JP2003060338A - Apparatus and method for mounting semiconductor component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solder a substrate, while avoiding adverse influence to an IC chip main body. SOLUTION: An elliptic mirror 3 converges the irradiation light of a xenon lamp 2 and converts in into a light beam. The irradiation position of the light beam can be moved to X direction and Y direction by an X-Y galvano mirror 5. A controller 7 controls the angle of the X-Y galvano mirror 5. Thus, a pad 17 part where the respective leads of an IC chip 10 are loaded is irradiated with the light beams. The controller 7 controls the X-Y galvano mirror 5, so that the light beams make circular scans of the respective leads for 100 times at the speed of 100 mm/second. Thus, respective solders in the pad part can be bonded almost simultaneously.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method of mounting a semiconductor component having a plurality of leads on a substrate.

[0002]

2. Description of the Related Art A method using a YAG laser has been proposed as an apparatus for mounting an IC chip having a plurality of leads on a substrate. However, in the heating method using such a laser, since the local heating is performed, the temperature unevenness of the solder part is large, the solder part cracks, or the side soldered earlier contracts and the opposite side floats. ,
I can't solder well. Further, since the laser light is locally supplied with energy, solder may be scattered.

In order to avoid such a problem, it is conceivable to heat the entire IC chip with warm air or the like.
Heat is also applied to the semiconductor components themselves in the IC chip, which leads to deterioration in quality.

The present invention solves the above problems and provides a mounting apparatus or mounting capability method that does not adversely affect the semiconductor portion and can easily mount a semiconductor component having a plurality of leads on a mounting substrate. The purpose is to do.

[0005]

1) A semiconductor component mounting apparatus according to the present invention is a semiconductor component mounting apparatus, in which a semiconductor component having a main body and a plurality of leads that are packaged so as to project from the main body is mounted on a mounting substrate. A semiconductor component mounting device for soldering each of the leads to a lead joint part,
A) irradiation means for irradiating the light beam, B) irradiation position changing means for moving the irradiation position of the irradiated light beam,
C) A control unit is provided to control the irradiation position changing unit so that the irradiation position of the light beam cyclically scans each lead of the semiconductor component, and D) the control unit is the solder supplied to each lead joint. The irradiation position changing means is controlled so that the energy required for melting the wafer to a bondable state is distributed to the leads in plural times. Therefore, the solder supplied to the lead joints can be melted to a joinable state almost at the same time. As a result, it is possible to uniformly heat only a necessary portion, and the solder is not scattered. Also, since the solder supplied to each lead joint melts to a joinable state almost at the same time, there is no problem that only one lead floats.
The semiconductor component is positioned on the mounting substrate by the self-aligning action.

2) In the semiconductor component mounting apparatus according to the present invention, the control means solidifies the melting of the solder at the lead joint portion after irradiating a certain lead with a light beam until the next irradiation of the lead. The control is performed at a cyclic scanning speed that does not cause the direction. Therefore, when the melting energy is supplied to each lead by dividing into multiple times,
The supplied solder can be reliably melted.

3) In the semiconductor component mounting apparatus according to the present invention, the control means controls so as to change in accordance with the amount of energy applied to each lead and the number of cyclic scans to the lead. As a result, it becomes possible to perform irradiation in accordance with the progress of solder melting.

4) In the semiconductor component mounting apparatus according to the present invention, the control means controls the irradiation energy so that it is small when the number of cyclic scans to the lead is small and becomes large when it is large. Therefore, the solder can be melted slowly until it begins to melt, and once it begins to melt.

5) In the semiconductor component mounting apparatus according to the present invention, the control means controls the irradiation energy so that the irradiation energy is low until the melting temperature of the solder is in a bondable state and is high immediately before the melting temperature. . Therefore, the solder can be melted slowly until it begins to melt, and once it begins to melt.

6) In the semiconductor component mounting apparatus according to the present invention, the control means changes the irradiation energy by controlling the intensity of the light beam emitted from the irradiation means. Therefore, the irradiation energy can be easily changed.

7) In the semiconductor component mounting apparatus according to the present invention, the irradiation means includes a xenon lamp and an elliptical lens for converging the irradiation light of the xenon lamp. Therefore, the irradiation means can be configured with a simple mechanism.

8) In the semiconductor component mounting apparatus according to the present invention, A) 1) an IC chip package part and 2) an IC chip having a plurality of leads so as to project from the package part is mounted on a pad of a mounting substrate. An IC chip mounting device for soldering to, wherein B) a xenon lamp for irradiating light, C) an elliptical mirror for converging the irradiation light of the xenon lamp and converting it into a light beam, and D) an irradiation position of the light beam. XY galvanometer mirrors that move in the X and Y directions, E) The irradiation position of the light beam scans all the leads of the IC chip a plurality of times so that the solder supplied to all the pads is almost simultaneously A controller for controlling the XY galvanometer mirror is provided so that the XY galvanometer mirror is melted in a joinable state. Therefore, the solder supplied to each pad can be melted to a joinable state almost at the same time. As a result, it is possible to uniformly heat only a necessary portion, and the solder is not scattered. Further, since the solder supplied to each pad portion is melted to a joinable state almost at the same time, there is no problem that only one lead floats, and the IC chip is positioned on the mounting substrate by a self-aligning action. be able to. 9) In the semiconductor component mounting apparatus according to the present invention, the control means causes the light beam to scan the IC chip body so that the temperature difference between the IC chip body and each lead does not exceed an allowable amount. First, the XY galvanometer mirror is controlled. Therefore, the temperatures of the IC body and each of the leads are set within an appropriate range, and thus the occurrence of cracks can be prevented.

10) In the semiconductor component mounting apparatus according to the present invention, A) 1) a main body and 2) a semiconductor component having a plurality of leads that are packaged so as to project from the main body, the lead joint portion of the mounting substrate. A semiconductor component mounting apparatus for soldering each of the leads to, B) irradiation means for irradiating a light beam, C) irradiation position changing means for moving the irradiation position of the irradiated light beam, and D) the light. Equipped with a control means for controlling the irradiation position changing means so that the irradiation position of the beam cyclically scans each lead of the semiconductor component, and E) the control means is in a state in which the solder supplied to each lead bonding portion can be bonded. The irradiation position changing means is controlled so as to irradiate the light beam in a time series manner until the melting temperature is reached. Therefore, the solder supplied to the lead joints can be melted to a joinable state almost at the same time.
As a result, it is possible to uniformly heat only a necessary portion, and the solder is not scattered. In addition, there is no problem that the solder supplied to each lead joint melts to a joinable state almost at the same time, so that only one lead floats, and the semiconductor component is self-aligned to the mounting substrate. To be done.

11) In the semiconductor component mounting apparatus according to the present invention, A) 1) a main body and 2) a semiconductor component having a plurality of leads that are packaged so as to project from the main body, the lead joint portion of the mounting substrate. An apparatus for soldering each of the leads to B) an irradiation means for irradiating a light beam, C) an irradiation position changing means for moving an irradiation position of the irradiated light beam, and D) an irradiation of the light beam. Equipped with control means for controlling the irradiation position changing means so that the position cyclically scans on each lead of the semiconductor component, and E) the control means melts the solder supplied to each lead joining portion to a joinable state. The light beam is time-sequentially distributed and irradiated so that the energy necessary for the above is supplied to each lead a plurality of times. Therefore, the solder supplied to the lead joints can be melted to a joinable state almost at the same time. This allows
Only necessary parts can be heated evenly, and solder scattering does not occur. In addition, there is no problem that the solder supplied to each lead joint melts to a joinable state almost at the same time, so that only one lead floats, and the semiconductor component is self-aligned to the mounting substrate. To be done. 12) In the semiconductor component mounting apparatus according to the present invention,
A) A device for soldering each of the leads to a lead joint portion of a mounting board for a semiconductor component having a plurality of leads that are packaged so as to project from the body 1) and the body 2). Irradiation means for irradiating a beam, C) irradiation position changing means for moving the irradiation position of the irradiated light beam, and D) irradiation so that the irradiation position of the light beam cyclically scans each lead of the semiconductor component. E) The control means controls the irradiation position changing means so that the solder supplied to the lead joints can be melted to a joinable state almost at the same time. Therefore, it is possible to uniformly heat only a necessary portion, and the solder is not scattered. In addition, there is no problem that the solder supplied to each lead joint melts to a joinable state almost at the same time, so that only one lead floats, and the semiconductor component is self-aligned to the mounting substrate. To be done.

13) In the method of mounting a semiconductor component according to the present invention, A) 1) a main body and 2) a semiconductor component having a plurality of leads that are packaged so as to project from the main body, a lead joint portion of a mounting substrate. In the mounting method of soldering the leads to B, the energy required for melting the solder supplied to the lead joints to a joinable state is distributed to the leads in plural times. Thus, the light beam is cyclically irradiated on each lead of the semiconductor component. Therefore, the solder supplied to the lead joints can be melted to a joinable state almost at the same time.
As a result, it is possible to uniformly heat only a necessary portion, and the solder is not scattered. In addition, there is no problem that the solder supplied to each lead joint melts to a joinable state almost at the same time, so that only one lead floats, and the semiconductor component is self-aligned to the mounting substrate. To be done.

14) In the semiconductor component mounting method according to the present invention, with respect to a semiconductor component having a main body and a plurality of leads that are packaged so as to project from the main body, each of the leads is soldered to a lead joint portion of a mounting substrate. In the mounting method of attaching, the light beam is radiated in a time-series distribution manner until the solder supplied to each lead joint reaches a melting temperature in a joinable state. Therefore, the solder supplied to the lead joints can be melted to a joinable state almost at the same time. As a result, it is possible to uniformly heat only a necessary portion, and the solder is not scattered. In addition, there is no problem that the solder supplied to each lead joint melts to a joinable state almost at the same time, so that only one lead floats, and the semiconductor component is self-aligned to the mounting substrate. To be done.

15) In the semiconductor component mounting method according to the present invention, with respect to a semiconductor component having a main body and a plurality of leads that are packaged so as to project from the main body, each of the leads is soldered to a lead joint portion of a mounting substrate. In the mounting method, the light beam is time-divisionally distributed and irradiated so that the energy required to melt the solder supplied to each lead joint portion to a bondable state is supplied to each lead a plurality of times. Therefore, the solder supplied to the lead joints can be melted to a joinable state almost at the same time. As a result, it is possible to uniformly heat only a necessary portion, and the solder is not scattered. In addition, there is no problem that the solder supplied to each lead joint melts to a joinable state almost at the same time, so that only one lead floats, and the semiconductor component is self-aligned to the mounting substrate. To be done. 16) In the semiconductor component mounting method according to the present invention,
A semiconductor component having a main body and a plurality of leads that are packaged so as to project from the main body, is a mounting method of soldering each of the leads to a lead joint of a mounting substrate, and is supplied to each lead joint. The light beam is irradiated so that the solder can be melted to a bondable state almost at the same time. Therefore, it is possible to uniformly heat only a necessary portion, and the solder is not scattered. In addition, there is no problem that the solder supplied to each lead joint melts to a joinable state almost at the same time, so that only one lead floats, and the semiconductor component is self-aligned to the mounting substrate. To be done.

In the present invention, "time-series distributed irradiation" does not mean that one lead is irradiated and the energy necessary for melting is not irradiated there, but other leads are also irradiated and divided in time. And irradiating the energy necessary for dissolution in a plurality of times.

The term "circular scanning" means that a certain lead is irradiated, then other leads are sequentially irradiated, and again the certain lead is irradiated.

[0020]

FIG. 1 shows the overall configuration of an IC chip mounting apparatus according to an embodiment of the present invention. The IC chip mounting device 1 is a device for mounting the IC chip 10 on the pads 17 of the mounting substrate 15 by soldering, and includes a light beam emitting unit 2, an XY galvanometer mirror 5, and a controller 7. There is.

The IC chip 10 includes an IC chip package portion 11 and a plurality of leads 12 (12a, 12b, 12c,
..., 12n-1, 12n). Each lead is packaged so as to project from the package portion 11.

The light beam emitting section 2 is provided with a xenon lamp and an elliptical mirror (both not shown). In this embodiment, a 100 W xenon lamp is used. The elliptical mirror collects the irradiation light of the xenon lamp and converts it into a light beam.

The XY galvanometer mirror 5 is composed of galvanometer mirrors 5a and 5b. Galvano mirror 5a, 5
The irradiation position of the light beam can be moved in the X and Y directions by b.

The controller 7 has a scanning speed of 800 mm
2, the XY galvanometer mirror 5 is controlled so that the light beam cyclically scans over each lead, as shown in the locus 41, as shown in FIG. As a result, each lead of the IC chip 10 can be irradiated with the light beam. In the present embodiment, in order to melt the solder, the points 41 a, 4
1b, 41c, 41d, 41a is set as 1 time, and this is 1
It was decided to repeat it 00 times.

A method of mounting the IC chip 10 on the mounting substrate 15 using this device will be described. The solder paste is applied to the pads 17 of the mounting substrate 15 to form the IC chip 1
0 is placed so that the lead corresponding to the pad 17 portion is located as shown in FIG. The controller 7 issues an irradiation start command to the beam emitting unit 2 and controls the XY galvanometer mirror 5. As a result, the IC chip 10
The respective leads are irradiated with a light beam, and the solder paste applied to the respective pad portions begins to melt.

FIG. 3 shows such a state change. FIG. 3A shows a state before dissolution, and FIG. 3B shows a state during dissolution. In the present embodiment, the solder is melted by scanning the light beam on each lead and irradiating the leads a plurality of times, so that the solder applied to each pad portion is almost at the same time.
As shown in B, it will be in a dissolved state.

When the scanning of 100 times is completed, the controller 7 gives the beam emitting unit 2 a command to stop the irradiation of the light beam. As a result, the solder cools and solidifies, and the IC
The chip 10 is mounted on the mounting substrate 15. Cooling the solder in about the same way solidifies it in about the same way.
Therefore, the contraction at that time pulls all the leads to the center of the pad, and the self-aligning action causes I
The C chip 10 is soldered to the proper position.

In this way, heat can be supplied only to the necessary parts of the IC chip 10, so that unnecessary heat is not supplied to the semiconductor components in the IC chip package part 11. Therefore, it is suitable for mounting an IC chip containing a semiconductor component having poor heat resistance.

Further, when the IC chip once mounted on the mounting substrate is defective and the IC chip is to be removed, it is necessary to melt the solder in all the lead portions. Conventionally, in such a case, it was put in a high temperature furnace or removed by applying hot air, but in this case, the IC chip package portion 11 also becomes a considerably high temperature, and even if a manipulator or the like is used, It was difficult to hold the IC chip package unit 11. On the other hand, in the present embodiment, when the IC chip once mounted on the mounting substrate is removed, the light beam only hits the necessary portion,
The IC chip package portion 11 does not become so hot. Therefore, it is also suitable for such replacement work.

In this embodiment, a plurality of IC chips cannot be collectively soldered to a plurality of substrates as in the case of using a furnace. On the other hand, to save time,
If the solder is unnecessarily melted, there is a problem such as scattering of the solder. So, by doing the following,
It is possible to further reduce the mounting time while preventing the scattering.

FIG. 4 shows the relationship between solder temperature and time. The appropriate temperature condition until melting depends on the solder used, but it is generally as follows. 1) Energy is supplied from a cold state up to the preheating temperature (80 degrees in this case), so even if high energy is supplied to the solder, the solder will not scatter. 2) After that, the preheating temperature or a temperature slightly higher than the preheating temperature is set for a predetermined time (for example, about 10 seconds). 3) After the holding time has elapsed, raise the temperature all at once until it exceeds the melting temperature (for example, 200 degrees). In this way, up to the preheat temperature,
After that, a holding time is provided, and after the holding time elapses, the temperature is raised at once, so that the soldering can be performed at a higher speed while preventing the scattering.

Irradiation energy and / or scan speed may be changed so that such a temperature change occurs. The irradiation energy is, for example, the output 1 of the lamp.
It is possible to start at 00%, scan in that state until the preheat temperature rises, hold for a while at output 50%, and then adjust again up to 100%.

The energy supplied to the pad portion is radiated through the mounting substrate and the IC chip package. Therefore, the supplied energy may be determined in consideration of the heat radiation amount.

Further, the graph shown in FIG. 4 is a graph for solder used in the present embodiment, and the melting temperature, the preheating temperature, the holding time, etc. are changed if the type of the solder is changed, and therefore irradiation is performed in accordance therewith. The control by the controller may be changed as follows.

When it is cooled after it is attached, shrinkage may occur and soldering may be lost. this is,
This is because the mounting substrate, the pad portion, the lead, and the IC chip package have different shrinkage rates and different warming degrees. For example, in the present embodiment, the irradiation energy applied to the periphery of the leads is also applied to the pad portion, but part of it is absorbed by the mounting substrate and part of it is dissipated. The same applies to the IC chip package. Under such circumstances, even if the solder is self-aligned in a molten state, cracks may occur in the solder portion due to different shrinkage of each portion. One of the factors is IC in this embodiment.
The point is that the chip package is hardly heated. Therefore, in order to prevent such a problem, the IC chip package may be irradiated with the light beam to the extent that the internal components are not affected.

In this embodiment, each lead is irradiated with the light beam a plurality of times. Therefore, since proper preheating can be applied, it is possible to prevent the solder from scattering.

As described above, the irradiation position of the light beam scans all the leads of the IC chip a plurality of times so that the solders supplied to all the pads are melted into a bondable state almost at the same time. Control the XY galvanometer mirror. Therefore, each pad and each lead can be bonded almost simultaneously. As a result, the soldering can be performed without the problem that the temperature becomes locally high or only the connected side contracts and the opposite side floats.

In the above embodiment, the case where the leads are provided at the four side surfaces of the IC chip has been described, but any type of IC chip having a plurality of leads is applicable. It is possible. For example, the same can be applied to a case where leads are present at two side surfaces.

The irradiation energy may be changed by changing the cyclic scanning speed.

In the present embodiment, the galvanomirror is used for scanning, but any type may be used as long as it can scan and irradiate each lead portion.
For example, the light beam irradiation unit 2 is mounted on an XY stage for scanning, the light source is fixed and placed, and the mounting substrate itself on which the IC chip is mounted is mounted on the XY stage for scanning. It is also possible to fix it and move only the elliptical mirror to scan in the XY directions.

Regarding the adjustment of irradiation energy,
A part such as a camera diaphragm mechanism may be provided between the xenon lamp and the elliptical lens to cut off a part of the irradiation.

The solder paste is not applied, but
You may make it supply with a dispenser.

In this embodiment, the xenon lamp is used as the light source of the light beam emitting section, but other lamps such as a metal halide lamp and a halogen lamp may be used.

As the light source, a light source capable of performing irradiation having a diameter of about 2 to 3 mm on the final irradiation surface is most desirable. Regarding the characteristics of the light source, in the case of the discharge lamp, the distance between the electrodes is about 1 to 2 mm, and when the filament is used, the size of the light emitting portion is about 1 to 2 mm. In addition, you may employ | adopt the light source which can be irradiated to a diameter of 1-5 mm on the final irradiation surface.

[Brief description of drawings]

FIG. 1 is a diagram showing an outline of an IC chip mounting apparatus 1 according to the present invention.

FIG. 2 is a diagram for explaining a cyclic scan on an IC chip.

3 is a cross-sectional view taken along the line AA in FIG.

FIG. 4 is a graph illustrating melting of solder.

[Explanation of symbols]

1 ... IC chip mounting device 2 ... Beam output section 5 ... XY Galvano Mirror 7 ... Controller 10 ... IC chip 11 ... IC chip package part 12 ... Lead 15 ... Mounting board 17 ... Pad part

[Procedure amendment]

[Submission date] September 14, 2001 (2001.9.1)
4)

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

Claims (17)

[Claims] 1. A semiconductor component mounting apparatus for soldering 1) a main body and 2) a semiconductor component having a plurality of leads that are packaged so as to project from the main body, to solder the leads to a lead joint portion of a mounting board. An irradiation means for irradiating a light beam, an irradiation position changing means for moving the irradiation position of the irradiated light beam, the irradiation so that the irradiation position of the light beam cyclically scans on each lead of the semiconductor component. Control means for controlling the position changing means, wherein the control means supplies the energy necessary for melting the solder supplied to each lead joint to a joinable state to the leads in plural times. So that the irradiation position changing means is controlled. 2. The semiconductor component mounting apparatus according to claim 1, wherein the control means melts the solder at the lead joint portion after irradiating a certain lead with a light beam until the lead is next irradiated with the light beam. The above-mentioned control is performed at a cyclic scanning speed that does not result in 3. The semiconductor component mounting apparatus according to claim 1 or 2, wherein the control means controls so as to change according to the amount of energy applied to each lead and the number of cyclic scans to the lead. Characterized by. 4. The semiconductor component mounting apparatus according to claim 1 or 2, wherein the control means controls the irradiation energy so that it is small when the number of cyclic scans to the lead is small, and is large when the number is large. , Characterized by. 5. The semiconductor component mounting apparatus according to claim 1 or 2, wherein the irradiation energy of the control means is small until the melting temperature at which the solder can be joined is reached, and is increased immediately before it is reached. It is characterized by controlling. 6. The semiconductor component mounting apparatus according to claim 3, wherein the control unit changes the irradiation energy by controlling the intensity of the light beam emitted from the irradiation unit. What to do. 7. The semiconductor component mounting apparatus according to claim 1, wherein the irradiation unit includes a xenon lamp and an elliptical lens that condenses irradiation light of the xenon lamp. 8. A 1) IC chip package part and 2) An IC chip, on which a plurality of leads are packaged so as to project from the package part, is soldered to a pad of a mounting board.
A C-chip mounting device, which comprises a xenon lamp for irradiating light, an elliptical mirror for converging the irradiation light of the xenon lamp into a light beam, and an X- for moving the irradiation position of the light beam in the X direction and the Y direction. Y galvanometer mirror, the irradiation position of the light beam scans all the leads of the IC chip a plurality of times so that the solder supplied to all the pads is melted into a bondable state almost at the same time. An IC chip mounting device including a controller for controlling the Y galvanometer mirror. 9. The semiconductor component mounting apparatus according to claim 8, wherein the control means scans the IC chip body with the light beam so that a temperature difference between the IC chip body and each lead does not exceed an allowable amount. And controlling the XY galvanometer mirror. 10. A semiconductor component mounting apparatus for soldering each lead to a lead joint portion of a mounting substrate for a semiconductor component having 1) a main body and 2) a plurality of leads that are packaged so as to project from the main body. An irradiation means for irradiating a light beam, an irradiation position changing means for moving the irradiation position of the irradiated light beam, the irradiation so that the irradiation position of the light beam cyclically scans on each lead of the semiconductor component. A control means for controlling the position changing means, wherein the control means irradiates the light beam in a time-series distribution manner until the solder supplied to each lead joint reaches a melting temperature in a bondable state, A semiconductor component mounting apparatus characterized by controlling irradiation position changing means. 11. A device for soldering each of the leads to a lead joint portion of a mounting substrate for a semiconductor component having 1) a main body and 2) a plurality of leads that are packaged so as to project from the main body, Irradiation means for irradiating a light beam, irradiation position changing means for moving the irradiation position of the irradiated light beam, and irradiation position changing means so that the irradiation position of the light beam cyclically scans each lead of the semiconductor component. Controlling means for controlling the light beam so that the energy necessary for melting the solder supplied to each lead joint portion into a bondable state is supplied to each lead a plurality of times. A semiconductor component mounting apparatus, which is characterized by performing time-sequential distributed irradiation. 12. A device for soldering each of the leads to a lead joint portion of a mounting substrate for a semiconductor component having 1) a main body and 2) a plurality of leads which are packaged so as to project from the main body, Irradiation means for irradiating a light beam, irradiation position changing means for moving the irradiation position of the irradiated light beam, and irradiation position changing means so that the irradiation position of the light beam cyclically scans each lead of the semiconductor component. A control means for controlling the irradiation position changing means so that the solder supplied to the lead joints can be melted to a joinable state substantially at the same time. Component mounting equipment. 13. A mounting method for soldering each of said leads to a lead joint portion of a mounting substrate for a semiconductor component having 1) a main body and 2) a plurality of leads which are packaged so as to project from said main body. , So that the energy required to melt the solder supplied to each lead joint portion to a joinable state is distributed to the leads in a plurality of times and is supplied to the leads of the semiconductor component. A semiconductor component mounting method, characterized in that cyclic scanning irradiation is performed. 14. A mounting method for soldering each of the leads to a lead joint portion of a mounting substrate for a semiconductor component having 1) a main body and 2) a plurality of leads that are packaged so as to project from the main body. A semiconductor component mounting method comprising: irradiating the light beam in time-series distribution until the solder supplied to each lead bonding portion reaches a melting temperature in a bondable state. 15. A mounting method for soldering each of the leads to a lead joint portion of a mounting substrate for a semiconductor component having 1) a main body and 2) a plurality of leads that are packaged so as to project from the main body. A semiconductor component characterized by irradiating the leads with a light beam in a time-series manner so that the energy required to melt the solder supplied to the lead joints into a bondable state is supplied to the leads at multiple times. How to implement. 16. A mounting method, comprising: 1) a main body and 2) a semiconductor component having a plurality of leads that are packaged so as to project from the main body, by soldering each of the leads to a lead joint portion of a mounting substrate. The semiconductor component mounting method is characterized in that a light beam is irradiated so that the solder supplied to each lead bonding portion can be melted to a bondable state almost at the same time. 17. A semiconductor component mounting apparatus for soldering 1) a main body and 2) a semiconductor component having a plurality of leads that are packaged so as to project from the main body, to solder the respective leads to a lead joint portion of a mounting substrate. An irradiation means for irradiating a light beam, an irradiation position changing means for moving the irradiation position of the irradiated light beam, the irradiation so that the irradiation position of the light beam cyclically scans on each lead of the semiconductor component. The energy required to melt the solder supplied to each lead joint to a joinable state is distributed to the semiconductor component mounting device equipped with a control unit that controls the position changing unit, and is supplied to each lead. And a computer program for controlling the irradiation position changing means.