JP2003060238A - Light-emitting device - Google Patents
Light-emitting deviceInfo
- Publication number
- JP2003060238A JP2003060238A JP2001241734A JP2001241734A JP2003060238A JP 2003060238 A JP2003060238 A JP 2003060238A JP 2001241734 A JP2001241734 A JP 2001241734A JP 2001241734 A JP2001241734 A JP 2001241734A JP 2003060238 A JP2003060238 A JP 2003060238A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- light emitting
- substrate
- diode chip
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、発光ダイオードチ
ップを用いた発光装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device using a light emitting diode chip.
【０００２】[0002]
【従来の技術】発光ダイオードでは一般に、発光ダイオ
ードチップを搭載した基板をレンズでモールド成形して
いる。2. Description of the Related Art Generally, in a light emitting diode, a substrate on which a light emitting diode chip is mounted is molded with a lens.
【０００３】[0003]
【発明が解決しようとする課題】従って、そのレンズ特
性で決まる光指向性のみを甘受しなければならず、他の
光指向性を望む場合は、レンズ特性が異なる他の発光ダ
イオードに交換しなければならない。しかし、その選択
肢は限られているのが普通である。本発明はこのような
解決すべき課題を鑑み、種々の光指向性を容易に実現可
能とした発光装置を提供することを目的とする。Therefore, only the light directivity determined by the lens characteristics must be accepted, and if another light directivity is desired, it must be replaced with another light emitting diode having a different lens characteristic. I have to. However, the options are usually limited. The present invention has been made in view of such problems to be solved, and an object thereof is to provide a light emitting device in which various light directivities can be easily realized.
【０００４】[0004]
【課題を解決するための手段】本発明は、発光ダイオー
ドチップを搭載した基板と、この基板を保持した筒と、
前記発光ダイオードチップの前面に配置され前記筒に対
して着脱可能とされたレンズとを備えた発光装置であ
る。また、筒内部において基板の前面には発光ダイオー
ドチップを覆うように透明樹脂による保護層があらかじ
めモールドされるとよい。また、レンズは筒に対して圧
入されり、螺合されたりする。According to the present invention, there is provided a substrate on which a light emitting diode chip is mounted, a cylinder holding the substrate,
A light emitting device comprising a lens arranged on the front surface of the light emitting diode chip and detachable from the cylinder. In addition, a protective layer made of transparent resin may be pre-molded on the front surface of the substrate inside the cylinder so as to cover the light emitting diode chip. Further, the lens is press-fitted or screwed into the cylinder.
【０００５】[0005]
【発明の実施の形態】次に、本発明の実施形態を説明す
るが、それはあくまで本発明に基づいて採択された例示
的な実施形態であり、本発明をその実施形態に特有な事
項に基づいて限定解釈してはならず、本発明の技術的範
囲は、請求項に示した事項さらにはその事項と実質的に
等価である事項に基づいて定めなければならない。BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of the present invention will be described, but it is merely an exemplary embodiment adopted based on the present invention, and the present invention is based on matters peculiar to the embodiment. However, the technical scope of the present invention should be determined based on the matters shown in the claims and the matters substantially equivalent to the matters.
【０００６】まず、図１（Ａ）の実施形態は、発光ダイ
オードチップ１を搭載した基板２と、この基板２を保持
した樹脂製の筒３と、前記発光ダイオードチップ１の前
面に配置され前記筒３に対して着脱可能とされたレンズ
４とを備えた発光装置である。レンズ４は透明な樹脂を
モールド成形して得られ、筒３の前端部内周面に圧入に
より取り付けられている。なお、必要に応じてレンズ４
と筒３とを接着するとよい。なお、筒３内部において基
板２の前面には発光ダイオードチップ１を覆うようにエ
ポキシなどの透明樹脂による保護層５があらかじめモー
ルド固着され、基板２の背面には発光ダイオードチップ
１に導通するリード線６が導出されている。図１（Ｂ）
の実施形態はレンズ４の形状を変更したものである。First, in the embodiment shown in FIG. 1A, a substrate 2 on which a light emitting diode chip 1 is mounted, a resin tube 3 holding the substrate 2 and a front surface of the light emitting diode chip 1 are arranged. The light emitting device includes a lens 4 that is attachable to and detachable from the cylinder 3. The lens 4 is obtained by molding a transparent resin, and is attached to the inner peripheral surface of the front end portion of the cylinder 3 by press fitting. In addition, if necessary, the lens 4
It is advisable to bond the tube 3 and the tube 3 together. A protective layer 5 made of transparent resin such as epoxy is molded and fixed in advance on the front surface of the substrate 2 inside the cylinder 3 so as to cover the light emitting diode chip 1, and on the back surface of the substrate 2, lead wires that are electrically connected to the light emitting diode chip 1 are provided. 6 has been derived. Figure 1 (B)
In this embodiment, the shape of the lens 4 is changed.
【０００７】図２（Ａ）の実施形態は、図１（Ａ）にお
ける発光ダイオードチップ１を例えば赤・緑・青の３色
に変更したものである。図２（Ｂ）ではレンズ４の形状
を変更したものである。図３、４、５の実施形態も、レ
ンズ４の形状を変更したものである。In the embodiment shown in FIG. 2A, the light emitting diode chip 1 shown in FIG. 1A is changed to, for example, three colors of red, green and blue. In FIG. 2B, the shape of the lens 4 is changed. The embodiment of FIGS. 3, 4, and 5 also has the shape of the lens 4 changed.
【０００８】図６の実施形態はいずれも、レンズ４を筒
３に対して螺合により取り付けたものである。In each of the embodiments shown in FIG. 6, the lens 4 is attached to the tube 3 by screwing.
【０００９】図７と図８では、筒３の形状を前方広がり
のものとし、その前面に幅の広いレンズ４を装着してい
る。図９と図１０、図１１と図１２ではそれぞれ、レン
ズ４の形状を変更している。In FIG. 7 and FIG. 8, the shape of the tube 3 is expanded forward, and the wide lens 4 is mounted on the front surface thereof. In FIGS. 9 and 10, and FIGS. 11 and 12, the shape of the lens 4 is changed.
【００１０】本実施形態によれば、レンズ４を交換可能
としたため、種々の光指向性を容易に実現可能とした発
光装置を提供できる。According to the present embodiment, since the lens 4 can be replaced, it is possible to provide a light emitting device which can easily realize various light directivities.
【図１】（Ａ）本発明の実施形態を示す断面図 （Ｂ）本発明の他の実施形態を示す断面図FIG. 1A is a sectional view showing an embodiment of the present invention. (B) A sectional view showing another embodiment of the present invention.
【図２】（Ａ）本発明のさらに他の実施形態を示す断面
図
（Ｂ）本発明のさらに他の実施形態を示す断面図FIG. 2A is a sectional view showing still another embodiment of the present invention. FIG. 2B is a sectional view showing yet another embodiment of the present invention.
【図３】（Ａ）本発明のさらに他の実施形態を示す断面
図
（Ｂ）本発明のさらに他の実施形態を示す断面図FIG. 3A is a sectional view showing still another embodiment of the present invention. FIG. 3B is a sectional view showing yet another embodiment of the present invention.
【図４】（Ａ）本発明のさらに他の実施形態を示す断面
図
（Ｂ）本発明のさらに他の実施形態を示す断面図FIG. 4A is a sectional view showing still another embodiment of the present invention. FIG. 4B is a sectional view showing yet another embodiment of the present invention.
【図５】（Ａ）本発明のさらに他の実施形態を示す断面
図
（Ｂ）本発明のさらに他の実施形態を示す断面図5A is a sectional view showing still another embodiment of the present invention. FIG. 5B is a sectional view showing still another embodiment of the present invention.
【図６】（Ａ）本発明のさらに他の実施形態を示す断面
図
（Ｂ）本発明のさらに他の実施形態を示す断面図FIG. 6A is a sectional view showing still another embodiment of the present invention. FIG. 6B is a sectional view showing yet another embodiment of the present invention.
【図７】本発明のさらに他の実施形態を示す断面図FIG. 7 is a sectional view showing still another embodiment of the present invention.
【図８】同斜視図FIG. 8 is a perspective view of the same.
【図９】本発明のさらに他の実施形態を示す断面図FIG. 9 is a sectional view showing still another embodiment of the present invention.
【図１０】同斜視図FIG. 10 is a perspective view of the same.
【図１１】本発明のさらに他の実施形態を示す断面図FIG. 11 is a sectional view showing still another embodiment of the present invention.
【図１２】同斜視図FIG. 12 is a perspective view of the same.
１ 発光ダイオードチップ ２ 基板 ３ 筒 ４ レンズ ５ 保護層 1 Light emitting diode chip 2 substrates 3 cylinders 4 lenses 5 protective layer
Claims (4)
と、この基板を保持した筒と、前記発光ダイオードチッ
プの前面に配置され前記筒に対して着脱可能とされたレ
ンズとを備えた発光装置。1. A light emitting device comprising: a substrate on which a light emitting diode chip is mounted; a tube holding the substrate; and a lens arranged on the front surface of the light emitting diode chip and detachable from the tube.
の前面には発光ダイオードチップを覆うように透明樹脂
による保護層があらかじめモールドされた発光装置。2. The light emitting device according to claim 1, wherein a protective layer made of a transparent resin is pre-molded on the front surface of the substrate inside the cylinder so as to cover the light emitting diode chip.
に対して圧入された発光装置。3. The light emitting device according to claim 1, wherein the lens is press-fitted into the cylinder.
に対して螺合された発光装置。4. The light emitting device according to claim 1, wherein the lens is screwed into the cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001241734A JP2003060238A (en) | 2001-08-09 | 2001-08-09 | Light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001241734A JP2003060238A (en) | 2001-08-09 | 2001-08-09 | Light-emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003060238A true JP2003060238A (en) | 2003-02-28 |
Family
ID=19072125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001241734A Pending JP2003060238A (en) | 2001-08-09 | 2001-08-09 | Light-emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003060238A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286608A (en) * | 2005-03-07 | 2006-10-19 | Nichia Chem Ind Ltd | Planar illumination light source and planar illumination device |
| JP2006295082A (en) * | 2005-04-14 | 2006-10-26 | Citizen Electronics Co Ltd | Light source body |
| US7549781B2 (en) | 2004-11-03 | 2009-06-23 | Samsung Electronics Co., Ltd. | Light emitting diode and lens for the same |
| US7842959B2 (en) | 2004-12-14 | 2010-11-30 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of light emitting cells and package mounting the same |
| US8076680B2 (en) | 2005-03-11 | 2011-12-13 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
| US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
-
2001
- 2001-08-09 JP JP2001241734A patent/JP2003060238A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
| US7549781B2 (en) | 2004-11-03 | 2009-06-23 | Samsung Electronics Co., Ltd. | Light emitting diode and lens for the same |
| US8183592B2 (en) | 2004-12-14 | 2012-05-22 | Seoul Opto Device Co., Ltd. | Light emitting device having a pluralilty of light emitting cells and package mounting the same |
| US8643029B2 (en) | 2004-12-14 | 2014-02-04 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of light emitting cells and package mounting the same |
| US7842959B2 (en) | 2004-12-14 | 2010-11-30 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of light emitting cells and package mounting the same |
| US8536612B2 (en) | 2004-12-14 | 2013-09-17 | Seoul Opto Device Co., Ltd. | Light emitting device having a pluralilty of light emitting cells and package mounting the same |
| JP2006286608A (en) * | 2005-03-07 | 2006-10-19 | Nichia Chem Ind Ltd | Planar illumination light source and planar illumination device |
| US8159000B2 (en) | 2005-03-11 | 2012-04-17 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
| US8076680B2 (en) | 2005-03-11 | 2011-12-13 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
| US8368190B2 (en) | 2005-03-11 | 2013-02-05 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
| US8610138B2 (en) | 2005-03-11 | 2013-12-17 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
| US8937326B2 (en) | 2005-03-11 | 2015-01-20 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
| JP4743844B2 (en) * | 2005-04-14 | 2011-08-10 | シチズン電子株式会社 | Light source |
| JP2006295082A (en) * | 2005-04-14 | 2006-10-26 | Citizen Electronics Co Ltd | Light source body |
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