JP2004207580A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device Download PDF

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Publication number
JP2004207580A
JP2004207580A JP2002376431A JP2002376431A JP2004207580A JP 2004207580 A JP2004207580 A JP 2004207580A JP 2002376431 A JP2002376431 A JP 2002376431A JP 2002376431 A JP2002376431 A JP 2002376431A JP 2004207580 A JP2004207580 A JP 2004207580A
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light emitting
lead frame
electrode
emitting device
light
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Tadahiro Okazaki
忠宏 岡崎
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Rohm Co Ltd
ローム株式会社
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Priority to JP2002376431A priority Critical patent/JP2004207580A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

Abstract

PROBLEM TO BE SOLVED: To control a directional characteristic of light emitted from a light emitting device as occasion demands, and to provide a common lead frame on a cathode side in the light emitting device whereon two or more light emitting elements each forming an anode electrode on its upper surface and a cathode electrode on its lower surface are packaged.
SOLUTION: A front surface electrode 5 is provided on upper end faces of anode side lead frames 3a, 3b with insulating adhesives 4, and light emitting elements 1a, 1b are mounted thereon. A cathode side lead frame 2 and the front surface electrode 5 are then connected by a wire 6a, and upper surface electrodes of the light emitting elements 1a, 1b and the anode side lead frames 3a, 3b are connected by the wire 6b. Further, at least the light emitting elements 1a, 1b and the wires 6a, 6b are sealed in a shape of a lens by a translucent resin 7 such that the light emitting elements 1a, 1b are positioned on different optical axes.
COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は、上面にアノード電極、下面にカソード電極を有する2個以上の発光素子を備えた半導体発光装置(以下、単に「発光装置」と記すことがある)に関するものである。 The present invention relates to a semiconductor light-emitting device having an anode electrode on the upper surface, two or more light emitting device having a cathode electrode on a lower surface (hereinafter, sometimes simply referred to as "light emitting device").
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
1個の発光装置で種々の発光色を得るために、異なる発光色の発光素子を2個以上搭載させた発光装置がこれまでから種々提案されている。 In order to achieve various emission colors in one light emitting device, different emission color of the light-emitting element 2 or more mounted so the light emitting device has been proposed from the past. 例えば特許文献1では、補色関係にある2個のLED素子を1つのリードフレームの上端面に固着し、これら2つのLED素子の上面電極と前記と異なる2つリードフレームとをワイヤで接続した発光装置が開示されている。 For example, Patent Document 1, two LED devices having a complementary relationship and secured to the upper end surface of one lead frame, luminescence and two top electrodes and the different two lead frames of the LED elements are connected by wires apparatus is disclosed.
【0003】 [0003]
図2に、このような発光装置の概略構成図を示す。 Figure 2 shows a schematic diagram of such a light-emitting device. 図2の発光装置は、コモンリードフレーム8の上端面に、発光色の異なる2個の発光素子1a,1bが導通可能に取り付けられ、発光素子1a,1bの上面電極とリードフレーム9a,9bとがワイヤ6で接続されている。 The light emitting device of FIG. 2, the upper end surface of the common lead frame 8, two light emitting elements 1a of different emission colors, 1b is mounted for conduction, the light emitting device 1a, 1b of the upper electrode and the lead frame 9a, and 9b There are connected by a wire 6. そして、発光素子1a,1bと、ワイヤ6、リードフレーム8,9a,9bの上部とが透光性樹脂7'で砲弾型のレンズ形状に封止されている。 Then, the light emitting device 1a, a 1b, the wire 6, the lead frame 8, 9a, and the upper 9b is sealed into a lens shape of the bullet type with translucent resin 7 '. このような従来の発光装置において2個の発光素子1a,1bを発光させると、透光性樹脂7で形成されたレンズ71'の光軸上からズレた位置に2個の発光素子1a,1bが配設されいるので、図の斜線で示すように指向特性が一致しない。 Two light emitting elements 1a in such a conventional light emitting device, the emit 1b, two light emitting elements 1a to shift was a position from the optical axis of the lens 71 'which is formed of a transparent resin 7, 1b since There has been provided, the directivity characteristic as shown by oblique lines in FIG do not match. このため、視認方向による色誤差が生じていた。 Thus, color errors due to the viewing direction has occurred.
【0004】 [0004]
2個の発光素子1a,1bを光軸上に配置するには、光軸を2つ設ける、すなわち透光性樹脂7'による封止体に2つのレンズを形成すればよい。 Two light emitting elements 1a, to be placed on the optical axis of the 1b, and the optical axis are provided two, i.e. may be formed of two lenses sealing body by translucent resin 7 '. 図3に、2つのレンズを形成した発光装置を示す。 3 shows a light emitting device formed of two lenses. この図の発光装置では、2つのレンズ71a,71bのそれぞれの光軸上に発光素子1a,1bが位置するように、発光素子1a,1bをリードフレーム9a',9b'の上端面にそれぞれ取り付け、発光素子の上面電極とコモンリードフレーム8'とをワイヤ6で接続している。 The light emitting device of this figure, two lenses 71a, the light emitting element 1a on each of the optical axes of 71b, as 1b are positioned, respectively attached to the upper end surface of the light-emitting element 1a, 1b the lead frame 9a ', 9b' connects the upper electrode of the light emitting element and a common lead frame 8 'by wire 6. このような構造の発光装置によれば、発光装置から出射した光の指向特性を随意に調整することができ、指向特性を一致させることもできる。 According to the light emitting device having such a structure, the directivity of the light emitted from the light emitting device optionally can be adjusted, it is also possible to match the directivity characteristics.
【0005】 [0005]
【特許文献1】 [Patent Document 1]
実開平7−3155号公報(実用新案登録請求の範囲、図1) Real Hei 7-3155 Patent Publication (range claims as, FIG. 1)
【0006】 [0006]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
ところで、広く使用されている発光素子の大半は、上面にアノード電極、下面にカソード電極が形成されたものである。 Meanwhile, most of the light emitting elements are widely used are those which anode electrode on the upper surface, a cathode electrode on the bottom surface is formed. このため、図3に示した発光装置ではコモンリードフレーム8'がアノード側となり、リードフレーム9a',9b'がカソード電極となる。 Thus, the common lead frame 8 'becomes the anode, the lead frame 9a' is a light emitting device shown in FIG. 3 becomes, 9b 'is a cathode electrode. 一方、発光装置の駆動を制御するドライバは通常はカソードコモンである。 Meanwhile, a driver for controlling the driving of the light emitting device is usually a cathode common. このため、コモンリードフレームがアノード側である発光装置を使用するためためトランジスタや抵抗を用いて回路を反転させなければならず、多数の発光装置を配設した表示パネルに使用する場合には特に問題があった。 Therefore, especially when the common lead frame must invert the circuits using transistors and resistors for for using light-emitting device which is the anode side, use the display panel which is arranged a number of light emitting devices there was a problem.
【0007】 [0007]
本発明のこのような従来の問題に鑑みてなされたものであり、その目的とするところは、上面にアノード電極、下面にカソード電極が形成された2個以上の発光素子を搭載した発光装置において、発光装置から出射した光の指向特性を随意に調整でき、しかもコモンリードフレームがカソード側となるようにすることにある。 Are those such has been made in view of the conventional problems of the present invention, it is an object of the anode electrode on the upper surface, the mounted light-emitting device to which two or more light-emitting elements having a cathode electrode is formed on the lower surface , directional characteristics of light emitted from the light emitting device can be adjusted at will, and moreover in that the common lead frame is made to be a cathode side.
【0008】 [0008]
【課題を解決するための手段】 In order to solve the problems]
本発明によれば、上面にアノード電極、下面にカソード電極を有する2個以上の発光素子と、1本のカソード側リードフレームと、前記発光素子の個数と同数のアノード側リードフレームとを備え、アノード側リードフレームの上端面上に絶縁性部材を介して設けた表面電極上に前記発光素子をそれぞれ取り付け、カソード側リードフレームと前記表面電極とを第1ワイヤで接続するとともに、前記発光素子のアノード電極とアノード側リードフレームとを第2ワイヤで接続し、前記発光素子のそれぞれが異なる光軸上に位置するように、少なくとも前記発光素子と前記ワイヤとを透光性樹脂でレンズ形状に封止したことを特徴とする半導体発光装置が提供される。 According to the present invention, includes an anode electrode on the upper surface, and two or more light-emitting elements having a cathode electrode on the lower surface, one and the cathode-side lead frame, an anode side lead frame number and the same number of the light emitting element, mounted on the upper end surface of the anode side lead frame the light emitting element on a surface electrode disposed via an insulating member, respectively, and a cathode side lead frame said surface electrode as well as connected by a first wire, of the light emitting element the anode electrode and the anode side lead frame are connected by a second wire, wherein as each of the light emitting elements are located on different optical axes, sealing and the at least the light emitting element wire into a lens shape of a translucent resin the semiconductor light emitting device characterized by-sealed is provided.
【0009】 [0009]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
本発明に係る発光装置の大きな特徴の一つは、コモンリードフレームではない個々のリードフレームに各発光素子を取り付けて、封止体で形成されたレンズの光軸上に発光素子のそれぞれを位置させたことにある。 One of the major features of the light-emitting device according to the present invention, by attaching the light emitting element in each of the lead frame is not a common lead frame, the position of each of the light emitting element on an optical axis of the lens formed in the sealing body some that were. かかる構成により発光装置から出射した光の指向特性を随意に調整できるようになった。 Now the directional characteristics of the light emitted from the light emitting device can be adjusted at will by such a configuration.
【0010】 [0010]
また本発明に係る発光装置のもう一つの大きな特徴は、個々のリードフレームの上端面上に絶縁性部材を介して表面電極を設け、この表面電極に発光素子を取り付けて、コモンリードフレームと表面電極とをワイヤで接続し、且つ発光素子の上面電極と、発光素子が固着されているリードフレームとをワイヤで接続したことにある。 The Another major feature of the light emitting device according to the present invention, the surface electrode is provided via an insulating member on the upper surface of each of the lead frame, by attaching the light emitting element to the surface electrode, the common lead frame and the surface the electrode is connected by wires, and the upper electrode of the light emitting element is that the light emitting element is connected by wire to a lead frame is fixed. かかる構成によりコモンリードフレームをカソード側にできるようになった。 Can now common lead frame in the cathode side by such a configuration. 以下、本発明の発光装置について図に基づいて説明する。 Hereinafter will be described with reference to FIGS light-emitting device of the present invention. なお、本発明はこれらの実施形態に何ら限定されるものではない。 The present invention is not intended to be limited to these embodiments.
【0011】 [0011]
図1に、本発明の発光装置の一例を示す概略断面図を示す。 Figure 1 shows a schematic cross-sectional view showing an example of a light-emitting device of the present invention. 図1の発光装置では、リードフレーム3a,3bの上端面にパラボラ部31が形成され、このパラボラ部31の底面に絶縁性接着剤(絶縁性部材)4によって表面電極5が固着されている。 In the light-emitting device 1, a lead frame 3a, parabolic section 31 is formed on the upper end surface of the 3b, the bottom surface insulating adhesive of the parabolic portion 31 is a surface electrode 5 by (insulating member) 4 is fixed. この表面電極5上に、上面にアノード電極(不図示)、下面にカソード電極(不図示)が形成された発光素子1a,1bがそれぞれ取り付けられている。 On the surface electrode 5, the anode electrode (not shown), the light emitting element 1a having a cathode electrode (not shown) is formed on the lower surface, 1b are respectively attached to the upper surface. そして、発光素子1a,1bのアノード電極とリードフレーム2とがワイヤ6aで接続され、表面電極5とリードフレーム3a,3bとがワイヤ6bで接続されている。 Then, the light-emitting element 1a, and the lead frame 2 anode electrode of 1b are connected by wires 6a, the surface electrode 5 and the lead frame 3a, and a 3b are connected by a wire 6b. このように発光素子1a,1bが実装されたリードフレーム3a,3bの上部は、透光性樹脂7で封止されている。 Thus the light emitting device 1a, the lead frame 3a that 1b is mounted, the upper portion of the 3b are sealed with translucent resin 7. この封止体にはレンズ71a,71bが2つ形成されており、それぞれのレンズ71a,71bの光軸上に発光素子1a,1bが配設されている。 The sealing body is a lens 71a, 71b are two forms, each of the lens 71a, the light emitting element 1a on the optical axis of 71b, 1b are disposed.
【0012】 [0012]
このような構成の発光装置では、コモンリードフレームであるリードフレーム2がカソード側となり、従来のドライバで発光装置の駆動を制御できる。 In such a light emitting device structure, the lead frame 2 becomes the cathode side is a common lead frame, it controls the driving of the light emitting device in a conventional driver. リードフレーム2とリードフレーム3a,3bとの間に電圧を印加すると発光素子1a,1bが発光する。 Lead frame 2 and the lead frame 3a, the light-emitting element 1a and a voltage is applied between the 3b, 1b emits light. 発光素子からの光は透光性樹脂7を通って上方に出射する。 Light from the light emitting element emits upwardly through the translucent resin 7. このとき、レンズ71a,71bの光軸上に発光素子1a,1bが配置されているので、レンズの形状を調整することにより所望の指向特性が得られる。 At this time, the lens 71a, the light emitting element 1a on the optical axis of 71b, since 1b are arranged, desired directional characteristics are obtained by adjusting the shape of the lens.
【0013】 [0013]
本発明で使用する発光素子としては従来公知のものが使用できる。 As a light emitting element used in the present invention can be used known ones conventionally. 搭載する2個以上の発光素子の発光色を異なる色にすれば、得られる発光色の範囲が広がるので好ましい。 If the light emission color of the two or more light-emitting elements to be mounted in different colors, preferably the range of the emission color obtained spread. 例えば2個の発光素子を搭載する場合には赤色と緑色の発光色の発光素子の組み合わせが好ましく、また3個の発光素子を搭載する場合には赤色、緑色、青色の発光色の発光素子の組み合わせが好ましい。 For example, a combination of red and green light emission color of the light-emitting element is preferably in the case of mounting the two light emitting elements, also red in the case of mounting the three light emitting elements, green, blue emission color of the light emitting element the combination is preferred.
【0014】 [0014]
赤色の発光素子としては、例えばGaAsP系、GaP系、GaAlAs系などの発光素子が挙げられる。 The red light-emitting element, for example GaAsP-based, GaP-based, and a light emitting element such as a GaAlAs system. 緑色の発光素子としては、GaP系、GaAsP系、InGaP系、InGaAlP系 などの発光素子が挙げられる。 The green light-emitting element, GaP-based, GaAsP-based, InGaP-based, and a light emitting element such as InGaAlP system. 青色の発光素子としては、例えばGaN系、InGaN/SiC、InGaN/サファイヤ、ZnSeなどの発光素子が挙げられる。 The blue light-emitting element, for example, GaN-based, InGaN / SiC, InGaN / sapphire include light emitting devices such as ZnSe.
【0015】 [0015]
本発明で使用する透光性樹脂としては透光性であれば特に限定はなく、例えばエポキシ樹脂や不飽和ポリエステル樹脂、シリコーン樹脂、ユリア・メラミン樹脂などが挙げられ、この中でも透光性などの点からエポキシ樹脂がより好適に使用できる。 The translucent resin used in the present invention is not particularly limited as long as it is translucent such as epoxy resin or unsaturated polyester resin, silicone resin, is like urea-melamine resins, such as translucent Among these epoxy resins can be more preferably used from the point. エポキシ樹脂としては、一分子中に2個以上のエポキシ基を有するものでエポキシ樹脂成形材料として使用されるものであれば制限はなく、フェノールノボラック型エポキシ樹脂、オルクレゾールノボラック型エポキシ樹脂を代表するフェノール類とアルデヒド類のノボラック樹脂をエポキシ化したもの、ビスフェノールA、ビスフェノールF、ビスフェノールS、水添ビスフェノールAなどのジグリシジルエーテル、フタル酸、ダイマー酸などの多塩基酸とエピクロルヒドリンの反応により得られるジグリシジルエステル型エポキシ樹脂、ジアミノジフェニルメタン、イソシアヌル酸などのポリアミンとエピクロルヒドリンの反応により得られるグリシジルアミン型エポキシ樹脂、オレフィン結合を過酢酸などの過酸により、酸化して得ら The epoxy resin, limited as long as it is used as the epoxy resin molding material having two or more epoxy groups in one molecule is not, represent a phenol novolak type epoxy resin, a Ol cresol novolac type epoxy resin that the novolak resin of phenols and aldehydes epoxidized, resulting bisphenol a, bisphenol F, bisphenol S, diglycidyl ethers, such as hydrogenated bisphenol a, phthalic acid, by reaction of polybasic acids with epichlorohydrin, such as dimer acid diglycidyl ester type epoxy resins, diaminodiphenylmethane, polyamine and epichlorohydrin glycidyl amine type epoxy resin obtained by reacting such isocyanuric acid, a peracid such as olefinic bonds peracetic acid, resulting et oxidized る綿状脂肪族エポキシ樹脂、および脂環族エポキシ樹脂などを挙げることができ、これらを単独であるいは2以上の混合物として使用することができる。 That flocculent aliphatic epoxy resins, and alicyclic epoxy resins and the like can be mentioned, and these can be used alone or as a mixture of two or more. これらのエポキシ樹脂は十分に精製されたもので、常温で液状であっても固形であってもよいが、液化時の外観ができる限り透明なものを使用するのが好ましい。 These epoxy resins has been substantially purified, or may be a solid even liquid at ordinary temperature, it is preferable to use a transparent as possible appearance during liquefaction.
【0016】 [0016]
図1の発光装置の作製方法を簡単に説明する。 Briefly a method of manufacturing a light-emitting device of FIG. 金型によって金属薄板から所定形状のリードフレームを打ち抜いた後、アノード側のリードフレーム3a,3bの上端面を凸状物で押圧してパラボラ部31を形成する。 After punching the lead frame of a predetermined shape from a sheet metal by the mold, the anode side lead frame 3a, the upper end surface of the 3b are pressed by the convex particle to form a parabolic portion 31. パラボラ部31の底面に表面電極5としての金属板を絶縁性の接着剤4で固着する。 A metal plate as the surface electrode 5 is adhesively secured fourth insulating the bottom of the parabolic section 31. そして表面電極5の上に発光素子1a,1bを固着する。 And fixing the light-emitting element 1a, and 1b on the surface electrode 5. 次に、発光素子の上面電極(アノード電極)と発光素子が載っているリードフレーム3a,3bとをワイヤ6bで接続し、またカソード側のリードフレーム2と表面電極5とをワイヤ6aで接続する。 Next, the lead frame 3a of the upper electrode (anode electrode) and the light emitting elements of the light emitting element is on, connects the 3b wire 6b, also connects the lead frame 2 and the surface electrode 5 of the cathode-side wire 6a . 一方、レンズ部71a,71bとなる2つの凹部が形成された金型に透光性樹脂を注ぎ込む。 On the other hand, pouring translucent resin into a lens portion 71a, a die two recesses serving as 71b are formed. レンズ形状は金型に形成されたこの凹部の形状によって決まるので、凹部の形状を調整することによってレンズ形状を調整できる。 Lens shape so determined by the shape of the recess formed in the mold, it is possible to adjust the lens shape by adjusting the shape of the recess. そして、発光素子1a,1bを固着した側を下にしてリードフレーム2,3a,3bの上部を凹部に浸漬する。 Then, the light emitting device 1a, the side which is fixed to 1b in the lower immersed leadframe 2, 3a, the upper 3b in the recess. 次に、透光性樹脂を加熱硬化させた後、リードフレーム2,3a. Then, after heating and curing the light transmissive resin, a lead frame 2, 3a. 3bを凹部から取り外し、図1の発光装置を得る。 3b removed from the recesses to give a light-emitting device of FIG.
【0017】 [0017]
本発明の発光装置は、照明用光源や各種表示器、車両用灯具などに用いることができる。 The light emitting device of the present invention can be used for such a light source for illumination, various indicators, vehicle lamp.
【0018】 [0018]
【発明の効果】 【Effect of the invention】
本発明の発光装置では、上面にアノード電極、下面にカソード電極を有する2個以上の発光素子と、1本のカソード側リードフレームと、前記発光素子の個数と同数のアノード側リードフレームとを備え、アノード側リードフレームの上端面上に絶縁性部材を介して設けた表面電極上に前記発光素子をそれぞれ取り付け、カソード側リードフレームと前記表面電極とを第1ワイヤで接続するとともに、前記発光素子のアノード電極とアノード側リードフレームとを第2ワイヤで接続し、前記発光素子のそれぞれが異なる光軸上に位置するように、少なくとも前記発光素子と前記ワイヤとを透光性樹脂でレンズ形状に封止したので、発光装置から出射した光の指向特性を随意に調整でき、しかもコモンリードフレームをカソード側とできる。 In the light emitting device of the present invention includes an anode electrode on the upper surface, and two or more light-emitting elements having a cathode electrode on the lower surface, one and the cathode-side lead frame, an anode side lead frame number and the same number of the light emitting element , mounting the light emitting element to the anode side lead frame of the upper end surface electrode on which is provided via an insulating member on the surface, respectively, and a cathode side lead frame and the surface electrode while connected by a first wire, said light emitting element the anode electrode of the anode-side lead frame are connected by a second wire, wherein as each of the light emitting elements are located on different optical axes, and said at least the light emitting element wire into a lens shape of a translucent resin because sealed, directivity of the light emitted from the light emitting device can be adjusted at will, and moreover can be common lead frame and the cathode side.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】本発明の発光装置の一例を示す概略構成図である。 1 is a schematic diagram showing an example of a light-emitting device of the present invention.
【図2】従来の発光装置を示す概略構成図である。 2 is a schematic diagram showing a conventional light emitting device.
【図3】2つのレンズを設けた場合の発光装置およびその指向特性を示す図である。 3 is a diagram showing a light emitting device and its directional characteristics obtained when a two lenses.
【符号の説明】 DESCRIPTION OF SYMBOLS
1a,1b 発光素子2 カソード側リードフレーム3a,3b アノード側リードフレーム4 絶縁性接着剤(絶縁性部材) 1a, 1b emitting element 2 cathode side lead frame 3a, 3b anode side lead frame 4 insulating adhesive (insulating member)
5 表面電極6a,6b ワイヤ7 透光性樹脂31 パラボラ部71a,71b レンズ部 5 surface electrodes 6a, 6b wire 7 translucent resin 31 parabolic portion 71a, 71b lens unit

Claims (1)

  1. 上面にアノード電極、下面にカソード電極を有する2個以上の発光素子と、1本のカソード側リードフレームと、前記発光素子の個数と同数のアノード側リードフレームとを備え、 Comprising an anode electrode on the upper surface, a lower surface and two or more light-emitting elements having a cathode electrode, one cathode-side lead frame, an anode side lead frame number and the same number of the light emitting element,
    アノード側リードフレームの上端面上に絶縁性部材を介して設けた表面電極上に前記発光素子をそれぞれ取り付け、カソード側リードフレームと前記表面電極とを第1ワイヤで接続するとともに、前記発光素子のアノード電極とアノード側リードフレームとを第2ワイヤで接続し、 Mounted on the upper end surface of the anode side lead frame the light emitting element on a surface electrode disposed via an insulating member, respectively, and a cathode side lead frame said surface electrode as well as connected by a first wire, of the light emitting element the anode electrode and the anode side lead frame are connected by a second wire,
    前記発光素子のそれぞれが異なる光軸上に位置するように、少なくとも前記発光素子と前記ワイヤとを透光性樹脂でレンズ形状に封止したことを特徴とする半導体発光装置。 Wherein as each of the light emitting elements are located on different optical axes, the semiconductor light emitting device characterized by sealing the said at least the light emitting element wire into a lens shape of a translucent resin.
JP2002376431A 2002-12-26 2002-12-26 Semiconductor light emitting device Pending JP2004207580A (en)

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US8235524B2 (en) 2001-11-07 2012-08-07 Michael Waters Illuminated eyewear
US8491118B2 (en) 2001-11-07 2013-07-23 Michael Waters Lighted reading glasses
US8388164B2 (en) 2005-05-17 2013-03-05 Michael Waters Hands-Free lighting devices
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US8979295B2 (en) 2005-05-17 2015-03-17 Michael Waters Rechargeable lighted glasses
US8545012B2 (en) 2005-05-17 2013-10-01 Michael Waters Illuminated eyewear
US9526292B2 (en) 2005-05-17 2016-12-27 Michael Waters Power modules and headgear
US8485682B2 (en) 2007-10-29 2013-07-16 Waters Industries, Inc. Illuminated eyeglass assembly
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US8444266B2 (en) 2009-09-30 2013-05-21 Michael Waters Illuminated eyewear
US8567945B2 (en) 2009-09-30 2013-10-29 Michael Waters Illuminated eyewear
US10117476B2 (en) 2010-04-30 2018-11-06 Michael Waters Lighted headgear and accessories therefor
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US9101174B2 (en) 2011-11-04 2015-08-11 Michael Waters Hat with automated shut-off feature for electrical devices
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