JP2003059398A - Method of manufacturing panel-like airtight vessel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a sealing material prearranged on a face plate 21 from protruding from a prescribed position by being fluidized by heat when baking the face plate 21 and a rear plate 20 performed before sealing in a sealing chamber 7 without restricting the baking condition of the face plate 21 and the rear plate 20 for constituting an image display panel 19. SOLUTION: The rear plate 20 and the face plate 21 for constituting the obverse - reverse of the image display panel 19 and an outer frame 22 for constituting a peripheral side wall are separated. A sealing material is prearranged in the outer frame 22. The rear plate 20 and the face plate 21 are separated from this outer frame 22, and are carried to substrate baking chambers 2 and 10 before sealing to perform baking.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention makes a pair of substrates constituting the front and back sides face each other with an outer frame constituting a peripheral side wall interposed therebetween, and hermetically seals the periphery by a sealing material to hermetically seal. The present invention relates to a method for manufacturing a panel-shaped airtight container having a closed gap. More specifically, for example, it is formed by sealing a face plate that constitutes the display surface, which is the front surface, and a rear plate that constitutes the back surface, facing each other with an outer frame that constitutes the peripheral side wall interposed therebetween. The present invention relates to a method for manufacturing a panel-shaped hermetic container used for manufacturing an image display panel and the like.

[0002]

2. Description of the Related Art Conventionally, for example, a panel-shaped hermetic container such as an image display panel has an extremely small internal space volume, and when gas is released from the inner wall surface after sealing, the degree of vacuum inside is greatly lowered. Since it is easy, the constituent members are carried into a series of processing apparatuses having a plurality of depressurized processing chambers including a bake processing chamber and a sealing processing chamber, sequentially transported between the processing chambers, and the baking treatment is performed to form the constituent members. There is known a method of removing water or gas that has been attached or adsorbed and then sealing in a sealing treatment chamber kept at a high degree of vacuum.

More specifically, Japanese Patent Laid-Open No. 2000-
No. 315458 and WO00 / 60634 disclose that a face plate having a phosphor is conveyed to a bake treatment chamber for bake treatment, cooled in a cooling treatment chamber, and then conveyed to a getter treatment chamber to obtain a getter film on the inner surface. After applying
Further, the rear plate having an electron source is transferred to a bake processing chamber separately from the face plate for bake treatment while being transported to the sealing treatment chamber through the alignment treatment chamber, cooled in the cooling treatment chamber, and then subjected to alignment treatment. The face plate and the rear plate, which have been conveyed to the sealing treatment chamber through the chamber and aligned in the alignment treatment chamber, are sealed in the sealing chamber using the sealing material that has been placed in the groove of the face plate in advance. It has been proposed to manufacture an image display panel by using it, and in particular, it is recommended that the outer frame that constitutes the peripheral side wall of the image display panel be fixed to the rear plate in advance in order to facilitate the process. There is.

[0004]

By the way, it is preferable that the rear plate and the face plate, which have a large exposed area to the inside, be baked at a high temperature at which the adhering or adsorbing water and gas can be sufficiently released and removed. .

However, in the above-mentioned conventional method, since the sealing material is provided on the face plate in advance, the sealing material is fluidized by the heat when the face plate is baked, and the groove is generated due to the shaking and vibration during the transportation. There is a problem in that the function of the manufactured image display panel is likely to be impaired because it may protrude from the inside. In addition, if it is attempted to prevent the fluidization of the sealing material, the bake processing conditions of the face plate are limited, and there arises a problem that sufficient removal of water and gas cannot be obtained.

The present invention has been made in view of the above-mentioned problems of the prior art, and the protrusion of the substrate forming the panel-like hermetic container from the predetermined position due to the fluidization of the sealing material due to the heat during the baking treatment is performed. The purpose is to be able to prevent without restriction of the baking processing condition.

[0007]

In order to achieve the above object, the present invention provides at least a sealing treatment chamber in which at least a pair of substrates constituting the front and back surfaces of a panel-shaped hermetic container and an outer frame constituting a peripheral side wall are provided. The plurality of substrates and the outer frame, which have been subjected to a predetermined process, are sealed by using a sealing material. In the method for manufacturing a panel-shaped airtight container for performing a sealing process in a deposition processing chamber, a substrate baking processing chamber in which at least the pair of substrates is transferred prior to being transferred to the sealing processing chamber, as the processing chamber of the processing device. A panel shape characterized by being provided with the sealing material in advance in the outer frame and carrying at least the pair of substrates separately from the outer frame to the substrate baking processing chamber to perform a baking process. Providing a method for manufacturing an airtight container Than it is.

According to the present invention, the sealing material is provided in advance because the area exposed to the panel-like airtight container is small and the vacuum in the panel-like airtight container is achieved without performing a high temperature baking process. The outer frame has a small effect on the maintenance of the degree of vacuum, and since this outer frame is separated from the substrate and is separated from the substrate during the baking process of the substrate, it has an effect on the maintenance of the degree of vacuum in the panel airtight container. Even if a substrate having a large size is baked at a high temperature, it is possible to prevent the sealing material from being fluidized due to the baking process.

Further, according to the present invention, the substrate baking processing chamber is provided for each of the two substrates forming a pair of substrates, and the two substrates are transferred to different substrate baking processing chambers to perform the baking treatment. The heating condition for the baking treatment of the substrate in the substrate baking treatment chamber is equal to or higher than the temperature at which the gas adsorbed to the substrate is released, and the outer frame serves as a sealing treatment chamber as the processing chamber of the treatment device. An outer frame bake processing chamber that is transferred prior to the transfer of the outer frame bake processing chamber, and the outer frame is conveyed to the outer frame bake processing chamber separately from the substrate for bake processing; The heating condition of the bake treatment is not less than the release temperature of the moisture attached or adsorbed to the outer frame and less than the fluidization temperature of the sealing material previously provided in the outer frame, and the pair of substrate and outer frame. Remains separated Be transported to the destination processing chamber, the outer frame,
Using the sealing material provided in advance, set it on one of the substrates that has undergone the baking process in the substrate baking process chamber and transfer it to the sealing process chamber. The outer frame is baked in the outer frame bake process chamber. After that, using a sealing material provided in advance, set to one of the substrates that have undergone the baking treatment in the substrate baking treatment chamber and convey the substrate to the sealing treatment chamber.
Is included as a preferred embodiment thereof.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be further described below with reference to the drawings by taking the manufacture of an image display panel as an example.

FIG. 1 (a) is a diagram schematically showing a first example of a manufacturing apparatus used in the manufacturing method of the present invention.
1D shows the temperature profile of each processing target member and the vacuum degree profile of each processing chamber in the outer frame processing line, rear plate to sealing processing line, and face plate processing line in FIG. 1A.

In FIG. 1A, the middle line is a rear plate processing line, 1 is a pretreatment chamber, 2 is a substrate baking treatment chamber, 3 is a surface cleaning treatment chamber, 4 is a cooling treatment chamber, 5 is a chamber getter. A processing chamber, 6 is an assembly processing chamber, 7 is a sealing processing chamber, 8 is a post-processing chamber, pre-processing chamber 1 to chamber getter processing chamber 5 is a rear plate processing line, and subsequent assembly processing chamber 6 is a rear plate processing line. The sealing processing line extends to the processing chamber. The rear plate processing line is shown enlarged in FIG. 2, and the sealing processing line is shown enlarged in FIG.

In FIG. 1A, the lower line is a face plate processing line, 9 is a pretreatment chamber, 10 is a substrate baking treatment chamber, 11 is a surface cleaning treatment chamber, 12 is a cooling treatment chamber, and 13 is a chamber getter. A processing chamber 14 is a panel getter processing chamber, and the panel getter processing chamber 14 is connected to the assembly processing chamber 6 in the sealing line. This face plate processing line is shown enlarged in FIG.

In FIG. 1A, the upper line is an outer frame processing line, 15 is a pretreatment chamber, 16 is an outer frame bake treatment chamber, 17 is a cooling treatment chamber, and 18 is a chamber getter treatment chamber. The getter processing chamber 18 is connected to the assembly processing chamber 6 in the sealing line. This outer frame processing line is shown enlarged in FIG.

The rear plate processing line, the face plate processing line, and the outer frame processing line are for carrying the respective constituent members of the image display panel 19 which is a panel-shaped airtight container in the directions indicated by the arrows in the figure. The rear plate (hereinafter referred to as “RP”) 20 which is one of the two substrates is carried into the rear plate processing line, and the other face plate (hereinafter referred to as “F”).
"P". ) 21 is carried into the face plate processing line, and the outer frame 2 constituting the peripheral side wall of the image display panel 19
2 is carried in to the outer frame processing line. Also, with the RP20 carried into the rear plate processing line,
FP21 carried into the face plate processing line,
The outer frame 22 carried into the outer frame processing line is sequentially transported to the assembly processing chamber 6 of the sealing line by the transport units 23, 24, 25, respectively.
The image display panel 18 is formed by merging with the rear plate processing line and the rear plate processing line and a series of transport units 23 to be sent to the sealing processing chamber 7 and sealed.

Each processing line will be further described below.

(1) Rear Plate Processing Line First, each processing chamber of the rear plate processing line will be described with reference to FIG.

The rear plate processing line is a line for performing necessary processing before the RP 20 is loaded and conveyed to the assembly processing chamber 6 of the sealing processing line described above. The processing chamber 2, the surface purification processing chamber 3, the cooling processing chamber 4, and the chamber getter processing chamber 5 are connected in series in this order, and the chamber getter processing chamber 5 is connected to the assembly processing chamber 6 of the sealing processing line. Each processing chamber is evacuated by a vacuum pump so that a necessary vacuum atmosphere can be formed.

Gate valves 26 to 31 separate the pretreatment chamber 1 from the atmosphere and the respective treatment chambers. RP
After the gate valve 26 to 31 is opened and closed to be loaded into the pretreatment chamber 7, the transport unit 23 causes the bake treatment chamber 2, the surface purification treatment chamber 3, the cooling treatment chamber 4, and the chamber getter treatment chamber 20 to be transported. Further, it is sequentially transported to the assembly processing chamber 6.

The RP 20 is a substrate having an electron-emitting device (not shown) formed on the inner surface side, and is a member constituting the back surface of the image display panel 19 (see FIG. 1). Also,
On the inner surface side of the RP 20 in this example, a spacer 32 for imparting an atmospheric pressure resistant structure to the image display panel 19 to be formed is fixed in advance at an appropriate position.

In the pretreatment chamber 1, the gate valve 27 is closed,
Open the gate valve 26 with the inside atmospheric pressure,
After the RP 20 is loaded, the gate valve 26 is closed to evacuate the inside to a predetermined depressurized state, and then the gate valve 27.
Is opened and the RP 20 is sent to the substrate bake processing chamber 2. This is a processing chamber that prevents the vacuum atmosphere in the processing chambers after the bake processing chamber 2 from being damaged by the loading of the RP 20. The pre-treatment chamber 1 uses the RP 20 for the substrate baking treatment chamber 2
Then, the gate valve 27 is closed and the pressure is gradually raised to atmospheric pressure again to prepare for the next loading of the RP 20.

The substrate baking processing chamber 2 is transferred to the R
P20 is held in the temperature control means 33 and heated under reduced pressure,
This is for performing a baking process for releasing moisture, gas, etc. attached or adsorbed to the RP 20.

The temperature control means 33 is carried by the carrying unit 23 together with the RP 20 in a state where the RP 20 is positioned and held, and the RP 20 is used in order to carry out necessary processing with a small processing chamber volume. It is preferable that it can be held vertically or obliquely. Further, it is preferable that the temperature control means 33 has a chuck that can hold the RP 20 with sufficient force without dropping it. As this chuck, for example, RP2
A mechanical system that mechanically grips the periphery of 0 with a claw or the like, an electrostatic system that attracts by static electricity, a vacuum system that attracts by vacuum suction, and the like can be used. As such a temperature control means 33, a hot plate having a butting pin for positioning and the chuck can be used.

The surface cleaning processing chamber 2 is a processing chamber in which the surface of the RP 20 is irradiated with an electron beam, ions, ultraviolet rays or plasma to perform a surface cleaning treatment by desorbing adsorbed impurities. The surface cleaning processing chamber 3 in this example is provided with an electron gun 34, and the surface cleaning processing is performed by irradiation of an electron beam 35. The ion irradiation, the ultraviolet irradiation, or the plasma irradiation is performed. By RP
It is also possible to perform the surface purification treatment of 20.

The cooling processing chamber 4 is provided with the RP 20 that has been transported.
This is a processing chamber for performing the temperature lowering process. This temperature reduction process is
This can be done by lowering the set temperature of the temperature control means 33 holding 20.

The chamber getter processing chamber 5 flushes the getter agent from the chamber getter flash device 37 on the chamber getter plate 36 arranged in the chamber getter processing chamber 5 to form a getter film, thereby increasing the degree of vacuum in the processing chamber. This is a processing chamber for preventing a decrease in the degree of vacuum in the assembly processing chamber 6 when the gate valve 31 is opened to transfer the RP 20 to the next assembly processing chamber 6. Reference numeral 38 denotes a chamber getter flash generated from the chamber getter flash device 37. For example, an evaporation type getter agent such as barium contained in the chamber getter flash device 37 is heated by a method such as resistance heating to instantaneously evaporate. It was made. The chamber getter flash 38 adheres to the chamber getter plate 36 and performs an exhaust action as a chamber getter, so that the degree of vacuum in the chamber getter processing chamber 5 can be increased.

Next, the processing steps in the rear plate processing line will be described.

First, the gate valve 26 is opened (the gate valve 27 is closed) while the pretreatment chamber 1 is at atmospheric pressure, and the spacer 32 is fixed in advance to the RP2.
0 is loaded into the pretreatment chamber 1. The carry-in unit may be carried in by using a dedicated jig, but the RP 20 is directly carried.
It can also be transported at 3. After loading the RP 20, the gate valve 26 is closed, the inside of the pretreatment chamber 1 is evacuated to prepare for opening the gate valve 27. In this example, FIG.
As shown in (c), the gas is evacuated to a vacuum state on the order of 10 ⁻⁵ Pa. The temperature of the RP 20 in the pretreatment chamber 1 is room temperature.

After evacuating the inside of the pretreatment chamber 1 to a predetermined vacuum degree, the gate valve 27 is opened, and the RP 20 is conveyed from the pretreatment chamber 1 to the substrate baking treatment chamber 2 by the conveyance unit 23, and after this movement. The gate valve 27 is shut off. The RP 20 transferred to the substrate baking processing chamber 2 is held by the temperature control means 32 and is subjected to a baking process that is a heating process under reduced pressure. By this baking treatment, impurities such as hydrogen, oxygen, and water attached to or adsorbed on the RP 20 can be released and removed as a gas. RP20
The baking treatment temperature is preferably a temperature at which the adhering or adsorbing gas and moisture can be released and removed as a gas, and specifically, it is preferably 300 to 400 ° C, and 350 to 380 ° C. Particularly preferred. Further, the pressure of the RP20 during the baking process rises due to the release of gas accompanying the baking process, but it is 10 ⁻⁴ to 10 ^−4.
It is preferably about ^-5 Pa. In the illustrated example, as shown in FIG. 1C, the pressure in the substrate baking processing chamber 2 is reduced to 10 ⁻⁴ Pa and the RP 19 is set to 380.
It is heated to ℃.

After performing the above-mentioned baking treatment, the gate valve 28 is opened, the RP 20 is conveyed to the surface cleaning treatment chamber 3 together with the temperature control means 33 while the RP 20 is placed on the temperature control means 33, the gate valve 28 is closed, and the baking is performed. RP2 after processing
The surface cleaning treatment is performed while gently reducing the temperature of 0. As described above, this surface cleaning process is a process of irradiating an electron beam, ions, ultraviolet rays, or plasma to perform a surface cleaning process by desorbing adsorbed impurities adhering to or adsorbed on the surface. This surface purification treatment chamber 3
It can be omitted if the gas and moisture can be sufficiently removed by the baking treatment.

In general, the surface cleaning treatment is more effective when the object to be treated is at a high temperature to some extent. Therefore, when the surface cleaning processing chamber 3 is provided, it is preferable to provide it immediately after the substrate baking processing chamber 2 because the surface cleaning processing effect can be improved by utilizing the residual heat of the baking processing. Further, the cooling of the RP 20 in the surface purification treatment chamber 3 is not essential, but it is preferable to perform it in order to shorten the cooling treatment time performed in the next cooling treatment chamber 4. This cooling can be performed by lowering the temperature of the temperature control means 33.

The cooling of the RP 20 in the surface cleaning treatment chamber 3 is performed by changing the temperature of the RP 20 from the baking treatment temperature to 100 ° C.
It is preferable to carry out the treatment at a temperature of up to a certain degree.
If the cooling temperature in the surface purification treatment chamber 3 is too high, it is difficult to sufficiently reduce the cooling time in the next cooling treatment chamber 4, and conversely, if the cooling temperature is too low, the reheating time in the sealing treatment chamber 7 described later Tends to be long. Further, the surface purification treatment chamber 3 preferably has a degree of vacuum of about 10 ⁻⁴ Pa to 10 ⁻⁵ Pa in order to easily maintain a high degree of vacuum in the subsequent treatment chamber. In the illustrated example, the electron beam 35 is irradiated by the electron gun 34 as the surface cleaning treatment.
As shown in FIG. 1C, the temperature of the RP 20 is lowered and the pressure is reduced to 10 ⁻⁵ Pa.

After the surface cleaning process is completed, the gate valve 29 is opened and the RP 20 is conveyed to the cooling process chamber 4 while being placed on the temperature control means 33, and the gate valve 29 is closed to perform the cooling process. This cooling process is to prevent the gas from being released from the RP 20 in the subsequent processing chamber, and if the cooling process in the surface purification processing chamber 3 can sufficiently cool the cooling process chamber 4, the cooling process chamber 4 may be omitted. You can

Cooling in the cooling processing chamber 4 can be carried out by lowering the temperature of the temperature control means 33.
It is preferable to cool until the temperature of P20 reaches 250 to 80 ° C. In order to make it easier to maintain the degree of vacuum of the next chamber getter processing chamber 5, the inside of the cooling processing chamber 4 is 10 ^−5.
The degree of vacuum is preferably about 10 ⁻⁶ Pa. In the illustrated example, as shown in FIG.
P19 is cooled to about 100 ° C., and the inside of the cooling treatment chamber 4 is depressurized to 10 ⁻⁵ Pa.

After the above cooling treatment, the gate valve 3
0 is opened, the RP 20 is conveyed to the chamber getter processing chamber 5 while being placed on the temperature control means 33, the gate valve 30 is closed, and the chamber getter processing is performed. In the chamber getter processing chamber 5, the chamber getter plate 36 in the processing chamber is subjected to the chamber getter processing in which the evaporation getter agent such as barium is flushed by the chamber getter flash device 37 to deposit the getter film. The getter film deposited on the chamber getter plate 36 captures the gas in the chamber getter processing chamber 5 and raises the degree of vacuum in the processing chamber.

The chamber getter process is for facilitating the maintenance of a high vacuum level in the assembly processing chamber 6 of the next sealing processing line, and up to a vacuum level similar to the vacuum level required for the assembly processing chamber 6. It is preferable to reduce the pressure. The chamber getter process may be a process of heating and activating the non-evaporable getter agent in the processing chamber to capture gas, instead of the above-mentioned evaporative getter agent. It is also possible to combine the above treatment with the treatment using the non-evaporable getter agent.

In the chamber getter processing chamber 5 in which the chamber getter process using the evaporative getter agent is performed, the vacuum degree is temporarily lowered by the flash of the evaporative getter agent, but by evacuation to the required high vacuum degree. Can be migrated. Further, in the chamber getter processing chamber 5, the RP 20 may be kept at the temperature of the cooling processing chamber 4, but if the cooling is insufficient, it may be further cooled. In the illustrated example, as shown in FIG. 1C, the chamber getter processing chamber 5 is depressurized to a vacuum degree of 10 ⁻⁶ Pa and the RP 20 is maintained at 100 ° C.

The chamber getter process is performed in the assembly process chamber 6
The chamber getter processing chamber 5, which is a so-called anterior chamber, is made to have a high vacuum, and is omitted if a high degree of vacuum can be obtained without such a chamber getter processing. Purification treatment chamber 3 or cooling treatment chamber 5
Can be directly connected to the assembly processing chamber 6. However, in order to easily maintain the assembly processing chamber 5 at a high degree of vacuum, the chamber getter processing chamber 5 is provided and the assembly processing chamber 6 is provided.
It is preferable to perform chamber getter processing before transporting to.

After the chamber getter processing in the chamber getter processing chamber 5, the RP 20 is transferred to the assembly processing chamber 6 of the next sealing processing line by opening the gate valve 6. The sealing processing line will be described later.

(2) Face plate processing line Each processing chamber of the face plate processing line will be described with reference to FIG.

The face plate processing line is FP21.
Is a line for performing necessary processing until the FP21 is loaded and the FP21 is transported to the assembly processing chamber 6 of the above-described sealing processing line. The preprocessing chamber 9, the substrate baking processing chamber 10, the surface cleaning processing chamber 11, The cooling processing chamber 12, the chamber getter processing chamber 12, and the panel getter processing chamber 14 are connected in series in this order, and the panel getter processing chamber 14 is connected to the assembly processing chamber 6 of the sealing processing line. Each processing chamber is evacuated by a vacuum pump so that a necessary vacuum atmosphere can be formed.

Among the processing chambers of the face plate processing line, the pre-processing chamber 9, the substrate baking processing chamber 10, the surface cleaning processing chamber 11, the cooling processing chamber 12 and the chamber getter processing chamber 13 are the objects to be transferred. FP21,
Pretreatment chamber 9 in the above-mentioned rear plate treatment line except that temperature control means 39 holds FP21 in the opposite direction and that chamber getter treatment chamber 13 is connected to panel getter treatment chamber 14. The same processing is performed in the same processing chamber as the substrate baking processing chamber 10, the surface cleaning processing chamber 11, the cooling processing chamber 12, and the chamber getter processing chamber 12 (see FIG. 2), and the same change can be made. is there. In the illustrated example, the temperature profile of the FP21 in the pretreatment chamber 9, the substrate baking treatment chamber 10, the surface cleaning treatment chamber 11, the cooling treatment chamber 12, and the chamber getter treatment chamber 13, and the vacuum degree profile of each of these treatment chambers. As is clear from FIGS. 1D and 1C, the pretreatment chamber 9, the substrate baking treatment chamber 10, the surface cleaning treatment chamber 11, the cooling treatment chamber 12, and the chamber getter treatment in the rear plate treatment line are shown in FIG. The temperature profile of the RP 20 in the chamber 13 and the vacuum degree profile of each of these processing chambers are similar.

The transport unit 24, gate valves 40 to 46, electron gun 47, electron beam 48, chamber getter plate 49, chamber getter flash device 50 in FIG.
The chamber getter flash 51 includes the transfer unit 23, the gate valves 26 to 31, the electron gun 34, the electron beam 35, the chamber getter plate 36, the chamber getter flash device 37, and the chamber getter flash 3 in FIG. 2, respectively.
It corresponds to 8.

The FP 21 processed in the face plate processing line is a substrate provided with a phosphor (not shown) as an image forming member on its inner surface, and is a display surface which is the surface of the image display panel 19 (see FIG. 1). Is a member constituting.

In the face plate processing line, F
P21 is held by the temperature control means 33 facing forward in the carrying direction (see FIG. 2), while P21 is held by the temperature controlling means 39 facing backward in the carrying direction. It has become one. In the assembly processing chamber 6 of the sealing processing line, which will be described later, the RP2
It is for facilitating the inner surfaces of 0 and FP21 to face each other, and depending on how the alignment is performed in the assembly processing chamber 6, the FP21 can be transported forward and the RP20 can be transported backward, or the FP21 and RP21 can be transported backward.
It is also possible to convey 20 in the same direction.

The bake treatment in the bake treatment chamber 10 in the face plate treatment line is the same as the bake treatment in the substrate bake treatment chamber 2 (see FIG. 2) in the rear plate treatment line, as described above. In the invention, since the sealing material is not provided when baking the FP21 in the substrate baking processing chamber 10, even if the sealing material is heated to a high temperature at which gas and moisture can be released and removed as described above. It fluidizes and does not stick out due to shaking or vibration during transportation. Therefore, the baking temperature can be arbitrarily set within a range that does not adversely affect the FP21 itself.
It is easy to sufficiently perform the baking treatment of.

In the face plate processing line, when the chamber getter processing in the chamber getter processing chamber 13 is completed, the gate valve 45 is opened and the FP21 is transferred to the panel getter processing chamber 14 while being placed on the temperature control means 39. Close 45.

The panel getter processing chamber 14 is a processing chamber equipped with a panel getter flash device 52. For example, an evaporative getter agent such as barium built in the panel getter flash device 52 is heated by resistance heating or the like, and is instantly heated. A panel getter process is performed in which a panel getter flash 53 is generated by the selective evaporation and a getter film is deposited on the inner surface of the FP 21. The getter film deposited on the inner surface of the FP 21 maintains its activity until after the sealing process described later, captures the gas released into the image display panel 19 after the sealing process, and It serves to maintain a high vacuum atmosphere.

It is preferable that the getter processing chamber 13 to the sealing processing chamber 7 have a high degree of vacuum so that the getter film does not lose its activity by adsorbing the gas in the processing chamber. Specifically, the degree of vacuum is preferably 10 ⁻⁵ Pa or higher. In order to obtain this degree of vacuum, in addition to exhaust by a general vacuum exhaust pump, the chamber getter processing described in the above rear plate processing line and the capture such as gas capture by heat activation of the non-evaporable getter agent are captured. Means can also be used in combination. Also, the chamber getter processing chamber 1
It is preferable that the FP 21 which is subjected to the chamber getter process in 3 is cooled to a temperature at which the getter film to be deposited is not thermally deteriorated, for example, in the case of barium getter, specifically about 120 to 60 ° C. The cooling processing in the surface purification processing chamber 11 and the cooling processing chamber 12 in the face plate processing line is performed on the inner surface of the FP21 in the panel getter processing chamber 14 in addition to the gas release prevention in the subsequent processing chamber described in the rear plate processing line. It also has the meaning of preventing thermal deterioration of the getter film deposited. In the illustrated example, the panel getter processing chamber 14 has a vacuum degree of 10 ⁻⁶ Pa, and the FP 21 is held at 100 ° C.

After the panel getter process in the panel getter process chamber 14, the FP 21 is transferred to the assembly process chamber 6 of the next sealing process line by opening the gate valve 46. The sealing processing line will be described later.

(3) Outer Frame Processing Line Each processing chamber of the outer frame processing line will be described with reference to FIG.

The outer frame 22 is carried into the outer frame processing line,
A line that performs necessary processing until the outer frame 22 is transported to the assembly processing chamber 6 of the sealing processing line described above.
Pre-treatment chamber 15, outer frame bake treatment chamber 16, cooling treatment chamber 1
7. The chamber getter processing chamber 18 is connected in series in this order,
The chamber getter processing chamber 18 is connected to the assembly processing chamber 6 of the sealing processing line. Each processing chamber is evacuated by a vacuum pump so that a necessary vacuum atmosphere can be formed.

Among the processing chambers of the outer frame processing line, the pre-processing chamber 15, the outer frame bake processing chamber 16, the cooling processing chamber 17, and the chamber getter processing chamber 18 are the outer frames 22 that are transferred. In addition, except that the heating condition is different from the point that the temperature is transferred without using the temperature control means 33 and heating and cooling are performed in the outer frame bake processing chamber 16 and the cooling processing chamber 17 without depending on the temperature control means 33 and 39. In the rear plate processing line, the same processing is performed in the same processing chamber as the preprocessing chamber 9, the substrate baking processing chamber 10, the cooling processing chamber 12, and the chamber getter processing chamber 12 (see FIG. 2), and the same changes are made. It is possible. In the illustrated example, the pretreatment chamber 1
5, the temperature profile of the outer frame 22 in the cooling processing chamber 17 and the chamber getter processing chamber 18 and the vacuum degree profile of each of these processing chambers are as shown in FIGS. 1 (b) and 1 (c). The temperature profile of the RP 20 in the pretreatment chamber 9, the cooling treatment chamber 12, and the chamber getter treatment chamber 13 in the rear plate treatment line and the vacuum degree profile of each of these treatment chambers are similar.

The transfer unit 25, the gate valves 54 to 58, the chamber getter plate 59, the chamber getter flush device 60, and the chamber getter flash 61 in FIG. 4 are respectively the transfer unit 23, the gate valves 26 to 31, and the chamber in FIG. It corresponds to the getter plate 36, the chamber getter flash device 37, and the chamber getter flash 38.

The outer frame 22 to be processed by the outer frame processing line constitutes the peripheral side wall of the image display panel 19 (see FIG. 1), and the portion facing the RP 20 (see FIG. 2) and the F
A sealing material (not shown) is provided in advance at the location facing P21 (see FIG. 3).

The bake treatment of the outer frame bake processing chamber 16 in the outer frame processing line can be carried out by, for example, heat treatment by lamp heating. This outer frame 22 is baked as follows.
Since it is performed separately from the RP20 (see FIG. 2) and the FP21 (see FIG. 3) described above, the temperature can be freely set separately from the baking process of the RP20 and FP21. Therefore, even when the RP 20 and the FP 21 are sufficiently baked at the above-mentioned high temperature, the outer frame 22 is baked at a temperature at which the sealing material provided in advance does not flow out and flow out. be able to.

By the way, the outer frame 22 is the image display panel 1
9 (see FIG. 1) constitutes the peripheral side wall, the exposed area inside the image display panel 19 is small, and even if the baking process is insufficient to some extent, the inside of the image display panel 19 after sealing is sealed. Has little effect on the degree of vacuum. Therefore, the outer frame 2
Even if the baking treatment of 2 is suppressed to a temperature at which the sealing material does not fluidize, the RP having a large exposed area in the image display panel 19
By sufficiently baking the 20 (see FIG. 2) and the FP 21 (see FIG. 3), it is possible to suppress a decrease in the degree of vacuum in the image display panel 19 after sealing.

In the baking process of the outer frame 22 in the outer frame bake processing chamber 16, it is necessary to prevent the outflow from flowing by making the temperature below the temperature at which the sealing material is fluidized. However, the image display panel 1 after the sealing is performed.
In order to effectively suppress the decrease in the degree of vacuum inside 9, it is preferable that the temperature is at least equal to or higher than the temperature at which water attached or adsorbed to the outer frame 22 can be removed by evaporation, and the gas attached or adsorbed can be removed to some extent. More preferably, the temperature is used. Specifically, depending on the type of the sealing material used, it is preferable to heat to 100 ° C or higher and lower than 380 ° C. In the illustrated example, as shown in FIG. 1B, heating is performed at 120 ° C. In addition, the baking processing room 1
Vacuum of 5, as similar to the substrate baking chamber 2 (see FIG. 2) in the rear plate processing line described above, in the illustrated example, shown in FIG. 1 (b), 10 ^-4
It is Pa.

For the cooling treatment in the cooling treatment chamber 17, for example, a cooling plate having a temperature control function by a cooling medium such as water can be used. Since the heating in the outer frame bake processing chamber 16 is not so high, the cooling processing chamber 17 in this outer frame processing line is omitted or, when the chamber getter processing chamber 18 is provided, the outer frame 22 in the chamber getter processing chamber 18 is omitted. Can be replaced by cooling. In addition, as described above, the outer frame 22
Has a small effect on the degree of vacuum in the image display panel 19 (see FIG. 1) after sealing, so that the outer frame baking chamber 1
6 can be omitted. Furthermore, for example, the surface cleaning treatment chamber 3 described in FIG. 2 can be interposed between the outer frame bake treatment chamber 16 and the cooling treatment chamber 17.

(4) Sealing Processing Line Each processing chamber of the outer frame processing line will be described with reference to FIG.

In the sealing processing line, the RP 20, FP 21 and outer frame 22 conveyed to the assembly processing chamber 6 are aligned in a predetermined positional relationship, and sealing is performed using a sealing material provided in advance in the outer frame. The assembly processing chamber 6, the sealing processing chamber 7, and the post-processing chamber 8 are connected in series in this order on a processing line. Each processing chamber is evacuated by a vacuum pump,
The necessary vacuum atmosphere can be formed.

In the assembly processing chamber 6 of the sealing processing line,
The chamber getter processing chamber 5 of the rear plate processing line, the panel getter processing chamber 14 of the face plate processing line, and the chamber getter processing chamber 18 of the outer frame processing line described above.
Are connected via gate valves 31, 46, 58, respectively, and the RP 20, FP 21, and outer frame 22 join from each line. Also, between the assembly processing chamber 6 and the sealing processing chamber 7, the sealing processing chamber 7 and the post-processing chamber 8
And the post-treatment chamber 8 and the atmosphere are separated by gate valves 62 to 64, respectively.

The assembly processing chamber 6 is provided with an alignment device, and the gate valves 31, 46,
58 is opened, and RP20 is provided from the chamber getter processing chamber 5 of the rear plate processing line, FP21 is provided from the panel getter processing chamber 14 of the face plate processing line, and outer frame 22 is provided from the chamber getter processing chamber 18 of the outer frame processing line. It is something that is transported. RP20 and FP21
Are carried on the temperature control means 33 and 39, respectively. Subsequent carrying on the sealing processing line is carried out on the rear plate processing line and a series of carrying units 23.
Done in.

After the RP 20, FP 21 and outer frame 22 are fed and the gate valves 31, 46, 58 are closed, first, the outer frame 22 is attached to the FP 21, and the abutting pin provided in the temperature control means 39. Place by. After arranging the outer frame 22, temperature control means 33 on which the RP 20 is placed
Then, the temperature control means 39 on which the FP 21 is placed is made to face the inner surfaces of the RP 20 and the FP 21 so that they face each other, and the RP 20 and the FP 21 are relatively aligned. This relative alignment can be performed by using the abutting pins provided on the temperature control means 33 and / or 39 with reference to the end faces of the RP 20 and the FP 21, but other methods may be used. After this relative alignment, the temperature control means 33,
39 further closer to each other, sandwiching the outer frame 22, and connecting the RP 20 and the F
P21 is pressed and the assembly process is completed.

The vacuum degree of the assembly processing chamber 6 is RP20,
In order to maintain the FP21 and the outer frame 22 in a clean state and to maintain the active state of the getter film applied to the FP21 by the panel getter treatment, it is preferable to maintain the pressure at 10 ⁻⁵ Pa or higher. In addition, the temperatures of the RP 20, FP 21, and outer frame 22 in the assembly processing chamber 6 are maintained at about the temperature at which they were carried into the assembly processing chamber 6. In the illustrated example, the vacuum degree of the assembly processing chamber 6 is 1
0 ^-6 has a Pa, RP in the assembling process chamber 6
The temperatures of 20, FP 21 and outer frame 22 are maintained at 100 ° C., which is the same as when they were carried in.

After the assembly process is completed, both temperature control means 3
The RP20 and FP21 sandwiched between 3, 39 and pressed against each other with the outer frame 22 interposed therebetween open the gate valve 62,
The gate valve 62 is closed by transporting it to the sealing processing chamber 7 so that the assembly positional relationship does not shift.

In the sealing processing chamber 7, the temperature control means 33, 3
The temperature of 9 is raised and the RP 20, FP 21 and outer frame 22 are reheated to a temperature suitable for sealing, and the sealing material provided in advance on the outer frame 22 is softened to a bondable state, A sealing process is performed in which the peripheral edges of the RP 20 and the FP 21 that face each other with the frame 22 sandwiched therebetween are bonded in an airtight state. In this sealing treatment, the sealing material is held at the peak temperature for about 10 minutes after the sealing material is softened or melted and becomes ready for adhesion, and then the temperature control means 3 is used.
This can be performed by lowering the temperatures of 3, 39 to cool the RP 20, FP 21, and the outer frame 22, and at the same time, cooling and solidifying the sealing material.

The sealing processing chamber 7 preferably has the same degree of vacuum as the assembly processing chamber 6 so that the inside of the image display panel 19 formed by sealing has a high degree of vacuum. In the illustrated example, as shown in FIG.
^-6 Pa is maintained.

The reheating performed in the sealing processing chamber 7 is
It is preferable to keep the temperature as low as possible in order to shorten the cooling treatment time performed in the next post-treatment chamber 8. If necessary, only the peripheral portions of the RP20 and FP21 provided with the sealing material (near the outer frame 22) Partial heating) can also be used. The reheating temperature depends on the type of the sealing material used. For example, when indium metal is used as the sealing material, the heating peak temperature is about 160 ° C. and the cooling solidification temperature is 1 ° C.
It can be set to about 40 ° C. In the illustrated example, the temperature is 160 ° C. as shown in FIG. When frit glass is used as the sealing material, the sealing treatment can be performed by setting the heating peak temperature to about 390 ° C and the cooling and solidifying temperature to about 300 ° C.

In the illustrated example, the assembly processing chamber 6 and the sealing processing chamber 7 are provided, but the assembly processing and the sealing processing do not have to be performed separately in different processing chambers, and are illustrated. The assembly processing chamber 6 may be the sealing processing chamber 7, and both the assembly processing (alignment) and the sealing processing may be performed in the sealing processing chamber 7.

After cooling to the cooling and solidifying temperature of the sealing material,
The image display panel formed by the sealing process is removed from the temperature control means 33, 39, the gate valve 63 is opened, and the image display panel is conveyed to the post-processing chamber 8. It is preferable that the post-treatment chamber 8 has a vacuum degree similar to that of the sealing treatment chamber 8 so as not to impair the vacuum degree of the sealing treatment chamber 8. In the illustrated example, it is preferable to evacuate to about 10 ⁻⁶ Pa.

In the post-processing chamber 8, the image display panel 1
A cooling process is performed to lower the temperature of 9 to a temperature at which it can be carried out. For this cooling treatment, a cooling plate having a temperature control function using a cooling medium such as water can be used. This cooling process can be performed by vacuum leaking and gradually increasing the pressure in the post-processing chamber 8 to the atmosphere, and also by performing natural cooling.

The temperature of the formed image display panel 19 is lowered to a temperature at which it can be taken out to the outside, and the post-processing chamber 8 is vacuum-leaked to atmospheric pressure, and then the gate valve 64 is opened to take out the image display panel 18.

Next, a second example of the present invention will be described with reference to FIGS. In FIGS. 6 to 8, the same reference numerals as those in FIGS. 1 to 5 indicate the same members.

FIG. 6 (a) is a diagram schematically showing a second example of the manufacturing apparatus used in the manufacturing method of the present invention.
6D shows the temperature profile of the processing target member and the vacuum degree profile of each processing chamber in the outer frame processing line, face plate processing line, rear plate processing line to sealing processing line in FIG. 6A. .

In FIG. 6A, the lower line is the rear plate and sealing treatment line, 1 is a pretreatment chamber, 2 is a substrate baking treatment chamber, 3 is a surface cleaning treatment chamber, 4 is a cooling treatment chamber, 5 Is a chamber getter processing chamber, 6 is an assembly processing chamber,
7 is a sealing treatment chamber, 8 is a post-treatment chamber, and the pre-treatment chamber 1 to the chamber getter treatment chamber 5 are rear plate treatment lines,
The assembly processing chamber 6 to the post-processing chamber 8 that follow are the sealing processing line. The rear plate and the sealing processing line are shown enlarged in FIG.

In FIG. 6A, the middle line is a face plate processing line, 9 is a pretreatment chamber, 10 is a substrate baking treatment chamber, 11 is a surface cleaning treatment chamber, 12 is a cooling treatment chamber, and 64 is an outer frame. A set process chamber, 13 is a chamber getter process chamber, and 14 is a panel getter process chamber. The panel getter process chamber 14 is connected to the assembly process chamber 6 in the sealing line. This face plate processing line is shown enlarged in FIG.

In FIG. 6A, the upper line is an outer frame processing line, 15 is a pre-treatment chamber, 16 is an outer frame bake treatment chamber, 17 is a cooling treatment chamber, and this cooling treatment chamber 17 is the above face. It is connected to the outer frame set processing chamber 65 in the plate processing line. This outer frame processing line is shown enlarged in FIG.

In this example, after facilitating the alignment in the assembly processing chamber 6 of the sealing processing line, after setting the outer frame 22 at a predetermined position of the FP 21 which has been baked,
As shown in FIG.
~ As shown in FIG. 8, between the cooling processing chamber 12 and the chamber getter processing chamber 13 of the face plate processing line,
Outer frame set processing chamber 65 through gate valves 66 and 67
And the chamber getter processing chamber 18 (see FIG. 4) of the outer frame processing line is omitted, and the cooling processing chamber 17 is not the assembly processing chamber 6 but the outer frame through the gate valve 68. It is different from the one in FIGS. 1 to 5 in that it is connected to the set processing chamber 65.

The outer frame setting processing chamber 65 is a processing chamber in which the outer frame 22 is aligned and temporarily fixed at a predetermined position of the conveyed FP 21 with the abutment pin arranged and fixed in the temperature control means 39 as a reference. It is preferable that the degree of vacuum is equal to or higher than that of the cooling processing chamber 4. In the illustrated example, the outer frame setting process chamber 65 has a vacuum degree of 10 ⁻⁵ Pa, and the temperature profile in the outer frame setting process chamber 65 is 100 ° C.

Even when the outer frame 22 is set on the FP 21 which has been subjected to the baking process and then conveyed to the assembly processing chamber 6 as in this example, the FP 2 is separated from the outer frame 22 provided with the sealing material in advance.
1 bake treatment can be performed, and the same benefits as those in FIGS. 1 to 5 can be obtained. Moreover, since the FP 21 and the outer frame 22 are simultaneously transferred to the assembly processing chamber 6,
The role of the chamber getter processing chamber 18 (see FIG. 4) for easily maintaining the high vacuum degree of the assembly processing chamber 6 is integrated into the chamber getter processing chamber 14, and even if the chamber getter processing chamber 18 is omitted, The same effect as when this is provided can be obtained. Further, the alignment in the assembly processing chamber 6 may be performed for two of the RP 20 and the FP 21, which simplifies the alignment operation of the RP 20 and the FP 21 and improves the accuracy.

Outer frame 2 before sealing treatment in the second example
The setting of 2 can be performed not for the FP 21 but for the RP 20 that has undergone the baking process, for the RP 20. For example, the outer frame set processing chamber 65 may be interposed between the cooling processing chamber 4 and the chamber getter processing chamber 5 in the rear plate processing line, and the cooling processing chamber 17 of the outer frame processing line may be connected thereto.

In the above first and second examples, since the pretreatment chamber 1 and the posttreatment chamber 8 are opened to the atmosphere, it may take some time to exhaust to the required vacuum degree. In particular, since it is preferable that the post-treatment chamber 8 be evacuated to a high degree of vacuum equivalent to that of the sealing treatment chamber, this evacuation easily takes time. Therefore, the pre-treatment chamber 1 and the post-treatment chamber, especially the post-treatment chamber 8
Is provided, and the plurality of pretreatment chambers 1 or posttreatment chambers 8 are connected to each other through a gate valve (not shown), and the degree of vacuum is raised or lowered stepwise to carry in or out. The evacuation time at the time of carrying out can be shortened. Further, with respect to the processing chambers other than the pre-processing chamber 1 or the post-processing chamber 8, a plurality of the same processing chambers may be provided to adjust the processing time in continuous processing and reduce the exhaust time for obtaining the required degree of vacuum. it can.

At the same time, the members to be processed are transferred to the respective processing chambers,
In the case of performing continuous processing, the substrate baking processing chambers 2 and 10, the outer frame baking processing chamber 16 and the cooling processing chambers 4, 12 and 17 in which the processing time is relatively long, sequentially convey a plurality of processing target members and simultaneously perform the processing. It is preferable to perform the treatment.

In each of the described examples, the RP20 is used.
And FP21 are baked in separate substrate baking processing chambers 2 and 10, but both are processed in one substrate baking processing chamber 2 or 1.
It is also possible to combine the substrate baking processing chambers 2 and 10 by transporting them to 0 and baking them together.

[0086]

The present invention is as described above, and a sealing material is provided in advance on the outer frame, and a pair of substrates is baked separately from the outer frame to form a panel-like hermetic seal. A substrate having a large exposed area in the container can be baked for a long time at a high temperature at which sufficient gas and moisture can be removed without causing a protrusion due to the flow of the sealing material. Further, since the outer frame has a small exposed area in the panel-shaped hermetic container, the adverse effect on the degree of vacuum in the panel-shaped hermetic container is small even if the baking process is not performed,
By subjecting the substrate to a sufficient baking treatment, it is possible to maintain a good degree of vacuum in the panel-shaped hermetic container. Furthermore, if the pair of substrates are baked in different substrate baking chambers, respectively, the baking can be performed under different conditions.
A more appropriate baking process becomes possible.

[Brief description of drawings]

FIG. 1 is a diagram schematically showing a first example of a manufacturing apparatus used in a manufacturing method of the present invention, and also a diagram schematically showing a temperature profile of a processing target member and a vacuum degree profile of each processing chamber in this manufacturing apparatus. Is.

FIG. 2 is an enlarged view of a rear plate processing line in FIG.

FIG. 3 is an enlarged view of the face plate processing line in FIG.

FIG. 4 is an enlarged view of an outer frame processing line in FIG.

5 is an enlarged view of the sealing processing line in FIG.

FIG. 6 is a diagram schematically showing a second example of a manufacturing apparatus used in the manufacturing method of the present invention, and also a diagram schematically showing a temperature profile of a processing target member and a vacuum degree profile of each processing chamber in this manufacturing apparatus. Is.

7 is an enlarged view of a rear plate processing line to a sealing processing line in FIG.

8 is an enlarged view of a face plate processing line and an outer frame processing line in FIG.

[Explanation of symbols]

1 pretreatment room 2 Substrate bake processing room 3 Surface purification treatment room 4 Cooling chamber 5 Chamber getter processing chamber 6 Assembly processing room 7 Sealing processing room 8 Aftertreatment room 9 Pretreatment room 10 Substrate bake processing room 11 Surface purification treatment room 12 Cooling room Processing room 13 Chamber getter processing chamber 14 panel getter processing room 15 Pretreatment room 16 Outer Bake Processing Room 17 Cooling chamber 18 Chamber Getter Processing Room 19 Image display panel 20 Rear plate (RP) 21 Face plate (FP) 22 Outer frame 23 Transport unit 24 Transport unit 25 Transport unit 26-31 Gate valve 32 spacer 33 Temperature control means 34 electron gun 35 electron beam 36 Chamber getter plate 37 Chamber getter flash device 38 Chamber Getter Flash 39 Temperature control means 40-46 Gate valve 47 electron gun 48 electron beams 49 Chamber getter plate 50 chamber getter flash device 51 Chamber Getter Flash 52 panel getter flash device 53 panel getter flash 54-58 Gate valve 59 Chamber Getter Plate 60 Chamber getter flash device 61 Chamber Getter Flash 62-64 Gate valve 65 Outer frame processing room 66-68 Gate valve

Continued front page    (72) Inventor Toshihiko Miyazaki             3-30-2 Shimomaruko, Ota-ku, Tokyo             Non non corporation F-term (reference) 5C012 AA05 BC03 BC04

Claims (8)

[Claims] 1. A series of processing apparatuses having a plurality of depressurized processing chambers including at least a sealing processing chamber, wherein a pair of substrates constituting the front and back surfaces of a panel-like airtight container and an outer frame constituting a peripheral side wall are provided. In a method of manufacturing a panel-shaped hermetic container in which a pair of substrates and an outer frame which have been carried in and sequentially transported between processing chambers and which have undergone predetermined processing are subjected to a sealing treatment in the sealing treatment chamber using a sealing material. As a processing chamber of the processing apparatus, a substrate baking processing chamber in which at least the pair of substrates is transferred prior to being transferred to the sealing processing chamber is provided, and the sealing material is provided in advance in the outer frame. A method for manufacturing a panel-shaped hermetic container, characterized in that at least the pair of substrates are separated from the outer frame and are conveyed to the substrate baking treatment chamber to be subjected to a baking treatment. 2. The substrate bake treatment chamber is provided for each of two substrates forming a pair of substrates, and the two substrates are conveyed to different substrate bake treatment chambers for bake treatment. The method for manufacturing a panel-shaped hermetic container according to claim 1. 3. The panel-like airtightness according to claim 1, wherein the heating condition for the baking treatment of the substrate in the substrate baking treatment chamber is equal to or higher than the temperature at which the gas adsorbed on the substrate is released. Container manufacturing method. 4. A processing chamber of the processing apparatus, wherein an outer frame baking processing chamber is provided in which an outer frame is transferred prior to being transferred to the sealing processing chamber, and the outer frame is separated from the substrate. The method for producing a panel-shaped hermetic container according to claim 1, wherein the method is carried to a bake treatment chamber and subjected to a bake treatment. 5. The fluidization of a sealing material provided in advance in the outer frame in which the heating condition for the outer frame bake treatment in the outer frame bake treatment chamber is equal to or higher than the release temperature of water adhering to or adsorbed to the outer frame. The method for producing a panel-shaped hermetic container according to claim 4, wherein the temperature is lower than the temperature. 6. The pair of substrates and the outer frame are conveyed to the sealing processing chamber while being separated from each other.
5. The method for manufacturing the panel-shaped airtight container according to any one of 5 above. 7. The outer frame is set on one of the substrates that has undergone the baking treatment in the substrate baking treatment chamber by using a sealing material provided in advance, and is conveyed to the sealing treatment chamber. The method for manufacturing the panel-shaped hermetic container according to claim 1. 8. The outer frame is set on one of the substrates which has been subjected to the baking treatment in the substrate baking treatment chamber and sealed by using a sealing material provided in advance after the baking treatment in the outer frame baking treatment chamber. The method for producing a panel-shaped hermetic container according to claim 4 or 5, wherein the method is carried to a processing chamber.