JP4408110B2 - Manufacturing method of image display device - Google Patents

Description

The present invention seals a face plate constituting a display surface of an image display device, particularly a display panel, and a rear plate constituting a back surface of the display panel so as to be opposed to the face plate at an interval. The present invention relates to a method for manufacturing an image display device having a display panel to be formed.

  2. Description of the Related Art Conventionally, two types of electron-emitting devices, known as a thermionic electron-emitting device and a cold cathode electron-emitting device, are known. Cold cathode electron-emitting devices include field emission type (hereinafter referred to as FE type), metal / insulating layer / metal type (hereinafter referred to as MIM type), surface conduction type electron emitting device, and the like.

  As an example of the FE type, W.W. P. Dyke & W. W. Dolan, “Field Emission”, Advance in Electro Physics, 8, 89 (1956), or C.I. A. Spindt, “PHYSICAL Properties of Thin-Film Field Emission Catalysts with Mollybdenum Cones”, J. Am. Appl. Phys. 47, 5248 (1976), etc. are known.

  Examples of the MIM type include C.I. A. Mead, “Operation of Tunnel-Emission Devices”, J. Am. Appl. Phys. , 32, 646 (1961), etc. are known.

  Examples of the surface conduction electron-emitting device type include M.I. I. Elinson, Radio Eng. Electron Phys. , 10, 1290 (1965).

The surface conduction electron-emitting device utilizes a phenomenon in which electron emission occurs when a current flows in parallel to a film surface of a small-area thin film formed on a substrate. As this surface conduction electron-emitting device, one using the SnO ₂ thin film by Erinson et al., One using Au thin film [G. Dittmer: “Thin Solis Films,” 9,317 (1972)], In ₂ O ₃ / SnO ₂ thin film [M. Hartwell and C.H. G. Fonstad: “IEEE Trans. ED Conf.”, 519 (1975)], carbon thin film [Hisa Araki et al .: Vacuum, Vol. 26, No. 1, pp. 22 (1983)] have been reported.

  In the manufacture of an image display device using the above-described electron-emitting devices, an electron source substrate (rear plate) in which these electron-emitting devices are arranged in a matrix is prepared, and a phosphor that emits light when excited by an electron beam is prepared. A prepared phosphor substrate (face plate) is prepared so that the electron-emitting device and the phosphor are inside, and an envelope providing a vacuum seal structure between them and a spacer providing an atmospheric pressure resistant structure After the face plate and the rear plate are placed facing each other, the inside is sealed using a low melting point material such as frit glass as a sealing material, and the inside is evacuated from a vacuum exhaust pipe provided in advance. After exhausting, a manufacturing process is used in which a vacuum exhaust pipe is sealed to form a display panel.

The above-described manufacturing method according to the prior art requires a very long time to manufacture one display panel. For example, for manufacturing a display panel having an internal vacuum of 10 ⁻⁶ Pa or more. Was not suitable.

  This problem of the prior art has been solved by, for example, the method described in JP-A-11-135018.

Since the method described in the above Japanese Patent Application Laid-Open No. 11-135018 uses only the step of sealing the two substrates after aligning the FP and RP in a single vacuum chamber, Steps such as baking, gettering, and electron beam cleaning, which are other steps necessary for creating the display panel described above, also require processing in a single vacuum chamber. Since the movement of each RP between the vacuum chambers is performed by breaking the atmosphere, each vacuum chamber is evacuated every time FP and RP are carried in, and therefore the manufacturing process time is long. At the same time that shortening was required, it was also required to achieve a high vacuum such as a degree of vacuum of 10 ⁻⁶ Pa or higher in the display panel in the final manufacturing process in a short time.

  The present invention has been made in view of the above-described conventional problems, and it is an object of the present invention to make it possible to easily shorten the evacuation time and increase the degree of vacuum in the manufacture of an image display device, thereby improving the manufacturing efficiency. To do.

First, according to the first aspect of the present invention (reference invention) , a panel member constituting a panel of an image display device is sequentially conveyed to a plurality of decompressed processing chambers each having a temperature control means, and the panel member is controlled while controlling the temperature. A method of manufacturing an image display device for forming a panel by sealing the panel member after performing a plurality of treatments,
The plurality of processing chambers include a bake processing chamber for baking the panel member, and a getter processing chamber in which the panel member is transferred after the baking processing and getter processing is performed on the panel member. Is a method for manufacturing an image display device, wherein the temperature of the panel member in the getter processing chamber is set to be lower than the temperature of the panel member to be baked in the baking chamber.

In the first aspect of the present invention, the plurality of processing chambers are adjacent to the getter processing chamber to which the panel member is transferred after the baking process in the baking processing chamber and before the transfer to the getter processing chamber. It is preferable that the front chamber and the getter processing chamber are set to 10 ⁻⁴ Pa or less including the front chamber.

According to a second aspect of the present invention (reference invention) , the panel member constituting the panel of the image display device is sequentially conveyed to a plurality of decompressed processing chambers each having a temperature control means, and the panel member is controlled while controlling the temperature. A method of manufacturing an image display device for forming a panel by sealing the panel member after performing a plurality of treatments,
The plurality of treatment chambers include a bake treatment chamber for baking the panel member, a surface purification treatment chamber in which the panel member is transported after the bake treatment, and a surface purification treatment of the panel member is performed, and the surface purification treatment And a getter processing chamber in which the panel member is transported later and getter processing is performed on the panel member. In the getter processing, the temperature of the panel member in the getter processing chamber is baked in the bake processing chamber. It is a method for manufacturing an image display device, which is performed at a temperature lower than the temperature of the panel member.

In the second aspect of the present invention, the plurality of processing chambers may have the getter process in which the panel member is transferred after the surface cleaning process in the surface cleaning process chamber and before the transfer to the getter processing chamber. A front chamber adjacent to the chamber, and the front chamber and the getter processing chamber are set to 10 ⁻⁴ Pa or less, or
The surface purification treatment chamber is adjacent to the getter treatment chamber, and the surface purification treatment chamber and the getter treatment chamber are set to 10 ⁻⁴ Pa or less, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with an electron beam, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ions, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ultraviolet rays, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating plasma on the surface of the member carried in;
Is preferred.

In the first to second aspects of the present invention described above, in the getter processing chamber, getter processing in the getter processing chamber is further performed, or
The sealing of the panel member is preferably performed by setting the temperature of the panel member to a temperature higher than the temperature of the panel member to be gettered in the getter processing chamber.

According to a third aspect of the present invention (reference invention) , the panel member constituting the panel of the image display device is sequentially conveyed to a plurality of decompressed processing chambers each having a temperature control means, and the panel member is controlled while controlling the temperature. A method of manufacturing an image display device for forming a panel by sealing the panel member after performing a plurality of treatments,
The plurality of processing chambers include a baking processing chamber for baking the panel member, a first getter processing chamber in which the panel member is transported after the baking processing, and getter processing is performed in the processing chamber, and the getter processing. The panel member is transported later and the panel member is subjected to getter processing. The first getter processing chamber and a second getter processing chamber adjacent to the first getter processing chamber are provided. The method of manufacturing an image display device, wherein the temperature of the panel member in the getter processing chamber of No. 2 is set to a temperature lower than the temperature of the panel member to be baked in the baking processing chamber.

In the third aspect of the present invention, the plurality of processing chambers may be configured such that the panel member is transported after the baking processing in the baking processing chamber and before transporting to the first getter processing chamber. It is preferable that a front chamber adjacent to one getter processing chamber is included, and the front chamber and the first and second getter processing chambers are set to 10 ⁻⁴ Pa or less.

According to a fourth aspect of the present invention (reference invention) , the panel member constituting the panel of the image display device is sequentially conveyed to a plurality of decompressed processing chambers each having a temperature control means, and the panel member is controlled while controlling the temperature. A method of manufacturing an image display device for forming a panel by sealing the panel member after performing a plurality of treatments,
The plurality of treatment chambers include a bake treatment chamber for baking the panel member, a surface purification treatment chamber in which the panel member is transported after the bake treatment, and a surface purification treatment of the panel member is performed, and the surface purification treatment A first getter processing chamber in which the panel member is transported later and getter processing is performed in the processing chamber; and the first getter processing chamber in which the panel member is transported and getter processing is performed after the getter processing. A panel having a getter processing chamber and a second getter processing chamber adjacent thereto, wherein the getter processing to the panel member is performed by baking the temperature of the panel member in the second getter processing chamber in the bake processing chamber. It is a manufacturing method of an image display device, characterized in that it is performed at a temperature lower than the temperature of the member.

In the fourth aspect of the present invention, the surface purification treatment chamber is adjacent to the first getter treatment chamber, and the surface purification treatment chamber, the first and second getter treatment chambers are 10 ^-4 Pa or less, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with an electron beam, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ions, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ultraviolet rays, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating plasma on the surface of the member carried in;
Is preferred.

  In the third to fourth aspects of the present invention, the sealing of the panel member is performed by setting the temperature of the panel member to a temperature higher than the temperature of the panel member to be gettered in the second getter processing chamber. It is preferable that the setting is performed.

According to a fifth aspect of the present invention (reference invention) , the panel member constituting the panel of the image display device is sequentially conveyed to a plurality of decompressed processing chambers each having a temperature control means, and the panel member is controlled while controlling the temperature. A method of manufacturing an image display device for forming a panel by sealing the panel member after performing a plurality of treatments,
The plurality of processing chambers are a baking chamber for baking the panel member, the panel member is transferred after the baking, a cooling chamber for cooling the panel member, and the panel member is transferred after the cooling process. And a getter processing chamber in which getter processing is performed on the panel member.

In the fifth aspect of the present invention, the plurality of processing chambers may include the getter processing chamber in which the panel member is transported after cooling processing in the cooling processing chamber and before transporting to the getter processing chamber. Including an adjacent front chamber, the front chamber and the getter processing chamber being set to 10 ⁻⁴ Pa or less, or
The cooling processing chamber is adjacent to the getter processing chamber, and the cooling processing chamber and the getter processing chamber are set to 10 ⁻⁴ Pa or less, or
In the getter processing chamber, further, getter processing is performed in the getter processing chamber, or
Performing further surface purification treatment of the panel member in the cooling treatment chamber, or
Performing further getter processing in the cooling chamber in the cooling chamber; or
Performing a surface purification process of the panel member and a getter process in the cooling process chamber in the cooling process chamber; or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with an electron beam, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ions, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ultraviolet rays, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating plasma on the surface of the member carried in;
Is preferred.

According to a sixth aspect of the present invention (reference invention) , the panel member constituting the panel of the image display device is sequentially conveyed to a plurality of decompressed processing chambers each having a temperature control means, and the panel member is controlled while controlling the temperature. A method of manufacturing an image display device for forming a panel by sealing the panel member after performing a plurality of treatments,
The plurality of processing chambers are a baking chamber for baking the panel member, the panel member is transferred after the baking, a cooling chamber for cooling the panel member, and the panel member is transferred after the cooling process. And a surface purification treatment chamber in which the panel member is subjected to a surface purification treatment, and a getter treatment chamber in which the panel member is transported after the surface purification treatment and the panel member is subjected to getter treatment. It is a manufacturing method of an image display device.

In the sixth aspect of the present invention, the plurality of processing chambers may have the getter process in which the panel member is transferred after the surface cleaning process in the surface cleaning process chamber and before the transfer to the getter processing chamber. A front chamber adjacent to the chamber, and the front chamber and the getter processing chamber are set to 10 ⁻⁴ Pa or less, or
The surface purification treatment chamber is adjacent to the getter treatment chamber, and the surface purification treatment chamber and the getter treatment chamber are set to 10 ⁻⁴ Pa or less, or
In the getter processing chamber, further, getter processing is performed in the getter processing chamber, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with an electron beam, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ions, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ultraviolet rays, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating plasma on the surface of the member carried in;
Is preferred.

  In the fifth to sixth aspects of the invention, the sealing of the panel member is performed by setting the temperature of the panel member to a temperature higher than the temperature of the panel member to be gettered in the getter processing chamber. It is preferred that it be done.

According to a seventh aspect of the present invention (reference invention) , the panel member constituting the panel of the image display device is sequentially conveyed to a plurality of decompressed processing chambers each provided with a temperature control means, and the panel member while controlling the temperature. A method of manufacturing an image display device for forming a panel by sealing the panel member after performing a plurality of treatments,
The plurality of processing chambers are a baking chamber for baking the panel member, the panel member is transferred after the baking, a cooling chamber for cooling the panel member, and the panel member is transferred after the cooling process. A first getter processing chamber in which getter processing is performed in the processing chamber, and adjacent to the first getter processing chamber in which the panel member is transported after the getter processing and getter processing is performed on the panel member. A method for manufacturing an image display device, comprising: a second getter processing chamber.

In the seventh aspect of the present invention, the cooling processing chamber is adjacent to the first getter processing chamber, and the cooling processing chamber and the first and second getter processing chambers are 10 ^−4. Set to Pa or below, or
Performing further surface purification treatment of the panel member in the cooling treatment chamber, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with an electron beam, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ions, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ultraviolet rays, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating plasma on the surface of the member carried in;
Is preferred.

According to an eighth aspect of the present invention (reference invention) , the panel member constituting the panel of the image display device is sequentially conveyed to a plurality of decompressed processing chambers each provided with a temperature control means, and the panel member is controlled while controlling the temperature. A method of manufacturing an image display device for forming a panel by sealing the panel member after performing a plurality of treatments,
The plurality of processing chambers are a baking chamber for baking the panel member, the panel member is transferred after the baking, a cooling chamber for cooling the panel member, and the panel member is transferred after the cooling process. A surface purification treatment chamber in which a surface purification treatment of the panel member is performed, a first getter treatment chamber in which the panel member is transported after the surface purification treatment and a getter treatment is performed in the treatment chamber, and the getter treatment A method of manufacturing an image display device, comprising: a second getter processing chamber adjacent to the first getter processing chamber in which the panel member is transported later and getter processing is performed on the panel member. is there.

In the eighth aspect of the present invention, the surface purification treatment chamber is adjacent to the first getter treatment chamber, and the surface purification treatment chamber, the first and second getter treatment chambers are 10 ^-4 Pa or less, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with an electron beam, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ions, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating the surface of the carried member with ultraviolet rays, or
The surface purification treatment is a treatment for purifying the surface of the member by irradiating plasma on the surface of the member carried in;
Is preferred.

  In the seventh to eighth aspects of the present invention, the sealing of the panel member is performed such that the temperature of the panel member is higher than the temperature of the panel member to be gettered in the second getter processing chamber. It is preferable that the setting is performed.

In the first to eighth aspects of the present invention described above, the panel member has a face plate that constitutes the display surface of the panel, and is disposed to face the face plate with a space therebetween. Sealed with the rear plate constituting the back, or
The rear plate side is provided with a first sealing material for sealing with the panel member, or
On the rear plate side, a first sealing material that forms a seal between an outer frame constituting a side surface of the panel fixed by a second sealing material and the panel member disposed on the outer frame. Or is provided, or
The second sealing material has a higher melting point than the first sealing material, or
The first sealing material is a low melting point metal or an alloy thereof, or
The second sealing material is frit glass;
Is preferred.

In the first to eighth aspects of the present invention described above, the panel member further includes a first sealing member disposed on the face plate, and the rear plate and the first sealing member. Sealed with materials, or
The rear plate side is provided with an outer frame fixed with a second sealing material and constituting the side surface of the panel, or
The second sealing material has a higher melting point than the first sealing material, or
The first sealing material is a low melting point metal or an alloy thereof, or
The second sealing material is frit glass;
Is preferred.

In the seventh to eighth aspects of the present invention, the panel member further includes an outer frame constituting a side surface of the panel fixed to the face plate with a second sealing material, and the rear member Sealed with plate, or
The rear plate side is provided with a first sealing material for sealing with the panel member, or
The second sealing material has a higher melting point than the first sealing material, or
The first sealing material is a low melting point metal or an alloy thereof, or
The second sealing material is frit glass;
Is preferred.

In the seventh to eighth aspects of the present invention, the panel member further includes an outer frame constituting a side surface of the panel fixed to the face plate with a second sealing material, and the outer frame. Having a first sealing material disposed, and being sealed with the rear plate and the first sealing material, or
The second sealing material has a higher melting point than the first sealing material, or
The first sealing material is a low melting point metal or an alloy thereof, or
The second sealing material is frit glass;
Is preferred.

In the first to eighth aspects of the present invention, the panel member has a rear plate that is disposed to face the face plate that constitutes the display surface of the panel at an interval and that constitutes the back surface of the panel. Sealing with the face plate, or
The face plate side is provided with a first sealing material for sealing with the panel member, or
On the face plate side, a first sealing material that seals an outer frame that constitutes a side surface of the panel fixed by a second sealing material and the panel member disposed on the outer frame. Or is provided, or
The second sealing material has a higher melting point than the first sealing material, or
The first sealing material is a low melting point metal or an alloy thereof, or
The second sealing material is frit glass;
Is preferred.

In the first to eighth aspects of the present invention, the panel member further includes a first sealing material disposed on the rear plate, and the face plate and the first sealing material. To be sealed, or
On the face plate side, an outer frame fixed with a second sealing material and constituting the side surface of the panel is provided, or
The second sealing material has a higher melting point than the first sealing material, or
The first sealing material is a low melting point metal or an alloy thereof, or
The second sealing material is frit glass;
Is preferred.

In the first to eighth aspects of the present invention, the panel member further includes an outer frame constituting a side surface of the panel fixed to the rear plate with a second sealing material, or
The face plate side is provided with a first sealing material for sealing with the panel member, or
The second sealing material has a higher melting point than the first sealing material, or
The first sealing material is a low melting point metal or an alloy thereof, or
The second sealing material is frit glass;
Is preferred.

In the first to eighth aspects of the present invention, the panel member further includes an outer frame that forms a side surface of the panel fixed to the rear plate with a second sealing material, and the outer frame. A first sealing material disposed and sealed with the face plate and the first sealing material; or
The second sealing material has a higher melting point than the first sealing material, or
The first sealing material is a low melting point metal or an alloy thereof, or
The second sealing material is frit glass;
Is preferred.

In the first to eighth aspects of the present invention, the face plate has a phosphor, or
The face plate has a phosphor and a metal back, or
The rear plate has a phosphor excitation means, or
The phosphor excitation means has an electron-emitting device;
Is preferred.

Further, a ninth aspect of the present invention (reference invention) is a method of manufacturing an image display device,
a: carrying the first member including the substrate on which the phosphor excitation means is disposed and the second member including the substrate on which the phosphor is disposed into a bake chamber in a vacuum atmosphere and heating and baking the member;
b: One or both members of the first member and the second member are carried into a getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the carried members or both of the carried members A step of gettering one or both;
c: carrying the first member and the second member into a sealing treatment chamber in a vacuum atmosphere in a vacuum atmosphere, and heating and sealing, and
The step b is a method for manufacturing an image display device, wherein the temperature of the member to be gettered is lower than the heating temperature in the step a.

The tenth aspect of the present invention (reference invention) is an image display device manufacturing method,
a: carrying the first member including the substrate on which the phosphor excitation means is disposed and the second member including the substrate on which the phosphor is disposed into a bake chamber in a vacuum atmosphere and heating and baking the member;
b: carrying one or both of the first member and the second member into a cooling processing chamber in a vacuum atmosphere in a vacuum atmosphere and performing a cooling process;
c: One or both of the first member and the second member are loaded into a getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the loaded members or both of the loaded members is loaded A step of gettering one or both;
d: carrying the first member and the second member into a sealing treatment chamber in a vacuum atmosphere in a vacuum atmosphere, and heating and sealing;
It is a manufacturing method of the image display apparatus characterized by having.

In the tenth aspect of the present invention, the surface purification treatment is performed on one or both of the loaded one member or both loaded members in the cooling processing chamber in the step b, or
In the cooling process chamber in the step b, it is preferable to perform a surface purification process and a getter process in the cooling process chamber on one or both of the loaded one member or both loaded members.

The eleventh aspect of the present invention is a method for manufacturing an image display apparatus,
a: carrying the first member including the substrate on which the phosphor excitation means is disposed and the second member including the substrate on which the phosphor is disposed into a bake chamber in a vacuum atmosphere and heating and baking the member;
b: One or both of the first member and the second member are carried into a surface purification treatment chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the carried-in members or both carried-in members A surface purification treatment of one or both of
c: One or both of the first member and the second member are loaded into a getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the loaded members or both of the loaded members is loaded A step of gettering one or both;
d: carrying the first member and the second member into a sealing treatment chamber in a vacuum atmosphere in a vacuum atmosphere, and heating and sealing;
I have a,
In the method of manufacturing an image display device, the temperature of the member to be gettered is lower than the heating temperature in the step a .

In the eleventh aspect of the present invention, the getter treatment in the surface purification treatment chamber is performed in the surface purification treatment chamber in the step b, or
In the surface purification treatment chamber in the step b, it is preferable to cool one of the loaded members or both of the loaded members.

According to a twelfth aspect of the present invention, in the method for manufacturing an image display device,
a: carrying the first member including the substrate on which the phosphor excitation means is disposed and the second member including the substrate on which the phosphor is disposed into a bake chamber in a vacuum atmosphere and heating and baking the member;
b: One or both of the first member and the second member are carried into a surface purification treatment chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the carried-in members or both carried-in members A surface purification treatment of one or both of
c: One or both of the first member and the second member are carried into a first getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and getter processing is performed in the first getter processing chamber. A process of performing;
d: One or both of the first member and the second member are loaded into a second getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and the loaded one member or both loaded members Gettering one or both of:
e: carrying the first member and the second member into a sealing treatment chamber in a vacuum atmosphere in a vacuum atmosphere, and heating and sealing;
I have a,
The method d is a method for manufacturing an image display device , wherein the temperature of the member to be gettered is lower than the heating temperature in the step a .

  In the twelfth aspect of the present invention, it is preferable to cool one of the loaded members or both of the loaded members in the surface purification treatment chamber of step b.

The thirteenth aspect of the present invention (reference invention) is a method of manufacturing an image display apparatus,
a: carrying the first member including the substrate on which the phosphor excitation means is disposed and the second member including the substrate on which the phosphor is disposed into a bake chamber in a vacuum atmosphere and heating and baking the member;
b: carrying one or both of the first member and the second member into a cooling processing chamber in a vacuum atmosphere in a vacuum atmosphere and performing a cooling process;
c: One or both of the first member and the second member are carried into a surface purification treatment chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the carried members or both of the carried members A surface purification treatment of one or both of
d: One or both of the first member and the second member are loaded into a getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the loaded members or both of the loaded members is loaded A step of gettering one or both;
e: carrying the first member and the second member into a sealing treatment chamber in a vacuum atmosphere in a vacuum atmosphere, and heating and sealing;
It is a manufacturing method of the image display apparatus characterized by having.

Further, a fourteenth aspect of the present invention (reference invention) is a method of manufacturing an image display device,
a: carrying the first member including the substrate on which the phosphor excitation means is disposed and the second member including the substrate on which the phosphor is disposed into a bake chamber in a vacuum atmosphere and heating and baking the member;
b: carrying one or both of the first member and the second member into a cooling processing chamber in a vacuum atmosphere in a vacuum atmosphere and performing a cooling process;
c: One or both of the first member and the second member are carried into a surface purification treatment chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the carried members or both of the carried members A surface purification treatment of one or both of
d: One or both of the first member and the second member are carried into a first getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and getter processing is performed in the first getter processing chamber. A process of performing;
e: One or both of the first member and the second member are loaded into a second getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and the loaded one member or both loaded members Gettering one or both of them,
f: carrying the first member and the second member into a sealing treatment chamber in a vacuum atmosphere in a vacuum atmosphere, and heating and sealing;
It is a manufacturing method of the image display apparatus characterized by having.

  In the ninth to fourteenth aspects of the present invention described above, the getter process in the cooling process chamber, the getter process in the surface purification process chamber, or the getter process in the first getter process chamber is a vacuum in each process chamber. This process is performed for the purpose of increasing the degree of processing, such as forming a getter film on the constituent members of the image display apparatus or forming a getter film on the non-constituent members of the image display apparatus disposed in the processing chamber. is there.

  In the ninth to fourteenth aspects of the present invention described above, the surface purification treatment is a treatment for purifying the surface of the member, and irradiating the surface of the member with an electron beam, ions, ultraviolet rays, or plasma. Is preferred.

  In the ninth to fourteenth aspects of the present invention described above, it is preferable that the getter process for the member is performed while heating the member.

The fifteenth aspect of the present invention (reference invention) is an apparatus for manufacturing an image display device,
A getter processing chamber for gettering one or both of a first member including a substrate on which phosphor excitation means is disposed and a second member including a substrate on which phosphor is disposed in a vacuum atmosphere; A sealing processing chamber for heating and sealing the first member and the second member, and the first member and the second member are connected to the getter processing chamber. A transporting means capable of transporting from the sealing processing chamber to the sealing processing chamber,
The image display device manufacturing apparatus is characterized in that a heat shielding member is provided between the getter processing chamber and the sealing processing chamber.

According to a sixteenth aspect of the present invention (reference invention) , in the image display apparatus manufacturing apparatus,
A baking process chamber for heating and baking a first member including a substrate on which a phosphor excitation means is disposed and a second member including a substrate on which a phosphor is disposed in a vacuum atmosphere; And a getter processing chamber for gettering one or both of the second member and the second member, and the first member and the second member from the bake processing chamber It has a transport means that can transport to the getter processing chamber,
An apparatus for manufacturing an image display device, wherein a heat shielding member is provided between the baking processing chamber and the getter processing chamber.

According to a seventeenth aspect of the present invention (reference invention), in an apparatus for manufacturing an image display device,
A baking process chamber for heating and baking a first member including a substrate on which a phosphor excitation means is disposed and a second member including a substrate on which a phosphor is disposed in a vacuum atmosphere; A getter treatment chamber for gettering one or both of the first member and the second member, and a seal for heating and sealing the first member and the second member. And a transporting means capable of transporting the first member and the second member in the order of a bake processing chamber, a getter processing chamber, and a sealing processing chamber,
An apparatus for manufacturing an image display device, wherein a heat shielding member is provided between the processing chambers.

An eighteenth aspect of the present invention (reference invention) is an apparatus for manufacturing an image display device.
A baking process chamber for heating and baking a first member including a substrate on which a phosphor excitation means is disposed and a second member including a substrate on which a phosphor is disposed in a vacuum atmosphere; A cooling chamber for cooling one or both of the first member and the second member, and gettering one or both of the first member and the second member. A getter processing chamber, and further comprising transport means capable of transporting the first member and the second member in the order of the bake processing chamber, the cooling processing chamber, and the getter processing chamber. An image display device manufacturing apparatus.

In the eighteenth aspect of the present invention, a heat shielding member is provided between the baking treatment chamber and the cooling treatment chamber, or
It is preferable that a heat shielding member is provided between the processing chambers.

According to a nineteenth aspect of the present invention (reference invention), in an apparatus for manufacturing an image display device,
A baking process chamber for heating and baking a first member including a substrate on which a phosphor excitation means is disposed and a second member including a substrate on which a phosphor is disposed in a vacuum atmosphere; A cooling chamber for cooling one or both of the first member and the second member, and gettering one or both of the first member and the second member. The getter processing chamber, and a sealing processing chamber for heating and sealing the first member and the second member, and the first member and the second member, An apparatus for manufacturing an image display device, comprising: a transfer unit capable of transferring the baking processing chamber, the cooling processing chamber, the getter processing chamber, and the sealing processing chamber in this order.

In the nineteenth aspect of the present invention, a heat shielding member is provided between the baking treatment chamber and the cooling treatment chamber, or
A heat shielding member is provided between the getter processing chamber and the sealing processing chamber, or
A heat shielding member is provided between the baking processing chamber and the cooling processing chamber and between the getter processing chamber and the sealing processing chamber; or
A heat shielding member is provided between the processing chambers;
Is preferred.

  Here, in the fifteenth to nineteenth aspects of the present invention, the heat shielding member is preferably made of a reflective metal.

In the ninth to nineteenth aspects of the present invention described above, the first member is
Having a substrate on which a phosphor excitation means is arranged and an outer frame, or
Having a substrate on which phosphor excitation means is arranged and a spacer, or
Having a substrate on which the phosphor excitation means is disposed, an outer frame, and a spacer;
Is preferred.

Alternatively, the second member is
Having a substrate on which a phosphor is disposed and an outer frame, or
Having a substrate with a phosphor and a spacer, or
Having a substrate on which a phosphor is disposed, an outer frame, and a spacer;
Is preferred.

In the ninth to nineteenth aspects of the present invention described above,
The getter used for the getter process is an evaporative getter, or
The phosphor excitation means has an electron-emitting device;
Is preferred.

  In the present invention described above, since each processing chamber is provided in a vacuum atmosphere, the temperature of the first or second member in each processing step is set independently for each processing chamber. The time required for raising and lowering the processing temperature can be greatly reduced.

  Further, in the present invention described above, the temperature of the member to be gettered is set to a temperature lower than the temperature of the member to be baked, and the gettering is performed by the heat of the getter film formed on the member. Degradation due to can be greatly reduced.

In the present invention described above, the front chamber or the front processing chamber adjacent to the getter processing chamber is set to a reduced pressure state of 10 ⁻⁴ Pa or less, more preferably 10 ⁻⁵ Pa or less. An extreme reduction in the degree of vacuum in the getter processing chamber when the member is transferred to the getter processing chamber can be prevented, and the standby time from the transfer of the member to the getter processing chamber until the getter processing can be shortened.

  In the present invention described above, the getter process is performed while heating the member to be gettered, so that the temperature difference between the getter process and the heating process before and after the getter process can be reduced. In addition to preventing damage to the first or second member due to extreme temperature drop, the temperature difference between the first or second member between the getter treatment step and the sealing treatment step can be reduced, so that the sealing step can be performed. The time required for the temperature rise in can be greatly reduced.

  Further, in the present invention described above, having the cooling process or the cooling process chamber can prevent the first or second member from being damaged due to extreme temperature drop, and is provided between the baking process and the getter process process. As a result, deterioration of the getter film formed on the member due to heat can be greatly reduced.

  Further, in the present invention described above, performing the surface purification treatment of the first or second member in the processing chamber in which the cooling treatment is performed means that the residual heat in the previous step such as the baking treatment step is used for the surface purification of the member. The surface purification treatment can be performed more efficiently.

  Further, in the present invention described above, the surface purification treatment of the member after the heat treatment step for the first or second member such as a baking treatment step is performed by using the remaining heat of the member in the heat treatment step. It can be used for surface purification, and the surface purification treatment can be performed more efficiently.

  In the present invention described above, the provision of the heat shielding member between the getter processing chamber and the sealing processing chamber or between the bake processing chamber and the getter processing chamber greatly reduces the deterioration of the getter film due to heat. Can be reduced.

  In the present invention described above, the outer frame is fixed to the face plate or the rear plate by using the second sealing material having a high melting point, so that the first sealing material in the sealing processing chamber is used. It is possible to prevent displacement of the plate and the outer frame due to softening of the second sealing material at the sealing processing temperature.

According to the present invention, the above-described electron-emitting device or plasma generating device is provided in a large capacity such as 1 million pixels or more in the XY direction, and the large capacity pixel is provided on a large screen having a diagonal size of 30 inches or more. In manufacturing the device, the manufacturing process time could be greatly shortened, and at the same time, the vacuum container constituting the image display device could be achieved at a high vacuum of 10 ⁻⁶ Pa or more.

  FIG. 1A schematically shows a manufacturing apparatus according to the present invention, and FIG. 1B shows the temperature of the panel member of the image display device, that is, the first member or the second member described above. The temperature profile, FIG. 1C, is a vacuum profile showing the vacuum in the manufacturing apparatus. Hereinafter, based on these, an example of the manufacturing method and the manufacturing apparatus according to the present invention will be described.

  In FIG. 1A, reference numeral 101 denotes a rear plate (hereinafter referred to as RP) which is a panel member, and an electron source in which a plurality of electron-emitting devices are wired in a matrix is formed as phosphor excitation means. . Reference numeral 102 denotes a face plate (hereinafter referred to as FP) which is a panel member, on which a phosphor, a metal back, and the like are formed. Reference numeral 103 denotes an outer frame which is a panel member, which is disposed between the RP 101 and the FP 102 and constitutes a panel which is an airtight container together with the RP 101 and the FP 102. Reference numeral 104 denotes a spacer that maintains the distance between the RP 1010 and the FP 102. In this embodiment, the case where the outer frame 103 and the spacer 104 are arranged and fixed on the RP 101 in advance is illustrated.

  105 is a front chamber, 106 is a bake processing chamber, 107 is a surface purification processing chamber, 108 is a first getter processing chamber (chamber getter processing chamber), 109 is a second getter processing chamber (panel getter processing chamber), and 110 is Sealing processing chambers 111 are cooling chambers, which are sequentially connected in accordance with the transport direction (arrow 145 in the figure), and each is evacuated by a vacuum pump (not shown) to form a vacuum atmosphere.

  In the present embodiment, the surface purification processing chamber 107 is an electron beam irradiation processing chamber (hereinafter referred to as an EB irradiation processing chamber) provided with electron beam irradiation means. The atmosphere and each processing chamber are separated by gate valves 112, 113, 114, 115, 116, 117, 118, 119. The panel members RP101, FP102, outer frame 103, and spacer 104 are first gated. It is carried into the front chamber 105 by opening / closing the valve 112 and sequentially moves to the processing chamber by opening / closing each gate valve. Reference numeral 120 denotes a transport roller for moving the panel member to each processing chamber.

  Reference numerals 121, 123, 127, 132, and 136 denote hot plates for heating the RP 101 and the outer frame 103 and the spacer 104 fixed to the RP 101. On the other hand, 122, 124, 128, 133, 137 are hot plates for heating the FP 102.

  125 is an electron gun for EB irradiation in the EB irradiation processing chamber 107, and 126 is an electron beam irradiated from the electron gun 125. In the chamber getter processing chamber 108, reference numeral 129 denotes a chamber getter flash device, and reference numeral 130 denotes a chamber getter flash generated from the chamber getter flash device, which is obtained by instantaneously evaporating a material such as Ba. A chamber getter plate 131 is attached to the chamber getter flash 130 and performs an exhausting action as a chamber getter, that is, the degree of vacuum in the chamber getter processing chamber 108 can be increased.

  In the panel getter processing chamber 109, 134 is a panel getter flash device, 135 is a panel getter flash generated from the panel getter flash device 134, and is a material obtained by instantaneously evaporating a material such as Ba and is attached to the FP 102. Is done.

  Reference numerals 138, 139, 140, 141, and 142 denote elevators, which support hot plates 121, 123, 127, 132, and 136, respectively, and have a function of raising and lowering the RP 101 to a height required for each processing step.

  In FIG. 1B, the horizontal axis indicates the process in each processing chamber in the manufacturing apparatus of FIG. 1A, and the vertical axis indicates the temperature profile of the panel member in the process in each processing chamber. This temperature profile shows the temperature state of RP101 and FP102. Further, in FIG. 1C, the horizontal axis indicates the process in each processing chamber in the manufacturing apparatus of FIG. 1A, and the vertical axis indicates the vacuum profile in each processing chamber.

  The RP 101, the FP 102, the outer frame 103, and the spacer 104 sequentially pass through the processing chambers in the direction of the arrow 145 by driving of the transport roller 120 that is a transport means, and various processes are performed during the passage.

  In the present embodiment, first, in the vacuum atmosphere of the front chamber 105, the first member including the RP 101, the outer frame 103, and the spacer 104 in which the electron source is disposed, the phosphor, and the metal back are disposed. A second member made of FP102 is prepared, reaches a high vacuum by baking processing in the baking processing chamber 106, electron beam irradiation in the EB irradiation processing chamber 107, chamber getter processing in the chamber getter processing chamber 108, in the panel getter processing chamber 109 Each process of the getter flush to the panel by the panel getter processing, the heat sealing in the sealing processing chamber 110 and the cooling processing in the cooling chamber 111 is performed on one line in series.

  As described above, the gate valves 112, 113, 114, 115, 116, 117, 118, and 119 are arranged between the processing chambers of the manufacturing apparatus illustrated in FIG. It is evacuated by the illustrated evacuation system. In this embodiment, the gate valves 112, 113, 114, 115, 116, 117, 118, and 119 are arranged between the processing chambers. This gate valve arrangement is a vacuum profile shown in FIG. For example, the gate valves 116 and 117 between the chamber getter processing chamber 108, the panel getter processing chamber 109, and the sealing chamber 110 can be omitted. It is.

  When there is no gate valve between adjacent processing chambers as described above, and the temperature of the panel member in each processing step is different, the processing step is formed of a reflective metal such as aluminum, chromium, stainless steel, etc. It is preferable that a heat shielding member (plate shape, film shape, etc.) is disposed. The heat shielding member is provided between the processing chambers having different temperature profiles of the panel member illustrated in FIG. 1B, for example, somewhere between the baking processing chamber 106 and the panel getter processing chamber 109, or the panel. It is preferable to arrange between the getter processing chamber 109 and the sealing processing chamber 110 or both of them. Further, the heat shielding member may be disposed between the processing chambers. The heat shielding member is installed so as not to cause a failure when the FP 102 and the RP 101 placed thereon move between the processing chambers.

  In this embodiment, the outer frame 103 that seals the vacuum structure and the spacer 104 that forms the atmospheric pressure resistant structure are fixedly installed in advance on the RP 101 before being carried into the front chamber 105, but this is not a limitation. Absent. For example, the spacer 104 is fixed to the outer frame 103 in advance (for example, as a plate-like spacer 104 crossing the outer frame 103, and both ends thereof are fixed to the outer frame 103). Separately, it is put into this device, each processing step is performed, and finally it is arranged and fixed at a desired position as a constituent member of the panel in the sealing processing step. Also, the outer frame 103 is fixed and installed on the FP 102 side in advance. It may be something to keep.

  In addition, when the outer frame 103 is fixed and installed in advance on the RP 101 side or the FP 102 side, it is preferable to fix the outer frame 103 using a sealing material having a higher melting point than a sealing material 143 described later. For example, if the sealing material 143 described later is a low melting point metal such as indium or an alloy thereof, it is preferable to fix the outer frame 103 to the RP 101 or FP 102 in advance using frit glass.

  In FIG. 1A, reference numeral 143 denotes a sealing material as described above, and a low melting point material such as frit glass, a low melting point metal such as indium, or an alloy thereof in advance at the end of the outer frame 103 arranged on the RP 101 on the FP 102 side. Can be provided. The arrangement of the sealing material 143 is not limited to this, and the sealing material 143 may be arranged on a portion on the FP 102 to which the outer frame 103 is contact-fixed. Furthermore, when the outer frame 103 is independently inserted into the apparatus as a single component member, the sealing material 143 may be provided on the RP101 side end and the FP102 side end of the outer frame 103. Further, the sealing material 143 may be disposed on a portion on the RP 101 and the FP 102 to which the outer frame 103 is fixed in contact. The portion for providing the sealing material 143 may be provided in at least one of the end portion of the outer frame 103 and the portion on the RP 101 and the FP 102 to which the end portion of the outer frame 103 is fixed in contact.

  In the apparatus configured as described above, the process of evacuating and sealing the panel will be described below. In addition, although the following process is a case where the case where one panel is sealed is shown, when processing and sealing a plurality of panels continuously, the processing time of each processing process is different. In order to adjust a process with a long processing time to another processing process time, the processing process is divided into a plurality of processing chambers, or the components for processing in the same processing chamber are, for example, hot This is possible by arranging a plurality of plates and performing processing simultaneously.

  First, the outer frame 103 and the spacer 104 are fixed in advance, and the RP 101 in which the sealing material 143 is also arranged in advance and the FP 102 are carried into the front chamber 105. Here, the outer frame 103 and the spacer 104 are fixed to the RP 101 using frit glass, and indium is used as the sealing material 143. When carrying in, the above-mentioned RP101 and FP102 are arranged on a transfer jig so that a gap is formed between both substrates due to the structure. Note that the carrying-in and transport are not limited to using a jig, and it is also possible to transport the substrates of RP101 and FP102 as they are by the support transport unit on the apparatus main body side.

  When the carry-in is completed, the gate valve 112 which is a carry-in port is shielded, and the inside of the front chamber 105 is evacuated. During this time, the processing chambers after the baking processing chamber 106 are set to the respective vacuum degrees and temperature profiles. Thereafter, when the substrates of the RP 101 and the FP 102 are transferred, the gate valves 113 to 119 between the corresponding processing chambers are sequentially opened and closed.

When the front chamber 105 reaches the vacuum exhaust state of the order of 10 ⁻⁵ Pa, the gate valve 113 is opened, the RP 101 and the FP 102 are unloaded from the front chamber 105 and moved to the bake processing chamber 106. The gate valve 113 is shut off.

The RP 101 and the FP 102 that have been moved to the bake processing chamber 106 without being exposed to the atmosphere are subjected to heat treatment (bake processing) of the hot plates 121 and 122 in the bake processing chamber 106. By this baking treatment, impurities such as hydrogen, oxygen, and water contained and adsorbed in RP101 and FP102 can be discharged. The baking temperature at this time is generally 300 ° C to 400 ° C, preferably 350 ° C to 380 ° C. The degree of vacuum at this time is about 10 ⁻⁴ Pa.

The RP 101 and the FP 102 that have finished the baking process are moved to the EB irradiation processing chamber 107, the RP 101 is fixed to the hot plate 123, and moved to the upper part of the EB irradiation processing chamber 107 by the elevator 139. During this time, the RP 101 and the FP 102 are temporarily separated from the hot plates 121 and 122 of the bake processing chamber 106 as a heating source. However, the hot plates 123 and FP of the EB irradiation processing chamber 107 are prevented from causing a sudden temperature drop. The temperature is gently lowered by fixing to 124 and heating. In the substrate temperature range in this temperature-decreasing state, the EB 126 is emitted from the electron gun 125 to an arbitrary region, and EB irradiation processing is performed. The EB irradiation treatment is generally performed in a substrate temperature range from 100 ° C. to the baking temperature. The degree of vacuum at this time is about 10 ⁻⁴ Pa to 10 ⁻⁵ Pa. Here, the surface purification treatment chamber of the panel member such as the EB irradiation treatment chamber 107 is preferably set to be in a vacuum state of 10 ⁻⁴ Pa or less, more preferably 10 ⁻⁵ Pa or less.

  The EB irradiation treatment has an effect such as substrate cleaning by desorption of adsorbed impurities by irradiation of the RP 101 and the FP 102. Further, as described above, at this time, the cleaning effect is further improved because the residual heat in the baking process can be used. Further, the EB irradiation may be performed by both RP101 and FP102 or only one of them.

  Further, the EB irradiation is not limited to the RP 101 and the FP 102, and any region in the EB irradiation process chamber may be irradiated. In the EB irradiation process, in addition to the substrate cleaning, the chamber space is irradiated with EB to ionize the gas desorbed by baking and EB irradiation substrate cleaning. There is also an effect which can accelerate adsorption.

  In addition, the EB irradiation processing chamber 107 described above, or the EB irradiation processing chamber 107 and a first getter processing chamber 108 (chamber getter processing chamber) to be described later, lower the temperature of the RP 101 and the FP 102 that have finished the baking processing. Although it also functions as a cooling rejection processing chamber, providing a cooling processing chamber separately between the bake processing chamber 106 and the EB irradiation processing chamber 107 is also a preferred form.

In such a cooling processing chamber, the RP 101 and the FP 102 are each fixed to a hot plate so that the temperature is gently lowered so as not to cause a rapid temperature drop from the heating temperature during the baking process. The temperature range of the hot plate at this time is set in a range from 100 ° C. to the baking temperature, and the vacuum state in the processing chamber is set to 10 ⁻⁴ Pa or less, more preferably 10 ⁻⁵ Pa or less.

After the EB irradiation processing is completed, the elevator 139 is lowered, and then the RP 101 is removed from the hot plate 123 and moved to the chamber getter processing chamber 108 together with the FP 102. At this time, the RP 101 and the FP 102 are moved to the chamber getter processing chamber 108 without being exposed to the atmosphere. The vacuum state in the chamber getter processing chamber 108 is set to 10 ⁻⁵ Pa or less. In this chamber getter processing chamber, an evaporation type getter material (for example, a getter material such as barium) incorporated in the chamber getter flash device 129 is heated and evaporated by a method such as resistance heating to generate a chamber getter flash 130, A getter film (not shown) made of a barium film or the like is deposited on the surface of a chamber getter plate 131 disposed in a chamber other than the panel member. The film thickness of the panel getter at this time is generally 5 nm to 500 nm, preferably 10 nm to 200 nm, and more preferably 20 nm to 200 nm. By this chamber getter processing step, the getter film deposited on the chamber getter plate 131 adsorbs and exhausts the gas in the chamber, and the degree of vacuum in the chamber getter processing chamber reaches the 10 ⁻⁶ Pa level. The substrate temperature of the RP 101 and the FP 102 is processed in a temperature range from the baking temperature to 100 ° C. Since the getter material evaporates due to the chamber getter flash 130, the degree of vacuum in the chamber temporarily decreases, but the vacuum shifts to a high vacuum. The chamber getter process described above is not limited to the chamber getter process chamber provided independently as in the present embodiment, but is performed in the panel getter process chamber described below without any chamber getter process chamber. May be used.

Next, the RP 101 and the FP 102 are moved to the panel getter processing chamber 109, the RP 101 is fixed to the hot plate 132, and is moved to the upper part of the panel getter processing chamber 109 by the elevator 141. The panel getter processing chamber is evacuated to a level of 10 ⁻⁶ Pa in advance. In order to reach this degree of vacuum, in addition to a general vacuum exhaust pump, auxiliary exhaust means such as exhaust by flashing of the evaporative getter material, exhaust by heat activation of the non-evaporable getter material, etc. can be used. it can. The above-described vacuum exhaust method on the 10 ⁻⁶ Pa level can also be used for the sealing processing chamber 110 and the cooling processing chamber 111 described below.

In the panel getter processing chamber 109, the evaporation getter material (for example, getter material such as barium) incorporated in the panel getter flash device 134 is heated and evaporated by a method such as resistance heating to generate the panel getter flash 135, and the FP A getter film (not shown) made of a barium film or the like is deposited on the surface of the film. The film thickness of the panel getter at this time is generally 5 nm to 500 nm, preferably 10 nm to 200 nm, and more preferably 20 nm to 200 nm. The evaporation type getter formed here is less deteriorated due to gas adsorption because the chamber of the processing step is a high vacuum of 10 ⁻⁶ Pa, and the next sealing is performed while maintaining the getter vacuum exhaust capability sufficiently. Moved to processing step.

  In FIG. 1A, a getter film is deposited and formed on the FP 102. However, the member to be formed is not limited to this, and can be formed on the RP 101 or the like. However, since the getter material is generally conductive, problems such as the generation of a large leakage current during the image display driving of the sealed panel and the inability to maintain the withstand voltage of the driving voltage may occur. For example, when a panel getter flash is performed on the RP 101 in FIG. 1A, a conductive getter film is also formed on the outer frame 103 and the spacer 104, which may cause electrical problems during driving. is there. In such a case, the portion where the getter film should not be deposited is covered with a metal thin film deposition mask, and the getter film is formed only on the necessary portion of the RP 101 while preventing the getter film from being deposited. Can be made into a membrane. Since the getter material evaporates due to the panel getter flash, the degree of vacuum in the chamber temporarily decreases, but the vacuum shifts to a high vacuum.

  After the panel getter processing step is completed, the elevator 141 is lowered, and then the RP 101 is removed from the hot plate 132 and moved to the sealing processing chamber 108 together with the FP 102.

The RP 101 and FP 102 are moved to the sealing processing chamber 110 evacuated to 10 ⁻⁶ Pa in advance, and the RP 101 and FP 102 are fixed to the hot plates 136 and 137, respectively. At this time, the sealing material 143 and the spacer 104 on the frame 103 arranged and fixed to the RP 101 do not contact the FP 102 and are fixed with a slight gap. At the time of fixing, the relative position of the RP 101 and the FP 102 when sealing the panel is determined. The relative position can be determined on the basis of the end face by the abutment pin, but is not limited to this.

After that, the elevator 142 is lowered, and the outer frame 103 arranged and fixed on the RP 101 is brought into contact with and pressed against the FP 102, and the substrate is made of the material of the sealing material 143 as shown in the temperature profile of FIG. The sealing material is raised to a suitable sealing temperature, and the sealing material 143 is softened or dissolved and then held at the peak temperature for 10 minutes. Thereafter, the substrate temperature is lowered to fix the sealing material. As a result, the sealing material 143 formed on the outer frame 103 is softened and dissolved to bond the outer frame 103 and the FP 102, and then the sealing material 143 is cured and fixed. At this time, the degree of vacuum in the sealing treatment chamber 110 is maintained at 10 ⁻⁶ Pa, and the inside of the panel sealed in this step also has a degree of vacuum of 10 ⁻⁶ Pa. For example, if the adhesive fixing temperature of the sealing material 143 is indium metal, the heating peak temperature is set to 160 ° C., and the curing fixing temperature is set to 140 ° C. When the sealing material 143 is frit glass, the peak temperature is 390 ° C. and the curing and fixing temperature is 300 ° C. The heating rate is 20 ° C./min and the cooling rate is 5 ° C./min, but this is not restrictive. Further, the heating peak temperature and the curing fixing temperature are not limited to the above.

When the temperature falls below the curing fixing temperature of the sealing material, the sealing process is completed, and thereafter, the RP 101 part is removed from the hot plate 136 and the elevator 142 is raised. The FP 102 part is removed from the hot plate 137, and the sealing panel 144 composed of the RP 101, the FP 102 outer frame 103, and the spacer 104 is moved to the cooling processing chamber 111. At this time, the cooling processing chamber 111 is evacuated to a level of 10 ⁻⁶ Pa in order to maintain the degree of vacuum of the sealing processing chamber. The sealing panel 144 is removed from the hot plate at the curing and fixing temperature of the sealing material, and cooled in the cooling processing chamber 111. As the cooling means, a cooling plate or the like having a temperature control function by water cooling is used. However, the cooling means is not limited to this, and if the substrate is not damaged due to a rapid temperature drop of the sealing panel 144, the cooling processing chamber 111 has a Natural cooling may be performed.

  When the temperature of the sealing panel 144 drops to room temperature or a temperature close to room temperature, a vacuum leak of the cooling processing chamber 111 is performed to bring the processing chamber to atmospheric pressure. Thereafter, the gate valve 119 on the atmosphere side outside the apparatus is opened, and the sealing panel 144 is carried out of the apparatus.

  The manufacturing apparatus of this embodiment is provided with a gate valve 118 between the sealing processing chamber 110 and the cooling chamber 111, and when the gate valve is opened, the display panel is unloaded from the sealing processing chamber 110 to cool the cooling chamber. After carrying in to 111, the gate valve is shielded, and after cooling, the carry-out port 119 is opened, the display panel is carried out from the cooling chamber 111, and finally the carry-out port 119 is shielded to complete the whole process. . In addition, before starting the next step, it is preferable to set a vacuum state by an evacuation system (not shown) in which the inside of the cooling chamber 111 is independently arranged.

  In the present embodiment, a non-evaporable getter film or a non-evaporable getter member made of a titanium material or the like may be provided in advance on the RP 101 or RP 102 in addition to the above-described evaporable getter material.

  The hot plates 121, 123, 127, 132, and 136 described above are equipment that can be fixed with sufficient force without dropping the FP 101, for example, a chuck method using a claw that mechanically grabs the periphery of the substrate, Equipment utilizing a chuck method or vacuum chucking method can be used.

Although the above example is an example of a process combination, a configuration example of a processing chamber can be given by a combination of each processing process. That is, in particular, in the process from baking to sealing,
As a first modification, after preparing the front chamber 105 in a vacuum atmosphere, the steps are performed in the order of baking in the baking chamber 106, panel getter processing in the panel getter processing chamber 109, and heat sealing in the sealing chamber 110. An example is given in which the processing chambers are connected in series so as to proceed.

  As a second modified example, after preparation of the front chamber 105 in a vacuum atmosphere, surface cleaning processing such as baking processing in the baking processing chamber 106, EB irradiation processing in the EB irradiation processing chamber 107, and the like in the panel getter processing chamber 109 An example in which the respective processing chambers are arranged in series so as to proceed in the order of panel getter processing and heat sealing in the sealing processing chamber 110 is given.

  As a third modified example, after preparation in a vacuum atmosphere in the front chamber 105, baking processing in the baking processing chamber 106, chamber getter processing in the chamber getter processing chamber 108, panel getter processing in the panel getter processing chamber 109, sealing An example in which the processing chambers are arranged in series so as to proceed in the order of heat sealing in the deposition processing chamber 110 is given.

  As a fourth modified example, after preparation of the front chamber 105 in a vacuum atmosphere, surface purification processing such as EB irradiation processing in the EB irradiation processing chamber 107, chamber getter processing in the chamber getter processing chamber 108, panel getter processing chamber An example is given in which the rooms are connected in series so that the process proceeds in the order of panel getter processing at 109 and heat sealing in the sealing processing chamber 110.

  As a fifth modification, after preparation in the vacuum chamber in the front chamber 105, baking processing in the baking processing chamber 106, cooling processing of the panel member in the cooling processing chamber, panel getter processing in the panel getter processing chamber 109, sealing An example in which the processing chambers are arranged in series so as to proceed in the order of heat sealing in the deposition processing chamber 110 is given.

  As a sixth modified example, after preparation of the front chamber 105 in a vacuum atmosphere, baking processing in the baking processing chamber 106, cooling processing of the panel member in the cooling processing chamber, EB irradiation processing in the EB irradiation processing chamber 107, etc. An example in which the processing chambers are arranged in series so as to proceed in the order of surface purification processing, panel getter processing in the panel getter processing chamber 109, and heat sealing in the sealing processing chamber 110 is given.

  As a seventh modified example, after preparation of the front chamber 105 in a vacuum atmosphere, baking processing in the baking processing chamber 106, cooling processing of the panel member in the cooling processing chamber, chamber getter processing in the chamber getter processing chamber 108, panel An example in which the processing chambers are arranged in series so as to proceed in the order of panel getter processing in the getter processing chamber 109 and heat sealing in the sealing processing chamber 110 is given.

  As an eighth modified example, after preparation of the front chamber 105 in a vacuum atmosphere, baking processing in the baking processing chamber 106, cooling processing of the panel member in the cooling processing chamber, EB irradiation processing in the EB irradiation processing chamber 107, etc. An example in which the processing chambers are arranged in series so as to proceed in the order of surface purification processing, chamber getter processing in the chamber getter processing chamber 108, panel getter processing in the panel getter processing chamber 109, and heat sealing in the sealing processing chamber 110 is given. .

Next, as a modified example of conveyance and device introduction of the constituent members RP101, FP102, outer frame 103, spacer 104,
As a first modified example, it is also possible to put in the apparatus as three constituent members of the RP 101, the FP 102, and the spacer 104 fixedly arranged on the outer frame 103. In this case, since the sealing surface of the outer frame 103 by the sealing process in the apparatus is the both surfaces of the RP 101 and the FP 102, a sealing material may be formed in advance on each sealing surface. is necessary.

  As a second modification, the outer frame 103 that is bonded and fixed to the RP 101 and the FP 102 or the outer frame 103 that is bonded and fixed to the RP 101 and the FP 102 and the two constituent members of the spacer 104 may be thrown into the apparatus. it can. In this case, since the sealing surface of the outer frame 103 by the sealing process in the apparatus is the side surface of the RP 101, it is necessary to form a sealing material on the sealing surface in advance.

Next, with respect to the above-described modification of the constituent members, the processing chambers of the apparatus are individually arranged in a line for each constituent member, and all the constituent members are joined into one processing chamber in the sealing process. As a modification of the device configuration in which the sealing process is performed,
As a first modified example, as a spacer 104 fixedly disposed on the RP 101, the FP 102, and the outer frame 103, and three components, each processing chamber from the front chamber 105 to the panel getter rush processing chamber 109 is arranged in three lines, The above three constituent members are put into each apparatus separately, and the three panel getter processing chambers are connected so as to merge into one sealing processing chamber, and the three constituent members are sealed in the sealing processing chamber. An apparatus configuration that performs a landing process and a cooling process can be given.

  As a second modified example, the outer frame 103 bonded and fixed to the FP 102 and the RP 101, the two structural members of the outer frame 103 and the spacer 104 bonded and fixed to the FP 102 and the RP 101, or bonded to the RP 101 and the FP 102 are used. As two constituent members of the outer frame 103 fixedly arranged or the outer frame 103 bonded and fixedly arranged on the RP 101 and the FP 102 and the spacer 104, each processing chamber from the front chamber 105 to the panel getter rush processing chamber 109 has two lines. The above-mentioned two components are put into the apparatus separately, and the two panel getter processing chambers are connected so as to merge into one sealing processing chamber. In the sealing processing chamber, the three components are sealed. An apparatus configuration that performs a landing process and a cooling process can be given. In the first and second modified examples described above, the getter process includes a case where it is sufficient to perform any one of three or two constituent members.

Further, in the description of the above-described embodiment, the degree of vacuum at the time of sealing the panel is set to 10 ⁻⁶ Pa level, but the present invention is not limited to this value. That is, the degree of vacuum at the time of sealing the panel can be set to a level of 10 ⁻⁵ Pa that can be reached by a general vacuum pump. In this case, it is possible to omit the chamber getter processing chamber 140 and the getter processing step performed to increase the ultimate vacuum in the processing chamber. In addition, vacuum evacuation by an auxiliary getter pump for reaching 10 ⁻⁶ Pa can be omitted.

  The sealing panel 144 subjected to the above processing steps is an evaporation type getter that has existed in a conventional sealing panel even though an evaporation type getter material such as Ba is formed on, for example, an FP. There is a structural feature in that gettering which is a material evaporation source mainly performing getter flashing by high-frequency heating and getter flashing mainly by resistance heating does not remain in the sealing panel.

  Further, the above processing steps and apparatus are characterized in that they are constituted by a processing chamber having a sealing process different from the panel getter flash processing step.

  FIG. 2 is a cross-sectional view showing a part of an image display device created by using the manufacturing apparatus and manufacturing method of the present embodiment.

  In the figure, the same reference numerals as those in FIG. 1 denote the same members. In the image display device created by the above apparatus and method, a vacuum container or a decompression container is formed by the RP 101, the FP 102, and the outer frame 103. The decompression vessel may contain an inert gas such as argon gas or neon gas or hydrogen gas under reduced pressure.

In the case of a vacuum vessel, a high vacuum of 10 ⁻⁵ Pa or higher, preferably 10 ⁻⁶ Pa or higher can be set.

  A spacer 104 is disposed in the vacuum vessel or the decompression vessel to form an atmospheric pressure resistant structure. The spacers 104 used in the present invention are provided on both ends of a main body 311 made of an alkali-free insulating material such as alkali-free glass, a high resistance film 309 formed of a high resistance material arranged so as to cover the surface of the main body 311, and the like. And metal (tungsten, copper, silver, gold, molybdenum, and alloys thereof) films 308 and 310 are electrically connected and bonded onto the wiring 306 via a conductive adhesive 308. When the spacer 104 is carried into the front chamber 105, it is bonded and fixed to the RP 101 with an adhesive 308 in advance, and when the processing is completed in the sealing processing chamber 110, the other end of the spacer 104 and the FP 102 are fixed. Are arranged in contact with each other.

The RP 101 includes a transparent substrate 304 such as glass, a base film (SiO ₂ , SnO _2, etc.) 305 for preventing entry of alkali such as sodium, and a plurality of electron beam emitters 312 arranged in an XY matrix. ing. The wiring 306 constitutes one cathode side wiring of the cathode side XY matrix wiring connected to the electron beam emitting element.

  In the present invention, a plasma generating element can be used instead of the electron beam emitting element 312 used as the phosphor excitation means or the image display element member. At this time, an inert gas such as argon gas or neon gas or hydrogen gas is contained in the container under reduced pressure.

  The FP 102 includes a transparent substrate 301 such as glass, a phosphor layer 302, and an anode metal (aluminum, silver, copper, etc.) film 303 connected to an anode source (not shown).

  In the present invention, when the plasma generating element is used, a color filter can be used instead of the phosphor used as the image display member.

  The envelope 113 is bonded and fixed to the RP 101 in advance with a low-melting-point adhesive 307 such as frit glass before being carried into the front chamber 105, and in the processing step in the sealing processing chamber 110, indium and frit are used. It is fixed and bonded by a sealing material 143 using glass.

It is the figure which showed typically the manufacturing apparatus which concerns on this invention with the temperature profile of the panel member in a manufacturing apparatus, and the vacuum degree profile between each chamber in a manufacturing apparatus. It is sectional drawing which shows a part of image display apparatus produced using the manufacturing apparatus and manufacturing method of this invention.

Explanation of symbols

101 Rear plate (RP)
102 Face plate (FP)
103 outer frame 104 spacer 105 front chamber 106 bake processing chamber 107 surface purification processing chamber (EB irradiation processing chamber)
108 First getter processing chamber (chamber getter processing chamber)
109 Second getter processing chamber (panel getter processing chamber)
110 Sealing processing chamber 111 Cooling chamber 112 to 119 Gate valve 120 Transport roller 121, 123, 127, 132, 136 Hot plate (for RP)
122, 124, 128, 133, 137 Hot plate (for FP)
125 Electron gun 126 Electron beam (EB)
129 Chamber Getter Flash Device 130 Chamber Getter Flash 131 Chamber Getter Plate 134 Panel Getter Flash Device 135 Panel Getter Flash 138-142 Elevator 143 Sealing Material 144 Sealed Panel 145 Arrow indicating Transport Direction 301 Transparent Substrate 302 Phosphor Layer 303 Anode Metal Film 304 Transparent substrate 305 Base film 306 Wiring 307 Low melting point adhesive 308 Metal film 309 High resistance film 310 Metal film 311 Main body 312 Electron emitting device

Claims (2)

In the manufacturing method of the image display device,
a: carrying the first member including the substrate on which the phosphor excitation means is disposed and the second member including the substrate on which the phosphor is disposed into a bake chamber in a vacuum atmosphere and heating and baking the member;
b: One or both of the first member and the second member are carried into a surface purification treatment chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the carried-in members or both carried-in members A surface purification treatment of one or both of
c: One or both of the first member and the second member are loaded into a getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the loaded members or both of the loaded members is loaded A step of gettering one or both;
d: carrying the first member and the second member into a sealing treatment chamber in a vacuum atmosphere in a vacuum atmosphere, and heating and sealing;
I have a,
In the method of manufacturing an image display device, the temperature of the member to be gettered is lower than the heating temperature in the step a . In the manufacturing method of the image display device,
a: carrying the first member including the substrate on which the phosphor excitation means is disposed and the second member including the substrate on which the phosphor is disposed into a bake chamber in a vacuum atmosphere and heating and baking the member;
b: One or both of the first member and the second member are carried into a surface purification treatment chamber in a vacuum atmosphere under a vacuum atmosphere, and one of the carried-in members or both carried-in members A surface purification treatment of one or both of
c: One or both of the first member and the second member are carried into a first getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and getter processing is performed in the first getter processing chamber. A process of performing;
d: One or both of the first member and the second member are loaded into a second getter processing chamber in a vacuum atmosphere under a vacuum atmosphere, and the loaded one member or both loaded members Gettering one or both of:
e: carrying the first member and the second member into a sealing treatment chamber in a vacuum atmosphere in a vacuum atmosphere, and heating and sealing;
I have a,
The method d is a method for manufacturing an image display device , wherein the temperature of the member to be gettered is lower than the heating temperature in the step a .

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