JP2003057560A - Main-body part of sample temperature controller - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a new main-body part of a sample temperature controller which can prevent heat generated by a heating means such as a conductive film and the heat of a heated top plate from being transferred to a frame more effectively and nearly eliminates the need to increase the thickness of the main- body part for that. SOLUTION: A plate unit 11 is constituted by sticking together the top plate 13 where an observed sample is mounted and a heating plate coated with a conductive film 17 for heat generation. A heat-insulating recessed part 5b is formed on the top surface of the bottom wall 5 of the frame almost over the entire circumference of a light transmission hole 5a, the plate unit 11 is stored in the frame 3 while covering the top surface of the heat-insulating recessed part 5b, and a vacuum is produced in the heat-insulating recessed part 5b in the state. Consequently, the heat which is generated by the conductive film 17 is more effectively prevented from being transferred to the frame 3 and the heat-insulation effect by the vacuum does not have large relation to the thickness of the vacuum layer, so the frame 3 need not be made thick.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a main body of a sample temperature control device. Specifically, a main body of a sample temperature controller including a top plate on which an observation sample is placed, a heating unit for heating the top plate, for example, a conductive film, and a frame holding the top plate in a storage state. It is about.

[0002]

2. Description of the Related Art For example, in quality control and characteristic tests in the fields of medicine and biotechnology, or in the field of industry, it is rare to observe a desired sample under a microscope while keeping it at an optimum temperature. Absent. A sample temperature management device is an apparatus for managing the temperature of a sample for such a purpose. In this sample temperature control device, as a means for heating or cooling the sample, a method of circulating a temperature-controlled fluid around the sample was previously used, but today, in general, a conductive material is used. In many cases, the film is used as a heating element or the Peltier element is used as both heating / cooling means, thereby realizing the thinning of the main body mounted on the stage of the microscope.

FIG. 11 shows examples a and a'of the main body in a conventional sample temperature control device using a conductive film as a heating means. In these main body portions a and a ', reference numeral b denotes a flat dish-shaped frame made of synthetic resin, and a horizontal outer flange c is projected from the upper portion of the outer peripheral wall thereof, and a transparent hole e is provided at the center of the bottom wall d. Are formed. In this frame b, a transparent top plate f and a transparent protection plate g which is superposed on the transparent top plate f from below are housed in a state of being bonded to each other. A transparent conductive film (not shown) serving as a heating element is provided on the entire upper surface of the protective plate g, and the conductive film generates heat when energized, and the heat heats the protective plate g and the top plate f. .

The main body parts a and a'are mounted on the microscope by accommodating the outer flange c in the tool fitting recess j formed on the stage i of the microscope, and the sample k for observation is the top plate f. The sample k to be observed is placed directly on the sample mounting surface which is the upper surface of the plate or on the slide glass m and placed on the sample mounting surface to heat the sample k to be observed right above the light transmitting hole d. After moving, it is viewed through the objective lens o.

[0005]

The conductive film for heat generation has the advantage of being excellent in response to the supplied current, but
Since the thickness is only about several tens of microns and the heat capacity is very small, a temperature difference easily occurs between a place where the protection plate g is in contact with or close to another object and a place where it is not. That is, in the main body a shown in FIG.
The protective plate g on which the conductive film is formed is not in contact with the frame b in the central portion thereof, but the region near the outer periphery is in direct contact with the bottom wall d of the frame b, and therefore in this contacting portion. , The heat of the conductive film is easily frame b
Because I will escape to. As a result, the temperature of the central region of the top plate f differs from that of the other region by 2 to 3 ° C., and the temperature of the sample k placed on the top plate f varies depending on the position on the top plate. Become.

Further, a plate-shaped stage fitting portion may be attached to the lower surface of the bottom wall d depending on the form of the stage of the microscope, but in this case, the above-mentioned temperature difference becomes more remarkable. The cause of this is not necessarily clear, but it is also a cause that the heat capacity of the bottom wall d is increased as a result of the mounting of the stage fitting portion, and the heat of the conductive film is more likely to escape there. Conceivable.

Therefore, conventionally, in this type of main body, a heat insulating sheet h is provided between the bottom wall d of the frame b and the protective plate g, as in the main body a'shown in FIG. Then, some measures have been taken to prevent the heat of the protective plate g from escaping to the frame b. However, the heat insulating effect is still insufficient with such measures, and the manufacturing cost is increased due to the presence of the heat insulating sheet h, and the thicker the sheet h in order to enhance the heat insulating effect, the more the main body part a.
Will be significantly thickened, and this will hinder focusing with a microscope.

The present invention has been made in view of the above-mentioned conventional problems, and it is better that the heat generated in the heating means such as the conductive film or the heat of the top plate heated thereby is transmitted to the frame. It is an object of the present invention to provide a new main body part of a sample temperature control device that can be effectively cut off and that requires almost no increase in the thickness of the main body part.

[0009]

In order to achieve this object, the main body of the sample temperature control device according to claim 1 is provided with a top plate on which an observation sample is placed and for heating the top plate. In the main body of the sample temperature control device including the thin-film heating means and the frame holding the top plate, the heat generated in the heating means or the heat of the top plate heated by the heat is transmitted to the frame. It is characterized by the provision of a substantially vacuum heat insulating space for stopping the operation.

Since there is no substance in a vacuum space,
The heat transmission is completely cut off between the members facing each other across the vacuum space, and the heat insulating effect is not influenced by the thickness of the vacuum space. Therefore, according to the present invention, the heat generated in the heating means and the heat of the top plate heated thereby can be more effectively prevented from propagating to the frame, as compared with the heat insulating means using a member such as a heat insulating sheet. You can
Moreover, for that reason, it is almost unnecessary to increase the thickness of the main body.

In carrying out the present invention, a known conductive film or the like may be used as the heating means, but as a specific mode for providing the heat insulating space, a plate unit including the heating means and the top plate and a frame are mainly used. There may be a mode in which a heat insulating space is provided between the plate units and a mode in which a heat insulating space is provided in the plate unit. Of these, as the former form, the configurations described in claims 2 and 3 are most rational, and as the latter form, the structure described in claim 4 is most reasonable.

That is, the main body of the specimen temperature control device according to claim 2 is a top plate on which an observation sample is placed, and a heat-generating conductive film coated on the top plate or another plate superposed on the top plate. A main body of a sample temperature control device comprising a plate unit having a plate unit and a frame having an open top surface and a light transmitting hole provided in the bottom wall and holding the plate unit in a storage state. The invention is characterized in that a heat insulating recess is provided, the upper surface of the heat insulating recess is closed by the plate unit, and the heat insulating recess in this state is substantially evacuated.

Further, the main body of the sample temperature control device according to a third aspect of the present invention comprises a top plate on which an observation sample is placed, and a heat-generating conductive film coated on the top plate or another plate superposed on the top plate. A sample including a plate unit having an opening, a frame having an opening on the upper surface and a light transmitting hole on the bottom wall for holding the plate unit in a storage state, and a stage fitting portion attached to the bottom surface of the bottom wall of the frame. In the main body of the temperature controller, a heat insulating recess is provided on the upper surface of the bottom wall of the frame, the upper surface of the heat insulating recess is closed by the plate unit, and the heat insulating recess in this state is made to be substantially vacuum. is there.

Therefore, in the main body of these sample temperature controllers, the plate unit including the heat generating conductive film is seated on the bottom wall of the frame with the vacuum heat insulating recess interposed therebetween. In the region in contact with the heat insulating concave portion, the heat generated in the heat generating conductive film can be almost certainly prevented from being transferred to the bottom wall and the stage fitting portion. As a result, the temperature unevenness of the top plate caused by the heat of the top plate and the conductive film escaping to the frame can be considerably reduced. Moreover, the heat insulation effect of the vacuum is
Since the thickness of the vacuum layer does not depend on the thickness, the depth of the heat insulating recess of about 1 mm is sufficient. Therefore, it is not necessary to increase the thickness of the bottom wall of the frame in order to provide the heat insulating recess.

The main body of the sample temperature controller according to claim 4 faces the top plate on which the observation sample is placed, the heat-generating conductive film coated on the lower surface of the top plate, and the top plate from below. A main body of a sample temperature control device comprising a plate unit having a protective plate and a frame having a bottom wall provided with a light-transmitting hole and holding the plate unit in a storage state, wherein the top plate and the protective plate are provided. It is characterized in that a substantially vacuum insulation space is provided between the two.

In the main body of the sample temperature control device, since there is a vacuum heat insulating space between the top plate coated with the heat-generating conductive film and the protective plate, the heat generated in the conductive film causes the heat generated in the protective plate and the protective plate. It will almost certainly be prevented from propagating to the bottom wall or the like of the seated frame, and thus the temperature of the top plate can be kept substantially uniform over the entire surface. Even in the main body portion, the thickness of the heat insulating space of about 1 mm is sufficient, and therefore the thickness of the main body portion hardly increases due to the heat insulating space.

In the body portion of claim 4, since the atmospheric pressure applied to the top plate acts to warp the top plate toward the protection plate side, it is desirable that the top plate and the protection plate are connected to each other. A warp prevention spacer may be provided at or near the central portion between.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The main body of a sample temperature controller according to the present invention will be described below with reference to the respective embodiments shown in the drawings. [1. First Embodiment] (FIGS. 1 to 4) FIGS. 1 to 4 show a main body 1 of a sample temperature management device according to a first embodiment.

[A. Shape of Each Member, etc.] The main body 1 is composed of a frame 3 made of synthetic resin, a plate unit 11 held in the frame 3 in a housed state, and the like. The frame 3 includes a disc-shaped bottom wall 5 as shown in FIG.
The short peripheral wall 7 extending endlessly along the outer peripheral edge of the upper surface is integrally formed to form a circular shallow dish shape with the entire upper surface opened.

The bottom wall 5 is formed with a relatively large light transmitting hole 5a having a circular shape at the center thereof, and the light transmitting hole 5 is formed.
An adiabatic recess 5b is formed so as to surround a, and the adiabatic recess 5b is formed on the entire upper surface of the bottom wall 5 except the portion along the light transmitting hole 5a and the portion along the peripheral wall 7. Therefore, the heat insulating recess 5b has a wide annular shape and is provided on most of the upper surface of the bottom wall 5. As a result, the portion of the bottom wall 5 where the heat insulating recess 5b is not formed, that is, the light transmitting hole 5a. The portion along the circumference and the portion along the peripheral wall 7 are left as annular step portions 5c and 5d, respectively.

A wiring groove 5f is formed in a part of the step portion 5d along the peripheral wall 7, and a cord through hole 7a penetrating in a horizontal direction is formed in the peripheral wall 7 and one end of the cord through hole 7a is formed. Has an opening in the wiring groove 5f. A small plug fitting hole 5 is formed in a portion of the bottom wall 5 where the heat insulating recess 5b is formed.
e is formed, and the plug fitting hole 5e is hermetically closed by a plug 9 made of an elastic material such as rubber. This stopper 9
A hemispherical recess 9a (see FIG. 4) is formed in the center of the bottom surface of the.

The plate unit 11 includes a top plate 13 on which an observation sample is placed, a heating plate 15, and a transparent conductive film 17 for heat generation coated on the heating plate 15 (indicated by a sand pattern in FIG. 3). And a pair of positive and negative electrodes 19 adhered to the transparent conductive film 17, a light shielding paper 21 (see FIG. 3), and the like.

Top plate 13 and heating plate 15
Are made of hard, colorless and transparent glass and have a disk shape with a thickness of about 1 mm to 0.4 mm. The outer diameter of the top plate 13 is slightly smaller than the inner diameter of the peripheral wall 7 of the frame 3, and the outer diameter of the heating plate 15 is slightly smaller than the outer diameter of the top plate 13. The transparent conductive film 17 is provided on the entire upper surface of the heating plate 15. The transparent conductive film 17 is an ITO film having a thickness of about 300 to 800 ohms, and has a film thickness of about 30 by a sputtering method using a SiO2-indium alloy or the like as a base material and various vapor phase methods such as a vacuum deposition method. It is formed in the order of microns.

The pair of electrodes 19 are formed of a metal foil having excellent conductivity such as copper, and are bonded to the upper surface of the transparent conductive film 17 in a state of being arranged in parallel with each other. A conductive adhesive is used for this adhesion. A shading paper 21 is attached to the lower surface of the top plate 11. This shading paper 21 is the top plate 1
A circular sheet having substantially the same size as that of No. 3 is made of black paper, and a circular hole 21a smaller than the light transmitting hole 5a is formed in the center thereof.

[B. Assembly, closing of heat insulating recess] Electrode 19
The heating plate 15 to which is attached and the top plate 13 to which the shading paper 21 is attached are attached to each other in a state where they are centered with each other. This bonding is performed with an insulating transparent adhesive 25 (see FIG. 4), for example, a silicon adhesive. As a result, the plate unit 1 having a multilayer structure in which the top plate 13, the light-shielding paper 21, the electrode 19, the transparent conductive film 17, and the heating plate 15 are stacked in this order from the top.
1 (see FIG. 3) is configured. Therefore, in this plate unit 11, only the portion corresponding to the hole 21a of the light-shielding paper 21 becomes the light transmitting portion.

On the outer peripheral portion of the lower surface of the heating plate 15, a thin temperature sensor (not shown) is bonded at a position corresponding to the two electrodes 19. Further, the tip of the connecting cord 31 extending from the controller (not shown) is inserted into the cord through hole 7a of the frame 3 from the outside (see FIG. 3, etc.), and the core wire is the electrode 19 or the lead wire of the temperature sensor (not shown). Connected to.

The plate unit 11 thus assembled has a top plate 13 as shown in FIG.
Are housed in the frame 3 with the side facing up. At this time, the adhesive 37 (see FIG. 4) is applied to the upper surfaces of the step portions 5c and 5d, and the lead wire of the connection cord 31 is housed in the wiring groove 5f. Therefore, the plate unit 11
Since the heating plate 15 is seated on the step portions 5c and 5d with adhesion, the upper surface of the heat insulating recess 5b is hermetically closed by the heating plate 15. Plate unit 11
Since the outer diameter of the plate unit 11 is slightly smaller than that of the peripheral wall 7 of the frame 3, some space remains around the plate unit 11. This space and the wiring groove 5f are filled with a filler 33 such as a silicon adhesive.

[C. Deaeration and effect of heat insulating recess] After the plate unit 11 is attached to the frame 3 as described above, the heat insulating recess 5b is degassed. In this deaeration, the suction needle connected to the vacuum device is pierced through the center of the plug 9, that is, the position corresponding to the center of the recess 9a, and the tip is projected into the heat insulating recess 5b. By driving, and when degassing is completed, remove the intake needle. As described above, since the plug 9 is made of an elastic material, the minute hole formed by piercing the suction needle here is naturally closed by pulling out the suction needle. By filling the adhesive 34 (see FIG. 4) on 9a, the hole is completely closed.

Then, the inside of the heat insulating recess 5b closed by the heating plate 15 or the like is made almost vacuum, and most of the plate unit 11 comes into contact with the frame 3 via the vacuum heat insulating recess 5b. Therefore, the transparent conductive film 17
Since the heat generated in 1 is hardly transmitted to the bottom wall 5, the temperature of the top plate 13 can be kept substantially uniform over the entire surface.

The method of using the main body 1 is not different from the conventional one. That is, with the frame 3 mounted on the stage of the microscope, the top plate 13 is heated to a desired temperature by operating a controller (not shown), and the target sample is directly mounted on the sample mounting surface which is the upper surface of the top plate 13. Alternatively, the sample is placed on a slide glass and placed on the sample mounting surface for heating, and the sample to be observed is moved right above the hole 21a and viewed through the objective lens.

[D. Warp Prevention Spacer] (FIG. 5) When the heat insulating recess 5b is evacuated, the atmospheric pressure directly applied to the plate unit 11 is only from above. In order to prevent the plate unit 11 from warping due to this pressure, it is preferable to provide a warping prevention spacer 35 in the heat insulating recess 5b as shown in FIG. 5, for example. The warp prevention spacer 35 may be formed integrally with the frame 3,
It is desirable to attach one formed of a material having a low thermal conductivity.

The warp prevention spacer 3 shown in FIG.
Although 5 has a form in which a large number of protrusions are arranged in an annular shape, depending on the case, it may be a line form or another form. In any case, it is desirable that the warp preventing spacers be arranged in a well-balanced manner in the heat insulating recess 5b.

[2. Second Embodiment] (FIGS. 6 to 8) FIGS. 6 to 8 show a main body 41 of a sample temperature management device according to a second embodiment. The main part 41 is different from the main part 1 mainly in the outer shape of each part and the stage fitting part 43 attached to the bottom surface of the bottom wall of the frame. Therefore, the description will be given only to the portions related to this difference, and the other portions will be denoted by the same reference numerals as those assigned to the same portions of the main body 1 or the reference numerals having a dash added thereto. Therefore, the description will be omitted.

As can be seen from FIG. 8, the main body 41
In, the top plate 13 'and the heating plate 1
The outer shapes of 5'are all rectangular, and the transparent conductive film 17 is coated on the upper surface of the heating plate 15 '.
A pair of electrodes 19 are attached to the conductive film 17. Corresponding to the outer shape of the top plate 13 ', etc., light-shielding paper 21
The outer shape of the frame 3'and most of the planar shape of each part of the frame 3'are rectangular, but only the light-transmitting hole 5a of the frame 3'is circular in plan view, and a heat insulating recess 5b is provided on the outside thereof. ing.

As shown in FIG. 7, the stage fitting portion 43 is for fitting in the light transmitting hole 45a of the stage 45 of the microscope, and is of a size which is made of synthetic resin so as to fit in the light transmitting hole 45a. Is formed so as to have a disk shape, and the light transmitting hole 5a of the frame 3'is formed at the center thereof.
A slightly larger light transmitting hole 43a is provided, and these light transmitting holes 5a, 43a are attached to the lower surface of the bottom wall 5 in a state of being coaxially located. This attachment is performed with four screws 47 (see FIG. 7). The screw holes 5g and 43b through which the screw 47 is inserted are hermetically sealed by an adhesive when the screw 47 is attached.

However, the bottom wall 5 of the frame 3'is increased in thickness by the thickness of the stage fitting portion 43 attached to the lower surface thereof to increase the heat capacity.
The heat of the conductive film 17 is more likely to escape to the frame 3 ',
Since the vacuum heat insulating recess 5b is provided between the plate unit 11 'and the frame 3', the heat propagation can be almost surely stopped.

[3. Third Embodiment] (FIGS. 9 and 1)
0) FIG. 9 and FIG. 10 show the body part 51 of the sample temperature management device according to the third embodiment. The main difference between the main body 51 and the main body 1 is that the heat insulating space is provided in the plate unit. The bottom wall 5 of the frame 3 ′ in the main body 51 has the wiring groove 5
Except for f, the entire upper surface is flat, and the plate unit 53 is seated on the upper surface and is housed in the frame 3 '.

In this plate unit 53, the transparent conductive film 17 is formed on the lower surface of the top plate 13 as shown in FIG.
And a pair of positive and negative electrodes 19 are attached to the transparent conductive film 17. An opaque paint (not shown) is applied to the upper surface of the top plate 13, and the paint is applied in such a manner that only the circular region at the center of the top plate 13 is left as a light transmitting portion. The transparent protective plate 55 faces the lower surface of the top plate 13 in this state from below with a thin vacuum insulation space 57 interposed therebetween.

In order to define the heat insulating space 57, a spacer is provided between the top plate 13 and the protection plate 55. That is, an annular closing spacer 61 is inserted in the outer peripheral portion between the top plate 13 and the protective plate 55, and four warp preventing spacers 63 are arranged in the central portion. Warp prevention spacer 63
Is formed of transparent glass in the shape of a small column, and is adhered in a state in which it is arranged at equal intervals around the portion corresponding to the light-transmitting portion limited by the above-mentioned paint. The closing spacer 61 is formed, for example, by applying an ultraviolet curable adhesive to the outer periphery of the upper surface of the protection plate 45, placing the top plate 13 thereon, and then curing the adhesive. .

The plate unit 53 is assembled in the following manner. First, the transparent conductive film 17 is coated on the top plate 13, and the electrode 19 is attached thereto. Further, a warp preventing spacer 63 is attached to the protective plate 55, and an adhesive as the closing spacer 61 is applied to the outer peripheral portion of the upper surface of the protective plate 55. This adhesive is thicker than the height of the warp preventing spacer 63. Next, the top plate 13 and the protection plate 55 in this state are transferred into a vacuum container, the inside of the container is deaerated, and then the top plate 13 is placed on the warp prevention spacer 63 and the top plate 13 is attached to the adhesive. Are adhered to each other, and finally the adhesive is cured in the vacuum container.
A thin insulating space 57 of vacuum is formed between the thin space and the space 5.

The plate unit 53 assembled in this manner is housed in the frame 3'after being subjected to required wiring processing, and the filler 3 is filled in the empty space of the frame 3 '.
The main body 51 is completed by filling 3 with the material. In the main body portion 51 having such a structure, most of the transparent conductive film 17 contacts only the top plate 13 and only slightly contacts the protection plate 55 with the spacers 61 and 63. Since there is a vacuum heat insulating space 57 between them, the heat generated in the conductive film 17 is hardly transferred to the protective plate 55 and the bottom wall 5 of the frame 3 '. Thereby, the temperature of the top plate 13 can be kept substantially uniform over the entire surface.

In this embodiment, the adhesive is used as the means for defining the outer peripheral portion of the heat insulating space 57.
For this, an annular spacer formed in advance with a material having a low thermal conductivity may be attached to the top plate 13 or the protection plate 55, or the protection plate 5
It is conceivable that an annular wall is integrally formed on the outer peripheral portion of 5 and the annular wall is used as a closing spacer.
Further, on the upper surface of the bottom wall 5, as in the case of the main body portion 1, the heat insulating recess 5
If b is formed and a vacuum is applied to it, the heat insulating effect can be further enhanced.

The embodiment of the present invention has been described above.
The specific configuration of the present invention is not limited to this embodiment, and the present invention includes a design change and the like within a range not departing from the gist of the present invention. For example, in the embodiments, only the form in which the heat insulating sheet is not used is shown, but in the case of a model in which the thickness of the main body does not matter so much, the heat insulating sheet may be used together to further enhance the heat insulating effect. Conceivable.

Regarding the form in which the heat insulating recess is provided on the bottom wall of the frame, the heat insulating recess may be spatially divided, and the plate unit has a structure in which a conductive film is directly formed on the top plate. The structure may be covered with a relatively thick protective film. In carrying out the present invention, it goes without saying that the method for evacuating the heat insulating recess or forming a vacuum heat insulating space between the top plate and the protective plate is not limited to that shown in the embodiment. Is.

[0045]

As described above, according to the present invention, the heat generated in the heating means and the heat of the top plate heated thereby can be effectively prevented from being transmitted to the frame and the members attached thereto. Therefore, it is possible to considerably improve the local temperature unevenness of the top plate, and for that reason, it is almost unnecessary to increase the thickness of the main body.

[Brief description of drawings]

FIG. 1 is an overall perspective view showing a main body section of a sample temperature management device according to a first embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along line AA of FIG.

FIG. 3 is an exploded perspective view of the main body shown in FIG.

FIG. 4 is an enlarged sectional view of a main part taken along line BB in FIG.

5 is a perspective view showing an example in which a warp prevention spacer is provided on the frame in the main body of FIG.

FIG. 6 is an overall perspective view showing a main body of a sample temperature management device according to a second embodiment of the present invention.

7 is an enlarged cross-sectional view taken along the line CC of FIG.

8 is an exploded perspective view of a main body of the sample temperature management device shown in FIG.

FIG. 9 is a central vertical cross-sectional view showing a main body portion of a sample temperature management device according to a third embodiment of the present invention.

FIG. 10 is an exploded perspective view of a main part of the sample temperature control device shown in FIG.

FIG. 11 shows a main body of a conventional sample temperature controller (A),
(B) It is sectional drawing which illustrated two.

[Explanation of symbols]

1 ... Main body of sample temperature controller 3 ... Frame 5 ...
Bottom wall 5a ... Translucent hole 5b ... Thermal insulation recess 11 ... Plate unit 13 ...
Top plate 15 ... Another plate 17 ... Heat generating conductive film 35 ...
Warp prevention spacer 41 ... main body of specimen temperature controller 3 '... frame 11' ... plate unit 13 '... top plate 15' ... heating plate 43 ... stage fitting portion 51 ... main body of specimen temperature controller 53 ... plate Unit 55 ... Protective plate 57 ... Insulation space 63 ... Warp prevention spacer

Claims (5)

[Claims] 1. A top plate on which an observation sample is mounted,
In a main body of a sample temperature controller including a thin-film heating unit for heating the top plate and a frame holding the top plate, heat generated by the heating unit or a top plate heated by the heat A main body part of the sample temperature control device, which is provided with a substantially vacuum heat insulating space for stopping the heat of the heat from being transmitted to the frame. 2. A plate unit having a top plate on which an observation sample is placed and a heat generating conductive film coated on the top plate or another plate superposed on the top plate; A main body of a sample temperature controller including a frame provided with a hole and holding the plate unit in a storage state, wherein a heat insulating recess is provided on an upper surface of a bottom wall of the frame, and an upper surface of the heat insulating recess is formed by the plate unit. A main body of a sample temperature control device, which is closed and the heat insulating recess in this state is made substantially vacuum. 3. A plate unit having a top plate on which an observation sample is mounted and a heat generating conductive film coated on the top plate or another plate superposed on the top plate; A body part of a sample temperature controller including a frame provided with a hole and holding the plate unit in a storage state, and a stage fitting part attached to the bottom surface of the bottom wall of the frame, and the top surface of the bottom wall of the frame. A main body of a sample temperature control device, characterized in that a heat insulating concave portion is provided in the heat insulating concave portion, the upper surface of the heat insulating concave portion is closed by the plate unit, and the heat insulating concave portion in this state is made substantially vacuum. 4. A plate unit having a top plate on which an observation sample is placed, a heating conductive film coated on the lower surface of the top plate, and a protection plate facing the top plate from below, and a transparent plate on the bottom wall. A main body of a sample temperature controller including a frame provided with a light hole and holding the plate unit in a storage state, wherein a substantially vacuum heat insulating space is provided between the top plate and the protection plate. The main body of the characteristic sample temperature controller. 5. The sample temperature control according to claim 4, wherein a warp preventing spacer is provided at or near a central portion between the top plate and the protection plate in the main body of the sample temperature control device. The body of the vessel.