JP2003051518A - Method of manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a method of manufacturing a semiconductor device, which can suppress marking errors while working man-hours necessary for marking are reduced, improve the yield, and, further, sort out chips into a plurality of types. SOLUTION: After a wafer is subjected to inspection, inspection results of respective chips are recorded on a rear surface of an expansion sheet, which has the wafer stuck after the inspection and is expanded after the wafer dicing to separate the wafer into individual chips, at positions corresponding to the respective chips. With such a constitution, working man-hours necessary for marking can be reduced and marking errors also can be suppressed. Even if a chip not defective is mistakenly marked as defective, as the mark is not recorded directly on the chip but on the rear side of the expansion sheet, the yield can be improved and the chips can be sorted out into a plurality of types.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing method suitable for use in a trial manufacturing process.

[0002]

2. Description of the Related Art When prototyping a semiconductor device, a wafer that has undergone a manufacturing process is inspected (probe check) for each chip in a wafer state using a prober, and a chip that does not pass this inspection is a defective product. A marking that indicates that there is an ink mark is provided.
When the inspection is completed for each chip, the assembly process proceeds. In the assembling process, the wafer for which the inspection of each chip has been completed is placed on the adhesive surface of the stretched sheet SS and adhered thereto, and in that state, the wafer is diced so as to individualize each chip. After dicing, the stretched sheet SS is stretched to separate the chips, as shown in FIG. Then, among the chips separated on the stretched sheet SS, only non-marked non-defective chips PC are selected and packaged.

[0003]

By the way, the conventional trial manufacturing process has the following problems (a) to (c). (B) In the mass production process, the quality judgment result for each chip obtained in the wafer inspection is input to a dedicated marking device called an inker for automatic marking.
In the trial production process, such equipment is not used, and marking is often done manually. Moreover, as the size of the wafer increases, the number of chips per wafer also increases, which increases the number of man-hours required for marking and causes a marking error.

(B) Further, when a chip which should be originally a good product is erroneously marked due to a marking mistake, the mark cannot be erased due to a quality control problem. Therefore, once a product is marked as a defective product, it is considered as a defective product even if it is a non-defective product, which causes a decrease in yield. (C) Further, the conventional marking has a problem in that it is only possible to distinguish whether each chip is good or bad and, for example, it is not possible to rank and select chips into a plurality of types.

Therefore, the present invention has been made in view of the above circumstances, and it is possible to suppress the occurrence of marking mistakes while improving the man-hour required for marking, improve the yield, and select chips into a plurality of types. An object of the present invention is to provide a method of manufacturing a semiconductor device that can be manufactured.

[0006]

In order to achieve the above object, in the invention according to claim 1, the wafer after the chip inspection is adhered to the front surface side of the stretched sheet, and in that state, the stretched sheet is subjected to wafer dicing. Is stretched to separate each chip into individual pieces, and then the inspection result for each chip is recorded at a position facing each chip on the back surface side of the stretched stretched sheet.

According to the second aspect of the invention, a wafer in which the chip inspection is completed is adhered to the surface side of the stretched sheet, and in that state, the stretched sheet is stretched after the wafer dicing to separate each chip into individual pieces. And a recording step of recording inspection results for each chip at a position facing each chip on the back surface side of the stretched sheet stretched in this stretching step, and each chip on the back surface side of the stretched sheet in this recording step. And a sorting step of sorting chips based on the inspection result for each chip recorded at a position facing each other.

According to the third aspect of the invention, a recording process for recording the inspection results for each chip in advance on the back surface side of the stretched sheet, and a wafer after the chip inspection is adhered to the front surface side of the stretched sheet, At the stretching step of stretching the stretched sheet after wafer dicing to separate each chip into individual pieces, and based on the inspection result for each chip recorded at a position facing each chip on the back surface side of the stretched sheet by the recording step And a selecting step of selecting.

According to the fourth aspect of the invention, a recording step of recording the inspection result for each chip according to the respective inspection specifications on each back surface side of the plurality of stretched sheets corresponding to the plurality of inspection specifications, and the recording step. In the process, a lamination process of laminating a plurality of stretched sheets in which the inspection results for each chip corresponding to each inspection specification are recorded, and the chip inspection is completed on the front surface side of the plurality of stretched sheets laminated in this laminating process. Bonding the wafer, stretching in that state after wafer dicing to separate each chip into individual pieces, and chip selection based on the inspection result for each chip recorded on the back side of the plurality of laminated stretched sheets And a sorting step of varying the sorting content according to the inspection result for each inspection specification that appears each time these laminated stretched sheets are peeled off in order. And butterflies.

In the invention according to claim 5 which depends on any one of claims 1 to 4, when the inspection result for each chip is recorded on the back surface side of the stretched sheet, a recording mode is set according to the inspection result. Characterized by making them different.

In the present invention, the wafer after the chip inspection is adhered to the front surface side of the stretched sheet, and in that state, the stretched sheet is stretched after wafer dicing to separate each chip into individual pieces, and then the stretched stretched The inspection result for each chip is recorded at a position facing each chip on the back surface side of the sheet. As a result, even if the number of chips per wafer increases as the wafer size increases,
The number of man-hours required for marking can be reduced, and the occurrence of marking errors can be suppressed. Further, even if the chip that should be a good product is erroneously marked, since it is recorded on the back side of the stretched sheet without directly marking the chip, it can be rewritten or overwritten. As described above, even if the product is a good product, it is not regarded as a defective product, and the yield can be improved. Further, since the inspection result for each chip is recorded on the back surface side of the stretched sheet, it becomes possible to sort the chips into a plurality of types.

[0012]

DETAILED DESCRIPTION OF THE INVENTION Embodiments will be described below with reference to the drawings. (1) First Embodiment FIG. 1 is a schematic diagram for explaining a first embodiment according to the present invention. The difference between the first embodiment shown in FIG. 1 and the conventional example shown in FIG. 3 is that the probe check result for each chip is recorded at a position facing each chip on the back surface side of the stretched sheet SS. There is something I did.

That is, similarly to the conventional trial manufacturing process, the probe check is performed for each chip using a prober on the wafer that has undergone the manufacturing process. The probe check result for each chip obtained in this way is input to inspection equipment such as a personal computer and stored in memory. After the probe check is completed, the wafer is stretched sheet S.
The wafer is placed on the adhesive surface of S and adhered thereto, and in that state, the wafer is diced to separate each chip into individual pieces. After dicing,
The stretched sheet SS is stretched.

Then, a probe check result for each chip is printed at a position facing each chip on the back surface side of the stretched stretched sheet SS. For printing, for example, a printing means such as a plotter is used, and the probe check result for each chip stored in the inspection equipment memory is printed at a position facing each chip. The content to be printed is, for example, as shown in FIG. 1, a defective chip F that does not meet the inspection specifications.
"X" for C, "△" for chips that meet some specifications
Is printed on the non-defective chip PC that meets all the specifications.

By doing so, even if the number of chips per wafer increases as the wafer size increases, the number of man-hours required for marking can be reduced, and the occurrence of marking errors can be suppressed. Further, even if the chip that should be originally a good product is mistakenly marked due to a marking mistake, it is possible to rewrite or overwrite since it is printed on the back side of the stretched sheet SS without directly marking the chip. Therefore, unlike the conventional case, even if the product is a good product, it is not regarded as a defective product, and the yield can be improved. Further, since the content for sorting each chip according to the probe check result is printed, it becomes possible to sort the chips into a plurality of types.

In the above-described embodiment, the probe check result for each chip is printed on the back surface side of the stretched sheet SS stretched after dicing, but instead of this, the wafer is bonded after the probe check is completed. The probe check result for each chip may be printed in advance by a printing means such as a printer on the stretched sheet SS before being stretched, that is, on the back surface side of the stretched sheet SS before being stretched. In this case, printing positioning may be performed in consideration of the amount of stretching when the stretched sheet SS is stretched.

(2) Second Embodiment In the above-described first embodiment, a mode in which one stretched sheet SS is used is mentioned, but in the second embodiment, a mode in which two stretched sheets SS are superposed will be described. .
Here, the stretched sheets SS to be superposed are all formed of a transparent or translucent film, the sheet on which the chips are placed and adhered is a stretched sheet SS2, and the sheet to be superposed below is a stretched sheet SS1. .

As in the first embodiment described above, a prober is used to perform a probe check for each chip in a wafer state. The probe check result for each chip obtained by this is stored in a memory using a personal computer or the like. Then, the probe check result for each chip is printed on each back surface side of the stretched sheets SS1 and SS2 before being stretched. For example, a mark representing a defective chip FC that does not meet the first inspection specification is printed on the stretched sheet SS1 side, while the stretched sheet SS1 is printed.
Defective chip FC that does not meet the second inspection specifications on the 2 side
Print a mark that represents.

After the printing of both sheets SS1 and SS2 is completed, the stretched sheet SS2 is placed on the adhesive surface of the stretched sheet SS1 and laminated. After that, the wafer for which the probe check is completed is placed on the adhesive surface of the stretched sheet SS2 and adhered thereto, and in that state, the wafer is diced so as to separate each chip. After dicing, the stretched sheets SS1 and SS2 in the superposed state are stretched. As a result, FIG.
The state shown in FIG.

When the stretched sheets SS1 and SS2 formed of transparent or translucent films are superposed on each other, the unmarked chips can be selected as non-defective chips PC satisfying both the first and second inspection specifications (see the same figure). (See (b)). Next, when the stretched sheet SS1 is peeled off, the non-marked chip is a non-defective chip PC that satisfies only the second inspection specifications.
Can be selected as (see (b) of the same figure). By doing this, as in the first embodiment described above, the number of man-hours required for marking can be reduced, the occurrence of marking errors can be suppressed, and the chips can be sorted into a plurality of types while improving the yield.

In this embodiment, the stretched sheet SS
An example in which the mark is printed only on the portion corresponding to the defective chip FC on the back surface side of the above has been described, but the invention is not limited to this.
If the symbols, letters, or numbers printed on the back surface side of the stretched sheet SS are made to differ depending on the probe check result, it becomes possible to rank and select chips. In addition, if the printed symbols, letters or numbers have different colors, and the fonts are different, the variation in selecting chips is further enhanced, and the visibility in selecting chips is improved.

Furthermore, in the present embodiment, an example of stacking stretched sheets formed of transparent or translucent films has been described, but the present invention is not limited to this, and a plurality of stretched sheets formed of opaque films may be stacked. Is also good. When a plurality of stretched sheets of opaque films are piled up, chips are sorted under the condition set individually for each stretched sheet.

[0023]

According to the invention described in claims 1 to 3, since the inspection result for each chip is recorded at a position facing each chip on the back surface side of the stretched sheet, the wafer size becomes large. Even if the number of chips per wafer increases, the number of man-hours required for marking can be reduced and the occurrence of marking errors can be suppressed. Also, even if the wrong chip is marked by mistake, it is possible to rewrite or overwrite because it is recorded on the back side of the stretched sheet without directly marking the chip.
Therefore, unlike the conventional case, even if the product is a good product, it is not regarded as a defective product, and the yield can be improved. Further, since the inspection result for each chip is recorded on the back surface side of the stretched sheet, it is possible to select a plurality of chips. According to the invention of claim 4, after recording the inspection results for each chip according to the respective inspection specifications on the back surface side of the plurality of the oriented sheets corresponding to the plurality of inspection specifications, the plurality of drawn sheets Are laminated and stretched. Since the selection contents are changed according to the inspection result for each inspection specification that appears each time these laminated stretched sheets are peeled off in sequence, the man-hour required for marking can be reduced, and the occurrence of marking errors can be suppressed. The chips can be sorted into a plurality of types while improving the yield. According to the invention of claim 5, when recording the inspection result for each chip on the back surface side of the stretched sheet, the recording mode is changed according to the inspection result. If the numbers, display colors, or fonts are changed according to the inspection result, there are many variations when selecting chips, and the visibility when selecting chips can be improved.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a first embodiment.

FIG. 2 is a diagram for explaining a second embodiment.

FIG. 3 is a diagram for explaining a conventional example.

[Explanation of symbols]

SS: stretched sheet, FC: defective chip, PC: non-defective chip.

Claims (5)

[Claims] 1. A wafer that has undergone a chip inspection is adhered to the front surface side of a stretched sheet, and in that state, the stretched sheet is stretched after wafer dicing to separate each chip into individual pieces, and then the stretched stretched sheet A method of manufacturing a semiconductor device, wherein the inspection result for each chip is recorded at a position facing each chip on the back surface side. 2. A stretching step of adhering a wafer that has undergone chip inspection to the front surface side of a stretched sheet, stretching the stretched sheet after wafer dicing in that state to separate each chip into individual pieces, and in this stretching step A recording step of recording the inspection result for each chip at a position facing each chip on the back surface side of the stretched stretched sheet, and a recording step at a position facing each chip on the back surface side of the stretched sheet in this recording step. And a selecting step of selecting chips based on the inspection result for each chip. 3. A recording process for recording the inspection result for each chip in advance on the back surface side of the stretched sheet, and a wafer after the chip inspection is adhered to the front surface side of the stretched sheet, and in that state, the stretched sheet is subjected to wafer dicing. And a stretching step of separating each chip into individual pieces, and a sorting step of sorting the chips based on the inspection result of each chip recorded at a position facing each chip on the back surface side of the stretched sheet by the recording process. A method of manufacturing a semiconductor device, comprising: 4. A recording step of recording an inspection result for each chip according to each inspection specification on each back side of a plurality of stretched sheets corresponding to a plurality of inspection specifications, and each inspection specification is recorded in this recording step. A laminating step of laminating a plurality of stretched sheets in which the inspection results of each corresponding chip are recorded, and a wafer after the chip inspection is adhered to the surface side of the plurality of stretched sheets laminated in this laminating step, and the state A step of stretching after wafer dicing to separate each chip into individual pieces, and a step of selecting chips based on the inspection result of each chip recorded on the back surface side of the plurality of laminated stretched sheets, And a sorting step of varying the sorting content according to the inspection result for each inspection specification that appears each time the drawn sheet is peeled off in order. Build method. 5. The semiconductor according to claim 1, wherein when recording the inspection result for each chip on the back surface side of the stretched sheet, the recording mode is changed according to the inspection result. Device manufacturing method.