JP2003051494A - Surface processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface processor which can perform uniform surface processing by maintaining the periodicity of a point cusp magnetic field in an internal space, even at a circumferential edge part as much as possible, making the asymmetricity of a magnetic field distribution in an area of the peripheral edge part small, where the periodicity is disordered, and maintaining the symmetry of the point cusp magnetic field, without greatly altering device constitution. SOLUTION: The surface processor has a reaction vessel 12, in which a substrate 14 having its top surface processed with plasma generated in it is placed and is equipped with a magnet plate 22, which generates the point cusp magnetic field distributed in the space in the reaction container, where the plasma is generated. The magnet plate is equipped with a plurality of magnets 21 arranged on a circular plane 33 facing the processed surface of the substrate in parallel; and one-end magnetic pole surfaces 21a of the plurality of magnets are arranged at the respective points of grating points, forming a hexagon on the circular plane in a honeycomb structure such that the magnetic pole end surfaces of two adjacent magnets have opposite polarities.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment apparatus, and in particular, in the production of integrated circuits in the semiconductor industry, film formation of insulating films, wiring metals, gate electrode materials, etc. on substrates or fine processing on substrate surfaces. It has a plasma source that supplies useful ions, electrons, neutral radicals, etc. to the plasma, and creates plasma by the plasma source in the reaction vessel and controls the distribution of this plasma with a point cusp magnetic field to utilize the plasma to move the substrate surface. The present invention relates to a surface treatment device for treating.

[0002]

2. Description of the Related Art A typical structure of a conventional surface treatment apparatus is shown in FIG.
2 will be described. FIG. 12 schematically shows the surface treatment apparatus. This surface treatment apparatus is provided with a reaction vessel (a vacuum tank or a processing chamber) made of a metal plate material, the inside of which is evacuated to a required reduced pressure state by an attached vacuum pump 11. Inside the reaction container 12, for example, an electrode (cathode electrode) 13 located on the upper side and an electrode (substrate electrode) 15 located on the lower side on which a substrate (or wafer) 14 is mounted in the form of a parallel plate type electrode structure. I have it. The substrate 14 mounted on the substrate electrode 15 is carried in from the substrate carry-in port 16 by a carrier device (not shown). After performing a predetermined process on the substrate electrode 15, the substrate electrode 15 is unloaded from the substrate unloading section 17. When the substrate 14 is processed in the reaction container 12, the reaction container 12
The internal space of the substrate is brought to a required reduced pressure state, the process gas is introduced, and the power supply condition is further satisfied to generate plasma in the front space of the substrate, and the substrate surface is treated with this plasma. Illustration of the process gas introduction mechanism is omitted.

Further, the reaction container 12 of the surface treatment apparatus has a structure in which the reaction container 12 is held at a ground potential 18. Cathode electrode 13 and substrate electrode 15
Are electrically isolated from the reaction vessel 12. In the illustrated example, a detailed structure for insulation is omitted. further,
High frequency power supplies 19 and 20 are independently connected to the cathode electrode 13 and the substrate electrode 15, respectively, and high frequency power is independently supplied to each. The frequency and the amount of high frequency power are arbitrarily determined according to the purpose.

The substrate 14 placed on the substrate electrode 15
Is fixed by a fixing mechanism 15a such as electrostatic adsorption. As described above, the structure of the substrate holder is added to the substrate electrode 15. Regarding the degree of vacuum in the reaction container 12, a certain amount of process gas for surface treatment of the substrate 14, such as argon, is introduced, while a vacuum state of about 1 to 10 Pa is maintained.

A magnet plate 22 having a large number of magnets (permanent magnets) 21 is provided on the back side of the cathode electrode 13. The magnet plate 22 is formed by fixing a large number of bar-shaped or block-shaped magnets 21 to a plate member 22a made of a non-magnetic member. The rod-shaped magnets 21 all have the same length and the same magnetic strength,
Opposite magnetic poles (N pole and S pole) are formed on both end faces, and one end face is fixed to the plate member 22a. Magnet plate 22
In, each of the plurality of magnets 21 is a plate member 22a.
It is fixed so that its length direction is perpendicular to the plane. In the magnet plate 22, the magnetic pole end surfaces of the many magnets 21 facing the surface of the plate member 22a are arranged so that the closest adjacent magnets are different from each other.
As shown in, the N poles and the S poles are alternately arranged at equal intervals on the surface of the plate member 22a. Regarding the way of disposing the magnet plate 22 in the reaction container 12, the plate material 22a may be provided on the cathode electrode 13 side, or conversely, the magnet 21 may be provided on the cathode electrode 13 side.

As a conventional technical document disclosing the structure relating to the arrangement of a large number of magnets 21 as described above, for example, Japanese Patent Application Laid-Open No. 11-283926 filed by the present applicant (FIGS. 1, 3 and 4). Etc.)). Further, as other documents, Japanese Patent Laid-Open No. 2000-14
4411, JP-A-6-69163, JP-A-6-316779, JP-A-8-288096, and the like.

In the reaction vessel 12 of the surface processing apparatus, the front surface space 23 of the substrate 14, that is, the cathode electrode 1 is processed in order to process the surface of the substrate 14 mounted on the substrate electrode 15.
Plasma is generated in the space below 3. This plasma is generated, for example, based on capacitive coupling of high frequency power.

FIG. 13 shows a plan view of the magnet plate 22. FIG. 13 is a plan view showing an array structure of a large number of magnets 21 provided on the magnet plate 22. In FIG. 13, a large number of small-diameter circles 21a indicate the end face positions of the cylindrical rod-shaped magnet 21 and the polarities of the magnetic poles. The planar shape of the magnet plate 22 is a circle having substantially the same diameter as the planar shape of the substrate 14 or the cathode electrode 13.
In the circular magnet plate 22, a large number of magnets 2
1s are arranged so that they are located at the four vertices of the square. In this arrangement structure, the magnet arrangement position is regarded as a square lattice point, and is referred to as a square lattice structure.
According to this square lattice structure, the periodicity of the square lattice arrangement is maintained in the central region of the magnet plate 22, but the periodicity is disturbed due to the circular contour shape being restricted in the peripheral region, as shown in FIG. In the above example, for example, the magnet 21 having the same polarity (N pole) and the magnet 2 having the opposite polarity (S pole) to these magnets 21
Four regions 24 in which 1s are arranged in a line are formed.
Arbitrary two adjacent magnets 21 (excluding diagonal positions) are in a positional relationship of equal intervals. In FIG. 13, a circled magnet 21a having a diagonal line means that the end face has an N pole, and a simple magnet 21 having a circular shape 21a means that the end face has an S pole. The polarity of each of the many magnets 21 arranged at the square lattice points is
Another adjacent magnet 21 arranged at the closest grid point
It is the opposite of the polarity. In FIG. 13, the length of one side forming the square is, for example, 2 cm, and the diameter of the circular end surface 21a of the magnet 21 is, for example, 8 mm.

In the inner space of the reaction vessel 12 and the inner space of the cathode electrode 13, a large number of magnets 2 in a magnet plate 22 arranged on the back surface of the cathode electrode 13 are provided.
A cusp field is formed on the basis of the above arrangement according to 1. The cusp magnetic field is a point cusp magnetic field formed by magnetic lines of force from the N pole to the surrounding S pole. Each of the multiple magnets 22 has the same magnetic force (coercive force).
Since they are arranged in a regular square lattice pattern in the same plane, the point cusp magnetic field is also formed in a periodic distribution form.

[0010]

In the surface treatment apparatus described above, a large number of magnets 21 are limited by the magnet plate 22 above the cathode electrode 13 having a circular planar shape due to the circular mounting surface of the plate member 22a. Are arranged in a square lattice structure. According to this magnet arrangement, in the inner space of the reaction vessel 12, the point cusp magnetic field is periodically generated by the same intensity distribution in the inner region of the cathode electrode 13 corresponding to the region where the square lattice structure is regularly maintained correctly. Again, cathode electrode 1
In the peripheral portion of No. 3, the periodicity of the magnet array is disturbed by the restriction of the circular contour shape, and the destination of the magnetic field lines disappears. Therefore, the strength of the magnetic field generated in the corresponding inner region is distributed in the radial direction viewed from the center of the substrate 14. Change to be very different. In general, in the inner space of the reaction vessel 12 and inside the cathode electrode 13, in order to make the plasma density uniform over a wide range, plasma generated in a strong magnetic field existing in a region near the magnet plate 22 is used. The magnetic field is diffused into a weak static magnetic field away from the magnet plate 22. However, according to the configuration of the conventional surface treatment apparatus, as described above, the weak static magnetic field is nonuniform in the space away from the magnet plate 22, and the magnetic field distribution is disturbed in the peripheral portion, so that ions in the plasma, The electron density and diffusion direction are not uniform. For this purpose, a plasma-based substrate 1
There is a problem that the surface treatment of No. 4 becomes non-uniform.

More specifically, the magnet 21
According to the magnet plate 22 in which the arrangement has a square lattice structure, a strong line cusp appears in the diagonal direction 25 of the unit square lattice in the space at the periphery of the magnet plate 22 which is separated from the magnet plate by, for example, 10 mm or more. As a result, the surface treatment result of the substrate area corresponding to the space is
There is a problem that the surface treatment result of the substrate region corresponding to another space is different.

An object of the present invention is to solve the above-mentioned problem, in which the periodicity of the point cusp magnetic field created in the internal space of the reaction vessel is maintained as much as possible in the peripheral portion, and the periodicity of the peripheral portion is disturbed. To reduce the asymmetry of the magnetic field distribution,
An object of the present invention is to provide a surface treatment apparatus capable of maintaining the symmetry of the point cusp magnetic field and performing uniform surface treatment without making a large change in the apparatus configuration.

[0013]

In order to achieve the above object, the surface treatment apparatus according to the present invention is constructed as follows.

First surface treatment apparatus (corresponding to claim 1):
It has a reaction vessel in which plasma is generated and an object to be processed whose surface is treated with plasma is placed, and a magnet plate for creating a point cusp magnetic field distributed in a space in the reaction vessel where plasma is generated. . The magnet plate includes a plurality of magnets arranged on a circular flat surface that faces the processing surface of the object to be processed, and one magnetic pole end surface of each of the plurality of magnets forms a hexagon on the circular flat surface. The magnets are arranged at respective positions of the lattice points so that the polarities of the magnetic pole end surfaces of two adjacent magnets are opposite to each other.

In the above-mentioned surface treatment apparatus, a large number of magnets of a magnet plate for producing a periodic point cusp magnetic field in the inner space of the cathode electrode are arranged in an array of a honeycomb lattice structure having hexagons as a unit lattice. . For this reason, the arrangement can be made to suppress the disturbance of the periodicity as much as possible, and the destination of the magnetic field line of the point cusp magnetic field at the peripheral portion of the magnet plate where the periodicity is easily disturbed is determined and closed. Thereby, the periodicity of the magnetic field corresponding to the peripheral portion of the magnet plate is maintained as much as possible, and the uniformity of processing in the corresponding portion of the substrate is improved.

Second surface treatment apparatus (corresponding to claim 2)
In the above configuration, preferably, the hexagon is a regular hexagon. According to the regular hexagonal honeycomb lattice structure, the honeycomb lattice can be arranged with high uniformity in the magnet plate due to the dense distribution.

Third surface treatment apparatus (corresponding to claim 3)
In the above configuration, preferably, the hexagon is characterized in that three pairs of opposing sides are parallel to each other, and the sides of each pair have different lengths. In the case of a honeycomb lattice structure, the unit honeycomb lattice does not have to be strictly hexagonal. The shape can be arbitrarily changed.

Fourth surface treatment apparatus (corresponding to claim 4)
Is preferably characterized in that the longest side is twice or less than the shortest side. In order to effectively exert the effect of suppressing the disorder of the periodicity of the point cusp magnetic field in the peripheral portion of the magnet plate, such a configuration is desirable.

Fifth surface treatment apparatus (corresponding to claim 5)
In the above configuration, preferably, at least two or more magnets are arranged corresponding to each of the hexagonal lattice points. Even with such a configuration, it is possible to produce the same effect.

Sixth surface treatment apparatus (corresponding to claim 6)
In the above configuration, preferably, another magnet having a reduced magnetic force is arranged in the outermost peripheral region of the circular plane to correct the disorder of the periodicity of the unit lattice. With this structure, the periodicity of the point cusp magnetic field at the peripheral portion of the magnet plate can be maintained as high as possible.

Seventh surface treatment apparatus (corresponding to claim 7)
In the above structure, preferably, the length of the other magnet is shortened to reduce the magnetic force.

[0022]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

The configurations, shapes, sizes, and arrangement relationships described in the embodiments are merely shown to the extent that the present invention can be understood and put into practice, and the numerical values and compositions (materials) of the respective configurations are also shown. Is merely an example. Therefore, the present invention is not limited to the embodiments described below, and can be modified into various forms without departing from the scope of the technical idea shown in the claims.

Since the basic constitution of the surface treatment apparatus according to the present invention is the same as the conventional constitution shown in FIG. 12, the explanation of the basic constitution of the apparatus in this embodiment is also based on FIG. The device configuration has already been described with reference to FIG. 12, and will not be described again here. The characteristic configuration of the surface treatment apparatus according to the present invention is the arrangement structure of a large number of magnets 21 on the magnet plate 22 provided on the back side of the cathode electrode 13. Therefore, in the description of the present embodiment, the array structure of the magnets 21 and the distribution characteristics of the magnetic field produced by the array structure will be described.

FIG. 1 shows a first embodiment of a magnet array structure in a surface treatment apparatus according to the present invention. FIG. 1 is a view similar to FIG. 13, and is a plan view of the magnet plate 22. In this magnet plate 22, the arrangement structure of a large number of magnets 21 having the same shape and the same magnetic strength has a honeycomb lattice 31 that forms a regular hexagon with six lattice points, if the magnet arrangement positions are regarded as lattice points. As a result, a honeycomb lattice structure is formed by arranging a large number of them. As described above, since the magnet plate 22 has a disc shape, the magnet 2 attached to the surface of the disc-shaped plate member 22a.
In No. 1, the honeycomb lattice 31 of the unit is spread and fixed on the circular surface of the plate member 22a without any gap and without protruding.

Regarding the magnet plate 22, according to the arrangement of the magnets 21 having the above-mentioned honeycomb lattice structure, compared to the arrangement of the magnets 21 having the above-mentioned conventional square lattice structure, a circular shape for fixing the magnets of the magnet plate 22. The plate member 22a can be attached in a circular shape similar to the plate member 22a so as to cover the entire surface of the plate member 22a as much as possible. As shown in FIG. 1, a circular plate member 22a
In the central region of the honeycomb lattice 31 with periodicity
Further, the magnets 21 having the N extreme surface 21a and the magnets 21 having the S extreme surface 21a are arranged so as to form a row at the peripheral edge of the circular plate member 22a as shown by the region 32. In addition, the respective columns are arranged closer to each other with a narrower interval as compared with the square lattice structure. As described above, in the magnet plate 22 of the surface treatment apparatus according to the present embodiment, a large number of magnets 21 are arranged in a honeycomb lattice structure, and in the peripheral portion (outermost magnet region) of the magnet plate 22 compared to the conventional square lattice structure. The shape of symmetry regarding the distribution state of magnetic field lines is kept as much as possible.

Next, the characteristics of the magnetic plate 22 relating to the magnetic field will be described with reference to FIGS. The plan view of the magnet plate 22 shown in FIG. 2 is substantially the same as that shown in FIG. However, in the magnet plate 22 shown in FIG. 2, as a specific example, the magnet 21 used is a cylindrical rod-shaped magnet having a length of 24 mm and a diameter of 8 mm (for example, NEOMAX-35 (model name) manufactured by Sumitomo Special Metals Co., Ltd.). In the circular plate member 22a, the two magnets 21 that are closest to each other are arranged in a honeycomb lattice structure in which the distance between them is 17 mm. Further, in FIG. 3 showing a side view of a part of the magnet plate 22, a magnet plate surface 33 is defined. A plane 34 positioned at a distance of, for example, 22 mm from the surface 33 of the magnet plate in the vertical direction is defined, and this plane 34 is defined as a plane region for measuring a magnetic field.
All the magnets 21 in the magnet plate 22 have the same length. Therefore, the magnet plate surface 33 becomes a plane parallel to the plate member 22a.

When the magnetic field strength was measured on the above-mentioned plane 34, it was found that the magnet plate 2 according to the present embodiment has the honeycomb lattice structure magnet array.
The magnetic field strength of the central part of 2 typically changes in the range of 0 to 2 mT, and the magnetic field strength of the peripheral part typically changes in the range of 0 to 6 mT. This is applied to a magnet plate 22 shown in FIG. 4, which has a conventional square-lattice structure magnet arrangement (closest magnet spacing is, for example, 20 mm) and magnet lengths are all the same as shown in FIG. When compared with the magnetic field strength measured under the same conditions, the magnetic field strength at the central portion of the magnet plate 22 typically changes in the range of about 0 to 2 mT, and the magnetic field strength at the peripheral portion is typical. It varied in the range of 0 to 10 mT. That is, in the conventional magnet plate having the magnet array of the square lattice structure shown in FIG. 4, the magnetic field in the space 10 mm or more away from the magnet plate surface 33 at the peripheral portion is about 5 times stronger than the space corresponding to the central portion. The intensity distribution appears in a straight line in the diagonal direction of the unit square lattice in the magnet array, whereas in the magnet plate 22 having the honeycomb lattice structure magnet array shown in FIGS. Magnet plate surface 3
In a space away from 3 to 10 mm or more, a magnetic field strength distribution in which the magnetic field strength is suppressed to about 3 times that in the space corresponding to the central portion appears in a circular shape. Magnet plate 22 according to the present embodiment
2, the outermost magnet area 35 shown in FIG.
Has a substantially circular shape along the circumference of the peripheral edge of the magnet plate 22 according to the present embodiment, which has a circular planar shape. It corresponds to a region in which the magnetic field intensity suppressed to about three times the magnetic field intensity in the central portion is distributed.

With reference to FIGS. 5 and 6, a concrete measurement example of the magnetic field strength distribution based on the magnet plate 22 according to the present embodiment and the conventional magnet plate 22 will be compared. The magnet plate 22 according to the present embodiment has the magnet arrangement of the honeycomb lattice structure shown in FIG. 2, and the conventional magnet plate 22 has the magnet arrangement of the square lattice structure shown in FIG. The magnetic field strength distribution is as shown in FIG.
It is a distribution related to the magnetic field strength in the direction perpendicular to the magnet plate 22 measured in. FIG. 5 shows the magnetic field strength distribution in the Y-axis direction, and FIG. 6 shows the magnetic field strength distribution in the diagonal direction (36). 5 and 6, the distribution characteristic A shows the magnetic field strength distribution regarding the magnet plate 22 according to the present embodiment, and the distribution characteristic B shows the magnetic field strength distribution regarding the conventional magnet plate 22.

As shown in FIG. 5, the magnet plate 22
-2.0 to 2.0 mT in the distribution characteristics A and B in the region of the central part (range near 0 to 140 mm in the radial direction from the center) of
The magnetic field changes in the range of, and outside 140 mm, the distribution characteristic B greatly changes to about 6.0 mT, whereas the distribution characteristic A changes to about -4.0 mT. Further, as shown in FIG. 6, in the central region of the magnet plate 22 (the range from 0 to 140 mm in the radial direction from the center), the distribution characteristics A and B have a magnetic field in the range of about -1.0 to 2.0 mT. The distribution characteristic B greatly changes to about 6.0 mT and the distribution characteristic A changes to about 3.0 mT outside 140 mm.

As described above, the magnetic field strength of the peripheral portion of the magnet plate 22 having the magnet array of the honeycomb lattice structure is improved as compared with the magnetic field strength of the peripheral portion of the magnet plate 22 having the magnet array of the square lattice structure. I understand.

A surface treatment apparatus constructed by using a magnet plate 22 having a large number of magnets 21 arranged in a honeycomb lattice structure as described above, and having a structure as shown in FIG. When the processing is performed, the magnetic field strength distribution of the point cusp magnetic field in the predetermined space corresponding to the peripheral portion of the magnet plate 22 is improved, so that the peripheral portion of the substrate, which has been a problem due to the magnet array of the conventional square lattice structure, is a problem. It was possible to solve the problem of processing non-uniformity.

Next, FIG. 7 shows a second embodiment of the present invention.
The surface treatment apparatus according to this embodiment includes a magnet plate having a magnet array of a honeycomb grid structure similar to that of the first embodiment, but the form of the honeycomb grid forming the magnet array is modified. Therefore, FIG. 7 shows one honeycomb lattice 41 having a characteristic form. In this honeycomb lattice 41, a magnet having an N extreme surface 42a and a magnet having an S extreme surface 42b are arranged at six lattice points forming a hexagon. The honeycomb lattice 41 does not form a regular hexagon, and is characterized in that three pairs of opposing sides are formed in parallel with respect to the sides between the six lattice points.
If the three sets of opposing sides are parallel, the length of each side may be arbitrary. Even in the magnet arrangement based on the honeycomb lattice structure made of the honeycomb lattice 41 having such a form, the above-described actions and effects can be sufficiently exhibited. However, in order to produce a higher effect, in the unit of the honeycomb lattice 41 shown in FIG. 7, the length of the longest side of each side of the hexagon is twice the length of the shortest side. The following is preferable.

Next, FIG. 8 shows a third embodiment of the present invention.
The surface treatment apparatus according to this embodiment also includes a magnet plate having a magnet array of a honeycomb grid structure similar to that of the first embodiment, but the form of the honeycomb grid forming the magnet array is modified. FIG. 8 shows one honeycomb lattice 51 as a unit having a characteristic form. The honeycomb lattice 51 according to this embodiment has, for example, four magnets 2 having the same extreme surface 21a at each lattice point in the arrangement of lattice points forming a regular hexagon.
1 is arranged. The number of magnets arranged at each lattice point forming the regular hexagon may be more than one (two or more), and any number can be set according to the use or purpose. Even in the magnet arrangement based on the honeycomb lattice structure made of the honeycomb lattice 51 having such a form, the above-described actions and effects can be sufficiently exhibited.

The magnet plate 22 according to the above-described embodiments.
Then, a large number of magnets 21 are arranged on one surface of one plate member 22a having a required thickness, but the magnets 21 are arranged in the plate member by increasing the thickness of the plate member 22a. Alternatively, a similar magnet array structure can be created by installing only the magnet 21 without using the plate member 22a. The magnet plate 22 may be arranged on the back surface of the cathode electrode 13 or on the inner space side of the reaction container 12. Further, it may be arranged outside the reaction vessel 12. The magnet plate 22 in the reaction container 12 may be arranged with the plate member 22a inside or the magnet inside.

Next, referring to FIGS. 9 and 10, the fourth embodiment of the present invention will be described.
An embodiment will be described. In this embodiment, the magnet plate 2
The magnet arrangement in 2 is, for example, in addition to the arrangement according to the honeycomb lattice structure of the first embodiment described above, a plurality of magnets 61 each having a magnet length of preferably ½ are arranged at required positions on the outermost peripheral edge portion. Is configured to. The end surface of the magnet 61 has an N pole 61a or an S pole 61b, depending on the location. By thus reducing the magnet length by half, the magnetic strength is weakened and the magnetic strength distribution in the peripheral portion of the magnet plate 22 is controlled to be equal to that described in the first embodiment. ing.

In the fourth embodiment, the outermost magnet 6 is used.
Although the length of 1 is preferably halved to control the magnetic field strength distribution at a required location, it is preferable that the planes 34, which are regions for measuring the magnetic field strength distribution, have the same height. As shown in FIG. 11, it is possible to provide a support base 62 and make the flat surface 34 a constant height.

It is needless to say that the magnet plate 22 of the surface treatment apparatus according to the present invention can be realized by arbitrarily combining the configurations according to any of the embodiments described above. Further, the magnet may be a magnet generated by an electromagnetic action in addition to a normal permanent magnet.

[0039]

As is apparent from the above description, according to the present invention, a magnet plate formed by arranging a large number of magnets in the vicinity of a cathode electrode is provided, and a point cusp magnetic field is periodically generated in a space where plasma is generated. In the surface treatment device that controls the plasma and treats the surface of the substrate, a large number of magnets are arranged on the magnet plate by using the honeycomb lattice structure. The symmetry of the point cusp magnetic field is maintained without making a major change in the device configuration by maintaining the periodicity of the point cusp magnetic field as much as possible even in the peripheral portion and reducing the asymmetry of the magnetic field distribution in the region where the periodicity of the peripheral portion is disturbed. Therefore, the surface of the substrate can be uniformly processed.

[Brief description of drawings]

FIG. 1 is a plan view showing a magnet array in a magnet plate provided in a surface treatment apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a specific example of a magnet array in the magnet plate according to the first embodiment.

FIG. 3 is a partial side view of a magnet plate.

FIG. 4 is a plan view showing a magnet array of a square lattice structure of a conventional magnet plate used for comparison.

FIG. 5 is a graph showing a magnetic field strength distribution characteristic (Y-axis direction) for comparing the magnet plate according to the first embodiment with a conventional magnet plate.

FIG. 6 is a graph showing a magnetic field strength distribution characteristic (diagonal direction) for comparing the magnet plate according to the first embodiment with a conventional magnet plate.

FIG. 7 is a plan view showing a honeycomb lattice in a magnet array of a honeycomb lattice structure in a magnet plate according to a second embodiment of the present invention.

FIG. 8 is a plan view showing a honeycomb lattice in a magnet array of a honeycomb lattice structure in a magnet plate according to a third embodiment of the present invention.

FIG. 9 is a plan view showing a magnet array in a magnet plate according to a fourth embodiment of the present invention.

FIG. 10 is a partial side view of a magnet plate according to a fourth embodiment.

FIG. 11 is a partial side view showing a modification of the magnet plate according to the fourth embodiment.

FIG. 12 is a vertical cross-sectional view showing the internal structure of the surface treatment apparatus.

FIG. 13 is a plan view showing a magnet array in a magnet plate used in a conventional surface treatment apparatus.

[Explanation of symbols]

12 reaction vessels 13 Cathode electrode 14 board 15 Substrate electrode 21 magnet 22 Magnet plate 22a Plate material 31 Honeycomb lattice

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05H 1/46 H01L 21/302 C (72) Inventor Yasumi Sago 5-8-1 Yotsuya, Fuchu, Tokyo No. Anelva Co., Ltd. (72) Inventor Yukio Nakagawa 5-8-1, Yotsuya, Fuchu-shi, Tokyo F-terms within Anelva Co., Ltd. (reference) 4G075 AA24 AA30 AA61 BC04 BC06 CA42 DA01 EB01 EB42 EC21 EC30 EE01 EE36 4K030 FA03 HA06 KA14 KA30 KA34 5F004 AA01 BA08 BA09 BA13 BB00 BB07 CA06 5F045 AA08 AB03 AB31 AB39 BB02 DP03 DQ10 EH14 EH16 EH20

Claims (7)

[Claims] 1. A point having a reaction vessel in which plasma is generated and a processing object whose surface is treated with the plasma is placed, and further distributed in a space in which the plasma is generated in the reaction vessel. In a surface treatment apparatus including a magnet plate that creates a cusp magnetic field, the magnet plate includes a plurality of magnets arranged on a circular flat surface that faces the processing surface of the object to be processed, and each of the plurality of magnets. One of the magnetic pole end faces is arranged at each position of lattice points forming a hexagon on the circular plane, and the magnetic pole end faces of two adjacent magnets are arranged so that their polarities are opposite to each other. A characteristic surface treatment device. 2. The surface treatment apparatus according to claim 1, wherein the hexagon is a regular hexagon. 3. The surface treatment apparatus according to claim 1, wherein the hexagon has three pairs of opposing sides that are parallel to each other, and the sides of each pair have different lengths. 4. The surface treatment apparatus according to claim 3, wherein the longest side is twice or less than the shortest side. 5. The surface treatment apparatus according to claim 1, wherein at least two magnets are arranged in correspondence with each of the hexagonal lattice points. 6. The surface treatment apparatus according to claim 1, wherein another magnet having a reduced magnetic force is arranged in the outermost peripheral region of the circular plane to correct the disorder of the periodicity of the unit lattice. . 7. The surface treatment apparatus according to claim 6, wherein the length of the other magnet is shortened to reduce the magnetic force.