JP2003039682A - Electrostatic ink jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the work for connecting a flat cable to the head body. SOLUTION: A first wiring pattern 20 corresponding to the odd ink ejecting parts 16 among a plurality of ink ejecting parts 16 arranged in line at the end face part 14 of a head body 12 is arranged at one planar section 18 of the head body 12 and a second wiring pattern 24 corresponding to the even ink ejecting parts 16 is arranged at the other planar section 22 of the head body 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrostatic ink jet system in which a plurality of ink ejecting portions are arranged in a line on a head main body, and a wiring pattern extending to the ink ejecting portions is formed on the head main body. Regarding the head.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 10, an electrostatic ink jet head of this type has a plate-shaped head body 101.
A plurality of ink ejecting portions 102 are arranged in a line at a fine pitch (for example, 80 μm) on the end face portion of the head main body 101, and a plurality of fine widths (for example, 40 μm) extending to the ink ejecting portion 102 are provided on the plane portion of the head body 101. Wiring pattern 103
Are formed with a fine pitch (for example, the space between adjacent wiring patterns 103 is 40 μm).

On the flat surface of the head body 101, an end portion of a power supply wiring body 105 made of a flexible flat cable in which a plurality of wiring conductors 104 are disposed is disposed. Each wiring conductor 104 of the wiring body 105
Is connected to the corresponding wiring pattern 103 via a wire 106 by a connecting means such as wire bonding, and ink is filled in a space formed between the cover body and a cover body (not shown) arranged opposite to each other. Has become.

In the electrostatic ink jet head having the above-mentioned structure, the drive signal supply section is connected to the power supply wiring body 105.
A pulsed drive voltage is supplied to the wiring pattern 103 through the wiring pattern 103, and when the driving voltage is supplied to the ink ejection unit 102 through the wiring pattern 103, a counter electrode having a potential difference between the drive voltage and the ink ejection unit 102. Ink is ejected from the ink ejecting unit 102 onto the recording paper arranged above.

[0005]

However, in the electrostatic ink jet head configured as described above, the space between the wiring patterns 103 formed on the head main body 101 is extremely narrow, for example, 40 μm, so that the power supply wiring is If the mounting position of the body 105 is shifted in the left-right direction (direction in which the ink ejection portion 102 is arranged), the wiring pattern 103 adjacent to the wiring pattern 103 to which each wiring conductor 104 should be connected.
It will be in a state very close to.

In this way, when the wiring conductor 104 comes close to the adjacent wiring pattern 103, a certain wiring conductor 1
When a driving voltage is supplied to 04, its wiring conductor 104
There is a risk that a leak may occur between the wiring pattern 103 and the adjacent wiring pattern 103, and ink may be ejected from the ink ejection portion 102 where ink should not be ejected. Therefore, in order to prevent such malfunctions, fine positioning of the power supply wiring body 105 with respect to the head main body 101 is required, and the work of connecting the power supply wiring body 105 becomes complicated. There was a problem that productivity fell. It should be noted that such a problem occurs not only when using the power supply wiring body 105 made of a flat cable, but also when using another power supply wiring body such as a cable having a different structure or a covered conductor. Is.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electrostatic ink jet head having a structure capable of easily connecting a power supply wiring body to a head body. And

[0008]

In order to achieve the above object, the invention of claim 1 is such that a plurality of ink ejecting portions are arranged in a line on the end face portion of a plate-shaped head body, and the flat surface of the head body. In an electrostatic inkjet head in which a wiring pattern extending to the ink ejection portion is formed in a portion, a first wiring pattern corresponding to an odd-numbered ink ejection portion of the plurality of ink ejection portions is provided in the head. It is characterized in that it is disposed on one flat surface portion of the main body, and the second wiring pattern corresponding to the even-numbered ink ejection portions is disposed on the other flat surface portion of the head main body.

According to this structure, the first wiring pattern arranged on one flat surface portion of the head body and the second wiring pattern arranged on the other flat surface portion of the head body are
Since it is provided corresponding to every other ink ejection portion, the space between adjacent wiring patterns can be widened. Therefore, when each wiring pattern of the head body and each wiring conductor of the power supply wiring body such as a flat cable are connected, the connection work is facilitated and the productivity can be improved.

According to a second aspect of the present invention, in the first aspect, a flexible first flat cable in which a wiring conductor is connected to a first wiring pattern of the head body, and the head are provided. A flexible second flat cable in which a wiring conductor is connected to the second wiring pattern of the main body is provided.

According to this structure, the spaces between the adjacent first wiring patterns and between the adjacent second wiring patterns can be widened, so that the first main body of the head main body can be made wider.
And the wiring conductor of the first flat cable and the connecting work of the second wiring pattern of the head body and the wiring conductor of the second flat cable are facilitated to improve productivity. be able to. Further, since the space between the adjacent wiring patterns can be widened, even if the flat cable is displaced, it is possible to effectively suppress the leak between the wiring conductor and the adjacent wiring pattern, and to prevent malfunction. It will be reliable and will not occur.

[0012]

FIG. 1 is a perspective view of a main part of an electrostatic ink jet head according to an embodiment of the present invention.
Is a view seen from one surface side, and (b) is a view seen from the other surface side. In these figures, an electrostatic ink jet head 10 includes a plate-shaped head body 12 made of a ceramic base material such as zirconia, and one end surface portion 1 of the head body 12.
4 is formed in parallel with a plurality of ink ejecting portions 16 integrally formed so as to be arranged in a line in 4 and one flat surface portion 18 of the head body 12, and is an odd-numbered ink ejecting counted from one end portion. The plurality of first wiring patterns (electrode patterns) 20 extended to one surface of the portion 16 and the other flat portion 22 of the head body 12 are formed in parallel with each other, and are formed from one end portion. A plurality of second wiring patterns (electrode patterns) 24, which are extended to the other surface of the ink ejection portion 16 which is an even number when counted, and an end portion of one flat surface portion 18 of the head body 12 are arranged. A flexible first flat cable 26 that is a power supply wiring body provided, and a flexible second flat cable 26 that is a power supply wiring body disposed at the end of the other flat surface portion 22 of the head body 12. The flag And a cable 28.

Incidentally, one flat surface portion 18 of the head main body 12
Alternatively, the other flat surface portion 22 or both flat surface portions 18, 2
In FIG. 2, cover bodies (not shown) are arranged to face each other with a predetermined gap, and the space formed between the cover bodies and the head body 12 is filled with ink supplied from the ink tank. There is.

The ink ejecting portion 16 is formed into a plate shape having an isosceles triangle whose tip is the top by cutting one end face portion 14 of the head body 12 or the like, and the tip of the top which is adjacent to each other. The distance d is set to 80 μm, for example. A partition wall 30 is formed between the ink ejection portions 16 adjacent to each other.

Each of the first wiring patterns 20 forms a strip line having a width of 40 μm, for example, and has a multi-layer structure in which three kinds of metal thin films of copper, nickel and gold are laminated. It should be noted that each of the first wiring patterns 20 corresponds to the odd-numbered ink ejecting portions 16, and the second wiring pattern 24 corresponding to the even-numbered ink ejecting portions 16 is the other one of the head main body 12. Since it is formed on the plane portion 22, the spaces between the adjacent first wiring patterns 20 are formed at a pitch of, for example, 120 μm. That is, in the present embodiment, the space between the adjacent first wiring patterns 20 is three times as large as that of the conventional one in which all the wiring patterns are formed on the same plane portion.

The second wiring pattern 24 is formed in the same manner as the first wiring pattern 18. That is,
Each of the second wiring patterns 24 forms a strip line having a width of 40 μm, for example, and has a multi-layer structure in which three kinds of metal thin films of copper, nickel and gold are laminated. In addition, each second wiring pattern 24 is
Since the first wiring patterns 20 corresponding to the even-numbered ink ejecting portions 16 and corresponding to the odd-numbered ink ejecting portions 16 are formed on one flat surface portion 18 of the head body 12, they are adjacent to each other. Second wiring pattern 24
Spaces between them are formed with a pitch of 120 μm, for example. That is, in the present embodiment, the space between the adjacent second wiring patterns 24 is three times as large as that of the conventional one in which all the wiring patterns are formed on the same plane portion as the first wiring pattern 20. It becomes the size of.

The first flat cable 26 has a plurality of wiring conductors 32 arranged at the same pitch as the first wiring pattern 20 formed on the one flat surface portion 18 of the head body 12.
And each wiring conductor 32 is connected to the first wiring pattern 20 via a wire 34 by a connecting means such as wire bonding.

As described above, when the wiring conductor 32 of the first flat cable 26 is connected to the first wiring pattern 20 of the head main body 12, the first wiring pattern 20 corresponds to the odd-numbered ink supply section 16. Then (ie first
Since the wiring patterns 20 are formed corresponding to every other ink supply section 16, the space between the adjacent first wiring patterns 20 is widened, and as a result, the first flat cable 26 is left and right. Direction (a plurality of ink ejecting units 1
Even if each wiring conductor 32 comes close to the adjacent first wiring pattern 20 due to the positional deviation in the arrangement direction 6), the ink is not ejected from the ink ejection portion 16 as in the conventional case in which a leak occurs. This prevents malfunctions such as ink ejection. Therefore, the work of connecting the first flat cable 26 to the head body 12 becomes easier than in the conventional case, and the productivity is improved.

The second flat cable 28 has a plurality of wiring conductors 36 arranged at the same pitch as the second wiring pattern 24 formed on the other flat surface portion 22 of the head body 12.
And each wiring conductor 36 is connected to the second wiring pattern 24 via a wire 38 by a connecting means such as wire bonding.

As described above, when the wiring conductor 36 of the second flat cable 28 is connected to the second wiring pattern 24 of the head main body 12, the second wiring pattern 24 corresponds to the even-numbered ink supply section 16. Then (ie the second
Every other ink supply section 16 where the wiring pattern 24 of
(Corresponding to the
As a result of increasing the space between the wiring patterns 24 of the
Even if the flat cable 28 is displaced in the left-right direction (arrangement direction of the plurality of ink ejection portions 16) and each wiring conductor 36 comes close to the adjacent second wiring pattern 24, leakage occurs as in the conventional case. Therefore, malfunction such as ink being ejected from the ink ejecting section 16 which should not eject ink will not occur. Therefore, the work of connecting the second flat cable 28 to the head body 12 becomes easier than in the conventional case, and the productivity is improved.

2 to 7 are views for explaining an example of a method of forming the first wiring pattern 20 and the second wiring pattern 24 in the electrostatic ink jet head 10. First, as shown in FIG. 2, a plate-shaped head body 12 made of zirconia whose one end face portion 14 is cut.
To prepare. Then, as shown in FIG. 3, the head body 1
2 pretreatment for electroless plating is performed on the entire surface, and then electroless plating is performed to a thickness of 1 μm on the entire surface.
The following (preferably 0.3 μm or less) a copper thin film 42 which is a lower metal film is provided.

Next, as shown in FIG. 4, one flat surface portion 1 of the head body 12 from which the copper thin film 42 on the peripheral surface has been removed in advance.
It is not necessary to irradiate the copper thin film 42 provided on 8 with a laser beam (for example, an excimer laser beam) generated by a laser oscillator (for example, an excimer laser oscillator) 44 and condensed by a condenser lens 46. Remove the part. As a result, a plurality of lower layer wiring patterns 48 made of the copper thin film 42 are formed on the ink ejection portions 16 at positions corresponding to the odd-numbered ink ejection portions 16. Each lower layer wiring pattern 48 has, for example, 40
It has a fine width of μm and is formed at a pitch such that the space between adjacent lower layer wiring patterns 48 is 120 μm.

Next, as shown in FIG. 5, the head body 1
To the copper thin film 42 provided on the other flat surface portion 22 of
The unnecessary portion is removed by irradiating the same laser beam as that generated by the laser oscillator 44 and condensed by the condenser lens 46. As a result, a plurality of lower layer wiring patterns 48 made of the copper thin film 42 are formed on the ink ejection portions 16 at positions corresponding to the even-numbered ink ejection portions 16. Each lower layer wiring pattern 4
8 has a fine width of 40 μm, for example, and is formed at a pitch such that the space between adjacent lower layer wiring patterns 48 is 120 μm.

Next, the two flat surface portions 18 of the head main body 12,
22. A pretreatment for performing electroless plating is performed on the surface of the head main body 12 in which the lower layer wiring pattern 48 made of the copper thin film 42 is formed on 22, and then the lower layer wiring pattern 48 on both the flat surface portions 18, 22 is formed. Only by electroless plating, a nickel thin film which is an intermediate metal film having a thickness of 0.5 μm or more is provided. As a result, as shown in FIG. 6, the nickel thin film is provided on the lower layer wiring pattern 48 made of the copper thin film to form the intermediate layer wiring pattern 50. Although FIG. 6 shows only the intermediate layer wiring pattern 50 on the one flat surface portion 18, the intermediate layer wiring pattern 50 is similarly formed on the other flat surface portion 22.

Next, the two flat surface portions 18 of the head main body 12,
22 is a lower layer wiring pattern 48 and an intermediate layer wiring pattern 50.
Pretreatment for electroless plating is applied to the surface of the ceramics base material 12 in the state where the and are laminated, and then the thickness of the intermediate layer wiring pattern 50 of both flat surface portions 18 and 22 is made to be 0. A gold thin film which is an upper metal film having a thickness of 5 μm or more is applied. As a result, as shown in FIG. 7, the gold thin film is applied onto the intermediate layer wiring pattern 50 to form the upper layer wiring pattern 52. In FIG. 7, one flat surface portion 1
Although only the upper layer wiring pattern 52 of 8 is shown, the upper layer wiring pattern 52 is similarly formed on the other plane portion 22. As a result, the first wiring pattern 20 having a three-layer structure is formed on the one flat surface portion 18 of the head body 12,
A second wiring pattern 24 having a three-layer structure is formed on the other flat surface portion 22 of the head body 12.

The first and second wiring patterns 20 and 24 formed by such a method serve as a lower metal film on the head body 12 and are a copper thin film 42 excellent in workability by a laser beam.
Since the lower wiring pattern 48 having a predetermined thickness can be easily obtained by irradiating a laser beam, the intermediate wiring layer made of a nickel thin film is formed on the obtained lower wiring pattern 48. Since the upper layer wiring pattern 52 made of a gold thin film is formed via the pattern 50, it has a highly accurate width dimension as a whole and is excellent in durability that the edge of the portion removed by the laser beam does not rise up. Will be things.

In the above embodiment, the copper thin film is provided as the lower metal film because the gold thin film cannot be directly formed on the ceramic substrate 12 with a predetermined adhesive strength (adhesive strength). Is. Moreover, the reason why the nickel thin film is provided as the intermediate metal film is that the gold thin film cannot be directly formed on the copper thin film in a state having a predetermined adhesive strength (adhesive strength).

FIG. 8 is a diagram for explaining an example of the printing operation of the electrostatic ink jet head 10 configured as described above. That is, the electrostatic ink jet head 10 is disposed so that the ink ejection unit 16 side faces the rotating drum 60, which is a counter electrode held at a negative potential, for example.

In this state, corresponding to the image data to be printed from the drive signal supplying section 62, the predetermined first and second wiring patterns 20 and 24 are formed via the first and second flat cables 26 and 28. A pulsed drive voltage (for example, 200 V) having a positive potential is applied. As a result, a pulsed drive voltage having a positive potential is supplied to the corresponding ink ejecting section 16, and the coloring material particles 64 in the ink liquid charged to a positive potential are attracted to the rotating drum 60 side and the circumference of the rotating drum 60. By adhering to the recording paper (recording medium) 66 disposed on the surface, printing for one line is performed.

When the printing for one line is completed, the rotary drum 60 rotates for the next one line, and then a pulsed drive voltage having a positive potential is supplied to the predetermined ink ejecting section 16 to carry out the next step. Printing for one line is performed. By repeating these operations, the predetermined printing operation is completed. When performing color printing, at least three electrostatic inkjet heads 10 are arranged along the rotation direction of the rotary drum 60. As a result, the color material particles 64 corresponding to each color ink adhere to the recording paper 66 from the predetermined ink supply unit 16 of each electrostatic ink jet head 10 corresponding to the color image data, thereby performing color printing.

The electrostatic ink jet head 10 of the present invention.
As in the above embodiment, the first wiring pattern 20 corresponding to the odd-numbered ink ejecting portion 16 of the plurality of ink ejecting portions 16 arranged in a line is formed on one flat surface portion of the head body 12. The second wiring patterns 24 corresponding to the even-numbered ink ejecting portions 16 are arranged on the other flat surface portion 22 of the head body 12, so that between the adjacent first wiring patterns 20. , And each space between the adjacent second wiring patterns 24 can be widened.

Therefore, even if the first flat cable 26 disposed on the first flat surface portion 18 of the head body 12 is displaced in the left-right direction, which is the disposing direction of the ink ejecting portion 16, the first flat cable 26 is displaced. The generation of leakage between the first wiring pattern 20 on the flat surface portion 18 and the wiring conductor 32 of the first flat cable 26 is effectively suppressed, and ink is not ejected from the ink ejection portion 16 that should not be ejected. The reliability is high so that malfunction such as ejection is not caused.

Further, the second flat surface portion 22 of the head body 12
Even if the second flat cable 28 disposed on the second plane portion 22 is displaced in the left-right direction, which is the arrangement direction of the ink ejection portion 16, the second wiring pattern 24 on the second flat surface portion 22.
The occurrence of leakage between the wiring conductor 36 of the second flat cable 28 and the second flat cable 28 is effectively suppressed, and malfunctions such as ink ejection from the ink ejection unit 16 that should not eject ink do not occur. It will be reliable. Therefore, the first and second wiring patterns 20,
24 and the wiring conductors 32 and 36 of the first and second flat cables 26 and 28 can be connected more easily than the conventional one in which the space between the wiring patterns is narrow, resulting in an improvement in productivity. Become.

The electrostatic ink jet head 10 of the present invention is not limited to that of the above embodiment, and various modifications can be adopted as described below.

(1) In the above embodiment, the first and second wiring patterns 20 and 24 have the ink supply unit 1 as shown in the drawing.
Although it is formed so as to be narrower than the maximum width of 6 (that is, the width between the adjacent isolation walls 30), it is not limited to this. For example, it may be formed to have the same width as the maximum width of the ink supply unit 16 (for example, 60 μm). In this case, the spaces between the adjacent first wiring patterns 20 and between the adjacent second wiring patterns 24 become slightly narrower than those in the above-described embodiment, but in this case as well, the spaces in the above-described embodiment Similarly, it is possible to prevent malfunction.

Further, the first and second wiring patterns 20, 2
If the width of 4 is widened, the first and second flat cables 2
Connection work with 6, 28 wiring conductors 32, 36 is facilitated. If the widths of the first and second wiring patterns 20 and 24 are widened, the first and second flat cables 26 and 28 are
From the connection with the wiring conductors 32 and 36 of the
It is possible to reduce the electric resistance during the period up to and to supply the drive voltage to the ink supply unit 16 in a stable state.

(2) In the above embodiment, the first and second wiring patterns 20 and 24 and the wiring conductors 32 and 36 of the first and second flat cables 26 and 28 are connected to the wires 34 and 38.
However, the connection is not limited to this. For example, an anisotropic conductive film (Anisotropic ConductiveFi) made of conductive particles dispersed in a binder resin.
lm) can also be used to connect. In this case, for example, as shown in FIG. 9 ((a) is a perspective view seen from one surface side, (b) is a perspective view seen from the other surface side), the end surface of one flat surface portion 18 of the head main body 12 is different. The exposed end portion of the wiring conductor 32 of the first flat cable 26 is placed and thermocompression-bonded with the anisotropic conductive film 70 interposed therebetween, and the other flat surface portion 2
The exposed end of the wiring conductor 36 of the second flat cable 28 may be placed on the second end surface with the anisotropic conductive film 72 interposed therebetween and thermocompression bonded. As a result, the first and second wiring patterns 20 and 24 and the wiring conductors 32 and 36 of the first and second flat cables 26 and 28 are connected via the conductive particles of the anisotropic conductive films 70 and 72. To be done. Although the first and second flat cables 26 and 28 here have the wiring conductors 32 and 36 disposed therein, as shown in FIG.
6 may be exposed on the surface.

(3) In the above embodiment, the head body 12
Although the copper thin film 32 is formed as the lower metal film above, the present invention is not limited to this. Instead of copper
For example, other metal materials such as nickel and palladium can be used. As described above, when a nickel thin film, palladium thin film, or the like is formed as the lower metal film, the gold thin film can be directly provided on the lower metal film, so that the intermediate metal film is unnecessary. Further, although a gold thin film is provided as the upper metal film, the present invention is not limited to this. For example, a platinum thin film may be used instead of the gold thin film.

(4) In the above embodiment, the copper thin film, the nickel thin film, and the gold thin film are all formed by electroless plating, but the present invention is not limited to this. For example, it is possible to form all thin films or specific thin films by a method other than electroless plating such as vapor deposition, sputtering, and electroplating. Also,
Although the unnecessary portion of the copper thin film is removed by the laser beam, it can be removed mechanically.

(5) In the above embodiment, the electrostatic ink jet head 10 includes the first and second flat cables 2.
6 and 28 have been described, the present invention is not limited to this. For example, the head body 12, a plurality of ink ejecting portions 16 arranged in a line, the first wiring pattern 20 corresponding to the odd-numbered ink ejecting portions 16,
The second wiring pattern 24 corresponding to the even-numbered ink ejecting portions 16 may be used. In this case, the electrostatic ink jet head 10 may be used by connecting the first and second flat cables 26 and 28 to each other, such as a cable having a structure other than the flat cable or another conductor such as a coated conductor. You may make it connect and use the wiring body for electric power feeding.

(6) In the above embodiment, the head body 12
Is described as being composed of a ceramic base material such as zirconia, but is not limited to this. For example, the head body 12 may be made of synthetic resin. In this case, the ink ejecting unit 16 is the head body 12
One of the end faces may be formed by cutting, or may be formed integrally with the head body 12.

[0042]

As described above, according to the present invention,
A first wiring pattern corresponding to an odd-numbered ink ejection portion of the plurality of line-shaped ink ejection portions is disposed on one flat surface portion of the head main body, and corresponds to an even-numbered ink ejection portion. Since the second wiring pattern is arranged on the other flat surface portion of the head main body, the space between the wiring patterns on each flat surface portion can be widened and the work of connecting a flat cable or the like to the head main body can be facilitated. It can be carried out.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of an electrostatic ink jet head according to an embodiment of the present invention, in which FIG.
(B) is the figure seen from the other surface side.

2 is a perspective view of a main part of a head body of the electrostatic inkjet head shown in FIGS. 1 and 2. FIG.

3 is a perspective view of relevant parts showing a state in which a lower-layer metal film is formed on the entire surface of the head body shown in FIG.

4 is a diagram showing a process of forming a lower layer wiring pattern by irradiating a lower layer metal film on one flat surface portion of the head body shown in FIG. 3 with a laser beam.

FIG. 5 is a diagram showing a process of forming a lower layer wiring pattern by irradiating a lower layer metal film on the other flat surface portion of the head body shown in FIG. 3 with a laser beam.

FIG. 6 is a side view of essential parts showing a state in which a nickel thin film is formed on a lower layer wiring pattern formed of a copper thin film on the head body.

FIG. 7 is a side view of essential parts showing a state in which a gold thin film is formed on an intermediate layer wiring pattern made of a nickel thin film formed on the lower layer wiring pattern shown in FIG.

FIG. 8 is a diagram for explaining a printing operation of the electrostatic inkjet head shown in FIGS. 1 and 2.

9A and 9B are views showing a modified example of the connection structure between the first and second wiring patterns of the head main body and the wiring conductors of the flat cable, FIG. 9A is a perspective view of a main part seen from one surface side, and FIG. FIG. 4 is a perspective view of a main part as seen from the other surface side.

FIG. 10 is a perspective view of a main part of a conventional electrostatic inkjet head.

[Explanation of symbols]

10 Electrostatic inkjet head 12 head body 14 End face 16 Ink ejection section 18 One flat part 20 First wiring pattern 22 The other flat part 24 Second wiring pattern 26 First Flat Cable 28 Second flat cable 32,36 wiring conductor

Continued front page    (72) Inventor Fumihiko Nakamura             No. 1 at 579 Umehara, Wakayama City, Wakayama Prefecture             Inside Ritsu Koki Co., Ltd. (72) Inventor Yuji Yamamoto             No. 1 at 579 Umehara, Wakayama City, Wakayama Prefecture             Inside Ritsu Koki Co., Ltd. F-term (reference) 2C057 AF93 AG85 AG89 AG93 AP23                       AP55 AQ10 BD05

Claims (2)

[Claims] 1. A plate-shaped head main body is provided with a plurality of ink ejecting portions arranged in a line on an end surface thereof, and a wiring pattern extending to the ink ejecting portions is formed on a flat portion of the head main body. In the electrostatic ink jet head, a first wiring pattern corresponding to an odd-numbered ink ejecting section of the plurality of ink ejecting sections is arranged on one flat surface portion of the head body, and an even-numbered ink ejecting section is provided. An electrostatic ink jet head characterized in that a corresponding second wiring pattern is arranged on the other flat surface portion of the head body. 2. A flexible first flat cable in which a wiring conductor is connected to a first wiring pattern of the head body, and a wiring conductor connected to a second wiring pattern of the head body. The inkjet head according to claim 1, further comprising a second flat cable having flexibility.