JP2003035949A - Photosensitive resin composition and method for manufacturing relief pattern and method for manufacturing heat resistant coating each using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition using an aminimide as a photo-base generator which efficiently generates a sufficiently strong base even under low light exposure in combination with a polyamic acid and to provide a method for producing a relief pattern and a method for producing a heat resistant coating. SOLUTION: The photosensitive resin composition contains (a) an aminimide compound which generates a base when irradiated with active light and (b) a polyamic acid. In the method for manufacturing a relief pattern, a coating comprising the photosensitive resin composition is patternwise irradiated with active light and heated at 50-180 deg.C and the unirradiated regions are removed by development. In the method for manufacturing a heat resistant coating, a coating comprising the photosensitive resin composition is irradiated with active light all over and heated at 80-300 deg.C.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a photosensitive resin composition containing an amine imide compound which generates a base upon irradiation with actinic rays and a polyamic acid, a method for producing a relief pattern and a method for producing a heat resistant coating film. .

[0002]

2. Description of the Related Art Photo-curing technology is used in a wide range of fields from paints to semiconductor materials by taking advantage of its characteristics such as low-temperature curing, process shortening, short-time curing, and microfabrication as compared with conventional thermosetting technology. Is being pursued. Particularly, in the field of semiconductor materials, photosensitive polyimide having heat resistance of 250 ° C. or higher is used as a surface protective film for the purpose of protecting circuits. For the photosensitive polyimide, several methods for imparting photosensitivity are known. A representative one is Japanese Patent Publication Sho 55-41.
No. 422, a carboxylic acid of a polyamic acid is esterified with hydroxyethyl acrylate, or a polyamic acid as proposed in JP-A-54-145794 is blended with an amino acrylate. However, it is known to introduce a photosensitive group by a salt bond. These materials include photosensitive materials (photoradical initiators, polyfunctional acrylate monomers), etc., such as N-methylpyrrolidone (NMP) and N, N-dimethylacetamide (DMA).
C) or the like is dissolved in a polar solvent and applied on a substrate such as a silicon wafer, and then exposed in a pattern using an actinic ray,
After developing and forming a pattern, it is heated at 300 ° C. or higher to imidize polyamic acid and decompose and volatilize the added photosensitive material to obtain a desired polyimide. However, since the photosensitive material does not completely volatilize even when heated and remains in the film, there is a problem that the physical properties (adhesive strength, elastic modulus, heat resistance, etc.) of the film after heating deteriorate. As a method for solving the above problem, a method using a polyamic acid and a photobase generator has been reported. this is,
In the presence of a base catalyst, the imidization reaction of polyamic acid is 3
This is an application of promotion at a low temperature of 00 ° C. or lower. For example, Polym. Bull. Volume 30, 369
As shown in page 1993, the o-nitrobenzyl carbamate derivative generates a base upon irradiation with light, so that it is exposed through a mask to generate a base only in the exposed portion, and then heated. Then, only the exposed portion is imidized and developed with a solvent or an alkaline aqueous solution in which the polyamic acid in the unexposed portion is dissolved to produce a negative pattern.

[0003]

However, in the case of conventional photobase generators, since the base generated by light irradiation is a primary or secondary amine, the basicity is low and the ability to promote imidization is low. There was a flaw. Furthermore, since the base generation efficiency of these photobase generators upon irradiation with actinic rays is very low, long-time exposure is required, and there is a problem that the process cannot be shortened.

In the present invention, amine imide is used as a photobase generator capable of efficiently generating a sufficiently strong base even at a low exposure amount.
Provided are a photosensitive resin composition used in combination with a polyamic acid, a method for producing a relief pattern, and a method for producing a heat-resistant coating film.

[0005]

Means for Solving the Problems The present invention has been intensively studied in view of the above, and as a result, an amine imide compound efficiently generates a tertiary amine which is a strong base upon irradiation with actinic rays, and the imidization reaction of a polyamic acid is carried out at a low temperature. I found that it can be promoted. Generation of a tertiary amine by heating an amine imide compound is described in JP-A-10-139748, but generation of a tertiary amine by irradiation of actinic rays is not described. The present invention is [1] a photosensitive resin composition comprising (a) an amine imide compound which generates a base upon irradiation with actinic rays, and (b) a polyamic acid. The present invention is the photosensitive resin composition according to the above [1], which further comprises [2] (c) a singlet or triplet sensitizer. Further, the present invention is characterized in that the singlet or triplet sensitizer [3] (c) is at least one of a naphthalene derivative, an anthracene derivative, a carbazole derivative, a thioxanthone derivative and a benzophenone derivative. ] It is a photosensitive resin composition of description. Also,
In the present invention, [4] a coating film comprising the photosensitive resin composition according to any one of the above [1] to [3] is irradiated with actinic rays in a pattern and heated at 50 to 180 ° C., A relief pattern manufacturing method is characterized in that an unirradiated portion is developed and removed. Further, the present invention is [5] a method for producing a heat-resistant coating film, which comprises irradiating an entire surface of the coating film made of the photosensitive resin composition with an actinic ray and heating at 80 to 300 ° C. is there.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The amine imide compound used in the present invention is not particularly limited as long as it is a compound which generates a base upon irradiation with actinic rays. For example, a typical amine imide compound is represented by the following general formula (1) or (2),

[Chemical 1] In the formula, R ¹ , R ² and R ³ are independently hydrogen, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkylidene group having 1 to 8 carbon atoms, and a cycloalkyl having 4 to 8 carbon atoms. Group, C4-8 cycloalkenyl group, C1-6 phenoxyalkyl group, phenyl group, electron-donating group and /
Alternatively, a phenyl group substituted with an electron-withdrawing group, a benzyl group, a benzyl group substituted with an electron-donating group and / or an electron-withdrawing group, and the like can be given. As the alkyl group having 1 to 8 carbon atoms, in addition to a linear alkyl group, an alkyl group having a substituent, for example, an isopropyl group, an isobutyl group,
Also includes t-butyl group and the like. Among these substituents, from the viewpoint of ease of synthesis, solubility of amine imide, etc., the number of carbon atoms is 1 to 1.
An alkyl group having 8 carbon atoms, a cycloalkyl group having 6 to 8 carbon atoms, and a phenoxyalkyl group having 1 to 6 carbon atoms are preferable. Also,
R ⁴ independently represents an alkyl group having 1 to 5 carbon atoms, a hydroxyl group, a cycloalkyl group having 4 to 8 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or a phenyl group. Ar ¹ in the general formula (1) is an aromatic group represented by the general formulas (I) to (XIII),

[Chemical 2] In the formula, R ^{5 to} R ²⁸ are independently hydrogen, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkylthio group having 1 to 8 carbon atoms, an alkylidene group having 1 to 8 carbon atoms, and carbon. Cycloalkyl group having 4 to 8 carbon atoms, cycloalkenyl group having 4 to 8 carbon atoms, amino group, alkylamino group having 1 to 6 carbon atoms, dialkylamino group having 1 to 3 carbon atoms, morpholino group, mercapto group, hydroxyl group, Hydroxyalkyl group having 1 to 6 carbon atoms, halogen such as fluorine, chlorine and bromine, ester group having 1 to 6 carbon atoms, carbonyl group having 1 to 6 carbon atoms, aldehyde group, cyano group, trifluoromethyl group, cyano group , A nitro group, a benzoyl group, a phenyl group, a phenyl group substituted with an electron-donating group and / or an electron-withdrawing group,
A benzyl group substituted with an electron-donating group and / or an electron-withdrawing group. Further, in the formula, U to Z are any of carbon, nitrogen, oxygen and sulfur atoms. Ar ² in the general formula (2) is an aromatic group represented by the following formulas (XIV) to (XXII),

[Chemical 3] R ^{29 to} R ³⁶ are independently hydrogen, an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkylthio group having 1 to 8 carbon atoms, an alkylidene group having 1 to 8 carbon atoms, and 4 carbon atoms.
~ 8 cycloalkyl group, C4-8 cycloalkenyl group, amino group, C1-6 alkylamino group,
A dialkylamino group having 1 to 3 carbon atoms, a morpholino group,
Mercapto group, hydroxyl group, hydroxyalkyl group having 1 to 6 carbon atoms, halogen such as fluorine, chlorine and bromine, and 1 to 1 carbon atoms
6 ester group, carbonyl group having 1 to 6 carbon atoms, aldehyde group, cyano group, trifluoromethyl group, cyano group,
A phenyl group substituted with a nitro group, a phenyl group, an electron-donating group and / or an electron-withdrawing group, an electron-donating group and
Or a benzyl group substituted with an electron-withdrawing group. In the formula, W is carbon, nitrogen, nitrogen substituted with an alkyl group having 1 to 6 carbon atoms, oxygen, and sulfur, and X to Z are independently carbon, nitrogen, oxygen, and sulfur atoms. From the viewpoints of thermal stability and absorption wavelength similar to Ar ¹ , the substituent of R ^{29 to} R ³⁶ is preferably a carbonyl group having 1 to 6 carbon atoms, which is an electron-withdrawing group, a cyano group, or a nitro group. .

A known method can be used for the synthesis of the amine imide compound. For example, Encycled
ia of Polymer Science and
Engineering, John Wiley &
Sons Ltd. , (1985), Volume 1, p74
0, it can be obtained from the reaction of the corresponding carboxylic acid ester with a halogenated hydrazine and sodium alkoxide, or the reaction of the carboxylic acid ester with a hydrazine and an epoxy compound. Considering the convenience and safety of the synthesis, the synthetic method from the corresponding carboxylic acid ester, hydrazine and epoxy compound is particularly preferable. The synthesis temperature and the synthesis time are not particularly limited as long as the starting materials used are not decomposed, but generally, the desired amine imide compound is obtained by stirring at a temperature of 0 to 100 ° C. for 30 minutes to 7 days. Obtainable.

As the polyamic acid used in the present invention, known ones can be used without particular limitation.
The thing obtained by addition-polymerizing a tetracarboxylic dianhydride and a diamine compound is mentioned.

Examples of the tetracarboxylic dianhydride include pyromellitic dianhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride, 3,3',
4,4'-biphenyltetracarboxylic dianhydride, 1,
2,5,6-naphthalenecarboxylic acid dianhydride, 1,2,
3,6,7-naphthalenetetracarboxylic dianhydride,
2,3,5,6-pyridinetetracarboxylic dianhydride,
1,4,5,8-naphthalenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 4,4'-sulfonyldiphthalic dianhydride, m-
Terphenyl-3,3 ", 4,4" -tetracarboxylic dianhydride, p-terphenyl-3,3 ", 4,4" -tetracarboxylic dianhydride, 4,4'-oxydiphthalic acid dianhydride Anhydrous, 1,1,1,3,3,3-hexafluoro-2,
2-bis (2,3-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) Propane dianhydride, 1,1,1,3
3,3-hexafluoro-2,2'-bis [4- (2,3-
Dicarboxyphenoxy) phenyl] propane dianhydride,
1,1,1,3,3,3-hexafluoro-2,2'-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride may be mentioned. These tetracarboxylic dianhydrides are used alone or in combination of two or more.

Examples of the diamine compound include p-phenylenediamine, m-phenylenediamine, p-xylylenediamine, m-xylylenediamine, 1,5-diaminonaphthalene, benzidine, 3,3'-dimethylbenzidine, and 3 , 3'-dimethoxybenzidine, 4,4 '
(Or 3,4'-, 3,3'-, 2,4 '-)-diaminodiphenylmethane, 4,4' (or 3,4'-, 3,
3'-, 2,4 '-)-diaminodiphenyl ether,
4,4 '(or 3,4'-, 3,3'-, 2,4'-)
-Diaminodiphenyl sulfone, 4,4 '(or 3,
4'-, 3,3'-, 2,4 '-)-diaminodiphenyl sulfide, 4,4'-benzophenone diamine,
3,3'-benzophenone diamine, 4,4'-di (4
-Aminophenoxy) phenyl sulfone, 4,4'-bis (4-aminophenoxy) phenyl sulfone, 4,
4'-bis (4-aminophenoxy) biphenyl, 1,
4-bis (4-aminophenoxy) benzene, 1,3-
Bis (4-aminophenoxy) benzene, 1,1,1,
3,3,3-hexafluoro-2,2-bis (4-aminophenyl) propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 3,3-dimethyl-4,
4'-diaminodiphenylmethane, 3,3 ', 5,5'
-Tetramethyl-4,4'-diaminodiphenylmethane,
4,4'-di (3-aminophenoxy) phenyl sulfone, 3,3'-diaminodiphenyl sulfone, 2,2 '
-Bis (4-aminophenyl) propane, 4,4 '-(9
An aromatic diamine such as fluorenylidene) dianiline,
2,7-diaminofluorene, 2,6-diaminopyridine, 2,4-diaminopyridine, 2,4-diaminopyrimidine, 2,4-diamino-s-triazine, 2,7-diaminobenzofuran, 2,7-diamino Carbazole,
3,7-diaminophenothiazine, 2,5-diamino-
1,3,4-thiadiazole, 2,4-diamino-6-
Heterocyclic diamines such as phenyl-s-triazine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, 2,2-dimethylpropylenediamine,
Aliphatic diamines such as diaminopolysiloxane may be mentioned. These diamine compounds are used alone or in combination of two or more.

The amount of the (a) amine imide compound of the present invention added is preferably 0.1 to 50 parts by weight, more preferably 1 to 30 parts by weight, based on 100 parts by weight of the solid content of the (b) polyamic acid. . If the amount of the amine imide compound is less than 0.1 part by weight, the sensitivity becomes insufficient and the imidization cannot be promoted. On the other hand, when the amount exceeds 50 parts by weight, a large amount of the amine-imide photolysis product remains in the film after heating, so that the physical properties of the film tend to deteriorate.

As the sensitizer used in the present invention, known singlet sensitizers and triplet sensitizers can be used as long as they do not adversely affect the photosensitive resin composition. For example, aromatic compound derivatives such as naphthalene, anthracene, and pyrene, carbazole derivatives, aromatic carbonyl compounds, benzophenone derivatives, thioxanthone derivatives, and coumarin derivatives are preferably used. Of these, a naphthalene derivative, an anthracene derivative, a carbazole derivative is most preferable as the singlet sensitizer, and a thioxanthone derivative and a benzophenone derivative are most preferable as the triplet sensitizer. For example, 1-methylnaphthalene, 2-methylnaphthalene,
1-fluoronaphthalene, 1-chloronaphthalene, 2-
Chloronaphthalene, 1-bromonaphthalene, 2-bromonaphthalene, 1-iodonaphthalene, 2-iodonaphthalene, 1-naphthol, 2-naphthol, 1-methoxynaphthalene, 2-methoxynaphthalene, 1,4-dicyanonaphthalene, anthracene, 1,2-benzanthracene, 9,10-dichloroanthracene, 9,10-dibromoanthracene, 9,10-diphenylanthracene, 9-cyanoanthracene, 9,10-dicyanoanthracene, 2,6,9,10-tetracyano Anthracene, carbazole, 9-methylcarbazole, 9-phenylcarbazole, 9-prop-2-ynyl-9H-carbazole, 9-propyl-9H-carbazole, 9-
Vinylcarbazole, 9H-carbazole-9-ethanol, 9-methyl-3-nitro-9H-carbazole,
9-methyl-3,6-dinitro-9H-carbazole,
9-octanoylcarbazole, 9-carbazolemethanol, 9-carbazolepropionic acid, 9-carbazolepropionitrile, 9-decyl-3,6-dinitro
-9H-carbazole, 9-ethyl-3,6-dinitro-9H-carbazole, 9-ethyl-3-nitrocarbazole, 9-ethylcarbazole, 9-isopropylcarbazole, 9- (ethoxycarbonylmethyl) carbazole, 9- ( Morpholinomethyl) carbazole, 9-acetylcarbazole, 9-allylcarbazole, 9-benzyl-9H-carbazole, 9-carbazoleacetic acid,
9- (2-nitrophenyl) carbazole, 9- (4-methoxyphenyl) carbazole, 9- (1-ethoxy-
2-methyl-propyl) -9H-carbazole, 3-nitrocarbazole, 4-hydroxycarbazole, 3,6
-Dinitro-9H-carbazole, 3,6-diphenyl-9H-carbazole, 2-hydroxycarbazole,
3,6-Diacetyl-9-ethylcarbazole, benzophenone, 4-phenylbenzophenone, 4,4'-bis (dimethoxy) benzophenone, 4,4'-bis (dimethylamino) benzophenone, 4,4'-bis (diethylamino) Benzophenone, 2-benzoylbenzoic acid methyl ester, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 3,3'-
Dimethyl-4-methoxybenzophenone, 2,4,6-
Trimethylbenzophenone, [4- (4-methylphenylthio) phenyl] -phenylmethanone, xanthone,
Thioxanthone, 2-chlorothioxanthone, 4-chlorothioxanthone, 2-isopropylthioxanthone,
4-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 1-
Chloro-4-propoxythioxanthone may be mentioned.
These may be used alone or in combination of two or more. The amount of the sensitizer used is required to refer to the absorption wavelength and the molar extinction coefficient of the sensitizer, but it is generally 0.01 to 10 parts by weight with respect to 1 part by weight of the amine imide compound, 1 to 5 parts by weight is particularly preferred. No sensitizer.
If the amount is less than 01 parts by weight, the efficiency of light absorption becomes low and 10
If it exceeds the weight part, light may not reach the entire photosensitive resin composition.

The photosensitive resin composition of the present invention may optionally contain additives such as an adhesion improver such as a coupling agent, a leveling agent, a plasticizer, and an organic or inorganic filler.

The photosensitive resin composition of the present invention may use an organic solvent, if necessary. The solvent that can be used is not particularly limited as long as it has sufficient solubility in the amine imide compound and the polyamic acid. For example,
Acetone, acetonitrile, methyl ethyl ketone, diethyl ketone, cyclohexanone, toluene, chloroform, methanol, ethanol, 1-propanol, 2-
Propanol, 1-butanol, t-butanol, ethylene glycol monomethyl ether, xylene, tetrahydrofuran, dioxane, N, N-dimethylacetamide, N, N-dimethylformamide, N-methyl-2-
Pyrrolidone, γ-butyrolactone, dimethylsulfoxide, ethylene carbonate, sulfolane and the like can be mentioned. These organic solvents may be used alone or in combination of two or more. The amount of such an organic solvent used is not particularly limited, but from the viewpoint of coatability, the solid content of the composition is 5%.
The amount is preferably ˜95 wt%, more preferably 10 to 50 wt%.

The photosensitive resin composition of the present invention is applied onto a substrate such as a silicon wafer, a metal substrate, a glass substrate or a ceramic substrate by an immersion method, a spray method, a screen printing method, a spin coating method or the like, and an organic solvent is used. In the case where it contains, most of these organic solvents can be dried by heating to form a non-adhesive coating film. This coating film is irradiated with actinic rays in a pattern or on the entire surface. The actinic rays for irradiation include ultraviolet rays, far ultraviolet rays, visible light, electron beams,
There are X-rays. 80-300 after irradiation with actinic rays
Heat at 5 ° C. for 5 seconds to 1 hour to accelerate imidization. When the actinic ray is irradiated in a pattern, the unirradiated portion is dissolved and removed with an appropriate developing solution to obtain a desired relief pattern.

The developer is not particularly limited, but for example, an alkaline aqueous solution such as an aqueous solution containing sodium carbonate or tetramethylammonium hydroxide (TMH), N, N-dimethylformamide, N, N-dimethylacetamide, A mixed solution of a good solvent such as N-methyl-2-pyrrolidone and a poor solvent such as lower alcohol, water or aromatic hydrocarbon is used. Further, after development, in order to complete imidization, heating may be performed at 100 to 350 ° C. for 5 minutes to 2 hours. The relief pattern thus obtained can be processed by dry etching or the like on a passivation film formed using an inorganic material such as SiO ₂ or SiN.

[0017]

EXAMPLES The present invention will be specifically described below based on examples, but the present invention is not limited thereto.

Synthesis of amine imide 1 (amine imide 1) p-nitrobenzoic acid methyl ester (2.00 g, 11 m
mol), N, N-dimethylhydrazine (0.66 g, 11
mmol), phenyl glycidyl ether (1.66 g,
11 mmol) to tert-butanol (15.0 g)
After stirring at 50 ° C. for 10 hours and further stirring at room temperature (25 ° C.) for 48 hours, a white precipitate was formed. This was filtered off, washed twice with ethyl acetate and dried in a vacuum drier to obtain an amine imide compound. The yield was 3.67 g, the yield was 85%, and the melting point was 146 to 147 ° C.

Synthesis of amine imide 2 (amine imide 2) p-cyanobenzoic acid methyl ester (2.00 g, 12 m
mol), N, N-dimethylhydrazine (0.75 g, 1
2 mmol), phenyl glycidyl ether (1.86
g, 12 mmol) with tert-butanol (10 g)
After stirring at 50 ° C. for 72 hours, the mixture was further stirred at room temperature for 48 hours. After removing tert-butanol from the obtained reaction solution with a rotary evaporator, 10 g of ethyl acetate was added for recrystallization to obtain a white amineimide compound. Yield 2.74 g, yield 65%, melting point 14
It was 8-149 ° C.

(Example 1) N-methyl-polyamic acid obtained by reacting 4,4'-diaminodiphenyl ether and pyromellitic dianhydride in equimolar amounts by a conventional method
In 10 g of 2-pyrrolidone solution (solid content 20% by weight), the amine imide compound 1 obtained by the above-mentioned synthesis was added 0.0
4 g was blended to obtain a photosensitive resin solution. This photosensitive resin solution was spin-coated on a silicone wafer and heated on a hot plate at 100 ° C. for 200 seconds to form a photosensitive coating film. The film thickness after drying was 10 μm. After exposing the coating film through a photomask with a mirror projection exposure machine using an ultra-high pressure mercury lamp as a light source so that the irradiation amount of 366 nm becomes 3 J / cm ^2, and then at 60 ° C. at 150 ° C. on a hot plate.
Heated for a second. After that, immersion development was performed with a 1.68N TMH (tetramethylammonium hydroxide) aqueous solution, followed by rinsing with pure water, and a negative relief pattern in which the pattern of the exposed portion remained was obtained.

Example 2 Except that 0.04 g of amine imide 2 was used in place of amine imide 1 and 0.02 g of benzophenone was used as a sensitizer.
When pattern formation was attempted in the same manner as in Example 1, a negative relief pattern in which the pattern of the exposed portion remained was obtained.

(Comparative Example 1) A pattern formation was tried in the same manner as in Example 1 except that the amine imide compound 1 was not added. As a result, irrespective of exposed and unexposed areas, all were dissolved during development and a relief pattern was obtained. I couldn't do it.

[0023]

EFFECTS OF THE INVENTION According to the present invention, it is possible to provide a curable composition which promotes imidization of polyamic acid at low temperature by irradiation with light and is excellent in storage stability.

Claims (5)

[Claims] 1. A photosensitive resin composition comprising (a) an amine imide compound which generates a base upon irradiation with actinic rays, and (b) a polyamic acid. 2. The photosensitive resin composition according to claim 1, further comprising (c) a singlet or triplet sensitizer. 3. The photosensitive material according to claim 2, wherein the singlet or triplet sensitizer (c) is at least one of a naphthalene derivative, an anthracene derivative, a carbazole derivative, a thioxanthone derivative and a benzophenone derivative. Resin composition. 4. A coating film comprising the photosensitive resin composition according to any one of claims 1 to 3 is irradiated with actinic rays in a pattern and heated at 50 to 180 ° C., and then an unirradiated portion. Is removed by development. 5. A heat resistance characterized in that a coating film comprising the photosensitive resin composition according to any one of claims 1 to 3 is irradiated with actinic rays on the entire surface and heated at 80 to 300 ° C. For producing a transparent coating film.