JP2003033645A - Decomposition treatment device of gaseous organic halogen compound and decomposition treatment device of liquid organic halogen compound applying the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a decomposition treatment device of gaseous organic halogen compound and a decomposition treatment device of liquid organic halogen compound provided with the same device. SOLUTION: This decomposition treatment device of gaseous organic halogen compound is provided with a gas introducing means which guides a gaseous organic halogen compound to a thermal decomposition means, the thermal decomposition means which generates decomposition gas by subjecting the gaseous organic halogen compound to the contact thermal decomposition with a heat generator and subjecting the gaseous organic halogen compound to the thermal decomposition due to radiation heat and a gas discharging means which supplies the gaseous organic halogen compound to the thermal decomposition means via the gas introducing means and discharges the decomposition gas which is generated by thermally decomposing the gaseous organic halogen compound in the thermal decomposition means from the thermal decomposition means. Further, this decomposition treatment device of liquid organic halogen compound has a constitution which consists of the decomposition treatment device of gaseous organic halogen compound and a gasification means which gasifies liquid organic halogen compounds.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a decomposition treatment apparatus suitable for decomposing a gaseous organic halogen compound, and more particularly to a gas particularly suitable for decomposing a gaseous PCB or other harmful gases. The present invention relates to a decomposition treatment apparatus for organic halogen compounds. In addition, the present invention relates to a liquid organic halogen compound decomposition treatment apparatus to which the gaseous organic halogen compound decomposition treatment apparatus is applied.

[0002]

2. Description of the Related Art Organic halogen compounds, such as polychlorinated biphenyls (hereinafter referred to as PCBs), have high resistance to acids and alkalis and are chemically stable, and are extremely stable thermally and excellent in electrical insulation. Since it exists in a wide variety of forms from liquid to solid, it is used in large quantities in a wide range of fields, regardless of application, as insulating oil such as transformers and capacitors, plasticizers such as electric wires, and heat medium in various processes such as various chemical industries. Has been used.

[0003]

However, when PCB is burned, harmful gas such as dioxin is generated and causes environmental pollution. Due to bioconcentration due to food chain, harmful substances caused by PCB, especially through seafood, are It was discovered that it was accumulated in the body, and PCB production was banned in 1972. As a result, the direct pollution problem due to the manufacture of PCB was avoided, but PCB is widely used due to its high versatility, and this time the treatment and disposal of PCB has become a new problem. .

That is, when a normal incineration process is performed to dispose and dispose of PCB, harmful substances such as dioxins are generated due to the low incineration temperature in the normal incineration process, and these harmful substances are emitted in the atmosphere along with smoke. It is released into the air and causes further air pollution. For this reason, PCBs cannot be easily processed and disposed of, and in reality, local governments store the collected PCBs as specially controlled substances in storages and the like.

Under these circumstances, various PCB treatment methods have been studied, and as a typical decomposition treatment method,
The high temperature incineration method and the alkali dechlorination method can be mentioned. However, when the PCB is treated by this high-temperature incineration method, if the incineration is insufficient, harmful gases such as gaseous PCB and dioxins are released from the incinerator into the atmosphere. As a result, the surrounding environment of the incinerator is polluted, and there is a potential demand for a treatment device for treating gaseous PCB and other harmful gases in a harmless form.

Further, in the case of liquid PCB, if the amount to be treated is small, it can be treated in this high temperature incinerator.
When it became a large amount, this high temperature incinerator could not process it all at once. This also applies to the alkaline dechlorination method. Therefore, there is also a potential demand for the treatment of liquid PCBs.

Therefore, an object of the present invention is to provide a decomposition treatment apparatus suitable for decomposing a gaseous harmful compound such as a gaseous PCB or dioxin, that is, a decomposition treatment apparatus for a gaseous organic halogen compound. In addition, another object is to provide a decomposition treatment apparatus for liquid organic halogen compounds.

[0008]

Therefore, the present inventors have
As a result of intensive studies, the above problems have been solved by the following constitution. That is, gas introduction means for introducing the gaseous organic halogen compound to the thermal decomposition means, and a primary decomposition part and the primary decomposition part for thermally decomposing the gaseous organic halogen compound introduced by the gas introduction means in contact with a heating element. A secondary decomposition part for thermally decomposing a mixed gas of a decomposition gas obtained by thermally decomposing the gaseous organic halogen compound and an undecomposed gaseous organic halogen compound by passing through a hole formed in the heating element and radiant heat. A thermal decomposition means provided with, the gaseous organic halogen compound is supplied to the thermal decomposition means through the gas introduction means, and a decomposition gas obtained by thermally decomposing the gaseous organic halogen compound in the thermal decomposition means And a gas discharge means for discharging from the thermal decomposition means (claim 1).

According to this structure, the gaseous organic halogen compound is reliably guided to the thermal decomposition means due to the presence of the gas introduction means. Then, the thermal decomposition means decomposes through two stages of thermal decomposition, that is, contact thermal decomposition by contact with the heating element and thermal decomposition by radiant heat when passing through the hole formed in the heating element, to become decomposed gas. Therefore, no harmful organohalogen compound is discharged to the downstream side of the decomposition apparatus for the gaseous organohalogen compound.

Further, the heating element is made of a tubular body whose both ends are sealed, and a hole for communicating the inside and the outside of the tubular body is provided on the outer peripheral surface thereof, and the gas introducing means is A tube for guiding the gaseous organic halogen compound into the inside of the tubular body is used (claim 2).

According to this structure, since the gaseous organic halogen compound is introduced into the cylindrical body whose both ends are sealed, it is more surely contacted with the heating element and thermally decomposed.
Since it always passes through the hole provided in this heating element and is discharged to the outside of the tubular body that is this heating element, it is provided on the outer peripheral surface of this tubular body even if it does not contact the heating element. When passing through the created holes, it is surely decomposed by radiant heat.

Further, a discharging means for discharging the liquid organic halogen compound by a predetermined amount and the liquid organic halogen compound discharged by the discharging means are dropped into a heated cylinder and vaporized in the cylinder. 3. A vaporizing means for converting the vaporized organic halogen compound into a gaseous organic halogen compound, and a decomposition treatment apparatus for the gaseous organic halogen compound according to claim 1 or 2, which thermally decomposes the gaseous organic halogen compound vaporized by the vaporizing means. And a recovery means for recovering the decomposition products contained in the decomposition gas generated in the decomposition apparatus for the gaseous organic halogen compound by attaching and reacting the decomposition products (claim 4).

According to this structure, the liquid organic halogen compound is converted into the gaseous organic halogen compound in the vaporizing means, and the gaseous organic halogen compound is surely decomposed by the decomposition apparatus for the gaseous organic halogen compound.
Therefore, even a liquid organic halogen compound can be decomposed without any problem.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings. The apparatus for decomposing a gaseous organic halogen compound according to the present invention is an apparatus for detoxifying a harmful gas such as an organohalogen compound supplied in a gaseous state by thermally decomposing it by heating. Further, the liquid organic halogen compound decomposition treatment device is a device for heating a liquid organic halogen compound into a gaseous organic halogen compound once, and thermally decomposing this into a detoxifying treatment. .

Here, the gaseous organic halogen compound in the present embodiment is, for example, a halogen-containing compound-based harmful gas such as polychlorinated biphenyl (hereinafter referred to as PCB) or dioxin. The liquid organohalogen compound is, for example, a liquid PCB.

FIG. 1 is a schematic configuration diagram of a decomposition treatment apparatus 1 for a gaseous organic halogen compound according to the present invention. Figure 2 (a)
FIG. 2B is a sectional view of a main part of the decomposition treatment apparatus 1 for a gaseous organic halogen compound according to the present invention. The apparatus 1 for decomposing a gaseous organic halogen compound includes a gas introduction means 2, a thermal decomposition means 3, a heating means 4, and a gas discharge means 5.

The gas introducing means 2 of the apparatus 1 for decomposing a gaseous organic halogen compound guides a gaseous PCB and various harmful gases (hereinafter referred to as a gas to be treated) to the thermal decomposing means 3 described later. As shown in FIGS. 1 and 2, in the present embodiment, the gas introduction means 2 is a circular pipe 10 having a predetermined length, and the gas to be treated is inserted into the hole 11 of the circular pipe 10. Then, it is introduced into the cylinder 12 of the thermal decomposition means 3 described later. The material forming the circular tube 10 has high heat resistance, little expansion and contraction due to heat, and is not easily induction-heated.
There is no particular limitation as long as it is a material having such characteristics. Alumina is used in this embodiment. Further, the diameter of the circular tube 10 can also be appropriately selected according to the size of the decomposition apparatus 1 for the gaseous organic halogen compound and the processing amount of the gas to be processed. In this embodiment, the 28 mmφ circular tube 10 is used.

The thermal decomposition means 3 of the apparatus 1 for decomposing gaseous organic halogen compounds is formed into a heating element by contact pyrolysis of the gas to be treated introduced by the gas introducing means 2 by contact with the heating element. Applied through two holes (slit 14) and radiant heat is applied,
Converts to harmless gaseous substances.

The heating element of this embodiment is a cylinder 12 whose both ends are sealed (see FIGS. 1 to 2B). On one end face of the cylinder 12, the gas introducing means 2
The circular tube 10 is inserted, and the tip of the inserted circular tube 10 is arranged so as to extend to the other end side in the cylinder 12.
Further, slits 14, 14, ... Which communicate the inside and outside of the cylinder 12 are provided on the outer peripheral surface of the cylinder 12 on the one end side where the circular tube 10 is inserted, from one end side to the other end side of the cylinder 12. It is provided in plural toward. The slits 14, 14, ... Are provided at two positions that are point-symmetrical with respect to the center of the cylinder 12 (see FIG. 2A).

Therefore, the gas to be treated supplied to the heating element is always supplied to the other end of the cylinder 12. Then, the gas to be treated introduced to the other end of the cylinder 12 is
Flowing in the cylinder 12, the slit 14, from the other end side,
14 is moved to one end side where the slit 1 is provided, and the slit 1
It passes through 4, 14, ... And is discharged to the outside of this cylinder 12.

Since the cylinder 12 is heated by the heating means 4 which will be described later, the gas to be treated introduced into the cylinder 12 moves through the slit 1 inside the cylinder 12.
When moving to the side of 4, 14, ... (One end side), the inner wall surface of the heated cylinder 12 is contacted and pyrolyzed. Even when the gas to be processed does not come into contact with the inner wall surface of the cylinder 12, when passing through the slits 14, 14, ... Provided in the cylinder 12, the slits 14, 14, ... Therefore, it is decomposed by radiant heat. Therefore, the gas to be treated is not discharged from the slits 14 of the cylinder 12, but only the decomposed gas decomposed into a harmless state is discharged.

Here, the diameter can be appropriately selected according to the diameter of the cylinder 12, the size of the apparatus, and the amount of gas to be treated.
In this embodiment, the cylinder 12 having a diameter of 35 mm is used. Further, the material forming the heating element can be appropriately selected such as molybdenum, SUS, and incoloy.

When molybdenum is used as the heating element, the heat resistance of molybdenum is 2800 ° C., which is better than that of other materials. Since it gives white light when heated and has a high energy density, There is an advantage that the processing gas can be decomposed by radiant heat without touching the heating element. Further, when Incoloy, which is a nickel alloy, is used as the heating element, there is an advantage that the catalytic action of nickel converts the organic matter in the gas to be treated, which is in contact with the heating element, into carbon and is recovered. Therefore, it is preferable to use incoloy rather than SUS and molybdenum rather than incoloy as the material forming the heating element.

Further, the number of slits 14, 14 ... Provided in the cylinder 12 and the slit width can be appropriately selected.
In the present embodiment, the slit width is 2 mm.

In the present embodiment, as shown in FIG. 1, a high frequency coil 15 serving as heating means 4 is provided at a position separated from the outer peripheral surface of the heating element by a predetermined distance. Therefore, when a high frequency current is applied to the high frequency coil 15 to heat the heating element, an eddy current is generated on the outer peripheral surface of the cylinder 12 of the heating element. At this time, the slits 14, 14
Since no current can flow in the ... portion, the portion between the slits 14, 14 (hereinafter, referred to as the narrow portion 16).
Current concentrates on. As a result, each interstitial portion 16 is heated to a higher temperature than the other portions of this cylinder 12. for that reason,
The spaces inside the slits 14, 14 ... Also become high-temperature bodies. Therefore, even if the gas to be treated is guided to the slits 14, 14 ... Without contacting the inner wall surface of the cylinder 12, it is reliably thermally decomposed by radiant heat when passing through the slits 14, 14. .

Further, on the inner wall surface of the cylinder 12, as shown in FIG.
The life ring 17 shown may be provided from the other end side of the cylinder 12 toward the one end side. In this case, the gas to be treated supplied to the other end of the cylinder 12 is guided to the one end where the slit 14 is provided while being spirally stirred by the existence of the life ring 17. Therefore, the chances of contact between the gas to be processed and the cylinder 12 increase, and the gas to be processed is catalytically decomposed more efficiently.

The heating means 4 of the decomposition treatment apparatus 1 for the gaseous organic halogen compound heats the thermal decomposition means 3.

The heating means 4 is provided with an alumina chamber 18 for accommodating the thermal decomposition means 3 therein and at a position separated from the outer peripheral surface of the alumina chamber 18 by a predetermined distance.
The high-frequency coil 15 is spirally wound from one end side to the other end side of the alumina chamber 18 (see FIGS. 1 and 2). This high frequency coil 15
Is connected to a current-controlled high frequency power source (not shown). Therefore, by changing the electric power supplied to the high-frequency coil 15, the thermal decomposition means 3 housed in the alumina chamber 18 is induction-heated and appropriately heated to a desired temperature.

The gas discharging means 5 of the apparatus 1 for decomposing gaseous organic halogen compounds guides the gas to be treated into the heat decomposing means 3 and decomposes it by decomposing the gas to be treated. The gas is discharged from the thermal decomposition means 3.

In the present embodiment, the gas discharging means 5 is a general vacuum pump (not shown) connected to the downstream side of the thermal decomposition means 3 via a pipe. This vacuum pump sucks the gas to be treated through the circular pipe 10 of the gas introduction means 2 and introduces it into the cylinder 12 of the thermal decomposition means 3. Then, when passing through the inside of the cylinder 12 and / or the slit 14 provided in the cylinder 12, the decomposed gas generated by the thermal decomposition of the gas to be treated is sucked and discharged to the downstream side of the thermal decomposition means 3. .

If necessary, a trapping means for adsorbing or reacting the decomposed matter contained in the decomposed gas to recover it is provided between the gas discharge means 5 and the thermal decomposition means 3. It is also possible to do so.

Next, the thermal decomposition means 3 and the gas introduction means 2
A second aspect of the present invention will be described with reference to FIG. In addition,
The same parts as those of the decomposition apparatus 1 for the gaseous organic halogen compound of the first aspect are designated by the same reference numerals, and the description thereof will be omitted.

The apparatus 20 for decomposing gaseous organic halogen compounds according to the second aspect of the present invention includes a gas introducing means 2a, a thermal decomposing means 3a and a heating means 4 as main parts, and further a gas discharging means 5 (see FIG. (Not shown) is provided on the downstream side. Here, since the heating means 4 and the gas discharging means 5 (not shown) of the decomposition treatment apparatus 20 for the gaseous organic halogen compound have the same configuration as the decomposition treatment apparatus 1 for the gaseous organic halogen compound, the description thereof will be omitted. .

The heating element of the thermal decomposition means 3a of the apparatus 20 for decomposing gaseous organic halogen compounds is a cylinder 22 whose both ends are sealed (see FIG. 3). In the cylinder 22, the gas introducing means 2a is arranged from one end surface toward the other end surface.
The circular pipe 23, which is a hole, is provided so as to penetrate therethrough. On the outer peripheral surface of the portion of the circular tube 23 located in the cylinder 22,
A plurality of discharge holes 24, 24 ... Are provided. Then, on the outer peripheral surface of the cylinder 22 in which the circular tube 23 is inserted, the cylinder 2
A plurality of slits 14, 14, ... That communicate the inside and the outside of 2 are provided. The downstream end of the circular pipe 23 is sealed.

Therefore, the gas to be processed supplied to the heating element is discharged through the discharge holes 24 formed in the outer peripheral surface of the circular pipe 23.
24 is supplied into the cylinder 22. Then, the gas to be processed supplied into the cylinder 22 is
Is discharged to the outside of the cylinder 22 through the slits 14, 14 ...

Since the cylinder 22 is heated by the heating means 4, the gas to be treated introduced into the cylinder 22 is heated when the inside of the cylinder 22 moves to the slit 14 side. The inner wall surface of the formed cylinder 22 is contacted and decomposed. Further, even when the gas to be treated does not come into contact with the inner wall surface of the cylinder 22, it is thermally decomposed by radiant heat when passing through the slits 14, 14, ... Provided in the cylinder 22. Therefore, the gas to be treated is not discharged from the slit 14 of the cylinder 22, but only the decomposed gas decomposed into a harmless state is discharged, and the decomposition treatment of the gas to be treated is achieved.

Here, the diameter of the cylinder 22, the material, the number of the slits 14, 14, ..., The slit width, etc. can be appropriately selected in the same manner as in the first embodiment. Further, the life ring 17 may be provided on the inner wall surface of the cylinder 22 in order to efficiently stir the gas to be treated.

Further, the discharge hole 2 provided in the circular pipe 23
4 and 24 and slits 14 and 14 provided in the cylinder 22.
The positional relationship with ... Is arranged so as to be displaced from each other so that the gas to be processed discharged from the discharge holes 24, 24 ... Is not discharged directly from the slits 14, 14. preferable. In this embodiment, the slit 14 is provided in the direction of 90 ° C. with respect to the discharge hole 24 (see FIG. 3b).

Further, a third mode of the thermal decomposition means 3 and the gas introduction means 2 will be described with reference to FIG.
The decomposition treatment apparatus 30 for a gaseous organic halogen compound according to the third aspect of the present invention has a gas introducing means 2b as a main part,
It comprises a thermal decomposition means 3b and a heating means 4, and further comprises a gas discharge means 5 (not shown) on the downstream side. Here, since the heating means 4 and the gas discharging means 5 have the same structure as the decomposition treatment apparatus 1 for the gaseous organic halogen compound, the description thereof will be omitted.

The gas introducing means 2b and the thermal decomposing means 3b of the decomposition treatment apparatus 30 for the gaseous organic halogen compound are housed in the housing portion 31, respectively. This housing part 31
Is composed of a tubular outer tubular portion 32 and a lid 33 screwed on both ends of the outer tubular portion 32 with screws 34. Inside the casing 31, an alumina chamber 35 having a cylindrical shape is provided.
, But is housed in a state of being sandwiched by the lid 33 via O-rings 36 provided at both ends thereof.

On the upstream side of the casing 31, a circular tube 2b for inserting the gas to be treated into the decomposition apparatus 30 for the gaseous organic halogen compound is inserted, and the tip of the circular tube 2b is the alumina. It is fitted in a recess 38 of an upstream projection 37 provided so as to project inward on the upstream side of the chamber 35. On the other hand, on the downstream side of the casing 31, a discharge pipe 39 for discharging the decomposed gas obtained by decomposing the gas to be treated is inserted, and the tip of the discharge pipe 39 is
It is fitted into a recess 41 of a downstream projection 40 that is provided on the downstream side of the alumina chamber 35 so as to project inward.

Upstream projection 3 of the alumina chamber 35
A cylinder 42, which is the thermal decomposition means 3b, is provided between the upstream projection 37 and the downstream projection 40 between the 7 and the downstream projection 40. A partition wall 43 that partitions the space inside the cylinder 42 into an upstream hollow portion 44 and a downstream hollow portion 45 is provided inside the cylinder 42.

The cylinder 42 is provided on the outer peripheral surface at a position corresponding to the upstream hollow portion 44 and the downstream hollow portion 45 of the cylinder 42.
14a, 14a for communicating the inside and outside of the
, And a plurality of slits 14b, 14b are provided. The upstream hollow portion 44 and the downstream hollow portion 45 are formed between the portion of the alumina chamber 35 surrounded by the upstream projection 37 and the downstream projection 40 and the outer peripheral surface of the cylinder 42. A contact space 46 for contact is formed.

Here, the cylinder 42 is the heating means 4
Is induction heated by the high frequency coil 15 of
The gas discharge means 5 (not shown) causes a gas flow from the upstream side to the downstream side of the cylinder 42.

Therefore, the gas to be treated introduced through the circular pipe 2b into the decomposition treatment apparatus 30 for the gaseous organic halogen compound is first the inner wall of the upstream hollow portion 44 of the cylinder 42 or the partition wall 43. And is thermally decomposed by contact with the slit 14a provided in the upstream hollow portion 44,
When being introduced into the communication space 46 through 14a ..., It is thermally decomposed by radiant heat. Further, it passes through the slits 14b, 14b ... From within the communication space 46 and is guided into the downstream hollow portion 45.

Therefore, even if the gas introduced from the upstream hollow portion 44 into the communication space 46 contains the undecomposed gas to be treated, this undecomposed gas is again thermally decomposed by radiant heat. In addition, there is an opportunity to undergo catalytic thermal decomposition due to contact with the inner wall surface of the downstream hollow portion 45. As a result, the vaporized gas of the halogen compound is surely decomposed into harmless decomposition gas.

The alumina chamber 3 of the guide tube 2b
A communication hole 47 is provided on the outer peripheral surface of the position accommodated in 5, so that the inside and the outside of the guide tube 2b communicate with each other. Further, on the upstream side of the alumina chamber 35,
Evacuation holes 48, 48 ... Which communicate the inside and outside of the alumina chamber 35 are provided.

Therefore, by operating the vacuum pump (not shown) of the decompression means 4 located in the downstream of the apparatus 30 for decomposing the gaseous organic halogen compound, upstream of the apparatus 30 for decomposing the gaseous organic halogen compound. When a gas flow from the side to the downstream side occurs, the alumina chamber 35
The gas in the space 49 between the outer peripheral surface of the housing 31 and the casing 31 is also sucked, and the space 49 is kept under a reduced pressure atmosphere.

Since the high frequency coil 15 of the heating means 4 is housed in the space 49, keeping the space 49 in a reduced pressure atmosphere prevents deterioration of the high frequency coil 15 due to oxidation. Become. In addition, this space 4
Since the inside of 9 is kept under a reduced pressure atmosphere, the heat applied to the thermal decomposition means 3b heated by the high frequency coil 15 is not released to the outside of the casing 31 by heat transfer. Therefore, all the heat can be used for heating the cylinder 42 of the thermal decomposition means 3b without causing heat loss.

Next, a decomposition treatment apparatus 50 for a liquid organic halogen compound, to which the decomposition treatment apparatus for a gaseous organic halogen compound of the present invention is applied, will be described.

FIG. 5 is a schematic block diagram of a decomposition treatment apparatus 50 for a liquid organic halogen compound to which the decomposition treatment apparatus for a gaseous organic halogen compound of the present invention is applied. The apparatus 50 for decomposing a liquid organic halogen compound is as follows.
The storage means 51, the discharging means 52, the vaporizing means 53, the decomposition processing means 54, the capturing means 55, and the depressurizing means 56 are included.

The storage means 51 of the liquid organic halogen compound decomposition treatment apparatus 50 stores the liquid PCB.
This storage means 51 includes a slide gate valve 60, a first
The storage tank 61 and the second storage tank 62 are included.

The slide gate valve 60 of the storage means 51 is interposed between the first storage tank 61 and the inlet 63 having a funnel shape, and the liquid PCB can be introduced into the first storage tank 61. After the completion, it is closed to prevent the excess atmosphere from mixing into the first storage tank 61. The first storage tank 61 is provided on the lower side of the slide gate valve 60 and stores the liquid PCB input through the slide gate valve 60. The second storage tank 62 is
The liquid PCB, which is provided below the first storage tank 61 via a supply valve 64 and is discharged from the first storage tank 61, is stored under a reduced pressure atmosphere.

The formation of the depressurized atmosphere in the second storage tank 62 is performed by the vacuum pump 9 of the depressurizing means 56 described later.
3 supplies the atmosphere led together with the liquid PCB supplied to the second storage tank 62 to the second storage tank 6
It is performed by discharging the gas through a vacuum exhaust pipe 65 provided on the upper part of 2.

The supply valve 64 interposed between the first storage tank 61 and the second storage tank 62 is opened and closed by the upper limit liquid level sensor 66 and the lower limit liquid provided in the second storage tank 62. By the surface sensor 67, the second storage tank 6
The amount of the liquid PCB stored in 2 is detected, and it is appropriately performed based on the detection result. Similarly, the opening / closing of the slide gate valve 60 is appropriately performed based on the detection result of the liquid level sensor 68 provided in the first storage tank 61.

Therefore, this storage means 51 is a liquid PC.
At the time of decomposing B, the atmosphere is mixed on the downstream side of the storage means 51 (from the vaporization means 53 to the capture means 55),
This prevents the degree of pressure reduction in the decomposition treatment device 50 for the liquid organic halogen compound from decreasing. That is, a structure is formed in which the air system and the decompression system are sealed with a liquid.

The discharge means 52 of the decomposition treatment apparatus 50 for the liquid organic halogen compound is used for the liquid supply pipe 70 of the vaporization means 53 to be described later for the liquid PCB stored in the second storage tank 62 of the storage means 51. A predetermined amount is supplied inward.

Here, in the present embodiment, the needle valve 69 is used as the discharging means 52. The needle valve 69 is used for the vaporizing means 53 described later.
Based on the measured value of the pressure sensor 77 provided in the processing chamber 73, the degree of opening / closing of the needle valve 69 is determined, and the liquid PCB at a predetermined speed / volume is
It is made to drip in the liquid supply pipe 70 of the vaporization means 53 mentioned later.
Therefore, due to the presence of the discharging means 52, the optimum amount of the liquid PCB for vaporizing the liquid PCB in the vaporizing means 53 described later is always supplied.

The vaporizing means 53 of the liquid organic halogen compound decomposition treatment device 50 heats and vaporizes the liquid PCB supplied from the inside of the storing means 51 through the discharging means 52 to form a gaseous PCB. Device (see FIG. 2).

The vaporizing means 53 comprises a liquid supply pipe 70, a vaporizing cylinder 71, a heating section 72, and a processing chamber 73.

The liquid supply pipe 70 of the vaporizing means 53 introduces the liquid PCB discharged from the storing means 51 by the discharging means 52 into the vaporizing cylinder 71 of the vaporizing means 53. In the present embodiment, a circular pipe is used as the liquid supply pipe 70, and the upper end of the liquid supply pipe 70 has the discharging means 5
2 is connected to a discharge port (not shown), the lower end is inserted into a vaporization cylinder 71 described later, and the tip of the liquid supply pipe 70 extends below the inside of the vaporization cylinder 71. In addition, this liquid supply pipe 7
0 is the discharging means 52 due to expansion and contraction due to heating and cooling.
In order to prevent the liquid supply pipe 70 from being detached from and the liquid supply pipe 70 from being damaged, it is made of alumina which has excellent heat resistance and little expansion and contraction due to heat.

The liquid supply pipe 70 is provided with a heating section 72 which will be described later.
Is constantly heated to a high temperature by the decompression means 5 of the liquid organic halogen compound decomposition treatment device 50 described later.
The vacuum pump 93, which is No. 6, is constantly exposed to a reduced pressure atmosphere. Therefore, the liquid PCB dropped or sprayed into the liquid supply pipe 70 by the discharge means 52.
Is heated in the liquid supply pipe 70 as it falls freely from the upper part to the lower part of the liquid supply pipe 70.
It becomes CB. The atmosphere in the processing chamber 73 in which the liquid supply pipe 70 is housed is the decompression means 5 described later.
6 is constantly sucked by the vacuum pump 93, the gaseous PCB and the liquid PCB are
Is sucked into the inside of the vaporizing cylinder 71 that has been inserted.

The vaporizing cylinder 71 of the vaporizing means 53 exposes the liquid PCB and the gaseous PCB supplied through the liquid supply pipe 70 to a heating environment and vaporizes all of them to vaporize them. PCB. The vaporization cylinder 71 has a cylindrical shape with both ends closed, and the liquid supply pipe 70 is inserted from one end side above the vaporization cylinder 71 (see FIG. 2). The vaporizing cylinder 71 is placed on the upper surface of an alumina pedestal 74 arranged in a processing chamber 73 that houses the vaporizing cylinder 71, and the outer peripheral surface of the vaporizing cylinder 71 communicates the inside and the outside thereof. A plurality of slits 75, 75 ... Which are provided are provided along the circumferential direction from the central portion of the vaporization cylinder 71 to the upper portion thereof.

The vaporizing cylinder 71 is also the liquid supply pipe 70.
Similarly to the above, the heating section 72 described below is used for heating.
Therefore, the gaseous PCB sucked out from the liquid supply pipe 70
When it comes into contact with the inner wall surface of the vaporization cylinder 71, is decomposed by heat. On the other hand, even if the gaseous PCB is guided to the slits 75, 75 ... Without contacting the inner wall surface of the vaporization section, it is decomposed by heat when the gaseous PCB passes through the slits 75, 75. Become.

However, in the present embodiment, the liquid supply pipe 7
0 and the vaporization cylinder 71 are configured to vaporize the liquid PCB, so that heat in the liquid supply pipe 70 and the vaporization cylinder 71 is removed when the liquid PCB vaporizes.
Therefore, the vaporization means 53 is not decomposed in the vaporization cylinder 71.
There is concern about the presence of gaseous PCBs that are directed to the wake side.
Therefore, in the decomposition treatment apparatus 50 for a liquid organic halogen compound according to the present embodiment, the decomposition treatment apparatus 1 for a gaseous organic halogen compound is provided as the decomposition treatment means 54 on the downstream side of the vaporization means 53, and the gaseous PCB is used. We are making every effort to dismantle the.

The heating part 72 of the vaporizing means 53 is the liquid supply pipe 7
0, the vaporization cylinder 71 is heated. The heating section 72 is composed of a high frequency coil 76. The high frequency coil 76 is provided in a spiral shape from the upper side to the lower side at a position separated from the outer peripheral surfaces of the liquid supply pipe 70 and the vaporization cylinder 71 by a predetermined distance. The high-frequency coil 76 is connected to a high-frequency power source (not shown) and heats the vaporizing cylinder 71 and the liquid supply pipe 70 to a desired temperature.

The processing chamber 73 of the vaporizing means 53 accommodates the liquid supply pipe 70, the vaporizing cylinder 71, and the heating section 72. The inside of the processing chamber 73 is always kept in a reduced pressure atmosphere by a vacuum pump 93 of the pressure reducing means 56 described later. The processing chamber 73 is provided with a pressure sensor 77 that measures the pressure inside the processing chamber 73 and a rupture disk 100 that functions as a pressure release valve 78. The pressure release valve 78 allows a large amount of gas that exceeds the exhaust capacity of the vacuum pump 93 of the decompression unit 56, which will be described later, to be processed in the processing chamber 73.
When it occurs inside the processing chamber 73 and becomes a pressurized body, the pressure inside the processing chamber 73 is released by releasing it.

Here, when the pressure release valve 78 releases the pressure in the processing chamber 73, the gaseous PCB in the processing chamber 73 is released to the atmosphere. for that reason,
In order to prevent the release of PCB into the atmosphere, it is preferable to provide the trap 103 shown in FIG.

This trap device is the same as the processing chamber 7 described above.
3 is connected via a pipe 101, and a vacuum pump 104 that creates a reduced pressure environment in this trap is provided on the downstream side of this trap via a valve. Since the inside of the trap 103 is always kept in a reduced pressure state by the vacuum pump 104, the pressure release valve 7 of the processing chamber 73 is
When 8 is released, the pressure is absorbed in the space between the pipe 101 and the trap 103. The trap 103
A cooling pipe 102 through which a suitable cooling medium such as liquid nitrogen is inserted is provided inside and on the outer peripheral surface of the pipe 101. The cooling pipe 102 is provided so as to meander inside the trap 103, and the trap 10 of the cooling pipe 102 is provided.
Fins are provided on the outer peripheral surface of the portion in 3 for efficiently cooling the inside of the trap 103. Therefore, by inserting a cooling medium through the cooling pipe 102, the high temperature gas discharged from the inside of the processing chamber 73 is rapidly cooled, and the volume of the gas is reduced. As a result, trap 1
03 and the pipe 101 are prevented from being damaged, and the PCB is prevented from being discharged to the outside of the apparatus.

The decomposition treatment means 54 of the decomposition treatment apparatus 50 for a liquid organic halogen compound is connected to the downstream of the processing chamber 73 of the vaporization means 53, and thermally decomposes the vaporized gas of PCB discharged from the processing chamber. To do. The processing means 54 has the same structure as that of the decomposition apparatus 1 for the above-mentioned gaseous organic halogen compound, and therefore its explanation is omitted here.

The trapping means 55 of the liquid organic halogen compound decomposition treatment device 50 collects the decomposition products contained in the decomposition gas formed by the decomposition of the gaseous PCB in the decomposition treatment means 54.

The capturing means 55 is the decomposition processing means 5 described above.
The upper chamber 81 is provided with a cooling plate 80 and is connected to the downstream side of the upper chamber 81. The lower chamber 82 is connected to the lower side of the upper chamber 81 via a gate valve 83. Cooling plate 80 provided in the upper chamber 81
Is made of a nickel alloy, and the high-temperature decomposed gas introduced into the capturing means 55 is adsorbed as carbon content by utilizing the catalytic reaction of nickel, and the high-temperature decomposed gas is absorbed by the capturing means 55. Pressure reducing means 5 provided on the downstream side
6 to prevent direct supply.

The cooling plate 80 is connected to a cooling pipe (not shown) and is constantly cooled to a cool temperature by a refrigerant such as liquid nitrogen passed through the cooling pipe. Therefore, the high temperature decomposed gas discharged from the decomposition processing means 54 upstream of the trapping means 55 is rapidly cooled to promote the adsorption of the decomposed matter in the decomposed gas. The cooling plate 80 is arranged so that the atmosphere in the upper chamber 81 is guided to the pressure reducing means 56 on the downstream side after passing through the gap between the cooling plate 80 and the wall surface of the upper chamber 81. If it is provided, it is not particularly limited.

The lower chamber 82 is the upper chamber 8
This is a device for collecting the decomposition products adsorbed and trapped in 1. Therefore, in this lower chamber 82, an inert gas cylinder (not shown) for replacing the inside of this lower chamber 82 with an inert gas such as argon, and a vacuum pump 87.
Are connected via an inert gas supply pipe 84 and an exhaust pipe 85, respectively.

Therefore, the gate valve 83 for partitioning the lower chamber 82 and the upper chamber 81 is closed, and then the inert gas is supplied through the inert gas supply pipe 84 connected to the lower chamber 82, After setting the pressure in the lower chamber 82 to atmospheric pressure, the lower chamber 8
Decomposition products such as carbon stored in 2 are discharged from the carbon powder 86
More recoverable.

After removing the carbon powder from the lower chamber 82, the inside of the lower chamber 82 is depressurized again by the vacuum pump 87 connected to the lower chamber 82, and then the gate valve 83 is released. By communicating with the upper chamber 81, decomposition products such as carbon can be stored again in the lower chamber 82. Therefore, the work of removing the carbon powder and the like can be performed without stopping the decomposition treatment apparatus 50 of the liquid organic halogen compound of the present invention.

A cage 91 filled with nickel balls 90, 90 ... Is provided in place of the cooling plate 80, and the decomposition gas discharged from the decomposition processing means 54 is supplied to the cage 9.
It is also possible to pass the inside of 1 and discharge it to the downstream of this capturing means 55 (see FIG. 6). In this embodiment, the nickel balls 90, 90 ... Cooled by an appropriate cooling means are intermittently dropped from above the cage 91 to below. In this case, the decomposition gas passing through the cage 91 adheres to the surfaces of the nickel balls 90, 90 ... As carbon due to the catalytic action of nickel. Then, by vibrating by a vibrating sieve 92 provided on the lower side of the cage 91, carbon and the like adhering to the surface of the nickel balls 90, 90 ... The nickel spheres 90, 90 ... Having the carbon removed are circulated and supplied again to the cage 91.

The decompression unit 56 of the liquid organic halogen compound decomposition treatment apparatus 50 according to the present invention includes the second storage tank 62 of the storage unit 51 and the processing chamber 7 of the vaporization unit 53.
3, the atmosphere in the trapping means 55 is forcibly discharged out of the apparatus, and a reduced pressure atmosphere is formed in the apparatus 50 for decomposing liquid organic halogen compounds according to the present invention. In the present embodiment, the vacuum pump 93 is used as the pressure reducing means 56. As the vacuum pump 93, a general vacuum pump used in this field is used as in the decomposition apparatus 1 for the gaseous organic halogen compound.

Incidentally, as shown in FIG.
It is also possible to further connect the decomposition processing means 54 capturing means 55 and the pressure reducing means 56 to the pipe 6 via the valve 106. With this configuration, when a problem occurs between the vaporizing means 53 and the capturing means 55 of the liquid organic halogen compound decomposition treatment device 50, the vaporizing means 53 remains between the vaporizing means 53 and the capturing means 55. Undegraded PCB can be detoxified.

<Operation> Next, the operation of the apparatus 50 for decomposing liquid organic halogen compounds according to the present invention will be described.

First, the slide gate valve 60 of the storage means 51 is opened, the liquid organic halogen compound is charged into the first storage tank 61, and the slide gate valve 60 is closed after the completion of the charging. Then, the supply valve 64 is opened to move the liquid organohalogen compound in the first storage tank 61 to the second storage tank 62. The valve 79 of the vacuum exhaust pipe 65 connected to the upper surface of the second storage tank 62 is opened, the atmosphere in the second storage tank 62 is exhausted by the vacuum pump 93, and a depressurized atmosphere is created in the second storage tank 62. Form.

The needle valve 79 attached to the lower side of the second storage tank 62 is opened to open the second storage tank 62.
The liquid organohalogen compound stored therein is dropped into the liquid supply pipe 70 of the vaporizing means 53.

The liquid organohalogen compound that drops inside the liquid supply pipe 70 is heated and vaporized when the liquid drops inside the liquid supply pipe 70, and most of it becomes a gaseous organic halogen compound. The liquid organohalogen compound that has not vaporized in the liquid supply pipe 70 is heated and completely vaporized in the vaporization cylinder 71 that accommodates the tip of the liquid supply pipe 70.

Subsequently, the gaseous organic halogen compound generated in the vaporizing means 53 is sucked out by the vacuum pump 93 of the decompressing means 56 to the decomposition treatment means 54 side located downstream of the vacuum pump 93, and the decomposition treatment means 54 is discharged. It passes through the circular pipe 10 and is guided into the cylinder 12 (see FIGS. 2 and 5). The gaseous organic halogen compound introduced into the cylinder 12 is
While being spirally agitated by the life ring 17 in the cylinder 12, it is guided to the slits 14, 14 provided on the outer peripheral surface of the cylinder 12. At this time, the gaseous organic halogen compound contacting the inner wall surface of the cylinder 12 is catalytically decomposed by heat to be decomposed gas. Those that do not come into contact with each other are decomposed by radiant heat when passing through the slits 14, 14, and become decomposed gas.

When the decomposed gas led to the trapping means 55 located downstream of the decomposition treatment means 54 comes into contact with the cooled nickel cooling plate 80 in the trapping means 55, the catalytic action of nickel is obtained. Soot cooling plate 8
It is adsorbed and collected on 0.

<Example> Next, the result of an experiment using the decomposition treatment apparatus 1 for a gaseous organic halogen compound of the present invention will be described. The experiment was carried out using three levels of oil samples (Sample 1: Electrical insulating oil only, Sample 2: Electrical insulating oil containing 10% by mass of liquid PCB, Sample 3: Liquid PCB only).

Here, the vaporization of each sample was performed by high-frequency induction heating the stainless steel container containing each sample in a chamber adjusted to 100 Pa or less by the operation of a vacuum pump. Further, the decomposition treatment in the decomposition treatment device is performed by high-frequency induction heating of the stainless steel decomposition portion.
It was carried out by heating to 00 ° C. Further, it is determined whether or not the PCB has been decomposed by providing a dry trap between the decomposition treatment apparatus 1 for the gaseous organic halogen compound and the vacuum pump, and using the activated carbon, which is the filler of the dry trap, to detect PCB and Whether or not dioxin was contained was determined by using a gas chromatograph.

As a result, as shown in Table 1 below, although PCB of 0.2 ppm was detected in Sample 3, most of the PCB was decomposed. Moreover, in sample 2, all P
CB was decomposed.

[0089]

[Table 1] Therefore, it was confirmed that the apparatus for decomposing an organohalogen compound of the present invention can almost certainly decompose and detoxify a PCB supplied in a gas state.

[0090]

According to the invention of claim 1, the gaseous organic halogen compound is surely guided to the thermal decomposition means by the presence of the gas introduction means, and is thermally decomposed in the thermal decomposition means to be decomposed gas. To be done. Therefore, no harmful organohalogen compound is discharged to the downstream side of the decomposition apparatus for the gaseous organohalogen compound.

According to the second aspect of the invention, the gaseous organic halogen compound introduced into the cylinder is more surely contacted with the heating element to be thermally decomposed, and even if it does not contact the heating element, When discharged through the slit to the outside of this cylinder, it is surely decomposed by radiant heat.

According to the third aspect of the present invention, the liquid organic halogen compound is converted into a gaseous organic halogen compound in the vaporizing means, and the gaseous organic halogen compound is surely treated in the decomposition treatment apparatus for the gaseous organic halogen compound. Be disassembled. Therefore, even a liquid organic halogen compound can be decomposed without any problem.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a decomposition treatment apparatus for a gaseous organic halogen compound according to the present invention.

2 (a) and 2 (b) are both sectional views of a main part of a decomposition treatment apparatus for a gaseous organic halogen compound according to the present invention.

FIG. 3 is a schematic configuration diagram of a second embodiment of the apparatus for decomposing a gaseous organic halogen compound according to the present invention.

FIG. 4 is a schematic sectional view of a third embodiment of the apparatus for decomposing gaseous organic halogen compounds according to the present invention.

FIG. 5 is a schematic explanatory view of a decomposition treatment apparatus for a liquid organic halogen compound according to the present invention.

FIG. 6 is a diagram showing one mode of a capturing means of the decomposition treatment apparatus for a liquid organic halogen compound according to the present invention.

FIG. 7 is a schematic explanatory diagram of a pressure release valve and a trap provided in the processing chamber of the liquid organic halogen compound decomposition processing apparatus of the present invention.

FIG. 8 is a schematic explanatory view of a safety device provided on the side of the decompression device for decomposing a liquid organic halogen compound according to the present invention.

[Explanation of symbols]

1. Decomposition treatment device for gaseous organic halogen compounds 2 ... Gas introduction means 3 ... Thermal decomposition means 4 ... Heating means 5: Gas discharging means 10 ... Circular tube 11 ... hole 12 ... Cylinder 14 ... Slit 15 ... High frequency coil 16 ... Between 17 ... life ring 18 ... Alumina chamber 50: Decomposition treatment device for liquid organic halogen compounds 51 ... Storage means 52 ... Ejection means 53 ... Vaporization means 54 ... Disassembly processing means 55 ... Capture means 56 Decompression means

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2E191 BA12 BA13 BD11                 4G075 AA03 BA05 CA18 DA01 DA12                       EB27 FB04                 4H006 AA04 AA05 AC26 BD60

Claims (3)

[Claims] 1. A gas introduction means for introducing a gaseous organic halogen compound to a thermal decomposition means, a primary decomposition section for thermally decomposing the gaseous organic halogen compound introduced by the gas introduction means with a heating element, and A mixed gas of a decomposition gas obtained by thermally decomposing the gaseous organic halogen compound in the primary decomposition section and an undecomposed gaseous organic halogen compound is passed through the holes formed in the heating element to be thermally decomposed by radiant heat. The gaseous organic halogen compound is supplied to the thermal decomposition means via the thermal decomposition means having a secondary decomposition part and the gas introduction means, and the gaseous organic halogen compound is thermally decomposed in the thermal decomposition means. And a gas discharge unit configured to discharge the decomposed gas from the thermal decomposition unit. 2. The heating element is made of a tubular body whose both ends are sealed, and a hole for communicating the inside and the outside of the tubular body is provided on the outer peripheral surface of the heating element. The decomposition apparatus for a gaseous organic halogen compound according to claim 1, which is a pipe for guiding the gaseous organic halogen compound into the inside of the cylindrical body. 3. A discharging means for discharging a liquid organic halogen compound by a predetermined amount, and the liquid organic halogen compound discharged by the discharging means is dropped into a heated cylinder and vaporized in the cylinder. 3. A vaporizing means for converting the gaseous organic halogen compound into a gaseous organic halogen compound; and a decomposition treatment apparatus for the gaseous organic halogen compound according to claim 1 or 2, which thermally decomposes the gaseous organic halogen compound vaporized by the vaporizing means. A decomposition treatment apparatus for a liquid organic halogen compound, comprising: a recovery unit for adhering and reacting a decomposition product contained in a decomposition gas generated in the decomposition apparatus for a gaseous organic halogen compound to recover the decomposition product.