JP2003029229A - Tool for conveying substrate, and method for manufacturing liquid crystal display element by using the tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tool for conveying a substrate, by which even a substrate having low rigidity, such as a plastic substrate, can be held and conveyed to a manufacturing process so that the warp does not occur. SOLUTION: The tool 31 for conveying the substrate is provided with a supporting body 4 for supporting the substrate for a liquid crystal display element to be worked and an adhesive layer provided on the supporting body for sticking the substrate to the adhesive layer by using a roller. The adhesive layer 2 consists of two stripe-shaped bodies consisting of a material whose adhesive force for holding the substrate is nearly fixedly maintained even if the material is repetitively used and is arranged in the direction parallel to the direction where the substrate is conveyed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer jig and a method of manufacturing a liquid crystal display device using the same, and more particularly, to a substrate transfer jig suitable for holding and transferring a plastic substrate and the same. The present invention relates to a method for manufacturing a liquid crystal display element using.

[0002]

2. Description of the Related Art Conventionally, a glass substrate for a liquid crystal display element has been considered to be thinned in order to eliminate a double image in display and to reduce weight. However, since the glass substrate is fragile and easily broken, when the manufacturing process is carried by the glass substrate alone, the thinning of about 0.4 mm is the limit at the mass production level.

Therefore, development of a liquid crystal display device using a plastic substrate which is not easily damaged and is lightweight instead of the glass substrate is under way. However, since the plastic substrate has low rigidity and is not so stiff, it is difficult to convey it while holding it flat in the manufacturing process, and when it is bent, cracks occur in the formed transparent electrode, alignment film, etc. There's a problem.

As a manufacturing method in consideration of such a problem, for example, a plastic substrate is attached to a substrate transfer jig in which an adhesive layer is provided on the entire surface of a support, and each manufacturing process is transferred to a transparent electrode, A method is known in which an alignment film or the like is formed and a pair of substrates are bonded together, and then the plastic substrate is peeled off from the substrate transport jig (for example, Japanese Patent Laid-Open No. 8-
(See Japanese Patent No. 86993).

[0005]

However, when a plastic substrate is attached to a conventional substrate transfer jig,
Since the plastic substrate is attached to the entire surface of the pressure-sensitive adhesive layer while being pressed from above with a roller, the plastic substrate can be attached to the jig for substrate conveyance while the strain (residual strain) remains.

This residual strain causes distorted patterning in the photo-patterning process (coating of resist, exposure, etching of transparent conductive film, resist peeling) of the transparent conductive film, which requires particularly precise patterning.

The present invention has been made in view of the above circumstances, and is a substrate transfer jig that can hold a plastic substrate so as not to cause distortion and transfer it to each manufacturing process, and a substrate transfer jig. A method for manufacturing a liquid crystal display device using a jig is provided.

[0008]

The present invention provides a support for supporting a substrate for a liquid crystal display element to be processed, and an adhesive provided on the support for attaching the substrate with a roller. And a pressure-sensitive adhesive layer, which is composed of two strips made of a material whose adhesive force for holding the substrate is maintained substantially constant even after repeated use, and arranged in parallel with the transport direction of the substrate. The present invention provides a substrate transfer jig.

Further, the present invention comprises a support for supporting a substrate for a liquid crystal display element to be processed, and an adhesive layer provided on the support for attaching the substrate with a roller. The adhesive layer is made of a material whose adhesive force for holding the substrate is maintained substantially constant even after repeated use, and a substrate transfer jig provided in a frame shape on the peripheral portion of the support is used. It is also provided.

That is, the substrate carrying jig according to the present invention is constructed so as to hold only the both edges or the peripheral edge of the liquid crystal display element substrate by adhering it to the adhesive layer. Therefore,
The central portion of the substrate is not attached to the adhesive layer, and the stress applied to the substrate is more dispersed than when the entire surface of the substrate is attached to the adhesive layer. As a result, the substrate can be held without being distorted and can be transported to each manufacturing process.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the liquid crystal display device substrate means a glass substrate or a plastic substrate, and the substrate carrying jig according to the present invention can be used for both a glass substrate and a plastic substrate. . However, the substrate transfer jig according to the present invention can disperse the stress applied to the substrate when the substrate is attached to the substrate transfer jig by the pressure of the roller. Is particularly preferable as

The plastic substrate may be a plate-shaped plastic substrate or a film-shaped plastic substrate. Examples of the plate-shaped plastic substrate include an acrylic resin having a thickness of about 0.4 mm. On the other hand, as the film-like plastic substrate, for example, a gas barrier layer made of ethylene vinyl alcohol, polyvinyl alcohol, SiOx or the like on both front and back surfaces of a base layer made of polycarbonate, polyarylate or polyether sulfone, and a surface made of epoxy resin are used. The thickness of each layer is about 0.1 mm.

The support may be made of glass or resin and has a thickness of about 1 to 3 mm. For example, soda glass can be used as the glass, and epoxy resin can be used as the resin.

Further, in the substrate carrying jig according to the present invention, it is preferable that the pressure-sensitive adhesive layer is provided so as to be attached and held outside the processing region (effective area) of the substrate. With this configuration, it is possible to prevent distortion in the processed region of the substrate as much as possible, which is particularly effective in a process that requires high positional accuracy such as a transparent conductive film patterning process in a liquid crystal display device manufacturing process. is there.

Further, the substrate carrying jig according to the present invention is
The adhesive layer may consist of a base elastomer and a tackifier. Here, as the base elastomer, silicone gel, silicone rubber, fluorosilicone rubber, butyl rubber, urethane rubber, natural rubber, butadiene rubber, ethylene propylene rubber, chloroprene rubber, nitrile rubber, nitrile isoprene rubber, acrylic rubber,
Fluorine rubber, chlorosulfonated polyethylene, chlorinated polyethylene, epichlorohydrin rubber or the like can be used. Among these base elastomers, butyl rubber or silicone rubber is preferable in consideration of tackiness, heat resistance, oil / chemical resistance, surface flatness, light resistance, ozone resistance and the like.

On the other hand, a rosin-based tackifier resin or a hydrocarbon-based tackifier resin can be used as the tackifier. Examples of the rosin-based tackifier resin include glycerin rosin ester, hydrogenated pentaerythritol ester, hydrogenated glycerin ester, modified tall oil resin, polymerized rosin, and rosin ester. Further, as the hydrocarbon tackifier resin, an aromatic hydrocarbon resin, an aliphatic hydrocarbon resin,
Examples thereof include mixed aliphatic / aromatic resins, heat-reactive hydrocarbon resins, terpene resins, modified resins and special resins.

For example, when silicone rubber is used as the base elastomer, a polymer such as polydimethylsiloxane or polydimethylphenylsiloxane to which a low molecular weight organosiloxane polymer and a tackifier resin such as silicone are added can be used.

When butyl rubber is used as the base elastomer, tackifier resin such as polyterpene, terpene phenol, phenol formaldehyde resin, modified rosin, rosin ester, or hydrocarbon resin is added to butyl rubber, and quinoid vulcanization and sulfur are further added. Alternatively, vulcanization with a sulfur donating compound or resin cross-linking can be used.

For quinoid vulcanization, p-quinone dioxime or dibenzoyl p-quinone dioxime and Mn are used.
A combination with an oxidizing agent such as O ₂ , PbO ₂ , Pb ₂ O ₃ or benzothiazyl disulfide can be used as a vulcanizing agent. When the resin is crosslinked, a brominated phenol resin or the like can be used.

The adhesive force of the pressure-sensitive adhesive layer can be adjusted by the composition of the above-mentioned materials constituting the pressure-sensitive adhesive layer, but it can be adjusted by increasing or decreasing the surface shape (smooth to unevenness) of the pressure-sensitive adhesive layer or the forming area of the pressure-sensitive adhesive layer. Can also be adjusted. In the present invention, the adhesive force of the adhesive layer is preferably in the range of about 25 to 400 g when expressed by the peeling force per 10 mm width.

When the peeling force per 10 mm width is less than about 25 g, the workability in peeling the substrate from the adhesive layer is good, but it depends on the conditions of the manufacturing process (heating temperature, cleaning conditions). The reason is that bubbles or a cleaning liquid may enter the interface between the substrate and the pressure-sensitive adhesive layer, or the substrate may drop off from the substrate-transporting jig, so that the substrate cannot be stably transported.

On the other hand, the peeling force per 10 mm width is about 40.
If it exceeds 0 g, it becomes difficult to peel off the substrate carrying jig after the process is completed, and in some cases, the stress during peeling may cause defects such as cracking and deformation of the substrate.

The jig for transferring a substrate according to the present invention is
A filling material for preliminarily filling the height difference between the pressure-sensitive adhesive layer and the support to ensure the surface smoothness of the support may be further provided. As the filling material, for example, an olefin resin can be used. With this configuration, since the adhesive side surface of the substrate transfer jig becomes a flat surface as a whole, the stress distribution applied to the substrate when the substrate is attached to the substrate transfer jig becomes uniform, and It is possible to effectively prevent distortion.

From another point of view, the present invention also provides a method of manufacturing a liquid crystal display device, which comprises manufacturing a liquid crystal display device by attaching a substrate to the substrate carrying jig according to the present invention.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the embodiments shown in the drawings. The present invention is not limited to the embodiments. Further, members common to a plurality of embodiments described below will be described using the same reference numerals.

Embodiment 1 A substrate transfer jig according to Embodiment 1 of the present invention is shown in FIG.
6 to 6. 1 is a plan view of a substrate transfer jig according to Example 1, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIGS. 3 and 4 use the substrate transfer jig shown in FIGS. Process drawing for explaining a process of manufacturing a liquid crystal display element,
5 is a plan view of the step of attaching the substrate to the substrate transfer jig according to the first embodiment, and FIG. 6 is a side view of the step shown in FIG.

As shown in FIGS. 1 and 2, the substrate transfer jig 11 according to the first embodiment of the present invention is a support for supporting the plastic substrate 1 (see FIG. 3A) to be processed. The body 4 and the pressure-sensitive adhesive layer 2 provided on the support 4 for attaching the substrate 1 with the roller 51 (see FIGS. 5 and 6) are provided, and the pressure-sensitive adhesive layer 2 holds the substrate 1. It is made of a material whose adhesive force for keeping the same substantially constant even if it is repeatedly used, and is provided like a frame at the peripheral edge of the support 4.

Specifically, the support 4 has a dimension of about 300.
X324 mm, thickness: made of soda glass of about 1.6 mm, the pressure-sensitive adhesive layer 2 has a smooth surface, thickness: about 0.2 mm
The sheet-like silicone rubber (a silicone-based adhesive having a hardness of 40 °) is used. The support 4 and the adhesive layer 2 are
It is permanently bonded by a double-sided tape 3 having an acrylic adhesive on one surface and a silicone adhesive on the other surface. Both the adhesive layer 2 and the double-sided tape 3 have a frame-like shape, and the width W1 of the frame shown in FIG. 1 is about 10 m.
m.

Next, a method of manufacturing a liquid crystal display device using the substrate carrying jig 11 will be described with reference to FIGS. First, as shown in FIG. 3 (a) and FIGS. 5 and 6, the surface of the adhesive layer 2 of the substrate transport jig 11 has dimensions of about 300 × 324 mm and thickness of about 0.4 mm.
The substrate 1 made of acrylic resin is placed (the placed substrate 1 is not shown in FIG. 5), and the surface of the substrate 1 is pressed by the rubber roller 51 having a diameter of about 20 mm while being conveyed in the conveyance direction F. : About 3 kgf / cm ² , Pressing speed: About 2
0 cm / sec. The substrate 1 was attached to the substrate transport jig 11 by pressing from the long side direction of the substrate 1.

The short line 52 on the substrate 1 in FIG.
Shows the magnitude and the direction of the residual strain generated on the substrate 1. The substrate 1 attached to the substrate transfer jig 11 according to the first embodiment shows almost no strain in its effective area. In addition, only a slight distortion was recognized even outside the effective area.

At this time, since the opening 5 is provided substantially in the center of the pressure-sensitive adhesive layer 2, the pressure-sensitive adhesive layer 2 is formed in the center of the substrate 1.
Can not be pasted on. As a result, as compared with the case where the entire surface of the substrate is attached to the adhesive layer as in the comparative example described later, the substrate 1
The stress applied to the substrate 1 is dispersed and the substrate 1 is not distorted. Further, since the peripheral edge of the substrate 1 is attached to the adhesive layer 2, the cleaning water used in the cleaning process or the like is blocked at the joint between the peripheral edge of the substrate 1 and the adhesive layer 2. As a result, the cleaning water does not enter between the substrate carrying jig 11 and the substrate 1,
The substrate transfer jig 11 can stably transfer the substrate 1 to each subsequent manufacturing process.

Next, as shown in FIG. 3B, the substrate carrying jig 11 to which the substrate 1 is attached is washed, and thereafter,
It is installed in a magnetron sputtering device (not shown) and a film thickness of 70 nm (700
Å) ITO transparent conductive film is formed, and further, fine processing for patterning the ITO transparent conductive film into a predetermined electrode pattern (resist application, exposure, development, etching, resist cleaning removal) is performed to form the transparent electrode 7. did.

Next, as shown in FIG. 3C, an alignment film 8 required to have a uniform coating property is printed by an offset printing machine (not shown), and the printed alignment film 8 is heated to about 100 ° C. ,
The film was provisionally dried on a hot plate set for about 3 minutes, and then the alignment film 8 was subjected to main baking at about 100 ° C. for about 3 hours, followed by rubbing treatment and cleaning.

Next, as shown in FIG. 4D, the sealing material 9 is printed on one of the pair of substrates 1 manufactured through the above-mentioned steps, and the cell gap control beads 10 are sprinkled on the other. After that, the substrates 1 were attached to each other, and the sealing material 9 was cured. The maximum processing temperature in each of the above steps was about 100 ° C. during the main baking of the alignment film 8. However, as a result of observing the bonded portion between the substrate transport jig 11 and the substrate 1, the adhesive No chemical solution or water penetrated into the interface between the layer 2 and the substrate 1, and no remarkable generation of bubbles was confirmed.

After that, as shown in FIG. 4E, the substrate carrying jigs 11 on both sides of the bonded substrates 1 were peeled off. The peeling force required at this time was about 150 to 200 g in terms of a value per 10 mm width, and the peeling property was appropriate.

Although not shown, the substrate 1 separated from the substrate carrying jig 11 was then cut into a predetermined shape, and liquid crystal injection and polarizing plate attachment were sequentially performed to manufacture a liquid crystal display element. At this time, since the substrates 1 were bonded to each other to increase the overall rigidity, the above-mentioned steps of dividing, injecting liquid crystal, and sticking the polarizing plate were carried out with the substrate carrying jig removed. However, no problem occurred.

On the other hand, the substrate conveying jig 11 separated from the substrate 1 is then returned to the step of attaching a new substrate 1 again after the step of cleaning the adhesive layer 2, and the above-mentioned substrate 1 is attached. It was used for transportation in each manufacturing process. Such reuse was repeated 3 times, but the adhesive strength of the pressure-sensitive adhesive layer 2 was not significantly reduced.

Comparative Example Here, a comparative example in which a plastic substrate is attached to a conventional substrate carrying jig and the strain generated in the plastic substrate is measured will be described with reference to FIGS. FIG. 15 is a plan view of a conventional substrate transfer jig according to a comparative example, FIG. 16 is a sectional view taken along the line DD of FIG. 15, and FIG. 17 is a plan view of a step of attaching a substrate to a conventional substrate transfer jig according to a comparative example. FIG. 18 is an explanatory view seen from the side, and FIG. 18 is an explanatory view seen from the side.

As shown in FIGS. 15 and 16, the conventional substrate carrying jig 41 according to the comparative example has a dimension of about 30.
A sheet-shaped silicone rubber (hardness: about 40 mm) having the same size as the substrate 1 as the adhesive layer 2 on the support 4 made of soda glass having a size of 0 × 324 mm and a thickness of about 1.6 mm. (Silicone pressure sensitive adhesive) of 3 ° is adhered with a silicone resin adhesive 3a.

Here, as shown in FIGS. 9 and 10, an acrylic resin having a size of about 300 × 324 mm and a thickness of about 0.4 mm is formed on the surface of the adhesive layer 2 of the conventional substrate transfer jig 41. The substrate 1 made of the above is placed (illustration of the placed substrate 1 is omitted in FIG. 9), and while being transported in the transport direction F, the surface of the substrate 1 is pressed by a rubber roller 51 having a diameter of about 20 mm and a pressure of about 3 kgf. / Cm ² , pressing speed: about 20 cm
/ Sec. Then, the substrate 1 was attached to the substrate transfer jig 41 by pressing from the long side direction of the substrate 1.

When the substrate 1 is attached in this way, the substrate 1
Will be attached while distorting the entire surface of the substrate 1, and the total length of the substrate 1 is about 324 mm and the strain is several tens of μm (residual strain).
There has occurred. The short line 52 on the substrate 1 in FIG.
Shows the magnitude and direction of the residual strain generated in the substrate 1, and the substrate 1 attached to the substrate transport jig 41 according to the comparative example showed a large strain over the entire surface. This residual strain causes distorted patterning in the patterning process (resist coating, exposure, etching of the transparent conductive film, resist stripping) of the transparent conductive film, which requires particularly high-precision patterning.

Second Embodiment Next, a substrate transfer jig according to a second embodiment of the present invention will be described with reference to FIGS. 7 is a plan view of a substrate transfer jig according to Example 2, FIG. 8 is a sectional view taken along line BB of FIG. 7, and FIG. 9 is a substrate attached to the substrate transfer jig shown in FIGS. 7 and 8. It is sectional drawing which shows a state.

As shown in FIGS. 7 and 8, the substrate transfer jig 21 according to the second embodiment has an opening 5 (see FIGS. 1 and 2) in the substrate transfer jig 11 according to the first embodiment.
Is filled with a non-adhesive resin material 6 (olefin resin), and other configurations are the same as those of the substrate transport jig 11 according to the above-described first embodiment.

With this structure, the adhesive layer 2 side of the substrate carrying jig 21 becomes a flat surface as a whole.
Therefore, when the substrate 1 is attached to the substrate transport jig 21, the stress distribution applied to the substrate 1 becomes uniform, and distortion is effectively prevented.

After that, as shown in FIG. 9, the substrate 1 was attached to the substrate carrying jig 21 and carried to each of the above manufacturing steps to manufacture a liquid crystal display element. These steps were described above. The description is omitted because it is the same as the first embodiment.

Embodiment 3 A substrate transfer jig according to Embodiment 3 of the present invention is shown in FIG.
A description will be given based on 0-14. 10 is a plan view of a substrate carrying jig according to a third embodiment of the present invention, FIG. 11 is a sectional view taken along line CC of FIG. 10, and FIG. 12 is a plan view of the substrate carrying jig shown in FIGS. FIG. 13 is a process diagram for explaining a process for manufacturing a liquid crystal display device, FIG. 13 is an explanatory plan view of a process for attaching a substrate to a substrate transfer jig according to a third embodiment of the present invention, and FIG. 14 is a process shown in FIG. It is the explanatory view which looked at from the side.

As shown in FIGS. 10 and 11, the substrate transfer jig 31 according to the third embodiment includes a support 4 for supporting the plastic substrate 1 (see FIG. 12A) to be processed. And a pressure-sensitive adhesive layer 2 provided on the support 4 in order to bond the substrate 1 with a roller 51 (see FIGS. 13 and 14).
Two strips made of a material whose adhesive force for holding the substrate 1 is maintained substantially constant even after repeated use, and are arranged in parallel to the transport direction F of the substrate 1 (see FIGS. 13 and 14). ing.

Specifically, the support 4 has a dimension of about 300.
X324 mm, thickness: made of soda glass of about 1.6 mm, the pressure-sensitive adhesive layer 2 has a smooth surface, thickness: about 0.2 mm
The sheet-like silicone rubber (a silicone-based adhesive having a hardness of 40 °) is used. The support 4 and the adhesive layer 2 are
It is permanently bonded by a double-sided tape 3 having an acrylic adhesive on one surface and a silicone adhesive on the other surface. Both the adhesive layer 2 and the double-sided tape 3 have a strip shape, and the width W2 of the strip shown in FIG. 10 is about 10 m.
m.

Next, a method of manufacturing a liquid crystal display element using the substrate carrying jig 31 will be described with reference to FIGS. First, FIG. 12A, FIG. 13 and FIG.
4, the adhesive layer 2 of the jig 31 for transferring the substrate
On the surface of: about 300 × 324 mm, thickness: about 0.4
The substrate 1 made of acrylic resin having a size of mm is placed (the placed substrate 1 is not shown in FIG. 13), and the surface of the substrate 1 is conveyed by the rubber roller 51 having a diameter of about 20 mm while being conveyed in the conveyance direction F. Pressure: about 3 kgf / cm ² , pressing speed: about 20 cm / sec. Then, the substrate 1 was attached to the substrate transfer jig 31 by pressing from the long side direction of the substrate 1.

The short line 52 on the substrate 1 in FIG.
Shows the magnitude and direction of the residual strain generated on the substrate 1. The substrate 1 attached to the substrate transfer jig 31 according to the third embodiment shows almost no strain in its effective area. In addition, only a slight distortion was recognized even outside the effective area. After that, the substrate 1 stuck to the substrate transport jig 31 was passed through a cleaning step, and the substrate transport jig 31 was washed together to clean the surface of the substrate 1.

Next, as shown in FIG. 12B, the substrate 1 is kept in the state of being attached to the substrate transfer jig 31.
The transparent electrode 7 is formed by performing a series of fine processing for forming an O transparent conductive film and further patterning the ITO transparent conductive film into a predetermined electrode pattern, that is, resist coating, exposure, development, etching, and resist cleaning / removal. After forming, the substrate 1 was peeled from the substrate carrying jig 31 as shown in FIG.

Although not shown in the figure, after that, alignment film coating, rubbing treatment, seal printing, cell gap control beads are dispersed, and then a pair of substrates are bonded together, divided into a predetermined shape, and liquid crystal is injected and a polarizing plate is bonded. The steps were sequentially performed to produce a liquid crystal display element.

The first to third embodiments have been described above.
In the jig for transferring a substrate according to the present invention, the adhesive layer is provided only on the both edges or the peripheral edge of the support, so that residual strain generated in the effective area of the substrate when the substrate is attached is prevented as much as possible.
Therefore, the jig for carrying a substrate according to the present invention is particularly effective in a process that requires high precision such as patterning an electrode pattern on a transparent conductive film. In addition, although the plate-shaped plastic substrate is used as the substrate in the above-described Examples 1 to 3, the substrate transfer jig according to the present invention can be similarly used for the glass substrate and the film-shaped plastic substrate.

[0054]

According to the present invention, since the adhesive layer for holding the liquid crystal display device substrate is composed of two strips and arranged in parallel with the substrate carrying direction, the rigidity of the plastic substrate or the like is improved. Even a weak substrate can be held and transported so as not to cause distortion in each manufacturing process.

[Brief description of drawings]

FIG. 1 is a plan view of a substrate carrying jig according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a process drawing showing a process of manufacturing a liquid crystal display element using the substrate carrying jig shown in FIGS. 1 and 2.

FIG. 4 is a process drawing showing a process for manufacturing a liquid crystal display element using the substrate carrying jig shown in FIGS. 1 and 2.

FIG. 5 is an explanatory plan view of a step of attaching a substrate to the substrate transfer jig shown in FIGS. 1 and 2.

FIG. 6 is an explanatory view showing the step shown in FIG. 5 from the side.

FIG. 7 is a plan view of a substrate carrying jig according to a second embodiment of the present invention.

8 is a sectional view taken along line BB of FIG.

9 is a cross-sectional view showing a state where a plastic substrate is attached to the substrate transfer jig shown in FIGS. 6 and 7. FIG.

FIG. 10 is a plan view of a substrate carrying jig according to a third embodiment of the present invention.

11 is a cross-sectional view taken along line CC of FIG.

FIG. 12 is a process drawing showing a process for manufacturing a liquid crystal display element using the substrate carrying jig shown in FIGS. 10 and 11.

FIG. 13 is a plan view of a step of attaching a substrate to the substrate transfer jig shown in FIGS. 10 and 11.

FIG. 14 is an explanatory view of the step shown in FIG. 13 as viewed from the side.

FIG. 15 is a plan view of a conventional substrate transfer jig according to a comparative example.

16 is a sectional view taken along line DD of FIG.

FIG. 17 is an explanatory plan view of a step of attaching a substrate to the conventional substrate transfer jig shown in FIGS. 15 and 16.

FIG. 18 is an explanatory view showing the step shown in FIG. 17 from the side.

[Explanation of symbols]

1 ... Plastic substrate 2 ... Adhesive layer 3 ... Double-sided tape 4 ... Support 5 ... Opening 11 ... Board transfer jig

Claims (9)

[Claims] 1. A support for supporting a substrate for a liquid crystal display element to be processed, and a pressure-sensitive adhesive layer provided on the support for sticking the substrate with a roller,
The adhesive layer is two strips made of a material whose adhesive force for holding the substrate is maintained substantially constant even after repeated use, and the substrate transport is arranged parallel to the substrate transport direction. Jig. 2. A support for supporting a substrate for a liquid crystal display element to be processed, and a pressure-sensitive adhesive layer provided on the support for attaching the substrate with a roller,
The adhesive layer is made of a material whose adhesive force for holding the substrate is maintained substantially constant even if it is repeatedly used, and is a frame-like jig provided on the peripheral portion of the support body. 3. The substrate transfer jig according to claim 1, wherein the pressure-sensitive adhesive layer is provided so as to be attached and held outside the processing region of the substrate. 4. The substrate transfer jig according to claim 1, further comprising a filling material that fills a height difference between the pressure-sensitive adhesive layer and the support in advance to ensure surface smoothness of the support. 5. The substrate carrying jig according to claim 4, wherein the filling material is an olefin resin. 6. The substrate transfer jig according to claim 1, wherein the adhesive layer comprises a base elastomer and a tackifier. 7. The base elastomer is silicone gel, silicone rubber, fluorosilicone rubber, butyl rubber, urethane rubber, natural rubber, butadiene rubber, ethylene propylene rubber, chloroprene rubber, nitrile rubber,
Nitrile isoprene rubber, acrylic rubber, fluororubber,
The substrate transfer jig according to claim 6, which is made of chlorosulfonated polyethylene, chlorinated polyethylene, or epichlorohydrin rubber. 8. The substrate transfer jig according to claim 6, wherein the tackifier is a rosin-based tackifier resin or a hydrocarbon-based tackifier resin. 9. A method of manufacturing a liquid crystal display device, which comprises manufacturing the liquid crystal display device by attaching the substrate to the jig for transferring a substrate according to claim 1. Description: