JP2003023118A - Hermetically sealing container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hermetically sealing container capable of suppressing a change in an internal pressure of the container without increasing in size the container. SOLUTION: The hermetically sealing container comprises an internal space 16 hermetically sealed between a base 20 and a cover 10. The container further comprises a communicating hole 18 formed in the cover 10 to communicate with an exterior through the space 16, and a piston 30 slidable in the hole 18 while holding a sealing state. When a pressure in the space 16 is changed, the piston 30 is slid, and the change in the pressure in the container can be suppressed without increasing in size the container.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hermetically sealed container whose inside is hermetically sealed, and more particularly to a hermetically sealed container suitable for use in a container such as a high density multichip module.

[0002]

2. Description of the Related Art As a hermetically sealed container, for example, there is a multi-chip module (MCM) in which a large number of semiconductor chips (LSI) are mounted on a high-density wiring board. Regarding the sealing structure of this multi-chip module, for example, Japanese Patent Laid-Open No.
As described in Japanese Patent Application Publication No. 000-349211,
A rubber O-ring is provided between the upper surface of the frame body, which is fixed to the LSI mounting surface of the wiring board by soldering, and the lower surface of the peripheral edge portion of the heat sink, and the plastic is provided between the upper surface of the peripheral edge portion of the heat sink and the upper frame body. It is known that the upper frame body and the frame body are hermetically sealed by fastening them with bolts via the.

[0003]

In a hermetically sealed container structure such as a multi-chip module, the internal pressure changes due to temperature changes during use. In a multi-chip module, if the LSI is not energized, the LS
While the heat-generating components such as I are kept at room temperature (for example, 25 ° C.), when the LSI is energized, the temperature of the heat-generating components such as LSI rises to a high temperature (for example, 80 ° C.). The temperature of the gas (nitrogen and atmosphere) enclosed in the container rises to the same level, and the gas tries to expand, so that the internal pressure of the container rises to, for example, about 1.2 atm.
The container itself also expands. Therefore, the concentration of strain on each part due to the increase of the internal pressure and the change of the contact state with the external medium bring about a crack in the container structural member itself or in the joint portion thereof, and further in the connection portion with the solder bump. The metallization of a certain electrode may be peeled off, the wiring pattern may be cut off, or the solder bump may be cracked, resulting in poor electrical connection. As a method of suppressing such deformation of the container or reducing the rise of the internal pressure, for example, a structure in which a bellows is attached to the outside can be considered, but this has a problem that it cannot be made lightweight and compact.

Further, recently, there has been considered a method of cooling an LSI or the like, for example, to an extremely low temperature to improve the processing speed of the LSI. At this time, if the LSI is cooled to a temperature lower than room temperature, the gas (nitrogen or atmosphere) enclosed in the container is also cooled to the same degree and the gas tries to be compressed, so that the internal pressure of the container is, for example, 0. The container itself contracts as the pressure drops to about 8 atm. Therefore, there is a possibility that the strain may be concentrated on each part due to the decrease of the internal pressure and the contact state with the external medium may be changed, resulting in poor hermetic sealing and poor connection. As a method of suppressing such deformation of the container or reducing the decrease of the internal pressure, for example, a structure in which a bellows is attached to the outside can be considered in the same manner, but this has a problem that it cannot be made lightweight and compact. .

An object of the present invention is to provide a hermetically sealed container capable of suppressing fluctuations in the internal pressure of the container without increasing the size of the container.

[0006]

In order to achieve the above object, the present invention provides a hermetically sealed container in which an internal space is hermetically sealed, wherein the space provided in a member constituting this container and the outside are provided. The sliding member is arranged in the communicating hole and is slidable in the hole while keeping the airtight state. With this configuration, when the pressure in the internal space fluctuates, the sliding member slides and the fluctuation in the internal pressure of the container can be suppressed without increasing the size of the container.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The structure of an airtightly sealed container according to an embodiment of the present invention will be described below with reference to FIG.
FIG. 1 is a sectional view showing the structure of an airtightly sealed container according to an embodiment of the present invention.

The hermetically sealed container according to the present embodiment mainly includes a lid portion 10 which serves as a lid body of the container and a base portion 2 which serves as a base.
It is composed of 0 and 0. The lid 10 and the base 20 are connected via an O-ring 12 to ensure the airtightness of the space 16 formed between the lid 10 and the base 20.
Instead of the O-ring 12, for example, another hermetic sealing means such as a C-ring can be used.

In the present embodiment, the lid portion 10 is further added.
A communication hole 18 that communicates the space 16 with the outside is formed therein. The communication hole 18 may be provided on the base 20 side. A piston 30 is arranged in the communication hole 18. The piston 30 can move inside the communication hole 18. A groove for inserting the O-ring 32 is formed in the piston 30 and holds the O-ring 32. The O-ring 32 is pressed against the wall surface of the communication hole 18, and the space 16 and the outside are hermetically sealed by the piston 30 having the O-ring 32.

Therefore, when the LSI or the like is energized, the temperature of the heat generating component such as the LSI or the like rises to a high temperature (for example, 80 ° C.), and the gas (nitrogen or atmosphere) enclosed in the space 16 inside the container is accordingly increased. When the temperature rises to the same level and the gas tries to expand, the internal pressure of the container increases, so that the piston 30
It moves in the direction of arrow A to the position of the piston 30A. Then, the piston 30 stops at the position where the internal pressure of the space 16 and the external atmospheric pressure are balanced, and it becomes possible to suppress the rise of the internal pressure. Therefore, it is possible to prevent the strain from concentrating on each part and the change of the contact body with the external medium due to the increase of the internal pressure of the container. Moreover, the piston 30
Since it is provided inside the lid portion 10, the airtight sealed container itself can be made lightweight and compact. Also, L
When the SI or the like is cooled to, for example, about −50 ° C. and used, when the internal pressure of the container drops to, for example, about 0.8 atm, the piston 30 moves in the direction of the arrow B to move the piston 30B. Move to position. Then, the piston 30 stops at the position where the internal pressure of the space 16 and the external atmospheric pressure are balanced, and it becomes possible to suppress the rise of the internal pressure. Therefore, it is possible to prevent the strain from being concentrated on each part and the change of the contact body with the external medium due to the decrease of the internal pressure of the container. Moreover, since the piston 30 is provided inside the lid portion 10, it is possible to make the hermetically sealed container itself lightweight and compact.

A lid member 40 is attached and fixed to the outer wall surface of the lid portion 10 and the opening portion of the communication hole 18.
The lid member 40 causes the internal pressure to rise excessively and the piston 30
However, it is provided in order to prevent it from jumping out from the communication hole 18.

As described above, by providing the O-ring which can be hermetically sealed and having the piston movable inside the communication hole, the piston moves inside the communication hole according to the pressure fluctuation inside the container. By doing so, the internal pressure is kept substantially constant with the internal pressure at room temperature.

As described above, according to this embodiment, it is possible to suppress the fluctuation of the internal pressure of the container without increasing the size of the container.

Next, the structure of the hermetically sealed container according to another embodiment of the present invention will be described with reference to FIG. In this embodiment, the hermetically sealed container is applied to the container of the multi-chip module. FIG. 2 is a cross-sectional view showing the structure of the hermetically sealed container according to another embodiment of the present invention.

In this embodiment, the ceramic multilayer wiring board 22 and the frame 24 are fixed to each other with solder or the like to form the base portion 20A. The frame 24 is made of, for example, an iron material. A plurality of L's are formed on the ceramic multilayer wiring board 22 by solder bumps 52.
SI50 is stuck. O on the base 20A
The lid portion 10A is connected via the ring 12, and the lid portion 10A
The airtightness of the space 16 formed between A and the base portion 20A is ensured. The upper surface of the LSI 50 and the lid 10A are fixed to each other by grease 54 or the like, and the heat generated by the LSI 50 is transmitted to the lid 10A. Lid 10
A forced cooling component 13 such as a water cooling jacket or an air cooling fin is integrally formed on the upper portion of A. LSI50
Of the heat is transmitted to the lid 10A, and the forced cooling component 13
The LSI 50 is cooled by. The space 16 is filled with nitrogen gas, helium gas, dry air, and the like.

Further, similarly to the embodiment shown in FIG. 1, a communication hole 18 for communicating the space 16 with the outside is formed in the lid 10A. A piston 30 having an O-ring 32 is arranged in the communication hole 18.
The piston 30 can move inside the communication hole 18.
The O-ring 32 is pressed against the wall surface of the communication hole 18, and the space 16 and the outside are hermetically sealed by the piston 30 having the O-ring 32.

Therefore, when the LSI or the like is energized, the temperature of the heat generating component such as the LSI or the like rises to a high temperature (for example, 80 ° C.), and the gas (nitrogen or atmosphere) enclosed in the space 16 inside the container is accordingly increased. When the temperature rises to the same level and the gas tries to expand, the internal pressure of the container increases, so that the piston 30 moves and stops at a position where the internal pressure of the space 16 and the external atmospheric pressure are balanced, and the internal pressure It is possible to suppress the rise of. When the LSI or the like is used after being cooled to, for example, about −50 ° C., when the internal pressure of the container drops to, for example, about 0.8 atm, the piston 30 moves to the internal pressure of the space 16, The piston 30 stops at a position where the outside air pressure is balanced, and it is possible to suppress the rise in the inside pressure. Therefore, it is possible to prevent the strain from concentrating on each part and the change in the contact state with the external medium due to the increase / decrease in the internal pressure of the container. Moreover, the piston 30
Since it is provided inside the lid portion 10, the airtight sealed container itself can be made lightweight and compact.

A lid member 40 is attached and fixed to the outer wall surface of the lid portion 10 and the opening portion of the communication hole 18.
The lid member 40 causes the internal pressure to rise excessively and the piston 30
However, it is provided in order to prevent it from jumping out from the communication hole 18.

As described above, by providing the O-ring which can be hermetically sealed and having the piston movable inside the communication hole, the piston moves inside the communication hole according to the pressure fluctuation inside the container. By doing so, the internal pressure inside the module is kept substantially constant with the internal pressure at room temperature.

As described above, according to this embodiment, it is possible to suppress the fluctuation of the internal pressure of the container without increasing the size of the container.

[0021]

According to the present invention, fluctuations in the internal pressure of the container can be suppressed without increasing the size of the container.

[Brief description of drawings]

FIG. 1 is a sectional view showing a configuration of an airtightly sealed container according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the structure of an airtightly sealed container according to another embodiment of the present invention.

[Explanation of symbols]

10, 10A ... Lid 12, 32 ... O-ring 13 ... Forced cooling parts 16 ... Space 18 ... Communication hole 20, 20A ... Base part 22 ... Ceramic multilayer wiring board 24 ... Frame 30 ... Piston 40 ... Lid member 50 ... LSI 52 ... Solder bump 54 ... Solder

Claims (2)

[Claims] 1. A hermetically sealed container in which an internal space is hermetically sealed, wherein the container is arranged in a hole communicating with the space provided in a member forming the container, and the inside of the hole is hermetically sealed. An airtight sealed container comprising a sliding member capable of sliding while maintaining the above. 2. The hermetically sealed container according to claim 1, further comprising a pop-out prevention member for preventing the sliding member from popping out.