JP2003019717A5

JP2003019717A5 -

Info

Publication number: JP2003019717A5
Application number: JP2002124352A
Authority: JP
Filing date: 2002-04-25
Publication date: 2005-07-07
Anticipated expiration: 2022-04-25

Claims

(A) A mold for molding a molded product made of a thermoplastic resin, which comprises a first mold part and a second mold part, and a cavity is formed at the time of clamping,
(B) a nest disposed inside the first mold part;
(C) a stamper made of a metal film that is detachably mounted on the surface of the nest facing the cavity and has an uneven portion on the surface;
(D) a gate portion for injecting the molten thermoplastic resin into the cavity;
A mold assembly comprising:
The nest has a thermal conductivity of 1.3 (W / m · K) to 6.3 (W / m · K), a Vickers hardness of 550 kg / mm ² or more, and a Young's modulus of 4.9 × 10 ¹⁰ N / m. ^{2. A} mold assembly, wherein the mold assembly is made of a material having a thickness of 0.5 mm to 5.0 mm.

(E) a covering plate that is attached to the first mold part or the second mold part, forms a part of the cavity, and covers the end of the insert;
Further comprising
The clearance between the nesting and the covering plate, or the clearance between the stamper and the covering plate detachably mounted on the surface of the nesting is 0.001 mm to 0.02 mm. Item 2. A mold assembly according to Item 1.

3. The mold assembly according to claim 1, wherein a thin film is formed on a surface of the nest facing the cavity.

4. The mold assembly according to claim 3 , wherein the thin film is made of at least one material selected from the group consisting of TiN, TiAlN, TiC, CBN, BN, amorphous diamond, CrN and Cr.

5. The mold assembly according to claim 3 , wherein the thickness of the thin film is 5 × 10 ⁻⁷ m to 2 × 10 ⁻⁵ m.

Metal film, Cr, Cr compound, at least one that consists of a material, characterized in claims 1 to mold set according to any one of claims 5 selected from the group consisting of Ni and Ni compounds Solid.

The mold assembly according to any one of claims 1 to 6 , wherein the metal film has a thickness of 0.01 mm to 0.4 mm.

The die assembly according to any one of claims 1 to 7, wherein a plating layer is formed on an end portion and / or a side surface of the insert.

A through hole is provided in the center of the nest,
A metal sleeve for covering the stamper portion near the through hole is attached to the first mold part through the through hole,
The mold assembly according to any one of claims 1 to 8 , wherein the clearance between the sleeve tip and the portion of the stamper is 5 µm to 30 µm.

Disposed within the second mold part, gold according to any one of claims 1 to 9, characterized in that it further comprises a second telescopic constituting a part of the cavity Mold assembly.

(A) A mold for molding a molded product made of a thermoplastic resin, which comprises a first mold part and a second mold part, and a cavity is formed at the time of clamping,
(B) a nest disposed inside the first mold part;
(C) an active metal layer formed on the surface of the nest facing the cavity;
(D) a metal film formed on the active metal layer and provided with an uneven portion on the surface;
(E) a gate portion for injecting the molten thermoplastic resin into the cavity;
A mold assembly comprising:
The nest has a thermal conductivity of 1.3 (W / m · K) to 6.3 (W / m · K), a Vickers hardness of 550 kg / mm ² or more, and a Young's modulus of 4.9 × 10 ¹⁰ N / m. ^{2. A} mold assembly, wherein the mold assembly is made of a material having a thickness of 0.5 mm to 5.0 mm.

(F) a covering plate that is attached to the first mold part or the second mold part, forms a part of the cavity, and covers the end of the insert;
Further comprising
Clearance between the nested and the cover plate, or the clearance between the metal film formed on nesting of said surface and the cover plate, to claim 11, characterized in that a 0.001mm to 0.02mm The mold assembly as described.

The active metal layer comprises a eutectic composition of a metal selected from the group consisting of Ti, Zr and Be and a metal selected from the group consisting of Ni, Cu, Ag and Fe;
13. The mold assembly according to claim 11, wherein the active metal layer has a thickness of 1 × 10 ⁻⁶ m to 5 × 10 ⁻⁵ m.

The metal mold assembly according to any one of claims 11 to 13 , wherein the metal film is made of at least one material selected from the group consisting of Cr, Cr compound, Ni, and Ni compound. Solid.

The mold assembly according to any one of claims 11 to 14 , wherein the metal film has a thickness of 0.01 mm to 0.4 mm.

The die assembly according to any one of claims 11 to 15, wherein a plating layer is formed on an end portion and / or a side surface of the insert .

A through hole is provided in the center of the nest,
A metal sleeve for covering the metal film portion in the vicinity of the through hole is attached to the first mold part through the through hole,
The mold assembly according to any one of claims 11 to 16 , wherein the clearance between the sleeve tip and the portion of the metal film is 5 µm to 30 µm.

18. The metal mold according to claim 11 , further comprising a second nest disposed inside the second mold part and constituting a part of the cavity. Mold assembly.

(A) A mold for molding a molded product made of a thermoplastic resin, which comprises a first mold part and a second mold part, and a cavity is formed at the time of clamping,
(B) a nest disposed inside the first mold part;
(C) a stamper made of a metal film that is detachably mounted on the surface of the nest facing the cavity and has an uneven portion on the surface;
(D) a gate portion for injecting the molten thermoplastic resin into the cavity;
With
The nest has a thermal conductivity of 1.3 (W / m · K) to 6.3 (W / m · K), a Vickers hardness of 550 kg / mm ² or more, and a Young's modulus of 4.9 × 10 ¹⁰ N / m. ² or more, an injection molding method of a thermoplastic resin using a mold assembly made of a material having a thickness of 0.5 mm to 5.0 mm,
The first mold part and the second mold part are clamped, and after the molten thermoplastic resin is injected from the gate part into the cavity, the thermoplastic resin in the cavity is cooled and solidified, and then the mold is opened. And an injection molding method characterized by taking out the molded product from the mold.

The mold assembly is a structure that can change the volume of the cavity,
The first mold part and the second mold part are clamped so that the volume of the cavity is larger than the volume of the molded product to be molded,
Injecting a molten thermoplastic resin into the cavity;
Injection before starting thermoplastic resin, simultaneously with the start of claim 19, wherein during the injection, or after completion of injection, to start the reduction of the to a volume of the molded article to be molded a volume of the cavity Injection molding method.

(E) a covering plate that is attached to the first mold part or the second mold part, forms a part of the cavity, and covers the end of the insert;
Further comprising
Clearance between the nested and the cover plate or the clearance between the freely placed on the stamper detachably nested in said surface and the cover plate, characterized in that it is a 0.001mm to 0.02mm claims Item 21. The injection molding method according to Item 20 .

The injection molding method according to any one of claims 19 to 21 , wherein the molded product is an optical disk substrate.

23. The injection molding method according to claim 22 , wherein the concavo-convex portions provided on the surface of the metal film are provided to form grooves or pits having a track pitch of 0.76 μm or less on the optical disk substrate. .

(A) A mold for molding a molded product made of a thermoplastic resin, which comprises a first mold part and a second mold part, and a cavity is formed at the time of clamping,
(B) a nest disposed inside the first mold part;
(C) an active metal layer formed on the surface of the nest facing the cavity;
(D) a metal film formed on the active metal layer and having a concavo-convex portion on the surface;
(E) a gate portion for injecting the molten thermoplastic resin into the cavity;
With
The nest has a thermal conductivity of 1.3 (W / m · K) to 6.3 (W / m · K), a Vickers hardness of 550 kg / mm ² or more, and a Young's modulus of 4.9 × 10 ¹⁰ N / m. ² or more, an injection molding method of a thermoplastic resin using a mold assembly made of a material having a thickness of 0.5 mm to 5.0 mm,
The first mold part and the second mold part are clamped, and after the molten thermoplastic resin is injected from the gate part into the cavity, the thermoplastic resin in the cavity is cooled and solidified, and then the mold is opened. And an injection molding method characterized by taking out the molded product from the mold.

The mold assembly is a structure that can change the volume of the cavity,
The first mold part and the second mold part are clamped so that the volume of the cavity is larger than the volume of the molded product to be molded,
Injecting a molten thermoplastic resin into the cavity;
Injection before starting thermoplastic resin, simultaneously with the start of claim 24, wherein during the injection, or after completion of injection, to start the reduction of the to a volume of the molded article to be molded a volume of the cavity Injection molding method.

(F) a covering plate that is attached to the first mold part or the second mold part, forms a part of the cavity, and covers the end of the insert;
Further comprising
Clearance between the nested and the cover plate, or the clearance between the metal layer and the cover plate disposed nested the surface preceding claims, characterized in that a 0.001mm to 0.02mm The injection molding method according to claim 24 or 25 .

27. The injection molding method according to claim 24 , wherein the molded product is an optical disk substrate.

28. The injection molding method according to claim 27 , wherein the concavo-convex portion provided on the surface of the metal film is provided to form grooves or pits having a track pitch of 0.76 [mu] m or less on the optical disk substrate. .