JP2003017519A - Resin sealing apparatus for semiconductor device and method for manufacturing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a means by which accumulated error of components in a resin sealing apparatus for a semiconductor device can be reduced or excluded and adjustments to the thickness of inserts and positions or the like can be make unnecessary. SOLUTION: In an upper mold D1 of the resigning seal apparatus, holes 4 to be located in both sides of an upper mold cavity 1 are formed at cavity inserts 3, and a first and a second upper mold side surface cavity peaces 6, 8 are inserted into these holes 4. Then the cavity is formed by the cavity insert 3 of the upper mold D1 and both upper mold side surface cavity peaces 6, 8, and the cavity insert of a lower mold and lower die side surface cavity peaces. As a result, the accumulated error of components constituting the resin sealing apparatus is reduced and thus adjustments to the thickness of inserts and positions or the like become unnecessary.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing device for a semiconductor device and a method for manufacturing the semiconductor device. More specifically, the present invention relates to a semiconductor resin sealing mold die used when sealing a semiconductor element mounted on a lead frame and connected by a bonding wire or the like with a molding resin.

[0002]

2. Description of the Related Art Generally, in a semiconductor device, a semiconductor element is mounted on a lead frame, and various wirings such as bonding wires and leads are connected to the semiconductor element. The semiconductor device is resin-sealed in order to protect the semiconductor element or the wiring connected to the semiconductor element. As a resin sealing device for such a semiconductor device,
For example, JP-A-6-238672 and JP-A-3-77
As disclosed in Japanese Patent No. 335 or Japanese Patent Laid-Open No. 5-15961, a mold using a mold or a resin-sealing mold is widely used.

Specifically, as such a resin sealing device, for example, after clamping two upper and lower mold plates mounted on a transfer molding press, a resin tablet in a transfer pot is pressure fed into a cavity by a plunger. However, it is known that molding is performed. This type of resin sealing device generally includes an upper mold plate having a cavity for forming one package and a lower mold plate having a cavity for forming the other package provided below the upper mold plate so as to be movable back and forth. And a ejecting mechanism having ejector pins housed in both mold plates and advancing and retracting inside each cavity. In addition, a transfer pot in which a plunger for pressing the tablet advances and retracts is provided at the center of the upper template.

FIG. 7 is a vertical cross-sectional view of a molding die mounted on a conventional resin sealing device of this type. Also, FIG.
FIG. 8 is a bottom plan view of the upper die of the molding die shown in FIG. 7. As shown in FIGS. 7 and 8, the molding die is composed of an upper die D and a lower die L. Here, in the upper mold D,
Upper mold cavity insert 1 having upper mold cavity 1
7, an upper mold side surface cavity insert 18 having a gate 5, an upper mold side surface cavity insert 19 having an air vent 7, and a runner insert 20 having a runner 2.
And an upper retainer 22 having a cull 21. It should be noted that the upper die retainer 22 corresponds to each of the inserts 1 described above.
Holds 7 to 20.

On the other hand, the lower mold L is provided with a lower mold cavity insert 27 having a lower mold cavity 26, a lower mold lateral cavity insert 28, and a lower mold lateral cavity insert 29 having an air vent (not shown). ing. A semiconductor element 24 is mounted on a lead frame 23 arranged between the upper die D and the lower die L via a die pad frame 25. A lead 30 is connected to the semiconductor element 24.

Next, the operation of the molding die will be described. First, the frame surface 23a on which the leads 30 are exposed faces upward, and the frame surface 2 on which the die pad 25 is exposed.
The lead frame 23 is sandwiched between the upper die D and the lower die L so that the surface 3b faces downward. At this time, the lead frame 23 is sandwiched between the upper die cavity insert 17 and the lower die cavity insert 27 in a certain portion, and the upper die side cavity insert 18 in another portion.
It is sandwiched between the (convex shape) and the lower side surface cavity insert 28 (concave shape), and in another portion, the upper mold side surface cavity insert 19 (convex shape) and the lower side surface cavity insert 29 (concave shape). Sandwiched between. After this,
Mold resin is injected into the upper mold cavity 1 and the lower mold cavity 26, and the semiconductor element 24 or the leads 30 are resin-sealed to form a package.

[0007]

As described above, in the molding die of the conventional resin sealing device, the inserts forming the side walls of the cavities 1 and 26 are concave or convex due to the requirement of processing accuracy. It is divided into 18, 19, 28, and 29. Therefore, when assembling the molding die, the errors in the thickness machining accuracy of the inserts 18, 19, 28, and 29 are accumulated, and the predetermined die performance (for example,
There is a problem that it is difficult to satisfy the deviation between the cavity and the frame and the deviation between the upper mold cavity and the lower mold cavity.

Further, in recent years, the package layout of the lead frame of the semiconductor device has been multi-rowed in order to efficiently manufacture more packages. For this reason, the number of divisions of the insert of the resin sealing device becomes very large. As a result of increasing the number of insert divisions,
In order to satisfy the mold performance, it is necessary to measure the center of the cavity and adjust the thickness of the insert when assembling the mold. Therefore, there is a problem that it takes a long time to complete the mold assembly, which leads to an increase in the manufacturing cost of the mold and a longer delivery time.

Further, if the insertion position of the insert is wrong at the time of disassembling and reassembling due to cleaning of the mold, replacement of parts, etc., product defects may occur. Therefore, it is necessary to manage the position and thickness of the insert. Further, when the replacement parts of the insert are held, the number of holding parts increases in proportion to the number of inserts. For this reason, there is a problem that the total cost required for manufacturing and managing the mold is increased.

The present invention has been made to solve the above conventional problems, and can reduce or eliminate the cumulative error (cumulative tolerance) of parts in a resin sealing device for a semiconductor device, and It is an object or an object to be solved to provide means capable of eliminating the need for adjustment of thickness, position, etc., and achieving high precision of a molding die, cost reduction, and the like.

[0011]

DISCLOSURE OF THE INVENTION The present invention, which has been made to solve the above-mentioned problems, provides a cavity encapsulation and groove processing for a cavity insert in a resin sealing device for a semiconductor device. The basic feature is to incorporate a concave or convex side surface cavity piece, a cavity insert, and the like. As a result, in this resin sealing device, it is not necessary to adjust the thickness of the component, and the insert can be incorporated in the mold without managing the position and thickness of the component.

Specifically, in a resin sealing device for a semiconductor device according to a first aspect of the present invention, (i) a lead having a semiconductor element mounted in a cavity formed by an upper die and a lower die. A resin encapsulation device for a semiconductor device in which a frame is housed and a semiconductor element is encapsulated with resin by filling (injecting) resin into a cavity, and (ii) a cavity insert in each of an upper mold and a lower mold. Is provided, and in each of the cavity inserts, a hole located on each side of the cavity is formed for each cavity, and (iii) is inserted into the hole for each of the upper mold and the lower mold and Cavity pieces forming both side walls are provided, and the upper mold cavity piece and the lower mold cavity piece are mutually (for each cavity insert). One has a concave shape and the other has a convex shape, and (iv) the cavity is formed by the upper mold cavity insert and cavity piece and the lower mold cavity insert and cavity piece. It is characterized by that.

A resin sealing device for a semiconductor device according to a second aspect of the present invention is the resin sealing device according to the first aspect, in which the hole portion extends over a plurality of cavities instead of each cavity ( And a cavity piece inserted into the hole is formed so as to form a side wall of the plurality of cavities.

A resin encapsulation device for a semiconductor device according to a third aspect of the present invention is the resin encapsulation device according to the first aspect, wherein each cavity insert is replaced with a plurality of (all in one row) instead of holes. (1) A grooved portion is formed which extends over the cavities and into which the cavity pieces forming the side walls of the plurality of cavities are inserted.

A resin sealing device for a semiconductor device according to a fourth aspect of the present invention is the resin sealing device according to any one of the first to third aspects, in which the upper mold cavity insert and the cavity piece are provided. The semiconductor element is sealed with resin while sandwiching the upper and lower surfaces of the lead frame with the lower mold cavity insert and the cavity piece.

A resin sealing device for a semiconductor device according to a fifth aspect of the present invention is the resin sealing device according to any one of the first to fourth aspects, wherein the cavity piece and the hole are the same. The cavity piece is provided with an inclined surface, and the cavity piece is positioned or fixed (assembled) in the hole portion by bringing the inclined surface into contact with the inclined surface of the hole portion.

A resin encapsulation device for a semiconductor device according to a sixth aspect of the present invention is the resin encapsulation device according to any one of the first to fifth aspects, wherein two cavities sandwiching the cavity are opposed to each other. One of the pieces is provided with a gate for introducing the resin into the cavity.

A resin sealing device for a semiconductor device according to a seventh aspect of the present invention is the resin sealing device according to the sixth aspect, wherein the cavity piece facing the cavity piece provided with the gate is sandwiched between the cavity piece and the cavity piece. An air vent is provided in (the other cavity piece).

A resin encapsulation device for a semiconductor device according to an eighth aspect of the present invention is the resin encapsulation device according to any one of the first to seventh aspects, wherein the gate is a transpot via a runner. And the resin is supplied from the transfer pot to the cavity.

A method of manufacturing a semiconductor device according to the present invention is
Manufacturing a packaged semiconductor device by sealing a semiconductor element mounted on a lead frame with a resin using the resin sealing device according to any one of the first to eighth aspects of the present invention. It is characterized by.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be specifically described below. Embodiment 1. First, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a bottom plan view of an upper mold forming a resin sealing device (semiconductor resin sealing mold die) of a semiconductor device according to a first embodiment of the present invention. Figure 2
[Fig. 2] is a perspective view of a main part of the upper mold shown in Fig. 1. Although not shown, this resin sealing device is composed of an upper mold and a lower mold (see FIG. 7).

As shown in FIGS. 1 and 2, the upper mold D1 of the resin sealing device for a semiconductor device has a cavity provided with three upper mold cavities 1 arranged in a line and a runner 2 extending in the cavity arrangement direction. An insert 3 is provided. Although not shown, the cavity insert 3 has
A plurality of rows of the upper mold cavities 3 and the runners 2 arranged in this way are arranged in a direction perpendicular to the cavity arrangement direction (see FIG.
They are provided side by side in the horizontal direction (see FIG. 7). Further, the upper die D1 is provided with an upper die retainer 22 having a cull 21, similarly to the upper die D of the conventional molding die shown in FIGS. 7 and 8. The cavity insert 3 is held by the upper die retainer 22.

The cavity insert 3 is provided with two holes 4 located on both sides of the upper mold cavity 1 by drilling for each upper mold cavity 1. here,
Hole 4 located on the side of the runner 2 (right side in FIG. 1)
A first upper mold side surface cavity piece 6 having a gate 5 is inserted in the. On the other hand, the side opposite to the runner 2 (see FIG.
A second upper mold side surface cavity piece 8 having an air vent 7 is inserted into the hole portion 4 located on the left side). Here, the gate 5 is provided for introducing the resin into the cavity. Further, the air vent 7 is provided for discharging the air in the cavity to the outside when filling or injecting the resin into the cavity. In addition,
The gate 5 is connected to a transpot (not shown) via the runner 2.

Thus, the cavity insert 3 and the first
The upper die side surface cavity piece 6 and the second upper die side surface cavity piece 8 form the upper die cavity 1.
At this time, the upper mold side surface cavity pieces 6 and 8 form both side walls of the upper mold cavity 1. The upper mold side surface cavity pieces 6 and 8 are respectively the cavity insert 3
It has a convex shape that slightly protrudes from the spreading surface of.

As is clear from FIG. 2, the first upper mold side surface cavity piece 6 and the second upper mold side surface cavity piece 8 are formed with inclined surfaces 6a and 8a (inclined portions), respectively. On the other hand, in the hole portion 4, the inclined surface 6a,
An inclined surface 4a having the same inclination degree (inclination angle) as 8a is formed. Here, each upper mold side surface cavity piece 6, 8
Are positioned or fixed in the hole portion 4 by bringing the inclined surfaces 6a and 8a into contact with the corresponding inclined surface 4a of the hole portion 4, respectively.

Although not shown, the lower mold of this resin sealing device also has the same structure as the upper mold D1 shown in FIGS. However, in the case of the lower mold, each of the two lower mold side surface cavity pieces is slightly concave from the expanding surface of the cavity insert and has a concave shape. That is, the upper mold side surface cavity pieces 6 and 8 and the lower mold side surface cavity pieces are formed in a shape such that the former is convex and the latter is concave, whereby the upper mold D1 and the lower mold are assembled. When the upper mold side surface cavity pieces 6 and 8 are engaged, the lower mold side surface cavity pieces 6 and 8 are fitted or engaged with each other.

The lead frame 23 (see FIG. 7)
The semiconductor element 24 or the lead 30 mounted on the
(See FIG. 2) is sealed with resin, the lead frame 23 is sandwiched between the upper mold D1 and the lower mold. Specifically, the semiconductor element 2 is placed in the cavity formed by the upper mold D1 and the lower mold.
4 or the lead 30 is accommodated and the upper die D
The upper die 23 and the upper die side cavity pieces 6 and 8 and the lower die cavity insert and the lower die side cavity pieces sandwich the upper surface 23a and the lower surface 23b of the lead frame 23 with the upper die D1. Assemble with the lower mold.

After this, a transfer pot (not shown)
Then, the mold resin is injected into the upper mold cavity 1 and the lower mold cavity through the runner 2 and the gate 5, and the semiconductor element 24 or the lead 30 is resin-sealed to form a semiconductor device package.

According to the resin sealing device according to the first embodiment, the cumulative error (cumulative tolerance) of the parts constituting the resin sealing device can be reduced or eliminated. Also,
There is no need to adjust the thickness and position of the insert. As a result, it is possible to achieve high precision of the mold, reduction of assembly time, reduction of cost, and the like.

Embodiment 2. The second embodiment of the present invention will be described below with reference to FIGS. 3 and 4. However, the resin sealing device for a semiconductor device according to the second embodiment has many common points with the first embodiment shown in FIGS. 1 and 2, and therefore, in order to avoid duplication of description, it is common with the first embodiment. The same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted. Below, mainly the points different from the first embodiment will be described.

FIG. 3 shows a second embodiment of the present invention.
FIG. 3 is a bottom plan view of an upper mold forming a resin sealing device (semiconductor resin sealing mold die) of a semiconductor device. FIG. 4 is a perspective view of the upper mold shown in FIG. Although not shown, this resin sealing device is composed of an upper mold and a lower mold. As shown in FIGS. 3 and 4, in the second embodiment, the holes 4 (see FIGS. 1 and 2) for each cavity in the first embodiment are not provided, and instead of this, the holes 4 are arranged in one row. 3
A straddle hole portion 10 is formed so as to straddle (cross) one upper mold cavity 1.

The first upper mold side surface cavity piece 11 common to the three upper mold cavities 1 is inserted into the straddle hole portion 10 on the runner 2 side. Gates 5 are provided on the first upper mold side surface cavity piece 11 at positions corresponding to the three upper mold cavities 1, respectively.
On the other hand, one second upper mold side surface cavity piece 12 common to the three upper mold cavities 1 is inserted into the straddle hole portion 10 on the opposite side of the runner 2. Air vents 7 are provided at positions corresponding to the three upper mold cavities 1 on the second upper mold side surface cavity piece 12, respectively. It should be noted that the straddle hole portion 10 and the upper mold side surface cavity pieces 11 and 12 are provided with inclined surfaces 10a and inclined surfaces 11a and 12a, respectively, as in the first embodiment. The other points are similar to those of the first embodiment.

Thus, also in the resin sealing device according to the second embodiment, as in the case of the first embodiment, the cumulative error (cumulative tolerance) of the parts constituting the resin sealing device is reduced or eliminated. You can Further, it is not necessary to adjust the thickness and position of the insert. As a result, it is possible to achieve high precision of the mold, reduction of assembly time, reduction of cost, and the like. Further, since it is only necessary to provide one set (two) of the straddling hole 10 and the upper mold side surface cavity pieces 11 and 12 for the three upper mold cavities, the number of parts is reduced, and the precision of the mold is improved. The effect of shortening the assembly time and the effect of reducing the cost can be further enhanced.

Embodiment 3. The third embodiment of the present invention will be described below with reference to FIGS. 5 and 6. However, the resin sealing device for a semiconductor device according to the third embodiment has many common points with the first embodiment shown in FIGS. 1 and 2, and therefore, in order to avoid duplication of description, it is common with the first embodiment. The same components as those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be omitted. Below, mainly the points different from the first embodiment will be described.

FIG. 5 shows the third embodiment of the present invention.
FIG. 3 is a bottom plan view of an upper mold forming a resin sealing device (semiconductor resin sealing mold die) of a semiconductor device. FIG. 6 is a perspective view of the upper mold shown in FIG. Although not shown, this resin sealing device is composed of an upper mold and a lower mold. As shown in FIGS. 5 and 6, in the third embodiment, the holes 4 (see FIGS. 1 and 2) for each cavity in the first embodiment are not provided, and instead of this, the holes 4 are arranged in one row. 3
One grooved part 1 straddling one upper mold cavity 1
4 (groove portion) is formed.

In the grooved portion 14 on the runner 2 side,
A common first upper mold side surface cavity piece 15 is inserted into the three upper mold cavities 1. Gates 5 are provided on the first upper mold side surface cavity piece 15 at positions corresponding to the three upper mold cavities 1, respectively. On the other hand, in the grooved portion 14 on the side opposite to the runner 2, the second upper mold side surface cavity piece 1 common to the three upper mold cavities 1 is formed.
6 has been inserted. Air vents 7 are provided at positions corresponding to the three upper mold cavities 1 of the second upper mold side surface cavity piece 16. The grooved portion 14 and the upper mold side surface cavity pieces 15 and 16 are provided with inclined surfaces 14a and 15a and 16a, respectively, as in the first embodiment. The other points are similar to those of the first embodiment.

Thus, also in the resin sealing device according to the third embodiment, as in the case of the first embodiment, the cumulative error (cumulative tolerance) of the parts constituting the resin sealing device is reduced or eliminated. You can Further, it is not necessary to adjust the thickness and position of the insert. As a result, it is possible to achieve high precision of the mold, reduction of assembly time, reduction of cost, and the like. Further, since it is only necessary to provide one set (two) of grooved portions 14 and upper die side surface cavity pieces 15 and 16 for the three upper die cavities, the number of parts is reduced, and the effect of improving the precision of the die is obtained. The effect of shortening the assembly time and the effect of reducing the cost can be further enhanced. Further, since the groove processing is easier than the hole processing, the upper mold and the lower mold can be easily manufactured.

In each of the first to third embodiments, the upper mold side surface cavity piece has a convex shape and the lower mold side surface cavity piece has a concave shape. However, depending on the specifications of the lead frame or the package, the upper mold side surface cavity piece may be formed. The piece may have a concave shape and the lower mold side surface cavity piece may have a convex shape. Also in this case, the same operation and effect as those in the first to third embodiments are achieved. Further, a conventional upper mold or lower mold as shown in FIG. 7, for example, may be used for either the upper mold or the lower mold.

[0039]

According to the resin sealing device of the first aspect of the present invention, in each of the upper mold and the lower mold, the cavity inserts are formed with holes located on both sides of the cavity. The cavity piece is inserted into the cavity mold, and the cavity insert and the cavity piece of the upper mold and the cavity insert and the cavity piece of the lower mold form a cavity. Therefore, it is possible to reduce or eliminate the cumulative error of the components forming the resin sealing device. Further, it is not necessary to adjust the thickness and position of the insert. As a result, it is possible to achieve high precision of the mold, reduction of assembly time, reduction of cost, and the like.

According to the resin sealing device of the second aspect of the present invention, like the resin sealing device of the first aspect,
Cumulative errors of the components that make up the resin sealing device can be reduced or eliminated, and the thickness and position of the insert need not be adjusted. As a result, it is possible to achieve high precision of the mold, reduction of assembly time, reduction of cost, and the like. Furthermore, since it is only necessary to provide one set (two) of holes and side cavity pieces for multiple cavities, the number of parts is reduced, the precision of the mold is improved, the assembly time is shortened, and the cost is reduced. The effect and the like can be further enhanced.

According to the resin sealing device of the third aspect of the present invention, like the resin sealing device of the first aspect,
Cumulative errors of the components that make up the resin sealing device can be reduced or eliminated, and adjustment of the thickness and position of the insert becomes unnecessary. As a result, it is possible to achieve high precision of the mold, reduction of assembly time, reduction of cost, and the like. Furthermore, since it is only necessary to provide one set (two) of grooved parts and side cavity pieces for multiple cavities,
The number of parts is reduced, and the effect of improving the precision of the mold, the effect of shortening the assembly time, the effect of reducing the cost, etc. can be further enhanced. Further, since the groove processing is easier than the hole processing, the upper mold and the lower mold can be easily manufactured.

According to the resin sealing device of the fourth aspect of the present invention, basically any one of the first to third aspects is used.
The same action and effect as the resin sealing device according to the third aspect can be obtained. Further, since the semiconductor element is sealed with resin while sandwiching the upper and lower surfaces of the lead frame, it is possible to accurately perform resin sealing at a predetermined position of the lead frame.

According to the resin sealing device of the fifth aspect of the present invention, basically any one of the first to fourth aspects is used.
The same action and effect as the resin sealing device according to the third aspect can be obtained. Furthermore, since the cavity piece is positioned in the hole by bringing its inclined surface into contact with the inclined surface of the hole, the cavity piece can be accurately positioned and the cumulative error can be further reduced.

According to the resin sealing device of the sixth aspect of the present invention, basically any one of the first to fifth aspects is used.
The same action and effect as the resin sealing device according to the third aspect can be obtained. Furthermore, since the gate is provided on one of the cavity pieces, it is easy to inject the resin into the cavity.

According to the resin sealing device of the seventh aspect of the present invention, basically, the same operation and effect as those of the resin sealing device of the sixth aspect can be obtained. Further, since the air vent is provided in the cavity piece that is not provided with the gate, the air in the cavity can be easily discharged to the outside when the resin is injected into the cavity.

According to the resin sealing device of the eighth aspect of the present invention, basically any one of the first to seventh aspects is used.
The same action and effect as the resin sealing device according to the third aspect can be obtained. Further, since the resin can be supplied from the transfer pot to the cavity via the runner and the gate, the resin can be supplied smoothly.

According to the method of manufacturing a semiconductor device of the present invention, since the resin sealing device according to any one of the first to eighth aspects is used, the precision of the mold is improved and the assembly time is improved. It is possible to manufacture a packaged semiconductor device by encapsulating a semiconductor element with a resin while achieving shortening and cost reduction.

[Brief description of drawings]

FIG. 1 is a bottom plan view showing the configuration of an upper die of a resin sealing device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration of a main part of the upper mold shown in FIG.

FIG. 3 is a bottom plan view showing the configuration of the upper die of the resin sealing device according to the second embodiment of the present invention.

FIG. 4 is a perspective view showing a configuration of a main part of the upper mold shown in FIG.

FIG. 5 is a bottom plan view showing the configuration of the upper die of the resin sealing device according to the third embodiment of the present invention.

FIG. 6 is a perspective view showing a configuration of a main part of the upper mold shown in FIG.

FIG. 7 is a cross-sectional view showing the configuration of a conventional resin-molding mold die for a semiconductor device.

FIG. 8 is a bottom plan view of an upper mold forming the conventional resin-molding mold shown in FIG. 7.

[Explanation of symbols]

D upper mold, D1 upper mold, D2 upper mold, D3 upper mold, L lower mold, 1 upper mold cavity, 2 runner,
3 Upper mold cavity insert, 4 Hole, 4
a inclined surface, 5 gates, 6 first upper mold side surface cavity piece, 6a inclined surface, 7 air vent, 8
2nd upper mold side surface cavity piece, 8a inclined surface, 9
Upper mold cavity insert, 10 straddle hole,
10a inclined surface, 11 1st upper mold side surface cavity piece, 11a inclined surface, 12 2nd upper mold side surface cavity piece, 12a inclined surface, 13 upper mold cavity insert, 14 groove processing part, 14a inclined surface, 15 1st upper surface Mold side cavity piece, 15a
Inclined surface, 16 second upper mold side surface cavity piece,
16a inclined surface, 17 upper mold cavity insert,
18 Upper Mold Side Cavity Insert, 19 Upper Mold Side Cavity Insert, 20 Runner Insert, 21 Cull, 22 Upper Mold Retainer, 23 Lead Frame, 23a Upper Surface, 23b Lower Surface, 24
Semiconductor element, 25 die pad frame, 26
Lower mold cavity, 27 Lower mold cavity insert,
28 lower mold side surface cavity insert, 29 lower mold side surface cavity insert, 30 lead.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toru Ueno             2-6-2 Otemachi 2-chome, Chiyoda-ku, Tokyo             Ryoden Engineering Co., Ltd. (72) Inventor Hiromichi Yamada             2-6-2 Otemachi 2-chome, Chiyoda-ku, Tokyo             Ryoden Engineering Co., Ltd. (72) Inventor Tetsuya Hirose             2-3 2-3 Marunouchi, Chiyoda-ku, Tokyo             Inside Ryo Electric Co., Ltd. (72) Inventor Katsuaki Makoto             Ryoden Semi, 4-chome, Mizuhara, Itami City, Hyogo Prefecture             Conductor system engineering stock             In the company F-term (reference) 4F202 AH37 CA12 CB01 CK12 CK43                 5F061 AA01 BA01 CA21 DA01 DA03                       DA05 DA06 DA08

Claims (9)

[Claims] 1. A lead frame having a semiconductor element mounted therein is housed in a cavity formed by an upper die and a lower die, and a resin is filled in the cavity to seal the semiconductor element with the resin. In a resin sealing device for a semiconductor device, a cavity insert is provided in each of the upper die and the lower die, and holes are formed on both sides of the cavity for each cavity in each cavity insert. The mold and the lower mold are each provided with a cavity piece that is inserted into the above-mentioned hole and forms both side walls of the cavity, and one of the upper mold cavity piece and the lower mold cavity piece has a concave shape. The other is formed into a convex shape, and the upper mold cavity insert and cavity piece,
A resin encapsulation device for a semiconductor device, wherein the cavity is formed by a lower mold cavity insert and a cavity piece. 2. The hole is formed so as to straddle a plurality of cavities, and the cavity piece inserted into the hole is formed so as to form a side wall of the plurality of cavities. A resin encapsulation device for a semiconductor device according to item 1. 3. Each of the cavity inserts extends over a plurality of cavities instead of the holes,
The resin encapsulation device for a semiconductor device according to claim 1, further comprising a grooved portion that is a sidewall of the plurality of cavities and into which a cavity piece is inserted. 4. The upper and lower surfaces of the lead frame are sandwiched between the upper mold cavity insert and the cavity piece and the lower mold cavity insert and the cavity piece,
The resin sealing device for a semiconductor device according to claim 1, wherein the semiconductor element is sealed with a resin. 5. The cavity piece and the hole portion each have an inclined surface with the same inclination, and the cavity piece is positioned in the hole portion by bringing the inclined surface into contact with the inclined surface of the hole portion. The resin sealing device for a semiconductor device according to any one of claims 1 to 4, characterized in that: 6. The semiconductor according to claim 1, wherein a gate for introducing a resin into the cavity is provided on one of the two cavity pieces that oppose each other with the cavity sandwiched therebetween. Equipment resin sealing device. 7. The resin encapsulation device for a semiconductor device according to claim 6, wherein an air vent is provided in the cavity piece provided with the gate and facing the cavity piece with the cavity interposed therebetween. 8. The resin according to claim 1, wherein the gate is connected to a transfer pot via a runner so that resin is supplied from the transfer pot to the cavity. 7. A resin sealing device for a semiconductor device according to claim 3. 9. A semiconductor device packaged by using the resin sealing device for a semiconductor device according to claim 1 to seal a semiconductor element mounted on a lead frame with a resin. A method of manufacturing a semiconductor device, comprising: