JP2003017367A - Stacked electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stacked electronic component in which positioning of a lowermost electronic component is facilitated with respect to a planar leg part when the stacked electronic component is assembled by stacking a plurality of electronic components having external electrodes at the opposite end parts and bonding the planar leg parts to the external electrodes of these electronic components, abutting impact and thermal shock are suppressed at the time of mounting the stacked electronic component on a circuit board, and a structure for facilitating dissipation of heat generated on the circuit board during use is employed. SOLUTION: A plurality of tongues 15a, 15b, 15c, 16a and 16b are formed by splitting a planar leg part. Forward end part of central tongues 15b and 16b is then bent inward to provide means for positioning a lowermost electronic component and outer tongues 15a, 15c and 16a are bent outward in the way to provide a space S2 between the outer tongues 15a, 15c, 16a and outer electrodes 13, 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stack type electronic component.

[0002]

2. Description of the Related Art Conventionally, a stack type electronic component is known, and as shown in FIG. 4, a plurality of electronic components 3a and 3b, which usually have external electrodes 1 and 2 on both ends, are provided on the external electrodes 1 and 2, respectively. Are stacked so that they are vertically arranged, and a pair of plate-like leg portions 4 and 5 made of a conductive material are fixed to the external electrodes 1 and 2, and further, the tip end portions of the leg portions 4 and 5 are the lowest electrons. A stack-type electronic component 6 which extends downward from the component 3b and can be grounded to the circuit board B is known (Japanese Patent Application Laid-Open No. H11-11011).
-102834).

[0003]

The electronic component of this structure has the advantage that when it is mounted on a circuit board, the parallelism of the circuit can be improved without increasing the installation area occupied by the electronic component by more than a predetermined amount. However, there are still the following problems at the time of assembling the stack electronic component, at the time of mounting on the circuit board, or after being similarly mounted.

First, when a plurality of electronic components are stacked and the plate-shaped leg portions are fixed to their electrodes, the electronic component to be attached is soldered to the lowest position on the leg portions. The installation position must be accurately determined. This is because it is necessary to provide a predetermined heat radiation space between the electronic component attached to the lowest and the circuit board.

Secondly, when the stack type electronic component is mounted on the circuit board by a robot, when the stack electronic component is brought into contact with the electronic substrate, it must be brought into contact with the electronic substrate so as not to be impacted. .
This is because it is necessary to avoid damaging the printed circuit or other electronic components of the electronic board. Thirdly, the installation of the legs must increase the heat dissipation area of the heat generated when the stack type electronic component is energized.

[0006] Therefore, as a result of earnest research to propose a stack type electronic component capable of solving the above-mentioned problems, the present inventor found out that the plate-shaped leg portion should have a specific shape and structure, and Was completed. Therefore, the object of the present invention is to
Stacking multiple electronic components with external electrodes on both ends,
When assembling a stack-type electronic component by fixing the plate-shaped legs to the external electrodes of those electronic components, it is easy to position the lowest electronic component with respect to the plate-shaped legs and the stack-type electronic component is attached to the circuit board. It is an object of the present invention to provide a stack-type electronic component having a structure that suppresses a contact impact and a thermal shock property of both when mounting the component and further easily dissipates heat generated when the stack-type electronic component is used.

[0007]

According to the first aspect of the present invention, in order to solve the above-mentioned problems, a plurality of electronic components having external electrodes at both ends are stacked so that the external electrodes are vertically arranged. At the same time, in the stack type electronic component in which a plate-shaped leg made of a conductive material is fixed to the external electrode and the tip of the plate-shaped leg is extended below the lowest electronic component so that it can be grounded to a circuit board, One or a plurality of tongue-shaped pieces is formed on each of the external electrode sides by notching or cutting the part, and the tip of one of the tongue-shaped pieces is bent inward. A means for positioning the lowest electronic component.

According to a second aspect of the present invention, in order to efficiently solve the above-mentioned problems, a plurality of electronic components having external electrodes at both ends are arranged so that the external electrodes are vertically arranged.
In the stack type electronic component, the plate-shaped leg portion made of a conductive material is fixed to the external electrode while being stacked, and the tip end portion is extended downward from the lowest electronic component so that the circuit board can be grounded. One or a plurality of tongue-shaped pieces are formed on each of the external electrode sides by notching or splitting the leg portions, and one tip of the tongue-shaped pieces of the tongue-shaped pieces is inwardly directed. The positioning means for supporting the lowest electronic component is formed by bending, and further, the middle of the leg is bent outward to form a heat radiation space between the leg and the external electrode.

According to a third aspect of the present invention, in order to solve the above problems more efficiently, the cutout piece is provided at the center of the plate-like leg in the width direction, and the middle of the plate-like leg is branched. Adopt means. According to the fourth aspect of the present invention, phosphor bronze is adopted as the conductive material to promote heat dissipation.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Next, preferred embodiments of the present invention will be described in detail with reference to the drawings. As the stack type electronic component to which the present invention is applied, there are a ceramic capacitor, a ceramic varistor and the like, which are mounted on a circuit board B as shown in FIGS. In the unit electronic component 11 constituting the stack type electronic component 10, a large number of internal electrodes (not shown) are vertically stacked in a rectangular parallelepiped ceramic body 12 at predetermined intervals. Every other one of these internal electrodes is exposed at the left and right ends of the ceramic body 11 in the horizontal direction, and the external electrodes 13, 14 are exposed at the exposed portions.
Is attached.

A plurality of the unit electronic components 11 are stacked with the external electrodes 13 and 14 arranged vertically with a thermosetting adhesive interposed therebetween. Then, a pair of plate-like leg portions 15 and 16 made of a conductive material, preferably phosphor bronze, are fixed to the end faces of the external electrodes 13 and 14 in the longitudinal direction of the unit electronic component 11, and the tips thereof are downward. Extends to.

The plate-shaped leg portions 15 and 16 are formed by machining a rectangular plate-shaped body, and the base end portion of at least the uppermost unit electronic component 11 among the unit electronic components 11 is formed. While being soldered to the external electrodes 13 and 14, the tip ends thereof are torn and split in the longitudinal direction so as to be divided into three in the width direction, and three tongue-shaped pieces 15a,
15b, 15c, 16a, 16b, 16c. And among the tongue-shaped pieces of each plate-shaped leg 15, 16, the central tongue-shaped piece 15b, 16b at the center is cut shorter than the outer tongue-shaped pieces 15a, 15c, 16a, 16c which are the other tongue-shaped pieces. In addition, the front end portion is bent and formed inward to serve as a positioning means for supporting the stack electronic component 10 from below.

On the other hand, the outer tongue pieces 15a, 15c, 1
6a and 16c are bent outward in the middle to form a lightning bolt shape, and the tips of them are formed in the central tongue piece 15.
B is formed inward at a position lower than b and 16b. Therefore, in the horizontal direction of the stacked electronic component 10, a predetermined heat dissipation space S1 is formed between the external electrodes 13, 14 or the central tongue-shaped pieces 15b, 16b and the outer tongue-shaped pieces 15a, 15c, 16a, 16c. At the same time, a predetermined heat radiation space S2 is formed between the circuit board B and the stack type electronic component 10, and the heat radiation spaces S1 and S2 generate heat when energized or the external electrodes 13 and 14 with respect to the circuit board B. Outer tongues 15a, 15c, 16a, 1 as grounding bodies of
The heat generated when soldering 6c is dissipated.

The stack electronic component 1 having the above structure
When mounting 0 on the circuit board B, first, the unit electronic component 11
While using a thermosetting adhesive for temporary fixing, a plurality of layers are stacked so that the external electrodes 13 and 14 are vertically arranged to form a stack type electronic component 10. Next, the plate-shaped legs 15 and 16 according to the present invention are prepared, and the central tongues 15b and 16 thereof are provided.
While the stack type electronic component 10 is locked to b, at least the outer electrodes 13, 14 of the uppermost unit electronic component 11 are held.
And the plate-shaped leg portions 15 and 16 are soldered. In this process, since the tip portions of the central tongue-shaped pieces 15b and 16b are bent, the stack type electronic component 10 can be positioned at a predetermined position with respect to the plate-shaped leg portions 15 and 16.

When the pair of external electrodes 13 and 14 facing each other are fixed to the stack type electronic component 10 in this manner, the outer tongue pieces 15a, 15c and 1 are attached to the circuit board B.
The robots 6a and 16c are brought into contact with predetermined positions by a robot, and then soldered and mounted on a part of the printed circuit. In this process the outer tongues 15a, 15c, 16a, 16c
Since there is a lightning-shaped bent part in the middle of the
The circuit board B is provided with the stack type electronic component 10 with 5 and 16.
Even if it comes into contact with, the impact is absorbed and relaxed at the bent portion, and as a result, other electronic components and printed circuits already installed on the circuit board B are not damaged.

The heat generated from the stack type electronic component 10 soldered on the circuit board B and the plate-like leg portion 15,
Heat is radiated from the heat radiation spaces S1 and S2 formed between the stacked electronic components 10 and 16, so that the stack type electronic component 10 according to the present invention has an effect of remarkably reducing thermal shock. In addition, the central tongue pieces 15b and 16b and the outer tongue pieces 15a and 15b
The heat dissipation space S1 existing between c, 16a, and 16c has an effect of dissipating the heat generated when the stack electronic component 10 is energized.

The present invention can be carried out by partially modifying the above-described embodiment without departing from the fundamental technical idea and not significantly impairing the effects of the invention. For example, as shown in FIG. 3, it is possible to cut out the central portions of the plate-shaped leg portions 15 and 16 near the tip end portions to form central tongue-shaped pieces 15b and 16b, or replace the central tongue-shaped pieces with a plurality of pieces. It is also possible to use one of the outer tongues as the positioning means. Further, it is possible to form two tongue-shaped pieces, one of which serves as the positioning means, and the other tongue-shaped piece serves as a grounding body. Further, the lateral width of the positioning means can be made significantly narrower than the lateral width of the grounding body.

[0018]

As described above in detail, according to the present invention, a plurality of electronic parts having external electrodes on both ends are superposed, and plate-like leg portions are fixed to the external electrodes of these electronic parts to form a stack type electronic part. When assembling, it facilitates the positioning of the lowest electronic components with respect to their plate-like legs, and suppresses the contact impact and thermal impact of both when mounting the stack type electronic components on the circuit board. Further, it has an excellent effect that heat generated during use on the circuit board is easily dissipated.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a stack type electronic component according to the present invention.

FIG. 2 likewise shows a front view.

FIG. 3 is a perspective view showing another embodiment as well.

FIG. 4 is a perspective view of a conventional technique.

[Explanation of symbols]

10 Stack type electronic parts 11 Electronic parts 12 Ceramics 13, 14 External electrodes 15, 16 Plate-like leg parts 15a, 15b, 15c, 16a, 16b, 16c Tongue-like pieces S1, S2 Heat dissipation space B Circuit board.

Claims (4)

[Claims] 1. A plate-shaped leg portion made of a conductive material, which comprises a plurality of electronic components (11) having external electrodes (13, 14) at both ends thereof, which are stacked so that the external electrodes are vertically arranged. In the stack type electronic component (10), in which (15, 16) are fixed to the external electrodes and the tip ends of which extend below the lowest electronic component so that they can be grounded to the circuit board (B), One or a plurality of tongue-shaped pieces (15a, 15b, 15c, 16a, 16b) are formed on each of the external electrode sides by notching or cutting the parts (15, 16).
16c) and forming one of these tongues
A stack type electronic component, characterized in that the tip end of each tongue is bent inward to form a positioning means for supporting the lowest electronic component. 2. A plate-shaped leg portion made of a conductive material while stacking a plurality of electronic components (11) having external electrodes (13, 14) on both ends so that the external electrodes are vertically arranged. In the stack type electronic component (10), in which (15, 16) are fixed to the external electrodes and the tip ends of which extend below the lowest electronic component so that they can be grounded to the circuit board (B), One or a plurality of tongue-shaped pieces (15a, 15b, 15c, 16a, 16b) are formed on each of the external electrode sides by notching or cutting the parts (15, 16).
16c) and forming one of these tongues
The tip of each tongue is bent inward to form a positioning means for supporting the lowest electronic component, and the plate-shaped legs (15, 16) are bent outward to form the external electrode. A stack type electronic component characterized in that a heat radiation space (S2) is provided between and. 3. The tongue piece is a plate-like leg (15,
16. The stack type electronic component according to claim 1, wherein the stack type electronic component is provided at the center in the width direction of 16), and the legs are branched in the middle. 4. The stack type electronic component according to claim 1, wherein the conductive material is phosphor bronze.