JP2003014946A - Photoelectron printing circuit board and method for manufacturing the same - Google Patents
Photoelectron printing circuit board and method for manufacturing the sameInfo
- Publication number
- JP2003014946A JP2003014946A JP2001201909A JP2001201909A JP2003014946A JP 2003014946 A JP2003014946 A JP 2003014946A JP 2001201909 A JP2001201909 A JP 2001201909A JP 2001201909 A JP2001201909 A JP 2001201909A JP 2003014946 A JP2003014946 A JP 2003014946A
- Authority
- JP
- Japan
- Prior art keywords
- groove
- optical fiber
- wiring board
- printed wiring
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光情報処理装置、
光通信装置などに使用される光・電子プリント配線板及
びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical information processing device,
The present invention relates to an optical / electronic printed wiring board used for optical communication devices and the like and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、光情報処理装置、光通信装置など
の装置内の回路ボード間を光回路でコンパクトに接続す
るための光ファイバ布線板が知られている。光ファイバ
布線板は、例えば、図８に示すようにプリント配線板２
上にエポキシ系接着剤を塗布して接着層１３を形成し、
その上にスプールに巻き付けた樹脂被覆の光ファイバ
５’を布線ヘッド１４の先端にあるキャピラリ１５を通
して布線しながら接着固定し、更に固定した光ファイバ
のポリマーコート材料よりガラス転移温度が低い熱可塑
性材料をオーバーコート層としてラミネートして製造さ
れている（Ｐｒｏｃ．ｏｆ ４３ｒｄ ＥＣＴＣ，Ｐ
Ｐ．７１１−７１７．１９９３参照）。2. Description of the Related Art Conventionally, there has been known an optical fiber wiring board for compactly connecting circuit boards in a device such as an optical information processing device and an optical communication device by an optical circuit. The optical fiber wiring board is, for example, as shown in FIG.
Epoxy adhesive is applied on top to form the adhesive layer 13,
The resin-coated optical fiber 5'wound on the spool is adhered and fixed while laying it through the capillary 15 at the tip of the wiring head 14, and a heat having a lower glass transition temperature than the polymer coating material of the fixed optical fiber. It is manufactured by laminating a plastic material as an overcoat layer (Proc. Of 43rd ECTC, P).
P. 711-717.1993).
【０００３】この方法では、光ファイバをプリント配線
板２上に接着固定するための樹脂被覆した光ファイバ
５’を用いなければならず、適用できる光ファイバの種
類が限られていた。これを解決するために、プリント配
線板表面にスクリーン印刷により溝を有する樹脂層を形
成し、その満に光ファイバを挿入し、更に上部に樹脂層
を積層して、光ファイバ布線板を製造する方法がある
（特開平１０−１９８４４１号公報）。In this method, a resin-coated optical fiber 5'for fixing and fixing the optical fiber on the printed wiring board 2 must be used, and the types of applicable optical fibers are limited. In order to solve this, a resin layer having a groove is formed on the surface of a printed wiring board by screen printing, an optical fiber is fully inserted into the resin layer, and a resin layer is laminated on the upper part to manufacture an optical fiber wiring board. There is a method (Japanese Patent Laid-Open No. 10-198441).
【０００４】しかし、この方法では、溝の幅や厚みのば
らつきが大きく、溝のエッジが鮮明に形成できないた
め、光ファイバの挿入・仮固定に不具合が生じる場合が
あった。これを解決するために、溝の幅や厚みのばらつ
きが小さく、溝のエッジが鮮明に形成できる製造方法と
して、プリント配線板表面に感光性樹脂層を形成し、露
光・現像法により、溝パターンを形成し、その溝内に光
ファイバを挿入し、更に上部を樹脂で被覆して、光ファ
イバ布線板を製造する方法が考えられる。However, in this method, the width and thickness of the groove are largely varied, and the edge of the groove cannot be clearly formed, so that there may be a problem in insertion / temporary fixing of the optical fiber. In order to solve this, as a manufacturing method in which variations in width and thickness of the groove are small and the edge of the groove can be clearly formed, a photosensitive resin layer is formed on the surface of the printed wiring board, and the groove pattern is formed by exposure and development. It is conceivable to form an optical fiber, insert an optical fiber into the groove, and cover the upper part with resin to manufacture an optical fiber wiring board.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上述の
露光・現像法により形成した感光性樹脂層の溝に光ファ
イバを挿入して光ファイバ布線板を製造する方法では、
深い溝、例えば、８０μｍ以上の深い溝を安定して精度
良く形成することが難しいため、光ファイバの戻り応力
がかかる、曲線の溝パターン部への光ファイバの挿入・
仮固定ができない場合があり不具合が生じる。However, in the method for manufacturing an optical fiber wiring board by inserting an optical fiber into the groove of the photosensitive resin layer formed by the above-mentioned exposure / development method,
Since it is difficult to stably and accurately form a deep groove, for example, a deep groove of 80 μm or more, the return stress of the optical fiber is applied, and the optical fiber is inserted into a curved groove pattern portion.
Problems may occur because temporary fixing may not be possible.
【０００６】本発明の目的は、プリント配線板上に、露
光・現像法により、溝パターンを有する感光性樹脂層を
形成し、更に該溝パターン下の導体層をエッチングして
深い溝を安定して精度良く形成して、光ファイバの挿入
・仮固定を簡便にするとともに光ファイバ布線板の製造
歩留まりを向上できる光・電子プリント配線板及びその
製造方法を提供することにある。An object of the present invention is to form a photosensitive resin layer having a groove pattern on a printed wiring board by an exposure / development method, and further etch a conductor layer below the groove pattern to stabilize deep grooves. It is an object of the present invention to provide an optical / electronic printed wiring board and a method for manufacturing the same, which can be formed with high precision to facilitate insertion / temporary fixing of an optical fiber and improve the manufacturing yield of the optical fiber wiring board.
【０００７】[0007]
【課題を解決するための手段】斯かる目的を達成する本
発明の請求項１に係る光・電子プリント配線板は、電子
回路パターンが形成されたプリント配線板の少なくとも
片面に溝パターンを有する感光性樹脂層が形成され、該
感光性樹脂層には該感光性樹脂層下方の基材に到達する
深さにまで凹溝が形成され、該凹溝内に光ファイバが装
着されてなることを特徴とする。The optical / electronic printed wiring board according to claim 1 of the present invention which achieves such an object is a photosensitive material having a groove pattern on at least one surface of a printed wiring board on which an electronic circuit pattern is formed. Is formed on the photosensitive resin layer, a groove is formed in the photosensitive resin layer to a depth reaching the base material below the photosensitive resin layer, and an optical fiber is mounted in the groove. Characterize.
【０００８】上記目的を達成する本発明の請求項２に係
る光・電子プリント配線板は、電子回路パターンが形成
されたプリント配線板の少なくとも片面に溝パターンを
有する感光性樹脂層が形成され、該感光性樹脂層には該
感光性樹脂層下方の基材に到達する深さにまで凹溝が形
成され、該凹溝内に光ファイバが装着され、該光ファイ
バが樹脂で被覆されてなることを特徴とする。In the optical / electronic printed wiring board according to the second aspect of the present invention which achieves the above object, a photosensitive resin layer having a groove pattern is formed on at least one surface of the printed wiring board on which an electronic circuit pattern is formed, A groove is formed in the photosensitive resin layer to a depth reaching the base material below the photosensitive resin layer, an optical fiber is mounted in the groove, and the optical fiber is covered with a resin. It is characterized by
【０００９】上記目的を達成する本発明の請求項３に係
る光・電子プリント配線板は、請求項１又は２におい
て、前記光ファイバは被覆保護材のないコア材とクラッ
ド材のみから構成されることを特徴とする。The optical / electronic printed wiring board according to claim 3 of the present invention which achieves the above object, is the optical fiber according to claim 1 or 2, wherein the optical fiber is composed only of a core material and a clad material without a coating protection material. It is characterized by
【００１０】上記目的を達成する本発明の請求項４に係
る光・電子プリント配線板の製造方法は、電子回路パタ
ーンが形成されたプリント配線板の少なくとも片面に感
光性樹脂層を形成し、露光・現像法により、光導波路パ
ターンに対応した溝パターンを形成し、更に該感光性樹
脂層をエッチングマスクとして、該溝パターン下の導体
層をエッチングして凹溝を設け、該凹溝内に光ファイバ
を装着固定することを特徴とする。A method for manufacturing an optical / electronic printed wiring board according to a fourth aspect of the present invention which achieves the above object is to form a photosensitive resin layer on at least one surface of a printed wiring board on which an electronic circuit pattern is formed, and perform exposure. A groove pattern corresponding to the optical waveguide pattern is formed by a developing method, and the photosensitive resin layer is used as an etching mask to etch the conductor layer below the groove pattern to form a groove, and a light groove is formed in the groove. It is characterized by mounting and fixing the fiber.
【００１１】上記目的を達成する本発明の請求項５に係
る光・電子プリント配線板の製造方法は、電子回路パタ
ーンが形成されたプリント配線板の少なくとも片面に感
光性樹脂層を形成し、露光・現像法により、光導波路パ
ターンに対応した溝パターンを形成し、更に該感光性樹
脂層をエッチングマスクとして、該溝パターン下の導体
層をエッチングして凹溝を設け、該凹溝内に光ファイバ
を装着固定した後、該光ファイバを樹脂で被覆すること
を特徴とする。A method for manufacturing an optical / electronic printed wiring board according to a fifth aspect of the present invention which achieves the above object is to form a photosensitive resin layer on at least one surface of a printed wiring board on which an electronic circuit pattern is formed, and perform exposure. A groove pattern corresponding to the optical waveguide pattern is formed by a developing method, and the photosensitive resin layer is used as an etching mask to etch the conductor layer below the groove pattern to form a groove, and a light groove is formed in the groove. After the fiber is mounted and fixed, the optical fiber is coated with a resin.
【００１２】上記目的を達成する本発明の請求項６に係
る光・電子プリント配線板の製造方法は、請求項４又は
５において、前記光ファイバは被覆保護材のないコア材
とクラッド材のみから構成することを特徴とする。According to a sixth aspect of the present invention to achieve the above object, the method for producing an optical / electronic printed wiring board according to the fourth or fifth aspect is the optical fiber according to the fourth or fifth aspect, in which only the core material and the clad material having no coating protection material are used. It is characterized in that it is configured.
【００１３】[0013]
【発明の実施の形態】以下、本発明について図面に基づ
いて説明する。図１は本発明の光・電子プリント配線板
２０の透視斜視図を示し、図２は図１中のＡ−Ａ線に沿
う部分構成断面図である。両図に示すように、電子回路
パターン１が形成されたプリント配線板２０に溝パター
ンを有する感光性樹脂層３が形成され、凹溝４が感光性
樹脂層３下方の基材１６に到達する深さにまで形成され
ている。感光性樹脂層３は片面のすべて、両面のすべて
に形成しても、或いは一方の面の必要な箇所のみに形成
してもよい。DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the drawings. FIG. 1 shows a perspective perspective view of an optical / electronic printed wiring board 20 of the present invention, and FIG. 2 is a partial structural sectional view taken along the line AA in FIG. As shown in both figures, the photosensitive resin layer 3 having a groove pattern is formed on the printed wiring board 20 on which the electronic circuit pattern 1 is formed, and the concave groove 4 reaches the base material 16 below the photosensitive resin layer 3. It is formed to the depth. The photosensitive resin layer 3 may be formed on all of one side, all of both sides, or may be formed only on a necessary portion of one side.
【００１４】凹溝４内には光ファイバ５が装着固定され
ている。光ファイバ５は周面が被覆保護されておらず、
コア材とクラッド材のみから構成されている。光ファイ
バ５としては石英系光ファイバ、ポリマー系光ファイバ
などが挙げられるが、特に限定はされない。凹溝４内に
は複数の光ファイバ５を装着固定してもよい。An optical fiber 5 is mounted and fixed in the groove 4. The optical fiber 5 is not covered and protected on the peripheral surface,
It is composed only of a core material and a clad material. Examples of the optical fiber 5 include a quartz optical fiber and a polymer optical fiber, but are not particularly limited. A plurality of optical fibers 5 may be mounted and fixed in the groove 4.
【００１５】光ファイバ５を凹溝４内に装着固定する手
段は、エポキシ系接着剤、感光性接着剤などの接着剤に
よる固定や、粘着剤付きのテープによる固定などで差し
支えない。The means for mounting and fixing the optical fiber 5 in the concave groove 4 may be fixing with an adhesive such as an epoxy adhesive or a photosensitive adhesive, or a tape with an adhesive.
【００１６】プリント配線板２０に用いる基材１６は、
ガラスエポキシやガラスポリイミドなどの有機系基材や
セラミック基材などが挙げられる。プリント配線板２０
はこれらの基材１６に電子回路パターンを形成したもの
で、電子回路パターンは片面、両面、或いは多層に形成
したもののいずれでもよく、凹溝４は片面の他、両面に
形成しても良い。The substrate 16 used for the printed wiring board 20 is
Examples include organic base materials such as glass epoxy and glass polyimide, and ceramic base materials. Printed wiring board 20
Is a substrate 16 on which an electronic circuit pattern is formed. The electronic circuit pattern may be formed on one side, both sides or in multiple layers, and the groove 4 may be formed on one side or both sides.
【００１７】感光性樹脂層３は、紫外線のみで硬化する
樹脂、紫外線照射後に加熱して硬化する樹脂、或いは電
子線を照射することにより硬化反応する樹脂が挙げられ
る。図２中の感光性樹脂層３は感光性液状樹脂の塗布、
或いは感光性フィルムのラミネートにより形成される。Examples of the photosensitive resin layer 3 include a resin which is cured only by ultraviolet rays, a resin which is cured by heating after being irradiated with ultraviolet rays, and a resin which is cured by irradiation with an electron beam. The photosensitive resin layer 3 in FIG. 2 is coated with a photosensitive liquid resin,
Alternatively, it is formed by laminating a photosensitive film.
【００１８】また、図３に示すように別途ソルダーレジ
スト層７を形成し、この上に感光性樹脂層３を形成して
もよい。Alternatively, as shown in FIG. 3, a solder resist layer 7 may be separately formed, and the photosensitive resin layer 3 may be formed thereon.
【００１９】図４は図２と同様に感光性樹脂層３を形成
し、凹溝４内に周面が被覆保護された光ファイバ５’を
装着した光・電子プリント配線板２２の断面図である。FIG. 4 is a sectional view of an optical / electronic printed wiring board 22 in which a photosensitive resin layer 3 is formed and an optical fiber 5 ′ whose peripheral surface is covered and protected is mounted in a groove 4 as in FIG. 2. is there.
【００２０】図５は本発明の光・電子プリント配線板２
０の製造方法を模式的に示した断面図である。先ず、電
子回路パターン１および導体層１０が形成されたプリン
ト配線板２の表面を感光性樹脂層３で被覆する。次い
で、光ファイバ装着用の溝パターンに対応したマスク９
を用いて紫外線、電子線などを照射して硬化させ、現像
した後、感光性樹脂層３をエッチングレジストにして、
導体層１０をエッチングして基材１６に到達する深さの
凹溝４を形成する。FIG. 5 shows an optical / electronic printed wiring board 2 of the present invention.
It is sectional drawing which showed the manufacturing method of 0 typically. First, the surface of the printed wiring board 2 on which the electronic circuit pattern 1 and the conductor layer 10 are formed is covered with the photosensitive resin layer 3. Next, a mask 9 corresponding to the groove pattern for mounting the optical fiber
Is irradiated with ultraviolet rays, electron beams, etc. to cure and develop, and then the photosensitive resin layer 3 is used as an etching resist,
The conductor layer 10 is etched to form the groove 4 having a depth reaching the base material 16.
【００２１】引き続き、凹溝４内に光ファイバー５を装
着固定する。ここで、導体層１０とは銅箔の如き金属箔
や金属箔の上にめっき処理を施したものをいう。図示は
しないが、当然のことながら部品実装パターンや部品実
装孔は開口部を設けるべく、これらに対応するパターン
をマスク９に形成する。図６、図７は更に他の実施形態
を示す光・電子プリント配線板２３，２４の断面図を示
し、凹溝４を形成した後、凹溝４内に光ファイバ５を固
定し、樹脂６を充填したものである。以下、実施例を挙
げ詳細に説明する。Subsequently, the optical fiber 5 is mounted and fixed in the groove 4. Here, the conductor layer 10 refers to a metal foil such as a copper foil or a metal foil plated with a metal. Although not shown, it is needless to say that patterns corresponding to these are formed on the mask 9 in order to provide openings for the component mounting patterns and component mounting holes. 6 and 7 are sectional views of optical / electronic printed wiring boards 23 and 24 showing still another embodiment. After forming the groove 4, the optical fiber 5 is fixed in the groove 4 and the resin 6 Is filled. Hereinafter, examples will be described in detail.
【００２２】〔実施例１〕先ず、ガラスエポキシ基材の
片面に電子回路パターンを形成したプリント配線板の表
面に、感光性液状樹脂を膜厚が７５μｍとなるように塗
布した。Example 1 First, a photosensitive liquid resin was applied to the surface of a printed wiring board having an electronic circuit pattern formed on one surface of a glass epoxy substrate so that the film thickness was 75 μm.
【００２３】次いで、光ファイバ装着用の溝パターンの
他、部品実装用の開口部に対応したマスクを使用して、
紫外線による露光後、現像して、溝幅１３５μｍの溝パ
ターン及び部品実装用の開口部を形成し、加熱して硬化
させた後、その感光性樹脂層をエッチングマスクとし
て、溝パターン下の厚み３５μｍの銅箔で形成した導体
層をエッチングして、ガラスエポキシ基材に到達する深
さ１１０μｍの凹溝を形成した。Next, in addition to a groove pattern for mounting an optical fiber, a mask corresponding to an opening for mounting components is used,
After exposure by ultraviolet rays, development is performed to form a groove pattern having a groove width of 135 μm and an opening for mounting components, and after heating and curing, the photosensitive resin layer is used as an etching mask to form a thickness of 35 μm below the groove pattern. The conductor layer formed of the copper foil of 1 was etched to form a groove having a depth of 110 μm that reaches the glass epoxy base material.
【００２４】引き続き、プラスチック材などの被覆保護
材がない外径がφ１２５μｍの石英系光ファイバを凹溝
内に感光性接着剤を使用して装着固定して光・電子プリ
ント配線板を得た。Subsequently, a silica-based optical fiber having an outer diameter of 125 μm without a coating protective material such as a plastic material was mounted and fixed in the groove using a photosensitive adhesive to obtain an optical / electronic printed wiring board.
【００２５】〔実施例２〕ガラスエポキシ基材の片面に
電子回路パターンを形成したプリント配線板の表面に、
ソルダーレジストを塗布した後に、感光性液状樹脂を膜
厚が７５μｍとなるように塗布した以外は実施例１と同
様に製造して光・電子プリント配線板を得た。Example 2 On the surface of a printed wiring board having an electronic circuit pattern formed on one surface of a glass epoxy substrate,
An optical / electronic printed wiring board was obtained in the same manner as in Example 1 except that the photosensitive liquid resin was applied so as to have a film thickness of 75 μm after applying the solder resist.
【００２６】〔実施例３〕実施例１と同様に石英系光フ
ァイバを溝内に感光性接着剤を使用して装着固定した
後、更に、溝内及び光ファイバの上に感光性樹脂を充填
し保護し光・電子プリント配線板を得た。[Embodiment 3] As in Embodiment 1, a quartz optical fiber is mounted and fixed in the groove using a photosensitive adhesive, and then a photosensitive resin is filled in the groove and on the optical fiber. And protected to obtain an optical / electronic printed wiring board.
【００２７】〔実施例４〕先ず、ガラスエポキシ基材の
片面に電子回路パターンを形成したプリント配線板の表
面に、感光性樹脂フィルムをラミネートして膜厚が７５
μｍの感光性膨脂層を形成した。[Example 4] First, a photosensitive resin film was laminated on the surface of a printed wiring board having an electronic circuit pattern formed on one surface of a glass epoxy substrate to a film thickness of 75.
A μm photosensitive swelling layer was formed.
【００２８】次いで、光ファイバ装着用の溝パターンの
他、部品実装用の開口部に対応したマスクを使用して、
紫外線による露光後、現像して、溝幅１３５μｍの溝パ
ターン及び部品実装用の開口部を形成し、加熱して硬化
させた後、その感光性樹脂層をエッチングマスクとし
て、溝パターン下の厚み３５μｍの銅箔で形成された導
体層をエッチングして、ガラスエポキシ基材に到達する
深さ１１０μｍの凹溝を形成した。Next, in addition to a groove pattern for mounting an optical fiber, a mask corresponding to an opening for mounting components is used,
After exposure by ultraviolet rays, development is performed to form a groove pattern having a groove width of 135 μm and an opening for mounting components, and after heating and curing, the photosensitive resin layer is used as an etching mask to form a thickness of 35 μm below the groove pattern. The conductor layer formed of the copper foil of 1 was etched to form a groove having a depth of 110 μm that reaches the glass epoxy base material.
【００２９】引き続き、プラスチック材などの被覆保護
材がない外径がφ１２５μｍの石英系光ファイバを凹溝
内に感光性接着剤を使用して接着固定した後、更に、溝
内及び光ファイバの上に感光性樹脂を充填し保護し光・
電子プリント配線板を得た。Subsequently, a silica-based optical fiber having an outer diameter of 125 μm, which is not covered with a protective material such as a plastic material, is adhered and fixed in the groove using a photosensitive adhesive, and then in the groove and on the optical fiber. It is protected by filling it with a photosensitive resin.
An electronic printed wiring board was obtained.
【００３０】〔実施例５〕先ず、ガラスエポキシ基材の
片面に電子回路パターンを形成したプリント配線板の表
面に、感光性液状嵐脂を膜厚が７５μｍとなるように塗
布した。Example 5 First, a photosensitive liquid resin was applied to the surface of a printed wiring board having an electronic circuit pattern formed on one surface of a glass epoxy substrate so that the film thickness was 75 μm.
【００３１】次いで、光ファイバ装着用の溝パターンの
他、部品実装用の開口部に亥寸応したマスクを使用し
て、紫外線による露光後、現像して、溝幅１３５μｍの
溝パターン及び部品実装用の開口部を形成し、加熱して
硬化させた後、その感光性樹脂層をエッチングマスクと
して、溝パターン下の銅箔上に銅めっきが施された厚み
７０μｍの導体層をエッチングして、ガラスエポキシ基
材に到達する深さ１４５μｍの凹溝を形成した。Next, in addition to the groove pattern for mounting the optical fiber, a mask corresponding to the opening for mounting the component is used, and after exposure by ultraviolet rays, development is performed to form the groove pattern having the groove width of 135 μm and the component mounting. After forming an opening for heating and curing by heating, using the photosensitive resin layer as an etching mask, a copper-plated conductor layer having a thickness of 70 μm is etched on the copper foil under the groove pattern, A groove having a depth of 145 μm that reaches the glass epoxy substrate was formed.
【００３２】引き続き、プラスチック材などの被覆保護
材がない外径がφ１２５μｍの石英系光ファイバを凹溝
内に感光性接着剤を使用して装着固定した後、更に、溝
内及び光ファイバの上に感光性樹脂を充填し保護し光・
電子プリント配線板を得た。Subsequently, a silica-based optical fiber having an outer diameter of 125 μm, which is not covered with a protective material such as a plastic material, is mounted and fixed in the groove using a photosensitive adhesive, and then in the groove and on the optical fiber. It is protected by filling it with a photosensitive resin.
An electronic printed wiring board was obtained.
【００３３】[0033]
【発明の効果】以上、実施例に基づいて具体的に説明し
たように、本発明では、光ファイバ装着用の溝が導体層
を貫いて基材まで達しているので、光ファイバの装着が
容易であり、また、安定させることができるので従来に
比べ信頼性の高い光・電子プリント配線板を得ることが
可能となる。As described above in detail with reference to the embodiments, in the present invention, the groove for mounting the optical fiber reaches the base material through the conductor layer, so that the mounting of the optical fiber is easy. In addition, since it can be stabilized, it becomes possible to obtain a more reliable optical / electronic printed wiring board than the conventional one.
【００３４】また、本発明の光・電子プリント配線板で
は、光ファイバを挿入・仮固定する凹溝の形成方法とし
て、プリント配線板の表面に感光性樹脂を塗布又は感光
性樹脂フィルムをラミネートして感光性樹脂層を形成
し、露光・現像法により、溝パターンを形成し、更に溝
パターン下の導体層をエッチングして、凹溝を形成する
方法を採用しているため、溝のエッジが鮮明で、溝幅の
ばらつきが小さく精度の良い深い溝を安定して得ること
ができる。従って、凹溝への光ファイバの装着、特に、
光ファイバの戻り応力がかかる、曲線部の凹溝への光フ
ァイバの装着も簡便に行うことができ、製造歩留まりを
向上させることができる。Further, in the optical / electronic printed wiring board of the present invention, as a method of forming a groove for inserting and temporarily fixing an optical fiber, a photosensitive resin is applied or a photosensitive resin film is laminated on the surface of the printed wiring board. The photosensitive resin layer is formed by using the method, the groove pattern is formed by exposure and development, and the conductor layer under the groove pattern is etched to form the concave groove. It is possible to stably obtain a deep groove that is clear, has a small variation in groove width, and is highly accurate. Therefore, mounting the optical fiber in the groove, especially,
The optical fiber can be easily attached to the concave groove of the curved portion where the return stress of the optical fiber is applied, and the manufacturing yield can be improved.
【００３５】更に、プリント配線板の表面に形成した基
材に至る深さの溝に光ファイバが装着されているため、
光ファイバの破損が防止でき、取り扱いも容易である。
また、取り扱いにより、光伝送損失が発生しやすい光フ
ァイバの曲げ部分も溝の曲げ半径で規制管理できる。更
に、溝に光ファイバを装着した後に樹脂充填することに
より、圧力や湿度による影響に対して、更に信頼性が向
上した光・電子プリント配線板を提供できる。Further, since the optical fiber is mounted in the groove formed in the surface of the printed wiring board to the depth of the base material,
It is possible to prevent damage to the optical fiber and it is easy to handle.
Further, the bending portion of the optical fiber, which is likely to cause optical transmission loss by handling, can be controlled and controlled by the bending radius of the groove. Furthermore, by filling the groove with the optical fiber and then filling it with resin, it is possible to provide an optical / electronic printed wiring board with further improved reliability against the influence of pressure and humidity.
【００３６】また、従来のプリント配線板の信号伝達回
路である金属配線の一部を光ファイバで構成することに
より信号伝達速度の向上が図れると共に、まわりの信号
ラインからのノイズによる誤動作を防ぐことができ、更
には、光ファイバから外部にノイズを輻射しなくなるた
め、信頼性が向上するという効果がある。Further, by constructing a part of the metal wiring which is the signal transmission circuit of the conventional printed wiring board by the optical fiber, the signal transmission speed can be improved and the malfunction due to the noise from the surrounding signal lines can be prevented. Moreover, since the noise is not radiated from the optical fiber to the outside, the reliability is improved.
【図１】本発明の光・電子プリント配線板の透視斜視図
である。FIG. 1 is a perspective view of an optical / electronic printed wiring board according to the present invention.
【図２】図１中のＡ−Ａ線に沿う部分構成断面図であ
る。FIG. 2 is a partial configuration cross-sectional view taken along the line AA in FIG.
【図３】他の実施態様を示す構成断面図である。FIG. 3 is a configuration cross-sectional view showing another embodiment.
【図４】他の実施態様を示す構成断面図である。FIG. 4 is a configuration cross-sectional view showing another embodiment.
【図５】本発明の光・電子プリント配線板の製造方法を
示す模式断面図である。FIG. 5 is a schematic cross-sectional view showing a method for manufacturing an optical / electronic printed wiring board of the present invention.
【図６】他の実施態様を示す構成断面図である。FIG. 6 is a sectional view showing the configuration of another embodiment.
【図７】他の実施態様を示す構成断面図である。FIG. 7 is a sectional view showing the configuration of another embodiment.
【図８】従来の光・電子プリント板の斜視図である。FIG. 8 is a perspective view of a conventional optical / electronic printed board.
１ 電子回路パターン ２ プリント配線板 ３ 感光性樹脂層 ４ 凹溝 ５ 光ファイバ ５’ 樹脂被覆された光ファイバ ６ 樹脂 ７ ソルダーレジスト層 ８ 被覆保護材 ９ マスク １０ 導体層 １０’ 導体層 １１ 電子部品 １２ 光電子部品 １３ 接着層 １４ 布線ヘッド １５ キャピラリ １６ 基材 ２０ 光・電子プリント配線板 ２１ 光・電子プリント配線板 ２２ 光・電子プリント配線板 ２３ 光・電子プリント配線板 ２４ 光・電子プリント配線板 1 Electronic circuit pattern 2 printed wiring boards 3 Photosensitive resin layer 4 groove 5 optical fiber 5'resin-coated optical fiber 6 resin 7 Solder resist layer 8 Cover protection material 9 mask 10 Conductor layer 10 'conductor layer 11 electronic components 12 Optoelectronic components 13 Adhesive layer 14 Wiring head 15 capillaries 16 Base material 20 Optical / electronic printed wiring boards 21 Optical / electronic printed wiring boards 22 Optical / electronic printed wiring boards 23 Optical / electronic printed wiring boards 24 Optical / electronic printed wiring boards
───────────────────────────────────────────────────── フロントページの続き (72)発明者 伊藤 章二 愛知県名古屋市中区千代田三丁目22番22号 アイカ工業株式会社内 (72)発明者 加藤 誠 愛知県名古屋市中区千代田三丁目22番22号 アイカ工業株式会社内 Ｆターム(参考） 2H038 CA52 5E338 AA01 AA02 AA03 BB03 BB19 BB28 CC10 CD12 EE32 5E339 AB02 AB06 AD01 AD03 AD05 BC02 BE13 CC01 CD01 CE11 CF16 CF17 DD04 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Shoji Ito 3-22-22 Chiyoda, Naka-ku, Nagoya City, Aichi Prefecture Aika Kogyo Co., Ltd. (72) Inventor Makoto Kato 3-22-22 Chiyoda, Naka-ku, Nagoya City, Aichi Prefecture Aika Kogyo Co., Ltd. F-term (reference) 2H038 CA52 5E338 AA01 AA02 AA03 BB03 BB19 BB28 CC10 CD12 EE32 5E339 AB02 AB06 AD01 AD03 AD05 BC02 BE13 CC01 CD01 CE11 CF16 CF17 DD04
Claims (6)
配線板の少なくとも片面に溝パターンを有する感光性樹
脂層が形成され、該感光性樹脂層には該感光性樹脂層下
方の基材に到達する深さにまで凹溝が形成され、該凹溝
内に光ファイバが装着されてなることを特徴とする光・
電子プリント配線板。1. A photosensitive resin layer having a groove pattern is formed on at least one surface of a printed wiring board on which an electronic circuit pattern is formed, and the photosensitive resin layer reaches a base material below the photosensitive resin layer. An optical fiber characterized in that a concave groove is formed to a depth and an optical fiber is mounted in the concave groove.
Electronic printed wiring board.
配線板の少なくとも片面に溝パターンを有する感光性樹
脂層が形成され、該感光性樹脂層には該感光性樹脂層下
方の基材に到達する深さにまで凹溝が形成され、該凹溝
内に光ファイバが装着され、該光ファイバが樹脂で被覆
されてなることを特徴とする光・電子プリント配線板。2. A photosensitive resin layer having a groove pattern is formed on at least one surface of a printed wiring board on which an electronic circuit pattern is formed, and the photosensitive resin layer reaches a base material below the photosensitive resin layer. An optical / electronic printed wiring board, wherein a groove is formed to a depth, an optical fiber is mounted in the groove, and the optical fiber is covered with a resin.
材とクラッド材のみから構成されることを特徴とする請
求項１又は２記載の光・電子プリント配線板。3. The optical / electronic printed wiring board according to claim 1, wherein the optical fiber is composed only of a core material and a clad material without a coating protection material.
配線板の少なくとも片面に感光性樹脂層を形成し、露光
・現像法により、光導波路パターンに対応した溝パター
ンを形成し、更に該感光性樹脂層をエッチングマスクと
して、該溝パターン下の導体層をエッチングして凹溝を
設け、該凹溝内に光ファイバを装着固定することを特徴
とする光・電子プリント配線板の製造方法。4. A photosensitive resin layer is formed on at least one surface of a printed wiring board on which an electronic circuit pattern is formed, and a groove pattern corresponding to an optical waveguide pattern is formed by an exposure / development method, and the photosensitive resin is further formed. A method for manufacturing an optical / electronic printed wiring board, comprising: etching a conductor layer below the groove pattern to form a groove using the layer as an etching mask, and mounting and fixing an optical fiber in the groove.
配線板の少なくとも片面に感光性樹脂層を形成し、露光
・現像法により、光導波路パターンに対応した溝パター
ンを形成し、更に該感光性樹脂層をエッチングマスクと
して、該溝パターン下の導体層をエッチングして凹溝を
設け、該凹溝内に光ファイバを装着固定した後、該光フ
ァイバを樹脂で被覆することを特徴とする光・電子プリ
ント配線板の製造方法。5. A photosensitive resin layer is formed on at least one surface of a printed wiring board on which an electronic circuit pattern is formed, and a groove pattern corresponding to an optical waveguide pattern is formed by an exposure / development method, and the photosensitive resin is further formed. Using the layer as an etching mask, the conductor layer under the groove pattern is etched to form a groove, and the optical fiber is mounted and fixed in the groove, and then the optical fiber is covered with a resin. Manufacturing method of electronic printed wiring board.
材とクラッド材のみから構成することを特徴とする請求
項４又は５記載の光・電子プリント配線板の製造方法。6. The method of manufacturing an optical / electronic printed wiring board according to claim 4, wherein the optical fiber is composed only of a core material and a clad material having no coating protection material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001201909A JP2003014946A (en) | 2001-07-03 | 2001-07-03 | Photoelectron printing circuit board and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001201909A JP2003014946A (en) | 2001-07-03 | 2001-07-03 | Photoelectron printing circuit board and method for manufacturing the same |
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| Publication Number | Publication Date |
|---|---|
| JP2003014946A true JP2003014946A (en) | 2003-01-15 |
Family
ID=19038800
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001201909A Pending JP2003014946A (en) | 2001-07-03 | 2001-07-03 | Photoelectron printing circuit board and method for manufacturing the same |
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| Country | Link |
|---|---|
| JP (1) | JP2003014946A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100669958B1 (en) | 2005-04-04 | 2007-01-16 | 삼성전기주식회사 | Methods of Forming Optical Waveguides in a Printed Circuit Board and Printed Circuit Board thereof |
| JP2013076987A (en) * | 2011-09-13 | 2013-04-25 | Hitachi Cable Ltd | Photoelectric conversion module |
| US8870470B2 (en) | 2012-01-24 | 2014-10-28 | Hitachi Metals, Ltd. | Optical module and method for producing the same |
| US9103971B2 (en) | 2012-01-24 | 2015-08-11 | Hitachi Metals, Ltd. | Optical module and method for producing the same |
-
2001
- 2001-07-03 JP JP2001201909A patent/JP2003014946A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100669958B1 (en) | 2005-04-04 | 2007-01-16 | 삼성전기주식회사 | Methods of Forming Optical Waveguides in a Printed Circuit Board and Printed Circuit Board thereof |
| JP2013076987A (en) * | 2011-09-13 | 2013-04-25 | Hitachi Cable Ltd | Photoelectric conversion module |
| US8909005B2 (en) | 2011-09-13 | 2014-12-09 | Hitachi Metals, Ltd. | Photoelectric conversion module having pattern for restricting a position of an optical fiber |
| US8870470B2 (en) | 2012-01-24 | 2014-10-28 | Hitachi Metals, Ltd. | Optical module and method for producing the same |
| US9103971B2 (en) | 2012-01-24 | 2015-08-11 | Hitachi Metals, Ltd. | Optical module and method for producing the same |
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