JP2003010110A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure an image area at a desired angle of visibility in a normal scan mode capable of displaying an image large, and superior in observation performance in a display area variable monitor. SOLUTION: When determining an image height h1 (the center to 25m in the figure) on the image area 25f, the ratio H1/H2 of a visual field area to a display area is related to the maximum image height h2 (the center to 25n in the figure) in the whole image area 25f to become h1 =h2 ×(H1/H2), and an objective optical system for obtaining a desired maximum angle of visibility at a diagonal point is set.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus, and more particularly to an image pickup apparatus characterized by an image pickup control portion according to a scan mode of a monitor.

[0002]

2. Description of the Related Art Conventionally, a monitor device having a plurality of scan modes has been known. By adopting this monitor device as the monitor of the electronic endoscope system, the area of the image displayed on the screen of the monitor can be changed by changing the scan mode of the monitor.

[0003]

However, although the entire area of the monitor becomes the visible area in underscan, the size of the screen on the monitor is compressed and displayed, so that the image can be obtained even if the desired angle of view is obtained. The display becomes small and the desired observation area cannot be obtained.

When the normal scan is performed, the endoscopic image is fully displayed on the cathode ray tube, but a part of the endoscopic image is hidden by the monitor frame, so that the entire endoscopic image cannot be visually recognized and the desired angle of view is obtained. I can't observe it.

The present invention has been made in view of the above circumstances, and can display an image in a large size on a monitor having a variable display area and can display an image area at a desired viewing angle in a normal scan mode which is excellent in observation performance. An object is to provide an imaging device that can be secured.

[0006]

SUMMARY OF THE INVENTION An image pickup apparatus according to the present invention includes a monitor having a scannable scanning area and at least a part of the periphery of the scanning area masked to limit an image display area, and a subject. An image pickup means for picking up an image, an area setting means for setting an area corresponding to the limited display area in an image area of the image pickup means, and an image formed by the area set by the area setting means on the monitor. And a control means for controlling to display in a limited display area.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

1 to 6 relate to a first embodiment of the present invention. FIG. 1 is a block diagram showing the configuration of an endoscope system, and FIG. 2 is provided in the tip portion of the electronic endoscope of FIG. FIG. 3 is a configuration diagram showing the configuration of the solid-state imaging device obtained, FIG. 3 is a first diagram illustrating the operation of the endoscope system of FIG. 1, and FIG. 4 is a second diagram illustrating the operation of the endoscope system of FIG. FIG. 5 is a third diagram for explaining the action of the endoscope system of FIG. 1, and FIG. 6 is a fourth diagram for explaining the action of the endoscope system of FIG.

An endoscope system 1 shown in FIG. 1 supplies illumination light 1 by connecting the electronic endoscope 2 of the first embodiment equipped with an electromagnetic interference countermeasure means and the electronic endoscope 2 to each other. Light source device 3 and the scope cable 4 to the electronic endoscope 2
Signal to a solid-state image sensor (hereinafter, abbreviated as CCD) 25, which will be described later and is connected via
It comprises a video processor 5 for processing and a color monitor 6 for displaying a video signal input via a monitor cable connected to the video processor 5.

The electronic endoscope 2 has an elongated insertion portion 7 to be inserted into a body cavity, an operation portion 8 formed at the rear end of the insertion portion 7, and a universal portion extended from the operation portion 8. It has a cord portion 9 and a scope connector portion 10 provided at the end of the universal cord portion 9 and detachably connected to the light source device 3.

A contact connector portion 10a is provided on the side of the scope connector portion 10, and the contact connector portion 1 is provided.
The other end of the scope cable 4 provided with a detachable electric connector 4a at 0a is detachably connected to the electric connector 5a of the video processor 5 by an electric connector 4b.

The insertion portion 7 is a solid-state image pickup device 2 described later.
2 provided inside, a bendable bending portion 13 formed at a rear end of the tip portion 12, and the bending portion 13
The long flexible tube portion 21 extends from the rear end to the front end of the operation portion 8.

The operation portion 8 is provided with a bending operation knob 14, and the bending portion 13 can be bent by gripping the grip portion 18 and operating the bending operation knob 14.

An air supply / water supply control unit 15 for controlling air supply / water supply and a suction control unit 16 for controlling suction i are provided on the side surface of the operation unit 8. Further, a switch section 17 provided with a plurality of switches 17a is provided on the top of the operation section 8.

As shown in FIG. 1, a light guide (not shown in FIG. 1) for transmitting illumination light is inserted into the insertion portion 7, the operation portion 8 and the universal cord portion 9, and the rear end of the light guide is the scope connector portion. 10, the illumination light supplied from the lamp inside the light source device 3 is transmitted, emitted from the front end surface fixed to the illumination window 20 of the front end portion 12 to the front, and illuminates an object such as an affected area.

The illuminated object is imaged on a CCD 25, which will be described later, arranged at the image forming position by an objective optical unit 23 attached to an observation window 19 provided adjacent to the illumination window 20, and photoelectric conversion is performed by the CCD 25. To be done.

A cable (or a signal cable) 30 (see FIG. 2) is connected to the CCD 25, and the cable 30 is connected to the scope cable 4 via a noise reducer housed in the scope connector section 10. The cable 4 is connected to the video processor 5.

An air supply / water supply conduit (not shown) is inserted into the insertion portion 7, and the air supply / water supply conduit is connected to the air supply / water supply controller 15 by the operation portion 8 and further, the universal cord portion. An end of the air supply / water supply pipe 9 is connected to the scope connector 10 and is connected to the air supply / water supply mechanism in the light source device 3.

The suction conduit (not shown) inserted into the insertion portion 7 branches into two in the vicinity of the front end of the operating portion 8, one of which communicates with the forceps port 11b and the other of which passes through the suction control portion 16. And communicates with the suction conduit in the universal cord section 9 to reach a suction mouthpiece (not shown) of the scope connector section 10.

The suction conduit serves as a tip opening 11a which opens at the tip 12, and the tip opening 11a serves as a suction port for performing suction during a suction operation. When forceps are inserted from the forceps port 11b, forceps are projected. It becomes the forceps outlet.

Referring to FIG. 2, the solid-state image pickup device 22 provided in the tip portion 12 and the CCD 25 constituting the solid-state image pickup device 22 will be described.

On the surface of the CCD 25, a chip 25a having a predetermined area image area 25f, a connecting portion 25h for transmitting the driving output and driving power of the CCD 25, and a CCD cover glass 25b bonded on the chip 25a are provided. Has been. A bump 25e is provided on one side of the chip 25a, and a flexible circuit board 25c is connected on the bump 25e.

In the circuit board 25c, for example, a first wiring pattern 25k and a second wiring pattern 25l made of a conductor such as copper are formed on both surfaces of a flexible base material 25j made of polyimide. . First wiring pattern 2
5k is exposed from the base material 25j near the chip 25a and forms the inner lead 25d. The inner lead 25d and the connecting portion 25h are connected to each other by thermocompression bonding via the bump 25e, and an input signal to the CCD 25 is transmitted and received between the chip 25a and the circuit board 25c. On the circuit board 25c, a chip component 29a such as a capacitor for removing noise and an electronic component 29 such as an integrated circuit (IC) 29b for amplifying a CCD output signal are mounted.

The inner lead 25d is composed of a bent portion, and the circuit board 25c is arranged so as to have an angle Θ.

Further, coaxial signal lines 39, 40 constituting the cable 30 are formed on the land portion 25i on the first wiring pattern 25k on the circuit board 25c and the electrode portion of the chip component 29a.
The simple line 41 is connected by, for example, solder.

A drive signal to the CCD 25 is transmitted from the processor (not shown) through the coaxial signal line 39. The output signal from the CCD 25 amplified by the integrated circuit (IC) 29b is transmitted to the processor (not shown) through the coaxial signal line 40. Further, the driving power to the CCD 25 is transmitted from a processor (not shown) through the simple line 41. The outer conductors 42 of the coaxial signal lines 39 and 40 are collectively the CCD 2
5 GND. For example, it is directly connected to the GND electrode of the chip part 29a which is electrically connected to the GND of the CCD 25. On the other hand, the simple line 41 is directly connected to the electrode of the electronic component 29 provided on the drive power supply line.

A cover glass 26 is attached to the CCD cover glass 25b, and the cover glass 26 is fitted and fixed to the CCD holder 27. The distal end portion 12 has an objective optical system unit 23, and an objective lens group 24 is arranged in an objective lens frame 28. A covering member 44 is covered in the vicinity of the CCD holder 27, the chip 25a, and the CCD cover glass 25b.

A reinforcing member 32 is externally fitted and fixed to the CCD holder 27 on the proximal side of the endoscope of the CCD holder 27, and the reinforcing member 32 is filled with, for example, an epoxy adhesive 33. As a result, the entire CCD 25 and the outer periphery of the cable 30 are filled with the adhesive to secure the strength.
In addition, the CCD holder 27, the reinforcing member 32 fitted on the CCD holder 27, and the outer circumference of the cable 30,
The CCD holder 27 is covered with the covering member 34 up to the end portion on the front end side.

The solid-state image pickup device 22 includes the objective optical unit 2
3 is focused between the objective lens frame 28 and the CCD holder 27, and is made of, for example, an epoxy adhesive.
Fitted and fixed.

The distal end portion 12 of the endoscope insertion portion 7 has a distal end cover body 3 and a distal end cover 3 fitted and fixed on the distal end side thereof.
6 and the like, the objective optical unit 23 is inserted into a mounting hole 43 that communicates with the observation window 19 of the tip forming section body 35, and both the tip forming section body 35 and the objective lens frame 28 are fixed by, for example, screws not shown. Has been done.

FIG. 3 and FIG. 4 are image output states on the monitor of the endoscope apparatus, FIG. 5 is a flow chart showing the optical image height configuration means in the normal scan mode, and FIG.
FIG. 3 is a diagram showing an image area of the CCD 25.

As shown in FIGS. 3 and 4, a cathode ray tube 46 constituting the color monitor 6 is housed in a housing 47 thereof. Further, below the frame 50 of the color monitor 6, a normal scan selection switch 48 and an underscan selection switch 49 for selecting an image display state are provided.

A part of the outer peripheral portion of the cathode ray tube 46 is entirely covered by the frame 50 which constitutes the color monitor 6.

The color monitor 6 displays
The switching means (not shown) provided above can set either normal scan or underscan.

FIG. 3 shows the normal scan mode. In this case, since the image is displayed on the entire area of the cathode ray tube 46, the visible area 52a is covered by the frame 50, and thus is narrower than the display area 51a.

FIG. 4 shows the underscan mode. In this case, since the image is displayed inside the frame 50, the display area 51b on the cathode ray tube 46 is displayed.
The entire area becomes the visible area 52b, but the apparent size becomes smaller.

When the endoscope is observed, the normal scan mode is generally used, and the image looks larger in the normal scan mode than in the underscan. The subject image captured by the image area 25f of the CCD 25 and displayed on the color monitor 6 has the maximum viewing angle at the diagonal point 53a of the display area 51a, which is an important specification in endoscopic observation. Optically, the image height (longest point), which is the distance from the center of the image area 25f to the diagonal point, is set, and the objective optical system is determined so that the maximum viewing angle corresponds at this position.

However, when the objective optical system set as described above is observed in the normal scan mode, the maximum viewing angle is at the position of the diagonal point 54a of the display area, and at the position of the diagonal point 53a in the viewing area. It becomes smaller than the desired viewing angle.

Therefore, in the objective optical system of the present embodiment, the image height h1 is set so that the desired maximum viewing angle is obtained at the position of the diagonal point 53a of the visible region 52a during normal scanning. The flowchart is shown in FIG.

The flowchart of FIG. 5 includes steps S1 to S1.
As shown in S6, the image height h1 on the image area 25f
In obtaining (center to 25 m), the ratio H1 / H2 between the visual field area and the display area is related to the maximum image height h2 (center to 25n) in the entire image area 25f as shown in FIG. 6, and h1 = h2 X (H1 / H2), diagonal point 5
The objective optical system for obtaining the desired maximum viewing angle in 3a is set.

The desired maximum viewing angle can be obtained at the diagonal point 53a of the viewing area in the normally used normal scan mode, and the maximum image height h2 that can be taken at this position.
Therefore, since the image height h1 is low, the brightness such as the light distribution of the endoscopic image is also advantageous.

FIG. 7 is a block diagram showing the configuration of the endoscope system according to the second embodiment of the present invention.

Since the second embodiment is almost the same as the first embodiment, only different points will be described, the same components will be denoted by the same reference numerals, and description thereof will be omitted.

At the time of underscan, the image size becomes small and the observation performance is inferior to that of the normal scan, but the display area completely becomes the visual field area. Since the display area is basically contained within the visible area on the color monitor 6, the entire display area can be confirmed even if the display area fluctuates due to variations in scan rate, and as a result, a stable viewing angle can be obtained. is there.

In the present embodiment, as shown in FIG. 7, the color monitor 6 is provided with a switching means 77 for selecting the display state of the endoscopic image. The signal from the switching means 77 is transmitted to the display state detecting means 78 provided in the video processor 5 connected to the color monitor 6, for example.

The signal detected by the display state detecting means 78 is transmitted to the objective frame position control means 79 provided in the video processor 5, and the viewing angle provided in the objective optical system 76 connected to the objective frame position control means 79. By the variable means 80,
The objective frame 81 is moved to a position corresponding to the two modes.

The viewing angle varying means 80 is composed of a zoom optical system, and the objective frame 81 is composed of a variator lens function.

In the present embodiment, the CCD image height h2 compared with the desired maximum viewing angle is h2 = h1 × (H1 / H
An optical design is performed under the conditions of 2).

During normal scanning: display state detecting means 7
8, the objective frame position control means 79 sets the objective frame 81 so that the objective optical system is in a wide state (on the side where the viewing angle is large and the magnification is small).

As described above, although the viewing angle at the diagonal point 54a of the display area of the cathode ray tube 46 is larger than the desired maximum viewing angle, it is displayed so that the desired maximum viewing angle is obtained at the diagonal point 53a of the visible area. .

Underscan: Display state detecting means 7
8, the objective frame 81 is set so that the objective optical system is in the tele state (the side where the viewing angle is small and the enlargement ratio is large) at the time of underscan.

Although the viewing angle becomes smaller due to the zoom effect,
Since the display area end 51b of the cathode ray tube 46 is inside the visible area 52b, the display area diagonal point 54b is displayed so as to have a desired maximum viewing angle.

As described above, according to the configuration of this embodiment, the desired maximum viewing angle can be obtained in the visible field areas 53a and 53b of the color monitor 6 regardless of the display state of the color monitor 6 Mirror observation performance is secured.

Even if the underscan is selected,
Because the zoom optical function increases the magnification rate,
The image can be displayed in a large size and the observation performance is not deteriorated.

By the way, when the pixels of the CCD 25 are increased in number and a high resolution monitor is used as the color monitor 6, for example, an HDTV monitor having an aspect ratio of 16: 9 and 1125 vertical scanning lines is used, As shown in FIGS. 8 and 9, the horizontal ratio of the endoscopic image may be arbitrarily changed by the examiner's intention while maintaining a high resolution in the vertical direction in the display area 55.

This makes it possible to optimize the visibility of the inspector and reduce fatigue during the inspection.

Further, FIG. 10 shows H of the high-definition monitor.
This is an example in which the enlarged detailed inspection region 56 is selected in the display area 55 by utilizing the long direction. For example,
The color monitor 6 has a sensor like a touch panel, and when touching the color monitor 6 with a finger, the normal observation image 5
7 and the enlarged image 58 are switched to a state in which they can be displayed at the same time, and the enlarged image 58 becomes a display in which the vicinity touched by the finger is enlarged.

Similarly, FIG. 11 shows H of the high-definition monitor.
This is an example in which a navigation function for displaying the position of the endoscope is provided as a sub-screen 59 together with the selected normal observation image 57 by utilizing the direction. In FIG. 11, the normal observation image 57 and other information disclosure are performed on the color monitor 6 simultaneously or individually, and the navigation function is not limited.

According to FIGS. 10 and 11, since the normal observation has an additional function, the inspection can be performed efficiently and surely.

By the way, the configuration of the solid-state image pickup device 22 is shown in FIG.
It may be as shown in FIG. That is, the bump 25e is provided on the chip 25a. Flexible leads 62a are connected to the bumps 25e by thermocompression bonding or the like. The signal line conductor portion 64 of the signal line 63 is connected to the base end side of the flexible lead 62a by the solder 61.

This solid-state image pickup device is characterized in that the signal line conductor portion 64 of the signal line 63 is connected inside the flexible lead 62a, and the hunter portion is inside the flexible lead because the banta connection portion is inside. It is possible to reduce the size of the solid-state image pickup device without protruding.

The structure of the solid-state image pickup device 22 may be as shown in FIG. That is, the flexible lead 6
A bend 62c may be provided in 2b, and the signal line conductor portion 64 of the signal line 63 may be connected to the outside of the bend 62c by solder 61.

Further, the structure of the solid-state image pickup device 22 is shown in FIG.
It may be as shown in. That is, bumps 25e are provided on the chip 25a, and a plurality of bumps 25e (not shown) are provided.
Is connected to one end of the first inner lead 66a and one end of the second inner lead 66b. The first inner lead 66a is provided with a bent portion 72, which is formed in the central axis direction. The other end of the lead 66a is connected to the land 68a of the circuit base sales 68, and
The signal line 70 of 1 is connected to the first inner lead 66.
a and the second inner lead 66b are insulated from each other by the insulating member 67, and the second signal line 71 is connected near the proximal end of the second inner lead 66b to connect the chip 25 to the chip 25.
Alternatively, the periphery of a, the first inner lead 66a, the second inner lead 66b, and the circuit base sales 68 may be sealed with the sealing resin 69.

Furthermore, the structure of the solid-state image pickup device 22 may be as shown in FIG. That is, the solder 94 is used as a means for connecting the conductor portion 93a of the signal line 93 to the lead 91. Although the solder 94 protrudes swelling due to the work, by providing the scraping region 95, the region protruding outward can be suppressed, the solid-state imaging device 22 can be downsized, and the endoscope device can be downsized. You can

Incidentally, the structure of the objective optical unit 23 may be as shown in FIG. That is, the mounting hole 74 of the objective lens frame 28 is provided with the first lens 86a and the optical lens 89. The outer diameter of the first lens 86a is smaller than the outer diameter of the mounting hole 74. First lens 8
6a and the mounting hole 74, the first lens 86a
A ring-shaped member 88 is mounted on the surface. A sealing member 87 is provided on the tip side of the ring-shaped member 88, and is pressed and fixed by the tip cover 36. When repairing the first lens 86a,
By removing the tip cover 36, the first lens 86a can be easily removed and replaced.

The structure of the objective optical unit 23 is shown in FIG.
7 may be used. That is, the ring-shaped member 88 of FIG.

Incidentally, the structure of the insertion portion 21 of the endoscope 1 may be as shown in FIG. Radiation noise from the endoscope is caused by harmonics of a CCD drive signal transmitted through a signal line not shown in FIG. 18, particularly a high frequency signal such as a horizontal transfer signal. Therefore, the metal member forming the insertion portion 21 is
The spiral tube 1 comprises a spiral tube 102 and a metal coating layer 103.
02, the metal cover layer 103 is fixed to the base 100 by the caulking portion 101 with the caulking jig 104, the base 100 is connected to the metal forming the operation unit (not shown), and finally, the patient of the video processor 5 It is connected so as to be electrically connected to the circuit GND.

By thus ensuring the conduction state of the exterior member constituting the endoscope, the entire exterior conductor of the endoscope falls to the GND of the patient circuit of the video processor 5,
The above-mentioned harmonic noise propagating through the signal line is enhanced in GN.
D, and the EMC performance is improved.

By the way, it is generally said that abnormal tissues among living tissues have a higher temperature than normal tissues. Therefore, next, a description will be given of an endoscope in which the temperature distribution is observed by an infrared image together with the visible image observation, and the infrared image is used as an aid for observation diagnosis and collection of abnormal tissue.

As shown in FIG. 19, the endoscope 110 includes
Visible image observing means 111 for observing visible light, infrared image observing means 112 for observing infrared light, and light guide 1
13. A treatment tool 114 as a means for collecting a lesion is provided. At the tip of the treatment tool 114, a portion 115 for gripping the tissue 116 is provided with a heating means (not shown).

As shown in FIG. 20, in the visible light observation image, the periphery of the lesion can be easily observed, but it is difficult to distinguish the abnormal tissue 117 depending on the level of the lesion. Moreover, when an attempt is made to collect a tissue aiming at a high temperature region by an infrared image, the treatment tool cannot be treated with a normal treatment tool because the treatment tool does not generate heat and an image of the treatment tool is not captured.

In the endoscope 110 described above, heat treatment is applied to the tissue gripping portion at the distal end of the treatment instrument, so that the structure shown in FIG.
Since the treatment tool 115 can be observed together with the heat-generating tissue 116 as in the infrared image shown in FIG. 1, the lesioned portion can be reliably collected.

By the way, in the endoscope apparatus for temperature distribution measurement, when an infrared transmission fiber is used by inserting it into a channel of an endoscope as a temperature measurement probe, LG bending occurs because its bending resistance is weak. However, if the probe length is increased in consideration of routing, transmission attenuation will occur and affect accurate temperature measurement. Further, since the infrared image pickup device is generally larger than the CCD, there is a problem in that the infrared image pickup device becomes thicker when it is arranged at the tip.

In view of this, the temperature distribution measuring endoscope apparatus may have the following configuration. That is,
As shown in FIG. 22, a light guide 123, an image guide (visible light observation) 122, and an infrared transmission fiber (infrared light observation) 121 are arranged inside the insertion portion of the endoscope 120.

Then, as the infrared transmitting fiber 121,
For example, a chalcogenide is used, and an infrared camera head 125 having an infrared imaging element 126 that captures an image transmitted by the infrared transmission fiber 121 is mounted on the operation unit 124.
a, and a camera head 125 equipped with a CCD 127 for imaging the visible light transmitted by the image guide 122.
b are fixed by connecting means (not shown).

The signals picked up by the infrared camera head 125a and the camera head 125b are transmitted to the camera control unit (CCU) 129, and the visible image 132 and the infrared image 130 are simultaneously displayed on the color monitor 6.

As shown in FIG. 23, the infrared camera head 125a and the camera head 125b may be housed in one camera head 125c.

With such a configuration, it is possible to obtain an endoscope apparatus for temperature distribution measurement which does not cause deterioration in temperature measurement performance due to transmission attenuation, is easy to handle, and is inexpensive.

By the way, when an infrared image is obtained in a state where the illumination light is applied, the infrared image is affected by the color of the object and the reflection of light, and also by the heat generated by the illumination light.

Therefore, in view of this, the endoscope apparatus may be configured as follows. That is, as shown in FIG. 24, the endoscope 135 is provided with a light guide 138, a visible image observation means 137, and an infrared image observation means 136.

For example, from the light source device 140 in which the camera control and the light source are integrated, to the light guide connector 14
1, the illumination light is transmitted through the light guide 138 to the endoscope 135.
It is emitted from the tip.

The electric signals from the infrared image observing means 136 and the visible image observing means 137 are transmitted to the light source device 140 by connecting the electric contact 143 of the camera adapter 142 to the light source device 140, and then on the color monitor 6. Is displayed in.

Further, for example, the operation unit 147 is provided with an infrared image display switch 139. When the infrared image display switch 139 is in the ON state, an infrared image is displayed on the color monitor 6, and the infrared image display switch 139 of the light source device 140 is operated to illuminate the image by the control means (not shown).
Light will not be emitted.

When the infrared image display switch 139 is off, a visible image is displayed on the color monitor 6 and the light source device 140 is controlled to emit illumination light.

As a result, an accurate temperature distribution can be obtained from an infrared image without disturbance.

On the other hand, visible image and infrared image (temperature distribution image)
When each is displayed on a separate monitor, there is a problem in that it is difficult to match the two images, and it is difficult to diagnose abnormal tissue. Therefore, as shown in FIG. 25, a switch 148 for switching the image display 146 on the color monitor 6.
Is provided instead of the infrared image display switch 139. The setting of switching is shown in FIGS. That is, (1) the visible image and the infrared image are superimposed and displayed: FIG. 26 (2) the visible image and the infrared image are displayed separately, and the images are switched and displayed: FIG. 27 (3) the visible image and the red image Displaying external images in parallel: FIG. 28 By performing monitoring in which visible images and infrared images are associated with each other, it is possible to reliably diagnose abnormal tissue.
By the way, the infrared image, due to the influence of the infrared objective optical system,
The temperature in the central part may be high and the temperature in the peripheral part may be low.

Therefore, in view of this, the endoscope apparatus may be configured as follows. That is, as shown in FIG. 29, a light guide 154, an infrared observation objective optical unit 159, and an infrared transmission fiber 1 are provided at the endoscope tip 150.
67 is provided.

When observing the object 151, the infrared ray 152 emitted from the object 151 is incident on the objective optical unit 159. On the other hand, the infrared ray as the disturbance light 153 is emitted from the objective lens frame 168 constituting the objective optical unit 159. It is radiated.

The light guide 154 is the objective optical unit 1
Since it is provided close to 59, heat generated from the light guide 154 is transmitted to the objective optical unit 159 and the infrared transmission fiber 167.

FIG. 30 shows a conventional observation image, in which the center portion 155 and the observation image 157 for monitoring the peripheral portion of the light guide 154 are displayed as high temperature, and the other peripheral portion 156 is cooled to the center. Is displayed as. According to this, the accurate temperature distribution of the subject 151 cannot be measured.

In the configuration of FIG. 29, calibration is performed by the image processing means (not shown), and a calibrated observed image 158 as shown in FIG. 31 is obtained.

As a result, variations in temperature due to external factors such as the light guide 154 can be eliminated, so that the accurate temperature distribution of the subject 151 can be measured.

By the way, it is difficult to make a correspondence between the visible image and the infrared image, and it is difficult to diagnose the abnormal tissue. Therefore, next, an embodiment will be described in which the two can be perfectly corresponded to each other to reliably diagnose the abnormal tissue.

As shown in FIG. 32, the endoscope 160 includes
A CCD 163 capable of picking up visible light to infrared light is provided.

An objective optical unit 164 that transmits visible light to infrared light is arranged on the tip side of the CCD 163. For example, sapphire is used as the lens 161 of the objective optical unit 164. An optical filter 162 is provided immediately before the CCD 163.

The optical filter 162 is composed of filters that transmit red, green, blue, and infrared rays, and is arranged as shown in FIG. 33. The red filters included in the optical filter 162,
The edge, blue, and infrared spectral characteristics are as shown in FIG.

FIG. 35 shows a state of an image displayed on the color monitor 6 of the present embodiment. The visible image and the infrared image, for example, the outline of the lesion 165 completely matches.

That is, the light receiving surface of the CCD 163 can be used as both a visible image / infrared image, and the CCD
Both can be observed in a high resolution state, so that abnormal tissue can be reliably diagnosed.

By the way, if the visible image observing means and the infrared image observing means are provided as different means and are displayed on different monitors, it is difficult for the two images to correspond to each other and the operability is poor. Therefore, an endoscope apparatus for observing a temperature distribution that facilitates switching between the two and has good operability will be described.

In FIG. 36, an endoscope 170 is provided with an infrared transmission fiber 171 and a visible light image guide 172.

A camera head 174 is removably provided on the base end side of the operating portion 179.

The camera head 174 is provided with one CCD 175 capable of picking up visible light to infrared light.

The operating section 179 has an infrared transmitting fiber 17
1 or the visible light image guide 172 CC
Selection means capable of selectively injecting D175 (Fig. 3
6, a rotary operation ring) 173 is provided.

The selecting means 173 may be configured not only by the rotary operation ring but also by switching with a reflecting mirror or the like.

Further, as shown in FIG. 37, a CCD for picking up a visible image and an infrared image is taken by the camera head 174.
Both 177 and 178 are arranged and the switching means (Fig.
The switch 7 may be electrically switched by a switch 176.

According to the above construction, switching between the two images is easy and the operability is good.

By the way, it was difficult to measure the temperature of a lesion using an infrared camera because the visual field was obstructed under direct observation. Therefore, an embodiment for solving this will be described next.

As shown in FIG. 38, a CCD capable of receiving infrared rays is attached to the tip of the temperature measuring probe 181 which uses infrared rays.
182 and an objective lens 183 are provided.

The mother endoscope 180 is, for example, an endoscope for observing from the front, and the channel 1 of the endoscope 180 is used.
86 the camera cable 185 of the temperature measuring probe 181
It has been inserted.

The temperature-measuring probe 181 is inserted through the tip channel first.

The visible observation of the lesion area is performed by using a front perspective or side-viewing endoscope, so that the temperature measuring probe 181 does not largely enter the visual field, and the temperature measurement under the visible observation can be easily performed. Be seen.

Further, in FIG. 39, under the direct-viewing endoscope 190, the infrared camera head 195 is attached to the channel 193.
This is an example for facilitating the temperature measurement of the affected part during the hyperthermia treatment by inserting and using.

The infrared camera head 195 is provided with an observation window 196 in which a CCD for infrared rays (not shown) is arranged and an illumination window 197.

A channel 198 is also provided in the infrared camera head 195 so that a treatment tool for thermotherapy or the like can be inserted through the channel 198 during infrared observation.

The temperature at the time of hyperthermia treatment can be confirmed by the infrared camera head 195 without contact, and the temperature of the affected area can be measured reliably and easily.

Next, an embodiment for obtaining the optimum distance for temperature measurement when using the temperature measuring probe will be described.

As shown in FIG. 40, the endoscope 200 includes
The channel 201 is provided, and the temperature measuring probe 202 is inserted into the channel 201. A tip hood 203 is attached to the tip of the temperature measuring probe 202.

As shown in FIG. 41, the tip hood 203 is brought into close contact with the lesion 204. Since the height of the tip hood 203 is optically set to the best distance at the time of contact, accurate temperature can be measured.

Next, an embodiment for obtaining a system in which the operability of the temperature measuring probe is improved will be described.

As shown in FIG. 42, the temperature measuring probe 202
When it is used under an endoscope, it is inserted in the channel in advance.

Since the infrared camera 205 cannot be inserted through the endoscope, the infrared camera 205 and the temperature measuring probe 202 are connected via the connection adapter 206.

As shown in FIG. 43, the connection adapter 206 is provided in advance in the vicinity of the treatment instrument insertion port 207 on the operation portion side.

According to this, the temperature measuring probe 202 can be naturally guided to the channel as it is, and the operation of the temperature measuring probe 202 is easy.

Incidentally, as shown in FIG. 44, the connection adapter 206
May be provided in advance at the base end of the operation unit 208.

As shown in FIGS. 43 and 44, the connection adapter 20
Since 6 is provided on the endoscope side in advance, only the infrared camera 205 is connected to the connection adapter 206 when the temperature is measured.
It is easy to operate because it only needs to be connected to. Next,
An example of a solid-state image pickup device having improved moisture resistance will be described.

As shown in FIG. 45, the CCD chip 211
A cover glass 212 is arranged on the front end side of the.

CCD chip 211 and cover glass 212
A metallized pattern 221 is formed on the side surface of the, and both are joined and sealed by solder 222.

CCD chip 211 and cover glass 212
Since its side surface is joined by a bang with high airtightness, moisture intrusion from the outside is more firmly prevented,
The moisture resistance of the solid-state imaging device is improved.

Further, it may be constructed as shown in FIG. That is, the second cover glass 226 is joined to the front end side of the cover glass 212.

A shield member 227 is joined and fixed to the second cover glass 226 by soldering 230 with a metallization pattern 232 provided on the side surface of the second cover glass 226. The base end side of the solid-state imaging device 225 is
A cable 228 is arranged.

A total shield 228b of the cable 228
Are arranged so as to close the insertion port of the cable 228 of the shield member 227, and are connected by the solder 229a to ensure airtightness.

A second shield member 233 separate from the shield member 227 is provided on the base end side of the solid-state image pickup device 225, and the shield member 227 and the second shield member 233 are provided.
The joint portion 234 is also joined by the solder 229b. The inside of the shield member 227 is sealed with, for example, an epoxy adhesive 231.

Since the respective joints of the solid-state image pickup device 225 are airtightly joined with solder, the moisture resistance of the solid-state image pickup device can be improved.

[Additional Remarks] (Additional Remark 1) In an endoscope apparatus having an endoscope main body having a solid-state image processing element and a monitor, and a display area is selected and displayed on the monitor, In order to obtain a desired maximum viewing angle in the visible region, an image height that is a diagonal distance from the center is set in the image area region of the solid-state image sensor, and an objective optical system based on the image height at that time is set. An endoscopic device having:

(Additional Item 2) When the monitor display is set to normal scan, the diagonal direction between the visible area and the display area on the monitor is adjusted so that the desired maximum viewing angle is obtained at the diagonal portion of the visible area on the monitor. Applying the positional relationship in the image area area of the solid-state image sensor,
The endoscope apparatus according to appendix 1, wherein the configuration of the objective optical system is set based on the image height of the solid-state image sensor obtained at that time.

(Additional Item 3) The objective optical system configuration is provided with a viewing angle setting means so as to obtain the maximum viewing angle in the diagonal part of the visible region on the monitor regardless of the monitor display mode. The endoscope apparatus according to Additional Item 1.

[0137]

As described above, according to the present invention, a large image can be displayed on a monitor having a variable display area.
In the normal scan mode, which is excellent in observing performance, there is an effect that an image area with a desired viewing angle can be secured.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a configuration of an endoscope system according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram showing a configuration of a solid-state imaging device provided in a tip portion of the electronic endoscope in FIG.

FIG. 3 is a first diagram illustrating the operation of the endoscope system of FIG.

FIG. 4 is a second diagram illustrating the operation of the endoscope system of FIG.

5 is a third diagram illustrating the operation of the endoscope system of FIG. 1. FIG.

6 is a fourth diagram for explaining the operation of the endoscope system of FIG.

FIG. 7 is a block diagram showing a configuration of an endoscope system according to a second embodiment of the present invention.

FIG. 8 is a first diagram showing a display example when the color monitor is a high resolution monitor.

FIG. 9 is a second diagram showing a display example when the color monitor is a high resolution monitor.

FIG. 10 is a third diagram showing a display example when the color monitor is a high resolution monitor.

FIG. 11 is a fourth diagram showing a display example when the color monitor is a high resolution monitor.

FIG. 12 is a diagram showing a configuration of a first modification of the solid-state imaging device.

FIG. 13 is a diagram showing a configuration of a second modification of the solid-state imaging device.

FIG. 14 is a diagram showing a configuration of a third modification of the solid-state imaging device.

FIG. 15 is a diagram showing a configuration of a fourth modification of the solid-state imaging device.

FIG. 16 is a diagram showing a configuration of a first modified example of the objective optical unit.

FIG. 17 is a diagram showing a configuration of a second modification of the objective optical unit.

FIG. 18 is a diagram showing a configuration of a modified example of the insertion portion of the endoscope.

FIG. 19 is a first diagram for explaining an embodiment of an endoscope that observes a temperature distribution by an infrared image together with a visible image observation, and uses the infrared image as an aid for observation diagnosis and collection of abnormal tissue.

FIG. 20 is a second diagram illustrating an example of an endoscope that observes a temperature distribution by an infrared image together with a visible image observation, and uses the infrared image as an aid for observation diagnosis and collection of abnormal tissue.

FIG. 21 is a third diagram for explaining an embodiment of an endoscope in which temperature distribution observation is performed by infrared image together with visible image observation, and the infrared image is used as an aid for observation diagnosis and collection of abnormal tissue.

FIG. 22 is a diagram showing a configuration of an endoscope apparatus for measuring temperature distribution.

FIG. 23 is a diagram showing a configuration of a first modified example of the temperature distribution measuring endoscope apparatus.

FIG. 24 is a diagram showing a configuration of a second modification of the endoscope apparatus for measuring temperature distribution.

FIG. 25 is a diagram showing the configuration of a third modification of the endoscope apparatus for measuring temperature distribution.

FIG. 26 is a first diagram illustrating an operation of a third modification of the temperature distribution measuring endoscope apparatus.

FIG. 27 is a second diagram illustrating the operation of the third modification of the endoscope apparatus for measuring temperature distribution.

FIG. 28 is a third diagram for explaining the operation of the third modified example of the temperature distribution measuring endoscope apparatus.

FIG. 29 is a diagram showing a configuration of a fourth modified example of the temperature distribution measuring endoscope apparatus.

FIG. 30 is a first diagram illustrating an operation of a fourth modified example of the temperature distribution measuring endoscope apparatus.

FIG. 31 is a second diagram for explaining the operation of the fourth modified example of the temperature distribution measuring endoscope apparatus.

FIG. 32 is a diagram showing a configuration of a fifth modification example of the temperature distribution measuring endoscope apparatus.

FIG. 33 is a first diagram illustrating an operation of a fifth modified example of the endoscope apparatus for measuring temperature distribution.

FIG. 34 is a second diagram for explaining the operation of the fifth modified example of the temperature distribution measuring endoscope apparatus.

FIG. 35 is a third diagram illustrating the operation of the fifth modified example of the temperature distribution measuring endoscope apparatus.

FIG. 36 is a diagram showing the configuration of a sixth modification of the endoscope apparatus for measuring temperature distribution.

FIG. 37 is a diagram showing the configuration of a seventh modified example of the temperature distribution measuring endoscope apparatus.

FIG. 38 is a diagram showing the configuration of an eighth modification of the endoscope apparatus for measuring temperature distribution.

FIG. 39 is a diagram showing the configuration of a ninth modification of the endoscope apparatus for measuring temperature distribution.

FIG. 40 is a diagram showing a configuration of a tenth modified example of the endoscope apparatus for measuring temperature distribution.

FIG. 41 is a view for explaining the operation of the tenth modified example of the temperature distribution measuring endoscope apparatus.

FIG. 42 is a diagram showing a configuration of an eleventh modification of the temperature distribution measuring endoscope apparatus.

FIG. 43 is a first diagram illustrating an operation of an eleventh modified example of the temperature distribution measuring endoscope apparatus.

FIG. 44 is a second diagram for explaining the operation of the eleventh modification of the temperature distribution measuring endoscope apparatus.

FIG. 45 is a diagram showing a configuration of a solid-state imaging device having improved moisture resistance.

FIG. 46 is a diagram showing a configuration of a modified example of the solid-state imaging device having improved moisture resistance.

[Explanation of symbols]

1 ... Endoscope system 2 ... Electronic endoscope 3 ... Light source device 5 ... Video processor 6 ... Color monitor 22 ... Solid-state imaging device 25 ... CCD 46 ... CRT 48 ... Normal scan selection switch 49 ... Underscan selection switch 50 ... Frame

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Claims (2)

[Claims] 1. A monitor having a scannable scan area, at least a part of the periphery of which is masked to limit an image display area, an image pickup means for picking up an object, and an image pickup means of the image pickup means. Area setting means for setting an area corresponding to the limited display area in the image area, and an image formed by the area set by the area setting means is displayed on the limited display area of the monitor. An image pickup apparatus comprising: 2. A monitor having a scannable scan area, at least a part of the periphery of the scan area being masked to limit an image display area, and a monitor displayed on the monitor's limited display area. Selection means for selecting the size of the image, image pickup means for picking up an object, visual field range changing means for changing the visual field range of the image pickup means, and the limited display in the image area of the image pickup means. Area setting means for setting an area corresponding to the area, and based on the selection result by the selecting means, controlling the change of the visual field range of the visual field range changing means, the area set by the area setting means in the image area And a second control means for controlling the subject image to be displayed in a limited display area of the monitor. An image pickup apparatus comprising: