JP2003008352A - Crystal oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal oscillator wherein punching of a green sheet of a ceramic vessel is enabled with a common punching tool, and investment of jig tools and manufacturing cost can be reduced by constituting the space of an accommodating part as a rational and common configuration. SOLUTION: In the crystal oscillator, a quartz chip is accommodated in a first accommodating part formed in a first vessel on one side of a ceramic package, and an oscillation circuit is accommodated in a second accommodating part formed in a second vessel on the other side, thereby defining mutually the quartz element and the oscillation circuit. The first and second accommodating parts have spaces of the same form constituted of a first rectangular empty part and a second empty part. The second empty part extends from a central part of a couple of facing sides of the first empty part toward the width direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal in which first and second storage parts are formed on both sides of a package made of ceramic, a crystal oscillator is stored in one storage part, and an oscillation circuit is stored in the other storage part. Regarding the oscillator.

[0002]

2. Description of the Related Art Conventionally, in a crystal oscillator, a crystal oscillator housed in a metal container has been mounted on a printed circuit board of an oscillation circuit. However, recently, a surface mount type and a small-sized one is desired. Therefore, a crystal oscillator has been considered in which a crystal oscillator hermetically sealed in a metal container together with an oscillation circuit is housed in a box-shaped ceramic container.

In addition to miniaturization of the crystal oscillator, it has been considered that the crystal piece having the excitation electrode is housed together with the oscillation circuit in a ceramic container and hermetically sealed. However, in such a structure, there is a problem that the excitation electrode of the crystal element is contaminated by a small amount of gas generated from various circuit components constituting the oscillation circuit, and thereby the oscillation frequency gradually changes with time.

Therefore, it has been considered that the interior of the ceramic container is divided into two spaces, the crystal blank is housed in one space, and the oscillation circuit is housed in the other space. By the way, such a ceramic container is manufactured by punching out and stacking a sheet-shaped material called a green sheet into a desired shape and firing it.

However, for example, the length is 7 mm, the width is 5 mm,
In a micro crystal oscillator with a thickness of about 2 mm, the die for punching the green sheet is extremely expensive because it is precisely manufactured from cemented carbide, so it is not possible to prepare several types of die for punching. The cost of jigs and tools is bulky and unreasonable.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and by making the space of the storage portion a rational common shape, the green sheet of the ceramic container is a common punching type. Can be punched out of
An object of the present invention is to provide a crystal oscillator capable of reducing the investment amount of jigs and tools and reducing the manufacturing cost.

[0007]

According to a first aspect of the present invention, a crystal piece is stored in a first storage portion provided in a first container on one side of a ceramic package and a second crystal on the other side is stored. In a crystal oscillator in which an oscillation circuit is housed in a second housing portion provided in a container to define a crystal piece and an oscillation circuit, the first and second housing portions are a rectangular first empty space and this first hollow space. A second space that is widened from the center of a pair of opposite sides of one space
Is a crystal oscillator having the same shape of empty spaces, and claim 2 is the crystal oscillator according to claim 1, wherein the first and second containers are integral with each other with their bottom plates being common. It is a crystal oscillator characterized by being molded into.

According to a third aspect of the present invention, in the crystal oscillator according to the first aspect, the first and second containers are formed integrally by backing their bottom plates back to back. Item 4 is the one according to any one of claims 1 to 3, wherein electrodes are formed on the respective plate surfaces divided by the second cavity of the first housing portion, and excitation electrodes are formed on the front and back plate surfaces. The crystal oscillator is characterized in that one end of the crystal piece led out to one end is placed and fixed and the excitation electrode is electrically led out.

A fifth aspect of the present invention is the method according to any one of the first to third aspects, wherein the semiconductor circuit element is housed in the first space of the second housing portion and the second space of the second housing portion is housed. In this crystal oscillator, chip capacitors used for the oscillation circuits are respectively provided.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention, in which a first and a second accommodating parts are integrally joined back to back as an example, is shown in FIG. Will be described in detail with reference to the perspective view of the oscillation circuit side shown in FIG. 3 and the sectional view taken along the line AA of FIG.

In the figure, reference numerals 1 and 2 are provided on one side and the other side of the package made of ceramics, and the first and the second are separately fired.
It is the second container. The first container 1 is provided with a first storage portion 3, and the second container 2 is provided with a second storage portion 4. Each of the first and second storage units 3 and 4 has a rectangular first empty space 5 having an opening on the outer side, and a second empty space expanded in the width direction from the center of the opposing sides of the first empty space 5. It has a space of the same shape consisting of places 6.

Then, for example, the first storage portion 3 stores the crystal piece 7 formed into a strip plate by cutting the crystal of the artificial quartz at a predetermined angle. This crystal piece 7
Forms an excitation electrode 8 on both side plate surfaces by, for example, AT cutting, and leads this excitation electrode 8 to the end of the plate surface.

Then, a pair of holding electrodes 9 is formed on the plate surface divided by the second space 6 of the first housing portion 3. Then, the lead-out end of the strip-shaped crystal piece 7 with the excitation electrode 8 led out at one end is placed on the holding electrode 9, and is fixed mechanically by a conductive adhesive and the excitation electrode 8 is held. The electrodes 9 are electrically connected and led out.

The holding electrode 9 is led out to the lead-out end 10 on the outer bottom surface of the first accommodating portion 3 by, for example, a metallizing process. On the other hand, a circuit pattern having a predetermined shape is formed on the inner bottom surface of the second storage portion 4, and the semiconductor integrated circuit element 11 in a bare chip state, for example, is arranged in the first space 5 and the two portions are formed. A chip capacitor 12 is mounted in each of the second empty spaces 6.

Since the semiconductor circuit element 11 is cut into a rectangle in order to effectively utilize the area of the silicon substrate, the first void 5 is formed in a shape corresponding to the shape of the semiconductor circuit element 11. . The chip capacitor 12 is a capacitor having a relatively large capacity, one of which is used as a bypass capacitor for a power supply and the other is used as a coupling capacitor for oscillation output. This second void 6 also
It is formed in a shape corresponding to the shape of the chip capacitor 12.

From the circuit pattern of the second storage section 4,
The connection end 13 for the crystal unit is extended. This connection end 13 is a joint surface with the first storage portion 3 and
It is arranged at a position corresponding to the lead-out end 10 of the holding electrode 9 of the housing portion 3. Then, the lead-out end 10 of the first storage portion 3 and the connection end 13 of the second storage portion 4 are bonded to each other with, for example, a conductive adhesive to achieve electrical conduction, and the first and second The joint surfaces of the storage portions 3 and 4 are attached back to back so as to be mechanically integrated.

In this case, it goes without saying that a non-conductive ordinary adhesive or the like may be used together to increase the adhesive strength. Further, the lead-out end 10 of the first storage portion 3 and the connection end 13 of the second storage portion 4 are led out to the peripheral portion of the outer bottom surface, where electrical conduction is achieved by means such as soldering and mechanically. You may make it join.

Then, the upper surface opening of the first storage portion 3 in which the crystal piece 7 is stored is hermetically sealed with the lid 14 in an atmosphere of nitrogen gas, inert gas or the like. When the lid 14 is a ceramic thin plate, it may be bonded by, for example, molten glass. When the lid 14 is made of metal, a metal ring may be fixed to the opening of the storage portion 3 and the lid 14 may be welded to this ring by means such as seam welding.

Then, a potting agent is potted and solidified in the opening of the second housing portion 4 to protect the circuit pattern, the semiconductor integrated circuit element 11, the chip capacitor 12 and the like. In this case, it goes without saying that instead of the potting agent, an appropriate adhesive may be filled and solidified.

In this way, the first and second storage parts 3 and 4 can be molded with a common mold at the stage of the green sheet, and the cost of jigs and tools can be reduced. Further, it is possible to store the crystal piece 7 in the first storage portion 3 side, hermetically seal it, check the electrical characteristics thereof, and select only non-defective products. Therefore, the oscillator is completed and eventually becomes a defective product, and it is not necessary to discard it at the stage of increasing the added value, which can contribute to the reduction of the manufacturing cost.

Similarly, regarding the oscillation circuit of the second housing portion 4, the semiconductor integrated circuit element 11 and the chip capacitor 12 are also included.
Then, it is possible to select a non-defective product by mounting it and oscillating by connecting a crystal unit. By combining a good-quality crystal oscillator and an oscillation circuit, the product yield can be improved and the manufacturing cost can be reduced. Further, since the crystal piece 7 and the oscillation circuit are separately stored in the first and second storage portions 3 and 4 which are defined with each other, the crystal piece is contaminated especially by dust, gas, etc. on the oscillation circuit side. Without
The oscillation frequency can be stably maintained for a long period of time.

The crystal piece 7 and the oscillation circuit can be assembled at the same time and in parallel because they are separate storage parts.
The time required for assembling the entire crystal oscillator can be roughly halved. Further, even if one of the crystal oscillator and the oscillation circuit is supplied for some reason, the other can be produced and stored, so that the manufacturing capacity can be effectively used.

The present invention is not limited to the above-mentioned embodiment, but the first and second containers 1 and 2 may be integrally molded with the bottom plate portions being common. In this case, the crystal unit and the oscillation circuit cannot be assembled separately, but there is an advantage that the work of bonding the first and second containers 1 and 2 is unnecessary.

[0024]

As described in detail above, according to the present invention,
It is possible to provide a crystal oscillator in which the shapes of the first and second accommodating portions can be made into a rational common shape, the amount of investment in jigs and tools can be reduced, and thereby the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is an assembled perspective view of one side of a crystal according to an embodiment of the present invention.

FIG. 2 is a perspective view of an oscillator circuit side according to an embodiment of the present invention.

3 is a cross-sectional view taken along the line AA of FIG.

[Explanation of symbols]

1, 2 ··· First and second containers 3rd, 4th ... First and second storage 5 ··· The first void 6 ... Second vacant space 7 ... Crystal pieces 8 ·· Excitation electrodes 9 ·· Holding electrode ..Semiconductor integrated circuit elements 12 ・ ・ Chip capacitors

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 5J079 AA04 BA43 FA01 FA19 HA04                       HA07 HA09                 5J108 BB02 CC04 EE03 EE07 FF11                       GG03 GG11 GG15 GG16 JJ02                       JJ04

Claims (5)

[Claims] 1. A ceramic package is housed in a first housing portion provided in a first container on one side of a ceramic package, and an oscillation circuit is housed in a second housing portion of a second container on the other side. In a crystal oscillator in which a quartz piece and an oscillating circuit are housed to define each other, the first and second accommodating portions have a rectangular first void and a center of a pair of opposite sides of the first void. A crystal oscillator having a space of the same shape, which is composed of a second void extending from the portion in the width direction. 2. A crystal oscillator according to claim 1, wherein the first and second containers have a common bottom plate and are integrally molded. 3. A crystal oscillator according to claim 1, wherein the first and second containers are integrally formed by backing their bottom plates back to back. 4. The device according to any one of claims 1 to 3, wherein an electrode is formed on each of the plate surfaces divided in the second space of the first storage portion, and the front and back plates are provided here. A crystal oscillator, characterized in that an excitation electrode is formed on a surface and one end of a crystal piece, which is led out to one end, is placed and fixed and the excitation electrode is electrically led out. 5. A semiconductor circuit element according to any one of claims 1 to 3, wherein a semiconductor circuit element is disposed in a first space of the second storage portion, and the second storage portion is provided with a semiconductor circuit element. A crystal oscillator, characterized in that chip capacitors used for an oscillation circuit are provided in each of the two voids.