JP2003007573A - Structure and manufacturing method of laminated chip type electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pole mark which shows the direction of a pole at a low cost in a form not to distinguish the pole mark in a laminated chip type electronic component such as a laminated chip type capacitor formed by laminating a plurality of ceramic sheets wherein an inner electrode film is formed. SOLUTION: A through hole 4 is formed in at least one ceramic sheet positioned in an uppermost layer of each ceramic sheet and thereby a pole mark 3 is provided to a bottom of the through hole 4. Alternately, a pole mark 3' is formed by shaping a recessed hole 4' in a ceramic sheet of the uppermost layer and charging the recessed hole 4' with materials of different colors.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to stacking a plurality of ceramic sheets having an internal electrode film for capacitors or an internal electrode film for coils, such as a multilayer chip type capacitor or inductor. The present invention relates to a structure of a laminated chip type electronic component and a manufacturing method thereof.

[0002]

2. Description of the Related Art Generally, in a multilayer chip type electronic component of this type, a multilayer chip is manufactured by stacking a plurality of ceramic sheets having internal electrodes for capacitors or internal electrode films for coils on the surface and then firing them. Cut into pieces
The structure is such that the connection terminal electrode film for each internal electrode film is formed on both left and right end surfaces of this laminated chip piece. Since both connection terminal electrodes have polarities, the surface of the laminated chip piece has a polar direction. It is necessary to provide a pole mark for displaying.

However, conventionally, in the manufacture of the above-mentioned laminated chip type electronic component, it is generally said that a plurality of ceramic green sheets having an internal electrode film formed on the surface thereof are prepared and the plurality of green sheets are prepared. The laminated chip pieces are laminated so that they are superposed on each other, and then pressed in the laminating direction to be integrated into a laminated chip piece, which is then fired at a high temperature to form a ceramic laminated chip piece. In order to expose the internal electrode film on both end faces of the laminated chip piece, surface polishing is performed by a barrel or the like, and then the connection terminal electrode film is formed on the left and right end faces of the laminated chip piece. The method of doing is adopted.

That is, the laminated chip type electronic component is manufactured through a process of firing the green sheet at a high temperature for making it into a ceramic, and a surface polishing process thereafter, so that the ceramic green sheet When stacking multiple sheets, if a pole mark indicating the direction of the pole is formed on the surface of the green sheet to be stacked on the uppermost layer of each green sheet, the poles formed on the surface of this uppermost green sheet The mark will disappear or become thinner in the subsequent steps of baking at a high temperature and surface polishing.

[0005]

Therefore, conventionally, after the laminated chip type electronic component is manufactured by the above method,
The direction of the pole in each electronic component is detected by measurement,
Based on this detection result, a method of imprinting a pole mark indicating the direction of the pole on the surface of the laminated chip piece is adopted.

In other words, conventionally, after manufacturing, the detection of the direction of the pole and the imprinting of the pole mark are performed for each electronic component, which requires a great deal of trouble and time. The cost was significantly increased.

Moreover, the pole mark imprinted on the surface of the layered chip after manufacturing is difficult to see because it becomes thin or blurs and becomes unclear depending on the ink condition and the imprint condition. In the case of automatic mounting on a substrate, there is also a problem that recognition mistakes frequently occur in optically recognizing the polar mark in this electronic component.

SUMMARY OF THE INVENTION The present invention has a technical object to provide a structure and a manufacturing method that solve these problems.

[0009]

In order to achieve this technical object, the first structure of the present invention is, as described in claim 1, "a plurality of ceramic sheets on which internal electrode films are formed are laminated. In an electronic component in which connection terminal electrodes for the internal electrode films are provided on both left and right end surfaces of a laminated chip piece integrally formed as a single unit, at least one ceramic sheet located in the uppermost layer of the ceramic sheets is penetrated. While forming a hole, a pole mark of a different color is formed in a portion of the ceramic sheet located below the ceramic sheet having the through hole, which corresponds to the through hole, and the polar mark is in the through hole. It is provided so that it is exposed to the bottom. ”

The second structure according to the present invention is, as described in claim 2, "the left and right end surfaces of a laminated chip piece formed by laminating and integrating a plurality of ceramic sheets having internal electrode films formed thereon. In the electronic component provided with the connection terminal electrode for each internal electrode film, at least one ceramic sheet located in the uppermost layer of each ceramic sheet is provided with a recessed hole, and in the recessed hole, It was filled with materials of different colors to make a pole mark. "

Next, the first manufacturing method of the present invention is as follows.
As described in claim 3, "a plurality of green sheets having an internal electrode film formed thereon are stacked, and further, a green sheet having polar marks formed in different colors and at least one uppermost layer are formed. Stacking green sheets into laminated chip pieces; forming a through hole exposing the polar mark in a portion of the uppermost green sheet corresponding to the polar mark; and forming the through hole. A step of firing the provided laminated chip piece into ceramic, a step of subjecting the fired laminated chip piece to surface polishing, and then,
And a step of forming connection terminal electrode films on the left and right end surfaces of the laminated chip piece. It is characterized by

The second manufacturing method of the present invention is
As described in claim 4, "a step of laminating a plurality of green sheets having an internal electrode film formed thereon, and further laminating at least one green sheet of the uppermost layer into a laminated chip piece; A step of forming a recessed hole in the uppermost green sheet, a step of filling a material of a different color in the recessed hole to provide a polar mark, and a laminated chip piece provided with the polar mark on a ceramic A step of firing, a step of subjecting the fired laminated chip piece to surface polishing,
Then, a step of forming connection terminal electrode films on the left and right end surfaces of the laminated chip piece is performed. It is characterized by

Still further, according to a third manufacturing method of the present invention, as described in claim 5, "a plurality of green sheets each having an internal electrode film formed thereon are laminated, and further, the internal electrode film is further laminated. And a step of stacking a green sheet having an auxiliary electrode film formed of the same material as the above and at least one uppermost green sheet into a laminated chip piece, which corresponds to the auxiliary electrode film among the uppermost green sheets. A step of forming a through hole having an inner diameter smaller than that of the auxiliary electrode film in the portion; a step of filling the through hole with the same material as the internal electrode film to provide a pole mark; and a laminated chip provided with the pole mark. It consists of a step of firing the piece into ceramic, a step of subjecting the fired laminated chip piece to surface polishing, and then a step of forming connection terminal electrode films on the left and right end surfaces of the laminated chip piece. . "It is characterized in that.

[0014]

According to the first and third aspects of the present invention, at least one ceramic sheet located at the uppermost layer is provided with a through hole, and at the same time, the ceramic sheet having the through hole is located below the ceramic sheet. By providing a polar mark of a different color in a portion of the sheet corresponding to the through hole so that the polar mark is exposed in the through hole, the polar mark is recessed in the bottom of the through hole. Since it will be provided in a form, it will not disappear even if it is subjected to firing to ceramic and subsequent surface polishing, and since it maintains a clear state, the polar mark in electronic parts is optically recognized. The certainty of doing so can be greatly improved.

Moreover, since the pole mark and the through hole exposing the pole mark are provided during the manufacture of the electronic component, it is not necessary to detect the direction of the pole after the manufacture as in the conventional case. The cost can be reduced significantly.

Further, as in claims 2 and 4, at least one ceramic sheet located at the uppermost layer is provided with a recessed hole, and a material having a different color is filled in the recessed hole to form a polar mark. By doing so, this pole mark is provided so as to be embedded inside the laminated chip piece, so that it will not disappear even if it is fired into ceramics and subjected to surface polishing thereafter, and it is clear. Since the state is maintained, it is possible to significantly improve the certainty of optically recognizing the polar mark in the electronic component.

Moreover, since the pole mark is provided during the manufacture of the electronic component, it is not necessary to detect the direction of the pole after the manufacture as in the conventional case, so that the manufacturing cost can be greatly reduced.

In particular, by adopting the method described in claim 5, the pole mark filled in the through hole in the uppermost green sheet becomes a large auxiliary electrode film formed in the green sheet located below it. On the other hand, since the electrodes are integrally joined by firing to the ceramic, it is possible to reliably prevent the pole mark from coming out of the through hole by the auxiliary electrode film. There is an advantage that the mark and the auxiliary electrode film can be made of the same material as the internal electrode film provided on the green sheet to reduce the cost.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings applied to a multilayer chip type capacitor.

1 to 8 show a first embodiment.

As shown in FIG. 1, a plurality of unfired first green sheets A1 formed by screen-printing a material paste on one surface of a plurality of internal electrode films 1 constituting a capacitor and the same surface as shown in FIG. And a plurality of unfired second green sheets A2 formed by screen-printing a material paste on a large number of one of the internal electrode films 2 constituting the capacitor are alternately laminated, and further, on the surface thereof, An unfired third green sheet A3 in which a large number of pole marks 3 are formed by screen printing of material pastes of different colors on each of the internal electrode films 1 and 2, and at least one unfired cover green sheet The green sheet A4 of No. 1 is superposed and laminated to obtain a laminated body B as shown in FIGS.

Each pole mark 3 on the green sheet A3 needs to be formed of a heat resistant material so that it can withstand firing at a high temperature which will be described later. Internal electrode films 1 in FIG. 2 and internal electrode films 2 in the second green sheet A2
Since the material paste forming the material has a color different from that of the ceramic, it may be formed of the same material paste as the ceramic material.
It is not limited to forming on the dedicated third green sheet A3, but a portion of the surface of the first green sheet A1 or the second green sheet A2 where the internal electrode films 1 and 2 are not formed, or The green sheet A1 or the second green sheet A2 may be formed on the back surface on which the internal electrode films 1 and 2 are not formed.

Next, in the uppermost green sheet A4 of the laminated body B, through holes 4 are formed at the positions of the respective pole marks 3 on the lower third green sheet A3 as shown in FIGS. The pole marks 3 are exposed in the through holes 4 by piercing.

The through hole 4 may be formed by irradiating a laser beam or a punch for forming a hole may be provided in the laminated body B.
Instead of this method, the through holes 4 are punched or punched in advance in the uppermost green sheet A4 before stacking, and this penetration is performed. Green sheet A with holes 4
It is needless to say that the step of forming the through holes 4 may be performed before the step of stacking, in other words, the step of stacking the four.

Next, as shown in FIG. 6, a plurality of laminated bodies B are laminated along the longitudinal cutting line C1 and the lateral cutting line C2 between the internal electrode films 1 and 2 as shown in FIG. The chip pieces 5 are cut.

Next, the plurality of laminated chip pieces 5 are
It is made into a ceramic by putting it in a heating furnace and firing at a high temperature.

Next, a large number of these ceramic-made laminated chip pieces 5 are surface-polished in a barrel surface polishing apparatus to expose the respective internal electrode films 1 and 2 to the left and right end surfaces 5a and 5b. , The left and right end surfaces 5a, 5
By forming the connection terminal electrode films 6a and 6b on b by applying / baking a material paste or plating, a multilayer chip type capacitor is completed.

As shown in FIGS. 7 and 8, the laminated chip type capacitor manufactured in this manner is a laminated body obtained by laminating a plurality of ceramic sheets 7 on which the internal electrode films 1 and 2 are laminated. Left and right end surfaces 5 of the chip piece 5
a and 5b are provided with connection terminal electrodes 6a and 6b for the internal electrode films 1 and 2, respectively, and the through hole 4 is formed in at least one ceramic sheet located at the uppermost layer of the ceramic sheets 7. On the other hand, in a portion of the ceramic sheet located below the ceramic sheet having the through holes 4, corresponding to the through holes 4,
This is a structure in which polar marks 3 of different colors are provided so that the polar marks 3 are exposed in the through holes 4.

In this structure, the polar mark 3 is provided in the bottom of the through hole 4 in a recessed form,
It does not disappear even if it is subjected to ceramic firing and subsequent surface polishing, and since it maintains a clear state, it can greatly improve the certainty of optically recognizing the polar mark in electronic parts. .

By providing the pole mark 3 and the through hole 4 exposing the pole mark during manufacturing, it is not necessary to detect the direction of the pole after manufacturing as in the conventional case.

Next, FIGS. 9 to 17 show a second embodiment.

As shown in FIG. 9, a plurality of unfired first green sheets A1 'formed by screen-printing a material paste on one surface of which a large number of one of the internal electrode films 1'constituting a capacitor are formed, Similarly, an unfired second green sheet A is formed by screen-printing a material paste on a large number of one of the internal electrode films 2'that form a capacitor on the surface.
A plurality of sheets of 2'are alternately laminated, and further, a third green sheet A3 'which has not been fired and at least one green sheet A4' which has not been fired for the cover are laminated and laminated on the surface thereof. By doing so, a laminated body B ′ as shown in FIG. 10 is obtained.

Next, of the uppermost green sheet A4 'in the laminated body B', each of the internal electrode films 1 ', 2'in each of the green sheets A1', A2 'below the green sheet A4', As shown in FIGS. 11 and 12, a recessed hole 4'is formed.

The formation of the recessed hole 4'is performed by irradiating a laser beam, or by pushing a punch for punching the hole into the laminated body B '.
Instead of this method, through holes are punched or punched in advance in the uppermost green sheet A4 'before being laminated, and the green sheet A4' having the through holes is laminated. It goes without saying that the step of providing the recessed hole 4 ', such as the above-mentioned formation of the recessed hole 4', may be performed before the step of stacking.

The recessed hole 4'may have a depth reaching a part of the third green sheet A3 ', but the third green sheet A3' is omitted and the first green sheet A1 'or The depth may reach the portion of the second green sheet A2 'where the internal electrode films 1', 2'are not formed or the back surface of the first green sheet A1 'or the second green sheet A2'.

Then, as shown in FIGS. 13 and 14,
Polar marks 3'are provided by filling material pastes of different colors by screen printing or the like into the recessed holes 4'in the uppermost green sheet A4 'of the laminate B'.

Each pole mark 3'needs to be formed of a heat-resistant material so that it can withstand firing at a high temperature described later. Since the material paste forming the internal electrode film 1'and each internal electrode film 2'in the second green sheet A2 'has a color different from that of ceramic, it may be formed of the same material paste.

Then, as shown in FIG. 15, the laminated body B'is cut along the vertical cutting line C1 'and the horizontal cutting line C2' between the internal electrode films 1'and 2 '. ,
The multi-layered chip pieces 5'are cut into pieces.

Next, this large number of laminated chip pieces 5 '
Is made into a ceramic by putting it in a heating furnace and firing at a high temperature.

Next, in the barrel surface polishing apparatus, the ceramic-made multiple laminated chip pieces 5'are surface-polished so that the respective internal electrode films 1 ', 2'are exposed on the left and right end surfaces 5a', 5b '. After processing, the connecting terminal electrode films 6a ', 6b' are formed on the left and right end surfaces 5a ', 5b'.
Is formed by applying / baking a material paste or plating treatment to obtain a finished multilayer chip capacitor.

As shown in FIGS. 16 and 17, the multilayer chip type capacitor thus manufactured is formed by laminating a plurality of ceramic sheets 7'on which internal electrode films 1'and 2'are formed. Formed on the left and right end surfaces 5a ', 5b' of the laminated chip piece 5 ', the internal electrode films 1',
2'is provided with connection terminal electrodes 6a 'and 6b', and at least one ceramic sheet located at the uppermost layer is provided with a recess hole 4 ', and different colors are provided in the recess hole 4'. This is a structure in which the polar mark 3 ′ is filled with the material of FIG.

In this structure, the polar mark 3'is
By being embedded in the laminated chip piece 5 ', it does not disappear even if it is fired into ceramics and subjected to surface polishing thereafter, and it maintains a clear state. The certainty of optically recognizing the mark 3'can be greatly improved.

By providing the pole mark 3'during manufacturing, it is not necessary to detect the direction of the pole after manufacturing as in the conventional case.

18 to 24 show a third embodiment.

As shown in FIG. 18, a plurality of unfired first green sheets A1 "formed by screen-printing a material paste on one surface of one of the internal electrode films 1" constituting the capacitor, Similarly, a plurality of unburned second green sheets A2 ″ formed by screen-printing a material paste on a large number of one of the inner electrode films 2 ″ that form a capacitor on the surface are alternately superposed, and further, A large number of auxiliary electrode films 8 are formed on the surface at the locations of the internal electrode films 1 ″ and 2 ″ by screen printing of the same material paste as that of the internal electrode films 1 ″ and 2 ″. By laminating the third green sheet A3 ″ and at least one unfired green sheet A4 ″ for the cover, the laminated body B ″ shown in FIG. 19 is obtained.

The auxiliary electrode films 8 are not limited to being formed on the dedicated third green sheet A3 ″ as described above, but may be formed on the first green sheet A1 ″ or the second green sheet A3 ″.
Each of the internal electrode films 1 ″ on the surface of the green sheet A2 ″,
It may be formed on a portion where 2 ″ is not formed or on the back surface of the first green sheet A1 ″ or the second green sheet A2 ″ where the internal electrode films 1 ″ and 2 ″ are not formed.

Next, in the uppermost green sheet A4 ″ of the laminated body B ″, the auxiliary electrode films 8 of the third green sheet A3 ″ on the lower side of the green sheet A4 ″ are placed at positions shown in FIG.
And as shown in FIG. 21, a through hole 4 ″ having an inner diameter smaller than that of the auxiliary electrode film 8 is bored by the same means as in the case of the first embodiment, so that the inside of the through hole 4 ″ is formed. Then, the auxiliary electrode film 8 is exposed.

Then, as shown in FIG. 22, the same material paste as that for the internal electrode films 1 "and 2" is screen-printed in the through holes 4 "in the uppermost green sheet A4" of the laminate B ". A pole mark 3 ″ is provided by filling with a pole or the like.

Next, as shown in FIG. 23, the laminated body B ″ is cut along the vertical cutting line C1 ″ and the horizontal cutting line C2 ″ between the internal electrode films 1 ″ and 2 ″. ,
A plurality of laminated chip pieces 5 ″ are cut.

Next, the plurality of laminated chip pieces 5 "
Is made into a ceramic by putting it in a heating furnace and firing at a high temperature.

Next, in the barrel surface polishing apparatus, a large number of these ceramic-made laminated chip pieces 5 "are surface-polished in order to expose the respective internal electrode films 1", 2 "to the left and right end surfaces 5a", 5b ". After processing, the connection terminal electrode films 6a "and 6b" are formed on the left and right end surfaces 5a "and 5b".
Is formed by applying / baking a material paste or plating treatment to obtain a finished multilayer chip capacitor.

As shown in FIG. 24, the multilayer chip type capacitor manufactured in this manner has internal electrode films 1 ″,
Connection terminal electrodes for the internal electrode films 1 "and 2" are formed on the left and right end surfaces 5a "and 5b" of a laminated chip piece 5 "formed by laminating and integrating a plurality of ceramic sheets 7" having 2 "formed thereon. 6a "and 6b" are provided, and
Since the pole mark 3 ″ here is embedded in the laminated chip piece 5 ″, it does not disappear even if the ceramic is fired and the surface is polished thereafter.

Moreover, the pole mark 3 ″ is integrally bonded to the auxiliary electrode film 8 larger than the pole mark 3 ″ during firing of the ceramic so that the pole mark 3 ″ penetrates. It is possible to reliably prevent the auxiliary electrode film 8 from coming out of the hole 4 ″.

Further, the inner electrode films 1 "and 2" provided on the green sheet are provided with the polar mark 3 "and the auxiliary electrode film 8".
The cost can be reduced by using the same material as.

Although each of the above-described embodiments is applied to the multilayer chip type capacitor, the present invention is not limited to this, and the coil is formed by the internal electrode film formed on each laminated ceramic sheet. It goes without saying that the present invention can also be applied to other laminated chip type electronic components such as a laminated chip type inductor formed by the following.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state in which green sheets are stacked in a first embodiment.

FIG. 2 is a perspective view showing a laminated body in the first embodiment.

3 is an enlarged sectional view taken along line III-III of FIG.

FIG. 4 is a perspective view showing a state in which a through hole is formed in the laminated body in the first embodiment.

5 is an enlarged sectional view taken along line VV of FIG.

FIG. 6 is a perspective view showing a laminated chip piece obtained by cutting the laminated body in the first embodiment.

FIG. 7 is a perspective view showing the multilayer chip type capacitor according to the first embodiment.

8 is a sectional view taken along line VIII-VIIII of FIG. 7.

FIG. 9 is a perspective view showing a state in which green sheets are stacked in the second embodiment.

FIG. 10 is a perspective view showing a laminated body in the second embodiment.

FIG. 11 is a perspective view showing a state in which a recessed hole is formed in the laminated body in the second embodiment.

12 is an enlarged sectional view taken along line XII-XII of FIG.

FIG. 13 is a perspective view showing a recessed hole of a laminated body filled with polar marks in the second embodiment.

14 is an enlarged sectional view taken along line XIV-XIV of FIG.

FIG. 15 is a perspective view showing a laminated chip piece obtained by cutting the laminated body in the second embodiment.

FIG. 16 is a perspective view showing a multilayer chip type capacitor according to a second embodiment.

17 is a sectional view taken along line XVII-XVII of FIG.

FIG. 18 is a perspective view showing a state in which green sheets are stacked in the third embodiment.

FIG. 19 is a perspective view showing a laminated body in the third embodiment.

FIG. 20 is a perspective view showing a state in which a through hole is formed in the laminated body in the third embodiment.

21 is an enlarged sectional view taken along line XXI-XXI of FIG. 20.

FIG. 22 is a cross-sectional view showing a through hole of a laminated body filled with polar marks in the third embodiment.

FIG. 23 is a perspective view showing a laminated chip piece obtained by cutting the laminated body in the third embodiment.

FIG. 24 is a cross-sectional view of a multilayer chip type capacitor according to a third embodiment.

[Explanation of symbols]

1 internal electrode 2 internal electrodes 3 pole mark 4 through holes 4'recessed hole 5 Layered chip pieces 5a, 5b End surface of laminated chip piece 6a, 6b connection terminal electrode film 7 Ceramic sheet 8 Auxiliary electrode film A1, A2, A3, A4 green sheet B laminate C1, C2 cutting line

Claims (5)

[Claims] 1. An electronic component in which a connecting terminal electrode for each internal electrode film is provided on both left and right end surfaces of a laminated chip piece formed by laminating and integrating a plurality of ceramic sheets having an internal electrode film formed thereon, While forming a through hole in at least one ceramic sheet located in the uppermost layer of the respective ceramic sheets,
In the portion corresponding to the through hole of the ceramic sheet located below the ceramic sheet having this through hole,
A structure of a laminated chip type electronic component, wherein polar marks having different colors are provided so that the polar marks are exposed in the through holes. 2. An electronic component in which a connecting terminal electrode for each internal electrode film is provided on both left and right end surfaces of a laminated chip piece formed by laminating and integrating a plurality of ceramic sheets having an internal electrode film formed thereon, At least one ceramic sheet located in the uppermost layer of the ceramic sheets is provided with a recessed hole, and a material having a different color is filled into the recessed hole to form a polar mark. Structure of chip-type electronic components. 3. A plurality of green sheets having an internal electrode film formed thereon are laminated, and a green sheet having polar marks of different colors and at least one uppermost green sheet are further laminated thereon. To form a laminated chip piece, a step of forming a through hole exposing the polar mark in a portion corresponding to the polar mark in the uppermost green sheet, and a laminated chip piece having the through hole To a ceramic, a step of subjecting the fired laminated chip piece to surface polishing, and then a step of forming connection terminal electrode films on the left and right end surfaces of the laminated chip piece. And a method for manufacturing a laminated chip type electronic component. 4. A step of laminating a plurality of green sheets having an internal electrode film formed thereon, and further laminating at least one green sheet of an uppermost layer into a laminated chip piece; A step of forming a recessed hole in the green sheet, a step of filling a material of a different color in the recessed hole to provide a pole mark, and a step of firing a laminated chip piece provided with the pole mark into a ceramic, A laminated chip type electronic component characterized by comprising a step of subjecting the fired laminated chip piece to surface polishing and a step of forming connection terminal electrode films on the left and right end surfaces of the laminated chip piece. Production method. 5. A plurality of green sheets having an internal electrode film formed thereon are laminated, and further, a green sheet having an auxiliary electrode film made of the same material as the internal electrode film and at least one uppermost layer Stacking green sheets into laminated chip pieces; forming a through hole having an inner diameter smaller than that of the auxiliary electrode film in a portion of the uppermost green sheet corresponding to the auxiliary electrode film; The step of filling the hole with the same material as the internal electrode film to provide a polar mark, the step of firing the laminated chip piece provided with the polar mark into a ceramic, and the surface polishing processing of the fired laminated chip piece A method of manufacturing a laminated chip type electronic component, comprising: a step of forming a connecting terminal electrode film on both left and right end surfaces of the laminated chip piece.