JP2002543421A5 - - Google Patents

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Publication number
JP2002543421A5
JP2002543421A5 JP2000615594A JP2000615594A JP2002543421A5 JP 2002543421 A5 JP2002543421 A5 JP 2002543421A5 JP 2000615594 A JP2000615594 A JP 2000615594A JP 2000615594 A JP2000615594 A JP 2000615594A JP 2002543421 A5 JP2002543421 A5 JP 2002543421A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2000615594A
Other versions
JP2002543421A (ja
JP4971543B2 (ja
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Publication date
Priority claimed from US09/304,699 external-priority patent/US6738505B1/en
Application filed filed Critical
Publication of JP2002543421A publication Critical patent/JP2002543421A/ja
Publication of JP2002543421A5 publication Critical patent/JP2002543421A5/ja
Application granted granted Critical
Publication of JP4971543B2 publication Critical patent/JP4971543B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000615594A 1999-05-04 2000-05-03 基板上の半田ペースト堆積を検査する方法および装置 Expired - Fee Related JP4971543B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/304,699 1999-05-04
US09/304,699 US6738505B1 (en) 1999-05-04 1999-05-04 Method and apparatus for detecting solder paste deposits on substrates
PCT/US2000/012121 WO2000067005A1 (en) 1999-05-04 2000-05-03 A method and apparatus for inspecting solder paste deposits on substrates

Publications (3)

Publication Number Publication Date
JP2002543421A JP2002543421A (ja) 2002-12-17
JP2002543421A5 true JP2002543421A5 (ja) 2007-06-28
JP4971543B2 JP4971543B2 (ja) 2012-07-11

Family

ID=23177612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000615594A Expired - Fee Related JP4971543B2 (ja) 1999-05-04 2000-05-03 基板上の半田ペースト堆積を検査する方法および装置

Country Status (6)

Country Link
US (1) US6738505B1 (ja)
EP (1) EP1181535B1 (ja)
JP (1) JP4971543B2 (ja)
AU (1) AU4697800A (ja)
DE (1) DE60034032T2 (ja)
WO (1) WO2000067005A1 (ja)

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US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
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US7101508B2 (en) * 2002-07-31 2006-09-05 Agilent Technologies, Inc. Chemical array fabrication errors
US7213738B2 (en) 2002-09-30 2007-05-08 Speedline Technologies, Inc. Selective wave solder system
DE10311822A1 (de) * 2003-03-13 2004-10-07 Ekra Eduard Kraft Gmbh Maschinenfabrik Verfahren und Vorrichtung zur Kontrolle oder Beeinflussung des Druckprozesses beim Lotpastendruck
US7508973B2 (en) * 2003-03-28 2009-03-24 Hitachi High-Technologies Corporation Method of inspecting defects
GB2403003B (en) * 2003-06-19 2006-06-07 Dek Int Gmbh Inspection system for and method of inspecting deposits printed on workpieces
US7003871B2 (en) * 2003-10-01 2006-02-28 Integrated Ideas & Technologies, Inc. Solder paste stencil manufacturing system
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
WO2007033349A1 (en) * 2005-09-14 2007-03-22 Cyberoptics Corporation Pick and place machine with improved component pick image processing
JP2009514234A (ja) * 2005-10-31 2009-04-02 サイバーオプティクス コーポレーション 組み込み型半田ペースト検査を備える電子アセンブリマシン
US20070102478A1 (en) * 2005-11-10 2007-05-10 Speedline Technologies, Inc. Optimal imaging system and method for a stencil printer
US20070102477A1 (en) * 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
WO2007066659A1 (ja) * 2005-12-06 2007-06-14 Shibaura Mechatronics Corporation 面粗さ検査装置
US7458318B2 (en) * 2006-02-01 2008-12-02 Speedline Technologies, Inc. Off-axis illumination assembly and method
US9068917B1 (en) * 2006-03-14 2015-06-30 Kla-Tencor Technologies Corp. Systems and methods for inspection of a specimen
CN101427127A (zh) 2006-04-26 2009-05-06 夏普株式会社 滤色器检测方法、滤色器制造方法和滤色器检测装置
US7549371B2 (en) * 2006-07-10 2009-06-23 Speedline Technologies, Inc. Method and apparatus for clamping a substrate
EP1901121A2 (en) * 2006-09-13 2008-03-19 ASML MaskTools B.V. A method for performing pattern decomposition based on feature pitch
JP2008139027A (ja) * 2006-11-29 2008-06-19 Sharp Corp 検査装置、検査方法、撮像検査システム、カラーフィルタの製造方法、検査プログラム
US7710611B2 (en) * 2007-02-16 2010-05-04 Illinois Tool Works, Inc. Single and multi-spectral illumination system and method
US7861650B2 (en) * 2007-04-13 2011-01-04 Illinois Tool Works, Inc. Method and apparatus for adjusting a substrate support
JP5877639B2 (ja) 2010-12-27 2016-03-08 富士機械製造株式会社 画像生成装置および画像生成方法
US8939074B2 (en) 2013-03-12 2015-01-27 Illinois Tool Works Inc. Color-based linear three dimensional acquisition system and method
KR102025184B1 (ko) * 2013-07-31 2019-09-25 엘지디스플레이 주식회사 데이터 변환 장치 및 이를 이용한 디스플레이 장치
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10576566B2 (en) * 2016-06-06 2020-03-03 International Business Machines Corporation Solder paste misprint cleaning
KR20190084167A (ko) * 2017-12-21 2019-07-16 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체
CN108960306B (zh) * 2018-06-22 2022-03-04 西安电子科技大学 基于smt大数据的锡膏检测阈值优化方法
US11033990B2 (en) * 2018-11-29 2021-06-15 Raytheon Company Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies
CN114930160A (zh) * 2020-01-17 2022-08-19 株式会社富士 检查装置以及检查方法

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US6066206A (en) 1997-02-21 2000-05-23 Speedline Technologies, Inc. Dual track stenciling system with solder gathering head

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