JP2002540588A - RF connectors on both sides - Google Patents

Abstract

(57) [Summary] This is a connector that interconnects pins and flat conductors. The connector uses two bundles formed of densely packed gold-plated wire bundles to make electrical connections to the device. The wire bundle is housed in a dielectric sleeve structure and connected by solid conductors. A portion of one wire bundle projects from one end of the sleeve structure to make electrical contact with the flat conductor on the coupling structure. The second wire bundle forms a recess in the sleeve structure adjacent the second end of the sleeve structure. The pin is inserted into the second end in the mounting structure and makes electrical contact with the second bundle of wires. The connector provides a robust electrical connection and adds precise pin position changes to provide flat conductor misalignment. The lengths of the pins of the coupling portion vary greatly and the connector arrangement provides a controlled impedance interconnect over microwave frequencies. Connectors can be installed in large assembly structures to provide multiple interconnects that are coupled together. This is achieved by providing a diameter margin and a taper in the bore of the coupling housing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD OF THE INVENTION

The present invention relates to RF connector devices, and more particularly, to a connector that provides an interconnection between a pin and a flat conductor.

[0002]

[Prior art]

Making RF interconnections between adjacent boards or circuit boards is necessary in many microwave applications. A common technique for interconnecting circuit boards involves the use of cables.

[0003] Coaxial connectors are used to connect between two joints with soldering pins entering the connector from each side. Connectors generally “grab” the coupling pin
Has finger sockets or crimps.

[0004]

[Problems to be solved by the invention]

 It requires a connector that forms a secure RF connection between the pins and the flat conductor.

[0005]

[Means for Solving the Problems]

The present invention is a connector for providing RF interconnection between pins and flat conductors. The connector uses two "buttons" or bundles made of densely packed gold-plated wires for making electrical connections to the device. The two buttons are housed in a dielectric sleeve and connected by a solid conductor. The connector arrangement provides robust electrical connections as a result of using densely packed wire buttons, but also provides flat connector misalignment in addition to precise pin position changes. Although the pin length of the coupling portion varies significantly, the connector arrangement provides microwave frequency controlled impedance interconnection.

[0006] Connectors are mounted in a number of structures that provide a number of interconnects that mate simultaneously. This is achieved by providing the coupling housing with a taper and clearance.

The present invention provides a coaxial transmission line with a robust and simple electrical connection whose impedance is controlled by the proper selection of the ratio of the diameter of the wire bundle or conductor pin to the diameter of the dielectric. One side of the connector provides a blind mating connection to the pin without mechanically gripping the pin to require split finger contacts. The other side of the connector provides another blind connection without the use of solder or mechanical fasteners. This end also allows for large variations in pin length.

[0008] These and other features and advantages of the present invention will become more apparent from the following detailed description of exemplary embodiments illustrated in the accompanying drawings.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION

An exemplary embodiment of a connector arrangement for making interconnections between flat conductors and pins according to the present invention is shown in cross section in FIG. Apparatus 50 includes a dielectric body 60, which in this embodiment is a two-part structure including an upper body member 70 and a lower body member 80. Body members 70 and 80 are made from a dielectric material. One material suitable for the purpose is Teflon, and another dielectric material can be used instead.

[0010] Body member 70 has a reduced diameter region 70C with respect to portion 72 to define a shoulder 70D. The shoulder provides a stop surface for indicating the position of the upper body member when inserted into the coupling structure, with the upper surface 70A being flush with the surface of the coupling structure.

The upper body member 70 has a central opening 74 therethrough, into which a gold-plated wire bundle 76 is pushed. The wire bundle is 20 mils (0.
020 inches) of dense gold-plated wire packed in high density and the bundle 76 is short distance from the first end 70A of the upper body member so as to make electrical contact with the coupling circuit when installed. Just protrude. In this exemplary embodiment, the bundle is manufactured as a cylindrical wire having a thickness in the range of 1 mil to 2 mils.

The upper body member 70 is configured to receive a portion of a solid, electrically conductive pin 90. One end of the pin is inserted into opening 74 from lower end 70B of the upper body member. The pins contact the wire bundle 76. In this exemplary embodiment, the pins are fabricated from beryllium copper, which is nickel plated and gold plated, ie, two metal layers on copper, a first nickel layer and a second gold layer. There are layers.

The lower body member 80 is made of Teflon and provides a housing for the solid pin 90. In addition, the lower body member has another gold plated wire bundle 8.
6 to provide a long hollow cylinder. The wire bundle 86 makes intimate contact with the solid pins 90 for electrical connection. The wire bundle 86 forms a recess in an opening 82 formed in the body member 80, leaving an open area 84 in which the coupling pin is received. The height of the wire bundle is specified according to the coupling pins to ensure proper electrical continuity. Body member 80 has a tapered portion 88 leading to opening 82 to facilitate receiving the coupling pin in region 84.

The diameter of the pins 90, the bundle of wires and the body member 60, are precisely controlled to maintain a particular characteristic impedance. In an embodiment operating over the frequency range of DC to 18 Ghz, the pin 80 has a diameter of 0.035 inches and the body member 8
0 has a diameter of 0.060 inches and the maximum diameter of body member 70 is 0.115 inches.

The upper body member 70 has the lower body member attached thereto in various ways. For example, Figure 1
The upper and lower body members 70 and 80 are formed to snap-fit together, as in the embodiment of FIG. If the snap fit is very small,
In some applications, it may not be enough to press a pin into the body member and / or glue the elements together with an epoxy to secure the elements of the structure together. The upper body member 70 has a depending lip 78 and the lower member 80 has an exposed edge lip 88 that is snap-fitted to the depending lip. The shape of the snap may be reversed between the upper and lower body members if space permits.

Another mounting technique is to press fit the solid pins 90 into each of the body members 70 and 80 for connection. A mating interface ensures that the entire connector is assembled. A third mounting technique is to bond the body members 70 and 80 together. The pins 90 are reduced in cross-sectional diameter within each of the upper and lower body members. The adhesive is placed in a small hole in each body member. The adhesive holds the pins within each body member and holds the structure.

The body member has a step-reducing portion of the diameter of the hole formed therein to provide a respective mating surface that mates with the end of the pin 90. In this embodiment, the change in diameter of the conductor through the length of the interconnect of the connector is matched by a corresponding change in the diameter of the dielectric sleeve to maintain a constant characteristic impedance throughout the length of the interconnect. Is done. The diameter of the wire bundles 78, 86 is reduced relative to the pin diameter to compensate for the reduction in hole diameter.

The connector according to the invention can be used in different installation environments. One specific installation structure is shown in FIGS. 2 to 5 and shows the order in which the various different components in the installation are combined. In this installation, the upper body member of the connector 50 has a flat conductor area formed on the lower surface. It contacts the printed wiring board 110 having 112. Upper body member 7
0 is attached to a hole 116 formed in the upper housing member 114. Hole 1
16 has a reduced diameter region 118 forming a stop shoulder 118A so that shoulder 70D of connector 50 mates when upper body member 70 is fully inserted into hole 116 of housing 114. . The housing member 114 is preferably made of a conductive material, such as aluminum. FIG. 3 is an exploded sectional view showing a substrate 110,
The housing 114 and the connector 50 are shown.

Connector 50 is used in installations that require multiple connections, and thus multiple connectors. This is shown in FIGS. 3-5, where the upper housing member 114 receives a plurality of connectors 50 at a plurality of receivers 116 at spaced intervals. The receptacle is sized to cooperate with the connector, such that when the connector is inserted into the receptacle, the respective shoulder surfaces 70D, 118A are joined so that the end surface 70A of the connector is flush with the surface 114A of the housing 114. Match.

FIG. 3 shows a printed wiring board 110 having a flat conductor 112 connected to an upper housing member 11.
4 shows the assembled structure, with the exposed tip of the wire bundle 76 of each connector 50 corresponding to a flat conductor area 112 on the underside of the printed wiring board 110.
Contact Printed wiring board 110 is secured to housing 114 by screw fasteners or, if necessary, another conventional technique. The structure is coupled to a lower housing member 120 having a plurality of receiving apertures 122 formed to receive the lower body member 80 of the connector 50. Lower housing 120 is made of an electrically conductive material such as aluminum.

For proper alignment and mating, the lower housing 120 is
2 is larger than the diameter of the connector 50 and has a taper.
0 is gradually aligned with the housing 120. In the embodiment, the size of the inlet opening is 50% larger than the diameter of the main body member 80. For a 0.06 inch diameter body member 80, the entrance to the opening 122 is 0.09 inch diameter, giving a radial tolerance of +/- 15 mils.

The lower housing 120 is assembled with the upper housing member 114 and the connector 50 is captured between them. The housings 120 and 114 are secured by conventional clamping techniques and, if necessary, for example, by screw fasteners.

The next step in the assembly process is a lower coupling component having a plurality of protruding conductive pins 132 aligned to be received in lower body member 80 of connector 50 in electrical contact with wire bundle 86. This is a step of assembling the slab 130. Instead of one coupling component that couples to a plurality of components, a plurality of components 130 each having one or more pins may be used. Pin 132 is connected to a circuit (not shown) that forms coupling component 130. The pins have a protruding substantially flat surface 134 which is moved toward the lower surface of the upper housing by pins 132 which are inserted into the pin receptacles 84 of each connector.

FIG. 5 shows the completed installation structure, in which connections are made between corresponding pins 132 projecting perpendicularly to surface 110 A and a flat conductor region formed on surface 110 A of printed wiring board 110. Is done. Many connections are set up to allow multiple blind coupling RF connections.

The present invention provides a robust and simple electrical connection with controlled impedance. One side of the connector provides a blind connection to the pin without mechanically gripping the pin like a split finger contact. The other side of the connector provides the other blind connection without the use of solder or mechanical fasteners. This end causes a considerable change in the length of the pin. Furthermore, by incorporating them into the structure, multiple connections are formed between large devices by blind coupling.

It should be understood that the above-described embodiments are merely illustrative of specific embodiments that illustrate the principles of the present invention. Other configurations are readily conceived by those skilled in the art according to these principles without departing from the scope of the invention.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a first embodiment of a connector structure according to the present invention.

FIG. 2 is a simplified exploded cross-sectional view of the connector of FIG. 1 and a printed circuit board having a top housing and flat conductors where electrical contact is made.

FIG. 3 is a simplified exploded cross-sectional view of an installation apparatus including a plurality of connectors according to the present invention, showing a connector installed in an upper housing and a position of a structure to a lower housing.

FIG. 4 is a view similar to FIG. 3 showing the coupling part with the exposed pins located for installation and the lower housing in the installed position;

FIG. 5 is a view similar to FIG. 4 showing the completed structure;

[Procedure amendment]

[Submission date] November 21, 2000 (2000.11.21)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Contents of correction]

[Claims]

────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Winslow, David T. United States, California 90034 Los Angeles, Oline Street 8921 (72) Inventor Lanyan, Michael Dee United States, California 90503 Torrance, Sturges Drive 19441 (72) Inventor Nguyen, Dante, USA 92708, Fountain Valley, California, Mount Nimbus Street 16326 (72) Inventor Quan, Clifton United States, California 91006 Arcadia, N. Florida Avenue 5521 (72) Inventor Fang Chou, Yan United States, 90045 Los Angeles, California, Compass drive 5843 F term (reference) 5E023 AA04 AA05 AA16 BB01 BB02 BB22 CC22 CC26 DD21 DD25 EE18 EE34 FF07 GG15 HH15 5E087 EE02 EE03 EE06 EE12 FF01 FF27 HH01 JJ06 KK01 QQ01 RR03

Claims (14)

[Claims] 1. A connector for making an RF interconnection between a pin and a flat conductor, wherein the first and second wire bundles are formed of densely packed wires for making electrical connections to the pin and the flat conductor, respectively. And a dielectric sleeve structure for receiving first and second bundles of wires, wherein the dielectric sleeve structure has first and second ends on opposite sides, and is flat in installation. A portion of the first bundle of wires protrudes from the first end to make electrical contact with the various conductors, and the second bundle of wires forms a recess in the sleeve structure adjacent the second end. Is configured to receive the pin in the installation to form an electrical contact between the pin and the second bundle of wires, and further electrically connected with the first and second bundle of wires, Comprising a conductor disposed between the first and second wire bundles, Connector that is formed between the pin and the flat conductor when the electrical connection of the connector is attached to the mounting structure. 2. The dielectric sleeve structure includes a first dielectric body member and a second dielectric body member, the first body member having a first opening therethrough, the first body member having a first opening. The wire bundle is located within the first opening, the second body member has a second opening therethrough, the second wire bundle is located within the second opening, and the first opening is The connector according to claim 1, wherein the first body member and the second body member are assembled so as to communicate with the second opening. 3. The connector of claim 2, wherein the conductor is received at an end adjacent the first and second openings. 4. The connector of claim 1, wherein the first bundle of wires makes electrical contact with the flat conductor and the second bundle of wires contacts pins projecting in a direction perpendicular to the flat conductor. 5. A connector for providing an RF interconnect between a pin and a flat conductor, the connector having a first opening therethrough and having a first cylindrical outer surface area coupled to the first housing structure. A first dielectric body member having a cylindrical outer surface area and having a second opening therethrough, and a high density for making electrical connections to the pins and the flat conductor, respectively. A first and a second bundle of wires packed with a first end disposed in the first opening and having a first end in electrical contact with a second end of the first bundle of wires. A solid conductor comprising a second portion disposed in the second opening and having a second end electrically contacting a second end of the second wire bundle. Wherein the first and second dielectric body members have a first end of a first opening and a first end of a second opening.
The first wire bundle is disposed in the first opening of the first main body member so as to protrude from the second end of the first opening. Disposing a second bundle of wires in a second opening of the second body member such that a recess is formed in the second opening adjacent to a second end of the second opening. Wherein the second end is configured to receive a pin arranged for electrical contact between the pin and the second bundle of wires, wherein when the conductor is installed during operation of the installation structure, the electrical connection is made with the pin. A connector formed between a flat conductor. 6. The first body member has a second outer cylindrical region having a smaller diameter than the first outer region, and the shoulder surface has a first cylindrical region and a second cylindrical region. 6. The connector of claim 5, wherein the connector defines a boundary between the regions and provides a stop for aligning the location of the connector on the receiving portion. 7. The connector of claim 5, wherein said first and second body members are assembled by a snap connection. 8. A first end of said first opening of said first dielectric body member is relatively oversized to a solid conductor, and said second dielectric body member is formed of an opening. A first open end is formed, the first end of the second body member is larger than a first end of the first opening of the first body member, and a second body is formed. The connector of claim 7, wherein a first end of the member is secured by the snap connection and is assembled into a first opening of the first body member. 9. The first body member includes a first opening having a depending lip region formed therein, wherein a first end of the second body member is a second body member. 9. The connector of claim 8, further comprising an edge lip structure that snaps into said depending lip area for securing a first body member. 10. The connector of claim 5, wherein the second end of the second opening is tapered outwardly to facilitate insertion of a pin into the second opening. 11. A method of making an RF connection between a flat conductor and a pin, wherein the first and second wires are formed into densely packed wires for making electrical connections to the pin and the flat conductor, respectively. Providing a connector having a bundle and a dielectric sleeve structure that receives the first and second wire bundles and has first and second opposite ends, wherein a portion of the first wire bundle includes an installation structure. A second wire bundle protruding from the first end of the dielectric sleeve structure for electrical contact with a flat conductor in the body, forming a recess in the sleeve structure adjacent the second end; A second end configured to receive a pin in an installation structure such that electrical contact is made between the first and second wire bundles and a housing between the first and second wire bundles that make electrical contact. And a solid conductor disposed in the first receiving portion formed therethrough Preparing a first conductive housing structure having an opening, inserting a first end of the connector into an opening of the first receiving portion, wherein the first end of the connector is the first end of the first wire bundle. Providing a second housing structure positioned through the first housing structure to be exposed on a first surface of the first housing structure and having a second receptacle opening formed therethrough; Assembling a second housing structure at a second end of the connector such that a portion of the second housing is received in the second receiving opening. 12. The connector of claim 2, wherein the pin is in electrical contact with the second wire bundle.
12. The method of claim 11 including the step of: locating in a coupling circuit structure having a pin projecting with respect to the second housing structure to project at an end of the coupling circuit structure. 13. A flat conductor formed on a first surface relative to a first surface of the first housing structure such that an exposed tip of the first wire bundle is in electrical contact with the flat conductor region. 13. The method of claim 12, including the step of positioning a substrate having an area. 14. A bond having a flat substrate having a flat conductor region formed on a first surface, and a pin spaced from the flat substrate and projecting perpendicular to the flat conductor region. A circuit and a connector for making an RF interconnection between the pin and the flat conductor area, the connector being formed by densely packed wires for making electrical connections to the pin and the flat conductor, respectively. A first and second wire bundle, and a dielectric sleeve structure for accommodating the first and second wire bundle having first and second opposite ends, wherein a part of the first wire bundle is The second bundle of wires protrudes from the first end to make electrical contact to the flat conductor in the installation device, and the second bundle forms a recess in the sleeve structure adjacent the second end. Forms electrical contact between pin and second bundle of wires A dielectric sleeve structure configured to receive the pins of the installation device, and a solid conductor disposed within the sleeve structure between the first and second bundles of wires in electrical contact, formed through the dielectric sleeve structure. A first receiving portion opening, the first end of the connector being inserted into the first receiving portion opening, and the tip end of the first wire bundle being exposed on the first surface of the first housing structure; A first conductive housing structure for contacting the flat conductive region; and a second receptacle opening formed therethrough, the connector having a second receptacle opening formed therein, wherein a portion of the connector is received in the second receptacle opening. A second conductive housing structure assembled at the second end, wherein the pins of the coupling circuit protrude into the second end of the connector to contact the second bundle of wires. And RF circuit.