JP2002524864A5 - - Google Patents

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Publication number
JP2002524864A5
JP2002524864A5 JP2000569296A JP2000569296A JP2002524864A5 JP 2002524864 A5 JP2002524864 A5 JP 2002524864A5 JP 2000569296 A JP2000569296 A JP 2000569296A JP 2000569296 A JP2000569296 A JP 2000569296A JP 2002524864 A5 JP2002524864 A5 JP 2002524864A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2000569296A
Other languages
Japanese (ja)
Other versions
JP2002524864A (ja
Filing date
Publication date
Priority claimed from US09/150,458 external-priority patent/US6078030A/en
Application filed filed Critical
Publication of JP2002524864A publication Critical patent/JP2002524864A/ja
Publication of JP2002524864A5 publication Critical patent/JP2002524864A5/ja
Abandoned legal-status Critical Current

Links

JP2000569296A 1998-09-09 1999-09-03 半導体製造設備で使用するための構成部品ヒータ Abandoned JP2002524864A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/150,458 1998-09-09
US09/150,458 US6078030A (en) 1998-09-09 1998-09-09 Component heater for use in semiconductor manufacturing equipment
PCT/US1999/019885 WO2000014616A1 (en) 1998-09-09 1999-09-03 Component heater for use in semiconductor manufacturing equipment

Publications (2)

Publication Number Publication Date
JP2002524864A JP2002524864A (ja) 2002-08-06
JP2002524864A5 true JP2002524864A5 (US07585860-20090908-C00136.png) 2006-10-26

Family

ID=22534624

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000569296A Abandoned JP2002524864A (ja) 1998-09-09 1999-09-03 半導体製造設備で使用するための構成部品ヒータ

Country Status (5)

Country Link
US (1) US6078030A (US07585860-20090908-C00136.png)
EP (1) EP1118051B1 (US07585860-20090908-C00136.png)
JP (1) JP2002524864A (US07585860-20090908-C00136.png)
TW (1) TW432451B (US07585860-20090908-C00136.png)
WO (1) WO2000014616A1 (US07585860-20090908-C00136.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7575616B2 (en) * 2006-02-10 2009-08-18 Entegris, Inc. Low-profile surface mount filter

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4436674A (en) * 1981-07-30 1984-03-13 J.C. Schumacher Co. Vapor mass flow control system
US4484472A (en) * 1983-02-16 1984-11-27 Emerson Electric Co. Concentric rod and tube sensor for thermal mass flow controller and flow meter
US4778559A (en) * 1986-10-15 1988-10-18 Advantage Production Technology Semiconductor substrate heater and reactor process and apparatus
US4794947A (en) * 1986-11-29 1989-01-03 Kabushiki Kaisha Nippon IC (also trading as Nippon IC, Inc.) Mass flow controller
US5138973A (en) * 1987-07-16 1992-08-18 Texas Instruments Incorporated Wafer processing apparatus having independently controllable energy sources
US5646334A (en) * 1995-09-12 1997-07-08 Seagate Technology, Inc. Multisample dynamic headspace sampler
JPH0244211A (ja) * 1988-08-04 1990-02-14 Sharp Corp フローセンサ
US5231291A (en) * 1989-08-01 1993-07-27 Canon Kabushiki Kaisha Wafer table and exposure apparatus with the same
JPH03156509A (ja) * 1989-11-14 1991-07-04 Stec Kk マスフローコントローラ
EP0447155B1 (en) * 1990-03-12 1995-07-26 Ngk Insulators, Ltd. Wafer heaters for use in semi-conductor-producing apparatus, heating units using such wafer heaters, and production of heaters
WO1991019959A1 (en) * 1990-06-14 1991-12-26 Unit Instruments, Inc. Thermal mass flow sensor
US5062446A (en) * 1991-01-07 1991-11-05 Sematech, Inc. Intelligent mass flow controller
US5436172A (en) * 1991-05-20 1995-07-25 Texas Instruments Incorporated Real-time multi-zone semiconductor wafer temperature and process uniformity control system
KR940011791B1 (ko) * 1992-04-15 1994-12-26 금성일렉트론주식회사 온도안정화 매스 플로우 컨트롤러 센서
US5441076A (en) * 1992-12-11 1995-08-15 Tokyo Electron Limited Processing apparatus using gas
US5439026A (en) * 1992-12-11 1995-08-08 Tokyo Electron Limited Processing apparatus and flow control arrangement therefor
US5455014A (en) * 1993-07-20 1995-10-03 Hughes Aircraft Company Liquid deposition source gas delivery system
JP2794081B2 (ja) * 1994-03-15 1998-09-03 工業技術院長 燃料電池発電システム
US5601366A (en) * 1994-10-25 1997-02-11 Texas Instruments Incorporated Method for temperature measurement in rapid thermal process systems
US5660207A (en) * 1994-12-29 1997-08-26 Tylan General, Inc. Flow controller, parts of flow controller, and related method
US5811762A (en) * 1996-09-25 1998-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Heater assembly with dual temperature control for use in PVD/CVD system
US5911238A (en) * 1996-10-04 1999-06-15 Emerson Electric Co. Thermal mass flowmeter and mass flow controller, flowmetering system and method

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