JP2002374086A - ラックマウント搭載型情報処理装置の冷却方法 - Google Patents
ラックマウント搭載型情報処理装置の冷却方法Info
- Publication number
- JP2002374086A JP2002374086A JP2001181018A JP2001181018A JP2002374086A JP 2002374086 A JP2002374086 A JP 2002374086A JP 2001181018 A JP2001181018 A JP 2001181018A JP 2001181018 A JP2001181018 A JP 2001181018A JP 2002374086 A JP2002374086 A JP 2002374086A
- Authority
- JP
- Japan
- Prior art keywords
- rack
- cooling
- cabinet
- information processing
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001181018A JP2002374086A (ja) | 2001-06-15 | 2001-06-15 | ラックマウント搭載型情報処理装置の冷却方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001181018A JP2002374086A (ja) | 2001-06-15 | 2001-06-15 | ラックマウント搭載型情報処理装置の冷却方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002374086A true JP2002374086A (ja) | 2002-12-26 |
| JP2002374086A5 JP2002374086A5 (enExample) | 2005-10-20 |
Family
ID=19021348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001181018A Pending JP2002374086A (ja) | 2001-06-15 | 2001-06-15 | ラックマウント搭載型情報処理装置の冷却方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002374086A (enExample) |
Cited By (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004082088A1 (de) * | 2003-03-11 | 2004-09-23 | Rittal Gmbh & Co. Kg | Kühlmittelführungselement und kühlmittelführungseinrichtung |
| WO2004080132A3 (de) * | 2003-03-07 | 2004-11-04 | Rittal Gmbh & Co Kg | Flüssigkeits-kühlsystem |
| EP1524888A2 (en) | 2003-10-17 | 2005-04-20 | Hitachi, Ltd. | Cooling device and electronic apparatus building in the same |
| DE102004008461A1 (de) * | 2004-02-17 | 2005-10-06 | Rittal Gmbh & Co. Kg | Gehäuseanordnung |
| DE102004013312A1 (de) * | 2004-03-17 | 2005-10-13 | Rittal Gmbh & Co. Kg | Vorrichtung zum Kühlen von in einem Baugruppenträger oder Aufnahmegehäuse übereinander angeordneten Steckeinschüben |
| EP1448040A3 (en) * | 2003-02-14 | 2006-04-26 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
| US7286351B2 (en) | 2005-05-06 | 2007-10-23 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system |
| JP2008161005A (ja) * | 2006-12-26 | 2008-07-10 | Toshiba Mitsubishi-Electric Industrial System Corp | 電力変換装置 |
| US7408775B2 (en) * | 2004-10-19 | 2008-08-05 | Honeywell International Inc. | Electrical module and support therefor with integrated cooling |
| WO2009110412A1 (ja) * | 2008-03-03 | 2009-09-11 | ナブテスコ株式会社 | 液冷式電子ユニットを収納するラック |
| JP2010072993A (ja) * | 2008-09-19 | 2010-04-02 | Internatl Business Mach Corp <Ibm> | 水冷媒圧縮システムを用いた電子装置ラックの冷却を促進するための装置および方法 |
| US7826217B2 (en) | 2007-12-14 | 2010-11-02 | Hitachi, Ltd. | Cooling device and electronic apparatus using the same |
| JP2010257431A (ja) * | 2009-04-28 | 2010-11-11 | Fuji Furukawa Engineering & Construction Co Ltd | 通信・情報処理用電子機器室等の冷却システム |
| KR100997045B1 (ko) | 2010-10-13 | 2010-11-29 | 에스피산업기술주식회사 | 서버랙 |
| JP2011018220A (ja) * | 2009-07-09 | 2011-01-27 | Takenaka Komuten Co Ltd | データセンターユニット及びデータセンター |
| US7961475B2 (en) | 2008-10-23 | 2011-06-14 | International Business Machines Corporation | Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
| US7983040B2 (en) | 2008-10-23 | 2011-07-19 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
| US8004839B2 (en) | 2007-03-22 | 2011-08-23 | Fujitsu Limited | Cooling system for information device |
| US8120916B2 (en) | 2009-09-17 | 2012-02-21 | International Business Machines Corporation | Facilitating cooling of an electronics rack employing water vapor compression system |
| US8164902B2 (en) | 2008-09-24 | 2012-04-24 | Hitachi, Ltd. | Electronic apparatus |
| US8179677B2 (en) | 2010-06-29 | 2012-05-15 | International Business Machines Corporation | Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
| US8184436B2 (en) | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
| JP2012099637A (ja) * | 2010-11-02 | 2012-05-24 | Kawamura Electric Inc | 冷却水配管機構を備えたサーバーラック |
| US8203842B2 (en) | 2008-10-23 | 2012-06-19 | International Business Machines Corporation | Open flow cold plate for immersion-cooled electronic packages |
| JP2012181714A (ja) * | 2011-03-02 | 2012-09-20 | Fujitsu Ltd | 冷却システム及び情報処理装置 |
| US8345423B2 (en) | 2010-06-29 | 2013-01-01 | International Business Machines Corporation | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems |
| US8345425B2 (en) | 2009-08-28 | 2013-01-01 | Hitachi, Ltd. | Cooling system and electronic apparatus applying the same therein |
| US8351206B2 (en) | 2010-06-29 | 2013-01-08 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit |
| JP2013008888A (ja) * | 2011-06-27 | 2013-01-10 | Ntt Facilities Inc | サーバラック冷却装置 |
| US8369091B2 (en) | 2010-06-29 | 2013-02-05 | International Business Machines Corporation | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
| JP2013065227A (ja) * | 2011-09-20 | 2013-04-11 | Hitachi Ltd | サーバラックの冷却システム及びサーバ機器 |
| WO2013179449A1 (ja) * | 2012-05-31 | 2013-12-05 | 富士通株式会社 | ラック型情報処理装置 |
| US8853872B2 (en) * | 2007-02-26 | 2014-10-07 | Google Inc. | Water-based data center |
| WO2015088186A1 (ko) * | 2013-12-11 | 2015-06-18 | 주식회사 한경아이넷 | 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치 |
| WO2015143819A1 (zh) * | 2014-03-28 | 2015-10-01 | 中兴通讯股份有限公司 | 液冷散热服务器 |
| JP2016512638A (ja) * | 2013-03-14 | 2016-04-28 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 支持部材 |
| WO2016127706A1 (zh) * | 2015-02-10 | 2016-08-18 | 中兴通讯股份有限公司 | 一种散热插箱 |
| WO2016130153A1 (en) * | 2015-02-13 | 2016-08-18 | Hewlett Packard Enterprise Development Lp | Thermal bus bar |
| WO2017049998A1 (zh) * | 2015-09-25 | 2017-03-30 | 顾玉奎 | 一种太阳能供电且可局部冷却的电气柜 |
| WO2017109996A1 (ja) * | 2015-12-25 | 2017-06-29 | 株式会社日立製作所 | 電子機器ラック及び電子機器ラックを具備する装置 |
| CN108591088A (zh) * | 2018-03-30 | 2018-09-28 | 郑州蓝奇盾网络科技有限公司 | 一种计算机主体排风扇 |
| KR101929284B1 (ko) | 2018-07-19 | 2018-12-14 | 한화시스템 주식회사 | 적층형 통신전자장비의 냉각장치 |
| CN109041518A (zh) * | 2018-07-17 | 2018-12-18 | 重庆电子工程职业学院 | 一种用于大型计算机的散热系统 |
| CN112436410A (zh) * | 2020-11-04 | 2021-03-02 | 南京巴斯勒自动化设备有限公司 | 一种机网同源一体化装置 |
| CN113540996A (zh) * | 2021-07-15 | 2021-10-22 | 傅金荣 | 一种水电站水力散热配电柜 |
-
2001
- 2001-06-15 JP JP2001181018A patent/JP2002374086A/ja active Pending
Cited By (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1448040A3 (en) * | 2003-02-14 | 2006-04-26 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
| US7318322B2 (en) | 2003-02-14 | 2008-01-15 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
| US7559209B2 (en) | 2003-03-07 | 2009-07-14 | Rittal Gmbh & Co. Kg | Liquid cooling system |
| WO2004080132A3 (de) * | 2003-03-07 | 2004-11-04 | Rittal Gmbh & Co Kg | Flüssigkeits-kühlsystem |
| CN100343783C (zh) * | 2003-03-07 | 2007-10-17 | 利塔尔两合公司 | 液体冷却系统 |
| WO2004082088A1 (de) * | 2003-03-11 | 2004-09-23 | Rittal Gmbh & Co. Kg | Kühlmittelführungselement und kühlmittelführungseinrichtung |
| US7635020B2 (en) | 2003-03-11 | 2009-12-22 | Rittal Gmbh & Co. Kg | Coolant guiding element and coolant guiding device |
| EP1524888A2 (en) | 2003-10-17 | 2005-04-20 | Hitachi, Ltd. | Cooling device and electronic apparatus building in the same |
| DE102004008461A1 (de) * | 2004-02-17 | 2005-10-06 | Rittal Gmbh & Co. Kg | Gehäuseanordnung |
| US7466549B2 (en) | 2004-02-17 | 2008-12-16 | Rittal Gmbh & Co. Kg | Cooling arrangement for server blades |
| DE102004013312A1 (de) * | 2004-03-17 | 2005-10-13 | Rittal Gmbh & Co. Kg | Vorrichtung zum Kühlen von in einem Baugruppenträger oder Aufnahmegehäuse übereinander angeordneten Steckeinschüben |
| US7408775B2 (en) * | 2004-10-19 | 2008-08-05 | Honeywell International Inc. | Electrical module and support therefor with integrated cooling |
| US7286351B2 (en) | 2005-05-06 | 2007-10-23 | International Business Machines Corporation | Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system |
| JP2008161005A (ja) * | 2006-12-26 | 2008-07-10 | Toshiba Mitsubishi-Electric Industrial System Corp | 電力変換装置 |
| US8853872B2 (en) * | 2007-02-26 | 2014-10-07 | Google Inc. | Water-based data center |
| US8004839B2 (en) | 2007-03-22 | 2011-08-23 | Fujitsu Limited | Cooling system for information device |
| US8611087B2 (en) | 2007-03-22 | 2013-12-17 | Fujitsu Limited | Cooling system for information device |
| US7826217B2 (en) | 2007-12-14 | 2010-11-02 | Hitachi, Ltd. | Cooling device and electronic apparatus using the same |
| US7692924B2 (en) | 2008-03-03 | 2010-04-06 | Nabtesco Corporation | Rack for housing a liquid-cooled electric unit |
| JP2013038448A (ja) * | 2008-03-03 | 2013-02-21 | Nabtesco Corp | 液冷式電子ユニットを収納するラック |
| WO2009110412A1 (ja) * | 2008-03-03 | 2009-09-11 | ナブテスコ株式会社 | 液冷式電子ユニットを収納するラック |
| JPWO2009110412A1 (ja) * | 2008-03-03 | 2011-07-14 | ナブテスコ株式会社 | 液冷式電子ユニットを収納するラック |
| JP2010072993A (ja) * | 2008-09-19 | 2010-04-02 | Internatl Business Mach Corp <Ibm> | 水冷媒圧縮システムを用いた電子装置ラックの冷却を促進するための装置および方法 |
| US8164902B2 (en) | 2008-09-24 | 2012-04-24 | Hitachi, Ltd. | Electronic apparatus |
| US7961475B2 (en) | 2008-10-23 | 2011-06-14 | International Business Machines Corporation | Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
| US7983040B2 (en) | 2008-10-23 | 2011-07-19 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
| US8203842B2 (en) | 2008-10-23 | 2012-06-19 | International Business Machines Corporation | Open flow cold plate for immersion-cooled electronic packages |
| JP2010257431A (ja) * | 2009-04-28 | 2010-11-11 | Fuji Furukawa Engineering & Construction Co Ltd | 通信・情報処理用電子機器室等の冷却システム |
| JP2011018220A (ja) * | 2009-07-09 | 2011-01-27 | Takenaka Komuten Co Ltd | データセンターユニット及びデータセンター |
| US8345425B2 (en) | 2009-08-28 | 2013-01-01 | Hitachi, Ltd. | Cooling system and electronic apparatus applying the same therein |
| US8120916B2 (en) | 2009-09-17 | 2012-02-21 | International Business Machines Corporation | Facilitating cooling of an electronics rack employing water vapor compression system |
| US8184436B2 (en) | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
| US8345423B2 (en) | 2010-06-29 | 2013-01-01 | International Business Machines Corporation | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems |
| US8351206B2 (en) | 2010-06-29 | 2013-01-08 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit |
| US8369091B2 (en) | 2010-06-29 | 2013-02-05 | International Business Machines Corporation | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
| US8179677B2 (en) | 2010-06-29 | 2012-05-15 | International Business Machines Corporation | Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
| KR100997045B1 (ko) | 2010-10-13 | 2010-11-29 | 에스피산업기술주식회사 | 서버랙 |
| JP2012099637A (ja) * | 2010-11-02 | 2012-05-24 | Kawamura Electric Inc | 冷却水配管機構を備えたサーバーラック |
| JP2012181714A (ja) * | 2011-03-02 | 2012-09-20 | Fujitsu Ltd | 冷却システム及び情報処理装置 |
| JP2013008888A (ja) * | 2011-06-27 | 2013-01-10 | Ntt Facilities Inc | サーバラック冷却装置 |
| JP2013065227A (ja) * | 2011-09-20 | 2013-04-11 | Hitachi Ltd | サーバラックの冷却システム及びサーバ機器 |
| WO2013179449A1 (ja) * | 2012-05-31 | 2013-12-05 | 富士通株式会社 | ラック型情報処理装置 |
| US20150077930A1 (en) * | 2012-05-31 | 2015-03-19 | Fujitsu Limited | Data processing rack unit |
| JP2016512638A (ja) * | 2013-03-14 | 2016-04-28 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 支持部材 |
| KR101533005B1 (ko) * | 2013-12-11 | 2015-07-02 | (주)한경아이넷 | 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치 |
| WO2015088186A1 (ko) * | 2013-12-11 | 2015-06-18 | 주식회사 한경아이넷 | 플렉서블 덕트를 구비한 서버랙의 냉방 제어 장치 |
| WO2015143819A1 (zh) * | 2014-03-28 | 2015-10-01 | 中兴通讯股份有限公司 | 液冷散热服务器 |
| WO2016127706A1 (zh) * | 2015-02-10 | 2016-08-18 | 中兴通讯股份有限公司 | 一种散热插箱 |
| US10185375B2 (en) | 2015-02-13 | 2019-01-22 | Hewlett Packard Enterprise Development Lp | Thermal bus bar |
| WO2016130153A1 (en) * | 2015-02-13 | 2016-08-18 | Hewlett Packard Enterprise Development Lp | Thermal bus bar |
| TWI578890B (zh) * | 2015-02-13 | 2017-04-11 | 慧與發展有限責任合夥企業 | 熱匯流排 |
| WO2017049998A1 (zh) * | 2015-09-25 | 2017-03-30 | 顾玉奎 | 一种太阳能供电且可局部冷却的电气柜 |
| WO2017109996A1 (ja) * | 2015-12-25 | 2017-06-29 | 株式会社日立製作所 | 電子機器ラック及び電子機器ラックを具備する装置 |
| JPWO2017109996A1 (ja) * | 2015-12-25 | 2018-03-29 | 株式会社日立製作所 | 電子機器ラック及び電子機器ラックを具備する装置 |
| CN108591088A (zh) * | 2018-03-30 | 2018-09-28 | 郑州蓝奇盾网络科技有限公司 | 一种计算机主体排风扇 |
| CN109041518A (zh) * | 2018-07-17 | 2018-12-18 | 重庆电子工程职业学院 | 一种用于大型计算机的散热系统 |
| KR101929284B1 (ko) | 2018-07-19 | 2018-12-14 | 한화시스템 주식회사 | 적층형 통신전자장비의 냉각장치 |
| CN112436410A (zh) * | 2020-11-04 | 2021-03-02 | 南京巴斯勒自动化设备有限公司 | 一种机网同源一体化装置 |
| CN113540996A (zh) * | 2021-07-15 | 2021-10-22 | 傅金荣 | 一种水电站水力散热配电柜 |
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