JP2002374053A - Method and apparatus for formation of pattern onto panel substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for the formation of a pattern onto a panel substrate, where a process is simple and a fine pattern is formed with satisfactory accuracy. SOLUTION: The method of forming the pattern onto the panel substrate 3 uses a method, comprising a process (a) in which a developer is electrostatically charged, a process (b) in which electrostatic force is made to act on the electrostatically charged developer so as to be spouted from a nozzle 4, a process (c) in which a reverse pattern is formed of the spouted developer, a process (d) in which the reverse pattern is fixed to the panel substrate 3, a process (e) in which a film is formed from its upper part and a process (f) in which the reverse pattern is removed for forming an original pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is capable of forming a desired pattern at low cost on a base material constituting a large panel such as a PDP (plasma display) panel, a liquid crystal panel, a circuit board or a solar cell. The present invention relates to a method and an apparatus for forming a pattern on a panel base material, which can form a fine pattern with high accuracy.

[0002]

2. Description of the Related Art A PDP device is much thinner than a CRT type image display device and has a flat image display surface, and is therefore useful for a so-called wall-mounted large-size image display device. ing.

The image display mechanism of the PDP forms a fine cell structure between a pair of transparent glass plates, generates a plasma discharge in the cell structure, and emits light from a phosphor layer formed in the cell structure. Light is transmitted through a transparent glass plate and emitted to the outside. A large number of transparent linear electrodes intersecting each other are formed on the pair of glass plates, and plasma emission is performed at the intersections of these linear electrodes to form a luminescent image having an arbitrary pattern. it can. By arranging the phosphor layers corresponding to the three primary colors of RGB, a color image can be displayed. On the glass panel on the front side, a transparent conductive film 300 μm width 100
There are 1,400 patterns with a thickness of 0 Å,
A silver electrode having a width of 100 μm and a thickness of 5 μm was formed on the film. The voltage of the silver electrode is spread by the transparent conductive film, and a discharge is caused between the silver electrode and the electrode on the back plate. As a result, light is emitted from the transparent conductive film to the outside, and an image can be viewed.

[0004]

The above-mentioned transparent conductive film is formed on the surface of the glass plate constituting the PDP panel by depositing the transparent conductive film, that is, the oxide film of tin and indium, on the entire glass surface. (ITO film) was formed, processed and patterned by laser. However, in this case, processing by the laser takes time, and the productivity is not improved. Further, the handling of the laser is difficult, and the light source needs to be replaced frequently. There is also a method of applying a resist to the ITO film and removing the resist after the completion of the etching. However, there is a problem that the number of steps is large and the cost is high.

[0005] Even if a method of producing a transparent conductive film by a printing method using a paste can be realized, it is difficult in consideration of printing accuracy, plate elongation, maintenance, and the like.

[0006] In the case of screen printing, the pattern is stretched and the positional accuracy of the pattern cannot be ensured. In addition, the cost of the plate is high at hundreds of thousands of yen, and it is necessary to frequently exchange every tens of plates.
In addition, it is necessary to remove the paste adhered to the back surface of the plate, and it is necessary to have trouble and skill in handling.

Accordingly, an object of the present invention is to simplify the process,
Further, it is an object of the present invention to provide a method and an apparatus for forming a pattern on a panel base material, which have high precision in forming a fine pattern.

[0008]

In order to achieve the above object, the present invention is configured as follows.

According to a first aspect of the present invention, there is provided a method for forming a pattern on a surface of a panel substrate, comprising the steps of: charging a developer; and applying electrostatic force to the charged developer to form a pattern from a nozzle. A step of spraying the panel base material, a step of forming a pattern opposite to a pattern to be formed on the panel base material with the sprayed developer, and a step of forming a film on the panel base material. And forming a pattern to be formed by removing the reverse pattern.

According to a second aspect of the present invention, when the reverse pattern is removed, the developer is either chemically or physically removed, or the developer is evaporated by heat. A method for forming a pattern on a panel substrate according to one embodiment is provided.

According to a third aspect of the present invention, the resin as a component of the developer is a water-soluble resin, and when the reverse pattern is removed, the developer constituting the reverse pattern is removed by washing with water. 3. A method for forming a pattern on a panel base material according to item 1.

According to a fourth aspect of the present invention, there is provided a method for physically removing the reverse pattern, wherein the needle is used to scrape off the developer constituting the reverse pattern. A method for forming a pattern is provided.

[0013] According to a fifth aspect of the present invention, there is provided any one of the first to fourth aspects, wherein the panel base material is any one of a plasma display panel, a liquid crystal panel, a circuit board, and a solar cell. And a method for forming a pattern on the panel base material.

[0014] According to a sixth aspect of the present invention, the pattern formed on the panel substrate is a pattern of a transparent conductive film of a plasma display panel according to any one of the first to fourth aspects. And a method for forming a pattern on the panel base material.

According to a seventh aspect of the present invention, there is provided an apparatus for forming a pattern on a surface of a panel substrate, comprising: a charging device for charging a developer; and a nozzle for applying an electrostatic force to the charged developer. An ejecting device for ejecting the ejected developer onto the panel substrate, a fixing device for fixing the ejected developer onto the panel substrate, a film forming device for forming a film on the panel substrate, and And a reverse pattern removing device for removing a developer and forming a pattern to be formed.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings.

As shown in FIG. 1, a method and an apparatus for forming a pattern on a panel base material according to an embodiment of the present invention use a transparent conductive film (for example, an indium tin oxide (ITO) film) for a PDP panel. A method for forming the film on the surface of the substrate will be described. It includes the following six steps (a) to (f).

Step (a): a step of charging the developer 1 with the blade 7 of the particle supply member (developer supply member) 2 (see FIG. 3).

Step (b): a step of applying an electrostatic force generated between the nozzle 4 and the panel substrate 3 to the charged developer 1 to eject the charged developer 1 from the hole 4b of the nozzle 4. (See FIG. 3).

Step (c): A step of forming a desired pattern (a pattern opposite to a pattern to be formed) by the ejected developer 1 (see FIGS. 1 and 3).

Step (d): a step of fixing the reverse pattern on the panel substrate 3. At this time, the reverse pattern may be formed directly on the panel base material 3 and fixed. However, once formed on the intermediate member 12, this is transferred onto the panel base material 3 and fixed. (See FIG. 4).

Step (e): a step of forming a transparent conductive film 20 on the reverse pattern. As the transparent conductive film 20, various kinds of film formation using a liquid and the like are used even in vacuum deposition, CVD, or the like (see FIG. 1).

Step (f): A step of forming the original pattern to be formed by chemically or physically removing the developer 1 constituting the reverse pattern (see FIG. 1).
In order to remove the developer 1 constituting the reverse pattern,
A laser or a needle is used.

First, the entire process will be described with reference to FIG. FIG. 1A is a diagram in which the developer 1 is ejected from a nozzle 4 to a panel base material 3 by using an electrostatic force and patterned in an inverse pattern. In FIG. 1B, a transparent conductive film 20 is formed thereon. FIG. 1 (c)
After that, the developer 1 constituting the reverse pattern from above
Is a method of forming an original pattern to be formed by removing the remaining portions.

First, the steps (a) to (d) will be described.

FIGS. 2 and 3 show an apparatus for forming a pattern on the panel substrate 3 according to the embodiment of the present invention.

The pattern forming apparatus includes a particle supply member 2 for carrying and transporting the developer 1 and a nozzle 4 disposed between the particle supply member 2 and the panel substrate 3. Although the roller-shaped particle supply member 2 is illustrated in FIG. 3, the particle supply member 2 is not limited to this, and for example, a belt-shaped particle supply member may be used.

The panel substrate 3 is, for example, a glass plate.

The nozzle 4 is housed in a case 4a and is constituted by an FPC (flexible printed circuit) 4c having a through hole 4b through which the developer 1 passes. A particle supply roller (developer supply roller) 6 is provided in the hopper 5 that stores the developer 1, and the developer 1 in the hopper 5 is sent to the particle supply member 2 by rotating. The developer 1 sent to and supported by the particle supply member 2 is
Although superposed on the peripheral surface of the particle supply member 2, it is rubbed by a blade 7 functioning as an example of a charging device, is negatively charged, and is regulated in thickness by one to three layers. The developer 1 arriving at the position of the nozzle 4 functioning as an example of the ejection device is ejected from the particle supply member 2 to the surface of the panel substrate 3 by voltage control by the control electrode 4d arranged on the particle supply member 2 side. You.

The (FPC) nozzle 4 is composed of five layers, the central layer is a polyimide sheet having a thickness of 100 μm, there are electrode layers above and below, a surface thereof is covered with an insulating layer, and a semiconductive film is formed on the surface of the upper surface. Is covering. One of the reasons for covering with a semiconductive film, in other words, a semi-insulating film is to prevent the nozzle 4 from being charged due to generation of static electricity.
The through hole 4b is circular, but may be rectangular or elliptical. The size of the hole 4b is set to about 40 to 120 μm. Excimer laser and press working, Y
Hole processing can be performed with an AG laser, a CO ₂ laser, or the like.

As an example, the nozzle FPC4c is provided with a copper electrode above and below a polyimide sheet having a thickness of 100 μm.
The deflection and extraction electrodes may be formed by forming a reverse pattern by a photo-forming method and forming a conductive film on the surface thereof. This film is provided so that static electricity does not accumulate in the nozzle FPC 4c. As an example, a hole having a hole diameter of 80 μmΦ and a hole number of 10 can be used. The interval between the holes 4b is adjusted to a line interval of 300 μm, which does not require an ITO film.

In addition to those described above, metal sheets,
A perforated thin plate, ceramic sheet, or the like may be used.

As an example, the panel substrate 3 is applied with a potential of about +1500 V with respect to the particle supply member 2.
When the control electrode 4 d is not ejected, a potential of −100 to −200 V is applied to the particle supply member 2 as an example. At the time of ejection, the voltage is set to +300 V as an example, and the negative developer 1 is ejected to the panel base material 3 by electrostatic force.

The developer 1 may be positively charged, and the applied potential may be set to the opposite polarity.

Charger 2 for charging panel substrate 3
As 1, for example, there is a method of charging from the front side of the panel base material 3 such as a corona charger or a contact charger, and a back side such as a voltage generator 120 for applying a voltage from the back side of the panel base material 3. There is also a side charging system.

Around the nozzle hole 4b, in addition to the control electrode 4d for turning on and off the ejection of the developer 1, a deflecting electrode 4e is also embedded in the panel substrate 3, so that the developer 1 is deflected. The ejection angle can be adjusted by the function of the electrode 4e. The deflecting electrode 4e having such a function is usually provided at a position around the nozzle hole 4b and opposed to the control electrode 4d, and deflects the jet flow of the developer 1 in one direction in the front-back direction or the left-right direction. As an example, as shown in FIGS. 2 and 3, when a PDP panel is used as an example of the panel base material 3 and a PDP electrode is formed by the above pattern forming apparatus, an electrode at an end of the panel base material 3 is used. The convergence portion can be formed by bending the developer 1 by the convergence electrode of the nozzle 4, in other words, by the deflection electrode 4e. However, in addition to such a deflection control electrode, a ring-shaped deflection electrode for concentrating and narrowing the jet flow of the developer 1 may be used.

Although not specifically shown, the nozzle 4
The distance between the holes 4b is adjusted to the distance between the electrodes which is the reverse pattern to be formed.

Further, the nozzle may not be provided with such an electrode. In this case, since the discharge is performed from all the existing holes, it is not possible to control each hole.

The panel substrate 3 is placed on the XY table 8 and its installation position is changed to the front, rear, left and right by the function of the XY table 8 being movable in the X direction and the Y direction orthogonal to the X direction. It is supposed to be. XY
The holding device for the panel base material 3 such as the table 8 detects the position of the panel base material 3 at a corner portion or the like of the panel base material with a marker or the like provided in a previous process using a camera such as a CCD and the like. If it is deviated from the position, the position is shifted and aligned.

(Developing device) The regulating blade 7 is formed on a metal sheet, for example, with a hardness of 40 to 80 (JISK6301,
An elastic material such as urethane made of A) can be attached and used. The developer 1 is frictionally charged between the blade 7 and the particle supply roller 6, and the developer 1 is negatively charged. In the above embodiment, the developer 1 is negatively charged. However, the developer 1 and a material of frictional charging may be selected so as to be positively charged.

The number of layers of the developer 1 on the particle supply roller 6 by the blade 7 is one to three. Normally, the regulating blade 7 is grounded to the ground. However, in order to charge the developer 1 strongly, a DC or AC voltage is applied to the regulating blade 7.

The particle supply roller 6 is made of, for example, stainless steel (SUS), aluminum, iron, or an alloy thereof, is polished, and has a diameter of 16 mm and an unevenness of 2 μm or less. As a specific example of the particle supply roller 6, a metal rod in which foamable urethane or synthetic rubber is covered with a thickness of 2 to 6 mm can be used. The biting of the particle supply roller 6 into the developing roller 2 can be set to about 0.1 to 2 mm.

In the application control, for example, +300 V is applied to the control electrode 4d in accordance with an instruction from the personal computer 9c to apply the control electrode 4d to the panel base material 3. When not applying, -100 V is applied as an example to prevent unnecessary developer from dropping on the panel base material 3.

(Control) At the time of coating, as an example, a negative voltage of -100 V is applied to the deflection electrode 4e to direct the width of the coating so that an electrode line of 70 μm can be drawn. When drawing without applying -100V, the line width of the drawing pattern is widened, or the developer 1 is scattered around. By applying twice, a thickness of 20 μm can be secured. The application speed can be 10 cm / sec.

As an example, a voltage of 5000 V can be applied to the XY table 8 below the panel base material 3 to apply the voltage. At this time, since the thickness of the panel was 3 mm, the voltage dropped, and the panel surface was approximately 100 mm.
It becomes 0V.

(Operation) First, the panel substrate 3 is roughly set on the XY table 8. The position recognition unit 9a and the laser displacement meter 9b are set so that the markers existing at the end of the panel base material 3 can be seen evenly. The panel base material 3 is vacuum-sucked on the XY table 8. The XY table 8 has its surface irregularities suppressed to ± 5 μm or less as an example.

The surface irregularities of the panel substrate 3 are ± 1 as an example.
0 μm or less. When the panel substrate 3 is set, X
The Y table 8 moves toward the nozzle 4 along the rail 8A by driving a built-in motor or the like. At this time, the position and thickness of the surface of the panel substrate 3 are detected by the laser displacement meter 9b, information is transmitted to the personal computer 9c, and the position of the nozzle 4 is moved up and down. When the movement of the panel base material 3 proceeds and comes below the nozzle 4, a voltage is applied to the control electrode 4d from the personal computer 9c so that the developer 1 is applied, and the developer 1 is applied to the panel base material 3. Let it. When the voltage reaches the end of the panel substrate 3, the voltage changes from + 300V to -100V as an example, and the application is stopped. Thereafter, the nozzle 4 is moved along the rail 10b, and performs drawing similarly. By repeating this, a reverse pattern of the electrode pattern is formed on the entire panel substrate 3.

(Panel Substrate) The glass panel 3 as an example of the panel substrate 3 has a thickness of 2.8 mm, 42 inches,
The size is 700 mm × 500 mm.

The thickness unevenness of the glass panel 3 is ± 5 μm. About 1000 Å of a transparent conductive film is deposited on the surface. When the glass panel 3 is set on the XY table 8, the surface irregularities are closely attached by vacuum suction, and the irregularities can be set to ± 5 μm or less.

(Intermediate Sheet) By appropriately adjusting the ejection angle of the developer 1 and changing the position of the panel substrate 3, the developer 1 ejected from the nozzle 4 can have a desired pattern (the pattern to be formed). Reverse pattern) (not shown)
Can be formed. Such an inverse pattern is usually formed directly on the surface of the panel substrate 3, but as described later, is formed on the intermediate member 12, and is then transferred from the intermediate member to the panel substrate 3. May be transferred. When such an intermediate member 12 is used, it is needless to say that the intermediate member 12 is charged to form a jet of the developer 1.

As described above, the reverse pattern formed directly on the surface of the panel substrate 3 or transferred from the intermediate member 12 indicates the energy required when the jet flow of the developer 1 collides with the surface of the panel substrate 3. Or the pressing force during transfer,
Temporarily fixed (fixed) stably on panel substrate 3
However, in order to increase the temporary fixing force, a pressing force may be separately applied to the developer 1 by a pressing device, which functions as an example of a fixing device, and the developer 1 is heated by a fusing device.
The adhesion may be enhanced by melting the resin component.

If the developer 1 colliding with the surface of the panel substrate 3 or the intermediate member 12 does not have a strong adhesive force or adhesive force, the developer 1 may have spots outside the reverse pattern forming region due to the recoil of the collision. Splatters on. In order to prevent this, other disturbing forces apply oil, an adhesive, or a solvent to the reverse pattern forming surface of the panel substrate 3 or the intermediate member 12 to form an adhesive layer, and the like. It is preferable to prevent the developer 1 from being scattered by absorbing the collision energy of the developer or increasing the adhesive force to the panel base material 3.

(Apparatus) In FIG. 2, reference numeral 9a denotes an opposite end of the panel base 3 so as to recognize a position of the panel base 3 (for example, a pair of markers present at opposite ends of the panel base 3). A pair of position recognition units are disposed opposite to each other, 9b is a laser displacement meter for measuring the thickness of the panel substrate 3, and 9c is a personal computer as an example of a control panel. The recognition unit 9a and the laser displacement meter 9b
A known optical sensor using the reflection of light from a laser diode may be used. These measurement devices use a laser method or the like. The distance between the nozzle 4 and the panel base material 3 greatly affects the accuracy of an image to be drawn. If the distance is large, the width of a drawn line becomes large. When drawing a line or the like, 0. It is preferably set to 1 mm or less. When inverse pattern accuracy is required, the distance needs to be 0.050 mm or less. The panel base 3 is placed on the XY table so that the pair of markers present at the opposite ends of the panel base 3 can be seen evenly by the pair of position recognition detection units 9a, 9a arranged diagonally on the panel base 3. 8 can be set.

(Nozzle) The nozzle case 4a accommodating the charge supply member 2 and the particle supply roller 6 is provided with a vertical rail 10a.
Is attached to the horizontal rail 10b via
It is possible to move left, right, up and down. By taking this movement into account, the reverse pattern formation by the developer 1 ejected from the nozzles 4 becomes even finer. A reverse pattern can be formed on the entire panel substrate 3. A three-axis robot or a three-axis manipulator may be used. In addition, each rail 10a, 10
As the power for moving b, an up-down drive device and a left-right drive device such as a stepping motor and a servo motor provided in the nozzle 4 are used. Alternatively, an air cylinder, a hydraulic cylinder, or the like can be used. X
The Y table 8 is driven by a motor or the like built in the base of the pattern forming apparatus to drive the ball screw 8 for moving the base material.
A is rotated so that the XY table 8 connected to the nut member screwed to the ball screw 8A is
The glass panel 3 is moved by moving along B.

(Control) The control of the movement of the nozzle 4, the control of the movement of the panel base material 3, and the control of ON / OFF of the developer 1 are all examples of a control panel connected to the control unit of each drive device. Is controlled by the personal computer 9c. The personal computer 9c includes a CPU, a ROM,
A signal is sent from the personal computer 9c to a control unit of each drive device, for example, a driver circuit or an electric circuit that drives each motor, and drives and controls each motor.

(Developer) Developer 1 used in the above embodiment
The material and structure may be any as long as they are fixed on the panel base material 3 by fixing or baking, and about 95% is a resin material as an example. Others are charge adjusting materials and external additives.
As the developer resin, polyethylene, polypropylene,
Polyvinyl chloride, styrene, ethylene-vinyl acetate copolymer, polyester, polystyrene, methyl cellulose, ethyl cellulose, nitrocellulose, cellulose acetate, cellulose propionate, cellulose resin such as cellulose butyrate, or methyl methacrylate, ethyl methacrylate, Examples thereof include thermoplastic resins such as methacrylic resins such as normal butyl methacrylate, isobutyl methacrylate, and isopropyl methacrylate.

As the developer 1, for example, a developer composed of 97% by weight of a polyethylene resin, 1.5% by weight of a charge control agent, and 1.5% by weight of an external additive can be prepared.

The property adjusting material adjusts the particles so as to have a negative charge, and an azo dye can be used. The chromium complex or the metal salt of salicylic acid can also be used.

In this example, the negative developer 1 is used. However, the positive developer 1 may be used to control the positive developer 1.

Fine particles having a diameter of about 0.1 μm such as colloidal silica, titanium oxide, and alumina as external additives can be attached to the surface of the developer 1. The reason for using these particles is to improve the fluidity of the developer 1 and to increase the charge amount of the developer 1. The charge amount of the developer 1 is
Since it is not stable due to changes in humidity and temperature, the conductivity is very high and the charge amount is not stable.

Therefore, in order to forcibly charge the particle supply roller 6, a charger using corona discharge may be provided. Usually, a corona charger that charges the surface of the photoreceptor can be used. A 50 μm diameter tungsten wire is stretched, and three directions around it are shielded by metal. In one direction, a mesh-like sheet is stretched. When a voltage of about 5 kV is applied to the wire, a corona discharge is generated, and the discharge is transmitted to the developer 1 across the net and charged. In this case, the wire is negatively charged, so that a negative voltage is applied to the wire. However, if the charger is too close to the developer 1, the developer 1 is melted by the discharge, and the developer 1
Adheres to the surface and cannot be applied. The distance is 5mm
It is good to be separated to the extent, preferably 10 mm or more.

Here, if a resin soluble in water is used, when the developer 1 on which the reverse pattern is formed is removed, water washing can be used, and the cost of the solvent can be reduced. Further, waste liquid treatment is simplified. Therefore, here, a water washing device that functions as an example of the reverse pattern removing device can be used.

(Developer Production Method) The average particle diameter of the developer 1 can be set to 6 μm as an example. The size may be further reduced, but the control is difficult, so the limit is 1 μm. The production method is such that a polyethylene resin is heated to 300 ° C., melted, mixed with silver particles and a charge control material, sufficiently stirred with a propeller-shaped stirrer, and uniformly dispersed. Quick freeze in the freezer and harden. The lump is crushed into several mm squares by a hammer mill and a cutter mill, and further crushed by a pulverizing machine mill.
Crushed to 5 to 15 μm, coarse powder with a particle size of 20 μm or more and particle size 5
Classification to remove the fine powder of μm or less to obtain the particle body,
Fine particles such as colloidal silica, titanium oxide, and alumina can be adhered to the surface of the particle body using a high-speed fluidizing mixer. In particular, in the case of a developer having a small particle size, 5 μm
The cut product of m or less is further classified.

The developer 1 is prepared, for example, by melt-kneading the above-mentioned materials, rolling and cooling the same, and using a hammer mill or a cutter mill to produce several mm
Crushed into corners, further crushed with a crushing machine mill to 5 to 15 μm,
Classification is performed by removing coarse powder having a particle size of 20 μm or more and fine powder having a particle size of 5 μm or less, and a particle body is obtained. Using a high-speed fluidizing mixer, the surface of the particle body is made of colloidal silica, titanium oxide, alumina or the like. Fine particles can be attached. Further, the spheroidizing treatment may be performed by spraying in a high-temperature hot air flow.

The developer 1 can also be obtained by a microcapsule method, a polymerization method, a spray drying method, or the like.

(Pattern of Multiple Times) In the pattern forming method according to the above embodiment, the above steps (a) to (d) are repeated to form a plurality of reverse patterns on the surface of the panel substrate 3 and then the fixing step After performing (d) or repeating steps (a) to (step d) to form a plurality of reverse patterns on the surface of the panel substrate 3, a film forming step (e) and a removing step (f) Can also be performed. The plurality of reverse patterns means, for example, that after forming a reverse pattern of a straight line on the panel base material 3, a straight line perpendicular to the line is formed, a grid is formed, and then the transparent pattern is formed. The conductive film 20 is formed, and then the developer 1 constituting the reverse pattern is removed, whereby the transparent conductive film 20 in the shape of a grid can be manufactured.

(Endless Sheet) In the pattern forming method of the above embodiment, in the step (c), as shown in FIG. 4, the surface of the intermediate member 12 composed of the rotating endless sheet is once exposed to the ejected developer 1. After the reverse pattern is formed, the reverse pattern on the intermediate member 12 can be transferred to the surface of the panel substrate 3. This intermediate member 1
Reference numeral 2 may be one sheet instead of the endless sheet. The intermediate member 12 is formed of a film in which a conductive filler is dispersed in a resin, and has a resistance of about 10 ⁸ Ωcm. The application to the intermediate member 12 is performed by applying a voltage to the back of the intermediate member 12 as described above. Further, other than the sheet, a drum shape or the like may be used. The image is transferred from the intermediate member 12 to the panel base material 3 by pressing it down with pressure.

It is preferable that the intermediate member 12 is cleaned after the reverse pattern transfer so that the intermediate member 12 can be used repeatedly. The thickness of the intermediate member 12 is not particularly limited, but is preferably 0.3 mm or less.

(Cleaning) The above-described embodiment may further include a step of removing the developer 1 clogging the nozzle 4 or adhering around the inside of the nozzle 4. This can be performed, for example, by sucking the developer 1 with the vacuum suction nozzle 13 as shown in FIG. For removal, besides the method using such airflow,
There is a method using vibration using ultrasonic waves or the like, and these methods may be performed together. This particle removal operation is preferably performed periodically except when the reverse pattern is formed. Cleaning should be performed periodically. It may be performed at the time of panel exchange or once for each line drawing.

In the above embodiment, the particle supply member 2
As shown in FIG. 6, is disposed above the inside of the nozzle 4 and has an inclined surface 2a along its lower peripheral surface, and the lower end of the inclined surface 2a faces the hole 4b of the nozzle 4. You can also. If the flat portion is eliminated around the nozzle hole 4b in this way, the nozzle hole is less likely to be clogged.

(Vacuum Attachment) In the above embodiment, if the panel base material 3 is held on a flat surface, and if the flat surface is designed to suck the panel base material 3 under vacuum, it is assumed that the panel base material 3 Even if it is thin and easily undulates and warps, these can be eliminated by vacuum suction, and the distance between the panel substrate 3 and the nozzle 4 can be made constant.

If the thickness of the panel substrate 3 is constantly measured by the laser displacement meter 9b shown in FIG. 2, the nozzle case 4a is moved up and down based on the detection information obtained from this, and the nozzle 4 and the panel Since the interval between the base materials 3 can be adjusted, some undulation and warpage of the panel base material 3 can be eliminated.

(Environment) In carrying out the above embodiment, the inside of the hopper 5, the periphery of the particle supply member 2, the nozzle hole 4
It is preferable to keep the ambient temperature and humidity near b, etc., to keep the charged state and the ejection state of the developer 1 constant.

After forming the reverse pattern, it is preferable to remove the electric charge from the reverse pattern forming surface of the panel base material 3 or the intermediate member 12 as soon as possible. And nozzle case 4
a, and apply the electrostatic current or the air current to the panel substrate 3 or the reverse pattern forming surface of the intermediate member 12 such that the flow is directed from the inside of the nozzle case 4a to the outside of the nozzle case 4a. Is good. As a device to be used, a static eliminator or the like can also be used.

(Hole Shape) In the above embodiment, as shown in FIG. 7, the nozzle holes 4b can be tapered holes that are wider on the particle supply member 2 side and narrow on the panel substrate 3 side. By doing so, the hole diameter can be reasonably reduced without forcibly reducing the diameter of the nozzle hole 4b.

In the above embodiment, the distance between the nozzle 4 and the panel substrate 3 is 0.1
It is preferable to keep the thickness to about 50 ± 0.025 μm, but in order to realize this easily, it is preferable to support the nozzle FPC 4 c having the nozzle hole 4 b of the developer 1 in a tensioned state. Further, it is preferable to use a nozzle 4 made of a metal or a ceramic material.
When the distance is close to 50 ± 0.025 μm, patterning can be performed with higher accuracy.

(Surface Treatment) The developer 1 is scattered on the surface of the panel substrate 3 by applying an adhesive solvent such as polyvinyl alcohol or turpentine oil to the surface of the panel substrate 3 to form an adhesive layer. That can prevent it. As a coating method, a spray method, a dipping method, a spin coating method, or the like can be used.

First, the steps (e) to (f) will be described.

The step (e) is a step of forming the transparent conductive film 20 on the reverse pattern. The formation of the transparent conductive film 20 can be performed by vapor deposition in a vacuum, printing using a paste, etc. May be used for various film forming methods. In the case of the transparent conductive film 20, an evaporation method can be used. In this method, a target in a vacuum is evaporated by heating with a heater, the evaporated particles are blown off, and evaporation is performed on a substrate. Often used to form electrodes of gold or aluminum.

In the above embodiment, the film forming apparatus having the structure shown in FIG. 8 is used to form the transparent conductive film 20. An electron beam 45 having an energy of about 10 keV is scattered by a magnetic instrument 46 from an electron gun 42 to a target 43.
Then, only the target 43 is directly heated to form vapor deposition particles, and vapor deposition is performed. The target 43 is placed in a hearth made of carbon or alumina at the center of a water-cooled crucible 44 made of copper. This electron beam heating vapor deposition is suitable for vapor deposition of the target 43 having a high melting point. As the target 43 used, an alloy of tin oxide and indium oxide can be used. Purity is 99%, with few impurities.

The produced transparent conductive film can have a thickness of about 2000 Å. The film thickness can be controlled by keeping the power of the electron beam constant and controlling the time. Since the panel substrate 3 held by the holder 41 is large, when the panel substrate 3 is rotated, a uniform transparent conductive film 20 is formed.

Step (f): In the step of removing the reverse pattern, a chemical or physical method and apparatus can be used. First, a method and an apparatus for dissolving a chemically reverse-patterned developer will be described. Since a polyethylene resin is used as a developer, it can be dissolved with acetone or toluene. Further, the transparent conductive film is not dissolved by acetone or toluene. The panel substrate 3 is immersed in a container containing acetone, and then washed with water to remove the reverse pattern and dried to complete. Ultrasound may be applied to the acetone container to accelerate the melting of the reverse pattern. Further, the solvent may be changed from acetone to xylene, toluene or the like. Alternatively, the solvent may be sprayed on the panel substrate 3 in a spray form to remove the reverse pattern.

However, due to cost and environmental problems, developers such as water-soluble resin, water-soluble cellulose resin, water-soluble acrylic resin, water-soluble styrene-male resin, water-soluble polyurethane resin, water-soluble alkyd resin, It is preferable to use a method in which a reverse pattern is washed away by washing with water, or by ultrasonic washing, spraying, or the like, using a developer mainly composed of a conductive epoxy resin.

In addition to this method and apparatus, there is a method and apparatus for removing the reverse pattern physically using a needle. This is a method and apparatus for physically removing the inverted pattern by scratching it with a hard needle made of tungsten or the like, which will be described with reference to FIG. The grinding unit 31 of the multi-tungsten needle 33 is set to 10 mm on the reverse pattern on the panel base material 3.
Run at / s and remove the reverse pattern. Thereafter, the grinding unit 31 moves to remove the entire reverse pattern of the panel base material 3.

As the needle 33, in addition to the tungsten needle, a carbon steel needle or a ceramic needle, a glass needle,
Alternatively, an acrylic resin needle or the like can be used. This load control is important. In other words, if the load applied to the tool edge is inappropriate, the transparent conductive film 20 may not be sufficiently ground due to scratching (when the load is too small), or conversely, the transparent conductive film to be ground. There is a problem that the film below the film 20 is also damaged (when the load is excessive). In this case, since what is removed is a resin, it is soft and easy to remove. As the apparatus using the grinding unit, the apparatus shown in FIG. 2 used for patterning can be used as it is. That is, the grinding unit 31 is used instead of the nozzle unit 4 in FIG. After positioning the panel base material 3 on the XY table 8, the panel base material 3 is fixed by suctioning with a vacuum pump. Next, the grinding unit 31
Is lowered so as to come into contact with the panel base material 3, and the load is applied to the grinding unit 31 while being controlled by a personal computer 9c as an example of a control panel. Thereafter, the XY table 8 is moved appropriately so as to grind the reverse pattern while the grinding dust generated by the grinding is collected by a dust collector (not shown), thereby forming an original pattern to be formed. It is.

At this time, the width of the obtained groove can be, for example, 20 μm to 100 μm.

The specific scribe situation of each transparent conductive film 20 will be described below.

As an example, when a tool equipped with a diamond blade having a bevel angle of about 120 to 150 ° is used, the tool slides up with a load of 20 to 100 g, and only the reverse pattern is taken, and the lower film or panel is removed. This is the extent to which the substrate 3 is scratched. In the case of a tool having a cemented carbide blade, as an example,
10-100 g can be appropriate. If the load is less than the above range, complete grinding cannot be performed, while
If the load exceeds the above range, the substrate is ground to such an extent that the underlying panel substrate 3 is damaged. As shown in FIG. 9, the needle 33 is set so that a constant pressure is applied by the spring 32. The reverse pattern width is, for example, 100 μm, and the tip of the needle can be 50 μm.

However, in order to remove the reverse pattern with a needle by grinding, it is necessary to use the fine grinding unit 31 as described above. Therefore, as another embodiment, as shown in FIG.
Thick and form the opposite pattern like a squeegee,
The reverse pattern can be scraped off by the flat blade 51. In this case, the distance between the flat blade 51 and the surface of the panel base material 3 is set to be equal to or greater than the film thickness, and the entire upper surface of the panel base material 3 is moved. There is no need to align the flat blade 51 with the reverse pattern of the panel base material 3, which is very simple.

As a third method and apparatus for removing the reverse pattern, the reverse pattern can be evaporated by heat treatment. This is because the resin used for the developer 1 is a thermoplastic resin and evaporates between 400 ° C. and 600 ° C. However, it is a simple method and apparatus. However, a heat treatment cost is required. Further, it can be used only when the material of the underlayer and the material of the transparent conductive film 20 are extinct to the heat. In the production of PDP, a heat treatment at about 600 ° C. is performed, so that ordinary resins can be used.

(Another Application) The above example can be used for forming various reverse patterns. For example, the present invention can be applied to the case of forming a thin film electrode of chromium copper chromium used for a PDP electrode. First, an inverse pattern is formed on the panel base material 3,
Thereafter, a transparent conductive film 20 of chromium-copper-chromium is formed on the entire surface by sputtering, and then the reverse pattern is removed by firing, thereby completing the process.

Further, the present invention can be applied to patterning of electrodes of a solar cell. In an amorphous solar cell, when a transparent conductive film, an amorphous semiconductor film, or a metal electrode film is formed, an inverse pattern is formed according to an original pattern to be formed required for each film, and This is done by filming and removing the reverse pattern. In addition, a pattern can be formed in the same manner as described above even when the panel base material is a sheet.

(Last Step) As an example, a silver electrode, a width of 80 μm,
m and a thickness of 6 μm are formed by a printing, exposing and developing method.
Thereafter, an insulating film is formed on the electrodes and on the front surface of the panel substrate 3 by die coating or the like. For the face plate,
After the MgO film is formed by vapor deposition and completed as a front plate, the completed front plate is completed by combining it with the back plate. The PDP panel is completed by sealing the two panel substrates 3, exhausting, and introducing gas. After that, the TV and the TV are completed by assembling the panel and the accessory members such as the circuit.

According to the method and apparatus for forming a pattern on a panel base material according to the above embodiment, the step (a) of charging the developer 1 with the blade 7 of the particle supply member (developer supply member) 2, Applying electrostatic force generated between the nozzle 4 and the panel substrate 3 to the charged developer 1 to eject the charged developer 1 from the hole 4b of the nozzle 4 (b).
(C) forming a desired pattern (a pattern opposite to a pattern to be formed) with the ejected developer 1;
A step (d) of fixing the reverse pattern on the panel base material 3, a step (e) of forming the transparent conductive film 20 on the reverse pattern, and a step of chemically or developer-forming the reverse pattern. A step (f) of forming an original pattern to be formed by physically removing the pattern is provided. Therefore, large-sized PDP (plasma display) panels, liquid crystal panels, circuit boards, etc. can be used without using laser processing, applying a resist to an ITO film and removing it after etching is completed, or using a printing method using a paste. Since the transparent conductive film 20 having the original pattern to be formed on the panel base material constituting the panel can be formed, and the process for forming the transparent conductive film 20 is simplified, the pattern-formed panel Can be manufactured at low cost, and the transparent conductive film 20 having a fine pattern with high precision can be formed on the panel base material.

It is to be noted that by appropriately combining any of the above-described various embodiments or modifications, the effects of the respective embodiments or modifications can be achieved.

[0096]

According to the method and apparatus for forming a pattern on a panel substrate according to the present invention, laser processing, ITO
Panel base material for large panels such as PDP (plasma display) panels, liquid crystal panels, and circuit boards without using a method of applying a resist on the film and removing it after etching is completed, or a printing method using paste. In addition, the transparent conductive film having the original pattern to be formed can be formed, and the process for forming the transparent conductive film is simplified, so that the patterned panel can be manufactured at low cost. Moreover, it is possible to form a transparent conductive film having a fine pattern with high precision on the panel base material.

[Brief description of the drawings]

FIGS. 1A to 1C are schematic diagrams each showing a process of a pattern forming method according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating a pattern forming apparatus according to the embodiment.

FIG. 3 is an enlarged side sectional view showing a part of the pattern forming apparatus.

FIG. 4 is a diagram illustrating a transfer method using an intermediate member.

FIG. 5 is a diagram illustrating a particle cleaning method.

FIG. 6 is a diagram illustrating a method for preventing nozzle hole clogging.

FIG. 7 is a diagram illustrating a modified example of a nozzle hole.

FIG. 8 is a diagram illustrating film formation by vapor deposition.

FIG. 9 is a diagram illustrating a method of physically scraping a pattern as a modification of the embodiment of the present invention.

FIG. 10 is a diagram illustrating a method of physically scraping a pattern as another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Developer, 2 ... Particle supply member, 3 ... Panel base material, 4 ...
Nozzle, 4a ... Nozzle case, 4b ... Nozzle hole, 4d ...
Control electrode, 4e deflection electrode, 5 hopper, 6 particle supply roller, 8 XY table, 11 firing furnace, 20
Film, 31 grinding unit, 32 spring, 33 needle, 41
... Holder, 42. Electron gun, 43. Substrate material, 44. Crucible, 45. Electron beam, 46. Vacuum device, 51. Flat blade.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01J 9/02 H01J 11/02 B 5G435 11/02 B41J 3/16 D (72) Inventor Hiroyuki Naka Osaka 1006 Kadoma, Kadoma Matsushita Electric Industrial Co., Ltd. MA19 MA35 NA27 5C027 AA03 AA10 5C040 FA10 GC19 JA23 JA40 MA26 5E339 AB05 AB06 BD13 BE11 BE13 CE13 CE19 CF05 5G435 AA17 BB06 BB12 KK05 KK09 KK10

Claims (7)

[Claims] 1. A method for forming a pattern on a surface of a panel base material, comprising: a step of charging a developer; and applying an electrostatic force to the charged developer to eject the developer from a nozzle onto the panel base material. A step of forming a pattern opposite to the pattern to be formed on the panel base material with the ejected developer, a step of forming a film on the panel base material, and forming the pattern by removing the reverse pattern Forming a pattern on the panel base material, the method including a step of forming a pattern. 2. The panel substrate according to claim 1, wherein when the reverse pattern is removed, the developer is chemically or physically removed, or the developer is evaporated by heat. Pattern formation method. 3. The pattern on a panel substrate according to claim 2, wherein the resin as a component of the developer is a water-soluble resin, and the developer constituting the reverse pattern is removed by washing with water when removing the reverse pattern. Forming method. 4. The method of forming a pattern on a panel base material according to claim 2, wherein the method of physically removing the reverse pattern is to scrape the developer constituting the reverse pattern with a needle. 5. The pattern on a panel substrate according to claim 1, wherein the panel substrate is any one of a plasma display panel, a liquid crystal panel, a circuit board, and a solar cell. Forming method. 6. The pattern on a panel substrate according to claim 1, wherein the pattern formed on the panel substrate is a pattern of a transparent conductive film of a plasma display panel. Forming method. 7. An apparatus for forming a pattern on a surface of a panel base material, comprising: a charging device for charging a developer; and applying electrostatic force to the charged developer to eject the charged developer from a nozzle to the panel base material. An ejecting device, a fixing device for fixing the ejected developer on the panel base material, a film forming device for forming a film on the panel base material, and removing and forming the fixed developer. An apparatus for forming a pattern on a panel base material, comprising: a removing apparatus for forming a pattern.