JP2002372648A - Optical transmission module and reception module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that a conventional optical transmission module and reception module are difficult to be miniaturized and have problems such as loss in optical output which are caused by a sealing resin covering each chip and wire. SOLUTION: An optical transmission module is composed of an optical mini- jack module 14 on the light emitting side and an optical fiber plug 1 engaged with the optical mini-jack module 14. In the optical mini-jack module 14, an optical element made up of light emitting elements(LED 8/LD) and an IC 9 are mounted on a substrate 7 and are electrically conducted with a pattern electrode on the substrate 7 through wires, and the LED 8, IC 9 and wires are coated with an electrically nonconductive coating material 16. With the mini-jack module 14 engaged with the optical fiber plug 1, a distance B is reduced between a light emitting module 15 and the end face of a fiber cable 3. Accordingly, an optical output can be efficiently transmitted to the fiber cable. Miniaturization of the optical transmission module becomes feasible. The optical reception module has a structure similar to that of the optical transmission module.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical transmitting and receiving module which is capable of communicating by engaging an optical fiber plug with an optical mini jack module.

[0002]

2. Description of the Related Art In recent years, the structure of a bidirectional optical transmission and reception module has been changed to an optical fiber jack type connector housing an optical fiber cable and a detachable engagement with the tip thereof, and a light emitting diode as a light emitting element (optical element). (LED) or laser (LD) and a drive IC for controlling the device are mounted on a circuit board.
Photodiode (PDi) as light receiving element (optical element)
And an OEIC integrated with an IC and having a function of converting an optical signal into an electric signal are mounted on a substrate, and each of those elements is sealed with a light-transmitting resin, and an electrical connection with the outside is provided. An optical mini-jack module in which a light emitting module or a light receiving module having electrode terminals on a circuit board is independently housed in a case, and two optical fiber cables are respectively provided for the light emitting module or the light receiving module in the optical mini jack module. They are connected and transmit and receive optical signals to enable optical communication.

FIGS. 3 and 4 show the structure of a conventional optical transmitting and receiving module, and FIG. 3 is a sectional view showing a state where an optical fiber plug is engaged with an optical mini-jack module on the light emitting module side. . FIG. 4 is a sectional view of a main part showing a state where an optical fiber plug is engaged with the optical mini jack module on the light receiving module side.

[0004] An optical transmission module on the light emitting module side will be described with reference to FIG. Reference numeral 1 denotes an optical fiber plug, and the optical fiber plug 1 houses an optical fiber cable 3 inside a housing portion 2.

[0005] Reference numeral 4 denotes an optical mini jack module. The optical mini jack module 4 has a light emitting module 6 built in a socket 5. The light emitting module 6
A light emitting diode (LED) 8 or a laser (LD) as a light emitting element as an optical element
A drive IC 9 for controlling D8 is mounted, and conduction with the base substrate 7 is performed by wires. The LED 8 or the LD, the IC 9 and the wires are sealed with a light-transmitting sealing resin 10 for protection.

As shown in FIG. 3, when the optical fiber plug 1 is engaged with the optical mini-jack module 4, it is packaged with a sealing resin 10 so that the LE is obtained.
A distance dimension A between the front surface of D8 and the end surface of the fiber cable 3 is set.

The light receiving module on the light receiving module side will be described with reference to FIG. In FIG. 4, the configuration is the same as the configuration of the optical transmission module on the light emitting module side described above.
The difference is that the light receiving module 11 is built in the socket 5 instead of the light emitting module 6.
In the light receiving module 11, an OEIC 12 in which a PDi having a function of converting an optical signal to an electric signal and an IC are integrated is mounted on the surface of the base substrate 7, and conduction with the base substrate 7 is performed by a wire. The OEIC 12 and the wires are sealed with a translucent sealing resin 10 to protect the wires.

As shown in FIG. 4, the optical fiber plug 1 is packaged with a sealing resin 10 in a state where the optical fiber plug 1 is engaged with the optical mini jack module 4A, so that an OE is obtained.
A distance dimension A between the front surface of the IC 12 and the end surface of the fiber cable 3 is set.

With the above-described configuration, the light emitting module 6
Input the electric signal on the side, and IC9 · L in the light emitting module 6
It is converted into an optical signal by the ED 8. Light emitted from the LED 8 enters the optical fiber cable 3 of the optical fiber plug 1 and is transmitted.

Next, the light transmitted from the optical fiber plug 1 on the light receiving module side is transmitted to the optical mini jack module 4.
The light is incident on the OEIC 12 in the light receiving module 11 of A, converted into an electric signal, and output.

[0011]

However, the above-mentioned optical transmitting and receiving module has a structure in which the optical fiber plug is engaged with the optical mini jack module.
By packaging with a sealing resin, the distance between the front face of the optical element (light emitting element or light receiving element) and the end face of the end face of the optical fiber cable cannot be set small, resulting in a small size. Therefore, there is a problem such as light output loss.

The present invention has been made in view of the above-mentioned conventional problems, and has as its object to reduce the distance between an optical fiber cable and each chip, to efficiently transmit an optical output to an optical fiber, and to reduce the size of an optical fiber. A transmission and reception module is provided.

[0013]

In order to achieve the above object, an optical transmitting and receiving module according to the present invention comprises an optical element comprising a light emitting element and an IC mounted on a base substrate,
An optical mini-jack module having an optical element module having an upper surface covered with a light-transmitting sealing resin and having an electrode terminal for electrical connection to the outside, and an optical fiber plug engaged with the optical mini-jack module In the optical transmission module, the optical mini-jack module performs conduction between the light emitting element and the IC and the pattern electrode on the base substrate by a wire, and coats the surface of the light emitting element, the IC, and the wire with a coating material. It is characterized by the following.

Further, an optical element comprising a light receiving element and an IC mounted on a base substrate, the upper surface of which is covered with a translucent sealing resin, and provided with an electrode terminal for electrical connection to the outside. An optical minijack module having a module;
An optical receiving module comprising an optical fiber plug engaged with the optical mini-jack module, wherein the optical mini-jack module comprises a PDi and an IC as the light receiving element.
And an OEIC for converting an optical signal into an electrical signal and a pattern electrode on a base substrate are electrically connected by a wire, and the surface of the OEIC is coated with a coating material.

Further, the coating material which coats the surface of the light emitting element, the IC and the wire is a non-conductive coating resin.

Further, the coating material on which the surface of the OEIC is coated is a non-conductive coating resin.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An optical transmission and reception module according to the present invention will be described below with reference to the drawings. 1 and 2 relate to an optical transmitting and receiving module according to an embodiment of the present invention. FIG. 1 is a sectional view of a main part showing a state where an optical fiber plug is engaged with an optical mini-jack module on the light emitting module side. is there. FIG. 2 is a sectional view of a main part showing a state where an optical fiber plug is engaged with the optical mini jack module on the light receiving module side. In the drawings, the same members as those of the prior art are denoted by the same reference numerals.

In FIG. 1, the description of the optical fiber plug 1 is omitted because it is the same as that of the prior art. The light emitting module 15 is built in the socket 5 of the optical mini jack module 14. The light emitting module 15 mounts a light emitting diode (LED) 8 or a laser (LD) as a light emitting element, which is an optical element, and a drive IC 9 for controlling the LED 8 on the surface of the base substrate 7.
Is conducted by wire. LED8 or L
D, IC 9 and wires are coated with a coating material 16 to protect them.

The coating material 16 can be coated with a precision thin film, and the distance B between the front surface of the light emitting module 11 and the end surface of the fiber cable 3 can be set small.

The coating material 16 is, for example, trade name "Parylene resin" (R), and its main characteristics are excellent in non-conductivity. Since it can be coated at room temperature, it does not cause thermal damage to electronic components. Coating of a precision thin film is possible. Conformal coating that fits the shape of the adherend is possible. It has excellent permeability to narrow gaps of micron order due to vapor phase coating. At the time of coating, no mechanical stress due to curing stress or thermal stress due to thermal strain is applied to the adherend, so that physical stability is maintained. It has excellent characteristics.

With the configuration described above, the LE as an optical element
Light emitting module 15 mounted with D8 or LD and IC9
The distance B between the front surface of the fiber cable 3 and the end surface of the fiber cable 3 can be narrowed as compared with the distance A set in the prior art.

Referring to FIG. 2, the light receiving module on the light receiving module side will be described. The configuration is the same as that of the above-described light transmitting module on the light emitting module side, except that a light receiving module 17 is built in the socket 5 instead of the light emitting module 6. The light receiving module 17 includes an OEI on which PDi and an IC having a function of converting an optical signal to an electric signal are integrated on the surface of the base substrate 7.
C12 is mounted, and conduction with the base substrate 7 is performed by wires. In order to protect the OEIC 12 and the wires, the OEIC 12 and the wires are coated with the above-mentioned coating material 16 which is a non-conductive coating resin.

As shown in FIG. 2, when the optical fiber plug 1 is engaged with the optical mini jack module 14A, the distance B between the front surface of the light receiving module 17 and the end surface of the fiber cable 3 is set small. be able to.

[0024]

As described above, since the ICs, LEDs (LDs), OEICs, wires, etc. of the optical transmitting and receiving modules are coated with the non-conductive thin film coating resin, the optical fiber plug is used for the optical mini jack module. In the engaged state, the distance dimension between the front surface of the light emitting module or the light receiving module and the end surface of the fiber cable can be reduced. Therefore, the optical output can be efficiently transmitted to the fiber cable. Further, it is possible to develop the module into a smaller size. It is possible to provide an optical transmission and reception module with downsizing, high characteristics, and the like.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an essential part showing a state in which an optical fiber plug is engaged with an optical mini jack module on a light emitting module side according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a principal part showing a state in which an optical fiber plug is engaged with an optical mini-jack module on the light receiving module side according to the embodiment of the present invention. FIG.

FIG. 3 is a cross-sectional view of a main part showing a state where an optical fiber plug is engaged with an optical mini-jack module on the conventional light emitting module side.

FIG. 4 is a cross-sectional view of a main part showing a state in which an optical fiber plug is engaged with an optical mini-jack module on the conventional light receiving module side.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical fiber plug 2 Housing part 3 Fiber cable 7 Base board 8 LED 9 IC 12 OEIC 14 Light-emitting-side optical minijack module 15 Light-emitting module 16 Coating material 17 Light-receiving module 18 Light-receiving-side optical minijack module

Continued on the front page F-term (reference) 2H037 BA02 BA11 DA03 DA06 DA15 DA33 DA36 5F041 AA39 DA07 DA20 DA43 DA83 EE02 EE06 FF14 5F088 BA15 BA16 JA03 JA06 JA10 JA14 JA20

Claims (4)

[Claims] 1. An optical device comprising an optical device comprising a light emitting device and an IC mounted on a base substrate, the upper surface thereof being covered with a light-transmitting sealing resin, and having an electrode terminal for electrical connection to the outside. In an optical transmission module comprising an optical mini-jack module having a module and an optical fiber plug engaged with the optical mini-jack module, the optical mini-jack module includes a light emitting element, an IC, and a pattern electrode on a base substrate. An optical transmission module, wherein conduction is performed by a wire, and the surfaces of the light emitting element, the IC, and the wire are coated with a coating material. 2. An optical element comprising an optical element comprising a light receiving element and an IC mounted on a base substrate, the upper surface thereof being covered with a light-transmitting sealing resin, and having an electrode terminal for electrical connection to the outside. In an optical receiving module including an optical mini-jack module having a module and an optical fiber plug engaged with the optical mini-jack module, the optical mini-jack module integrates PDi and an IC as the light receiving element to transmit an optical signal. An optical receiving module, wherein electrical connection between an OEIC for converting an electric signal and a pattern electrode on a base substrate is performed by a wire, and a surface of the OEIC is coated with a coating material. 3. The optical transmission module according to claim 1, wherein the coating material is a non-conductive coating resin. 4. The optical receiving module according to claim 2, wherein said coating material is a non-conductive coating resin.