JP2002368410A - Solder temperature examining object and temperature examining method by using solder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To examine the temperatures of many places at a time without limiting a temperature examining part. SOLUTION: Solder paste 10 where a plurality of solder powders 10a, 10b, 10c and 10d different in melting points is formed. Solder paste 10 is fixed to the temperature examining part of a wiring board and the wiring board is heated by an actual heating process. The temperature of the temperature examining part is examined from the molten state of solder paste 10 after the heating process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder temperature investigation object and a temperature investigation method using solder.
Do not use a temperature measuring device.

[0002]

2. Description of the Related Art For example, when performing reflow soldering, it is necessary to control the temperature inside the reflow device so as to be suitable for soldering, and it has been conventionally required to investigate the temperature state of wiring boards and electronic components in the reflow device. Is being done. Conventionally, as shown in FIG. 5, a thermocouple 3 is fixed at an appropriate position on a wiring board 1 or an electronic component 2 to be mounted thereon with a heat-resistant tape 4, and this is disposed inside a reflow device or the like, and the temperature in a heated state is set. By monitoring the change, the heating conditions of the reflow device were set and adjusted.

[0003]

However, in such a conventional method of temperature investigation using a thermocouple, there is a problem that the location where the temperature can be investigated is limited due to the performance and workability of the measuring device. Therefore, only the parts where the temperature is expected to be lower than empirical rules and the electronic components having low heat resistance are subjected to the temperature investigation. In actual products, the temperature distribution on the wiring board is not uniform due to differences in the wiring pattern of the wiring board, the heat capacity of the mounted electronic components, unevenness in the heating state, and fluctuations due to continuous input during production. It is difficult to grasp the temperature distribution of the entire substrate by the temperature measurement described above.

Accordingly, the present invention has been made to solve the above-mentioned problems, and there is no limitation on the number of temperature investigation locations, and a solder temperature investigation object capable of investigating a temperature at many locations at once and a temperature investigation using solder. The aim is to provide a method.

[0005]

According to the first aspect of the present invention,
A solder temperature investigation object, characterized by including a plurality of types of solder powder having different melting points.

According to the first aspect of the present invention, since the melting points of the respective types of solder powders are different from each other, there is a case where a solder powder that melts at a predetermined temperature and a solder powder that does not melt at this temperature exist. It can be seen that the temperature is in the region between the melting points of both solder powders. When all types of solder powder are not melted, it can be seen that the temperature is lower than the melting points of all solder powders. Further, when all the solder powders are melted, it is found that the temperature is higher than the melting point of all the solder powders. Therefore, according to the first aspect of the present invention, it is possible to recognize the temperature range of each place where the solder temperature investigation object is arranged without using a temperature measuring unit such as a thermocouple.

According to a second aspect of the present invention, there is provided the solder temperature investigation product according to the first aspect, wherein the plurality of types of solder powder are:
It is characterized in that they are set to different sizes.

Therefore, according to the second aspect of the present invention, since the size of the solder powder is different for each type, it is possible to specify the solder powder that is not melted. For this reason, it becomes possible to know the temperature state visually.

Further, the invention according to claim 3 is the invention according to claim 1.
Alternatively, in the solder temperature test article according to claim 2, the plurality of types of solder powder are a paste-like solder paste to which a flux and an additive are added.

Therefore, the invention according to claim 3 has the effect of the invention described in claim 1 and claim 2 and, in addition, because the solder temperature investigation object is a solder paste, it can be easily attached to the temperature investigation object. The temperature can be easily investigated.

According to a fourth aspect of the present invention, there is provided the solder temperature investigation product according to any one of the first to third aspects, wherein the plurality of types of solder powders are resin solids coated with a resin. And a resin solid material attached to a heat-resistant tape portion.

Therefore, according to the fourth aspect of the present invention, in addition to the effects of the first to third aspects of the present invention, the effect of preventing the oxidation of the solder powder is obtained by coating the solder powder with the resin. is there.

According to a fifth aspect of the present invention, there is provided a temperature inspection method using solder, in which a solder temperature investigation object is prepared by mixing a plurality of solder powders having different melting points, and the solder temperature investigation object is subjected to a temperature investigation object. The temperature of the temperature investigation target is heated by an actual heating step, and after the heating step, the temperature of the temperature investigation point is inspected from the melting state of the solder temperature investigation object.

In the temperature survey method using the solder, the solder temperature survey object is fixed to a temperature survey site of the temperature survey object, and the melting state of the fixed solder temperature survey object is observed, so that the soldering temperature associated with the solder heating is measured. It becomes possible to know the temperature range of the heating section.

According to a sixth aspect of the present invention, there is provided a temperature inspection method using the solder according to the fifth aspect, wherein solder powders having different melting points are set to different sizes.

Therefore, according to the sixth aspect of the present invention, it is possible to know the temperature range at that time by recognizing the size of the solder powder that has not been melted (remaining melted).

[0017] Further, the invention according to claim 7 is based on claim 5.
Alternatively, in the temperature survey method using solder according to claim 6, a flux and an additive are added to the plurality of solder powders to form a paste.

Therefore, according to the invention of claim 7, in addition to the effects of the invention of claims 5 and 6, the solder paste can be fixed to the temperature investigation object by printing or the like.

The invention according to claim 8 is a method for inspecting temperature using solder according to claims 5 and 6,
A plurality of solder powders are coated with a resin to form a resin solid, and the resin solid is attached to a heat-resistant tape portion.

Therefore, according to the eighth aspect of the present invention, in addition to the functions of the fifth and sixth aspects of the present invention, the solder tape can be fixed only by sticking it to the temperature investigation object.

Further, the invention according to claim 9 is the same as the invention according to claim 5.
9. A temperature inspection method using solder according to claim 8, wherein the temperature inspection target is a wiring board for soldering an electronic component.

Therefore, according to the ninth aspect of the present invention, the temperature distribution of the wiring board can be known in detail by fixing the solder temperature investigation object evenly on the wiring board to be soldered and conducting the temperature investigation.

According to a tenth aspect of the present invention, there is provided a temperature inspection method using the solder according to any one of the fifth to eighth aspects, wherein the temperature inspection target is a wiring having a wiring pattern formed thereon. It is a substrate.

Therefore, according to the tenth aspect of the present invention,
For example, the influence of the wiring pattern on the temperature distribution can be known by fixing the solder temperature investigation object to each land portion of the wiring pattern and performing the temperature investigation.

According to an eleventh aspect of the present invention, there is provided a temperature inspection method using the solder according to any one of the fifth to eighth aspects, wherein the temperature investigation target includes a wiring board and a wiring board. It is an electronic component to be soldered.

Therefore, according to the eleventh aspect of the present invention,
By fixing the solder temperature survey object in the appropriate place on the wiring board on which the electronic component is mounted and conducting a temperature survey, it is possible to know in detail the temperature distribution taking into account the effect of the electronic component, that is, the actual heating situation of the product .

[0027]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 show a first embodiment of the present invention, and FIG. 1 (a) is a configuration diagram schematically showing solder powder contained in a solder paste (a solder temperature investigation object). b) is a configuration diagram schematically showing an example in which the solder powder contained in the solder paste (solder temperature investigation object) changes state due to heating;
FIG. 2A is a plan view showing a state in which a solder paste is printed on a wiring board, and FIG. 2B is a plan view showing an example in which the state of the solder paste changes due to heating of the wiring board.

As shown in FIG. 1A, a solder paste 10 which is a solder temperature test object is obtained by mixing four types of solder powders 10a, 10b, 10c and 10d having different melting points, and mixing the solder powders 10a and 10d. A paste is prepared by further mixing fluxes, additives, and the like with 10b, 10c, and 10d. The melting point of the solder powder 10a is A, the melting point of the solder powder 10b is B, the melting point of the solder powder 10c is C, and the melting point of the solder powder 10d is D.
Then, the melting point temperature has a relationship of A <B <C <D. Specific examples of the composition (melting point) of the solder powder used include:
For example, 63Sn / 37Pb (melting point: 183 ° C));
8Sn / 3.5Ag / 0.7Cu (melting point 217 ° C))
96.5Sn / 3.5Ag (melting point: 221 ° C));
3Sn / 0.7Cu (melting point: 227 ° C)), 100% Sn
(Melting point: 232 ° C.)), 95.0 Sn / 5.0 Sb (melting point: 228 to 238 ° C.), and the like, depending on the measurement temperature range. Note that the types and combinations of the solder powders (solder grains) and the respective solder compositions and composition ratios are not limited to the above-described solder powders.

The four types of solder powders 10a, 10b, 10
Each of c and 10d has a different size, and is provided so as to gradually increase in size from low melting point solder powder to high melting point solder powder.

Next, a case will be described in which the solder paste 10 is used to investigate the entire temperature distribution of the wiring board (temperature investigation object) 11. As shown in FIG. 2A, the solder paste 10 is applied on the wiring board 11 at equal intervals by printing or the like. Next, the wiring board 11 is heated by an actual heating step (for example, a reflow soldering apparatus), and after the heating step, the melting state of the solder paste 10 is inspected. Solder paste 10
4 types of solder powder 10a, 10b, 10c, 10d
Has different melting points, and thus shows a dissolved and undissolved state depending on the heating temperature.

In other words, as shown in FIG. 2 (b), the solder paste 10 at a location which has received a heating temperature higher than the melting point D of the solder powder 10d shows a molten state, and the melting point A of the solder powder 10a
The solder paste 10 at a location that has received a lower heating temperature is
It shows an unmelted state, and the melting point D of the solder powder 10d and the solder powder 10d
The portion of the solder paste 10 that has received the heating temperature between the melting point A of FIG. To explain the semi-molten state in more detail, the solder paste 10 at a location which has been subjected to a heating temperature between the melting point D of the solder powder 10d and the melting point C of the solder powder 10c has only the solder powder 10d undissolved and other solder powder. 10a, 10b, and 10c are melted, and the solder paste 10 at a location where a heating temperature between the melting point C of the solder powder 10c and the melting point B of the solder powder 10b is applied, the solder paste 10d and 10c are not melted and other solder The powders 10a and 10b are melted (the state of FIG. 1B), and the melting point B of the solder powder 10b and the melting point A of the solder powder 10a
The solder paste 10 at the location that has received the heating temperature between
Solder powders 10d, 10c and 10b are not melted and solder powder 10a
Only dissolves.

As described above, since the melting state of the solder paste 10 changes depending on the heating temperature, it is possible to know the heating state of each part of the wiring board 11 by inspecting the state of the solder paste 10 remaining after the heating step. it can. Therefore, it is possible to grasp the entire temperature distribution of the wiring board 11 including the non-uniform state of the temperature distribution on the wiring board 11 due to unevenness in the heating state, fluctuation due to continuous input during production, and the like.

As described above, according to the temperature survey method of the present invention, the solder paste 10 is applied to the temperature survey portion of the wiring board 11,
Since the temperature is investigated by investigating the dissolution state of the applied solder paste 10 later, the temperature investigation can be performed at many locations at once without limiting the temperature investigation location.
Also, since the actual production equipment and conditions can be used as they are,
Temperature survey can be performed at low cost. Furthermore, if the actual production facilities and conditions are used as they are and the actual temperature survey target is used, the temperature distribution in the actual production mode can be known. In addition, it is possible to conduct an investigation in a state close to the solder joint as compared with the case where a temperature indicating paint system is used.

In addition, in the first embodiment, the solder temperature test items are the solder powders 10a, 10b, 10
Since c and 10d have different sizes,
Since the heating temperature can be estimated from the size of the unmelted solder powders 10a, 10b, 10c, and 10d, quick temperature investigation is possible. Alternatively, a sample of the change in the molten state of the solder paste corresponding to the heating temperature may be separately prepared, and the heating temperature may be estimated based on a comparison with this sample. The size of each of the solder powders 10a, 10b, 10c, and 10d may be the same size such as a spherical shape (for example, the same mesh size and the fineness of a sieve).

In the first embodiment, the solder temperature investigation object is the solder paste 10 formed by adding a flux and an additive to a plurality of solder powders 10a, 10b, 10c, and 10d to form a paste. Since the paste 10 can be fixed to the temperature investigation target such as the wiring board 11 by printing or the like, handling is easy.

Further, in the first embodiment, since the object of temperature investigation is the wiring board 11 for soldering electronic components, the solder paste 10 is placed on the wiring board 11 to be soldered.
The temperature distribution of the wiring board 11 can be known in detail by fixing the temperature uniformly and conducting a temperature survey.

Further, if a plurality of solder pastes having different compositions and different measurement temperature ranges are prepared, and a plurality of types of solder pastes are applied to different places or the like using a dispenser or the like, a wide range of heating temperatures can be obtained. It is effective to know the distribution.

FIGS. 3 and 4 show a second embodiment of the present invention. FIG. 3 (a) is a plan view of a continuously connected solder tape (solder temperature investigation object), and FIG. A- of 3 (a)
FIG. 4 is a plan view showing a state in which a solder tape is attached to a wiring board. As shown in FIGS. 3 (a) and 3 (b), the solder tape 20 as the solder temperature test object has four types of solder powders 10a, 10b, 10c and 10d having different melting points.
And the mixed solder powders 10a, 10b, 10
c, 10d is a resin solid 22 coated with a resin (for example, rosin-based resin) 21 having the same action as the flux,
The resin solid 22 is attached to a heat-resistant tape portion 23 and manufactured. Each solder powder 10a, 10b, 10c, 1
Od is coated with the resin 21 having the same action as the flux, so that surface oxidation during storage and heating is prevented,
Further, it is fixed at a distance at which the molten solder powders 10a, 10b, 10c, 10d can be melted.

The heat-resistant tape portion 23 is a long material having cut portions 23a formed at appropriate intervals, and can be separated at the cut portions 23a so that the continuously connected solder tape 20 can be easily separated. It has become. 4
The configurations of the various types of solder powders 10a, 10b, 10c, and 10d are the same as those of the first embodiment, and a description thereof will be omitted.

Next, a case will be described in which the entire temperature distribution of the wiring board (temperature investigation target) 11 is investigated by using the solder tape 20. As shown in FIG.
On the wiring board 11 so as to form a staggered foot shape. Next, the wiring board 11 is heated by an actual heating step (for example, a reflow soldering apparatus), and after the heating step, the melting state of each of the solder powders 10a, 10b, 10c, and 10d of the solder tape 20 is inspected. Each solder powder 10a of the solder tape 20,
Since the melting states of the solder powders 10b, 10c, and 10d are changed according to the heating temperature, the solder powder 10 remaining after the heating process is not melted.
By inspecting the states of a, 10b, 10c, and 10d, the heating state of each part of the wiring board 11 can be known.

As described above, in the same manner as in the first embodiment, the solder tape 20 is applied to the portion of the wiring board 11 where the temperature is to be investigated.
Since the temperature is checked by checking the melting state of the applied solder tape 20 later, the temperature can be checked at many points at once without limiting the temperature check points.
Also, since the actual production equipment and conditions can be used as they are,
Temperature survey can be performed at low cost. In addition, if the actual production equipment and conditions are used as they are, and the actual object is used as the temperature investigation target, the temperature distribution in the actual production mode can be known. In addition, it is possible to conduct an investigation in a state close to the solder joint as compared with the case where a temperature indicating paint system is used.

In the second embodiment, the solder tape 2
Since it can be fixed simply by sticking 0 to the temperature investigation object, handling is easy.

In the second embodiment, since the object of temperature investigation is the wiring board 11 for soldering electronic components,
The soldering tape 20 is evenly fixed on the wiring board 11 to be soldered, and the temperature is checked.
The temperature distribution of No. 1 can be known in detail.

In the first and second embodiments,
The object of temperature investigation is a wiring board on which a wiring pattern is formed, and a solder paste 1 is applied to each land portion of the wiring pattern.
If the temperature is investigated while fixing the solder tape 20 or the solder tape 20, the influence of the wiring pattern on the temperature distribution can be known.

In the first and second embodiments,
The temperature investigation target is a wiring board and an electronic component to be soldered to the wiring board. If the solder paste 10 or the solder tape 20 is fixed to an appropriate place of the wiring board on which the electronic component is mounted and the temperature is investigated, the electronic component can be inspected. The temperature distribution in consideration of the influence, that is, the actual heating state of the product can be known in detail.

According to the first and second embodiments,
The solder paste 10 and the solder tape 20, which are the solder temperature investigation objects, have four types of solder powders 10a, 10b, 10c, and 10d.
Although the case where it is manufactured by mixing is shown, two or more types may be manufactured according to the measurement temperature range, and may be manufactured from a solder powder having an arbitrary composition. In addition, according to the first and second embodiments, For example, the case of investigating the heating temperature of the soldering surface of the wiring board 11 has been described, but for the purpose of knowing the heating temperature state of the non-soldering surface during double-sided reflow and flow soldering, or the heating temperature other than soldering It can also be used to know the status.

The discussion and drawings that form part of the above disclosure of the first and second embodiments of the present invention should not be understood as limiting the present invention. From this disclosure, various alternative embodiments, examples, and operation techniques will be apparent to those skilled in the art.

For example, in the first embodiment, specific examples of the solder powder have been listed and described. However, the present invention is not limited to these solder powders. It can be changed as appropriate. Further, even with the same combination of solder powders, since the melting point changes by changing the composition ratio, solder powders having the same composition but different composition ratios may be combined.

[0050]

As described above, according to the first aspect of the present invention, the heating temperature range can be recognized by examining the state of the undissolved solder powder. For this reason, it is possible to recognize the temperature range of each place where the solder temperature investigation object is arranged without using a temperature measuring unit such as a thermocouple as in the related art.

According to the second aspect of the present invention, since the size of the solder powder is different for each type, it is possible to specify the solder powder that is not melted. For this reason, the temperature state can be known visually.

According to the third aspect of the present invention, since the solder temperature test object is a solder paste, the solder temperature test object can be easily attached to the temperature test object, and the temperature can be easily checked.

According to the fourth aspect of the present invention, since the solder powder is covered with the resin, the oxidation of the solder powder can be prevented.

According to the fifth aspect of the present invention, the temperature can be investigated at many locations at once without limiting the temperature investigation location.
Further, since the actual production equipment and conditions can be used as they are, the temperature can be investigated at low cost. Furthermore, if the actual production equipment and conditions are used as they are and the actual object is used as the temperature investigation target, the temperature distribution in the actual production mode can be known. In addition, it is possible to conduct an investigation in a state close to soldering as compared with the case where a temperature indicating paint system is used.

According to the sixth aspect of the present invention, since the solder temperature investigation object has different sizes of solder powders having different melting points, the heating temperature can be estimated from the size of the unmelted solder powder. Temperature survey.

According to the seventh aspect of the present invention, since the solder temperature investigation object is a solder paste obtained by adding a flux and an additive to a plurality of solder powders, the temperature of the solder paste is determined by printing or the like. Since it can be fixed to the object, it is easy to handle.

According to the eighth aspect of the present invention, since the solder temperature investigation object is a resin solid material in which a plurality of solder powders are coated with a resin, and the resin solid material is attached to a heat-resistant tape, It can be fixed simply by sticking the solder tape to the temperature investigation target, and the handling is easy.

According to the ninth aspect of the present invention, since the temperature investigation target is a wiring board for soldering electronic components,
The temperature distribution of the wiring board can be known in detail by fixing the solder temperature investigation object evenly on the wiring board to be soldered and conducting the temperature investigation.

According to the tenth aspect of the present invention, since the temperature investigation target is the wiring board on which the wiring pattern is formed, the solder temperature investigation object is fixed to each land portion of the wiring pattern and the temperature is measured. The influence of the wiring pattern on the temperature distribution can be known by conducting the investigation.

According to the eleventh aspect of the present invention, since the temperature investigation target is a wiring board and an electronic component to be soldered to the wiring board, the solder temperature investigation object is placed at an appropriate position on the wiring board on which the electronic component is mounted. By performing the temperature survey while fixing the temperature, it is possible to know in detail the temperature distribution in consideration of the influence of the electronic component, that is, the actual heating state of the product.

[Brief description of the drawings]

1A and 1B show a first embodiment of the present invention, in which FIG. 1A is a configuration diagram schematically showing solder powder contained in a solder paste (solder temperature investigation object), and FIG. FIG. 4 is a configuration diagram schematically showing an example in which the state of solder powder included in the object changes.

FIGS. 2A and 2B show a first embodiment of the present invention, wherein FIG. 2A is a plan view showing a state in which a solder paste is printed on a wiring board, and FIG.
FIG. 4 is a plan view showing an example in which the state of the solder paste changes due to the heating of the wiring board.

FIG. 3 shows a second embodiment of the present invention, in which (a) is a plan view of a continuously connected solder tape (solder temperature investigation object),
FIG. 3B is a cross-sectional view taken along line AA of FIG.

FIG. 4 is a plan view showing a second embodiment of the present invention and showing a state where a solder tape is attached to a wiring board.

FIG. 5 is a plan view for explaining a conventional temperature investigation method using a thermocouple.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Solder paste (Solder temperature investigation object) 10a, 10b, 10c, 10d Solder powder 11 Wiring board 20 Solder tape (Solder temperature investigation object) 21 Resin 22 Resin fixed object 23 Heat resistant tape part

Continuing from the front page (72) Inventor Hiroe Suzuki 206-1 Nunobikihara, Haibara-cho, Haibara-gun, Shizuoka Prefecture Inside (72) Inventor Tomoyuki Iwata 206-1 Nunobikihara, Haibara-cho, Haibara-gun, Shizuoka Prefecture Inside Yazaki Parts Co., Ltd. F term (reference) 5E319 AA03 AC01 BB05 CC34 CD51 GG15

Claims (11)

[Claims] 1. A solder temperature investigation object comprising a plurality of types of solder powder having different melting points. 2. The solder temperature survey object according to claim 1, wherein the plurality of types of solder powders are set to different sizes. 3. The solder temperature investigation product according to claim 1, wherein the plurality of types of solder powder is a paste-like solder paste to which a flux and an additive are added. Solder temperature investigation item. 4. The solder temperature investigation object according to claim 1, wherein the plurality of types of solder powder are formed into a resin solid material covered with a resin. A solder temperature investigation object, wherein the object is attached to a heat-resistant tape portion. 5. A solder temperature survey object in which a plurality of types of solder powders having different melting points are mixed is prepared, and the solder temperature survey object is fixed to a temperature survey point of the temperature survey object, and the temperature survey object is actually heated. A temperature inspection method using solder, wherein the temperature is inspected by heating in a process, and a temperature of a temperature inspection location is inspected from a melting state of the solder temperature inspection object after the heating step. 6. A temperature survey method using solder according to claim 5, wherein each size of the solder powder having a different melting point is set to a different size. . 7. A temperature survey method using solder according to claim 5 or 6, wherein a flux and an additive are added to the plurality of types of solder powder to form a paste. Temperature survey method using solder to be used. 8. A temperature survey method using a solder according to claim 5 or 6, wherein a plurality of solder powders are coated with a resin to form a resin solid, and the resin solid is heat-resistant tape. Temperature investigation method using solder, characterized in that it is attached to a part. 9. A temperature survey method using solder according to claim 5, wherein the temperature survey target is a wiring board for soldering an electronic component. Temperature survey method using solder to be used. 10. A temperature inspection method using a solder according to claim 5, wherein the temperature inspection object is a wiring board on which a wiring pattern is formed. Temperature survey method using solder to be used. 11. The method for investigating a temperature using solder according to claim 5, wherein the object to be inspected is a wiring board and an electronic component to be soldered to the wiring board. Temperature survey method using solder to be used.