JP2002368037A - Air tension device for wire bonder - Google Patents
Air tension device for wire bonderInfo
- Publication number
- JP2002368037A JP2002368037A JP2001177517A JP2001177517A JP2002368037A JP 2002368037 A JP2002368037 A JP 2002368037A JP 2001177517 A JP2001177517 A JP 2001177517A JP 2001177517 A JP2001177517 A JP 2001177517A JP 2002368037 A JP2002368037 A JP 2002368037A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- air
- tension
- wire
- generating tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はワイヤボンダ用エア
ーテンション装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air tension device for a wire bonder.
【０００２】[0002]
【従来の技術】一般に、半導体装置における結線作業に
使用されるワイヤボンダは、金、あるいはアルミニウム
等のボンディングワイヤの先端部を保持するボンディン
グヘッドを半導体装置の接続パッド間で高速移動させ、
該接続パッド上にボンディングワイヤを接合するように
構成される。2. Description of the Related Art Generally, a wire bonder used for connection work in a semiconductor device moves a bonding head, which holds a tip of a bonding wire such as gold or aluminum, between connection pads of the semiconductor device at a high speed.
It is configured to bond a bonding wire on the connection pad.
【０００３】そして、ボンディングワイヤがからむこと
なく、ボンディングヘッドの移動に追随させるために
は、ボンディングワイヤには所定のテンションを与えて
おくことが必要であり、この目的のために使用されるエ
アーテンション装置には、例えば、特開昭６０-５２０
３０号公報の第３図に記載されたものが知られている。In order for the bonding wire to follow the movement of the bonding head without getting entangled, it is necessary to give a predetermined tension to the bonding wire, and the air tension used for this purpose is required. The apparatus includes, for example, JP-A-60-520.
No. 30 is known from FIG.
【０００４】この従来例において、エアーテンション装
置は、中心にワイヤ挿通孔が設けられた管体からなり、
管体側壁には、ワイヤ挿通孔に連通するエアー供給開口
が開設され、さらに、エアー供給開口とワイヤ挿通孔と
の境界部に空気ガイド孔が設けられる。空気ガイド孔は
ワイヤ挿通孔を包囲して上方、すなわちワイヤ導入側に
開放され、エアー供給開口から導入されたエアーは空気
ガイド孔により上方への気流となり、ワイヤ挿通孔に挿
通されるボンディングワイヤに上方へのテンションを付
与する。In this conventional example, the air tension device is composed of a tube having a wire insertion hole at the center thereof.
An air supply opening communicating with the wire insertion hole is opened in the side wall of the tube, and an air guide hole is provided at a boundary between the air supply opening and the wire insertion hole. The air guide hole surrounds the wire insertion hole and is opened upward, that is, to the wire introduction side, and the air introduced from the air supply opening becomes an upward airflow by the air guide hole, and the air flows through the bonding wire inserted into the wire insertion hole. Apply upward tension.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上述した従来
例には以下の欠点がある。すなわち、ボンディングワイ
ヤには直径０．０２ｍｍ程度の極細線が使用されるため
に、ワイヤ挿通孔もほぼ同程度の極小径に形成される。
これに伴ってワイヤ挿通孔を包囲する空気ガイド孔も微
少寸法に形成する必要があるが、管体内にこのような微
少で、かつ、複雑な空気ガイド孔を形成するのは困難
で、製造コストが高くついてしまう上に、精度の確保も
難しく、信頼性が低い。However, the above-mentioned prior art has the following disadvantages. That is, since a very fine wire having a diameter of about 0.02 mm is used for the bonding wire, the wire insertion hole is also formed with a very small diameter of about the same.
Along with this, the air guide hole surrounding the wire insertion hole also needs to be formed in a very small size, but it is difficult to form such a small and complicated air guide hole in the pipe, and the manufacturing cost is reduced. Cost is high, accuracy is difficult to secure, and reliability is low.
【０００６】本発明は、以上の欠点を解消すべくなされ
たものであって、安価で、かつ、確実に所望のテンショ
ンを付与することのできるエアーテンション装置の提供
を目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-described drawbacks, and has as its object to provide an air tension device which is inexpensive and can reliably apply a desired tension.
【０００７】[0007]
【課題を解決するための手段】本発明によれば上記目的
は、中心部に長手通しに形成された貫通孔１へのエアー
供給孔２を備えた本体３と、貫通孔１に挿入され、中央
部に空気流通孔４が長手通しに設けられるテンション発
生管５と、貫通孔１の開口終端に固定され、前記テンシ
ョン発生管５の空気流通孔４より小径のワイヤ挿通孔６
を備えたワイヤガイド７とを有するワイヤボンダ用エア
ーテンション装置を提供することにより達成される。According to the present invention, the object is to provide a main body 3 provided with an air supply hole 2 to a through hole 1 formed in a central portion so as to extend longitudinally, and to be inserted into the through hole 1, A tension generating pipe 5 having an air flow hole 4 provided in the center thereof in a longitudinal direction, and a wire insertion hole 6 fixed to the end of the opening of the through hole 1 and having a diameter smaller than that of the air flow hole 4 of the tension generation pipe 5;
This is achieved by providing an air tension device for a wire bonder having a wire guide 7 provided with a wire guide.
【０００８】本発明において、エアー供給孔２から貫通
孔１内に強制導入されたエアーは、貫通孔１内において
上下、該貫通孔１に沿って流動する。貫通孔１はテンシ
ョン発生管５とワイヤガイド７により上下両端が閉塞さ
れた状態となっており、貫通孔１内に導入されたエアー
はワイヤガイド７内に形成されたワイヤ挿通孔６より大
径のテンション発生管５側の空気流通孔４に流れ込み、
上昇気流となる。この結果、空気流通孔４を挿通するボ
ンディングワイヤ８には繰り出し方向（下方）と反対側
のテンション（バックテンション）が付与される。In the present invention, the air forcedly introduced into the through hole 1 from the air supply hole 2 flows vertically along the through hole 1 in the through hole 1. The upper and lower ends of the through hole 1 are closed by the tension generating tube 5 and the wire guide 7. The air introduced into the through hole 1 has a larger diameter than the wire insertion hole 6 formed in the wire guide 7. Flows into the air flow hole 4 on the side of the tension generating pipe 5,
It becomes an updraft. As a result, a tension (back tension) on the side opposite to the feeding direction (downward) is applied to the bonding wire 8 inserted through the air flow hole 4.
【０００９】本発明によれば、本体３にテンション発生
管５とワイヤガイド７を固定するだけの構造であり、か
つ、テンション発生管５、およびワイヤガイド７への加
工は、通常の孔明け加工で足りるために、製造効率も向
上する上に、加工精度の信頼性も高くなる。According to the present invention, the tension generating tube 5 and the wire guide 7 are simply fixed to the main body 3, and the processing into the tension generating tube 5 and the wire guide 7 is performed by ordinary drilling. Therefore, the manufacturing efficiency is improved, and the reliability of the processing accuracy is also increased.
【００１０】また、テンション発生管５の先端形状を先
細りのテーパ形状に形成し、該テーパ部をエアー供給孔
２に対峙させると、テーパ部側壁面と貫通孔１内壁面と
の間に適度のエアー対流スペース９が確保されるととも
に、エアー供給孔２から吹き出すエアーが直接ボンディ
ングワイヤ８に衝突しないために、不測の力がボンディ
ングワイヤ８に負荷されることもなくなる。When the tip of the tension generating tube 5 is formed in a tapered shape and the tapered portion is opposed to the air supply hole 2, an appropriate space is formed between the side wall surface of the tapered portion and the inner wall surface of the through hole 1. The air convection space 9 is secured, and the air blown out from the air supply hole 2 does not directly collide with the bonding wire 8, so that an unexpected force is not applied to the bonding wire 8.
【００１１】さらに、発明者が実施した実験によると、
ボンディングワイヤ８に付与されるテンションはテンシ
ョン発生管５の長さ、空気流通孔４、および導入するエ
アーの圧力に影響されるために、テンション発生管５を
本体３に対して着脱可能とすることにより、テンション
発生管５を変更することにより最適なものを選択使用す
ることが可能になる。Further, according to an experiment conducted by the inventor,
Since the tension applied to the bonding wire 8 is affected by the length of the tension generating tube 5, the air flow hole 4, and the pressure of the air to be introduced, the tension generating tube 5 must be detachable from the main body 3. Accordingly, it is possible to select and use an optimum one by changing the tension generating tube 5.
【００１２】この場合、テンション発生管５の全長
（Ｌ）が、空気流通孔４の直径をｄとして、 ３０＜＝（Ｌ／ｄ）＜＝２００、 望ましくは、５０＜＝（Ｌ／ｄ）＜＝１２５とすると、
安定したテンションを得ることができる。In this case, the total length (L) of the tension generating tube 5 is 30 <= (L / d) <= 200, preferably 50 <= (L / d), where d is the diameter of the air flow hole 4. If <= 125,
A stable tension can be obtained.
【００１３】[0013]
【発明の実施の形態】図２に示すように、ワイヤボンダ
は、超音波ホーンを備えたボンディングアーム１０と、
ボンディングアーム１０に連動してボンディングワイヤ
８を捕捉、解放しながら上下揺動駆動するワイヤクラン
パ１１と、ワイヤクランパ１１の上方に配置されるエア
ーテンション装置Ａとを有する。ボンディングワイヤ８
は、ワイヤクランパ１１の揺動動作により図外のスプー
ルから順次繰り出され、まず、キャピラリ１０ａと、そ
の下方に位置する図外のトーチロッドにより発生する放
電により自由端が溶融されてボールが形成される。次い
で、キャピラリ１０ａ先端によりボールを接続パッド１
２に押しつけながら超音波ホーンにより超音波振動を加
え、該ボールを接続パッド１２上に接合する。この後、
キャピラリ１０ａを他の接続パッド１２上に移動させて
ボンディングワイヤ８を該接続パッド１２上に接合した
後、ワイヤクランパ１１によりボンディングワイヤ８に
引張荷重を負荷させてボンディングワイヤ８を切断して
ボンディング工程が終了する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 2, a wire bonder includes a bonding arm 10 having an ultrasonic horn,
It has a wire clamper 11 that swings up and down while capturing and releasing the bonding wire 8 in conjunction with the bonding arm 10, and an air tension device A disposed above the wire clamper 11. Bonding wire 8
Is sequentially fed out of a spool (not shown) by the swinging operation of the wire clamper 11, and first, a free end is melted by a discharge generated by the capillary 10a and a torch rod (not shown) located thereunder to form a ball. You. Next, the ball is connected to the connection pad 1 by the tip of the capillary 10a.
Ultrasonic vibration is applied by an ultrasonic horn while pressing the ball onto the connection pad 2 to join the ball to the connection pad 12. After this,
After the capillary 10a is moved onto another connection pad 12 and the bonding wire 8 is bonded to the connection pad 12, a tensile load is applied to the bonding wire 8 by the wire clamper 11 to cut the bonding wire 8 to perform a bonding process. Ends.
【００１４】エアーテンション装置Ａは、上述した一連
のボンディング工程においてボンディングワイヤ８に上
方、すなわちボンディングワイヤ９の供給源方向へのテ
ンションを付加し、ボンディングワイヤ８のからみを防
止するために配置され、図１に示すように、本体３にワ
イヤガイド７とテンション発生管５とを連結して構成さ
れる。The air tensioner A is arranged to apply tension upward to the bonding wires 8, that is, in the direction of the supply source of the bonding wires 9 in the above-described series of bonding steps, to prevent the bonding wires 8 from being entangled. As shown in FIG. 1, a wire guide 7 and a tension generating tube 5 are connected to a main body 3 and configured.
【００１５】上記本体３は、ステンレス鋼等により形成
されるスリーブ３ａと、アルミニウム、あるいは真鍮等
により形成される本体金具３ｂとからなる。本体金具３
ｂは、上記スリーブ３ａの側壁部を包囲するスリーブ３
ａ１と、後述するスリーブ側エアー供給孔２ａに連通す
る金具側エアー供給孔２ｂとを備え、金具側エアー供給
孔２ｂの一端にはホース連結部２ｃが設けられる。一
方、スリーブ３ａは上下端に同心のねじ部１３と、両ね
じ部１３、１３を貫通するようにしてねじ部１３の中心
に沿う貫通孔１とを備える。また、スリーブ３ａの側壁
には上記貫通孔１に連通するスリーブ側エアー供給孔２
ａが開設され、該スリーブ側エアー供給孔２ａと、上記
金具側エアー供給孔２ｂとによりエアー供給孔２が構成
される。スリーブ側エアー供給孔２ａは加工性を良好に
するために、まず横方向に一側壁から対向壁まで貫通さ
せた後、金具側エアー供給孔２ｂを一方の開放端に合致
させて本体金具３ｂをスリーブ３ａに固定することによ
り、他端側を本体金具３ｂのスリーブ固定穴３ｂ１内壁
面により閉塞して形成される。The main body 3 comprises a sleeve 3a made of stainless steel or the like and a main body fitting 3b made of aluminum or brass. Body bracket 3
b denotes a sleeve 3 surrounding the side wall of the sleeve 3a.
a1 and a fitting-side air supply hole 2b communicating with a sleeve-side air supply hole 2a to be described later, and a hose connection portion 2c is provided at one end of the fitting-side air supply hole 2b. On the other hand, the sleeve 3a is provided with a concentric thread portion 13 at the upper and lower ends, and a through hole 1 extending through the two thread portions 13 and 13 along the center of the thread portion 13. A sleeve-side air supply hole 2 communicating with the through hole 1 is provided on a side wall of the sleeve 3a.
The air supply hole 2 is formed by the sleeve side air supply hole 2a and the metal fitting side air supply hole 2b. In order to improve the workability, the sleeve side air supply hole 2a is first penetrated in the lateral direction from one side wall to the opposite wall, and then the metal side metal supply hole 2b is aligned with one open end, and the main body metal part 3b is connected. By fixing to the sleeve 3a, the other end side is closed by the inner wall surface of the sleeve fixing hole 3b1 of the main body fitting 3b.
【００１６】上記貫通孔１にはテンション発生管５が固
定される。テンション発生管５は、例えばセラミック等
により細長パイプ形状に形成される主体部５ａに固定部
５ｂを固定して形成され、直径０．０２ｍｍ程度の線径
のボンディングワイヤ８の使用を想定して構成されるこ
の実施の形態において、主体部５ａの中心部には直径
０．４ｍｍ程度の空気流通孔４が長手通しに設けられ
る。主体部５ａは３０ｍｍ程度の長さを有し、空気流通
孔４の上端、すなわちボンディングワイヤ８の導入側端
部には、ボンディングワイヤ８の挿入作業性を考慮し
て、先端に行くに従って漸次拡径するワイヤ導入部５ａ
１が設けられる。さらに、主体部５ａの下端、すなわ
ち、ボンディングワイヤ８の引き出し側端部には、先端
に行くに従って漸次縮径するテーパ面５ａ２が形成され
る。A tension generating tube 5 is fixed in the through hole 1. The tension generating tube 5 is formed by fixing a fixing portion 5b to a main portion 5a formed into an elongated pipe shape by, for example, ceramics, and is configured on the assumption that a bonding wire 8 having a diameter of about 0.02 mm is used. In this embodiment, an air flow hole 4 having a diameter of about 0.4 mm is provided at the center of the main body 5a so as to extend through the length. The main body 5a has a length of about 30 mm, and gradually expands toward the tip at the upper end of the air flow hole 4, that is, at the introduction side end of the bonding wire 8 in consideration of the workability of inserting the bonding wire 8. Diameter wire introduction part 5a
1 is provided. Further, a tapered surface 5a2 whose diameter is gradually reduced toward the tip is formed at the lower end of the main body 5a, that is, at the end on the drawing side of the bonding wire 8.
【００１７】固定部５ｂは、本体３側のねじ部１３に螺
合可能なねじ５ｂ１を備えてボルト形状をなし、中心に
主体部５ａを挿通させた後、接着等の適宜手段で主体部
５ａに接合される。また、固定部５ｂには位置決め部５
ｂ２が設けられ、該位置決め部５ｂ２を本体３側の位置
決め部３ｃに当接させてテンション発生管５の本体３へ
の位置決めがなされる。この状態において、テンション
発生管５の主体部５ａ下端のテーパ面５ａ２がエアー供
給孔２の開口全域に渡って対峙し、側面視においてエア
ー供給孔２と完全に重合する位置で固定される。The fixing portion 5b is provided with a screw 5b1 which can be screwed into the screw portion 13 of the main body 3 and is formed in a bolt shape. After the main portion 5a is inserted through the center, the main portion 5a is formed by an appropriate means such as bonding. Joined to. The positioning part 5 is provided on the fixed part 5b.
b2 is provided, and the positioning portion 5b2 is brought into contact with the positioning portion 3c of the main body 3 to position the tension generating tube 5 with respect to the main body 3. In this state, the tapered surface 5a2 at the lower end of the main body 5a of the tension generating tube 5 faces the entire opening of the air supply hole 2 and is fixed at a position where it completely overlaps with the air supply hole 2 in a side view.
【００１８】なお、この実施の形態において、テンショ
ン発生管５をパイプ状の主体部５ａと固定部５ｂとを接
合して形成する場合を示したが、固定部５ｂを一体に形
成することも可能である。In this embodiment, the case where the tension generating pipe 5 is formed by joining the pipe-shaped main part 5a and the fixing part 5b has been described, but the fixing part 5b may be formed integrally. It is.
【００１９】さらに、上記本体３の下端には、セラミッ
ク等により形成されるワイヤガイド７が固定される。ワ
イヤガイド７は中心部にテンション発生管５の空気流通
孔４より小径のワイヤ挿通孔６を上下方向に貫通させて
形成され、上記本体３の下端に形成されたねじ部１３に
螺合される下部固定ねじ１４を介して本体３に固定され
る。このワイヤガイド７は上端面とテンション発生管５
の下端との間に０．５ｍｍ程度の間隔が確保されるよう
に固定され、この間隔と、上記貫通孔１の内周壁とテン
ション発生管５のテーパ面５ｂとの間にエアー対流スペ
ース９が構成される。Further, a wire guide 7 made of ceramic or the like is fixed to the lower end of the main body 3. The wire guide 7 is formed at the center thereof by vertically penetrating a wire insertion hole 6 having a smaller diameter than the air flow hole 4 of the tension generating tube 5, and is screwed to a screw portion 13 formed at a lower end of the main body 3. It is fixed to the main body 3 via the lower fixing screw 14. The wire guide 7 is provided between the upper end face and the tension generating tube 5.
The space between the inner peripheral wall of the through hole 1 and the tapered surface 5b of the tension generating tube 5 is fixed by an air convection space 9 between the inner peripheral wall of the through hole 1 and the tapered surface 5b. Be composed.
【００２０】したがってこの実施の形態において、本体
３にテンション発生管５とワイヤガイド７を固定し、さ
らに、テンション発生管５の空気流通孔４、本体３の貫
通孔１、ワイヤガイド７のワイヤ挿通孔６を経由して下
部固定ねじ１４の挿通孔１４ａにボンディングワイヤ８
を挿通させ、エアー供給孔２から圧縮空気を矢印で示す
ように供給すると、供給されたエアーは、まず、エアー
対流スペース９内に導かれた後、径の大きな空気流通孔
４側に流出し、テンション発生管５内に上昇気流を発生
させる。この上昇気流は、下方に引き出されるボンディ
ングワイヤ８に対してテンションを与えることとなり、
ボンディング操作中におけるボンディングワイヤ８のか
らまりを防止する。Therefore, in this embodiment, the tension generating pipe 5 and the wire guide 7 are fixed to the main body 3, and further, the air flow hole 4 of the tension generating pipe 5, the through hole 1 of the main body 3, and the wire insertion of the wire guide 7. The bonding wire 8 is inserted into the through hole 14a of the lower fixing screw 14 through the hole 6.
When compressed air is supplied from the air supply hole 2 as shown by an arrow, the supplied air is first guided into the air convection space 9 and then flows out to the large-diameter air circulation hole 4 side. Then, an ascending airflow is generated in the tension generating pipe 5. This rising airflow gives tension to the bonding wire 8 drawn downward,
The entanglement of the bonding wire 8 during the bonding operation is prevented.
【００２１】また、エアー供給孔２から吹き出すエアー
はテンション発生管５のテーパ面５ａ２に衝突し、ボン
ディングワイヤ８に直接当たることがないために、ボン
ディングワイヤ８に過度の応力が発生することもない。
加えて、テンション発生管５への空気流通孔４と、ワイ
ヤガイド７へのワイヤ挿通孔６の加工は比較的微細な加
工を要するが、これらは直線状の貫通孔明け作業である
ために、従来多用される汎用の加工方法によることがで
きるために、製造コストも比較的安価で、かつ、高い精
度も確保することができる。Further, since the air blown out from the air supply hole 2 collides with the tapered surface 5a2 of the tension generating tube 5 and does not directly hit the bonding wire 8, no excessive stress is generated in the bonding wire 8. .
In addition, processing of the air circulation hole 4 to the tension generating pipe 5 and processing of the wire insertion hole 6 to the wire guide 7 require relatively fine processing. However, since these are straight through hole drilling operations, Since a general-purpose processing method that is frequently used in the related art can be used, the manufacturing cost is relatively low, and high accuracy can be secured.
【００２２】ボンディングワイヤ８に付加されるテンシ
ョンの大きさは、テンション発生管５の長さ（Ｌ）、お
よび空気流通孔４の直径（ｄ）に影響を受け、一般に長
さが長いほど安定した大きなテンションが得られる。ま
た、テンション発生管５が長くなると、少ないエアー流
量により安定したテンションを得られるために、テンシ
ョン発生管５のボンディングワイヤ８導入端（上端）で
のボンディングワイヤ８の横方向振動を抑えることがで
きるという効果も得ることができる。The magnitude of the tension applied to the bonding wire 8 is affected by the length (L) of the tension generating tube 5 and the diameter (d) of the air flow hole 4, and in general, the longer the length, the more stable. Great tension can be obtained. Further, when the tension generating tube 5 is long, a stable tension can be obtained with a small air flow rate, so that the lateral vibration of the bonding wire 8 at the introduction end (upper end) of the bonding wire 8 of the tension generating tube 5 can be suppressed. The effect described above can also be obtained.
【００２３】発明者が直径０．０２ｍｍの金線をボンデ
ィングワイヤ８として使用して行った実験によると、テ
ンション発生管５の長さ（Ｌ）と空気流通孔４の直径
（ｄ）との比（Ｌ／ｄ）が３０程度からテンションの増
加が見られ、５０程度にまで増加すると上記ボンディン
グワイヤ８の横方向振動を害にならない程度まで低くし
てテンションを与えることが可能になることが確かめら
れた。According to an experiment conducted by the inventor using a gold wire having a diameter of 0.02 mm as the bonding wire 8, the ratio of the length (L) of the tension generating tube 5 to the diameter (d) of the air flow hole 4 was determined. (L / d) shows an increase in tension from about 30. When it is increased to about 50, it is confirmed that the lateral vibration of the bonding wire 8 can be reduced to a level that does not harm the tension. Was done.
【００２４】一方、テンション発生管５の長さは、テン
ション発生管５へのボンディングワイヤ８の初期挿入操
作の信頼性を低める方向にも働くために、上記Ｌ／ｄ値
はこの要求から上限が決定される。図３は横軸にＬ／ｄ
値、縦軸にボンディングワイヤ８のテンション発生管５
への挿通操作の成功率をパーセントで示すもの、図中破
線は手作業による作業、実線は吸引式（導出端に負圧を
負荷し、ボンディングワイヤ８を吸引する方法）による
作業結果を示す。図３に示すように、吸引式において
は、Ｌ／ｄ値が２００以下、手動式でＬ／ｄ値が１２５
以下が通線操作可能域であり、上述したテンション発生
機能をも考慮すると、テンション発生管５は、Ｌ／ｄ値
が、３０≦Ｌ／ｄ≦２００、望ましくは、５０≦Ｌ／ｄ
≦１２５であれば、通線操作性を維持しつつ、所定のテ
ンションを得ることができる。On the other hand, since the length of the tension generating tube 5 also acts in the direction of lowering the reliability of the initial insertion operation of the bonding wire 8 into the tension generating tube 5, the above L / d value has an upper limit from this requirement. It is determined. FIG. 3 shows L / d on the horizontal axis.
Value, the vertical axis is the tension generation tube 5 of the bonding wire 8
The percentage of the success rate of the insertion operation into the device is shown as a percentage. In the figure, the broken line indicates the result of the manual operation, and the solid line indicates the operation result of the suction type (a method of applying a negative pressure to the lead-out end and sucking the bonding wire 8). As shown in FIG. 3, in the suction type, the L / d value is 200 or less, and in the manual type, the L / d value is 125 or less.
The following is the line operable area, and in consideration of the tension generating function described above, the tension generating tube 5 has an L / d value of 30 ≦ L / d ≦ 200, preferably 50 ≦ L / d.
If ≦ 125, a predetermined tension can be obtained while maintaining the line operability.
【００２５】なお、この実施の形態において、テンショ
ン発生管５は本体３に対して着脱することができるため
に、長さ（Ｌ）、および空気流通孔４の直径（ｄ）の異
なった複数のテンション発生管５から、最適なテンショ
ンを付与できるものを適宜選択することもできる。In this embodiment, since the tension generating tube 5 can be attached to and detached from the main body 3, a plurality of tension generating tubes 5 having different lengths (L) and different diameters (d) of the air flow holes 4 are provided. The tension generating tube 5 can be appropriately selected from those capable of providing an optimal tension.
【００２６】[0026]
【発明の効果】以上の説明から明らかなように、本発明
によれば、安価で、かつ、確実に所望のテンションを付
与することのできるエアーテンション装置を得ることが
できる。As is apparent from the above description, according to the present invention, it is possible to obtain an inexpensive air tension device capable of reliably applying a desired tension.
【図１】本発明を示す断面図である。FIG. 1 is a sectional view showing the present invention.
【図２】ワイヤボンダを示す説明図である。FIG. 2 is an explanatory diagram showing a wire bonder.
【図３】ボンディングワイヤの通線操作性を示す図であ
る。FIG. 3 is a diagram showing the operability of a bonding wire;
１ 貫通孔 ２ エアー供給孔 ３ 本体 ４ 空気流通孔 ５ テンション発生管 ６ ワイヤ挿通孔 ７ ワイヤガイド ８ ボンディングワイヤ DESCRIPTION OF SYMBOLS 1 Through hole 2 Air supply hole 3 Main body 4 Air circulation hole 5 Tension generating tube 6 Wire insertion hole 7 Wire guide 8 Bonding wire
───────────────────────────────────────────────────── フロントページの続き (72)発明者 丸山 高緒 東京都大田区大森北５丁目７番12号 オグ ラ宝石精機工業株式会社内 Ｆターム(参考） 5F044 BB16 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Takao Maruyama 5-7-12 Omorikita, Ota-ku, Ota-ku, Tokyo F-term (reference) 5F044 BB16
Claims (4)
エアー供給孔を備えた本体と、 貫通孔に挿入され、中央部に空気流通孔が長手通しに設
けられるテンション発生管と、 貫通孔の開口終端に固定され、前記テンション発生管の
空気流通孔より小径のワイヤ挿通孔を備えたワイヤガイ
ドとを有するワイヤボンダ用エアーテンション装置。1. A main body having an air supply hole to a through hole formed in a central portion thereof and having a longitudinal passage formed therein, a tension generating tube inserted into the through hole and having an air flow hole provided in a central portion thereof in a longitudinally extending manner. An air tensioner for a wire bonder, comprising: a wire guide fixed to the end of the opening of the through hole and having a wire insertion hole smaller in diameter than the air flow hole of the tension generating tube.
給孔に対峙する先細りのテーパ形状に形成され、 エアー供給孔からの噴出エアーのボンディングワイヤへ
の直接衝突を防止する請求項１記載のワイヤボンダ用エ
アーテンション装置。2. The wire bonder according to claim 1, wherein the tip of the tension generating tube is formed in a tapered shape facing the air supply hole to prevent direct collision of air jetted from the air supply hole with the bonding wire. Air tension device.
である請求項１または２記載のワイヤボンダ用エアーテ
ンション装置。3. The air tension device for a wire bonder according to claim 1, wherein the tension generating tube is detachable from a main body.
気流通孔の直径をｄとして、 ３０≦（Ｌ／ｄ）≦２００ である請求項１ないし３のいずれかに記載のワイヤボン
ダ用エアーテンション装置。4. The air for a wire bonder according to claim 1, wherein the total length (L) of the tension generating tube is 30 ≦ (L / d) ≦ 200, where d is the diameter of the air flow hole. Tension device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001177517A JP3503700B2 (en) | 2001-06-12 | 2001-06-12 | Air tension device for wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001177517A JP3503700B2 (en) | 2001-06-12 | 2001-06-12 | Air tension device for wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002368037A true JP2002368037A (en) | 2002-12-20 |
| JP3503700B2 JP3503700B2 (en) | 2004-03-08 |
Family
ID=19018350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001177517A Expired - Fee Related JP3503700B2 (en) | 2001-06-12 | 2001-06-12 | Air tension device for wire bonder |
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| Country | Link |
|---|---|
| JP (1) | JP3503700B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008198886A (en) * | 2007-02-15 | 2008-08-28 | Shinkawa Ltd | Washer washing guide |
| CN102630338A (en) * | 2009-12-25 | 2012-08-08 | Adamant工业株式会社 | Air tension apparatus |
| CN113070417A (en) * | 2021-04-22 | 2021-07-06 | 中国空气动力研究与发展中心设备设计与测试技术研究所 | Automatic straightening and cutting device for ultra-fine aluminum wires |
-
2001
- 2001-06-12 JP JP2001177517A patent/JP3503700B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008198886A (en) * | 2007-02-15 | 2008-08-28 | Shinkawa Ltd | Washer washing guide |
| JP4700633B2 (en) * | 2007-02-15 | 2011-06-15 | 株式会社新川 | Wire cleaning guide |
| CN102630338A (en) * | 2009-12-25 | 2012-08-08 | Adamant工业株式会社 | Air tension apparatus |
| EP2518760A1 (en) * | 2009-12-25 | 2012-10-31 | Adamant Kogyo Co., Ltd. | Air tension apparatus |
| EP2518760A4 (en) * | 2009-12-25 | 2014-09-17 | Adamant Kogyo Co | Air tension apparatus |
| JP5750644B2 (en) * | 2009-12-25 | 2015-07-22 | アダマンド株式会社 | Air tension device |
| CN102630338B (en) * | 2009-12-25 | 2015-08-19 | Adamant工业株式会社 | Air tension device |
| CN113070417A (en) * | 2021-04-22 | 2021-07-06 | 中国空气动力研究与发展中心设备设计与测试技术研究所 | Automatic straightening and cutting device for ultra-fine aluminum wires |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3503700B2 (en) | 2004-03-08 |
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