JP2002367873A - Method of manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the cost of an electronic component. SOLUTION: The upper surface of a substrate 20 is processed to form recessed parts 2a and after that, a semiconductor substrate 21 is bonded to the upper surface of the substrate 20. At this time, a part of the upper surface of substrate 20 is kept exposed. Recessed parts (marks for positioning) 33 for positioning are previously formed in the exposed parts of the upper surface of this substrate 20. After that, a type Patten 22 is formed on the upper surface of the substrate 21 to set processing object positions on the substrate 21 based on processing positions (the formation positions of the recessed parts 2) on the substrate 20. At this time, the arrangement of the pattern 22 is made from the side of the upper surface of the substrate 21 utilizing the recessed parts 33. When arranging this pattern 22, a special device, i.e., a double-side mask aligner, can be eliminated. As a result, an increase in the cost of equipment can be suppressed. Hereby, a reduction in the cost of the electronic component can be promoted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing an electronic component such as an angular velocity sensor.

[0002]

2. Description of the Related Art FIG. 6 schematically shows an example of a sectional configuration of an angular velocity sensor which is one example of an electronic component. The angular velocity sensor 1 has a base (for example, glass) 2, a semiconductor unit (for example, silicon) 3, and a lid (for example, glass) 4. The base 2, the semiconductor unit 3, and the lid 4 are laminated. It is integrated. The base 2 and the cover 4 have recesses 2a, 4 respectively.
a, and a vacuum space 6 is formed by the concave portions 2a and 4a.

In the semiconductor section 3, a sensor section 8 and a seal section 9 surrounding the sensor section 8 are formed by utilizing a semiconductor processing technique such as etching. Seal part 9
Is sandwiched between the base 2 and the lid 4 and is anodically bonded to the base 2 and the lid 4 to seal the vacuum space 6.

FIG. 7 schematically shows one embodiment of the sensor section 8. The sensor unit 8 includes a square vibrating body 7.
And the vibrating body supporting and fixing portion 10 (10a, 10b, 10c,
10d) and the electrode support fixing portion 11 (11a, 11b)
, A detection electrode pad forming part 12, and a beam 13 (13a,
13b, 13c, 13d) and the comb-shaped movable electrode 1
4 (14a, 14b) and a comb-shaped fixed electrode portion 15
(15a, 15b).

[0005] The vibrating body support fixing portion 10 (10a, 10b,
10c, 10d) and the electrode support fixing portion 11 (11a, 11
b) and the detection electrode pad forming section 12 are fixed to the base 2 and the lid 4 by anodic bonding. The vibrating body 7 has a beam 13 (1
3a, 13b, 13c, 13d) are connected to the vibrating body supporting and fixing portions 10 (10a, 10b, 10c, 10d), respectively. Further, a comb-shaped movable electrode portion 14 (14a, 14b) is formed to protrude from the edge of the vibrating body 7 along the X direction. The fixed electrode portion 15 (15) having a comb shape is meshed with the movable electrode portion 14 with an interval.
a, 15b) are the electrode support fixing portions 11 (11a, 11b)
, And extend in the X direction.

The recesses 2a, 4a of the base 2 and the cover 4 are respectively provided with the vibrating body 7 and the beams 13 (13a, 13b, 13c, 13c).
13d) and the movable electrode portion 14 (14a, 14b). These recesses 2a,
4a, the vibrating body 7 and the beam 13 (13a, 13b, 1)
3c, 13d) and the movable electrode portion 14 (14a, 14b) are in a state of being floating with respect to the base 2 and the lid portion 4 and are movable.

[0007] The vibrating body support fixing portion 10 (10a, 10b,
10c, 10d) and the electrode support fixing part 11 (11a, 11
An electrode pad (not shown), which is a metal film, is formed on each of the upper surfaces of b) and the detection electrode pad formation section 12. Through holes (not shown) are formed in the cover 4 at positions corresponding to the respective electrode pads, whereby each electrode pad can be electrically connected to an external circuit.

On the bottom surface of the concave portion 2a of the base 2, a detecting electrode portion (not shown) is formed at a portion opposed to the vibrating body 7 with a space therebetween. Further, the base 2 is formed with a wiring pattern 16 for electrically connecting the detection electrode portion and the detection electrode pad formation portion 12.

In the sensor section 8 of this embodiment, for example, when an AC circuit for driving is applied to the fixed electrode sections 15a and 15b from an external circuit, between the fixed electrode section 15a and the movable electrode section 14a, the fixed electrode section The electrostatic force generated between the movable electrode 15b and the movable electrode portion 14b changes according to the AC voltage, and
Drive vibration in the direction. When the vibrating body 7 is rotated around the Y axis in a state where the vibrating body 7 is vibrating, a Coriolis force in the Z direction is generated. This Coriolis force is applied to the vibrating body 7, which vibrates in the Z direction.

Due to the vibration of the vibrating body 7 in the Z direction, the distance between the vibrating body 7 and the detecting electrode changes, and the capacitance between the vibrating body 7 and the detecting electrode changes. The change in the capacitance is taken out from the detection electrode portion through the wiring pattern 16 and the electrode pad to the outside, and based on the detected value,
The magnitude of the angular velocity of rotation around the Y axis can be detected.

An example of a manufacturing process of the angular velocity sensor 1 will be described below with reference to FIG. In FIG. 8, a portion corresponding to the AA portion shown in FIG. 7 is shown by a cross section.

First, a base making substrate for forming a plurality of bases 2 is prepared, and as shown in FIG. Each time, the concave portion 2a is formed. Then, a detection electrode portion and a wiring pattern 16 are formed on the inner peripheral surface of each concave portion 2a by using a film formation technique such as sputtering.

Next, as shown in FIG. 8 (b), a semiconductor substrate 21 is anodically bonded to the upper side of the base manufacturing substrate 20 so as to cover the openings of the recesses 2a. Then, FIG.
As shown in FIG. 2, the semiconductor substrate 21 is thinned to a set thickness by, for example, surface grinding, and then the semiconductor substrate 2
1 is mirror polished.

Thereafter, as shown in FIG. 8D, a mold pattern 22 made of a photoresist is formed on the upper surface of the semiconductor substrate 21 by using photolithography. The mold pattern 22 is a mold for processing a semiconductor substrate that determines a processing target position of the semiconductor substrate 21. This pattern 2
2 has a form in which a plurality of patterns of the sensor section 8 and the seal section 9 of the semiconductor section 3 are arranged as shown in FIG.

Then, as shown in FIG. 8E, the semiconductor substrate 21 is processed based on the pattern 22 by etching or the like. Thereby, the sensor section 8 and the seal section 9 of the semiconductor section 3 can be formed. In the previous step of forming the pattern 22, the positioning of the pattern 22 is determined so that the vibrating body 7 of the sensor unit 8 thus formed is disposed above the recess 2 a of the base 20. ing.

Next, as shown in FIG. 8F, the mold pattern 22 is removed from the upper surface of the semiconductor substrate 21 using, for example, a mixture of sulfuric acid and hydrogen peroxide. And the semiconductor substrate 2
An electrode pad or the like is formed on the upper surface of the substrate 1 by a thin film forming technique such as sputtering.

Thereafter, as shown in FIG. 8 (g), a lid-forming substrate 23 is anodic-bonded to the upper side of the semiconductor substrate 21 in a vacuum chamber in which evacuation is performed. The lid manufacturing substrate 23 forms a plurality of lids 4. The lid manufacturing substrate 23 has a recess 4a and a plurality of through holes (not shown) formed in advance for each lid forming region. Have been.
When the lid manufacturing substrate 23 is joined to the upper side of the semiconductor substrate 21, each of the recesses 4a faces the corresponding vibrator 7 with a space therebetween, and the plurality of through holes respectively correspond to the corresponding vibrators. The support fixing part 10 (10a, 10b,
10c, 10d) and the electrode support fixing portion 11 (11a, 11d).
b) and the position of the electrode pad formed on the upper surface of the detection electrode pad formation portion 12 is aligned.

Thus, the plurality of angular velocity sensors 1 are formed inside the joined body of the base manufacturing substrate 20, the semiconductor substrate 21, and the lid manufacturing substrate 23. Thereafter, the joined body is cut along a dicing line L as shown in FIG. 8 (h), and a plurality of angular velocity sensors 1 are cut out. Thus, the angular velocity sensor 1 can be manufactured.

[0019]

In the process of manufacturing such an angular velocity sensor 1, when forming the mold pattern 22 on the upper surface of the semiconductor substrate 21, as described above, It is necessary to determine the position of the mold pattern 22 based on the formation position of the concave portion 2a. However, the concave portion 2 a of the base manufacturing substrate 20 is hidden by the semiconductor substrate 21, and the formation position of the concave portion 2 a of the base manufacturing substrate 20 cannot be seen from the upper surface side of the semiconductor substrate 21. For this reason, a special device called a double-sided mask aligner has been used when positioning the arrangement of the pattern 22.

However, since the double-sided mask aligner is not a general device, it is expensive.
The equipment cost is increased, and the manufacturing cost of the angular velocity sensor 1 is increased. This is one of the factors preventing the price reduction of the angular velocity sensor 1.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method of manufacturing an electronic component which can promote the cost reduction of an electronic component such as an angular velocity sensor. is there.

[0022]

Means for Solving the Problems In order to achieve the above object, the present invention has the following structure to solve the above problems. That is, in the first invention, after processing at least the upper surface of the first substrate, the second substrate is bonded to the upper surface of the first substrate, and then the second substrate based on the processing position of the first substrate is processed. In the method of manufacturing the electronic component by processing the processing target portion of the first substrate from the upper surface side of the second substrate, when the first substrate and the second substrate are joined, a part of the upper surface of the first substrate Is formed on the exposed upper surface portion of the first substrate, a positioning mark for determining a processing position of the first substrate is formed, and the first substrate and the second substrate are formed. After the bonding, the second substrate is processed by determining a processing target position of the second substrate from the upper surface side of the second substrate using the positioning mark.

A second invention comprises the configuration of the first invention,
The positioning mark is formed by a concave portion.

A third aspect of the present invention includes the configuration of the first aspect of the present invention,
The positioning mark is formed by a film pattern.

According to a fourth aspect of the present invention, there is provided the configuration according to the first, second, or third aspect, wherein after processing the second substrate, the joined body of the first substrate and the second substrate is divided into a plurality of parts. It is characterized by producing electronic components.

According to a fifth aspect of the present invention, there is provided the configuration of any one of the first to fourth aspects, wherein the first substrate is a glass substrate, and the second substrate is a semiconductor substrate. , The first substrate and the second substrate are bonded by an anodic bonding method.

According to a sixth aspect of the present invention, there is provided the configuration of any one of the first to fifth aspects of the present invention, wherein the second substrate is arranged on the upper surface of the first substrate. The position of the second substrate is determined based on the positioning mark.

According to the present invention, when the first substrate and the second substrate are bonded, a part of the upper surface of the first substrate is exposed, and the exposed upper surface of the first substrate is provided on the first substrate. A positioning mark for determining the processing position of one substrate is formed in advance. By using this positioning mark, the processing target position of the second substrate based on the processing position of the first substrate from the upper surface side of the second substrate without using a special device such as a double-sided mask aligner device. Can be determined.

As described above, since it is not necessary to use the double-sided mask aligner, it is possible to suppress an increase in equipment cost, and to suppress a manufacturing cost of electronic components.
As a result, it is possible to promote the cost reduction of electronic components.

[0030]

Embodiments of the present invention will be described below with reference to the drawings.

In this embodiment, an example of a method of manufacturing an electronic component will be described using the angular velocity sensor 1 shown in FIGS. 6 and 7 as an example. Since the configuration of the angular velocity sensor 1 has been described above, a duplicate description thereof will be omitted.

The method of manufacturing the angular velocity sensor 1 in this embodiment is substantially the same as the method of manufacturing the angular velocity sensor 1 shown in the conventional example, except that the first After bonding the semiconductor substrate 21 which is the second substrate, the method of positioning the arrangement of the mold pattern 22 that determines the processing target position of the semiconductor substrate 21 is a feature different from the conventional example.

In this embodiment, when the angular velocity sensor 1 is manufactured, a base manufacturing substrate (for example, a glass substrate) 20 as shown in FIGS. 2A and 2B and a semiconductor substrate (for example, (A silicon substrate) 21 is used. The base manufacturing substrate 20 and the semiconductor substrate 21 are both substantially circular, and the diameter of the base manufacturing substrate 20 is larger than the diameter of the semiconductor substrate 21. The semiconductor substrate 21 has a positioning notch 31 (31a, 31b) in addition to the notch 30 indicating the crystal orientation.

In this embodiment, the substrate 20
When the semiconductor substrate 21 is bonded to the upper surface of the substrate 20, the semiconductor substrate 21 is disposed on the upper surface of the base manufacturing substrate 20 such that the center O 'of the semiconductor substrate 21 substantially coincides with the center O of the base manufacturing substrate 20. . At this time, the base manufacturing substrate 20 is a semiconductor substrate 21
Therefore, the edge portion of the base manufacturing substrate 20 is exposed without being hidden by the semiconductor substrate 21. A positioning recess 33 (33a, 33b), which is a positioning mark, is formed on the exposed upper surface of the base manufacturing substrate 20.

In this embodiment, the positioning recess 33 is used.
As shown in the cross-sectional view of the base manufacturing substrate 20 in FIG.
The distance D between the edge of the concave portion 2a and the edge of the concave portion 2a is predetermined. Thus, even if the semiconductor substrate 21 is arranged on the concave portion 2a of the base manufacturing substrate 20 and the processing position of the concave portion 2a cannot be seen from the upper surface side of the semiconductor substrate 21, the positioning concave portion 33 is used. The processing position of the concave portion 2a of the base manufacturing substrate 20 can be determined.

The positioning recesses 33 (33a, 33a,
33b) is the semiconductor substrate 21 when the base manufacturing substrate 20 and the semiconductor substrate 21 are overlapped with their center positions substantially coincident with each other.
Along the edge of the positioning notch 31 (31a, 31b) and the positioning notch 31 (31
a, 31b). For this reason, the positioning notches 31a and 31b of the semiconductor substrate 21 almost coincide with the edges of the positioning recesses 33a and 33b of the base manufacturing substrate 20, respectively.
By arranging the semiconductor substrate 21 on the upper surface of the base manufacturing substrate 20, it is possible to arrange the semiconductor substrate 21 on the upper surface of the base manufacturing substrate 20 so that their respective center positions substantially coincide with each other. Thus, the positioning recesses 33
By using a and 33b, the arrangement position of the semiconductor substrate 21 with respect to the base manufacturing substrate 20 can be easily determined.

Conventionally, both the base manufacturing substrate 20 and the semiconductor substrate 21 are generally circular and have the same size in many cases, and the diameter and the width H of the notch 30 (32) are often large.
Standards for dimensions such as are defined. For this reason, there are many electronic device manufacturing apparatuses manufactured based on the standard. In this embodiment, the dimensions of the base manufacturing substrate 20 and the semiconductor substrate 21 are not particularly limited, but in consideration of using a conventionally used manufacturing apparatus, the base manufacturing substrate 20 It is preferable that the dimensions of the semiconductor substrate 21 be substantially the same as the standard.

An example of a method of manufacturing an angular velocity sensor using such a base manufacturing substrate 20 and a semiconductor substrate 21 will be described with reference to FIG. In FIG. 1, A-
A portion corresponding to the portion A is shown by a cross section.

First, as shown in FIG. 1A, a concave portion 2a is formed on the upper surface of the base manufacturing substrate 20 by using, for example, a sandblasting method. At this time, the positioning recesses 33 (33a, 33b) are formed simultaneously with the formation of the recesses 2a. Thus, the position of the positioning recess 33 with respect to the recess 2a can be precisely designed as designed.

Next, as shown in FIG. 1B, positioning recesses 33 (33a, 33a,
33b) and the positioning notch 3 of the semiconductor substrate 21
1 (31a, 31b) and the base-fabricating substrate 2
Anodic bonding is performed on the upper surface of the semiconductor substrate 21 so that the center position of the semiconductor substrate 21 is substantially aligned. Then, as shown in FIG. 1C, the semiconductor substrate 21 is thinned to a set thickness by, for example, a plane cutting method, and then the upper surface of the semiconductor substrate 21 is mirror-polished.

Next, as shown in FIG. 1D, a pattern 22 is formed on the upper surface of the semiconductor substrate 21 by photolithography. At this time, the positioning of the arrangement of the mold pattern 22 is performed using the positioning concave portions 33 (33a, 33b) of the base manufacturing substrate 20 from the upper surface side of the semiconductor substrate 21 without using a double-sided mask aligner device. .
Thus, by forming the mold pattern 22,
The processing target position of the semiconductor substrate 21 is determined.

Thereafter, as shown in FIG. 1E, the semiconductor substrate 21 is processed on the basis of the mold pattern 22 and the semiconductor portion 3 having the sensor portion 8 and the seal portion 9 is formed as shown in FIG. 21 are formed. Thereafter, as shown in FIG.
Is removed by, for example, a mixture of sulfuric acid and hydrogen peroxide solution.

Then, as shown in FIG. 1 (g), a lid-forming substrate 23 is anodically bonded to the upper surface of the semiconductor substrate 21.
In this embodiment, the lid manufacturing substrate 23 has the same shape and the same size as the semiconductor substrate 21, and the lid manufacturing substrate 23 substantially matches the semiconductor substrate 21. It is joined to the upper surface of. In addition, the concave part 4a and the through-hole (not shown) are previously formed in this lid part production substrate 23.

Thereafter, as shown in FIG. 1 (h), the joined body of the base manufacturing substrate 20, the semiconductor substrate 21, and the lid manufacturing substrate 23 is cut along the set dicing line L. Then, the plurality of angular velocity sensors 1 are cut out.
Thus, the angular velocity sensor 1 can be manufactured.

According to this embodiment, when the semiconductor substrate 21 is bonded to the upper surface of the base manufacturing substrate 20, a part of the upper surface of the base manufacturing substrate 20 is exposed. The positioning recesses 33 (33a, 33b) were formed in the exposed upper surface portion of the use substrate 20. The positioning recess 33 is formed at a predetermined distance from the recess 2 a of the base manufacturing substrate 20. Therefore, when forming the mold pattern 22 on the upper surface of the semiconductor substrate 21, the positioning of the mold pattern 22 is performed from the upper surface side of the semiconductor substrate 21 using the positioning recess 33 without using a double-sided mask aligner. Can be performed, and the processing target position of the semiconductor substrate 21 can be determined.

As described above, since it is not necessary to use the double-sided mask aligner, it is possible to suppress an increase in equipment cost and to suppress a manufacturing cost of the angular velocity sensor 1. Thereby, the price reduction of the angular velocity sensor 1 can be promoted.

In this embodiment, since the positioning recess 33 is formed at the same time as the recess 2a is formed in the base manufacturing substrate 20, a separate step for forming the positioning recess 33 is required. There is no. In addition, recess 2
Since the formation position of the positioning concave portion 33 with respect to a can be accurately set as designed, the positioning of the arrangement of the mold pattern 22 can be performed with high accuracy.

It should be noted that the present invention is not limited to this embodiment, but can adopt various embodiments. For example, in this embodiment, the positioning mark formed on the exposed upper surface of the base manufacturing substrate 20 is in the form of a concave portion, but this positioning mark is formed on the upper surface of the base manufacturing substrate 20. It may be in the form of a formed film pattern (for example, a pattern of a metal film such as gold or aluminum).

Further, in this embodiment, the base manufacturing substrate 20 is larger than the semiconductor substrate 21, so that when the semiconductor substrate 21 is superimposed on the upper surface of the base manufacturing substrate 20, Although a part of the upper surface of the substrate 20 is exposed, for example, the base manufacturing substrate 20 and the semiconductor substrate 21 may have the same shape and the same size.
In this case, as shown in FIG.
And the semiconductor substrate 21, a part of the upper surface of the base manufacturing substrate 20 can be exposed.

Further, the base manufacturing substrate 20 and the semiconductor substrate 21 need not be substantially circular, and for example, the base manufacturing substrate 20 and the semiconductor substrate 21 may be rectangular as shown in FIG. In this case, when bonding the semiconductor substrate 21 to the upper surface of the base manufacturing substrate 20, the base manufacturing substrate 20
The semiconductor substrate 21 is arranged on the base manufacturing substrate 20 such that the longitudinal direction α of the semiconductor substrate 21 and the longitudinal direction β of the semiconductor substrate 21 intersect (orthogonal in the example of FIG. 4). Even when the size of the manufacturing substrate 20 and the size of the semiconductor substrate 21 are equal, a part of the upper surface of the base manufacturing substrate 20 can be exposed.

Further, as shown in FIG. 5, when the base manufacturing substrate 20 and the semiconductor substrate 21 are joined, the notch 32 of the base manufacturing substrate 20 and the notch 30 of the semiconductor substrate 21 Is made different, a part of the upper surface of the base manufacturing substrate 20 can be exposed.

Further, the base manufacturing substrate 20 and the semiconductor substrate 21 may have different shapes. Again, in this case,
Of course, when the semiconductor substrate 21 is bonded to the base manufacturing substrate 20, a part of the upper surface of the base manufacturing substrate 20 is exposed.

Further, in this embodiment, when the semiconductor substrate 21 is arranged on the upper surface of the base manufacturing substrate 20, the positioning recess 33 is used to position the semiconductor substrate 21 relative to the base manufacturing substrate 20. However, the arrangement of the semiconductor substrate 21 with respect to the base manufacturing substrate 20 may be determined by other means without using the positioning recess 33. In this case, for example, the positioning recess 33 can be formed without being restricted by the formation position of the notch 31 of the semiconductor substrate 21.

In this embodiment, the angular velocity sensor 1 has been described as an example. However, the present invention can be applied to the manufacture of electronic components other than the angular velocity sensor. Further, in this embodiment, a base manufacturing substrate (first substrate) 20 which is a glass substrate and a semiconductor substrate (second substrate)
The substrate 21 was bonded by the anodic bonding method, but the constituent materials of the first substrate and the second substrate are appropriately set according to the type of the electronic component. Therefore, the bonding method of the substrates may be appropriately set, and is not limited to the anodic bonding method.
Furthermore, in this embodiment, after the first substrate and the second substrate are joined, the joined body is divided to produce a plurality of electronic components. However, the present invention provides the first substrate and the second substrate. The present invention can also be applied to the case where one electronic component is produced by bonding substrates of the above.

[0055]

According to the present invention, when joining the first substrate and the second substrate, a part of the upper surface of the first substrate is exposed, and the upper surface of the first substrate is exposed. A positioning mark for determining a processing position of the first substrate was formed in the portion. Accordingly, the first substrate and the second substrate are joined, and even if the processed portion on the upper surface of the first substrate cannot be seen from the upper surface side of the second substrate, the positioning mark is used to make use of the positioning mark. From the upper surface side of the second substrate,
The processing target position of the second substrate can be determined based on the processing position of the substrate.

Therefore, when determining the processing target position of the second substrate, it is not necessary to use a special device such as a double-sided mask aligner. As a result, an increase in equipment cost can be suppressed, and the manufacturing cost of electronic components can be reduced. Therefore, the cost reduction of the electronic component can be promoted.

In the case where the positioning mark is a concave portion or a film pattern, when processing the upper surface of the first substrate, the concave portion or the film pattern as the positioning mark may be formed simultaneously with the processing. it can. This eliminates the need to provide a separate step for forming the positioning mark. In addition, the positional relationship between the processed portion on the upper surface of the first substrate and the positioning mark can be almost exactly as designed, and the positioning mark is used to determine the positional relationship based on the processed position of the first substrate. In addition, the processing target position of the second substrate can be accurately determined.

In the case of manufacturing a plurality of electronic components by dividing the joined body of the first substrate and the second substrate, the electronic components are very small, and the processing of the first substrate and the second substrate is performed. Is very fine, and the positioning of the processing target position on the second substrate is required to be very high precision. In such a case, the positioning mark is used for the second processing. The processing target position of the substrate can be accurately determined in accordance with the processing position of the first substrate.

In the case where the first substrate and the second substrate are joined by the anodic bonding method, the first substrate and the second substrate can be firmly joined.

When positioning the second substrate on the upper surface of the first substrate, the position of the second substrate relative to the first substrate is determined based on the positioning mark.
Thus, the position of the second substrate with respect to the first substrate can be easily determined.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining an embodiment of a method for manufacturing an electronic component according to the present invention.

FIG. 2 is a diagram for explaining a base manufacturing substrate (first substrate) and a semiconductor substrate (second substrate) used in the embodiment.

FIG. 3 is a diagram for explaining another embodiment.

FIG. 4 is a diagram for explaining still another embodiment.

FIG. 5 is a diagram for explaining still another embodiment.

FIG. 6 is a model diagram schematically showing a cross-sectional configuration example of an angular velocity sensor which is one example of an electronic component.

FIG. 7 is a model diagram schematically illustrating an example of main components of the angular velocity sensor.

FIG. 8 is an explanatory view showing an example of a conventional electronic component manufacturing method.

[Explanation of symbols]

 Reference Signs List 1 angular velocity sensor 20 base manufacturing substrate 21 semiconductor substrate 33 positioning recess

Claims (6)

[Claims] After processing at least the upper surface of the first substrate, a second substrate is bonded to the upper surface of the first substrate, and then the second substrate is processed based on the processing position of the first substrate. In a method of manufacturing an electronic component by processing a processing target portion from an upper surface side of a second substrate, when bonding the first substrate and the second substrate, a part of the upper surface of the first substrate is exposed. In a mode, a positioning mark for determining a processing position of the first substrate is formed on an exposed upper surface portion of the first substrate, and after the first substrate and the second substrate are joined, ,
A method for manufacturing an electronic component, wherein a processing target position of the second substrate is determined from the upper surface side of the second substrate using the positioning mark, and the second substrate is processed. 2. The method according to claim 1, wherein the positioning mark is formed by a concave portion. 3. The method according to claim 1, wherein the positioning mark is formed by a film pattern. 4. The method according to claim 1, wherein after processing the second substrate, a plurality of electronic components are produced by dividing a joined body of the first substrate and the second substrate. Item 4. A method for manufacturing an electronic component according to Item 3. 5. The method according to claim 1, wherein the first substrate is a glass substrate, the second substrate is a semiconductor substrate, and the first substrate and the second substrate are bonded by an anodic bonding method. A method for manufacturing an electronic component according to claim 1. 6. The method according to claim 1, wherein when arranging the second substrate on the upper surface of the first substrate, an arrangement position of the second substrate with respect to the first substrate is determined based on a positioning mark. A method for manufacturing an electronic component according to claim 1.