JP2002363487A - Methods for producing heat resistant and moisture proof insulating coating material and insulation-processed electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a heat resistant and moisture proof insulating coating material capable of obtaining electronic parts excellent in heat resistance without reducing flexibility of its coating film even when heated and deteriorated at a high temperature and insulation-treated in high reliability. SOLUTION: The heat resistant and moisture proof insulating coating material comprises a polymer obtained by reacting a hydrogenated product of a hydroxy group-containing polyisoprene with a polyisocyanate, and a solvent. The method for producing electronic parts is to use this heat resistant and moisture proof insulating coating material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a moisture-proof insulating paint excellent in heat resistance suitable for insulating electronic components, an insulated electronic component, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Electrical devices tend to be smaller and lighter and have more functions year by year. Circuit boards mounted on various types of electrical devices for controlling the devices are required to be insulated for protection from moisture, dust, gas, and the like. Is being done. In this insulation treatment method, a protective coating treatment with a paint such as an acrylic resin or a silicone resin is widely adopted. Such a mounted circuit board is used under a severe environment, particularly under a high humidity, and is used by being mounted on, for example, a machine such as a washing machine and an automobile. However, the acrylic resin paint has a heat resistance of 80 to 100 ° C., loses flexibility after heat deterioration, and its use in applications requiring heat resistance has been limited. On the other hand, silicone resin paint has excellent heat resistance,
Although the flexibility after heat deterioration is good, the material price is high, and the coating is covered with the coating, gelling occurs, and there is a problem in workability.

[0003]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and is suitable for moisture-proof insulation and the like, and is excellent in heat resistance. It provides a manufacturing method.

[0004]

The present invention relates to the following. (1) (a) Hydroxide of hydroxyl group-containing polyisoprene 1
00 parts by weight, a polymer obtained by reacting (b) a polyisocyanate at a ratio of 0.7 to 1.0 mol with respect to 1 mol of a hydroxyl group in (a) and (c) a solvent 10 to 10 mol. A heat-resistant and moisture-proof insulating paint containing 1000 parts by weight. (2) at least one additive selected from a filler, a modifier, an antifoaming agent, a coloring agent, and an adhesive agent;
The heat-resistant and moisture-proof insulating paint according to (1), comprising a seed. (3) An electronic component insulated using the heat-resistant and moisture-proof insulating paint according to (1) or (2). (4) The method for producing an insulated electronic component according to claim 3, wherein the heat-resistant and moisture-proof insulating coating according to (1) or (2) is applied to the electronic component and dried.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The hydride of (a) a hydroxyl group-containing polyisoprene used in the present invention has a hydroxyl group in a molecule or at a molecular terminal, and has a number average molecular weight of usually 500 to 10,
000, preferably in the range of 1,000 to 5,000. As this commercially available product, for example, Epole (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.) can be mentioned.

The polyisocyanate (b) used in the present invention is an isocyanate compound having two or more isocyanate groups in one molecule. Triphenylmethane diisocyanate, hexamethylene diisocyanate,
3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanatoethyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanatoethyl-3,5,5-triethylcyclohexyl isocyanate, diphenylpropane diisocyanate, phenylene Polyisocyanates such as diisocyanate, cyclohexylylene diisocyanate, 3,3'-diisocyanate propyl ether, triphenylmethane triisocyanate, and diphenyl ether-4,4'-diisocyanate; Phenols, oximes, imides, mercapta , Alcohols, ε-caprolactam, ethylene imine, α-pyrrolidone, diethyl malonate, sodium bisulfite, compounds blocked with boric acid, etc. And the like.

The polyisocyanate of the component (b) of the present invention is reacted with the component (a) at a ratio such that the isocyanate group is in the range of 0.7 to 1.0 mol per 1 mol of the hydroxyl group of the component (a). When the amount of the isocyanate group exceeds 1.0 mol, the isocyanate group remains, which is not preferable in terms of the stability of the coating. When the amount is less than 0.7 mol, the molecular weight does not increase.

The solvent (c) used in the present invention includes ketone solvents such as acetone and methyl ethyl ketone, toluene,
Aromatic solvents such as xylene, ester solvents such as ethyl acetate and butyl acetate, alcohol solvents such as ethanol and butanol, paraffin solvents such as paraffin oil and naphthenic oil, and petroleum solvents such as mineral terpenes and naphtha. is there.

The amount of the solvent as the component (c) is determined depending on the viscosity of the coating material in relation to the workability, and is 10 to 1000 parts by weight based on 100 parts by weight of the hydrogenated polyisoprene (a). Parts, preferably 20 to 500 parts by weight.

In the present invention, a filler, a modifying agent, an antifoaming agent, a coloring agent, an adhesion-imparting agent, and the like can be optionally added to the paint, if necessary.

Examples of the filler include fine powdered silicon oxide, magnesium oxide, aluminum hydroxide, calcium carbonate and the like. Usually, (a) 0.01 to 100 parts by weight based on 100 parts by weight of the hydride of hydroxyl group-containing polyisoprene. Parts can be added.

As the modifier, for example, organic acid metal salts such as manganese naphthenate and manganese octenoate can be used to improve the drying property. Usually, 0.01 to 10 parts by weight is added to 100 parts by weight of the coating material. can do.

Examples of the antifoaming agent include known antifoaming agents such as silicone oil, fluorine oil, and polycarboxylic acid polymer.
001 to 5 parts by weight can be added.

Examples of the colorant include known inorganic pigments, organic pigments, and organic dyes, each of which is blended according to a desired color tone. These may be used in combination of two or more. Usually, the addition amount of these pigments and dyes can be 0.01 to 50 parts by weight based on 100 parts by weight of the paint.

As the tackifier, it is easily dissolved in a solvent and preferably has a solid softening point at room temperature of 50 to 180 ° C.
More preferably, a hydrogenated rosin-based resin at 60 to 170 ° C., an alicyclic saturated hydrocarbon resin, and the like are mentioned. Usually, (a) 10 to 100 parts by weight is added to 100 parts by weight of a hydride of a hydroxyl group-containing polyisoprene. be able to.

The electronic parts insulated by using the heat-resistant and moisture-proof insulating paint according to the present invention include microcomputers, transistors,
Examples include a capacitor, a resistor, a relay, a transformer, and a mounted circuit board on which these are mounted, and may further include a lead wire, a harness, a film substrate, and the like bonded to these electronic components.

As a method for producing an electronic component to be insulated by using the heat-resistant and moisture-proof insulating coating according to the present invention, the coating can be obtained by a generally known method such as an immersion method, a brush coating method, a spraying method and a wire drawing coating method. May be applied to the electronic component and dried.

[0018]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. In the present invention,
Unless otherwise specified, "parts" indicate parts by weight.

Comparative Example 1 214 parts of butyl methacrylate, 25 parts of butyl acrylate
And 150 parts of toluene were added to a 1-liter four-necked flask, and heated to 90 ° C. while passing nitrogen gas to keep the temperature. Polymerization was promoted while a solution obtained by mixing and dissolving 200 parts of butyl methacrylate, 21 parts of butyl acrylate, and 3 parts of azobisisobutyronitrile was dropped in 2 hours. Thereafter, the temperature was raised to 110 ° C., and the temperature was maintained for 2 hours to complete the polymerization. After cooling, the temperature reached 50 ° C., and 200 parts of toluene was added thereto.
The mixture was stirred for 0 minutes to obtain a uniform solution varnish A.

Comparative Example 2 In a 1 liter four-necked flask, 281 parts of G-2000 (trade name, manufactured by Nippon Soda Co., hydroxyl group-containing polybutadiene), 280 parts of xylene, and 40 parts of tolylene diisocyanate were mixed and stirred at 70 ° C. for 3 hours. Reacted. Thereafter, the synthesis temperature was lowered to 50 ° C., and 100 parts of ethyl alcohol was added, and the temperature was lowered to 50 ° C.
For 1 hour to obtain Varnish B.

Example 1 Epol (trade name, manufactured by Idemitsu Petrochemical Co., hydride of hydroxyl group-containing polyisoprene) 2 was placed in a 1-liter four-necked flask.
80 parts, 280 parts of xylene and 40 parts of tolylene diisocyanate were mixed and stirred and reacted at 70 ° C. for 3 hours. Thereafter, the synthesis temperature was lowered to 50 ° C., 100 parts of ethyl alcohol was added, and the mixture was reacted at 50 ° C. for 1 hour to obtain Varnish C.

Example 2 Varnish C obtained in Example 1 was placed in a 1-liter four-necked flask.
250 parts, hydrogenated rosin-based resin (softening point: 80 ° C., trade name, manufactured by Arakawa Chemical Industries, ester gum HP), and 210 parts of toluene were added, and the mixture was stirred at room temperature to obtain a uniform solution varnish D.

The varnishes A to E obtained above were used for a tin plate (50 × 180 × 0.25
mm), a copper plate (50 × 100 ×
1.6 mm), and dried at 80 ° C. for 2 hours.
A coating film of μm was formed. Next, the coating film was left in a thermostat at 125 ° C., and the pencil hardness, flexibility and adhesion to copper were measured at each time. Table 1 shows the results.

[0024]

[Table 1]

[0025]

The coating film of the heat-resistant and moisture-proof insulating coating of the present invention comprises:
Even if it is degraded by heating at a high temperature, its flexibility does not decrease and its heat resistance is excellent, so that a highly reliable insulated electronic component can be obtained.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09D 5/25 C09D 5/25 201/00 201/00 F-term (Reference) 4D075 CA03 CA13 CA18 CA23 CA40 DA06 DB05 DB06 DC19 DC21 EA07 EB08 EB38 EB56 EC11 EC13 EC30 EC35 EC54 EC60 4J034 BA03 DA01 DB03 DB07 DP06 DP19 HA01 HA06 HA07 HA08 HC03 HC08 HC12 HC13 HC17 HC22 HC34 HC35 HC46 HC52 HC61 HC64 HC65 HC67 HC68 HC70 HC71 HC73 HD03 HD04 HD05 HD05 HD06 HD05 QA03 QB06 QC05 RA07 RA14 4J038 BA231 BA232 CR011 CR012 DG191 DG192 DG261 DG262 DG301 DG302 HA166 HA286 HA446 KA04 KA06 KA08 KA09 NA04 NA12 NA21 PB09

Claims (4)

[Claims] (1) 100 parts by weight of a hydride of a hydroxyl group-containing polyisoprene, and (b) a polyisocyanate of (a)
Isocyanate group is 0.7 to 1 mole of hydroxyl group of
A heat-resistant and moisture-proof insulating coating composition comprising a polymer obtained by reacting at a ratio of 1.0 mol and (c) 10 to 1000 parts by weight of a solvent. 2. The heat-resistant and moisture-proof insulating coating according to claim 1, further comprising at least one selected from additives consisting of a filler, a modifier, an antifoaming agent, a coloring agent and an adhesion-imparting agent. 3. An electronic component which has been insulated using the heat-resistant and moisture-proof insulating paint according to claim 1. 4. The method for producing an insulated electronic component according to claim 3, wherein the heat-resistant and moisture-proof insulating coating according to claim 1 or 2 is applied to the electronic component and dried.