JP2002361507A - Blind hole drilling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a blind hole drilling method excellent in working performance and hole depth precision. SOLUTION: Z coordinate values of a plural number of points of a work 1 are measured in advance of working, and X coordinate values, Y coordinate values and the Z coordinate values of corresponding positions are memorized for each of the positions with the measured positions as the previously measured positions. Blind holes are worked at corresponding working positions after confirming that a difference of the Z coordinate values found at the working positions and the Z coordinate values at the previously measured positions a distance in the XY direction of which is near to the working positions is within a previously specified range at the time of working, and the corresponding working positions are added to the previously measured positions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a blind hole machining method for determining a Z coordinate value in a thickness direction of an upper surface of a work at a machining position and machining a blind hole based on the obtained Z coordinate value.

[0002]

2. Description of the Related Art Japanese Patent Laying-Open No. 9-277140 discloses, as a first aspect, a table on which a printed circuit board is mounted, a support disposed opposite to the table, and a rotation supported by the support. A spindle, a drill attached to the tip of the spindle, a board holding plate connected to the support via a cylinder, and a lowering of the support to bring the tip of the board holding plate to the surface of the printed circuit board. Using a drilling machine with a sensor that detects this when it comes into contact with
Detecting the surface height of the printed circuit board at the scheduled drilling position, calculating the average value of the surface height of each drilling position going back a predetermined number in order from the drilling position immediately before the drilling scheduled position, The surface height of the drilling position is compared with the average value, and when the difference between the two is less than a predetermined value, drilling is performed and the hole is moved to the next scheduled drilling position, and the difference between the two is equal to or more than a predetermined value. A method of boring a printed circuit board, which sometimes stops processing, is disclosed.

According to a second aspect of the present invention, the printed circuit board is divided into a plurality of areas, the predetermined value is determined in advance for each area, and a difference between a surface height of a scheduled drilling position and the average value is compared. A method for boring a printed circuit board is disclosed in which a predetermined value of an area to which the scheduled drilling position belongs is used as the value.

[0004] In the above technique, each time the hole is moved to the drilling position, it is determined whether or not the difference between the surface height at that position and the average value of the surface heights, which are traced N times from immediately before, is less than a predetermined value. In addition, it was possible to prevent drilling in a state where dust or the like was interposed between the tip of the board holding plate and the surface of the printed board. In addition, by performing processing in consideration of the undulation and thickness unevenness of the printed circuit board, unnecessary stoppage of the machine could be prevented.

[0005]

However, when a linear scale is used as a position detector, the life is shortened in a short time because the linear scale moves up and down as the drill moves. Further, for example, when the thickness of the printed board is gradually increased, it is not always appropriate to compare the surface height of the printed board at the processing position with the average value of a predetermined number of immediately preceding surface heights. Was. Further, in order to improve the processing accuracy, it is necessary to reduce the area, and the processing efficiency is reduced.

The applicant of the present application has filed Japanese Patent Application No. 2000-16.
In No. 3681, the tool is held on a rotatable rotor shaft with a high ground resistance, the work is insulated from the ground, and the tip voltage of the tool is detected by measuring the shaft voltage generated on the rotor shaft through the work. A method of machining a workpiece characterized by the following is proposed. According to this processing method, since the tool itself is used as a sensor, the depth of the hole can be accurately processed. However, when conductive chips (hereinafter referred to as “chips”) generated during the processing adhere to the vicinity of the tip of the tool, and the chips come into contact with the workpiece before the tip of the tool, the chips are removed. As a result of misidentifying the end as the tool tip, the depth of the hole was sometimes reduced.

An object of the present invention is to solve the above-mentioned problems in the prior art and to provide a blind hole machining method which is excellent in machining efficiency and hole depth accuracy.

[0008]

In order to achieve the above-mentioned object, the present invention is directed to a method of forming a workpiece on an upper surface of a workpiece in a thickness direction at a processing position determined by an X coordinate value and a Y coordinate value in a direction perpendicular to the thickness. In the blind hole drilling method of drilling blind holes based on the obtained Z coordinate values and measuring the Z coordinate values at a plurality of positions of the work before machining, the measured positions are measured. As a position, the X coordinate value, the Y coordinate value, and the Z coordinate value of the position are stored for each position, and the Z coordinate value and XY obtained at the processing position during processing are stored.
After confirming that the difference in the directional distance from the Z coordinate value at the measured position close to the processing position is within a predetermined range, a blind hole is processed at the processing position, and the processing position is It is characterized in that it is added to the already measured position.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiment.

FIG. 1 is a flowchart showing a processing procedure of a blind hole processing method according to the present invention, FIG. 2 is a plan view of a work showing a measurement position, and FIG. 3 is a plan view of the work showing a processing position. is there.

First, prior to machining, after setting i = 0 (procedure S10 in FIG. 1), it is confirmed whether or not a measurement position is designated (procedure S20). If a measurement position is designated, processing in step S30 is performed. Is performed, and if there is no instruction for measurement, the process of step S50 is performed.

In step S30, the Z coordinate value Z1 in the thickness direction of the upper surface of the work 1 at the designated measurement position (here, position A1 in FIG. 2) is obtained, and the obtained coordinate value Z1 is obtained.
And the X coordinate value X1 and the Y coordinate value Y1 of the position are stored as the measured position (step S40). In this embodiment, four positions A1 to A4 are designated as measurement positions, and so on.
, The above operation is repeated. The measured position is
It is stored as shown in FIG.

In step S50, it is checked whether or not there is a processing instruction. If there is a processing instruction, the processing in step S60 is performed. If there is no processing instruction, the processing ends.

In step S60, the Z coordinate value Z5 in the thickness direction of the upper surface of the work 1 at the designated processing position (here, position A5 in FIG. 3) is obtained. Next, a measured position whose X and Y directions are closest to the position A5 is calculated (step S70). Here, A1 is calculated as the measured position as shown in FIG. Next, the difference α between the Z coordinate value Z5 and the Z coordinate value Z1 is obtained, and the absolute value of the difference α is compared with a predetermined allowable value β (step S80). If the absolute value of the difference α is equal to or smaller than the allowable value β, the process of step S90 is performed. If the absolute value of the difference α exceeds the allowable value β, the process proceeds to step S90.
Step 110 is performed.

In step S90, the Z coordinate value Z5 and the X coordinate value X
5 and the Y coordinate value Y5 are stored, that is, the position A5 is added to the measured position, and a blind hole is formed at the position A5 (step S100), and then the process of step S50 is performed.

In step S110, i = i + 1, and a predetermined number of repetition times n (here, n = 3) and i
(Step S120), and if i ≦ n, Step S6
The processing of 0 is performed, and if i> n, an alarm is displayed and the processing is stopped.

According to the above procedure, the machining position A shown in FIG.
6, the Z coordinate value Z6 of the measured position A5 closest to the machining position A6, and the Z coordinate value Z7 at the machining position A7 is the measured position A closest to the machining position A7.
2 and the Z coordinate value Z8 at the processing position A8 are compared with the Z coordinate value Z5 of the measured position A5 closest to the processing position A8.

As a result of processing the blind hole at the processing position in this way, even if the thickness of the printed circuit board is gradually increased, for example, a blind hole with excellent depth accuracy can be processed.

In particular, when an axial voltage generated on the rotor shaft is measured via a work, conductive chips attached to the tip of the tool often separate from the tip of the tool during the first Z coordinate measurement. When the absolute value of the difference α exceeds the allowable value β, the case where the machining is continued by measuring the Z coordinate again increases, and the workability can be improved.

In the above description, the Z coordinate value at the machining position is compared with the Z coordinate value at the measured position closest to the position. However, the Z coordinate value at one or more measured positions within a predetermined range is compared. You may make it compare with.

[0021]

As described above, according to the present invention,
Prior to machining, Z coordinate values at a plurality of positions of the work are measured, and the measured position is set as a measured position, and the X coordinate value, Y coordinate value, and Z coordinate value of the position are stored for each position. The distance between the Z coordinate value obtained in the position and the distance in the XY direction is Z at the measured position that is close to the processing position.
After confirming that the difference from the coordinate value is within a predetermined range, a blind hole is machined at the machining position, and the machining position is added to the measured position, so that a blind hole with excellent depth accuracy is provided. Can be processed.

[Brief description of the drawings]

FIG. 1 is a flowchart showing a processing procedure of a blind hole processing method according to the present invention.

FIG. 2 is a plan view of a work showing a measurement position.

FIG. 3 is a plan view of a workpiece showing a processing position.

FIG. 4 is a data storage image of a measured position.

[Explanation of symbols]

 1 Work A1 to A4 Measured position

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission Date] January 24, 2002 (2002.1.2
4)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction contents]

First, before the machining, the number of measurements i is set to 0 (step S10 in FIG. 1), and it is confirmed whether or not a measurement position is specified (step S20). Is performed, and if there is no measurement instruction, the process of step S50 is performed.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction contents]

In step S60, the Z coordinate value Z5 in the thickness direction of the upper surface of the work 1 at the designated processing position (here, position A5 in FIG. 3) is obtained. Next, a measured position whose X and Y directions are closest to the position A5 is calculated (step S70). Here, A1 is calculated as the measured position as shown in FIG. Next, the difference α between the Z coordinate value Z5 and the Z coordinate value Z1 is obtained, and the absolute value of the difference α is compared with a predetermined allowable value β (step S80). Then, when the absolute value of the difference α is equal to or smaller than the allowable value β, i = 0 is set.
S85), the process of step S90 is performed, and if the absolute value of the difference α exceeds the allowable value β, the process of step S110 is performed.

[Procedure amendment 3]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 4]

[Document name to be amended] Drawing

[Correction target item name] Figure 3

[Correction method] Change

[Correction contents]

FIG. 3

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuo Watanabe 2100 Kamiimaizumi, Ebina-shi, Kanagawa F-term in Hitachi Via Mechanics Co., Ltd. 3C036 DD13

Claims (2)

[Claims] At a working position determined by an X coordinate value and a Y coordinate value in a direction perpendicular to the plate thickness, a Z coordinate value in a plate thickness direction of an upper surface of a work is obtained, and a blind hole is determined based on the obtained Z coordinate value. In the blind hole drilling method, the Z coordinate values at a plurality of positions of the work are measured prior to the processing, and the measured position is set as the measured position, and the X coordinate value, the Y coordinate value, and the Z coordinate value of the position are determined for each position. The coordinate values are stored, and it is confirmed that the difference between the Z coordinate value obtained at the processing position during processing and the Z coordinate value at the measured position near the processing position in the XY direction is within a predetermined range. After the confirmation, a blind hole is formed at the processing position, and the processing position is added to the measured position. 2. The blind hole machining method according to claim 1, wherein the Z coordinate value to be compared with the Z coordinate value obtained at the machining position is the measured coordinate position closest to the machining position. .