JP2002350330A - Method and apparatus for measuring adhesion of thin film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measuring method and a measuring apparatus used for the method which are not limited by composition of a thin film, types of substrates and a mechanical vibration during measurement, etc., and can mea sure adhesion of the thin film having a thickness of the order of nanometers. SOLUTION: A base fixed to a support and having the thin film on a surface is placed in the vicinity of a scratching member attached to a lower face of a load adding mechanism. A loading member is mounted on an upper face of the load adding mechanism. The thin film and the scratching member are in a closely contacting state. The support or the load adding mechanism moves in the horizontal direction of the base. The thin film is scratched by the scratching member. The scratched surface of the thin film is analyzed. The adhesion of the thin film to the base is measured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring the adhesion of a thin film to a substrate and a measuring apparatus used for the method. The present invention relates to a measuring device used for the measuring method.

[0002]

2. Description of the Related Art For devices having a functional inorganic thin film such as a surface anti-reflection film and a surface anti-static film, a silane coupling agent, an aluminum-type coupling agent, A coupling agent such as a titanate-based coupling agent is applied. The coupling agent forms a chemical bond with the above-mentioned inorganic thin film at a monomolecular level, and forms a protective layer composed of a thin film having a thickness of about several nm. The adhesion of the protective layer to the inorganic thin film is
It is affected by the conditions for forming the protective layer. Therefore, in order to obtain a high adhesion, it is necessary to quantitatively evaluate the adhesion of the protective layer and feed back the result to the conditions for forming the protective layer.

[0003] As a method for measuring the adhesive force of a thin film, a scratch method is well known. The scratching method is a method in which an indenter such as a hard needle is moved while being pressed against a thin film under a certain load, and the thin film is peeled off from the substrate by scratching. The load that forms a scratch on the thin film surface or the sharp friction coefficient The load at which the rise occurs (critical load value) is defined as the adhesion between the thin film and the substrate. For example, JP-A-64-31036
Japanese Patent Application Laid-Open Publication No. H11-163873 proposes a method for measuring the adhesion force of a thin film by measuring an acoustic emission signal inside the thin film due to destruction or peeling at the interface between the thin film and the substrate.
Further, Japanese Patent Application Laid-Open No. 7-325028 proposes a method of measuring the light transmitted or reflected at a peeling portion of a thin film to detect the peeling of the thin film.

[0004]

However, the scratching method has a problem that the thickness of a measurable thin film is limited to a micron order or a submicron order, and cannot be applied to a thin film having a thickness of a nanometer order. Also,
For a thin film made of a ductile material, the coefficient of friction increases due to the bulge formed in front of the scratching needle, making measurement difficult, and the measurement target is limited to hard films such as oxide films, nitride films, and carbide films. There is also a problem that. Also, the critical load value required for calculating the adhesion force depends on the substrate hardness and the film thickness in a complicated manner. Therefore, when comparing the adhesion force between different samples, when comparing the adhesion force between a substrate having the same hardness and a thin film having the same thickness, There is also the problem of being limited to samples. In addition, there is a problem that the sensitivity of the means for detecting the peeling of the thin film due to mechanical vibration during measurement decreases, and the accuracy of measurement decreases.

Accordingly, the present invention solves the above-mentioned problems, and is not limited to the composition of the thin film, the type of the substrate, and the mechanical vibration at the time of measurement, and can measure the adhesive force of a thin film having a thickness of the order of nanometers. An object of the present invention is to provide a possible measuring method and a measuring device used for the method.

[0006]

In order to solve the above-mentioned problems, a method for measuring the adhesion of a thin film according to the present invention comprises a substrate fixed on a support and having a thin film on the surface; A rubbing member attached to the lower surface of the load applying mechanism for rubbing is brought into close proximity, a load member is mounted on the upper surface of the load applying mechanism to bring the thin film and the rubbing member into close contact with each other, and the support or the load The mechanism is characterized by moving the mechanism forward and backward in the horizontal direction of the substrate, rubbing the thin film with a rubbing member, analyzing the surface of the rubbed thin film, and measuring the adhesion of the thin film to the substrate.

According to the adhesive force measuring method of the present invention, the load from the load member is applied to the rubbing member by using the load applying mechanism having the rubbing member on the lower surface and the load member on the upper surface. The thin film can be rubbed with the member always in close contact with the thin film. Thus, even if the thickness of the thin film is on the order of nanometers, the surface of the thin film can be rubbed. In addition, after the thin film is rubbed, the composition and state of the thin film surface changed by the rubbing are analyzed, so there is no need to detect the peeling of the thin film from the substrate, and an acoustic emission device or a light detecting device for detecting the peeling. This eliminates the need for thin film peeling detecting means such as the above. Thus, the measurement of the adhesive force is not affected by the composition of the thin film, the type of the substrate, the mechanical vibration at the time of rubbing, and the like, and is not limited to the type of the sample. In addition, the rubbed thin film can be analyzed using a highly sensitive surface analysis method,
Higher precision measurement is possible.

In the method for measuring an adhesive force according to the present invention, the load applying mechanism is supported so as to be able to move up and down in the vertical direction of the support, and the load applying mechanism is lowered to bring the scraping member close to the thin film.
After rubbing the thin film, the load applying mechanism can be raised to separate the rubbing member from the thin film.

Further, in the method for measuring adhesive force according to the present invention, a cloth material can be used as the rubbing member.

In the method for measuring adhesive force according to the present invention, a surface contact angle measuring method can be used as a surface analysis.

In the method for measuring adhesive force according to the present invention, photoelectron spectroscopy can be used for surface analysis.

An apparatus for measuring the adhesion of a thin film according to the present invention is an apparatus for measuring the adhesion of a thin film formed on a substrate to a substrate, wherein the apparatus for measuring the adhesion of the thin film formed on the substrate is used. An adhesive force measuring device for a thin film used for measuring the adhesive force to the substrate, wherein a support for fixing the substrate, disposed on the support, a lower surface has a scraping member, and an upper surface A load applying mechanism having a detachable load member for bringing the rubbing member into close contact with the thin film, and the support or the load applying mechanism movably supported in the horizontal direction of the base, and the thin film and the rubbing member were brought into close contact with each other. A driving mechanism for moving the supported support or the load applying mechanism in the horizontal direction of the base in the state, and a slide fixed to the drive mechanism and supporting the load applying mechanism movably in the vertical direction of the base. Support mechanism and front A drive mechanism or the supporter is supported so as to be movable in the vertical direction of the base, and an elevating mechanism for moving the thin film and the rubbing member close to or away from each other, and the thin film and the rubbing member in close contact with the load applying mechanism. Activating the elevating mechanism, a control means for operating a driving mechanism to cause the support or the load applying mechanism to move forward and backward in the horizontal direction of the base in a state where the thin film and the scraping member are in close contact with each other, And a surface analysis unit for measuring a surface state of the thin film rubbed by the thin film rubbing unit.

Further, the adhesive force measuring device of the present invention can use one or more plate members that can be laminated on the load member. By laminating the one or more plate members on the upper surface of the load applying mechanism, the load applied to the rubbing member can be adjusted.

Further, as the adhesive force measuring device of the present invention, a device in which a load applying mechanism is fixed to a driving mechanism can be used. The thin film and the scraping member can be brought close to each other by raising and lowering the load applying mechanism by the lifting mechanism.

Further, in the adhesive force measuring device of the present invention, a frictional force measuring means for measuring a frictional force generated when the load applying mechanism is moved in the horizontal direction of the base can be attached to the support.

Further, in the adhesive force measuring device of the present invention, a surface contact angle meter can be used in the surface analyzing section.

Further, in the adhesive force measuring device of the present invention, a photoelectron spectrometer can be used in the surface analyzing section.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are schematic diagrams showing the configuration of an example of a thin film rubbing unit used in the thin film adhesion measuring device according to the present invention. FIG. 1 is a side view, and FIG.
FIG. 2 is a front view including a cross-sectional view taken along line I-II ′.

The thin film scraping section 50 comprises a support 1 for fixing a base 35 having a thin film 36 on its surface, and a support 37
And a load applying mechanism 5 disposed on the support 1 and having a scraping member 10 on the lower surface and a load member 6 on the upper surface, and the load applying mechanism 5 can be moved in the vertical direction of the base 35. Sliding support mechanism 25 for supporting on
5, a rubbing mechanism 40 including a driving mechanism 15 for moving the load applying mechanism forward and backward in the horizontal direction of the base 35, and a lifting mechanism 20 for moving the driving mechanism 15 in the vertical direction of the base 35; A control mechanism (not shown) for controlling the operation of the mechanism 15.

The load applying mechanism 5 is integrally formed from the lower surface side through the rubbing member 10, the rubbing member fixing means 9 for detachably fixing the rubbing member 10, and the rubbing member fixing means 9 and the connecting portion 8a. And a load member fixing rod 7 whose lower end is screwed to the upper end of the load member stage 8 and whose upper end extends above the load member stage 8.
And a load member 6 made of one or more plates having a guide hole (not shown) through which the load member fixing rod 7 can slide. The plate material is fitted into the load member fixing rod 7 by penetrating the guide hole, and the plate material is fixed on the load member stage 8.

The sliding support mechanism 25 includes sliding means 27 for slidably supporting the connecting portion 8a of the load member stage 8,
Connecting means 26 provided at one end of the sliding means, and the connecting means 26 is fixed to the drive mechanism 15. The sliding means 27 has a pair of detachable fitting members 29 and 31 fitted around the connecting portion 8a. One fitting member 31 is used by being fitted into the frame 28. The other fitting member 29 is brought into contact with the fitting member 31 and the frame 28 via the connecting portion 8a, and the fixing member 30 is screwed to the fitting member 29 and the frame 28, thereby connecting the connecting portion 8a to the fitting member 29, 31 so as to be slidable.

The driving mechanism 15 includes a movable means 17 and a moving rail 18 for moving the movable means 17 in the horizontal direction of the base.
And driving means 16 having Movable means 1
Since the connecting means 26 of the sliding support mechanism 25 is fixed to the, the moving means 17 can be moved to move the load applying mechanism 5 in the horizontal direction of the base.

The lifting mechanism 20 includes a handle 21 for moving the weight adding mechanism 5 in the horizontal direction of the base 35 via a driving mechanism 15 by a screw mechanism, and a lock for holding the rubbing member 10 at a desired height on the base 35. 22.

Next, the operation of the thin film scraping section 50 will be described with reference to FIG. A base 35 having a thin film 36 on the surface is fixed on the support 1. Here, the support 1 is a wire 3
Thus, both ends are hung down, and the base 35 is supported so as to be movable in the horizontal direction. Further, load cells 4 as frictional force measuring means are attached to both ends of the support, respectively, so that the frictional force generated between the rubbing member 10 and the thin film 36 can be measured.

The load applying mechanism 5 is held at a predetermined standby position on the base 35 with the load member 6 removed, and the handle 21 of the lifting / lowering mechanism 20 is rotated to cause the load applying mechanism 5 to rotate.
Is lowered to a predetermined proximity position. Next, the load member 6 is mounted and fixed on the load member fixing means 8.
Is applied to the rubbing member 10 to bring the rubbing member 10 into close contact with the thin film 36. Here, the connecting portion 8 a is slidably supported by the fitting members 29 and 31, and is lowered by the load of the load member 6.

The thin film 36 can be rubbed by the rubbing member 10 by moving the movable means 17 on the moving rail 18 in the horizontal direction while the rubbing member 10 is in close contact with the thin film 36. The number of times of rubbing, the rubbing distance, the rubbing speed, and the like are controlled by
The number of forward / backward movements, forward / backward moving distance and forward / backward moving speed can be controlled and changed.

Next, after the thin film 36 is rubbed a predetermined number of times by repeating the forward and backward movements, the forward and backward movement of the movable means 17 is stopped, the load member 6 is removed, the load applying mechanism 5 is raised, and the rubbing member 10 and the base 35 are lifted. And separated. Then
The substrate 35 is removed from the support 1, and the surface state of the rubbed thin film is analyzed using a predetermined surface analysis unit (not shown).

The substrate applicable to the adhesive force measuring method of the present invention only needs to have a flat surface, and a substrate made of a solid such as a metal, an inorganic solid, and an organic material can be used.

The thin film applicable to the adhesion measuring method of the present invention may be a single film or a multilayer film in which a plurality of layers are laminated. The thickness of the thin film may be 1 nm or more, preferably 1 nm to 1 μm, and more preferably 1 nm to 0.1 μm. Also, by increasing the load applied to the rubbing member, it is possible to rub even a soft film without being affected by the material of the thin film.

In the method for measuring an adhesive force according to the present invention, it is preferable to adjust the load applied to the rubbing member according to the magnitude of the adhesive force between the substrate and the thin film. By increasing or decreasing the weight or the number of plate members mounted on the load member fixing stage, the load applied to the rubbing member can be easily adjusted. The preferable range of the load is 98 Pa-9.
It is 80 kPa. For example, in the case of a thin film composed of a silane coupling agent on a silica substrate, 1.96 kPa to 98
It is preferable to be in the range of kPa.

The rubbing member used in the adhesive force measuring method of the present invention may be a cloth material such as a woven or nonwoven fabric, a rubber material, a polymer pad material, etc., but a cloth material is preferable.
The cloth material is flexible and does not damage the substrate.
The thin film can be easily scraped off by the unevenness on the surface.
Polyester, polypropylene,
Vinylon, acrylic, polyethylene terephthalate, rayon, chemical fibers such as nylon, animal fibers such as wool and silk, and plant fibers such as hemp and cotton,
Cotton is preferred.

The thickness of the rubbing member is 0.1 to 5.0 mm, more preferably 0.5 to 2.0 mm, in order to sufficiently adhere to the thin film. The area of the rubbing member is 1
~50cm ² is preferred.

The rubbing speed and the number of times of rubbing of the rubbing member are as follows:
1 cm · sec ^{-1 to} 10 cm · sec ⁻¹
And the range of 1 to 10000 times is preferable.

In the method for measuring the adhesive force according to the present invention, the surface of the abraded thin film is analyzed by surface contact angle measurement, photoelectron spectroscopy, infrared spectroscopy, visible ultraviolet spectroscopy, or the like. Changes in surface composition can be examined. By measuring the change in the surface composition of each of the plurality of samples for each number of times of rubbing, it becomes possible to make a relative comparison between the samples on the adhesive force of the thin film to the substrate.

Here, a method for measuring the adhesive force when the surface contact angle measuring method is used for the surface analysis will be described. FIG.
Is a graph showing an example of a change in a surface contact angle with respect to the number of times of rubbing. The surface coverage of the thin film is X, the contact angle when the thin film covers the entire substrate is θ ₁ , and the surface contact angle of the substrate surface is θ ₂
In other words, the surface contact angle θ of the rubbed portion is given by the following equation (1).
Indicated by cos θ = X · cos θ ₁ + (1−X) · cos θ ₂ (1) Therefore, the coverage X is expressed by the following equation (2). X = (cos θ−cos θ ₂ ) / (cos θ ₁ −cos θ ₂ ) (2) The surface contact angle is measured every number of times of rubbing, and the above equation (2) is obtained.
Is used to calculate the coverage. By measuring the change in the covering ratio for each number of times of rubbing, it becomes possible to evaluate the adhesion force between the samples.

Also, when using methods other than contact angle measurement, such as photoelectron spectroscopy, infrared spectroscopy, and visible-ultraviolet spectroscopy, the relative areas of the peaks attributable to the thin films obtained in each of these methods are compared. Since the coverage X can be calculated, the relative evaluation of the adhesive force of the thin film becomes possible.

In this embodiment, the example in which the frictional force measuring means 4 is attached to the support 1 is shown. However, the same effect can be obtained by attaching the frictional force measuring means 4 to the load applying mechanism 5. In this case, the support 1 may be fixed to the drive mechanism 15, and the support 1 may be moved up and down by the lift mechanism 20 via the drive mechanism 15.

[0038]

EXAMPLES The present invention will be described below in detail with reference to Examples, but it should not be construed that the invention is limited thereto. The following examples are examples in which the adhesion of an antifouling coat formed on the outermost surface of a surface coating film of a CRT was measured. When the antifouling coat is damaged, the moisture permeability of the portion increases, and a defect called ghost gridder occurs. It is known that this defect has a correlation with the peeling of the antifouling coat. The adhesive force of the antifouling coat was measured using the adhesive force measuring method according to the present invention, and the correlation between the obtained adhesive force and the susceptibility of ghost gridder to occurrence was examined.

Embodiment 1 Substrate for surface coating of CRT
Using a film, the composition and forming conditions on the surface of the film
Forming three types of antifouling coats with different thicknesses of 5 nm,
Sample films A, B, and C were prepared. Remove the sample film
The substrate was fixed horizontally on a support by laminating on a lath plate. Vertical
7.6cm, 5.2cm width cotton bleached cloth with rubbing member
And load the weight of 1.0 kg as a load member onto the scraping member.
A weight was added to adhere to the film surface. In this state,
10cm · s horizontal member to sample film
ec ^-1Forward and backward at the speed of
Scratched.

After rubbing, the sample film was removed from the support, and the surface contact angle of the rubbed portion of the film surface with ion-exchanged water was measured using Kyowa Interface Science model PD-X. FIG. 6 shows the surface contact angles after rubbing the surfaces of the sample films A, B and C ten times. The magnitude of the surface contact angle after rubbing was in the order of A <B <C. Since the antifouling coat having a small adhesive force to the film is peeled off from the film by abrasion, the surface contact angle becomes small. Therefore, the result was obtained that the antifouling coat of the sample film C had the highest adhesion, the sample film A had the lowest adhesion, and the sample film B was intermediate. In addition, according to a test performed separately, these sample films show that A>
In the order of B> C, the result that a ghost gridder is easily generated was obtained. From the above results, it was found that the smaller the surface contact angle of the rubbed sample film, that is, the smaller the adhesive force of the antifouling coat, the more easily ghost gridder is generated.

Example 2 The adhesive force of a sample film was measured in the same manner as in Example 1 except that the number of times of rubbing was changed up to 320 times and the surface contact angle was measured every predetermined number of times. FIG. 7 shows the relationship between the number of times of rubbing and the surface contact angle of the sample films A, B, and C. In any of the films, when the number of times of rubbing exceeded about 150, the surface contact angle converged to a constant value. The magnitudes of the convergence values of the surface contact angles of the sample films A, B, and C are 70 degrees and 95 degrees, respectively.
Degrees, 108 degrees. It was found that the sample film A had a larger decrease in the surface contact angle with the increase in the number of times of rubbing than the sample films B and C, and the adhesion of the antifouling coat was considerably smaller than the other sample films.

Example 3 The adhesive force of a sample film was measured in the same manner as in Example 2 except that the frictional force applied to the film during rubbing was measured with load cells attached to both ends of the support. FIG. 8 shows sample films A,
For B and C, the relationship between the coverage obtained from the change in the contact angle and the number of times of rubbing is shown. The coverage converged to a constant value when the number of times of rubbing was about 150 or more, and the convergence values of the coverage of the sample films A, B, and C were 38%, 80%, and 92%, respectively. Thus, the magnitude of the adhesive force of the sample film is A
It turned out that <B <C.

Example 4 A sample film was prepared in the same manner as in Example 2 except that the surface of the rubbed sample film was analyzed using a photoelectron spectrometer (ESCA-1000 manufactured by Shimadzu Corporation) instead of measuring the surface contact angle. The adhesion was measured. In the photoelectron spectrum, the relationship between the peak area around 689 eV attributed to F1s derived from fluorine atoms in the antifouling coat and the number of times of rubbing was examined. In any of the sample films, the peak area around 689 eV decreased with the number of times of rubbing, and tended to converge to a constant value. The decrease in the peak area around 689 eV is due to the progress of the peeling of the antifouling coat, and the magnitude of the adhesion of the antifouling coat of each sample film is in the order of A <B <C. The same result was obtained.

[0044]

As described above, according to the method for measuring the adhesive force of a thin film of the present invention, a load applying mechanism having a rubbing member on the lower surface and a load member on the upper surface is disposed immediately above the thin film, With the rubbing member in close contact with the thin film, rubbing the rubbing member so as to move the thin film in the horizontal direction,
In addition, since the adhesive force is measured by analyzing the surface of the thin film after rubbing, it is possible to measure the adhesive force with high accuracy regardless of the type of sample for a thin film with a thickness of nanometer order Becomes

In the method for measuring the adhesive force according to the present invention, the load applying mechanism can be moved up and down in the vertical direction of the support, so that the positioning of the rubbing member can be performed easily.

Further, in the method for measuring adhesive force according to the present invention, since a cloth material is used for the scraping member, it is possible to scrape the thin film without damaging the substrate, and it is possible to measure the adhesive force with higher accuracy. Become.

In the method for measuring the adhesive force according to the present invention, the surface contact angle is measured for the surface analysis, and the adhesive force of the thin film is measured from the change in the contact angle due to the rubbing. The adhesive force of the thin film can be easily measured.

In the adhesion measuring method of the present invention, photoelectron spectroscopy is used for surface analysis, and the adhesion of a thin film is measured from the change in the peak area of a specific element due to abrasion. The adhesive force of the thin film of the order can be measured with higher accuracy.

Further, the apparatus for measuring the adhesive force of a thin film according to the present invention comprises:
Consists of a thin film rubbing part for rubbing the thin film and a surface analysis part for measuring the surface state of the rubbed thin film, and further, the thin film rubbing part, a support for fixing the base, and disposed on the support, A load applying mechanism having a rubbing member and having a load member on the upper surface having a load member for bringing the rubbing member into close contact with the thin film, supporting the support or the load applying mechanism, and supporting the thin film and the rubbing member in a state of being in close contact with the thin film. A drive mechanism for moving the body or the load applying mechanism forward and backward in the horizontal direction of the base, a sliding support mechanism fixed to the drive mechanism and supporting the load applying mechanism movably in the vertical direction of the base, and a drive mechanism or a support. An elevating mechanism that movably supports the substrate in the vertical direction, moves the thin film and the rubbing member close to or away from each other, and operates an elevating mechanism to make the thin film and the rubbing member adhere to each other in conjunction with the load applying mechanism. Close contact with scraping member Control means for operating the drive mechanism to move the support or the load applying mechanism forward and backward in the horizontal direction of the substrate in a state where the thin film having a thickness of the order of nanometers is limited to the sample type. A measuring device capable of measuring an adhesive force with high accuracy can be provided.

Further, since the adhesion measuring device of the present invention uses one or more plate members which can be laminated on the load member,
The load on the rubbing member can be easily adjusted according to the adhesive force of the thin film, and more accurate measurement of the adhesive force can be performed.

Further, in the adhesive force measuring device of the present invention, the load applying mechanism is fixed to the drive mechanism, and the load applying mechanism can be moved in the vertical direction of the base by the elevating mechanism. Can be easily positioned.

Further, in the adhesive force measuring device of the present invention, the friction force measuring device is attached to the support, so that the friction force at the time of rubbing can be easily measured.

Further, since the adhesive force measuring device of the present invention uses a surface contact angle meter in the surface analyzing section, the adhesive force of a thin film having a thickness on the order of nanometers can be easily measured.

Further, since the adhesive force measuring device of the present invention uses a photoelectron spectrometer in the surface analysis section, the adhesive force of a thin film having a thickness on the order of nanometer can be measured with high accuracy.

[Brief description of the drawings]

FIG. 1 is a side view showing a configuration of an example of a thin film adhesion measuring device according to an embodiment of the present invention.

FIG. 2 is a front view including a partial cross-sectional view of the adhesion measuring device of FIG. 1;

FIG. 3 is a graph showing an example of measurement results obtained by using the adhesion measuring device of FIG. 1, and showing a relationship between a surface contact angle and the number of times of rubbing.

FIG. 4 shows sample films A and 1 according to the first embodiment of the present invention.
It is a graph which shows the surface contact angle of B and C.

FIG. 5 shows sample films A and 2 in Example 2 of the present invention.
It is a graph which shows the relationship between the surface contact angle of B and C, and the number of times of rubbing.

FIG. 6 shows sample films A, 3 in Example 3 of the present invention.
It is a graph which shows the relationship between the coverage and the number of times of rubbing of B and C.

[Description of Signs] 1 support, 2 fixing member, 3 wire, 4 load cell, 5 load applying mechanism, 6 load member, 7
Fixing rod, 8 stage for load member, 8a connecting portion, 9 holding member for scraping member, 10 scraping member,
Reference Signs List 15 drive mechanism, 16 drive means, 17 movable means, 18 moving rail, 20 lifting mechanism, 21
Handle, 22 lock, 25 sliding support mechanism,
26 connecting means, 27 sliding means, 28 frame,
29 first fitting member, 30 fixing member, 31
2nd fitting member, 35 base, 36 thin film, 3
7 gantry, 40 rubbing mechanism, 45 control mechanism, 5
0 Thin film rubbing part.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tetsuyuki Kurata 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Inventor Sadaharu Takahashi 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Rishi Electric Co., Ltd. (72) Inventor Mikako Maeda 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Inventor Yu Fujii 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric F term in the company (reference) 2G001 AA01 BA08 CA03 KA03 LA06 MA05 RA08

Claims (11)

[Claims] 1. A substrate fixed on a support and having a thin film on its surface, and a rubbing member supported on said support and attached to a lower surface of a load applying mechanism for rubbing said thin film, are brought close to each other, and said load is applied. The thin film and the rubbing member were brought into close contact with each other by mounting a load member on the upper surface of the mechanism, and the thin film was rubbed and rubbed by the rubbing member by moving the support or the load applying mechanism forward and backward in the horizontal direction of the base. A method for measuring the adhesion of a thin film, in which the surface of the thin film is analyzed and the adhesion of the thin film to a substrate is measured. 2. The load applying mechanism is supported so as to be able to move up and down in the vertical direction of the support. After the load applying mechanism is lowered to bring the scraping member close to the thin film and rub the thin film,
The measuring method according to claim 1, wherein the load applying mechanism is raised to separate the rubbing member from the thin film. 3. The measuring method according to claim 1, wherein the rubbing member is a cloth material. 4. The measuring method according to claim 1, wherein the surface analysis is a surface contact angle measuring method. 5. The measuring method according to claim 1, wherein the surface analysis is photoelectron spectroscopy. 6. An apparatus for measuring an adhesive force of a thin film formed on a substrate, which is used for measuring an adhesive force of the thin film on the substrate, comprising: a support for fixing the substrate; A load applying mechanism having a rubbing member on the lower surface and a detachable load member for bringing the rubbing member into close contact with the thin film on the upper surface; and allowing the support or the load applying mechanism to move in the horizontal direction of the base. A driving mechanism for moving the supported support or the load applying mechanism forward and backward in the horizontal direction of the base in a state in which the thin film and the rubbing member are in close contact with each other, and the load applying mechanism is fixed to the driving mechanism. A sliding support mechanism that movably supports the substrate in a vertical direction, an elevating mechanism that supports the driving mechanism or the support so as to be movable in a vertical direction of the substrate, and moves a thin film and a rubbing member close to or away from each other; Loading machine The lifting / lowering mechanism is operated so that the thin film and the rubbing member are brought into close contact with the structure, and the support or the load applying mechanism is driven to move forward and backward in the horizontal direction of the base with the thin film and the rubbing member in close contact with each other. A thin film adhesive force measuring device, comprising: a thin film rubbing part having a control means for operating a mechanism; and a surface analyzing part for measuring a surface state of the thin film rubbed by the thin film rubbing part. 7. The measurement according to claim 6, wherein the load member is made of one or more stackable plate members, and the one or more plate members are stacked on an upper surface of the load applying mechanism to apply a load to the rubbing member. apparatus. 8. The measuring apparatus according to claim 6, wherein the load applying mechanism is fixed to the drive mechanism, and the load applying mechanism is moved up and down by the elevating mechanism to move the thin film and the rubbing member close to or away from each other. 9. The measuring device according to claim 8, wherein the support has a frictional force measuring means for measuring a frictional force generated when the load applying mechanism is moved forward and backward in the horizontal direction of the base. 10. The measuring device according to claim 6, wherein the surface analysis unit is a surface contact angle meter. 11. The measurement device according to claim 6, wherein the surface analysis unit is a photoelectron spectroscope.