JP2002343845A - Liquid processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid processing apparatus which can surely advance a holding member into a chamber for liquid processing in the apparatus for moving the holding means which holds a substrate to liquid process the substrate. SOLUTION: A cleaning processing apparatus of a semiconductor wafer of one embodiment of the liquid processing apparatus comprises a rotor 34 which can hold the wafer W, a chamber 70 for housing the rotor 34 and executing liquid processing of the wafer W, an X-axis linearly driving mechanism 30 for advancing/retracting the rotor 34 to or from the chamber 70, and a positioning unit 150 for deciding a mounting position of the mechanism 30. The positioning unit 150 has a laser beam source 154, slits 153a, 153b, and targets 153c, 153d, and regulates the mounting position of the mechanism 30 so as to penetrate predetermined positions of the slits 153a, 153b and the targets 153c, 153d and to advance/retract the rotor 34 without colliding with the chamber 70.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a liquid processing apparatus that performs predetermined liquid processing and drying processing on various substrates such as a CD substrate.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, for example, a semiconductor wafer (wafer) as a substrate is washed with a predetermined chemical solution or a cleaning solution such as pure water, and contaminants such as particles, organic contaminants and metal impurities are removed from the wafer. A wafer cleaning device for removing the polymer and the like after the etching and the etching process, and removing the droplets from the wafer with an inert gas such as a nitrogen (N ₂ ) gas or a highly volatile and hydrophilic IPA vapor to dry the wafer. Wafer drying equipment is used.

As such a wafer cleaning apparatus, for example, as shown in FIG. 12, a processing chamber 202 for forming a wafer cleaning chamber 201 and a rotor 205 capable of holding and rotating a wafer W are provided. Processing chamber 20
The wafer W can be transferred between the rotor 205 and the wafer chucks 209a and 209b of the transfer arm while the rotor 205 is advanced from the processing chamber 202 by allowing the wafer W to advance and retreat from the wafer loading / unloading port 203 formed on the front side of the wafer 2. A wafer cleaning apparatus 200 having a structure that can be used is known. Reference numeral 207 in FIG. 12 denotes a drive mechanism for moving the rotor 205 forward and backward, and rotating the rotor 205.
8 is a rotating shaft, 204 is a lid of the processing chamber 202, 206
Is a holding member for the rotor 205.

[0004]

However, FIG.
In the wafer cleaning apparatus 200 shown in FIG.
The control programs 09a and 209b and the holding member 206 of the rotor 205 must be controlled so as not to collide with each other.

[0005] In recent years, in response to the trend toward higher integration and mass production of semiconductor devices, the size of a wafer has been reduced to 20%.
The diameter is increasing from 0 mmφ to 300 mmφ.
Here, without changing the structure of the conventional liquid processing apparatus, if the mechanisms, members, etc. of the respective parts that handle the wafer in accordance with the size of the wafer are enlarged, the size of the entire liquid processing apparatus cannot be avoided. There is a strong need to suppress the enlargement of the liquid processing apparatus as much as possible by changing the apparatus configuration. In this case, it is necessary to adopt a structure in which the wafer is reliably inserted into the chamber where the liquid processing is performed.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art. In a liquid processing apparatus for moving a holding means for holding a substrate to a chamber in which liquid processing is performed, the present invention is directed to a liquid processing apparatus in which a substrate is reliably liquid. It is an object of the present invention to provide a liquid processing apparatus that can enter a chamber where processing is performed. Another object of the present invention is to provide a space-saving liquid processing apparatus corresponding to an increase in the size of a substrate.

[0007]

According to the present invention, there is provided, in accordance with the present invention, a liquid processing apparatus for performing a predetermined liquid processing on a substrate, wherein a plurality of substrates may be held substantially in parallel at predetermined intervals. A holding means, a chamber for housing the holding means and performing predetermined liquid processing on a substrate held by the holding means, a holding means moving device for moving the holding means into and out of the chamber, A liquid processing apparatus, comprising: a positioning device that determines an entry / exit direction of the holding unit with respect to the chamber by adjusting an arrangement position of the holding unit moving device.

Further, according to the present invention, there is provided a liquid processing apparatus for performing a predetermined liquid processing on a substrate, wherein the holding means is capable of holding a plurality of substrates substantially in parallel at predetermined intervals, and
An entry / exit exit for exiting is formed, the chamber containing the holding means and performing a predetermined liquid treatment on the substrate held by the holding means, and the entrance in the state where the holding means is housed in the chamber. A lid integrally formed with the holding means for closing the retreat port, the holding means being moved in / out of the chamber, and the lid being moved in / out of the entrance / exit port. And a positioning device that adjusts an arrangement position of the holding device moving device to determine an entry / exit direction of the holding device and the lid with respect to the chamber and the entrance / exit port. A liquid processing apparatus is provided.

Further, according to the present invention, there is provided a liquid processing apparatus for performing a predetermined liquid processing on a substrate, wherein the holding means is capable of holding a plurality of substrates substantially in parallel at predetermined intervals, and wherein the holding means includes an ingress / egress movement. A chamber for receiving the holding means and performing a predetermined liquid treatment on the substrate held by the holding means; and an inlet / outlet in a state where the holding means is housed in the chamber. A holding means moving device which closes an outlet, and makes the substrate held by the holding means substantially perpendicular to the lid integrally formed with the holding means, and moves the holding means into and out of the chamber. And a positioning device that determines an entry / exit direction of the holding unit and the lid with respect to the chamber and the entrance / exit by adjusting an arrangement position of the holding unit moving device. A liquid processing unit, and a container loading / unloading unit in which loading / unloading of a container in which a plurality of substrates are stored in substantially parallel with the main surface as a horizontal plane is performed, and a container and the holding unit arranged in the container loading / unloading unit. And a substrate transport unit that transports the substrate in a substantially horizontal state.

According to such a liquid processing apparatus of the present invention,
By adjusting the disposition position of the holding means moving device by using a positioning device, the approaching / exiting direction of the holding means with respect to the chamber is accurately determined, so that the holding means holding the substrate is moved into and out of the chamber formed in the chamber. The holding means can be reliably moved into and out of the chamber without colliding with the side surface of the outlet or the like, and thus the damage of the substrate and the holding means can be prevented. Further, even if a lid for closing the entrance / exit formed in the chamber is provided integrally with the holding means, the positioning device prevents the lid from colliding with the side surface of the entrance / exit / exit.

[0011]

Embodiments of the present invention will be specifically described below with reference to the accompanying drawings. The liquid processing apparatus of the present invention can be applied to, for example, a cleaning processing apparatus or a drying processing apparatus using various substrates as a processing target. Therefore, in the present embodiment, a semiconductor wafer (wafer)
A case will be described in which the present invention is applied to a cleaning apparatus configured to consistently carry in, wash, dry, and carry out a wafer.

FIG. 1 is a perspective view showing the appearance of a cleaning apparatus 1 according to this embodiment. The cleaning apparatus 1 includes a plurality of
For example, a hoop loading / unloading section 2 provided with hoop stages 2a to 2c for mounting hoops (storage containers) F capable of storing 25 wafers W at predetermined intervals substantially horizontally, Processing unit 3 for performing cleaning processing
And a wafer transfer unit 4 provided between the hoop loading / unloading unit 2 and the cleaning unit 3 for transferring the wafer W.
And a chemical solution supply unit 5 for storing and supplying a chemical solution for the cleaning process.

Further, a power supply box 6 for various electric drive mechanisms and electronic control devices provided in the cleaning apparatus 1.
A temperature control box 7a for mainly controlling the temperature of the chemical solution or the like stored in the chemical solution supply unit 5, and a process control box for controlling the processing process of the wafer W in the cleaning processing unit 3 (immediately below the temperature control box 7a). Are provided above the cleaning unit 3, and various display panels provided in the cleaning apparatus 1 are controlled above the wafer transfer unit 4. And a transfer mechanism control box 10 for controlling a processing process of the wafer W in the wafer transfer unit 4. Further, a heat exhaust box 8 for collecting and exhausting heat exhaust from each box or the like is provided above the chemical solution supply unit 5.

FIG. 2 is a plan view showing a schematic structure of the cleaning apparatus 1, and FIG. 3 is a side view showing a schematic structure of the cleaning apparatus 1.
FIG. 4 is a side view showing a state where some of the driving mechanisms shown in the side view of FIG. 3 are driven. here,
2 to 4, only the hoop loading / unloading section 2, the cleaning processing unit 3, the wafer transport unit 4, and the chemical supply unit 5 are shown, and are disposed above the cleaning processing unit 3, the wafer transport unit 4, and the chemical supply unit 5. The power supply box 6 provided and other various boxes are not shown. As shown in FIG. 2, the cleaning unit 3 includes a wafer transfer chamber 3a, a chamber 3b, and a utility chamber (not shown) provided below the chamber 3b. In the unit 3, a schematic structure of the wafer transfer chamber 3a is shown.

A wafer loading / unloading port for loading / unloading a wafer W is provided on one side surface of the hoop F. The wafer loading / unloading port is opened and closed by a lid 11. Windows 12a to 12c are provided on a boundary wall 12 between the wafer transfer unit 4 and the hoop loading / unloading section 2, and an outer peripheral portion of a wafer loading / unloading opening formed in the hoop F closes the windows 12a to 12c. The hoop F is moved from the hoop stage 2a to the hoop F so that the lid 11 can be detached by the lid opening / closing mechanisms 15a to 15c.
2c (see FIGS. 3 and 4).

The inside of the boundary wall 12 (the wafer transfer unit 4
Side), shutters 13a to 13c for opening and closing the windows 12a to 12c at the respective positions of the windows 12a to 12c.
Mechanism 14 for raising and lowering the shutters 13a to 13c
Cover opening / closing mechanisms 15a to 15c each including a to 14c are provided. Further, the wafer transfer unit 4 is formed on a wafer inspection device 110, a wafer transfer mechanism 16, filter fan units (FFU) 24 a and 24 b, and a boundary wall 25 separating the wafer transfer unit 4 and the cleaning unit 3. A shutter 26a for opening and closing the window 25a, an elevating mechanism 26b for the shutter 26a, and an operation panel 4a for operating the cleaning apparatus 1 are provided.

The lid opening / closing mechanisms 15a to 15c have lid gripping means such as a suction pad (not shown) so that the lid 11 of the hoop F is moved up and down together with the shutters 13a to 13c. The wafer inspection apparatus 110 includes a window 12a.
To 12c, and the hoop F
Then, the number of wafers W and the storage state of the wafers W are inspected.

The wafer transfer mechanism 16 includes the linear drive mechanism 1
9 and transfer arms 17a and 17b holding wafer W
And holding units 18a and 18b for holding the transfer arms 17a and 17b, respectively, and slide mechanisms 20a and 20b for sliding the transfer arms 17a and 17b in the longitudinal direction.
A table 21 on which slide mechanisms 20a and 20b are arranged, a rotation mechanism 22 for rotating the table 21, an elevating mechanism 23 for elevating a portion above the rotation mechanism 22,
have.

The linear drive mechanism 19 has a guide 19a extending in the X direction, a motor 19b, and a pivot 19c rotated by the motor 19b. An exhaust port 19d is formed in the base of the guide 19a. . The pivot 19c is engaged with the lifting mechanism 23, and the rotation of the pivot 19c allows the lifting mechanism 23 to move in the X direction. For example, one of the transfer arms 17a and 17b is used to transfer an unprocessed wafer W, and the other is used to transfer a cleaned wafer W. One transfer arm 17a transfers one wafer W, and 25
The 25 transfer arms 17a are held by the holding portion 18a at a predetermined interval substantially in parallel so that one wafer W can be transferred at a time, and the 25 transfer arms 17b are also held at a predetermined interval substantially in parallel. It is held by the portion 18b.

The transfer arms 17a and 17b are slidable in the longitudinal direction by slide mechanisms 20a and 20b, and the table 21 is rotatable in a horizontal plane in the θ direction shown in FIG. The portion above the elevating mechanism 23 can be moved in the X direction by the driving mechanism 19. Thus, the transfer arm 1
7a and 17b can access any hoop F and the rotor 34 mounted on the hoop stages 2a to 2c, and between the hoop stages 2a to 2c and the rotor 34,
The wafer W is transferred while being held in a horizontal state.

A step is provided at the ceiling of the wafer transfer unit 4, and a filter fan unit (FFU) 24a is provided at a lower part of the ceiling, and a filter fan unit (FFU) 24b is provided at a higher part. Has been established. Filter fan unit (FFU) 24a ・ 2
The air 4b can be taken in from the side or top of the cleaning apparatus 1, respectively. An ionizer (not shown) may be provided below the filter fan units (FFU) 24a and 24b to remove charges from the wafer W.

A window 25a for transferring the wafer W is formed on a boundary wall 25 separating the wafer transfer unit 4 and the cleaning unit 3, and the window 25a can be moved up and down by an elevating mechanism 26b. Shutter 26a
Is opened and closed by The shutter 26a is shown in FIGS.
In the embodiment, the cleaning processing unit 3 is provided on the wafer transfer unit 4 side, but may be provided on the cleaning processing unit 3 side.

In the wafer transfer chamber 3a, a filter fan unit (FFU) 24c, a rotor rotating mechanism 27,
Attitude conversion mechanism 28 for controlling the attitude of rotor rotation mechanism 27
A Z-axis linear drive mechanism 29 that moves the rotor rotation mechanism 27 and the attitude conversion mechanism 28 in the vertical direction; an X-axis linear drive mechanism 30 that moves the Z-axis linear drive mechanism 29 in the horizontal direction; And a holder opening / closing mechanism 80 for opening / closing a holder 83 (see FIG. 5 described later) of the rotor 34.

A chamber 70 having a double structure comprising a fixed outer chamber 71a and a horizontally slidable inner chamber 71b is provided in the chamber 3b.
And an X-axis slide mechanism 120 for the inner chamber 71b.
There are provided a pump for boosting the processing liquid supplied to the inner chamber 71b and 1a, and a piping (not shown) for guiding the processing liquid discharged from the outer chamber 71a and the inner chamber 71b to the outside. A vertical wall 62a, which is a boundary between the wafer transfer chamber 3a and the chamber chamber 3b, is provided with a rotor entrance / exit 62c for allowing the rotor 34 to enter / exit the chamber 70. The rotor entrance / exit 62c is a rotor entrance / exit 62c. When 34 has not entered the chamber 70, it can be closed by the lid 62d.

The rotor rotating mechanism 27 includes a rotor 34 capable of holding the wafers W at predetermined intervals with the main surfaces thereof substantially parallel to each other, and a motor 31 for rotating the rotor 34 so that the wafers W held by the rotor 34 rotate in the plane. And the connecting portion 32 connected to the posture changing mechanism 28 and the rotor 34
1a, a lid 33 closing the rotor entrance / exit 62c formed in the vertical wall 62a when entering the vertical wall 62a, and a rotating shaft connecting the rotor 34 and the motor 31 through the connecting portion 32 and the lid 33. 50.

FIG. 5 is a perspective view showing a schematic structure of the rotor 34. The rotor 34 has a pair of disks 35a and 35b arranged at predetermined intervals, and four locking members formed between the disks 35a and 35b and having grooves and the like formed at predetermined intervals for holding the wafer W. A member 36, two holders 83 provided with grooves so as to hold the wafer W in a substantially parallel state similarly to the locking member 36, and a holder 83.
And lock pins 84a and 84b for locking the lock.

The disk 35b is connected to the rotating shaft 5 by a screw 35c.
The locking member 36 is fixed between the disks 35a and 35b by screws or the like from outside the disks 35a and 35b. When the rotating portion 88a provided on the holder 83 is turned in the “open” direction shown in FIG. 5, the holder 83 opens left and right to carry in the wafer W into or out of the rotor. Conversely, when the rotating part 88a is turned in the “closed” direction shown in FIG. 5, the holder 83 is closed, and the holder 83 holds the wafer W similarly to the locking member 36. Carry.

Whether or not the rotating portion 88a can be rotated is determined by the state of the lock pins 84a and 84b. For example, when the lock pins 84a and 84b are protruding, the rotating portion 88a cannot be rotated, and only when the lock pins 84a and 84b are pushed toward the inside of the rotor 34, the rotating portion 88a does not rotate. Can be rotated.

A holder opening / closing mechanism 80 for opening / closing the holder 83 is attached to the boundary wall 25 above the window 25a. The holder opening / closing mechanism 80 accesses the lock pin 84a and puts the lock pin 84a on the rotor 34.
And a rotating cylinder 82 that accesses the rotating part 88a and drives the rotating part 88a to rotate. A pressing cylinder (not shown) for accessing the lock pin 84b and pressing the lock pin 84b into the inside of the rotor 34 is provided on the lid 33.

The holder opening / closing mechanism 80 is rotatable between a retracted position shown in FIG. 3 and an operating position shown in FIG. At the retracted position of the holder opening / closing mechanism 80, a cover 40 is provided on the boundary wall 25, and separates the wafer transfer unit 4 from the cleaning processing unit 3. As shown in FIG. 4, when the holder opening / closing mechanism 80 accesses the rotor 34, the lock pin 84 a is held in a state where the lock pin 84 a is pushed into the rotor 34 by the pressing force from the pressing cylinder 81. At this time, the lock pin 84b is also pushed into the inside of the rotor 34, so that the rotating cylinder 82 rotates the rotating portion 88a in a predetermined direction, and the opening and closing operation of the holder 83 becomes possible.

Next, various mechanisms provided for moving the rotor rotation mechanism 27 will be described. The attitude conversion mechanism 28 that controls the attitude of the rotor rotation mechanism 27 has a rotation mechanism 42 and a rotation shaft 41 attached to the rotation mechanism 42, and the rotation shaft 41 is fixed to the connecting portion 32 of the rotor rotation mechanism 27. Have been. The rotation mechanism 42 can hold the entire rotor rotation mechanism 27 in a posture (vertical posture) in which the wafer W is held in a horizontal state as shown in FIG. 3 or FIG. 4, and FIG. 6 to FIG. As shown in (1), the wafer W can be held after being converted into a posture (horizontal posture) in which the wafer W is held vertically.

The Z-axis linear drive mechanism 29 includes a motor 43
And the rotational driving force and displacement of the motor 43
Power transmitting unit 44, guide 47, and guide 47
, And a cover 45. The attitude conversion mechanism 28 is fitted with the guide 47 so as to be able to move along the guide 47. When the motor 43 is rotated, the rotation driving force and the displacement are transmitted to the attitude conversion mechanism 28 via the power transmission unit 44. The attitude conversion mechanism 28 can move a predetermined distance along the guide 47 together with the rotor rotation mechanism 27 in the Z direction (vertical direction).

The X-axis linear drive mechanism 30 includes a guide 49
A motor (not shown), a ball screw 39a connected to the motor, a meshing member 39b meshed with the ball screw 39a, and a connecting member 38 fitted in the guide 49 to connect the meshing member 39b and the support 48. And These members are disposed on the base 46, and the base 46 is attached to a boundary wall 59 that forms a boundary between the cleaning unit 3 and the chemical storage unit 5.

In the X-axis linear drive mechanism 30, a ball screw 39 is rotated by rotating a motor (not shown).
a operates, and the engagement member 39b moves in the X direction according to the operation of the ball screw 39a. At this time, since the connecting member 38 connects the engagement member 39b and the support 48, the connection member 38 and the support 48 also move in the X direction together with the engagement member 39b. That is,
When the engagement member 39b moves in the X direction, the rotor rotation mechanism 27, the attitude conversion mechanism 28, and the Z-axis linear drive mechanism 29 move in the X direction at the same time.

FIG. 6 is an explanatory diagram showing an example of a form in which the rotor rotation mechanism 27 is moved by using the attitude conversion mechanism 28, the Z-axis linear drive mechanism 29, and the X-axis linear drive mechanism 30. For example, when the rotor 34 is moved into the outer chamber 71a after the wafer W is loaded into the rotor 34, the rotor rotation mechanism 27 is in the vertical position with the connecting portion 32 positioned at the position P1, and in this state, It is assumed that the wafer W is carried into the rotor 34 from the transfer arm 17a.

When the wafer W is stored in the rotor 34, the Z-axis linear drive mechanism 29 is operated to
Then, the posture changing mechanism 28 is raised so that the connecting portion 32 moves to the position P2. At the position P2, the attitude conversion mechanism 28 is operated to rotate the entire rotor rotation mechanism 27 by 90 degrees (°) so that the wafer W is changed from the horizontal holding state to the vertical holding state. It is in the state of the horizontal posture. Subsequently, the Z-axis linear drive mechanism 29 is operated again so that the connecting portion 32 moves to the position P3 while the rotor rotation mechanism 27 is in the horizontal posture, and the rotor rotation mechanism 27 is raised.

When the connecting portion 32 reaches the position P3, the X-axis linear drive mechanism 30 is operated, and the connecting portion 32 is moved.
Is horizontally moved to the position P4, the rotor 34 can enter the outer chamber 71a, for example. After the cleaning processing of the wafer W is completed, the rotor rotation mechanism 27 is moved so as to run backward in the above-described movement path, and the wafer W after the cleaning processing is carried out using the transfer arm 17b.

Filter fan unit (FFU) 24
Part of the clean air (downflow) sent from c to the wafer transfer chamber 3a is exhausted from an exhaust port (not shown) provided on the bottom plate of the wafer transfer chamber 3a. Another part is:
The air is exhausted after being introduced into the chamber 3b or the utility chamber through a not-shown vent provided at the boundary between the wafer transfer chamber 3a and the chamber 3b and at the boundary between the wafer transfer chamber 3a and the utility chamber. It has become.

Next, the internal structure of the chamber 3b will be described. FIGS. 7 and 8 show the rotor 34 of the rotor rotation mechanism 27 in the chamber 70 provided in the chamber 3b.
FIG. 7 is a cross-sectional view showing a state in which the inner chamber 71b is retracted. FIG. 7 shows a state where the inner chamber 71b is retracted outside the outer chamber 71a, and FIG. 8 shows a state where the inner chamber 71b is stored in the outer chamber 71a. Each state at the processing position is shown. 7 and 8, the structure of the rotor 34 is shown simply.

The outer chamber 71a has a cylindrical body 61a,
Ring member 62 disposed on one end surface of cylindrical body 61a
b, a sealing mechanism 63b disposed on the inner peripheral surface of the ring member 62b, a processing liquid discharge nozzle 53 formed with a large number of processing liquid discharge ports 54 in the horizontal direction, and attached to the cylindrical body 61a; It has a nozzle case 57 for accommodating the liquid discharge nozzle 53, and an exhaust / drain pipe 65a provided at the lower part of the outer chamber 71a for discharging the processing liquid and also for exhausting.

The inner chamber 71b includes a cylindrical body 61b,
Ring members 66a and 6 disposed on the end face of the cylindrical body 61b
6b, two seal members 67a and 67b provided on the inner peripheral surfaces of the ring members 66a and 66b, and a plurality of processing liquid discharge ports 56 are formed in the horizontal direction.
b, a processing liquid discharge nozzle 55 attached to the nozzle b, a nozzle case 58 accommodating the processing liquid discharge nozzle 55, and an exhaust / drain provided at a lower portion of the inner chamber 71b to discharge and exhaust the processing liquid. A tube 65b. In the chamber 3b, a disk 92a,
A ring member 92b and a cylindrical body 91 are provided, a cleaning liquid discharge nozzle 73a and an exhaust pipe 73c are provided on the disk 92a, and a gas supply nozzle 93 and an exhaust pipe 9 are provided on the cylindrical body 91.
4 are provided.

As shown in FIG. 2, the X-axis slide mechanism 120 for sliding the inner chamber 71b in the X direction includes a support portion 123 attached to the boundary wall 59, and a linear guide 122 provided on the support portion 123. , Moving along the linear guide 122 and having a connecting member 121 connected to the ring member 66b of the inner chamber.
A drive mechanism such as an air cylinder (not shown) that slides the connecting member 121 is provided at 23.

A seal mechanism 63a is provided at a portion corresponding to the outer periphery of the rotor entrance / exit port 62c formed on the vertical wall 62a. When the rotor 34 enters the outer chamber 71a, the rotor entrance / exit port 62c becomes The lid 33 is closed by a lid 33 provided in the rotation mechanism 27,
Is sealed by a seal mechanism 63a between the outer peripheral surface of the rotor and the rotor entrance / exit 62c.

Wafer transfer chamber 3 at rotor entrance / exit 62c
In the lower part on the a side, when the rotor rotation mechanism 27 is moved so as to retreat the rotor 34 from the outer chamber 71a,
A liquid receiver 62e is provided to prevent the cleaning liquid and the like adhering to the lid 33, the seal mechanism 63a and the like from leaking from the rotor entrance / exit port 62c.

The outer diameter of the ring member 62b constituting the outer chamber 71a is set larger than the outer diameter of the vertical wall 62a, and the cylindrical body 61a is closer to the ring member 62b than the lower end of the vertical wall 62a. It is arranged with a gradient so that the lower end is located lower. Various processing liquids discharged toward the wafer W from the processing liquid discharge nozzle 53 in this manner
Naturally, it flows on the bottom surface of the cylindrical body 61a from the side of the vertical wall 62a to the side of the ring member 62b, and is discharged to the outside through the exhaust / drainage pipe 65a.

The processing liquid discharge nozzle 53 is supplied with a processing liquid such as pure water, IPA or various chemical liquids or a dry gas such as nitrogen (N ₂ ) gas from a processing liquid supply source such as the chemical liquid supply unit 5. These processing liquids and the like can be discharged from the discharge port 54 toward the wafer W held by the rotor 34. The processing liquid discharge nozzle 53 is 1 in FIGS.
Although only a book is shown, a plurality of books can be provided, and it is not always necessary to provide the book directly above the cylindrical body 61a. The same applies to the processing liquid discharge nozzle 55.

The cylindrical body 61b constituting the inner chamber is formed in a cylindrical shape, and a lower part thereof projects from the cylindrical body 61b to facilitate discharge of the processing liquid to the outside. A groove 69 having a gradient is formed. For example, when the inner chamber 71b is at the processing position, the processing liquid discharged toward the wafer W from the processing liquid discharge nozzle 55 flows through the groove 69 and exhaust / drain pipe 65b.
Discharged to the outside. The processing liquid discharge nozzle 55 is supplied with processing liquids such as various chemical liquids, pure water, and IPA from a processing liquid supply source such as the chemical liquid supply unit 5, and is directed from the processing liquid discharge port 56 toward the wafer W held by the rotor 34. Thus, these processing liquids and the like can be discharged.

When the inner chamber 71b is at the processing position, as shown in FIG. 8, the space between the inner peripheral surface of the ring member 66a and the lid 33 is sealed by a seal mechanism 67a. The seal mechanism 63b seals between the ring member 62b and the ring member 66b, and the seal mechanism 67b seals between the ring member 66b and the disk 92a. Thus, the processing chamber 52 is formed when the inner chamber 71b is at the processing position.

On the other hand, in the state shown in FIG. 7 in which the inner chamber 71b is in the retracted position, the space between the ring member 66a and the ring member 62b is sealed by the seal mechanism 63b, and the space between the ring member 66a and the disk 92a is formed. Are sealed by a sealing mechanism 67a.
Further, since the rotor entrance / exit port 62c is closed by the lid 33 and the seal mechanism 63a, the processing chamber 51 is formed when the inner chamber 71b is at the evacuation position. For example, after the chemical solution processing in the processing chamber 52 ends,
In the processing chamber 51, a water washing process and a drying process of the wafer W are performed.

A cleaning liquid or a drying gas for cleaning and drying the disk 35a can be discharged from a cleaning liquid discharge nozzle 73a provided on the disk 92a.
From the cleaning liquid discharge nozzle 73b provided on the disk 35b.
A cleaning liquid and a drying gas for cleaning and drying the liquid can be discharged. Further, the cleaning liquid discharge nozzles 73a and 73b
In order to set the processing chambers 51 and 52 to a predetermined gas atmosphere, for example, oxygen (O ₂ ) gas or carbon dioxide (C
O ₂ ) gas or the like can be discharged.
The processing chambers 51 and 52 can be evacuated from the exhaust pipe 73c provided at the bottom.

When the inner chamber 71b is in the retracted position, the space between the ring member 66a and the disk 92a is sealed, and the space between the ring member 66b and the ring member 92b is sealed by the seal mechanism 67b. A narrow annular space 72 is formed between the outer periphery of the tubular body 91 and the inner periphery of the tubular body 61b. The cleaning liquid is discharged from the processing liquid discharge nozzle 55 into the annular space 72, and thereafter, a dry gas such as nitrogen gas is injected from the gas supply nozzles 93 and the processing liquid discharge nozzle 55 provided at a plurality of locations in the cylindrical body 91, By performing exhaust from the exhaust pipe 94 and the exhaust / drain pipe 65b,
The inner peripheral surface of the inner chamber 71b can be cleaned. The cleaning liquid may be discharged from the gas supply nozzle 93.

The chemical liquid supply unit 5 includes, for example, a tank for storing a chemical liquid discharged from the processing liquid discharge nozzle 55 and various processing liquids such as IPA, and a pump for sending a chemical liquid and the like from the tank to the processing liquid discharge nozzle 55. A switch for switching between pure water, nitrogen gas, etc. supplied from the outside and a chemical solution is provided, and a flammable gas leak detection sensor, fire detection sensor, fire extinguishing nozzle, etc. are provided. Have been.
These leak detection sensor, fire detection sensor, and fire extinguishing nozzle are also provided in the chamber 3b.

Next, an example of the cleaning process of the case where the wafer W stored in the hoop F placed on the hoop stage 2a is cleaned will be described. Here, it is assumed that the transfer arm 17a is used for transferring an unprocessed wafer W, and the transfer arm 17b is used for transferring a cleaned wafer W.

First, the FOUP F containing 25 wafers W is placed on the FOUP stage 2a. The window 12a is opened so that the inside of the FOUP F and the inside of the wafer transfer unit 4 are in communication with each other, and the number of wafers W in the FOUP F and the storage state are inspected using the wafer inspection apparatus 110. If no abnormality is detected in the stored state of the wafers W in the FOUP F, the transfer arm 17a accesses the FOUP F and unloads 25 wafers W from the FOUP F.

Next, the wafer transfer mechanism 16 is operated so that the transfer arm 17a can access the rotor 34, and
The window 25a is opened. At this time, in the wafer transfer chamber 3a, the holder opening / closing mechanism 80 accesses the rotor 34 so that the holder 83 is opened. The transfer arm 17a is slid to the rotor 34 side to load the wafer W into the rotor 34. Then, after closing the holder 83, the transfer arm 17a is returned to the original position, and the holder opening / closing mechanism 80 is also moved to the retracted position. Thus, the loading of the wafer W into the rotor 34 is completed.

The attitude conversion mechanism 28, the Z-axis linear drive mechanism 29, and the X-axis linear drive mechanism 30 are arranged so that the rotor 34 enters the outer chamber 71a and the rotor entry / exit port 62c is closed by the lid 33. Is driven to move the rotor rotation mechanism 27, the inner chamber 71b is slid to the processing position in the outer chamber 71a, and the seal mechanisms 63a, 63b, 67a, 67b are operated to form the processing chamber 52.

Next, the motor 31 is driven to rotate the rotor 34.
While rotating, a predetermined chemical is supplied from the processing liquid discharge nozzle 55 to perform the chemical processing, and then IPA is discharged from the processing liquid discharge nozzle 55 in the processing chamber 52 to perform pre-cleaning for removing the chemical. Thereafter, the inner chamber 71b is moved to the retreat position, and the processing chamber 5 by the outer chamber 71a is moved.
1 is formed, and pure water is discharged from the processing liquid discharge nozzle 53 while rotating the wafer W to perform a water washing process. Wafer W
After the water washing process is completed, the drying process is performed by rotating the wafer W at a predetermined number of revolutions while blowing nitrogen gas onto the wafer W. With respect to the inner chamber 71b that has been moved to the retracted position during the water washing processing of the wafer W, the inner chamber 71b is cleaned using the formed annular space 72.

While the cleaning processing of the wafer W is being performed in the cleaning processing unit 3 in this manner, in the wafer transfer unit 4, the transfer arm 17 b is in a state where the rotor 34 can be accessed. When the cleaning process of the wafer W is completed, the rotor rotation mechanism 27 drives the X-axis linear drive mechanism 30 and the like to return the rotor 34 to a position where the wafer W can be transferred between the transfer arms 17a and 17b and the rotor 34. . With the holder 83 closed, the window 25a is opened, and the slide mechanism 20b is operated to move the transfer arm 17a.
b is inserted into the rotor 34.

The holder opening / closing mechanism 80 accesses the rotor 34 to open the holder 83, returns the transfer arm 17 b to the original position, and unloads the cleaned wafer W from the rotor 34. The transfer arm 17b is accessed to the FOUP F, the wafer W after the cleaning processing is carried into the FOUP F, and the cleaning processing is completed.

In order to perform such a cleaning process accurately,
The cleaning apparatus 1 is assembled while various driving mechanisms are fixed at appropriate positions during the manufacturing process. But,
After the cleaning apparatus 1 is assembled in a factory or the like in this way, it is disassembled into units and drive mechanisms, transported to a place where it is actually used, and reassembled at that place and used. At the time of this assembling, for example, the outer chamber 71a is moved so that the rotor rotating mechanism 27 and the inner chamber 71b can enter and exit from the outer chamber 71a, and the rotor rotating mechanism 27 can be housed in the inner chamber 71b. On the other hand, when the inner chamber 71b and the rotor rotation mechanism 27 are slid in the X direction, it is necessary to first accurately perform axis alignment.

More specifically, the axis alignment for accurately sliding the rotor rotation mechanism 27 and the inner chamber 71b in the X direction is performed by fixing the X-axis linear drive mechanism 30 and the X-axis slide mechanism 120, that is, the X-axis Linear drive mechanism 3
0 base part 46 and support part 1 of X-axis slide mechanism 120
This is done by precisely determining the fixed position of the 23.
This is because, for example, if the fixed position of the X-axis linear drive mechanism 30 is incorrect, no matter how much the position of the Z-axis linear drive mechanism 29 or the like attached to the X-axis linear drive mechanism 30 is adjusted. This is because the Z-axis linear drive mechanism 29 and the rotor rotation mechanism 27 cannot be accurately slid in the X direction.

FIGS. 9 and 10 show the base portion 46 and the support portion 12.
FIG. 9 is an explanatory view showing an attachment form of the base unit 3, and FIG.
6 shows the structure of the support unit 123 and the use of the positioning device 150. FIG. 10 shows a state in which the Z-axis linear drive mechanism 29 and the like are attached to the base unit 46, and the inner chamber 71b and the like are attached to the support unit 123. Is shown. The laser light source 154, the slits 153 a and 153 b, the target 15
A positioning device 150 having 3c and 153d is used.

The base portion 46 includes a laser light source 154 provided near the four corners thereof and slits 153a and 153b.
And the target 153c / 153d, the boundary wall 5
9 can be attached to the frame 59a,
By changing the screw-in depth of the depth adjusting bolts 151a to 151d, the mounting angle of the base 46 can be finely adjusted. The frame 59a is provided with projections 59b and 59b 'to which height adjustment bolts 152a and 152a' are attached. The height of the height adjustment bolts 152a and 152a 'is adjusted, and the tip thereof is used as a base. By contacting the bottom surface of the portion 46, the inclination of the base portion 46 in the X direction can be finely adjusted.

Slits 153a and 153b are provided on the surface of the base portion 46 (the ZX surface (side surface in the Y direction)) at predetermined intervals in the X direction.
Further, the laser light source 154 can be arranged laterally in the X direction of the slit 153a, and the laser oscillated from the laser light source 154 proceeds to the support portion 123 side through the slits 153a and 153b. At this time, the laser is
153b It is possible to pass only through the central part, and the diameter of the laser is reduced. The cleaning apparatus 1
2 to 4 showing the entire structure of the slit 153a / 1
53b and the like are not shown.

The slits 153a and 153b are precisely fixed to the surface of the base 46 so that the direction of travel of the laser beam and the upper surface of the base 46 (the XY plane (side surface in the Z direction)) are parallel. . The longitudinal direction of the guide 49 provided on the base portion 46 is also parallel to the upper surface of the base portion 46.

When the laser beam emitted from the laser light source 154 has a small beam diameter, the slits 153a and 153
In place of b, a laser-transmissive member such as a glass member on which rectangular coordinates are imprinted can be used, and the laser light emitted from the laser light source 154 passes through the intersection of the rectangular coordinates so that The position can also be adjusted.

The support portion 123 has the same structure as the base portion 46, and is attached to the frame 59a constituting the boundary wall 59 by depth adjusting bolts 151a 'to 151d' provided near the four corners. By changing the screw-in depth of the depth adjusting bolts 151a 'to 151d', the mounting angle of the support portion 123 can be finely adjusted. The frame 59a is provided with projections 59c and 59c 'to which height adjustment bolts 152b and 152b' are attached, and adjusts the height of the height adjustment bolts 152b and 152b 'to support the tip. By contacting the bottom surface of the portion 123, the support portion 123
Can be finely adjusted in the X direction.

The targets 153c and 153d are provided on the surface of the support portion 123 (the ZX plane (side surface in the Y direction)) at predetermined intervals in the X direction. The targets 153c and 153d are made of a laser permeable material such as a thermal shock resistant glass or a quartz glass.
On the surface, rectangular coordinates (YZ coordinates) with the horizontal axis being the Y axis and the vertical axis being the Z axis are engraved. Target 153
The targets 153c and 153d are accurately fixed to the surface of the support portion 123 such that straight lines connecting the intersections of the rectangular coordinates marked on c and 153d are parallel to the upper surface of the support portion 123. The longitudinal direction of the linear guide 122 provided on the support 123 is parallel to the upper surface of the support 123.

FIG. 11 is an explanatory view showing one embodiment of a process of attaching the base portion 46 and the support portion 123. Here, Steps 1 to 6 are initial adjustment steps of the attachment of the base portion 46 and the support portion 123, and Steps 7 to 9 are processes of readjusting the base portion 46 and the support portion 123 later.

First, the depth adjustment bolts 151a to 151a are adjusted by using a level so that the upper surface of the base portion 46 is horizontal.
1d and height adjustment bolts 152a and 152a 'are adjusted (step 1). Next, the depth adjustment bolt 1 is similarly set using a level so that the upper surface of the support portion 123 is horizontal.
51a 'to 151d' and height adjustment bolt 152b.
152b 'is adjusted (step 2). Subsequently, the laser oscillated from the laser light source 154 is supplied to the slit 153a.
After passing through the center of 153b, the targets 153c and 15c
The position of the laser light source 154 is adjusted so as to fall to the 3d side (step 3).

The laser emitted from the laser light source 154 and passing through the slits 153a and 153b
Coordinates (Yc, Z) passing through 53c and 153d, respectively.
c) and (Yd, Zd) are measured (step 4), and the depth adjusting bolts 151a to 151d of the base 46 are adjusted so that the horizontal coordinate values Yc and Yd are both 0 (zero) (step 4). 5). In step 5, the depth adjusting bolts 151a to 151d are adjusted so that the horizontality of the upper surface of the base portion 46 is maintained.

Subsequently, the height adjusting bolts 152b and 152b 'of the support portion 123 are adjusted so that the vertical coordinate values Zc and Zd of the targets 153c and 153d are both 0 (step 6). In step 6, since only the height adjustment bolts 152b and 152b 'of the support portion 123 are adjusted, the values of the horizontal coordinate values Yc and Yd are both 0.
As it is, it does not change.

The laser emitted from the laser light source 154 and passing through the slits 153a and 153b passes through the intersection of the rectangular coordinates marked on the targets 153c and 153d. That is, the sliding directions of the rotor rotation mechanism 27 and the inner chamber 71b are completely parallel.
After this state, as shown in the explanatory view of FIG. 10, the Z-axis linear drive mechanism 2
9, the posture changing mechanism 28 and the rotor rotating mechanism 27 are attached to the guide 49 in a predetermined order, and the connecting member 121, the inner chamber 7
1b and the like are attached to the linear guide 122 according to a predetermined procedure, and finally the positions of the rotor rotation mechanism 27 and the inner chamber 71b are adjusted. Reference numeral 39c in FIG. 10 denotes a motor connected to the ball screw 39a, and reference numeral 124 denotes a motor.
Is an air cylinder that slides the connecting member 121 along the linear guide 122.

By adjusting the fixed position of the outer chamber 71a, the rotor 34 is moved to the inner chamber 71b and the outer chamber 71a, and the lid 33 is moved to the outer chamber 7a.
1a can smoothly enter / leave without collision or the like. Further, the inner chamber 71b can be moved in and out of the outer chamber 71a in a predetermined state. At this time, the lid 33 is made to enter / exit at the center of the rotor entrance / exit 62c, and the variation in the gap between the side surface of the lid 33 and the side of the rotor entrance / exit 62c can be reduced. Sealing can be performed uniformly by the sealing mechanism 63a, and the occurrence of liquid leakage can be more reliably prevented.

By the way, when the step 6 is completed, the mounting of the base portion 46 and the support portion 123 to the frame 59a is completed. However, after the step 6 is completed, the base portion 46, the surface of the support portion 123 and the frame 59a. Gauges 161 for measuring the distance from the base are arranged at the four corners of the base 46, and the distance is measured and recorded (step 7).
Here, FIG. 9 shows the gauges 161 at only two locations for each of the base portion 46 and the support portion 123. The distance between the targets 153c and 153d, the distance between the target 153c and the slit 153b, and the position where the gauge 161 is attached and the target 1
The positional relationship with 53c and 153d is recorded (step 8).

When the positions of the rotor rotation mechanism 27 and the inner chamber 71b are shifted due to the use of the cleaning apparatus 1, each gauge 161 is recorded first using the numerical value of the gauge 161 thus recorded. Depth adjustment bolts 151a to 151d and 151a 'to 1
By adjusting 51d ', it is possible to easily return to the initial adjustment state (step 9).

The laser light source 154 and the slit 1
53a and 153b are provided on the base portion 46 and the target 153.
Since c · 153d is attached to the support portion 123, a laser is emitted from the laser light source 154 in a state where the value of the gauge 161 is returned to the initial state, and this laser passes through the targets 153c · 153d. By examining the coordinates, the base 46 and the support 12
3 can be confirmed.

For example, when the laser is set to the target 153c · 1
When the light passes through the center of 53d, there is no problem in the mounting position of the base portion 46 and the support portion 123. Therefore, the position of the rotor rotation mechanism 27 and the like may be finely adjusted as necessary. If the laser does not pass through the centers of the targets 153c and 153d, the laser
The coordinates (Yc, Zc) and (Y
d, Zd), geometrically calculate the value to be indicated by each gauge 161 by calculation, and adjust the depth adjusting bolts 151a to 151d according to the calculated value to support the base portion 46 and the supporting member. The position of the part 123 can be adjusted.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, slits 153a and 153b and targets 153c and 153d may be provided on the upper surfaces of the base 46 and the support 123 to determine the mounting position of the base 46 and the support 123. Further, as chambers for performing liquid processing, an outer chamber 71a and an inner chamber 71b are provided.
Although the chamber 70 having the dual structure consisting of the following is exemplified, the number of chambers may be one, or three or more.
When there is only one chamber for performing the liquid processing and the chamber is fixed, the target 153c · 1
By attaching 53d to the conductor of the chamber, the sliding direction of the rotor rotation mechanism 27 can be adjusted.
The liquid processing apparatus of the present invention can be applied to all types of liquid processing apparatuses that use various chemicals, such as a coating process for applying a predetermined coating solution and an etching process. further,
Although the semiconductor wafer has been described as an example of the substrate, the substrate is not limited to this, and may be a substrate for a liquid crystal display (LCD).

[0080]

According to the liquid processing apparatus of the present invention, the positioning device for determining the direction of entry / exit of the holding means with respect to the chamber allows the holding means holding the substrate to have the side wall of the entrance / exit exit formed in the chamber. The holding means can be reliably moved into and out of the chamber without colliding with the like, and the effect of preventing breakage of the substrate and the holding means can be obtained. Further, even if a cover for closing the entrance / exit formed in the chamber is provided integrally with the holding means, the positioning device prevents the lid from colliding with the side wall of the entrance / exit / exit. At this time, the lid can be made to enter / exit at the center of the entrance / exit to reduce the dispersion of the gap between the disassembly and the side surface and the side surface of the entrance / exit / exit, so that this gap can be uniformly sealed. As a result, the entrance / exit port can be reliably closed by the lid, and the occurrence of liquid leakage can be effectively prevented.

Further, since the positioning device is always mounted on the liquid processing device, it is easy to finely adjust the mounting position of the drive mechanism and the like. Furthermore, the mounting position of the drive mechanism used for moving the holding means into and out of the chamber can be specified by a numerical value,
In addition, by recording the initial value indicating the mounting state of the drive mechanism, even when the entering / exiting direction of the holding unit is shifted,
The position of the drive mechanism can be easily returned to the initial state.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of a cleaning apparatus which is an embodiment of a liquid processing apparatus of the present invention.

FIG. 2 is a plan view of the cleaning apparatus shown in FIG. 1;

FIG. 3 is a side view showing the internal structure of the cleaning apparatus shown in FIG. 1;

FIG. 4 is another side view showing the internal structure of the cleaning apparatus shown in FIG. 1;

FIG. 5 is a perspective view showing one embodiment of a rotor.

FIG. 6 is an explanatory diagram showing a movement mode of a rotor rotation mechanism.

FIG. 7 is a cross-sectional view showing one mode in a state where the rotor has entered the chamber.

FIG. 8 is a sectional view showing another embodiment in a state where the rotor has entered the chamber.

FIG. 9 is an explanatory view showing an attachment form of a base portion for adjusting a moving direction of a rotor rotation mechanism and an inner chamber.

FIG. 10 is another explanatory view showing an attachment form of a base portion for adjusting a moving direction of the rotor rotation mechanism and the inner chamber.

FIG. 11 is an explanatory view showing a mounting process of a base portion for adjusting a moving direction of the rotor and the inner chamber.

FIG. 12 is an explanatory view showing the structure of a conventional wafer cleaning apparatus.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1: Cleaning processing apparatus 2: Hoop loading / unloading part 3: Cleaning processing unit 4: Wafer transfer unit 5, Chemical liquid supply unit 16; Wafer transfer mechanism 27; Rotor rotation mechanism 28; Attitude conversion mechanism 29; Z-axis linear drive mechanism 30; X-axis linear drive mechanism 46; base part 71a; outer chamber 71b; inner chamber 120; X-axis slide mechanism 123; support part 150; positioning device 151a to 151d 151a 'to 151d'; depth adjustment bolts 152a 152a ' 152b / 152b '; Height adjustment bolts 153a / 153b; Slits 153c / 153d; Target 154; Laser light source 161; Gauge F; Hoop W; Semiconductor wafer (substrate)

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/304 H01L 21/304 648J 21/30 564C 21/306 569C 21/306 JF Term (Reference) 5F031 CA02 CA05 DA08 EA14 FA01 FA09 FA11 FA12 GA03 GA46 GA48 GA49 GA50 HA24 HA27 HA29 HA42 HA45 HA48 HA56 HA57 HA58 HA59 HA60 JA01 JA05 JA07 JA13 JA25 JA28 JA29 JA43 KA11 KA12 KA20 LA12 LA15 MA23 NA03 NA16 NA18 PA20 PA21 EE27 EE27 EE27 EE27 EE27 5F046 CD01 JA05 JA10 JA16 LA05 LA06 LA08

Claims (16)

[Claims] 1. A liquid processing apparatus for performing predetermined liquid processing on a substrate, comprising: holding means capable of holding a plurality of substrates substantially in parallel at predetermined intervals; and holding the holding means to be held by the holding means. A chamber for performing a predetermined liquid treatment on the substrate, a holding means moving device for moving the holding means into and out of the chamber, and an arrangement position of the holding means moving apparatus for adjusting the position of the holding means. And a positioning device for determining an entry / exit direction with respect to the chamber. 2. The positioning device, comprising: a laser light source; a laser control unit that matches a traveling direction of a laser oscillated from the laser light source with an entry / exit direction of the holding unit with respect to the chamber; A target to be irradiated with the laser that has passed therethrough, and a direction adjusting mechanism that adjusts the direction of entry and exit of the holding unit by adjusting the direction of the laser that has passed through the laser control unit. In a state where the entering / exiting direction of the holding unit is adjusted so that the laser that has passed through the laser control unit is irradiated on a predetermined position of the target, the holding unit can enter / exit the chamber. The liquid processing apparatus according to claim 1, wherein: 3. The liquid processing apparatus according to claim 2, wherein the laser control means is a laser-transmissive member provided at a predetermined distance from the laser transmission member and displaying a rectangular coordinate. 4. A liquid processing apparatus for performing predetermined liquid processing on a substrate, comprising: holding means capable of holding a plurality of substrates substantially in parallel at predetermined intervals; and an entrance / exit port for the holding means to enter / exit. Is formed, a chamber for housing the holding means and performing a predetermined liquid treatment on the substrate held by the holding means, and closing the entrance / exit port in a state where the holding means is housed in the chamber. A lid integrally formed with the holding means, and the holding means is moved in and out of the chamber,
And a holding means moving device for moving the lid into and out of the entrance / exit port, and adjusting the arrangement position of the holding means moving device to adjust the position of the holding means and the lid body to the chamber and the entrance. And a positioning device for determining an entry / exit direction with respect to the exit. 5. A liquid processing apparatus for performing predetermined liquid processing on a substrate, comprising: holding means capable of holding a plurality of substrates substantially in parallel at predetermined intervals; and an entrance / exit port for the holding means to enter / exit. Is formed, a chamber for housing the holding means and performing a predetermined liquid treatment on the substrate held by the holding means, and closing the entrance / exit port in a state where the holding means is housed in the chamber; A cover integrally formed with the holding means, a holding means moving device for moving the holding means into and out of the chamber with the substrate held by the holding means in a substantially vertical state; A liquid processing unit comprising: a positioning device that determines an entry / exit direction of the holding unit and the lid with respect to the chamber and the entrance / exit port by adjusting an arrangement position of the device; and A container loading / unloading section in which loading / unloading of a container in which a plurality of substrates are stored in substantially parallel with the main surface as a horizontal plane is performed, and the substrate is substantially moved between the container arranged in the container loading / unloading section and the holding means. A substrate transport unit that transports the substrate in a horizontal state. 6. A rotating mechanism for rotating the holding means,
The holding mechanism, the lid, and the rotating mechanism are provided on a side opposite to the holding unit with the lid interposed therebetween, and are integrally formed.
A liquid processing apparatus according to claim 1. 7. The holding means moving device, wherein a posture in which the main surface of the substrate held by the holding means is held in a substantially horizontal state and a state in which the main surface of the substrate held by the holding means is substantially vertical A posture conversion mechanism for performing a posture change between the postures held by the above, an elevating mechanism for elevating the holding means together with the posture conversion mechanism, and a substantially horizontal direction together with the posture conversion mechanism and the elevating mechanism. The liquid processing apparatus according to any one of claims 4 to 6, further comprising: a horizontal sliding mechanism that slides. 8. The horizontal slide mechanism includes: a base portion attached to a wall surface of a liquid processing apparatus; a linear guide provided on the base portion; and a connecting member fitted to the linear guide and holding the elevating mechanism. The liquid processing apparatus according to claim 7, further comprising: a driving mechanism configured to move the connecting member in a substantially horizontal direction along the linear guide. 9. A gauge for measuring a distance between the base portion and a wall surface of the liquid processing apparatus to which the base portion is attached is provided at a predetermined location, and the base portion is set so that a value indicated by the gauge becomes a predetermined value. 9. The liquid processing apparatus according to claim 8, wherein the holding unit can enter / exit the chamber by adjusting a mounting position of the holding unit on the wall surface. 10. An outer chamber fixed at a processing position for performing liquid processing on a substrate held by the holding means, and an inner chamber capable of containing the holding means and housed in the outer chamber. And a double structure comprising: a chamber, wherein the inner chamber is movable substantially horizontally between a processing position in the outer chamber and a retracted position outside the outer chamber by a chamber moving mechanism. The liquid processing apparatus according to any one of claims 4 to 9, wherein 11. The chamber moving mechanism includes: a support portion fixed to a wall surface of a liquid processing apparatus; a linear guide provided on the support portion; and a connection that fits with the linear guide and holds the inner chamber. The liquid processing apparatus according to claim 10, further comprising: a member; and a chamber driving mechanism that moves the inner chamber substantially horizontally. 12. A gauge for measuring a distance between the support portion and a wall surface of the liquid processing apparatus to which the support portion is attached is provided at a predetermined location, and the support portion is set so that a value indicated by the gauge becomes a predetermined value. The liquid processing apparatus according to claim 11, wherein the inner chamber can enter / exit with respect to the outer chamber by adjusting an attachment position of the inner chamber to the outer wall. 13. The positioning device, comprising: a laser light source; a laser control unit for causing a traveling direction of a laser oscillated from the laser light source to coincide with an entering / exiting direction of the holding unit and the lid; A target to be irradiated with the laser that has passed through, and a direction adjusting mechanism that adjusts the direction of entry and exit of the holding unit and the lid by adjusting the direction of the laser that has passed through the laser control unit, The holding unit and the cover are adjusted in a state where the direction of entry / exit of the holding unit and the cover is adjusted so that the laser that has passed through the laser control unit is irradiated to a predetermined position of the target by the direction adjustment mechanism. 13. The body according to claim 4, wherein a body is capable of entering / exiting the chamber and the entrance / exit respectively. The liquid processing apparatus according to claim 1. 14. The liquid processing apparatus according to claim 13, wherein said laser control means is attached to said base portion. 15. The device according to claim 13, wherein the target is fixed to the support.
5. The liquid processing apparatus according to 4. 16. The target is two laser transmission plates arranged at a predetermined distance from each other, and a laser oscillated from the laser light source and passed through the laser control means is used as the laser transmission plate of the two laser transmission plates. The liquid processing apparatus according to any one of claims 13 to 15, wherein the holding unit is capable of entering / leaving the chamber in a state where the liquid passes through a predetermined position at the same time.