JP2002343677A - Laminated electronic component with built-in capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a laminated electronic component having built-in capacitor where the strength of bonding between dielectric sheets with capacitor electrodes formed thereon is enhanced and the variations in insertion loss characteristics from one mounting face to another of a laminate are reduced and which does not require taking into consideration the directionality, when the laminate is mounted. SOLUTION: A laminated feedthrough capacitor comprises first and second ground electrodes 21 and 22 formed on first and second dielectric sheets 11 and 12, respectively, and hot electrodes 23 formed on dielectric sheets 13. The laminated electronic component may be constituted as an LC composite part with an inductor which is laminated in addition. Both the ends of the ground electrodes 21 and 22 are led out in a directions such that the ends are orthogonal to each other, and the portions led out are used as lead out electrode portions 21a and 22a and further connected with a ground external electrode 29. The laminate 25 is mounted on a circuit board, with either of the side faces 25a and 25b thereof being used as a mounting face.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a multilayer electronic component,
For example, the present invention relates to a multilayer electronic component with a built-in capacitor used as a multilayer feedthrough capacitor, a multilayer LC noise filter, and the like.

[0002]

2. Description of the Related Art FIGS. 6A and 6B show an example of a conventionally known multilayer feedthrough capacitor. This capacitor is formed by laminating a dielectric sheet 1 on which a ground electrode 5 is formed, a dielectric sheet 2 on which a hot electrode 6 is formed, and a number of dielectric sheets 3 on which via holes 7a are formed. Note that the sheet 3 does not necessarily need to be a dielectric, but may be an insulator.

A via hole 7 a and a hot electrode 6 are connected in series via a via hole 7 c formed in each dielectric sheet 2 and a via hole 7 b formed in each dielectric sheet 1. It is connected to the output external electrode 8.

The ground electrode 5 is provided with a lead electrode portion 5a drawn out at opposite ends of the dielectric sheet 1, and the ground electrode 5 is connected to a ground external electrode 9 provided at the central portion of the laminated body 4 by the lead electrode portion 5a. It is connected.

[0005]

However, FIG.
In the multilayer feedthrough capacitor having the configuration shown in (A) or (B), the dielectric sheet 1 on which the ground electrode 5 is formed is only joined on both sides to the vertically adjacent sheet 2. The bonding portion 1a is not only small in area but also unevenly distributed in a part, and the adhesive force between the sheets 1 and 2 is weak. There was a problem that occurred.

In addition, although one of the side surfaces 4a and 4b of the laminated body 4 is mounted on a circuit board as a mounting surface,
As shown by the curves B and C in FIG. 5, the insertion loss characteristic is large when the side surface 4a is a mounting surface (referred to as horizontal installation) and when the side surface 4b is a mounting surface (referred to as vertical installation). There was variation, and therefore, there was the complexity of having to provide directionality during mounting.

Therefore, an object of the present invention is to increase the bonding strength of a dielectric sheet on which a capacitor electrode is formed, to reduce the variation in insertion loss characteristics even if any side surface of the laminate is used as a mounting surface, and to improve the directionality during mounting. An object of the present invention is to provide a multilayer electronic component with a built-in capacitor that does not require much consideration.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a multilayer electronic component with a built-in capacitor comprising a dielectric sheet on which a capacitor electrode is formed. And a first and second ground electrode formed on the second dielectric sheet, respectively, and a hot electrode formed on another dielectric sheet, and the first and second ground electrodes are Each of the first and second ground electrodes includes an extraction electrode portion extending to a different end of the dielectric sheet, and the extraction electrode portions of the first and second ground electrodes are connected to a ground external electrode on a side surface of the laminate. Are connected to via holes penetrating through the inside of the laminated body, and both ends of the via holes are connected to input / output external electrodes at end faces of the laminated body.

In the multilayer electronic component with a built-in capacitor having the above-described structure, at least the extraction electrode portions of the pair of ground electrodes are extended to different ends.
The area where the dielectric sheet on which the ground electrode is formed is joined to another sheet is increased, and the junction is not unevenly distributed. Therefore, even if an external force acts on the laminate, the possibility that cracks are generated is reduced.

[0010] In addition, regardless of which side surface of the laminate is mounted on the circuit board as a mounting surface, in other words, regardless of whether the laminate is placed horizontally or vertically, the variation in insertion loss characteristics is small. This means that the direction at the time of mounting is lost.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a multilayer electronic component with a built-in capacitor according to the present invention will be described below with reference to the accompanying drawings.

FIGS. 1A and 1B show a multilayer feedthrough capacitor according to an embodiment of the present invention. The multilayer feedthrough capacitor includes a first dielectric sheet 11 on which a first ground electrode 21 is formed, a second dielectric sheet 12 on which a second ground electrode 22 is formed, and a dielectric sheet on which a hot electrode 23 is formed. 13 are laminated in the order shown in FIG. 1 (A), and a large number of dielectric sheets
4 are laminated. Note that the sheet 14 does not necessarily need to be a dielectric, but may be an insulator.

The via hole 24a and the hot electrode 23
A via hole 24d formed in each dielectric sheet 13 and a via hole 24b formed in the center of the non-electrode regions 11b and 12b located at the center of each of the dielectric sheets 11 and 12 are formed.
Via holes that are connected in series via 24c and formed linearly so as to penetrate the laminate 25 are connected to input / output external electrodes 28 provided on both end surfaces of the laminate 25 by via holes 24a at both ends. .

The first ground electrode 21 and the second ground electrode 22 are provided with extraction electrode portions 21a and 22a extending in directions orthogonal to each other on opposite end sides of the dielectric sheets 11 and 12, respectively. That is, the extraction electrode portion 21a of the first ground electrode 21 is extracted in the X direction, and the extraction electrode portion 22a of the second ground electrode 22 is extracted.
Are drawn in the Y direction (perpendicular to the X direction). In other words, the first ground electrode 21 and the second ground electrode 22 form a sheet on which the same electrode pattern is formed by 90
。It is used by rotating. And each extraction electrode part 2
Reference numerals 1a and 22a are connected to a ground external electrode 29 provided so as to wind a central portion of the laminate 25.

The multilayer feedthrough capacitor having the above configuration is manufactured by a conventionally known method. The equivalent circuit is the same as the conventional feedthrough capacitor shown in FIG. First
Joint part 11 in which the dielectric sheet 11 is joined to another sheet
Although a is substantially equal to that of the conventional capacitor, the joint portion 12a where the second dielectric sheet 12 is joined to another sheet is provided widely. Therefore, the adhesion between the sheets and the joining force are improved without the small joining portion being unevenly distributed in a part as in the conventional capacitor, and problems such as the occurrence of cracks in the laminate 25 due to the action of the external force are reduced.

Further, the capacitor of the present invention is a laminate 25
Can be mounted on the circuit board with the side surface 25a as the mounting surface (horizontal installation) or mounted on the circuit board with the side surface 25b as the mounting surface (vertical installation).
The insertion loss characteristics are shown in FIG.
The same characteristics are exhibited and the variation is small in any case of vertical installation. Therefore, it is not necessary to consider the direction at the time of mounting, and the mounting operation is simplified.

The multilayer electronic component with a built-in capacitor according to the present invention is not limited to the above embodiment, but can be variously modified within the scope of the invention.

For example, as shown in FIG.
The ground electrodes 21 and 22 are formed in a substantially L-shaped pattern, and the extraction electrode portions 21a and 22a are
It may be drawn to 1,2 different end sides. In this case, the first ground electrode 21 and the second ground electrode 22 are formed by forming a sheet on which the same electrode pattern is formed by 180.
゜ It will be used after rotating.

Also, the first and second dielectric sheets 11,
In the embodiment, the lamination state of the sheet 12 is changed from the sheet 1 from the top.
1, 12, 11, 12, but as shown in FIG. 3 (A), sheets 11, 11, 12, 12, 11, 11,
11, or as shown in FIG.
Sheets 12, 12, 11, 11, 12, 12 from above may be used.

Further, as shown in FIG. 4, an inductor portion 32 in which a conductor is connected in a coil shape with a via hole is laminated on at least one of the upper and lower portions of the capacitor portion 31 of the laminate 25, and is used as a noise filter or the like. LC
A composite part may be configured. The external electrodes are not shown in FIG.

[0021]

As is apparent from the above description, according to the present invention, the extraction electrodes located at both ends of the first and second ground electrodes formed on the first and second dielectric sheets, respectively. Since the part is pulled out to different edges, the area where the dielectric sheet on which the ground electrode is formed is bonded to other sheets is increased, and the bonded part is not unevenly distributed. Risk of doing so is reduced. Further, even if the laminate is mounted in either the horizontal or vertical direction, the variation in insertion loss characteristics is small, and it is not necessary to consider the directionality of the laminate during mounting,
Mounting workability is facilitated.

[Brief description of the drawings]

1A and 1B show a multilayer feedthrough capacitor according to an embodiment of the present invention, wherein FIG. 1A is an exploded perspective view and FIG. 1B is a perspective view of a multilayer body.

FIG. 2 is a plan view showing another pattern of a ground electrode.

FIGS. 3A and 3B are explanatory views showing a laminated state of dielectric sheets according to another embodiment.

FIG. 4 is a perspective view of an LC composite component according to another embodiment.

5 is a graph showing the insertion loss of the multilayer feedthrough capacitor shown in FIG. 1 and also shows the insertion loss of the conventional multilayer feedthrough capacitor.

6A and 6B show a conventional multilayer feedthrough capacitor, wherein FIG. 6A is an exploded perspective view and FIG. 6B is a perspective view of a multilayer body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... 1st dielectric sheet 12 ... 2nd dielectric sheet 21 ... 1st ground electrode 22 ... 2nd ground electrode 21a, 22a ... Lead-out electrode part 23 ... Hot electrode 24a-24d ... Via hole 25 ... Laminate 28: input / output external electrode 29: ground external electrode

Claims (2)

[Claims] In a multilayer electronic component with a built-in capacitor, wherein a dielectric sheet on which a capacitor electrode is formed is laminated, a capacitor is formed on at least first and second dielectric sheets, respectively. A ground electrode, and a hot electrode formed on another dielectric sheet, wherein the first and second ground electrodes each have an extraction electrode portion extending to a different end of the dielectric sheet, The extraction electrode portions of the first and second ground electrodes are connected to a ground external electrode on a side surface of the laminate, and the hot electrode is connected to a via hole penetrating through the inside of the laminate, and both ends of the via hole are connected to the laminate. A multilayer electronic component with a built-in capacitor, characterized in that it is connected to an input / output external electrode at an end face. 2. The lead-out electrode portion of each of the first and second ground electrodes is drawn out in a direction orthogonal to each other at opposite end sides of the dielectric sheet. Multilayer electronic components with built-in capacitors.