JP2002342905A - Thin film magnetic head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deterioration of insulation performance caused by conduction between a backgap part and a conductor coil in a thin film magnetic head. SOLUTION: The thin film magnetic head includes a first conductor coil contact hole part for interconnecting first and second conductor coil layers stacked through a second insulating film 113, and a backgap part 112 for interconnecting lower and upper magnetic pole films to be interlinked with the first and second conductor coil layers, and the second insulating film 113 has an opening 113a including the backgap part 112 and the first conductor coil contact hole part. The opening 113a of the second insulating film 113 is provided with a projecting part 113b bulged to a gap between the backgap part 112 and the first conductor coil contact hole part, and a third insulating film 115 for covering the second conductor coil layer is constituted in a manner that the second insulating film 113 is exposed on the peripheral part of the opening including the backgap part 112.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head and a technique for manufacturing the same, and more particularly, to a thin film magnetic head having at least an inductive magnetic transducer and a method for manufacturing the same.
More specifically, the present invention relates to a technique that is effective when applied to an insulating film structure of a conductor coil.

[0002]

2. Description of the Related Art FIG. 20 is an external view of a slider 203 on which a thin-film magnetic head 202 according to the present invention is formed.

A thin-film magnetic head 202 is formed on an end face of a slider 203 together with a terminal 204 for recording and reproducing information.
41 (see FIG. 21).

FIG. 21 is a plan view of a thin-film magnetic head according to a reference technique of the present invention. FIG. 19 is a sectional view taken along line AA 'of the thin-film magnetic head in FIG.

As shown in FIG. 19, the thin-film magnetic head includes a substrate 101, a lower protective film 102, a reproducing head, a write head, and an upper protective film 117.

The reproducing head is a lower magnetic shield film 10.
3, a lower shield gap film 104, a magnetoresistive (hereinafter referred to as MR (Magneto Resistive)) element 106, an upper shield gap film 107, and an upper magnetic shield film 108.

On the other hand, the write head comprises a lower magnetic pole film 1.
08 (shared with upper magnetic shield film for reproducing head), gap film 109, first insulating film 110, first conductor coil layer 1
11a, second insulating film 113, second conductor coil layer 114
a, the third insulating film 115, and the upper magnetic pole film 116.

Referring to FIG. 19, there is shown an example of a thin-film magnetic head according to a reference technique of the present invention.

A lower protective film 102 is formed by depositing, for example, alumina (Al ₂ O ₃ ) or the like on a Al ₂ O ₃ —TiC-based substrate by a sputtering method or the like.

Next, a reproducing head portion and a writing head portion are sequentially formed, and the upper protective film 1 is formed in the same manner as the lower protective film.
17 is formed. Thereafter, the substrate on which the reproducing head portion, the writing head portion, and the like are formed is divided into sliders using a grindstone or the like.

The method of manufacturing the reproducing head is shown in FIGS.

A lower magnetic shield film 103 made of, for example, permalloy (Ni-Fe) is formed on the lower protective film 102 by plating or the like (FIG. 11). Next, for example, alumina (Al ₂ O ₃ ) is applied to the lower magnetic shield film 1.
03, and a lower shield gap film 104 is formed. Next, an MR film 106 for forming an MR element for reproduction is formed on the shield gap, and is formed into a desired shape by using a lithography method or the like. Subsequently, a lead terminal layer 105 for the MR film is formed by using a lift-off method or the like. Next, the lower shield gap film 104 and the MR film 10
6. Upper shield gap film 1 on lead terminal layer 105
07 is formed, and the MR film 106 and the lead terminal layer 105 are buried between the lower shield gap film 104 and the upper shield gap film 107 (FIG. 12). Subsequently, an upper magnetic shield film 108 is formed in the same manner as the lower magnetic shield film 103 (FIG. 13).

The reproducing head magnetizes the soft magnetic layer in the MR element by a magnetic field generated when a sense current flows through the MR element formed of the MR film, and applies a bias magnetic field from the soft magnetic layer to the MR element. The information is reproduced by reading the magnetic field of the magnetic recording medium in a state where the voltage is applied to the magnetic recording medium.

Next, a method of manufacturing a write head will be described with reference to FIG.
4 to FIG.

Upper magnetic shield film 108 of reproducing head
Is used as the lower magnetic pole film 108 of the write head, and a non-magnetic film such as alumina is formed on the film by a sputtering method or the like, and the gap film 109 is formed. At this time, the gap film 109 is formed on the upper magnetic pole film 11 to be formed later.
6 and an opening 112 (hereinafter, referred to as a back gap portion) for forming a magnetic path between the lower magnetic pole film 108 and the lower magnetic pole film 108
Is formed so as to have a shape in which is selectively removed.

Next, a photoresist film is formed in a shape in which the back gap portion 112 is selectively removed by using a photolithography method or the like, and the photoresist film is heated to a predetermined temperature in order to planarize the photoresist film. To form a first insulating film 110 (FIG. 14).

Next, a base film to be formed by, for example, a plating method or the like is formed on the entire surface of the first insulating film 110 by, for example, a sputtering method or the like. Conductor coil contact hole 111
After patterning the first conductor coil having b using photolithography or the like, the first conductor coil is formed using plating, for example. After that, the underlying film existing other than the conductor coil portion is removed by using, for example, an ion milling method. Thereby, the first conductor coil layer 111a is formed (FIG. 15).

Next, a photoresist film is formed by using a photolithography method or the like at a position other than the back gap portion 112 and the first conductor coil contact hole portion 111b on the first conductor coil layer 111a. This photoresist film is flattened and the first conductor coil layer 111 is formed.
A heat treatment is performed at a predetermined temperature to insulate between a, thereby forming a second insulating film 113 (FIG. 16).

Next, a base film is formed on the second insulating film 113 and the entire surface of the first conductor coil contact hole portion 111b of the first conductor coil layer 111a by, for example, a plating method by a sputtering method or the like. After forming a film and forming a second conductor coil having a second conductor coil contact hole portion 114b for conducting between the conductor coils on the base film using a photolithography method or the like, a pattern is formed. A second conductor coil is formed using the method. After that, the underlying film existing other than the conductor coil portion is removed by using, for example, an ion milling method. Thereby, the second conductor coil layer 114a is formed (FIG. 17).

After forming the second conductor coil layer 114a,
Second conductor coil layer 114 excluding back gap portion 112
A photoresist film is formed on a by using a photolithography method or the like, and a heat treatment is performed at a predetermined temperature to planarize the photoresist film and insulate between the second conductor coils. 115 (FIG. 1)
8).

Next, an upper magnetic pole film 116 made of, for example, permalloy is selectively formed on the magnetic pole tip and the third insulating film 115 in the back gap 112 by photolithography or the like. The upper magnetic pole film 116 extends over the third insulating film 115 and at the back gap portion 112, the lower magnetic pole film 10
8 and is magnetically connected (see FIG. 1).
9).

The write head unit applies a current to the formed conductor coil in accordance with the write information, so that the gap film 10 between the upper magnetic pole film 116 and the lower magnetic pole film 108 at the tip of the magnetic pole is formed.
9, a magnetic field is generated to write information on the magnetic recording medium.

[0023]

In order to improve the recording characteristics of a hard disk drive, it is essential to improve the performance of a thin-film magnetic head. Generally, the flux rise time (Flux Rise T) is required to improve the performance of an inductive type thin film magnetic head.
It is known that the length of the lower magnetic pole (lower magnetic film) and the upper magnetic pole (upper magnetic film) of the portion surrounding the conductor coil portion (hereinafter, referred to as magnetic path length) is shortened. There is a way.

However, when the magnetic path length is shortened, the installation area of the conductor coil is inevitably reduced, and accordingly, the cross-sectional area of each conductor coil must be reduced. However, the reduction in the cross-sectional area causes an increase in the resistance value, the rise time of the current is extended, and the high-frequency characteristics at the time of recording are affected.
Therefore, in order to improve the performance of the inductive type thin film magnetic head, it is necessary to shorten the length of the conductor coil as well as the length of the magnetic path (hereinafter referred to as compact coil). Therefore, the size between the back gap portion and the contact hole portion was reduced in order to make a compact coil.

As a result, the third insulating film wall on the back gap side between the back gap and the contact hole becomes substantially vertical, and as a result, the resist film on the back gap becomes thicker in the photolithography step of the upper magnetic film portion, so that the exposure is performed. As a result, the positive resist material remained in the back gap. In addition, due to halation from the third insulating film wall (a phenomenon in which a resist region that should not be originally exposed to light is exposed by exposure light in a direction substantially parallel to the substrate plane that is irregularly reflected by the film wall), For example, an unnecessary resist frame or the like was formed in the opening, and a predetermined shape could not be produced. In addition, even when a negative resist material was used, a predetermined resist pattern shape could not be formed due to the influence of halation from the third insulating film wall in the same photolithography process as described above.

Therefore, the second insulating film between the back gap and the coil contact hole is removed, the openings of the back gap and the coil contact hole are integrated, and the angle of the third insulating film wall is made gentle. An attempt was made to solve the technical problem of the photolithography process described above.
Regarding the technical problem of the photolithography process, JP-A-2000-331312 discloses a second insulating film having an integrated opening in which a back gap and an opening of a coil contact hole are integrated. .

However, the following new technical problem has occurred. That is, in the removal of the base film in the second conductor coil layer forming step, the base film of the second conductor coil layer is re-attached to the second insulation film wall around the second conductor coil contact from the enlarged back gap, or the second insulation coil is removed. There was a new technical problem that a base film residue was generated at the film wall edge, the structure became conductive with the upper magnetic film, and the conductor coil and the magnetic pole were short-circuited.

An object of the present invention is to provide a thin-film magnetic head and a method of manufacturing the same which efficiently solve the technical problem in manufacturing a "compact coil" structure capable of realizing high-performance head characteristics. is there.

[0029]

The thin-film magnetic head of the present invention comprises at least a lower magnetic film, a conductor coil layer, an upper magnetic film,
A thin-film magnetic head having a first insulating film that insulates a lower magnetic film and a conductor coil layer, and a second insulating film that insulates an upper magnetic film and a conductor coil layer, and forms a magnetic path between the upper magnetic film and the lower magnetic film. A second insulating film having an opening including a back gap portion to be contacted and a contact hole portion for conducting the laminated conductor coil, and provided with a projection projecting toward the inside of the opening at the contour of the opening. Have. In the case where the third insulating film is provided, at least a part of the protrusion of the second insulating film has a structure exposed from the third insulating film.

In the case of a multilayer coil structure having a third insulating film or the like, a structure is provided in which at least a part of the edge of the opening of the second insulating film is exposed from the third insulating film. The protrusions of the second insulating film can prevent the residue of the coil or the upper insulating film on the upper layer of the second insulating film and the occurrence of reattachment.

The second conductor coil reattachment and residue adhering to the projections of the second insulating film are removed by, for example, ion milling after the formation of the third insulating film, so that the conductor can be removed when the upper magnetic film is formed. It can be insulated from the coil, and insulation failure can be prevented.

The back gap portion of the second insulating film and the opening of the contact hole portion are integrated, and an opening including the back gap portion and the contact hole portion is formed to form a vertical portion of the side edge of the third insulating film. It is possible to prevent the formation of the resist and prevent the remaining of the resist when the upper magnetic film is formed or the halation during the exposure.

Further, according to the present invention, an etching protection film may be provided immediately after the formation of the second conductor coil, and selective etching may be performed to perform reattachment and removal immediately after the formation of the second conductor coil. Further, the reattachment and removal may be performed by etching when removing the plating base film when forming the second conductor coil or etching when forming the upper magnetic pole.

[0034]

Embodiments of the present invention will be described below in detail with reference to the drawings.

The thin-film magnetic head of this embodiment is manufactured by the same method as that of the above-described reference example, except for the write head.

First, an example of a method of manufacturing a write head section in a thin-film magnetic head according to an embodiment of the present invention will be described with reference to FIGS. FIG.
0 is a plan view of FIG. 1 and FIG.
, And FIG. 1 shows a cross section BB ′.

In the manufacturing method according to the embodiment, first, a lower magnetic pole film 108 made of a magnetic film shown in FIG.
After performing a pre-treatment using a lift-off method or the like at a place where a gap film is not required, a non-magnetic film such as alumina is entirely formed by using a sputtering method or the like, thereby selectively forming the gap film 109. To form

Next, a photoresist film is formed in a shape in which the back gap portion 112 is selectively removed by using a photolithography method or the like, and is further heated to a predetermined temperature to planarize the photoresist film. To form a first insulating film 110.

Next, a base film to be formed by, for example, a plating method is formed on the entire surface of the first insulating film 110 by, for example, a sputtering method or the like, and a first conductive film is formed on the base film to allow conduction between the conductor coils. Conductor coil contact hole 111
After patterning the first conductive coil layer 111a having b using photolithography, the first conductive coil is grown using, for example, plating where the base film of the pattern portion is exposed. After the plating, the resist pattern is peeled off, and the underlying film other than the first conductor coil is removed by using an ion milling method or the like.
Thereby, the first conductor coil layer 111a is formed.

The first conductor coil layer 111a is spirally formed on the first insulating film 110 with the back gap 112 and the first conductor coil contact hole 111b as the centers and the first conductor coil contact hole 111b as a starting point. Is formed.

Next, as shown in FIG. 2A, a photoresist film is formed on the first conductor coil by using a photolithography method or the like. Further, a heat treatment is performed at a predetermined temperature to flatten the photoresist film and insulate between the second conductor coils, thereby removing the second insulation film between the first conductor coil contact hole portion 111b and the back gap portion 112. As shown in FIG. 9, FIG. 9 and FIG.
A second insulating film 113 having an opening 113a having left and right overhangs 3b is formed. By performing the heat treatment on the second insulating film 113, the slope of the end wall of the opening 113a of the second insulating film 113 becomes gentle.
By providing the projection 3b with the projection 113b, the slope of the projection 113b can be made gentler.

Preferably, the second insulating film 113 is formed.
The protrusion 113 c of the projection 113 b in the opening 113 a is set to be 1 to 3 times the thickness of the second insulating film 113 so that the slope of the edge of the projection 113 b of the opening 113 a of the second insulating film 113. The angle can be 55 to 70 degrees, and the reattachment and residue of the conductor coil can be easily removed. In the present embodiment, the second insulating film 113
And the overhang dimension was set to 3 μm.

Next, as shown in FIG. 3A, the second conductive film 113 and the first conductor coil contact hole 111b are formed.
On the entire surface, a base film to be formed by, for example, a plating method or the like is formed by a sputtering method or the like, and a second conductor coil contact hole portion 114b having a second conductor coil contact hole portion 114b for conducting between the conductor coils is formed on the under film. After forming a pattern on the two-conductor coil by using the photolithography method, a second conductor coil is grown by using, for example, a plating method in a portion where the underlying film of the pattern portion is exposed. After the plating, the resist pattern is peeled off, and the underlying film other than the second conductor coil is removed by using, for example, an ion milling method. Thereby, the second conductor coil layer 114a is formed.

Next, as shown in FIG. 3A, a photoresist film is formed on the second conductor coil layer 114a and the second conductor coil contact hole 114b except for the back gap portion 112 by using a photolithography method or the like. Forming
A heat treatment is performed at a predetermined temperature to planarize and insulate between the second conductor coils to form a third insulating film 115.

At this time, the configuration of the second insulating film 113 and the third insulating film 115 is as shown in FIG. 5 and FIG.
In a region surrounding the back gap 112, the opening 115a of the third insulating film 115 is formed so as to expose a part of the protrusion 113b of the opening 113a of the second insulating film 113.

In the case where the milling step is added here, the coil adhering matter and the residue adhering to the protrusion 113b of the opening 113a of the second insulating film 113 not covered by the third insulating film 115 are removed. The back gap 112 and the second conductor coil contact hole 114b.
Insulation between them can be realized. In addition to the configuration shown in FIG. 5, the configuration of the overlapping portion of the opening 113a of the second insulating film 113 and the opening 115a of the third insulating film 115 is as shown in FIGS. The same insulating effect can be obtained.

Next, an upper magnetic pole film 116 made of a magnetic film such as permalloy is selectively formed on the magnetic pole tip and the third insulating film 115 and in the back gap 112 by photolithography or the like. The upper magnetic pole film 116 contacts the lower magnetic pole film 108 at the back gap portion 112 over the third insulating film 115 and is formed as a magnetically connected structure (see FIGS. 1 and 4).

Also, the protrusion 11 of the second insulating film 113
3b to remove the reattachment and residue on the second conductor coil layer 11
It may be performed after the formation of 4a.

In this case, after the formation of the second conductor coil layer 114a, the second conductor coil contact hole 114b and the second conductor coil contact hole 114b are removed except for the protrusion 113b of the opening 113a of the second insulation film 113 using, for example, a resist film. Forming an etching protection film on the second conductor coil layer 114a,
For example, by performing etching by ion milling or the like,
It is possible to remove re-adhered substances and residues. At this time, the protrusion-shaped portion 1 of the opening 113a of the second insulating film 113 is etched by etching the re-adhered matter and residue after the formation of the third insulating film 115.
Since a wide range of re-deposits and residues can be removed in 13b, a higher insulating effect can be obtained than the removal of re-deposits and residues after the formation of the third insulating film 115. This method is also effective for a thin-film magnetic head having a single-layer conductor coil without the third insulating film 115.

Further, as shown in FIG.
Since there is no need to limit the formation position of the opening 115a of the fifth magnetic layer 5, the influence of halation in the photolithography process of the upper magnetic pole film 116 can be reduced.

Further, without adding a new process as described above, for example, by extending the processing time of the conductor coil base film removing step and the upper magnetic film base film removing step which are the steps of the reference technology, the coil reattachment material is removed. Removal is possible.

In the present embodiment, the second insulating film 113
Forming an opening 113a including the back gap 112 and the contact hole of the conductor coil layer,
Although the protrusion 113b is provided in the opening 113a, the present invention is not limited to this. The opening 113a of the second insulating film 113 is formed as shown in FIG.
8, the entire surface around the back gap 112 is exposed from the opening 115a of the third insulating film 115, or the opening 11 of the second insulating film 113 as shown in FIG.
In 3a, at least part of the periphery of the back gap 112 may be exposed through the opening 115a.

As described above, according to the present embodiment, the back gap 112 included in the opening 113a of the second insulating film 113, the first conductor coil layer 111a, the second conductor coil layer 114a, and the like. A high-performance head that can prevent the insulation performance between the magnetic pole film and the conductor coil from deteriorating due to conduction between the formed conductor coils, and prevent resist residue and poor resist frame formation due to halation in downsizing the conductor coil. Technical problems with the "compact coil" structure that enables the realization of characteristics can be efficiently solved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and can be variously modified without departing from the gist thereof. Needless to say, there is.

[0055]

According to the present invention, there is provided a thin-film magnetic head and a method for manufacturing the same, which efficiently solve the technical problem in manufacturing a "compact coil" structure capable of realizing high-performance head characteristics. Can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of a completed state of a thin-film magnetic head according to an embodiment of the present invention.

FIGS. 2A and 2B are cross-sectional views taken along lines AA ′ and BB ′ of FIG. 9 in the process of manufacturing the thin-film magnetic head according to one embodiment of the present invention, respectively. It is sectional drawing which shows an example.

FIGS. 3 (a) and 3 (b) respectively show FIGS.
FIG. 6 is a cross-sectional view illustrating an example of a cross-sectional structure (line AA ′ and line BB ′ in FIG. 5) in a step following (a) and (b).

FIG. 4 is a cross-sectional view showing an example of a cross-sectional structure in a step following FIG.

FIG. 5 is a plan view corresponding to the steps of FIGS. 3 (a) and 3 (b).

FIGS. 6A, 6B, and 6C are plan views showing modified examples of the configuration of the second insulating film and the third insulating film in the thin-film magnetic head according to one embodiment of the present invention; .

FIG. 7 is a plan view showing a modification of the configuration of the second insulating film and the third insulating film in the thin-film magnetic head according to one embodiment of the present invention.

FIGS. 8A and 8B are plan views showing a modification of the configuration of the second insulating film and the third insulating film in the thin-film magnetic head according to an embodiment of the present invention.

FIG. 9 is a plan view corresponding to FIGS. 2A and 2B of the thin-film magnetic head according to one embodiment of the present invention.

FIG. 10 is a plan view corresponding to FIG. 1 (line BB ′) and FIG. 4 (line AA ′) of the thin-film magnetic head according to one embodiment of the present invention;

FIG. 11 is a cross-sectional view illustrating a manufacturing process of the thin-film magnetic head according to the reference technology of the present invention.

FIG. 12 is a cross-sectional view following FIG. 11 showing a manufacturing step of the thin-film magnetic head according to the reference technology of the present invention;

FIG. 13 is a cross-sectional view following FIG. 12 showing a manufacturing step of the thin-film magnetic head according to the reference technology of the present invention;

FIG. 14 is a cross-sectional view following FIG. 13 showing a manufacturing step of the thin-film magnetic head according to the reference technology of the present invention;

FIG. 15 is a cross-sectional view showing a manufacturing step of the thin-film magnetic head according to the reference technology of the present invention, which is subsequent to FIG. 14;

FIG. 16 is a sectional view following FIG. 15 showing a manufacturing step of the thin-film magnetic head according to the reference technology of the present invention;

FIG. 17 is a cross-sectional view following FIG. 16 showing a manufacturing step of the thin-film magnetic head according to the reference technology of the present invention;

FIG. 18 is a sectional view following FIG. 17 showing a manufacturing step of the thin-film magnetic head according to the reference technology of the present invention;

FIG. 19 is a sectional view following FIG. 18 in a manufacturing step of the thin-film magnetic head according to the reference technology of the present invention;

FIG. 20 is an explanatory diagram of a thin-film magnetic head according to a reference technique of the present invention.

FIG. 21 is a plan view of a thin-film magnetic head according to a reference technique of the present invention.

[Explanation of symbols]

101: Substrate, 102: Lower protective film, 103: Lower magnetic shield film, 104: Lower shield gap film, 105
... Lead terminal layer,... MR film (MR element), 107
... upper shield gap film, 108 ... lower magnetic pole film (upper magnetic shield film), 109 ... gap film, 110 ... first insulating film, 111a ... first conductor coil layer, 111b ... first conductor coil contact hole, 112 ... Back gap (opening), 113: second insulating film, 113a: opening, 113b: protrusion, 113c: overhang dimension,
114a: second conductor coil layer, 114b: second conductor coil contact hole, 115: third insulating film, 115a
... opening, 116 ... top magnetic pole film, 117 ... top protective film,
201: flying rail, 202: thin-film magnetic head, 203
... Slider, 204 ... Terminal, 241 ... Magnetic recording medium.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hideharu Takahashi 18th Matsuyamacho, Moka-shi, Tochigi Hitachi Metals Co., Ltd. OE Device Division (72) Inventor Shigenori Tanaka 18th Matsuyamacho, Moka-shi, Tochigi OE Devices Hitachi Metals Co., Ltd. (72) Inventor Nobuo Yoshida 1-280 Higashi Koigakubo, Kokubunji-shi, Tokyo Inside the Central Research Laboratory, Hitachi, Ltd. (72) Inventor Ritsu Imanaka 2,880 Kozu, Kokufu, Odawara-shi, Kanagawa Prefecture F-term in the Storage Division, Hitachi, Ltd. Reference) 5D033 BA35 BA36 BA39 BA41 DA01 DA02 DA04 DA07 DA08 DA31

Claims (6)

[Claims] At least a lower magnetic film, a conductor coil layer,
A thin-film magnetic head comprising: an upper magnetic film, a first insulating film that insulates the lower magnetic film from the conductor coil layer, and a second insulating film that insulates the upper magnetic film from the conductor coil layer. The film has an opening including a back gap portion that forms a magnetic path with the upper magnetic film and the lower magnetic film and a contact hole portion of the conductor coil layer, and the contour of the opening has the back gap portion. A thin-film magnetic head having a projection projecting between said contact hole and said contact hole. 2. At least a lower magnetic film, a first conductor coil layer, a second conductor coil layer, an upper magnetic film, a first insulating film for insulating the first conductor coil layer from the lower magnetic film, and the first conductor coil A thin-film magnetic head including a second insulating film that insulates a layer and the second conductor coil layer, wherein the second insulating film includes a back gap portion that forms a magnetic path with the upper magnetic film and the lower magnetic film. A first conductor coil layer and an opening including a contact hole of the second conductor coil layer, and a contour of the opening includes a protrusion protruding between the back gap and the contact hole. A thin-film magnetic head comprising: 3. The thin-film magnetic head according to claim 2, wherein a third insulating film is provided on the second conductor coil layer, the third insulating film including the back gap portion, and A thin-film magnetic head having an opening exposing at least a part of the protrusion of the opening of the insulating film. 4. At least a lower magnetic film, a first conductor coil layer, a second conductor coil layer, an upper magnetic film, a first insulating film for insulating the first conductor coil layer from the lower magnetic film, and the first conductor coil A second insulating film insulating the layer and the second conductor coil layer, a thin-film magnetic head including a third insulating film on the second conductor coil layer, wherein the second insulating film and the upper magnetic film The lower magnetic film has a back gap portion that forms a magnetic path, and an opening that includes a contact hole portion of the first conductor coil layer and the second conductor coil layer. A thin-film magnetic head, comprising: an opening that exposes at least a part of an edge of the opening of the second insulating film. 5. A method of manufacturing a thin film magnetic head for manufacturing the thin film magnetic head according to claim 1, 2, 3, or 4. 6. A method for manufacturing a thin-film magnetic head for manufacturing a thin-film magnetic head according to claim 1, 2, 3, or 4, wherein a deposit or residue on a peripheral portion of said opening of said second insulating film is removed. A method for manufacturing a thin-film magnetic head including a step of removing.