JP2002335143A - Shared antenna - Google Patents

Shared antenna

Info

Publication number
JP2002335143A
JP2002335143A JP2001139768A JP2001139768A JP2002335143A JP 2002335143 A JP2002335143 A JP 2002335143A JP 2001139768 A JP2001139768 A JP 2001139768A JP 2001139768 A JP2001139768 A JP 2001139768A JP 2002335143 A JP2002335143 A JP 2002335143A
Authority
JP
Japan
Prior art keywords
terminal
phase line
package
transmitting
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001139768A
Other languages
Japanese (ja)
Other versions
JP2002335143A5 (en
Inventor
Kazufumi Nishida
和史 西田
Katsuya Fujii
勝也 藤井
Tomohisa Tazaki
朝尚 田崎
Ichiro Kameyama
一郎 亀山
Yuji Fujinaka
祐司 藤中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001139768A priority Critical patent/JP2002335143A/en
Publication of JP2002335143A publication Critical patent/JP2002335143A/en
Publication of JP2002335143A5 publication Critical patent/JP2002335143A5/ja
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a shared antenna which has superior isolation characteristic, even if is made compact in size. SOLUTION: The shared antenna has a package 11, having its formed reception, transmission, antenna terminal, and ground terminals 14a, 14b, 14c, 14d respectively; a phase line, formed inside the package 11 whose one end, is connected with the antenna terminal 14c; a transmission-oriented SAW filter 20 mounted inside the package 11 and having its input side connected with the transmission terminal 14b, and having its output side connected with the input terminal of the phase line; and a reception-oriented SAW filter 21, mounted inside the package 11 and having its input side connected with the output terminal of the phase line, and having its output side connected with the reception terminal 14. The shared antenna has input and output terminals of the phase line provided respectively at the end portions opposite to the package 11.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は例えば無線通信機器
に用いられるアンテナ共用器に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna duplexer used for wireless communication equipment, for example.

【0002】[0002]

【従来の技術】従来のアンテナ共用器について図面を参
照しながら説明する。
2. Description of the Related Art A conventional antenna duplexer will be described with reference to the drawings.

【0003】図6は従来のアンテナ共用器の断面図、図
7は同アンテナ共用器のA−B断面図である。
FIG. 6 is a sectional view of a conventional duplexer, and FIG. 7 is a sectional view of the same duplexer taken along line AB.

【0004】図6、図7において、1は内部に送、受信
端子、アンテナ端子、グランド端子を有するパッケー
ジ、2はパッケージ1の内部に設けた位相線路、3はパ
ッケージ1内に実装した送、受信用SAWフィルタ、4
は送、受信用SAWフィルタ3とパッケージ1の各端子
とを接続するワイヤ、5はパッケージ1を封止するリッ
ドである。
[0006] In FIGS. 6 and 7, reference numeral 1 denotes a package having transmission and reception terminals, an antenna terminal, and a ground terminal, 2 denotes a phase line provided inside the package 1, 3 denotes a transmission mounted in the package 1, SAW filter for reception, 4
Is a wire connecting the transmitting and receiving SAW filter 3 to each terminal of the package 1, and 5 is a lid for sealing the package 1.

【0005】以上のように構成されたアンテナ共用器の
製造方法について説明する。
[0005] A method of manufacturing the antenna duplexer configured as described above will be described.

【0006】まず図7に示すようにパッケージ1の底部
を形成するガラスセラミック基板の表面に銀あるいは銅
を用いたミアンダ状の位相線路2を形成する。この位相
線路2の入、出力端子はパッケージ1の同じ端部に配置
したものである。
First, as shown in FIG. 7, a meandering phase line 2 using silver or copper is formed on the surface of a glass ceramic substrate forming the bottom of the package 1. The input and output terminals of the phase line 2 are arranged at the same end of the package 1.

【0007】次にこの基板の上下に所望の枚数のガラス
セラミック基板を積層し、この上にガラスセラミック枠
体を重ね合わせて一体焼成することによりパッケージ1
を得る。この時パッケージの内部表面に送、受信端子、
グランド端子も形成する。
Next, a desired number of glass-ceramic substrates are laminated on and under the substrate, and a glass-ceramic frame is superimposed on the glass-ceramic substrates and integrally fired to form a package 1.
Get. At this time, send to the internal surface of the package, receive terminal,
A ground terminal is also formed.

【0008】一方、圧電基板上にそれぞれインターディ
ジタルトランスデューサ(以下IDTと称する)及びこ
のIDTに接続した接続電極を有する送、受信用SAW
フィルタ3を形成し、パッケージ1の内部底面に実装す
る。
On the other hand, a transmitting and receiving SAW having an interdigital transducer (hereinafter referred to as IDT) and connection electrodes connected to the IDT on a piezoelectric substrate, respectively.
The filter 3 is formed and mounted on the inner bottom surface of the package 1.

【0009】次に送、受信用SAWフィルタ3の接続電
極とパッケージ1の各種端子とをワイヤ4で接続後、リ
ッド5でパッケージ1の開口部を封止してアンテナ共用
器を得る。
Next, after connecting the connection electrodes of the transmitting and receiving SAW filters 3 and the various terminals of the package 1 with the wires 4, the opening of the package 1 is sealed with the lid 5 to obtain an antenna duplexer.

【0010】[0010]

【発明が解決しようとする課題】近年、無線通信機器の
小型化に伴い用いられる電子部品も小型化が要求されて
いる。しかし、上記構成のまま小型化を図ると、位相線
路2に入、出力端子を近接配置することになり、送、受
信信号の電磁波的な干渉が発生し、十分なアイソレーシ
ョンを確保することができないという問題点を有してい
た。
In recent years, there has been a demand for downsizing of electronic components used with the downsizing of wireless communication devices. However, if the size is reduced with the above configuration, the input and output terminals of the phase line 2 are arranged close to each other, and electromagnetic interference of transmission and reception signals occurs, and sufficient isolation can be ensured. There was a problem that it was not possible.

【0011】そこで本発明は小型化したとしてもアイソ
レーション特性に優れたアンテナ共用器を提供すること
を目的とするものである。
An object of the present invention is to provide an antenna duplexer which is excellent in isolation characteristics even if it is miniaturized.

【0012】[0012]

【課題を解決するための手段】この目的を達成するた
め、以下の構成を有するものである。
In order to achieve the above object, the present invention has the following arrangement.

【0013】本発明の請求項1に記載の発明は、特に、
位相線路の入、出力端子をパッケージの相対向する端部
に位置するようにしたものであり、位相線路の入、出力
端子間の距離が長いため、この間での送、受信信号の電
磁波的な干渉を防止することができ、小型でアイソレー
ション特性に優れたアンテナ共用器となる。
[0013] The invention described in claim 1 of the present invention is, in particular,
The input and output terminals of the phase line are located at the opposite ends of the package, and the distance between the input and output terminals of the phase line is long. Interference can be prevented, and the antenna duplexer is small and has excellent isolation characteristics.

【0014】本発明の請求項2に記載の発明は、特に、
送、受信端子をアンテナ端子を形成した端部とは異なる
相対向する端部に設けると共に、位相線路を形成した面
上において送、受信端子と位相線路との間にシールド電
極を設けたものであり、シールド作用により送、受信端
子と位相線路間での送、受信信号の電磁波的な干渉を防
止することができ、アイソレーション特性に優れたアン
テナ共用器が得られる。さらに送、受信端子をアンテナ
端子を形成した端部とは異なる相対向する端部に設けて
いるため各端子間の距離が長くなり、各端子間の電磁波
の干渉を最小限にすることができ、アイソレーション特
性に優れたアンテナ共用器が得られる。
[0014] The invention described in claim 2 of the present invention is, in particular,
The transmitting and receiving terminals are provided on opposite ends different from the end on which the antenna terminal is formed, and a shield electrode is provided between the transmitting and receiving terminals and the phase line on the surface on which the phase line is formed. In addition, the shield function can prevent electromagnetic interference of transmission and reception signals between the transmission and reception terminals and the phase line, thereby obtaining an antenna duplexer having excellent isolation characteristics. Furthermore, since the transmitting and receiving terminals are provided at opposite ends different from the end at which the antenna terminal is formed, the distance between the terminals becomes longer, and interference of electromagnetic waves between the terminals can be minimized. An antenna duplexer having excellent isolation characteristics can be obtained.

【0015】本発明の請求項3に記載の発明は、特に、
長辺線路部と折返し線路部で構成されたミアンダ状の位
相線路において、長辺線路部と位相線路の端子間を結ぶ
直線が交差するようにしたものであり、送、受信端子に
近接する位相線路の面積をできるだけ小さくすることに
より、送、受信信号の電磁波的な干渉を小さくし優れた
アイソレーション特性を得ることができる。
[0015] The invention described in claim 3 of the present invention is, in particular,
In the meander-shaped phase line composed of the long side line portion and the folded line portion, the straight line connecting the long side line portion and the terminal of the phase line intersects, and the phase close to the transmitting and receiving terminals By minimizing the area of the line as much as possible, it is possible to reduce electromagnetic interference between transmitted and received signals and obtain excellent isolation characteristics.

【0016】本発明の請求項4に記載の発明は、特に、
送、受信用SAWフィルタを一枚の圧電基板上に形成す
ると共に、この圧電基板上において、パッケージの送信
端子と接続する送信用SAWフィルタの接続電極と、受
信端子と接続する受信用フィルタの接続電極とを相対向
する端部に設け、これら接続電極を設けた両端部とは異
なる相対向する両端部に位相線路に接続する送、受信用
SAWフィルタの接続電極を設けたものであり、各接続
電極間の距離が長いため、送、受信信号の電磁波的な干
渉を低減することができ、アイソレーション特性に優れ
たアンテナ共用器となる。
The invention described in claim 4 of the present invention particularly provides
A transmitting and receiving SAW filter is formed on a single piezoelectric substrate, and a connection electrode of the transmitting SAW filter connected to the transmitting terminal of the package and a receiving filter connected to the receiving terminal are formed on the piezoelectric substrate. Electrodes are provided at opposite ends, and connection electrodes of a transmitting and receiving SAW filter connected to a phase line are provided at opposite opposite ends different from both ends provided with these connection electrodes. Since the distance between the connection electrodes is long, electromagnetic interference between transmitted and received signals can be reduced, and an antenna duplexer having excellent isolation characteristics can be obtained.

【0017】本発明の請求項5に記載の発明は、特に、
送、受信用SAWフィルタを一枚の圧電基板上に形成す
ると共に、位相線路の端子、パッケージの送、受信端子
とを電気的に接続し、これら各信号線間にはグランドが
介在するようにしたものであり、シールド作用により、
送、受信信号の電磁波的な干渉を低減することができ、
アイソレーション特性に優れたアンテナ共用器となる。
[0017] The invention described in claim 5 of the present invention particularly provides
The transmitting and receiving SAW filters are formed on a single piezoelectric substrate, and the terminals of the phase line and the transmitting and receiving terminals of the package are electrically connected to each other. It is a shield action,
It can reduce the electromagnetic interference of transmission and reception signals,
It becomes an antenna duplexer with excellent isolation characteristics.

【0018】本発明の請求項6に記載の発明は、特に、
位相線路と送、受信端子の距離を300μm以上とした
ものであり、アンテナ共用器を小型化した場合でも位相
線路と送、受信端子間の信号の電磁波的な干渉を防止す
ることができ、優れたアイソレーション特性が得られ
る。
[0018] The invention described in claim 6 of the present invention is, in particular,
The distance between the phase line and the transmitting and receiving terminals is set to 300 μm or more. Even if the antenna duplexer is miniaturized, electromagnetic interference of signals between the phase line and the transmitting and receiving terminals can be prevented. The isolation characteristics obtained are as follows.

【0019】本発明の請求項7に記載の発明は、特に、
位相線路を形成した面上において送、受信端子と位相線
路との間にシールド電極を設けたものであり、シールド
作用により送、受信端子と位相線路間での信号の電磁波
的な干渉を防止することができ、アイソレーション特性
に優れたアンテナ共用器が得られる。
The invention described in claim 7 of the present invention particularly provides
A shield electrode is provided between the transmitting and receiving terminals and the phase line on the surface on which the phase line is formed. The shield function prevents electromagnetic interference of signals between the transmitting and receiving terminals and the phase line. As a result, an antenna duplexer having excellent isolation characteristics can be obtained.

【0020】本発明の請求項8に記載の発明は、特に、
位相線路と送、受信端子との距離を300μm以上とし
たものであり、アンテナ共用器を小型化した場合でも位
相線路と送、受信端子間の信号の電磁波的な干渉を防止
することができ、優れたアイソレーション特性が得られ
る。
The invention according to claim 8 of the present invention particularly provides
The distance between the phase line and the transmitting and receiving terminals is 300 μm or more. Even when the antenna duplexer is downsized, electromagnetic interference of signals between the phase line and the transmitting and receiving terminals can be prevented. Excellent isolation characteristics can be obtained.

【0021】本発明の請求項9に記載の発明は、特に、
送、受信端子をアンテナ端子を形成した端部とは異なる
相対向する端部に設けたものであり、各端子間の距離が
大きく、各端子間での信号の電磁波的な干渉を最小限に
することができ、アイソレーション特性に優れたアンテ
ナ共用器が得られる。
The invention as defined in claim 9 of the present invention particularly provides
The transmitting and receiving terminals are provided at opposite ends different from the end where the antenna terminal is formed, the distance between each terminal is large, and the electromagnetic interference of signals between each terminal is minimized. Therefore, an antenna duplexer having excellent isolation characteristics can be obtained.

【0022】[0022]

【発明の実施の形態】以下、一実施の形態を用いて、本
発明の特に請求項1〜9に記載の発明について図面を参
照しながら説明する。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a first embodiment of the present invention;

【0023】図1は本発明の一実施の形態におけるアン
テナ共用器の断面図であり、図2は同アンテナ共用器の
断面図、図3は同リッドで封止前のアンテナ共用器の上
面図、図4は同アンテナ共用器の下面図、図5は同アン
テナ共用器の回路図である。また図1は図2のC−D断
面図である。
FIG. 1 is a sectional view of an antenna duplexer according to an embodiment of the present invention, FIG. 2 is a sectional view of the antenna duplexer, and FIG. 3 is a top view of the antenna duplexer before sealing with the lid. FIG. 4 is a bottom view of the antenna duplexer, and FIG. 5 is a circuit diagram of the antenna duplexer. FIG. 1 is a sectional view taken along line CD of FIG.

【0024】図1〜図5において、11aは第1基板、
11bは第1基板11aの上に積層した第2基板、11
cは第2基板11bの上に積層した第1枠体、11dは
第1枠体11cの上に積層した第2枠体であり、これら
を一体焼成することによりパッケージ11を構成してい
る。また、第1基板11a、第2基板11b、第1枠体
11c、第2枠体11dは、誘電率が8程度のガラスセ
ラミックを用いて形成したものである。12は第1基板
11a、第2基板11bの間に設けた位相線路、12
a,12bは位相線路12の入、出力端子、12cは位
相線路を構成する長辺線路、12dは位相線路12を構
成する折返し線路である。また13a,13bは第1基
板11aの上に設けたシールド電極、14aは受信端
子、14bは送信端子、14cはアンテナ端子、14d
はグランド端子である。
1 to 5, reference numeral 11a denotes a first substrate;
11b is a second substrate laminated on the first substrate 11a, 11b
c is a first frame laminated on the second substrate 11b, and 11d is a second frame laminated on the first frame 11c, and these are integrally fired to constitute the package 11. The first substrate 11a, the second substrate 11b, the first frame 11c, and the second frame 11d are formed using a glass ceramic having a dielectric constant of about 8. 12, a phase line provided between the first substrate 11a and the second substrate 11b;
Reference numerals a and 12b denote input and output terminals of the phase line 12, 12c denotes a long side line forming the phase line, and 12d denotes a folded line forming the phase line 12. 13a and 13b are shield electrodes provided on the first substrate 11a, 14a is a receiving terminal, 14b is a transmitting terminal, 14c is an antenna terminal, 14d
Is a ground terminal.

【0025】さらに15は圧電基板、16は接続電極、
16aは入力用接続電極、16bは出力用接続電極、1
6cは接地用接続電極、17はIDT、18は接続電
極、18aは入力用接続電極、18bは出力用接続電
極、18cは接地用接続電極、19はIDT、20は圧
電基板15、接続電極16、入力用接続電極16a、出
力用接続電極16b、接地用接続電極16c、IDT1
7で構成される送信用SAWフィルタ、21は圧電基板
15、接続電極18、入力用接続電極18a、出力用接
続電極18b、接地用接続電極18c、IDT19で構
成される受信用SAWフィルタ、22は一枚の圧電基板
15の上に送、受信用SAWフィルタ20,21を形成
したSAW素子であり、パッケージ11内に実装する。
23はSAW素子22をパッケージ11に固定するため
のダイボンド樹脂、24はSAW素子22に設けた入力
用接続電極16a、出力用接続電極16b、接地用接続
電極16c、入力用接続電極18a、出力用接続電極1
8b、接地用接続電極18cとパッケージ11に設けた
各種端子14a〜14dとを接続するワイヤ、25はパ
ッケージ11を封止するためのリッドである。
Further, 15 is a piezoelectric substrate, 16 is a connection electrode,
16a is an input connection electrode, 16b is an output connection electrode, 1
6c is a ground connection electrode, 17 is an IDT, 18 is a connection electrode, 18a is an input connection electrode, 18b is an output connection electrode, 18c is a ground connection electrode, 19 is an IDT, 20 is a piezoelectric substrate 15, and a connection electrode 16 , Input connection electrode 16a, output connection electrode 16b, ground connection electrode 16c, IDT1
7, a transmitting SAW filter including the piezoelectric substrate 15, the connecting electrode 18, an input connecting electrode 18a, an output connecting electrode 18b, a grounding connecting electrode 18c, and a receiving SAW filter including an IDT 19; This is a SAW element in which sending and receiving SAW filters 20 and 21 are formed on a single piezoelectric substrate 15 and mounted in a package 11.
Reference numeral 23 denotes a die bond resin for fixing the SAW element 22 to the package 11, and reference numeral 24 denotes an input connection electrode 16a, an output connection electrode 16b, a ground connection electrode 16c, an input connection electrode 18a, an output connection electrode provided on the SAW element 22. Connection electrode 1
8b, a wire for connecting the ground connection electrode 18c to the various terminals 14a to 14d provided on the package 11, and 25 a lid for sealing the package 11.

【0026】パッケージ11について図を参照しながら
さらに詳しく説明する。
The package 11 will be described in more detail with reference to the drawings.

【0027】図1に示すように第1基板11aの上に形
成した位相線路12は、入、出力端子12a,12bを
相対向する端部に配置し、この間を直線状の金属ストリ
ップラインをミアンダ状になるように組み合わせたもの
である。またこのミアンダパターンを構成する長辺線路
部12cと折返し線路部12dのうち、長辺線路部12
cと位相線路12の入、出力端子12a,12b間を結
ぶ直線状が交差するように配置し、送、受信端子14
b,14aと近接する金属ストリップラインの面積をで
きるだけ小さくしている。さらに位相線路12は送、受
信端子14b,14aから少なくとも300μm離れて
いる。その上、位相線路12を形成した第1基板11a
の面上において送、受信端子14b,14aと位相線路
12との間に送、受信端子14b,14aの外周部を囲
むようにシールド電極13a,13bを設けている。
As shown in FIG. 1, a phase line 12 formed on a first substrate 11a has input and output terminals 12a and 12b arranged at opposing ends, and a linear metal strip line is provided between the terminals. It is combined so that it becomes a shape. In addition, of the long side line portion 12c and the folded line portion 12d constituting the meander pattern, the long side line portion 12c is formed.
c and the input / output terminals 12a and 12b of the phase line 12 are arranged so as to intersect with each other, and the transmission / reception terminals 14
The area of the metal strip line adjacent to b, 14a is made as small as possible. Further, the phase line 12 is at least 300 μm away from the transmitting and receiving terminals 14b, 14a. In addition, the first substrate 11a on which the phase line 12 is formed
The shield electrodes 13a and 13b are provided between the transmitting and receiving terminals 14b and 14a and the phase line 12 so as to surround the outer periphery of the receiving and transmitting terminals 14b and 14a.

【0028】また送、受信用SAWフィルタ20,21
の入、出力用接続電極16a,16b、18a,18b
は、圧電基板15上でそれぞれ異なる端部に配置し、で
きるだけ各接続電極間距離が長くなるようにしている。
さらに送、受信用SAWフィルタの入、出力用接続電極
16a,16b,18a,18bと対応する位相線路1
2の入、出力端子12a,12b、送、受信端子14
b,14aとをワイヤ24など信号線で結び、隣接する
信号線間には必ずグランドが介在するような構成となっ
ている。
The transmitting and receiving SAW filters 20 and 21
Input / output connection electrodes 16a, 16b, 18a, 18b
Are arranged at different ends on the piezoelectric substrate 15 so that the distance between the connection electrodes is as long as possible.
Further, the phase line 1 corresponding to the input / output connection electrodes 16a, 16b, 18a, 18b of the transmission and reception SAW filters.
2, input / output terminals 12a, 12b, send / receive terminal 14
b and 14a are connected by a signal line such as a wire 24, and a ground is always interposed between adjacent signal lines.

【0029】以上のように構成されたアンテナ共用器の
製造方法について説明する。
A method of manufacturing the antenna duplexer configured as described above will be described.

【0030】まず、ガラスセラミックのグリーンシート
を用いて第1基板11a及び第2基板11b及び第1枠
体11c、第2枠体11dを作製する。
First, a first substrate 11a, a second substrate 11b, a first frame 11c, and a second frame 11d are manufactured using glass ceramic green sheets.

【0031】次に第1基板11aの表面には、図1に示
すように銀を用いて位相線路12、シールド電極13
a,13bを、下面にはグランド層(図示せず)及び図
4に示すように送、受信端子14b,14a、アンテナ
端子14c、グランド端子14dを形成する。また、第
2基板11bの上面には銀を用いてグランド層を形成す
る。さらに第1枠体11cの上面には銀を用いて送、受
信端子14b,14a、位相線路の入、出力端子12
a,12b、グランド端子14dを形成する。その上、
第2枠体11dの上面には銀を用いてグランド層を形成
する。
Next, on the surface of the first substrate 11a, as shown in FIG.
On the lower surface, a and 13b are sent and a ground layer (not shown) is formed, and as shown in FIG. 4, receiving terminals 14b and 14a, an antenna terminal 14c, and a ground terminal 14d are formed. In addition, a ground layer is formed on the upper surface of the second substrate 11b using silver. Further, the upper surface of the first frame 11c is sent using silver, the receiving terminals 14b and 14a, the input and output terminals 12 of the phase line,
a, 12b and a ground terminal 14d are formed. Moreover,
A ground layer is formed on the upper surface of the second frame 11d using silver.

【0032】次いで第1基板11aの上に第2基板11
bを積層し、第2基板11bの上に第1枠体11cを積
層する。
Next, the second substrate 11 is placed on the first substrate 11a.
b, and the first frame 11c is stacked on the second substrate 11b.

【0033】その後第1基板11a、第2基板11b及
び第1枠体11cの側面においてスルーホール電極を用
いて第1基板11aの底面に設けた送、受信端子14
b,14aと第1枠体11cの上面に設けた送、受信端
子14b,14a、第1基板11aの底面に設けたアン
テナ端子14cと、第1枠体11cの上面に設けた位相
線路12の入力端子12a、第1基板11aの底面に設
けたグランド端子14dと第1枠体11cの上面に設け
たグランド端子14dをそれぞれ接続する。
Thereafter, the transmitting and receiving terminals 14 provided on the bottom surface of the first substrate 11a using through-hole electrodes on the side surfaces of the first substrate 11a, the second substrate 11b, and the first frame 11c.
b, 14a and the transmitting and receiving terminals 14b, 14a provided on the upper surface of the first frame 11c, the antenna terminal 14c provided on the bottom of the first substrate 11a, and the phase line 12 provided on the upper surface of the first frame 11c. The input terminal 12a and the ground terminal 14d provided on the bottom surface of the first substrate 11a are connected to the ground terminal 14d provided on the upper surface of the first frame 11c.

【0034】さらにその後積層した第1基板11a、第
2基板11b、第1枠体11cの上に第2枠体11dを
積層する。
Then, a second frame 11d is laminated on the first substrate 11a, the second substrate 11b, and the first frame 11c.

【0035】そして第1基板11a、第2基板11b、
第1枠体11c及び第2枠体11dの側面においてスル
ーホール電極を用いて第1基板11aの底面に設けたグ
ランド端子14dと第2枠体11dの上面に形成したグ
ランド層を接続する。
Then, the first substrate 11a, the second substrate 11b,
The ground terminals 14d provided on the bottom surface of the first substrate 11a and the ground layers formed on the upper surface of the second frame 11d are connected to the side surfaces of the first frame 11c and the second frame 11d by using through-hole electrodes.

【0036】また第2基板11b、第1枠体11cには
第1基板11a上に形成した位相線路12の入、出力端
子12a,12bと第1枠体11c上に形成した位相線
路12の入、出力端子12a,12bとをそれぞれ接続
する貫通電極(図示せず)を設けている。
The second substrate 11b and the first frame 11c receive the phase line 12 formed on the first substrate 11a, and the output terminals 12a, 12b and the phase line 12 formed on the first frame 11c. , And through electrodes (not shown) for connecting the output terminals 12a and 12b, respectively.

【0037】その後これを焼成して、メッキを行うこと
によりパッケージ11を得る。
Thereafter, the package 11 is baked and plated to obtain the package 11.

【0038】一方、図3に示すようにタンタル酸リチウ
ム、ニオブ酸リチウムなどの単結晶を用いて作製した圧
電基板15の上に送、受信用SAWフィルタ20,21
を有するSAW素子22を形成するため、アルミニウム
合金とチタンを用いた積層電極を用いてIDT17,1
9及びこのIDT17,19に接続した接続電極16、
入力用接続電極16a、出力用接続電極16b、接地用
接続電極16c、接続電極18、入力用接続電極18
a、出力用接続電極18b、接地用接続電極18cを作
製する。
On the other hand, as shown in FIG. 3, SAW filters 20 and 21 for sending and receiving on a piezoelectric substrate 15 made of a single crystal such as lithium tantalate and lithium niobate.
In order to form the SAW element 22 having IDTs, the IDTs 17 and 1 are formed by using a laminated electrode using an aluminum alloy and titanium.
9 and connection electrodes 16 connected to the IDTs 17 and 19,
Input connection electrode 16a, output connection electrode 16b, ground connection electrode 16c, connection electrode 18, input connection electrode 18
a, an output connection electrode 18b and a ground connection electrode 18c are prepared.

【0039】次に図2に示すようにパッケージ11の内
部底面にダイボンド樹脂23を用いてSAW素子22を
固定し、入、出力用接続電極16a,16b,18a,
18b、接地用接続電極16c,18cと送、受信端子
14b,14a、位相線路12の入、出力端子12a,
12b、グランド端子14dをそれぞれ接続して、図5
に示すような回路構成となるようにする。その後リッド
25でパッケージ11の開口部を封止してアンテナ共用
器を得る。
Next, as shown in FIG. 2, the SAW element 22 is fixed to the inner bottom surface of the package 11 using a die bond resin 23, and the input / output connection electrodes 16a, 16b, 18a,
18b, the ground connection electrodes 16c and 18c, the transmission and reception terminals 14b and 14a, the input / output of the phase line 12, the output terminal 12a
12b and the ground terminal 14d, respectively, and FIG.
The circuit configuration shown in FIG. Thereafter, the opening of the package 11 is sealed with the lid 25 to obtain an antenna duplexer.

【0040】本実施の形態のアンテナ共用器は、位相線
路12の入、出力端子12a,12bをパッケージ11
の相対向する端部に配置することにより、位相線路12
の入、出力端子12a,12b間の距離を大きくし、位
相線路12の入、出力端子12a,12b間での送、受
信信号の電磁波的な干渉を防止することができ、小型で
アイソレーション特性に優れたものとなる。
In the antenna duplexer of the present embodiment, the input and output terminals 12a and 12b of the phase line 12 are
At the opposite ends of the phase line 12
The distance between the input and output terminals 12a and 12b can be increased to prevent electromagnetic interference of the transmission and reception signals between the input and output terminals 12a and 12b of the phase line 12. It will be excellent.

【0041】また、位相線路12を形成した面上におい
て、送、受信端子14b,14aと位相線路12との間
にシールド電極13a,13bを設けることにより、
送、受信端子14b,14aと位相線路12間での送、
受信信号の電磁波的な干渉をシールド作用により防止す
ることができ、アンテナ共用器のアイソレーション特性
が優れたものとなる。
By providing shield electrodes 13a and 13b between the transmitting and receiving terminals 14b and 14a and the phase line 12 on the surface on which the phase line 12 is formed,
Sending and receiving between the receiving terminals 14b, 14a and the phase line 12,
Electromagnetic interference of the received signal can be prevented by the shield effect, and the isolation characteristics of the duplexer are improved.

【0042】さらに送、受信端子14b,14aをアン
テナ端子14cを形成した端部とは異なる相対向する端
部に設けているため各端子間の距離が大きく、各端子間
の送、受信信号の干渉を最小限にすることができ、アン
テナ共用器のアイソレーション特性が優れたものとな
る。
Further, since the transmitting and receiving terminals 14b and 14a are provided at opposite ends different from the end where the antenna terminal 14c is formed, the distance between the terminals is large, and the transmitting and receiving signals between the terminals are large. Interference can be minimized, and the isolation characteristics of the duplexer can be improved.

【0043】さらにまた、位相線路12のミアンダパタ
ーンを構成する長辺線路部12cと折返し線路部12d
のうち、長辺線路部12cが位相線路12の入、出力端
子12a,12b間を結ぶ直線と交差、好ましくは直交
させることにより、送、受信端子14b,14aに近接
する位相線路12の面積を小さくすることができ、送、
受信端子14b,14aと位相線路12間での送、受信
信号の電磁波的な干渉を小さくし優れたアイソレーショ
ン特性を得ることができる。
Further, a long side line portion 12c and a folded line portion 12d forming a meander pattern of the phase line 12 are formed.
Of these, the long side line portion 12c intersects, preferably orthogonally intersects, preferably orthogonals, a straight line connecting the input and output terminals 12a and 12b of the phase line 12, thereby reducing the area of the phase line 12 close to the transmission and reception terminals 14b and 14a. Can be small, sent,
Electromagnetic interference of transmission and reception signals between the reception terminals 14b and 14a and the phase line 12 can be reduced, and excellent isolation characteristics can be obtained.

【0044】その上、送、受信用SAWフィルタ20,
21を一枚の圧電基板15上に形成し、送信端子14b
と接続する送信用SAWフィルタ20の入力用接続電極
16aと、受信端子14aと接続する受信用SAWフィ
ルタ21の出力用接続電極18bを、圧電基板15の上
において相対向する端部に設け、送信端子14bと接続
する送信用SAWフィルタ20の入力用接続電極16a
と受信端子14aと接続する受信用SAWフィルタ21
の出力用接続電極18bを設けた端部とは異なる相対向
する端部に位相線路12の入力端子12aに接続する送
信用SAWフィルタ20の出力用接続電極16bと位相
線路12の出力端子12bに接続する受信用SAWフィ
ルタ21の入力用接続電極18aを設けることにより、
送信端子14bと接続する送信用SAWフィルタ20の
入力用接続電極16a、受信端子14aと接続する受信
用SAWフィルタ21の出力用接続電極18b、位相線
路12の入力端子12aに接続する送信用SAWフィル
タ20の出力用接続電極16b、位相線路12の出力端
子12bに接続する受信用SAWフィルタ21の入力用
接続電極18aそれぞれの間の距離が大きくなり、送、
受信信号の電磁波的な干渉を低減することができ、アイ
ソレーション特性に優れたアンテナ共用器となる。
In addition, the transmitting and receiving SAW filters 20,
21 is formed on one piezoelectric substrate 15 and the transmission terminal 14b is formed.
An input connecting electrode 16a of the transmitting SAW filter 20 connected to the receiving terminal 14a and an output connecting electrode 18b of the receiving SAW filter 21 connected to the receiving terminal 14a are provided at opposite ends on the piezoelectric substrate 15, and Input connection electrode 16a of transmission SAW filter 20 connected to terminal 14b
SAW filter 21 for receiving and connecting to receiving terminal 14a
The output connection electrode 16b of the transmission SAW filter 20 connected to the input terminal 12a of the phase line 12 and the output terminal 12b of the phase line 12 are connected to the opposite end different from the end provided with the output connection electrode 18b. By providing the input connection electrode 18a of the receiving SAW filter 21 to be connected,
The input connection electrode 16a of the transmission SAW filter 20 connected to the transmission terminal 14b, the output connection electrode 18b of the reception SAW filter 21 connected to the reception terminal 14a, and the transmission SAW filter connected to the input terminal 12a of the phase line 12. 20, the distance between each of the input connection electrodes 18a of the reception SAW filter 21 connected to the output connection electrode 16b of the phase line 12 and the output connection electrode 18b of the reception SAW filter 21 increases.
Electromagnetic interference of received signals can be reduced, and an antenna duplexer having excellent isolation characteristics can be obtained.

【0045】また、送、受信用SAWフィルタ20,2
1の入、出力用接続電極16a,16b,18a,18
bと対応する位相線路12の入、出力端子12a,12
b、送、受信端子14b,14aとを結ぶワイヤ24間
には必ずグランド端子14dと接地用接続電極16c,
18cを結ぶワイヤ24を設けることにより、グランド
端子14dと接地用接続電極16c,18cとを結ぶワ
イヤ24及びグランド端子14dのシールド作用が働
き、送、受信信号の電磁波的な干渉を低減することがで
き、アイソレーション特性に優れたアンテナ共用器が得
られる。
The transmitting and receiving SAW filters 20, 2
1 connection / output connection electrodes 16a, 16b, 18a, 18
b, input and output terminals 12a, 12 of the phase line 12 corresponding to
b, the ground terminal 14d and the ground connection electrode 16c, between the wires 24 connecting the sending and receiving terminals 14b and 14a
By providing the wire 24 connecting the ground terminal 18c, the shield effect of the wire 24 connecting the ground terminal 14d and the ground connection electrodes 16c and 18c and the ground terminal 14d works, thereby reducing electromagnetic interference of transmission and reception signals. As a result, an antenna duplexer having excellent isolation characteristics can be obtained.

【0046】また、位相線路12と送、受信端子14
b,14aとの距離を300μm以上にすることによ
り、位相線路12と送、受信端子14b,14a間の信
号の干渉を防止することができ、アンテナ共用器を小型
化した場合でも優れたアイソレーション特性が得られ
る。
The phase line 12 and the transmitting and receiving terminals 14
By setting the distance from the phase line b, 14a to 300 μm or more, it is possible to prevent signal interference between the phase line 12 and the transmitting and receiving terminals 14b, 14a, and to provide excellent isolation even when the antenna duplexer is miniaturized. Characteristics are obtained.

【0047】[0047]

【発明の効果】以上のように本発明は、位相線路の両端
をパッケージの相対向する端部に配置したものであり、
位相線路の入出力端子間の距離が大きいため、位相線路
の端子間の電磁波的な干渉を防止することができ、小型
でアイソレーション特性に優れたアンテナ共用器が得ら
れる。
As described above, according to the present invention, both ends of the phase line are arranged at opposite ends of the package.
Since the distance between the input and output terminals of the phase line is large, electromagnetic interference between the terminals of the phase line can be prevented, and a compact antenna duplexer with excellent isolation characteristics can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態におけるアンテナ共用器
の断面図
FIG. 1 is a sectional view of an antenna duplexer according to an embodiment of the present invention.

【図2】本発明の一実施の形態におけるアンテナ共用器
の断面図
FIG. 2 is a sectional view of an antenna duplexer according to an embodiment of the present invention.

【図3】本発明の一実施の形態におけるリッドで封止前
のアンテナ共用器の上面図
FIG. 3 is a top view of the duplexer before sealing with a lid according to an embodiment of the present invention.

【図4】本発明の一実施の形態におけるアンテナ共用器
の下面図
FIG. 4 is a bottom view of the antenna duplexer according to the embodiment of the present invention.

【図5】本発明の一実施の形態におけるアンテナ共用器
の回路図
FIG. 5 is a circuit diagram of an antenna duplexer according to an embodiment of the present invention.

【図6】従来のアンテナ共用器の断面図FIG. 6 is a sectional view of a conventional antenna duplexer.

【図7】従来のアンテナ共用器の断面図FIG. 7 is a cross-sectional view of a conventional antenna duplexer.

【符号の説明】[Explanation of symbols]

11 パッケージ 11a 第1基板 11b 第2基板 11c 第1枠体 11d 第2枠体 12 位相線路 12a 入力端子 12b 出力端子 12c 長辺線路 12d 折返し線路 13a シールド電極 13b シールド電極 14a 受信端子 14b 送信端子 14c アンテナ端子 14d グランド端子 15 圧電基板 16 接続電極 16a 入力用接続電極 16b 出力用接続電極 16c 接地用接続電極 17 IDT 18 接続電極 18a 入力用接続電極 18b 出力用接続電極 18c 接地用接続電極 19 IDT 20 送信用SAWフィルタ 21 受信用SAWフィルタ 22 SAW素子 23 ダイボンド樹脂 24 ワイヤ 25 リッド Reference Signs List 11 package 11a first substrate 11b second substrate 11c first frame 11d second frame 12 phase line 12a input terminal 12b output terminal 12c long side line 12d folded line 13a shield electrode 13b shield electrode 14a reception terminal 14b transmission terminal 14c antenna Terminal 14d Ground terminal 15 Piezoelectric substrate 16 Connection electrode 16a Input connection electrode 16b Output connection electrode 16c Ground connection electrode 17 IDT 18 Connection electrode 18a Input connection electrode 18b Output connection electrode 18c Ground connection electrode 19 IDT 20 Transmission SAW filter 21 SAW filter for reception 22 SAW element 23 Die bond resin 24 Wire 25 Lid

───────────────────────────────────────────────────── フロントページの続き (72)発明者 田崎 朝尚 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 亀山 一郎 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 藤中 祐司 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 5J097 AA17 AA29 BB15 HA04 JJ07 KK10 LL07  ────────────────────────────────────────────────── ─── Continuing on the front page (72) Asahi Tasaki, Inventor 1006, Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Yuji Fujinaka 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5J097 AA17 AA29 BB15 HA04 JJ07 KK10 LL07

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 送、受信端子、アンテナ端子及びグラン
ド端子を形成したパッケージと、前記パッケージの内部
に形成すると共に一方の端子を前記アンテナ端子に接続
した位相線路と、前記パッケージ内に実装すると共に入
力側を前記送信端子に出力側を前記位相線路の前記一方
の端子に接続した送信用SAWフィルタと、前記パッケ
ージ内に実装すると共に入力側を前記位相線路の他方の
端子に出力側を前記受信端子に接続した受信用SAWフ
ィルタとを備え、前記位相線路の一方の端子を前記パッ
ケージに形成した前記アンテナ端子と同じ端部に設け、
前記位相線路の他方の端子を前記位相線路の一方の端子
と相対向する端部に設けたアンテナ共用器。
A package formed with a transmitting / receiving terminal, an antenna terminal, and a ground terminal; a phase line formed inside the package and having one terminal connected to the antenna terminal; A transmission SAW filter having an input side connected to the transmission terminal and an output side connected to the one terminal of the phase line; a transmission SAW filter mounted in the package, and an input side connected to the other terminal of the phase line and an output side connected to the reception terminal; A receiving SAW filter connected to a terminal, wherein one terminal of the phase line is provided at the same end as the antenna terminal formed on the package,
An antenna duplexer in which the other terminal of the phase line is provided at an end facing one terminal of the phase line.
【請求項2】 送、受信端子をアンテナ端子を形成した
端部とは異なる相対向する端部に設けると共に、位相線
路を形成した面上において前記送、受信端子と位相線路
との間にシールド電極を設けた請求項1に記載のアンテ
ナ共用器。
2. A transmitting and receiving terminal is provided at an end opposite to an end on which an antenna terminal is formed, and a shield is provided between the transmitting and receiving terminal and the phase line on a surface on which a phase line is formed. The antenna duplexer according to claim 1, further comprising an electrode.
【請求項3】 位相線路は金属ストリップラインで形成
された長辺線路部と折返し線路部をミアンダ状に接続し
たものであり、前記長辺線路部と位相線路の端子間を結
ぶ直線が交差するようにした請求項1に記載のアンテナ
共用器。
3. The phase line is formed by connecting a long side line portion formed of a metal strip line and a folded line portion in a meandering manner, and a straight line connecting the long side line portion and a terminal of the phase line intersects. The antenna duplexer according to claim 1, wherein
【請求項4】 送、受信用SAWフィルタが一つの圧電
基板上にインターディジタルトランスデューサ及びこの
インターディジタルトランスデューサに接続した接続電
極を有するものであり、前記圧電基板上において送信端
子と接続する送信用SAWフィルタの接続電極と、受信
端子と接続する受信用フィルタの接続電極は相対向する
端部に位置し、前記送信端子と接続する送信用SAWフ
ィルタの接続電極と前記受信端子と接続する受信用フィ
ルタの接続電極を形成した端部とは異なる相対向する端
部に位相線路の一方の端子に接続する前記送信用SAW
フィルタの接続電極と前記位相線路の他方の端子に接続
する受信用SAWフィルタの接続電極を設けた請求項1
に記載のアンテナ共用器。
4. A transmitting / receiving SAW filter having an interdigital transducer and a connection electrode connected to the interdigital transducer on one piezoelectric substrate, and a transmitting SAW filter connected to a transmitting terminal on the piezoelectric substrate. The connection electrode of the filter and the connection electrode of the reception filter connected to the reception terminal are located at opposite ends, and the connection electrode of the transmission SAW filter connected to the transmission terminal and the reception filter connected to the reception terminal. The transmitting SAW connected to one terminal of the phase line at an end opposite to the end where the connection electrode is formed.
2. A connection electrode of a receiving SAW filter connected to a connection electrode of the filter and the other terminal of the phase line.
An antenna duplexer according to item 1.
【請求項5】 送、受信用SAWフィルタは、一つの圧
電基板上にそれぞれインターディジタルトランスデュー
サ及びこのインターディジタルトランスデューサに接続
した入、出力用接続電極および接地用接続電極を有する
ものであり、前記入、出力用接続電極と位相線路の端
子、パッケージの送、受信端子とを電気的に接続し、こ
れら接続間にはグランドが介在するようにした請求項4
に記載のアンテナ共用器。
5. A transmitting and receiving SAW filter having an interdigital transducer and input / output connection electrodes and a ground connection electrode connected to the interdigital transducer on one piezoelectric substrate, respectively. 5. An electrical connection between the output connection electrode and the terminal of the phase line, the transmission and reception terminals of the package, and a ground interposed between these connections.
An antenna duplexer according to item 1.
【請求項6】 位相線路と送、受信端子の距離は300
μm以上である請求項1に記載のアンテナ共用器。
6. The distance between the phase line and the transmitting and receiving terminals is 300.
The antenna duplexer according to claim 1, which is not less than μm.
【請求項7】 送、受信端子、アンテナ端子及びグラン
ド端子を形成したパッケージと、このパッケージの内部
に形成すると共に一端を前記アンテナ端子に接続した位
相線路と、前記パッケージ内に実装すると共に入力側を
前記送信端子に出力側を前記位相線路の一端に接続した
送信用SAWフィルタと、前記パッケージ内に実装する
と共に入力側を前記位相線路の他端側に出力側を前記受
信端子に接続した受信用SAWフィルタとを備え、前記
位相線路を形成した面上において前記送、受信端子と位
相線路との間にシールド電極を有するアンテナ共用器。
7. A package in which a transmitting terminal, a receiving terminal, an antenna terminal and a ground terminal are formed, a phase line formed inside the package and having one end connected to the antenna terminal, and mounted on the input side while being mounted in the package. A transmission SAW filter having an output side connected to the transmission terminal at one end of the phase line, and a reception port mounted in the package and having an input side connected to the other end of the phase line and an output side connected to the reception terminal. An antenna duplexer comprising: a SAW filter for use; and a shield electrode between the transmitting and receiving terminals and the phase line on a surface on which the phase line is formed.
【請求項8】 送、受信端子、アンテナ端子及びグラン
ド端子を形成したパッケージと、このパッケージの内部
に形成すると共に一端を前記アンテナ端子に接続した位
相線路と、前記パッケージ内に実装すると共に入力側を
前記送信端子に出力側を前記位相線路の一端に接続した
送信用SAWフィルタと、前記パッケージ内に実装する
と共に入力側を前記位相線路の他端側に出力側を前記受
信端子に接続した受信用SAWフィルタとを備え、前記
位相線路と送、受信端子との距離は300μm以上であ
るアンテナ共用器。
8. A package in which a transmitting / receiving terminal, an antenna terminal and a ground terminal are formed, a phase line formed inside the package and having one end connected to the antenna terminal, and a package mounted in the package and connected to the input side. A transmission SAW filter having an output side connected to the transmission terminal at one end of the phase line, and a reception port mounted in the package and having an input side connected to the other end of the phase line and an output side connected to the reception terminal. An antenna duplexer, comprising: a SAW filter for use, wherein the distance between the phase line and the transmitting and receiving terminals is 300 μm or more.
【請求項9】 送、受信端子、アンテナ端子及びグラン
ド端子を形成したパッケージと、このパッケージの内部
に形成すると共に一端を前記アンテナ端子に接続した位
相線路と、前記パッケージ内に実装すると共に入力側を
前記送信端子に出力側を前記位相線路の一端に接続した
送信用SAWフィルタと、前記パッケージ内に実装する
と共に入力側を前記位相線路の他端側に出力側を前記受
信端子に接続した受信用SAWフィルタとを備え、前記
送、受信端子を相対向する端部に設けると共に、前記ア
ンテナ端子は前記送、受信端子を設けた端部とは異なる
端部に設けたアンテナ共用器。
9. A package in which a transmitting / receiving terminal, an antenna terminal and a ground terminal are formed, a phase line formed inside the package and having one end connected to the antenna terminal, and a package mounted in the package and connected to the input side. A transmission SAW filter having an output side connected to the transmission terminal at one end of the phase line, and a reception port mounted in the package and having an input side connected to the other end of the phase line and an output side connected to the reception terminal. An antenna duplexer comprising: a SAW filter for use, wherein the transmitting and receiving terminals are provided at opposite ends, and the antenna terminal is provided at an end different from the end at which the transmitting and receiving terminals are provided.
JP2001139768A 2001-05-10 2001-05-10 Shared antenna Pending JP2002335143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001139768A JP2002335143A (en) 2001-05-10 2001-05-10 Shared antenna

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001139768A JP2002335143A (en) 2001-05-10 2001-05-10 Shared antenna

Publications (2)

Publication Number Publication Date
JP2002335143A true JP2002335143A (en) 2002-11-22
JP2002335143A5 JP2002335143A5 (en) 2005-07-14

Family

ID=18986488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001139768A Pending JP2002335143A (en) 2001-05-10 2001-05-10 Shared antenna

Country Status (1)

Country Link
JP (1) JP2002335143A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008029641A1 (en) * 2006-08-30 2008-03-13 Kyocera Corporation Circuit board for wave separator device, wave separator, and communication device
US7400216B2 (en) 2003-07-29 2008-07-15 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7400216B2 (en) 2003-07-29 2008-07-15 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device
WO2008029641A1 (en) * 2006-08-30 2008-03-13 Kyocera Corporation Circuit board for wave separator device, wave separator, and communication device
JPWO2008029641A1 (en) * 2006-08-30 2010-01-21 京セラ株式会社 Circuit board for duplexer device, duplexer, and communication apparatus

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