JP2002334736A - Terminal part of high density substrate - Google Patents

Terminal part of high density substrate

Info

Publication number
JP2002334736A
JP2002334736A JP2001135917A JP2001135917A JP2002334736A JP 2002334736 A JP2002334736 A JP 2002334736A JP 2001135917 A JP2001135917 A JP 2001135917A JP 2001135917 A JP2001135917 A JP 2001135917A JP 2002334736 A JP2002334736 A JP 2002334736A
Authority
JP
Japan
Prior art keywords
terminal
terminals
connection
density substrate
trapezoidal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001135917A
Other languages
Japanese (ja)
Inventor
Shinji Yamashita
真司 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Display Inc
Original Assignee
Advanced Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Display Inc filed Critical Advanced Display Inc
Priority to JP2001135917A priority Critical patent/JP2002334736A/en
Publication of JP2002334736A publication Critical patent/JP2002334736A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a terminal part wherein a terminal forming area is narrowed without lowering reliability of connection, in a high density substrate having many terminals required for connection to outside circuits. SOLUTION: A terminal 2 takes the form of a trapezoid, and the terminal part 1 is formed by alternately disposing the long sides and the short sides of the trapezoids on the connecting side for a leader line 4. At this time, the widely formed parts of the terminals 2 are provided so as to form a zigzag shape, and the wide parts provided in the zigzag shape are used for connection to outside circuits as contact areas 3.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、例えば外部駆動
回路と接続が必要な電極端子を多数個有する液晶表示素
子等、外部回路と接続が必要な多数の端子を有する高密
度基板の端子が配列形成されてなる端子部に関するもの
である。
BACKGROUND OF THE INVENTION The present invention relates to an arrangement of terminals of a high-density substrate having a large number of terminals that need to be connected to an external circuit, such as a liquid crystal display device having a large number of electrode terminals that need to be connected to an external drive circuit. The present invention relates to a formed terminal portion.

【0002】[0002]

【従来の技術】液晶表示素子は、対向する面に透明電極
等が形成された二枚の透明基板間に液晶材料を封入する
ことにより構成され、一方の透明基板の周囲に形成され
た電極端子部に外部駆動回路を接続して電圧を印加する
ことにより駆動される。近年の液晶表示素子は、装置の
小型化かつ画面サイズ(表示領域)の大面積化および表
示画素数の増加の要求に伴い、端子形成領域が縮小され
かつ端子数が増加する傾向にある。
2. Description of the Related Art A liquid crystal display element is constituted by enclosing a liquid crystal material between two transparent substrates having transparent electrodes and the like formed on opposing surfaces, and electrode terminals formed around one of the transparent substrates. It is driven by connecting an external drive circuit to the unit and applying a voltage. 2. Description of the Related Art In recent liquid crystal display elements, with the demand for smaller devices, larger screen sizes (display areas), and an increase in the number of display pixels, there is a tendency that the terminal formation area is reduced and the number of terminals is increased.

【0003】図2は特開昭60−39617号公報に示
された従来の液晶表示素子を示す図で、(a)は概略断
面図、(b)は端子部を示す平面図である。図におい
て、10は液晶表示素子を構成する二枚の透明基板で、
間に液晶材料を挟持している。11は端子12が二列に
配列形成されている端子部、13は端子12のコンタク
ト領域、14は端子12に接続されている引き出し線、
hは端子12の長さ、jは端子部11の二列に配列され
ている端子12の形成領域の長さ、kは引き出し線14
のピッチある。図2に示す従来の液晶表示素子の端子部
11においては、隣接する引き出し線14に接続された
端子12を一列目と二列目に交互に配置することによ
り、同じ列で隣接する端子12のピッチを大きくしてい
る。
FIGS. 2A and 2B show a conventional liquid crystal display device disclosed in Japanese Patent Application Laid-Open No. Sho 60-39617. FIG. 2A is a schematic sectional view, and FIG. 2B is a plan view showing a terminal portion. In the figure, reference numeral 10 denotes two transparent substrates constituting a liquid crystal display element,
A liquid crystal material is sandwiched between them. 11 is a terminal portion in which the terminals 12 are arranged in two rows, 13 is a contact region of the terminal 12, 14 is a lead wire connected to the terminal 12,
h is the length of the terminal 12, j is the length of the formation area of the terminal 12 arranged in two rows of the terminal portion 11, and k is the lead wire 14.
There is a pitch. In the terminal portion 11 of the conventional liquid crystal display element shown in FIG. 2, the terminals 12 connected to the adjacent lead lines 14 are alternately arranged in the first column and the second column, so that the terminals 12 adjacent to each other in the same column are arranged. The pitch has been increased.

【0004】[0004]

【発明が解決しようとする課題】従来の液晶表示素子に
おける端子部11は以上のように構成されており、端子
12を千鳥足状に二列に配列した場合は、隣接する端子
12のピッチを大きくすることはできるが、端子12を
二列に配列するために端子部11の長さjを長くするこ
とが必要で、端子形成領域を狭小化できないという問題
があった。
The terminal portions 11 in the conventional liquid crystal display element are constructed as described above. When the terminals 12 are arranged in two rows in a staggered manner, the pitch between adjacent terminals 12 is increased. However, it is necessary to increase the length j of the terminal portion 11 in order to arrange the terminals 12 in two rows, and there is a problem that the terminal formation region cannot be narrowed.

【0005】この発明は、上記のような問題点を解消す
るためになされたもので、外部回路と接続が必要な端子
を多数個有する高密度基板において、接続信頼性を低下
させずに端子形成領域が狭小化された端子部を得ること
を目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has been made in consideration of the above problem. In a high-density substrate having a large number of terminals which need to be connected to an external circuit, the terminal formation can be performed without deteriorating connection reliability. It is an object of the present invention to obtain a terminal portion having a reduced area.

【0006】[0006]

【課題を解決するための手段】この発明に係わる高密度
基板の端子部は、外部回路と接続が必要な端子が多数配
置されたものにおいて、端子の形状を台形形状とし、端
子の引き出し線との接続側に台形形状の平行を成す長辺
と短辺が交互に並ぶように配置し、端子の幅の広い部分
を外部回路との接続に用いるようにしたものである。
A terminal portion of a high-density substrate according to the present invention is provided with a large number of terminals which need to be connected to an external circuit. Are arranged such that long sides and short sides of a trapezoid which are parallel to each other are alternately arranged on a connection side, and a wide portion of a terminal is used for connection to an external circuit.

【0007】[0007]

【発明の実施の形態】実施の形態1.以下、この発明の
一実施の形態である高密度基板の端子部を図について説
明する。図1はこの発明の実施の形態1による高密度基
板の多数の端子が配列形成されてなる端子部を示す平面
図である。図において、1は台形形状を有する端子2が
配列形成されてなる端子部、3は端子2のコンタクト領
域、4は端子2に接続されている引き出し線である。a
は端子2の形成領域の長さ、すなわち台形形状の端子2
の高さ、bは台形形状の端子2の平行を成す一対の辺の
内の短辺の1/2の長さ、cは台形形状の端子2の平行
を成す一対の辺の内の長辺の1/2の長さ、eは引き出
し線4のピッチ、fは端子1の間隔である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, a terminal portion of a high-density substrate according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a terminal portion formed by arranging a large number of terminals on a high-density substrate according to Embodiment 1 of the present invention. In the drawing, reference numeral 1 denotes a terminal portion in which terminals 2 having a trapezoidal shape are arranged and formed, 3 denotes a contact region of the terminal 2, and 4 denotes a lead wire connected to the terminal 2. a
Is the length of the formation area of the terminal 2, that is, the trapezoidal terminal 2
, B is the length of half of the short side of the pair of sides forming the parallel of the trapezoidal terminal 2, c is the long side of the pair of sides forming the parallel of the trapezoidal terminal 2 , E is the pitch of the lead wire 4, and f is the interval between the terminals 1.

【0008】本実施の形態による高密度基板の端子部1
は、台形形状を有する端子2を引き出し線4との接続側
に台形形状の長辺と短辺を交互に配置することにより構
成されている。台形形状の端子2の長辺と短辺を交互に
配置することにより、端子2の幅が広く形成される部分
が千鳥足状に設けられる。この千鳥足状に設けられた幅
の広い部分をコンタクト領域3として外部回路との接続
に用いる。
[0008] Terminal portion 1 of high-density substrate according to the present embodiment
Is formed by alternately arranging long sides and short sides of a trapezoidal terminal 2 on a connection side with a lead wire 4 on a trapezoidal shape. By alternately arranging the long sides and the short sides of the trapezoidal terminals 2, the portions where the terminals 2 are formed to be wide are provided in a staggered manner. The wide portion provided in a staggered manner is used as a contact region 3 for connection to an external circuit.

【0009】次に具体例を示して説明する。例えば、図
2に示す従来例における引き出し線14のピッチkを6
5ミクロン、二列に配列されている端子12の形成領域
の長さjを100ミクロンとし、二列に配列さた端子1
2間のショートを考慮して5ミクロンの間隔を設け、コ
ンタクト領域13を円形と仮定した場合、端子12の長
さhは47.5ミクロンとなり、コンタクト領域13の
直径は47.5ミクロンとなる。一方、図1に示す本実
施の形態では、引き出し線4のピッチeを65ミクロ
ン、端子2の形成領域の長さ、すなわち台形形状の端子
2の高さaを100ミクロン、平行を成す一対の辺の内
の短辺の1/2の長さbを20ミクロン、平行を成す一
対の辺の内の長辺の1/2の長さcを40ミクロン、端
子1の間隔fを5ミクロンとし、コンタクト領域13を
円形と仮定した場合、コンタクト領域3の直径は60ミ
クロン以上となる。
Next, a specific example will be described. For example, the pitch k of the lead wire 14 in the conventional example shown in FIG.
5 μm, the length j of the formation region of the terminals 12 arranged in two rows is 100 μm, and the terminals 1 arranged in two rows are
Assuming that the contact region 13 has a circular shape in consideration of the short circuit between the two and the contact region 13 is circular, the length h of the terminal 12 is 47.5 microns and the diameter of the contact region 13 is 47.5 microns. . On the other hand, in the present embodiment shown in FIG. 1, the pitch e of the lead wire 4 is 65 microns, the length of the formation region of the terminal 2, that is, the height a of the trapezoidal terminal 2 is 100 microns, and a pair of parallel The length b of the short side of the side is 20 microns, the length c of the long side of the pair of parallel sides is 40 microns, and the distance f between the terminals 1 is 5 microns. Assuming that the contact region 13 is circular, the diameter of the contact region 3 is 60 microns or more.

【0010】本実施の形態によれば、外部回路と接続さ
れて電圧が印加される端子2の形状を台形形状とし、引
き出し線4との接続側に台形形状の長辺と短辺を交互に
配置することにより、端子2の幅が広く形成される部分
が千鳥足状に設けられ、この千鳥足状に設けられた幅の
広い部分をコンタクト領域3として外部回路との接続に
用いることにより、接続信頼性を低下させずに端子が配
列形成されてなる端子部の長さを短くすることができ
る。また、図2に示す従来例のように端子12間に引き
出し線14を延長させる必要がなくなり、引き出し線1
4と端子2間の接触不良等を回避できる。
According to the present embodiment, the shape of the terminal 2 connected to the external circuit and to which a voltage is applied is trapezoidal, and the long side and the short side of the trapezoidal shape are alternately formed on the connection side with the lead wire 4. By arranging, the portion where the width of the terminal 2 is formed is provided in a zigzag pattern, and the wide portion provided in the zigzag pattern is used as the contact region 3 for connection with an external circuit. The length of the terminal portion in which the terminals are arranged and formed can be reduced without lowering the performance. Further, it is not necessary to extend the lead wire 14 between the terminals 12 as in the conventional example shown in FIG.
Poor contact between the terminal 4 and the terminal 2 can be avoided.

【0011】[0011]

【発明の効果】以上のように、この発明によれば、外部
回路と接続が必要な端子を多数個有する高密度基板にお
いて、端子の形状を台形形状とし、引き出し線との接続
側に台形形状の長辺と短辺を交互に配置することによ
り、千鳥足状に設けられた端子の幅が広く形成される部
分をコンタクト領域として外部回路との接続に用いるこ
とができ、接続信頼性を低下させずに端子形成領域が狭
小化された端子部を提供することができる。
As described above, according to the present invention, in a high-density substrate having a large number of terminals that need to be connected to an external circuit, the terminals are trapezoidal, and the trapezoidal shape is provided on the connection side with the lead wire. By alternately arranging the long side and the short side of the terminal, a portion where the width of the terminals provided in a staggered manner is formed can be used as a contact region for connection with an external circuit, and connection reliability is reduced. It is possible to provide a terminal portion in which the terminal formation region is narrowed without using the terminal portion.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 この発明の実施の形態1による高密度基板の
端子部を示す平面図である。
FIG. 1 is a plan view showing a terminal portion of a high-density substrate according to a first embodiment of the present invention.

【図2】 従来のこの種端子部を有する液晶表示素子を
示す図である。
FIG. 2 is a view showing a conventional liquid crystal display device having such terminal portions.

【符号の説明】[Explanation of symbols]

1 端子部、2 端子、3 コンタクト領域、4 引き
出し線、a 端子2の形成領域の長さ(台形形状の端子
2の高さ) b 台形形状の端子2の短辺の1/2の長さ、c 台形
形状の端子2の長辺の1/2の長さ、e 引き出し線4
のピッチ、f 端子2の間隔。
1 Terminal portion, 2 terminals, 3 contact regions, 4 lead wires, a Length of the formation region of the terminal 2 (height of the trapezoidal terminal 2) b Length of half of the short side of the trapezoidal terminal 2 , C 1/2 length of the long side of the trapezoidal terminal 2, e lead wire 4
Pitch, f spacing between terminals 2.

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2H092 GA33 GA40 GA45 NA25 5C094 AA14 AA15 DB01 DB02 DB03 FA04 5E077 BB11 BB31 BB34 CC01 JJ20 JJ21 JJ23 5G435 AA14 AA17 BB12 EE46 HH12 KK09  ──────────────────────────────────────────────────続 き Continued on front page F term (reference) 2H092 GA33 GA40 GA45 NA25 5C094 AA14 AA15 DB01 DB02 DB03 FA04 5E077 BB11 BB31 BB34 CC01 JJ20 JJ21 JJ23 5G435 AA14 AA17 BB12 EE46 HH12 KK09

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 外部回路と接続が必要な端子が多数配置
された高密度基板の端子部において、 上記端子の形状を台形形状とし、上記端子の引き出し線
との接続側に上記台形形状の平行を成す長辺と短辺が交
互に並ぶように配置し、上記端子の幅の広い部分を上記
外部回路との接続に用いるようにしたことを特徴とする
高密度基板の端子部。
In a terminal portion of a high-density substrate on which a large number of terminals required to be connected to an external circuit are arranged, the terminal has a trapezoidal shape, and the trapezoidal parallel side is connected to a connection side of the terminal with a lead wire. A terminal portion of a high-density substrate, wherein long sides and short sides are arranged alternately, and a wide portion of the terminal is used for connection to the external circuit.
JP2001135917A 2001-05-07 2001-05-07 Terminal part of high density substrate Pending JP2002334736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001135917A JP2002334736A (en) 2001-05-07 2001-05-07 Terminal part of high density substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001135917A JP2002334736A (en) 2001-05-07 2001-05-07 Terminal part of high density substrate

Publications (1)

Publication Number Publication Date
JP2002334736A true JP2002334736A (en) 2002-11-22

Family

ID=18983299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001135917A Pending JP2002334736A (en) 2001-05-07 2001-05-07 Terminal part of high density substrate

Country Status (1)

Country Link
JP (1) JP2002334736A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100669375B1 (en) 2004-05-31 2007-01-15 삼성에스디아이 주식회사 Organic electro luminescence display device with the same
WO2017035881A1 (en) * 2015-09-06 2017-03-09 深圳市华星光电技术有限公司 Driver chip structure and liquid crystal display device
JP2020521169A (en) * 2017-09-29 2020-07-16 クンシャン ゴー−ビシオノクス オプト−エレクトロニクス カンパニー リミテッドKunshan Go−Visionox Opto−Electronics Co., Ltd. Array substrate and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100669375B1 (en) 2004-05-31 2007-01-15 삼성에스디아이 주식회사 Organic electro luminescence display device with the same
WO2017035881A1 (en) * 2015-09-06 2017-03-09 深圳市华星光电技术有限公司 Driver chip structure and liquid crystal display device
JP2020521169A (en) * 2017-09-29 2020-07-16 クンシャン ゴー−ビシオノクス オプト−エレクトロニクス カンパニー リミテッドKunshan Go−Visionox Opto−Electronics Co., Ltd. Array substrate and manufacturing method thereof
US11462491B2 (en) 2017-09-29 2022-10-04 Kunshan Go-Visionox Opto-Electronics Co., Ltd. Array substrate and manufacturing method thereof

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