JP2002333614A - Manufacturing method and manufacturing device for liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device for a liquid crystal display device, by which the mixing of bubbles between a substrate and a photosensitive resin film layer is suppressed and the generation of the defect part generated at the photosensitive resin film is suppressed. SOLUTION: When a resist film 15 is thermocompression bonded to a TFT array substrate using two rubber rolls 14 and 14', the diameter of the rubber roll 14 coming in contact with the resist film 15 is made larger than that of the rubber roll 14' coming in contact with the TFT array substrate and only the rubber roll 14 coming in contact with the resist film 15 is connected to a driving motor. The mixing of the bubbles and the generation of the defect part are suppressed by this means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for manufacturing a liquid crystal display device.

[0002]

2. Description of the Related Art Conventional liquid crystal display devices are widely used as main display devices, especially for applications requiring small size and light weight. FIG. 3 shows a sectional structure view of a conventional liquid crystal display device. 3, reference numeral 1 denotes a pair of glass substrates constituting a liquid crystal display device, 2 denotes a transparent electrode for applying a voltage to the liquid crystal 8, 3 denotes an alignment film for aligning the liquid crystal 8, and 4 denotes an active electrode for driving the transparent electrode 2. Element 5, reference numeral 5 denotes a color filter pattern, reference numeral 6 denotes a black matrix, reference numeral 7 denotes a spacer for maintaining a distance between the pair of glass substrates 1, reference numeral 9 denotes a sealing material for sealing the liquid crystal 8, reference numeral 10 denotes a color filter pattern 5, and transparent electrodes on the glass substrate 1. 2, a color filter substrate provided with an alignment film 3, 11 is a transparent electrode 2, an active element 4,
This is a TFT array substrate provided with an alignment film 3.

In the liquid crystal display device shown in FIG. 3, a switching element 4 provided on a signal line is driven to apply a voltage to the transparent electrode 2 to deflect the molecular arrangement of the liquid crystal 8. It operates by transmitting or blocking light through the device. In this case, since the color filter 5 is formed, the liquid crystal display performs color display.

In recent years, this liquid crystal display device has become a large monitor,
Applications have been developed in the field of devices where CRTs have conventionally been used, such as television applications, and accordingly, further improvement in performance is required for liquid crystal display devices. In particular, when applying liquid crystal panels to medical applications such as radiographic display and Internet commerce, high-brightness, high-definition liquid crystal, and non-bright point panels are required. Against this background, in order to realize high brightness and high definition, an HA type liquid crystal display device in which a flattening resin film pattern is formed on a TFT array substrate, and a color filter pattern is formed on a TFT array substrate. A color filter-on TFT array type liquid crystal display device is being developed.

As a method for forming a flattening resin film pattern or a color filter pattern on a TFT array substrate, a pigment photo method, a film transfer method, a printing method, an electrodeposition method, an ink jet method, and the like are widely known. Among them, the film transfer method is one of the effective methods because of its high yield and large format.

Hereinafter, the steps of the film transfer method will be described with reference to FIG. First, as shown in FIG. 2A, a resist film 15 obtained by applying a photosensitive resin film layer 12 to a base film 13 is thermocompression bonded to the glass substrate 1 using two rubber rolls 14 and 14 '. After the substrate end of the resist film 15 is cut by the cutter 16 (FIG. B), the substrate is turned over (FIG. C), and the base film 13 is peeled off (FIG. D). Thereafter, exposure and development are performed using the photomask 17 (FIG. 3E) to obtain the glass substrate 1 on which the resin film pattern 18 is formed.

This method is applied to a TFT array substrate.
That is, the color filter and the black matrix are formed and the respective color patterns 18 are formed by sequentially repeating the above-described steps using the resist film 15 in which the R, G, B, and Bk (black) pigments are dispersed.

[0008]

SUMMARY OF THE INVENTION However, TFT
Since the array substrate 11 is provided with the matrix-shaped electrode wiring, when the resist film 15 is thermocompression-bonded thereto, there is a problem that air bubbles are more likely to be mixed between the film and the substrate as compared with a normal glass substrate. is there.

When the resist film 15 is pressed, a torque is applied to the two rubber rolls 14 and 14 ′, or the roll 1 in contact with the resist film 15
4 is smaller than the diameter of the roll 14 ′ in contact with the TFT array substrate 11, the two rolls 14, 14 ′
The shearing stress generated in the contact portion between the resist film 15 and the glass substrate 1 when passing between them increases, and the photosensitive resin film layer 12 of the resist film 15 is cut into protrusions of the electrode wiring formed on the glass substrate 1. In some cases, a defective portion was generated.

[0010] In order to solve such problems, the present invention suppresses the incorporation of air bubbles between the substrate and the photosensitive resin film layer, and also suppresses the occurrence of defective portions generated in the photosensitive resin film. An object of the present invention is to provide a method and an apparatus for manufacturing a liquid crystal display device.

[0011]

According to a first aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, comprising a step of laminating a photosensitive resin film layer and an array substrate between two opposing rolls. Pressing the photosensitive resin film layer and the array substrate by passing through, and forming a resin film pattern on the array substrate by exposing and developing the photosensitive resin film layer pressed on the array substrate. , Wherein only the roll on the photosensitive resin film layer side of the two opposing rolls is driven to perform pressure bonding.

According to the first aspect of the present invention, the opposed two
Since only the roll on the photosensitive resin film layer side of the two rolls is driven, the shear stress generated between the photosensitive resin film layer and the array substrate when both of the opposed rolls are driven is suppressed. be able to. As a result, it is possible to suppress the occurrence of a defective portion of the photosensitive resin film layer.

According to a second aspect of the present invention, in the method for manufacturing a liquid crystal display device according to the first aspect of the present invention, the diameter of the roll on the photosensitive resin film layer side of the two opposing rolls is changed to the diameter of the roll on the array substrate side. The crimping is performed with a diameter larger than the diameter.

According to the second aspect of the invention, the same effect as the first aspect of the invention is exhibited, and the diameter of the roll on the photosensitive resin film layer side of the two opposing rolls is changed to the array substrate side. In order to perform the pressure bonding with a diameter larger than the diameter of the roll, the array substrate slightly warps toward the roll on the array substrate side. As a result, the incorporation of air bubbles between the photosensitive resin film layer and the array substrate can be suppressed.

According to a third aspect of the present invention, there is provided an apparatus for manufacturing a liquid crystal display device, comprising two opposing rolls, wherein a photosensitive resin film layer and an array substrate are overlapped and passed between the two opposing rolls. A method for manufacturing a liquid crystal display device in which a photosensitive resin film layer and an array substrate are pressure-bonded, wherein only a roll on the photosensitive resin film layer side can be driven.

According to the third aspect of the invention, only the roll on the photosensitive resin film layer side of the two opposing rolls can be driven, so that when both of the two opposing rolls are driven, the photosensitive property is increased. The shear stress generated between the resin film layer and the array substrate can be suppressed. Therefore, it is possible to manufacture a liquid crystal display device in which defective portions generated in the photosensitive resin film layer are reduced.

According to a fourth aspect of the present invention, in the liquid crystal display device manufacturing apparatus according to the third aspect, the diameter of the roll on the photosensitive resin film layer side is larger than the diameter of the roll on the array substrate side. .

According to the fourth aspect of the present invention, the diameter of the roll on the photosensitive resin film layer side is made larger than the diameter of the roll on the array substrate side. Slightly warps toward the roll on the array substrate side. As a result, a liquid crystal display device in which bubbles mixed between the photosensitive resin film layer and the array substrate are reduced can be manufactured.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The steps of a film transfer method based on an embodiment of the present invention will be described below with reference to FIG.
First, as shown in FIG. 1A, a resist film 15 obtained by applying a photosensitive resin film layer 12 to a base film 13 is used.
Is thermocompression-bonded to the glass substrate 1 using two rubber rolls 14 and 14 '. As for these two rubber roll diameters, the diameter of the rubber roll 14 that contacts the resist film 15 is larger than the diameter of the rubber roll 14 ′ that contacts the glass substrate 1, and only the rubber roll 14 is connected to a drive motor (not shown). . Thereafter, the resist film 15 is cut at the edge of the substrate (FIG. 2B).
Is inverted (FIG. C), and the base film 13 is peeled off (FIG. D). After that, exposure and development (e in the same figure) are performed using the photomask 17, and
The resin film pattern 18 is formed.

Using this method, a color filter and a black matrix are formed by successively repeating the above steps using a resist film in which R, G, B, and Bk (black) pigments are dispersed. It is possible to form an array substrate.

Hereinafter, a comparison between a TFT array substrate according to an embodiment of the present invention and a comparative example will be described. In Comparative Example 1, Fuji Photo Film was used as the resist film 15.
Rubber roll 1 using resist film B35 manufactured by
At a temperature of 130 ° C. and a pressure of 1.6 MPa at 4,14 ′, thermocompression bonding was performed on a TFT array substrate (a matrix pattern of 125 μm × 42 μm was formed with metal wiring of 6 μm in width and 1.2 μm in thickness). At this time, the diameter of each of the two rubber rolls 14 and 14 'of the thermocompression bonding apparatus was set to 90 mm, and only the rubber roll 14 located on the resist film 15 side was connected to the drive motor. At this time, the rubber roll 14 'rotates as it passes through the TFT array substrate.

In Comparative Example 2, since the same temperature and pressure of the resist film 15 and the rubber rolls 14 and 14 'and the same TFT array substrate as in Comparative Example 1 are used, the description will be omitted. In Comparative Example 2, of the two rubber rolls 14 and 14 ′ of the thermocompression bonding apparatus used for thermocompression bonding of the resist film 15 to the TFT array substrate, the diameter of the rubber roll 14 located on the resist film 15 side was 90 mm, and the TFT array The diameter of the rubber roll 14 'located on the substrate side was set to 80 mm, and these two rubber rolls 14 and 14' were connected to drive motors.

In the embodiment of the present invention, the temperature and pressure of the resist film 15 and the rubber rolls 14, 14 '
Since the same TFT array substrate as in Comparative Examples 1 and 2 is used, the description is omitted. In the present embodiment, of the two rubber rolls of the thermocompression bonding apparatus used for thermocompression bonding of the resist film 15 to the TFT array substrate, the diameter of the rubber roll 14 located on the side of the resist film 15 is 90 mm,
The diameter of the rubber roll 14 'on the T array substrate side is set to 80 mm, and the rubber roll 1 located on the resist film 15 side is set.
Only 4 was connected to the drive motor. At this time, the rubber roll 14 'rotates as it passes through the TFT array substrate.

Under the above set conditions, after the thermocompression bonding of the resist film, the present embodiment and Comparative Examples 1 and 2 were used.
When individually evaluated, air bubbles were mixed on the entire surface of the array substrate according to the process of Comparative Example 1. In the array substrate according to the process of Comparative Example 2, defects were found in the photosensitive resin film layer 12 of the resist film 15. In the array substrate according to the process of the present embodiment, no bubbles were found in the photosensitive resin film layer 12 of the resist film 15 and no generation of bubbles was found.

From the above results, according to the present embodiment,
It is possible to suppress the incorporation of bubbles between the photosensitive resin film layer 12 of the resist film 15 and the TFT array substrate, and to suppress the occurrence of defects in the photosensitive resin layer 12 of the resist film 15 while maintaining the TFT array. The resist film 15 can be thermocompression-bonded to the substrate.

In this embodiment, a color filter-on TFT array substrate is manufactured. In the same manner, an HA type TFT for forming a flattening resin film pattern on the TFT array substrate is formed.
It is also possible to manufacture an FT array substrate.

It is desirable that the hardness of the rubber roll 14 of the two rubber rolls 14 and 14 'be lower than the hardness of the rubber roll 14'. This allows the TF
The T array substrate slightly warps to the rubber roll 14 'side, and TF
The mixing of air bubbles generated between the T array substrate and the photosensitive resin film layer 12 can be further suppressed. Therefore, the rubber roll 14
In addition to making the diameter of the rubber roll 14 'larger than the diameter of the rubber roll 14', it is more desirable that the hardness of the rubber roll 14 be lower than the hardness of the rubber roll 14 '.

Before the thermocompression bonding, the resist film 1
5 is desirably heated. Thus, the temperature of the photosensitive resin film layer 12 can be stably maintained at a temperature necessary for pressure bonding without mixing bubbles generated between the TFT array substrate and the photosensitive resin film layer 12.
Therefore, in addition to making the diameter of the rubber roll 14 larger than the diameter of the rubber roll 14 ', it is more desirable to heat the resist film 15 before thermocompression bonding.

Of course, in addition to making the diameter of the rubber roll 14 larger than the diameter of the rubber roll 14 ', the hardness of the rubber roll 14 is made lower than the hardness of the rubber roll 14', and the resist film 15 is heated in advance before thermocompression bonding. Needless to say, it is even more desirable to keep them.

[0030]

According to the first aspect of the present invention, only the roll on the photosensitive resin film layer side of the opposing rolls is driven. The shear stress generated between the film layer and the array substrate can be suppressed, and the occurrence of a defective portion in the photosensitive resin film layer can be suppressed.

According to the second aspect of the present invention, the same effect as that of the first aspect of the invention is exhibited, and the diameter of the roll on the photosensitive resin film layer side of the two opposing rolls is set to the array substrate side. In order to perform the pressure bonding with a diameter larger than the diameter of the roll, the array substrate slightly warps toward the roll on the array substrate side. As a result, the incorporation of air bubbles between the photosensitive resin film layer and the array substrate can be suppressed.

According to the third aspect of the present invention, the opposed two
Since only the roll on the photosensitive resin film layer side of the two rolls can be driven, the shear stress generated between the photosensitive resin film layer and the array substrate when both of the two opposing rolls are driven is suppressed. be able to. Therefore, it is possible to manufacture a liquid crystal display device in which defective portions generated in the photosensitive resin film layer are reduced.

According to the present invention, the diameter of the roll on the photosensitive resin film layer side is made larger than the diameter of the roll on the array substrate side. Slightly warps toward the roll on the array substrate side. As a result, a liquid crystal display device in which bubbles mixed between the photosensitive resin film layer and the array substrate are reduced can be manufactured.

[Brief description of the drawings]

FIG. 1 is a process diagram showing a film transfer method based on an embodiment of the present invention.

FIG. 2 is a process diagram showing steps of a conventional film transfer method.

FIG. 3 is a structural sectional view of a conventional liquid crystal display device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Transparent electrode 3 Alignment film 4 Active element 5 Color filter pattern 6 Black matrix 7 Spacer 8 Liquid crystal 9 Seal material 10 Color filter substrate 11 TFT array substrate 12 Photosensitive resin film layer 13 Base film 14 Rubber roll (resist film side) 14 'rubber roll (glass substrate or array substrate side) 15 resist film 16 cutter 17 photomask 18 resin film pattern

Continued on the front page F term (reference) 2H048 BA43 BA45 BB02 BB44 2H088 FA01 FA24 FA30 HA01 HA06 HA12 HA14 MA20 2H091 FA02Y FA35Y FB04 FC10 FC29 FD16 FD18 GA01 GA08 GA13 LA12

Claims (4)

[Claims] A step of laminating a photosensitive resin film layer and an array substrate between two opposed rolls so as to press-fit the photosensitive resin film layer and the array substrate; Forming a resin film pattern on the array substrate by exposing and developing the photosensitive resin film layer pressed on the substrate, wherein the two rolls facing each other are formed. The method of manufacturing a liquid crystal display device, wherein the pressure bonding is performed by driving only the roll on the photosensitive resin film layer side. 2. The pressure bonding is performed by setting the diameter of the roll on the photosensitive resin film layer side of the two opposing rolls larger than the diameter of the roll on the array substrate side. Of manufacturing a liquid crystal display device. 3. A photosensitive resin film layer and an array substrate are provided by superposing and passing a photosensitive resin film layer and an array substrate between the opposed two rolls. An apparatus for manufacturing a liquid crystal display device, wherein only the roll on the photosensitive resin film layer side is drivable. 4. The apparatus according to claim 3, wherein the diameter of the roll on the photosensitive resin film layer side is larger than the diameter of the roll on the array substrate side.