JP2002331551A - Injection-molding die for optical disk - Google Patents
Injection-molding die for optical diskInfo
- Publication number
- JP2002331551A JP2002331551A JP2001139688A JP2001139688A JP2002331551A JP 2002331551 A JP2002331551 A JP 2002331551A JP 2001139688 A JP2001139688 A JP 2001139688A JP 2001139688 A JP2001139688 A JP 2001139688A JP 2002331551 A JP2002331551 A JP 2002331551A
- Authority
- JP
- Japan
- Prior art keywords
- stamper
- heat insulating
- optical disk
- insulating material
- molding die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Optical Record Carriers (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、光ディスクの射出
成形用金型に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for injection molding an optical disk.
【0002】[0002]
【従来の技術】従来、光ディスクの成形において、金型
温度を調整して、成形ディスクへの転写を確保してい
る。金型温度が高ければ転写性は向上するが、ディスク
を取り出すまでの冷却時間が長くなり、生産性との両立
が困難である。また、冷却時間を短くすると、ディスク
の反りが悪化する。2. Description of the Related Art Conventionally, in molding an optical disk, a mold temperature is adjusted to ensure transfer to a molded disk. When the mold temperature is high, the transferability is improved, but the cooling time until the disk is taken out becomes long, and it is difficult to achieve compatibility with the productivity. In addition, when the cooling time is shortened, the warpage of the disk worsens.
【0003】[0003]
【発明が解決しようとする課題】上述のように金型温度
を調整していては、転写性と反り、生産性の両立が困難
であった。When the temperature of the mold is adjusted as described above, it is difficult to balance transferability with productivity and productivity.
【0004】本発明は上記問題点に鑑み、転写性を向上
させ、生産性を損なわないようにすること。特に、冷却
時間を長期化させない、反りを悪化させずに転写性だけ
を向上させる光ディスクの射出成形用金型を提供するこ
とを目的とする。SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to improve transferability so as not to impair productivity. In particular, it is an object of the present invention to provide a mold for injection molding of an optical disk that does not prolong the cooling time and improves only the transferability without deteriorating the warpage.
【0005】[0005]
【課題を解決するための手段】上記課題を解決する為に
本発明は、成形中の樹脂射出開始時における前記スタン
パ表面の樹脂の冷却速度を遅延化させ転写性を向上させ
る均一な密度の断熱材を有し、該断熱材を前記スタンパ
と該スタンパ固定している支持体との間に挟みこんだこ
とを特徴とする光ディスク射出成形金型を提供する。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a uniform-density heat insulating material for delaying the cooling rate of the resin on the surface of the stamper at the start of resin injection during molding and improving transferability. An optical disk injection molding die, comprising: a heat insulating material sandwiched between the stamper and a support fixed to the stamper.
【0006】なお上記断熱板として該断熱板が上記スタ
ンパに接する面が鏡面仕上げされている。あるいはその
面の面粗さが0.10s以下でありあるいは該材料の熱
伝導度が15w/m・k以下でかつ300Hv以上の硬
度を有し、あるいは0.5〜2.0mmの厚みを有し、
あるいはアモルファスカーボン材料であることがより上
記目的を達成することができる。また前記断熱材の固定
方法として、前記スタンパの中央部と該断熱板中央部と
を、スタンパホルダーにて前記支持体に共締めして且つ
該断熱板外周部を吸引して該支持体に固定することによ
りベッターである。The heat insulating plate has a mirror-finished surface in contact with the stamper. Alternatively, the surface has a surface roughness of 0.10 s or less, or the material has a thermal conductivity of 15 w / m · k or less and a hardness of 300 Hv or more, or has a thickness of 0.5 to 2.0 mm. And
Alternatively, the above object can be achieved by using an amorphous carbon material. As a method of fixing the heat insulating material, the center of the stamper and the center of the heat insulating plate are fastened together to the support by a stamper holder, and the outer peripheral portion of the heat insulating plate is sucked and fixed to the support. You are a bettor.
【0007】[0007]
【発明の実施の形態】以下本発明の光ディスク射出成形
用金型について、図面を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a mold for injection molding an optical disk according to the present invention will be described with reference to the drawings.
【0008】図1において、1はスタンパ着脱部材を示
し、スタンパ取り付け面5を含む部品、スタンパホルダ
7、外周リング8から主に構成され、以後この1の部材
をカセットと定義する。カセット1にはスタンパ6と断
熱板15が取り付けてある。また3はスタンパ取り付け
側の固定側型板、2は可動側型板を示す。In FIG. 1, reference numeral 1 denotes a stamper attaching / detaching member, which is mainly composed of a part including a stamper mounting surface 5, a stamper holder 7, and an outer peripheral ring 8. Hereinafter, this one member is defined as a cassette. The cassette 1 is provided with a stamper 6 and a heat insulating plate 15. Reference numeral 3 denotes a fixed mold plate on the side where the stamper is mounted, and 2 denotes a movable mold plate.
【0009】図1は、本発明の請求項1記載のスタンパ
を受容する支持体の金型温調配管16とスタンパ6の間
に、着脱式に位置せしめられた均一密度の断熱板15を
含み、本発明の請求項7記載の断熱板15を、スタンパ
ホルダ7でスタンパ6の中央部と共締めし、断熱板15
の外周部を吸引し、カセット方式の金型で、オフライン
にてスタンパ6及び断熱板15の着脱作業を可能とした
金型のカセットを金型に取り付ける或いは取り外す際の
概略図を示している。FIG. 1 includes a detachable, uniform-density heat insulating plate 15 between a mold temperature control pipe 16 and a stamper 6 of a support for receiving a stamper according to claim 1 of the present invention. The heat insulating plate 15 according to claim 7 of the present invention is fastened together with the center portion of the stamper 6 by the stamper holder 7 to form the heat insulating plate 15.
FIG. 3 is a schematic view showing a state in which a mold cassette in which a stamper 6 and a heat insulating plate 15 can be detached and attached in an off-line manner by a cassette type mold is attached to or detached from the mold by suctioning an outer peripheral portion of the mold.
【0010】光ディスク成形の場合、スタンパ形状に樹
脂を転写する為に、樹脂の分解温度近くまで(例;ポリ
カーボネートの場合330℃以上)溶融した樹脂を、樹
脂の軟化点以下の温度(例;ポリカーボネートの場合1
00℃前後)の金型内に短時間で射出し(0.1秒程
度)、スタンパ形状に樹脂を転写した後、樹脂を冷却固
化(数秒オーダー)させ、金型を開き成形体を取り出
す。スタンパ形状に樹脂を転写する際には、樹脂の粘度
を低くすることが必要で、その為には射出時のスタンパ
表面温度を高く保っておきたい。この時、生産性を考慮
すると、タクトは短いほうが好ましいので、結果として
金型温度よりは高い温度で成形体は金型から取り出され
ることになる。つまり、金型から成形体が取り出された
あと次の樹脂が射出されるまでの間にスタンパ表面温度
は金型温度の影響を受け低下することになる。この時
に、スタンパ6と金型温調配管16の間に断熱板15を
入れることにより、射出時までのスタンパ表面温度をよ
り高温に保つことが可能となり、その結果転写が向上す
る。In the case of molding an optical disk, in order to transfer the resin to a stamper shape, a resin melted to a temperature close to the decomposition temperature of the resin (eg, 330 ° C. or more in the case of polycarbonate) is heated to a temperature below the softening point of the resin (eg, polycarbonate). In case 1
The resin is transferred into a stamper shape in a short time (approximately 0.1 second) and then cooled and solidified (on the order of several seconds), the mold is opened, and the molded body is taken out. When transferring the resin to the stamper shape, it is necessary to lower the viscosity of the resin, and therefore, it is desirable to keep the stamper surface temperature at the time of injection high. At this time, in consideration of productivity, it is preferable that the tact is short, and as a result, the compact is removed from the mold at a temperature higher than the mold temperature. That is, after the molded body is taken out of the mold and before the next resin is injected, the surface temperature of the stamper is affected by the mold temperature and decreases. At this time, by inserting the heat insulating plate 15 between the stamper 6 and the mold temperature control pipe 16, the surface temperature of the stamper until injection can be kept higher, and as a result, the transfer is improved.
【0011】この際、断熱板のスタンパ面と接する面5
を鏡面仕上げとすることで、スタンパとの密着性を向上
させることにより、成形圧力に対するスタンパと断熱板
の強度を向上させることができ、スタンパと断熱板の寿
命を長くすることができる。At this time, the surface 5 in contact with the stamper surface of the heat insulating plate
By making the mirror finish, the adhesion between the stamper and the heat insulating plate with respect to the molding pressure can be improved by improving the adhesion to the stamper, and the life of the stamper and the heat insulating plate can be extended.
【0012】また、断熱板のスタンパ面と接する面5の
表面粗度を0.10s以下とすることで、成形圧力によ
り断熱板表面がスタンパ面に転写されることによるスタ
ンパ品質の悪化を防ぎ、スタンパの寿命を長くすること
ができる。Further, by setting the surface roughness of the surface 5 of the heat insulating plate in contact with the stamper surface to 0.10 s or less, deterioration of the stamper quality due to the transfer of the heat insulating plate surface to the stamper surface due to molding pressure is prevented. The life of the stamper can be extended.
【0013】金型材質の熱伝導度は20W/m・kより
大きいため、この断熱板は、15W/m・k以下の熱伝
導度、かつ成形圧力に耐えうる300Hv以上の硬度を
有する材料とすることで断熱効果が大きく成形射出時の
転写が向上する。Since the heat conductivity of the mold material is larger than 20 W / m · k, this heat insulating plate is made of a material having a heat conductivity of 15 W / m · k or less and a hardness of 300 Hv or more that can withstand molding pressure. By doing so, the heat insulating effect is large and the transfer at the time of molding injection is improved.
【0014】また、断熱板は0.5mm以下の厚みでは
断熱効果が小さくまた強度が弱くなり、2.0mm以上
の厚みでは断熱効果は変わらないため、断熱板は0.5
〜2.0mmの厚みを有することで断熱効果が大きく、
成形射出時の転写が向上する。When the thickness of the heat insulating plate is 0.5 mm or less, the heat insulating effect is small and the strength is weak. When the thickness is 2.0 mm or more, the heat insulating effect is not changed.
Heat insulation effect is large by having a thickness of ~ 2.0 mm,
Transfer during molding and injection is improved.
【0015】断熱板は、高強度・高耐熱性・低磨耗・高
強度・低熱伝導のアモルファスカーボンを材料とするこ
とで転写を向上させることができるとともに断熱板及び
スタンパの寿命も長くすることができる。アモルファス
カーボンの1例を挙げると、UNIVEKSTM(ユニチ
カ株式会社製)は、熱伝導度5〜8W/m・k、硬度5
00Hv、曲げ強度100〜220Mpa、アモルファ
ス状態を維持できる温度2600度まで(すべてカタロ
グ値)である。The heat insulating plate is made of amorphous carbon having high strength, high heat resistance, low abrasion, high strength, and low thermal conductivity, so that the transfer can be improved and the life of the heat insulating plate and the stamper can be extended. it can. As an example of amorphous carbon, UNIVEKS ™ (manufactured by Unitika Ltd.) has a thermal conductivity of 5 to 8 W / m · k and a hardness of 5
It is 00Hv, the bending strength is 100 to 220 Mpa, and the temperature can maintain the amorphous state up to 2600 degrees (all catalog values).
【0016】断熱板15を、スタンパホルダ7でスタン
パ6の中央部と共締めし、断熱板15の外周部を吸引す
る取り付け方法とすることで、成形時の金型への固定が
確実となり安定した成形が可能となることで、成形体の
品質が安定する。The heat insulating plate 15 is fastened together with the central portion of the stamper 6 by the stamper holder 7 and the outer peripheral portion of the heat insulating plate 15 is suctioned, so that the heat insulating plate 15 is securely fixed to the mold during molding and is stable. As a result, the quality of the molded body is stabilized.
【0017】カセット方式の金型に断熱板及びスタンパ
を取り付けることにより、スタンパ取りつけ面及び断熱
板が傷ついた場合に交換が容易であるため製造のリード
タイムを短縮することができる。また異物がスタンパの
裏面と断熱板及びスタンパ取り付け面の間に存在する状
態で成形を行った場合、成形の際の圧縮力により(例え
ばDVD−ROM成形で、15〜30Ton)、異物形
状がスタンパ及び金型に転写され、スタンパに転写され
た場合はその転写が成形ディスクに転写されるため不良
品ディスクを作ることになり、製品品質に重大な欠陥を
もたらすとともに、スタンパも作り直しすることにな
る。またスタンパ取り付け面に転写された場合きれいに
拭き取らないと次のスタンパに転写されることになり、
また傷になった場合傷の面全体を研磨するか或いはこの
部分の部品を作り直すこととなり、製造のリードタイム
が長くなり、製造コストが増大するという重大な影響を
及ぼす。しかし、カセット方式を用いることにより、ス
タンパ取りつけ面がカセット内に含まれることで、スタ
ンパの交換作業がオフラインで作業できることから、ス
タンパの裏面とスタンパ取り付け面の間の異物を除去す
る際により異物の見やすい環境で作業できることによ
り、異物のない状態でスタンパをスタンパ取りつけ面に
取り付けることができるので、異物の挟み込みによるバ
ンプの発生を防止することができる。またクリーン度の
より高い場所にて上記スタンパ交換作業を行うことで、
よりバンプの発生を防止することができる。そしてバン
プのない成形を行うことで、製造のリードタイムを守
り、製造コストを抑えることができる。By attaching the heat insulating plate and the stamper to the cassette type mold, when the stamper mounting surface and the heat insulating plate are damaged, they can be easily replaced, so that the manufacturing lead time can be shortened. Also, when molding is performed in a state where foreign matter exists between the back surface of the stamper and the heat insulating plate and the mounting surface of the stamper, the shape of the foreign matter is reduced by the compression force at the time of molding (for example, 15 to 30 Ton in DVD-ROM molding). And when it is transferred to a mold and transferred to a stamper, the transfer is transferred to a molding disk, so that a defective disk is made, which causes a serious defect in product quality and remakes the stamper. . Also, if it is transferred to the stamper mounting surface, it will be transferred to the next stamper unless it is wiped cleanly,
In the case of scratching, the entire surface of the scratch is polished or parts of this portion are remade, which has a serious effect of increasing the manufacturing lead time and increasing the manufacturing cost. However, by using the cassette method, since the stamper mounting surface is included in the cassette, the stamper replacement operation can be performed off-line. Since the work can be performed in an environment that is easy to see, the stamper can be mounted on the stamper mounting surface without any foreign matter, so that the occurrence of bumps due to the foreign matter being sandwiched can be prevented. Also, by performing the stamper replacement work in a place with higher cleanliness,
The occurrence of bumps can be further prevented. By performing molding without bumps, the production lead time can be protected and the production cost can be reduced.
【0018】[0018]
【発明の効果】以上のように本発明は、成形中の射出開
始時において、スタンパ表面の初期冷却を遅延化し転写
性を向上させる為に、スタンパを受容する支持体とスタ
ンパの間に、着脱式に位置せしめられた均一密度の断熱
板を含むことにより、転写性が向上し、その結果金型温
度を低下させることができ、反りが良化するとともに冷
却時間を短縮することで生産性を向上させることができ
る光ディスクの射出成形用金型を提供する。As described above, according to the present invention, at the start of injection during molding, in order to delay the initial cooling of the surface of the stamper and to improve the transferability, it is necessary to attach or remove the stamper between the support receiving the stamper and the stamper. By including the heat insulating plate of uniform density positioned in the formula, the transferability is improved, and as a result, the mold temperature can be lowered, the warpage is improved, and the cooling time is shortened to improve the productivity. Provided is a mold for injection molding of an optical disk which can be improved.
【図1】本発明のスタンパを受容する支持体の金型温調
配管とスタンパの間に、着脱式に位置せしめられた均一
密度の断熱板を含み、カセットを金型に取り付ける或い
は取り外す際の金型の概略図BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 includes a detachably positioned uniform-density heat insulating plate between a mold temperature control pipe of a support for receiving a stamper of the present invention and a stamper, and is used when a cassette is attached to or detached from a mold. Schematic diagram of mold
1 カセット 2 可動側型板 3 固定側型板 4 固定側ミラーインサート 5 スタンパ取り付け面 6 スタンパ 7 スタンパホルダ 8 外周リング 9 回転リング 10 可動側ミラーインサート 11、13 ボルト 12 回転リング 14 外周吸引部 15 断熱板 16 金型温調配管 Reference Signs List 1 cassette 2 movable mold plate 3 fixed mold plate 4 fixed mirror insert 5 stamper mounting surface 6 stamper 7 stamper holder 8 outer ring 9 rotating ring 10 movable mirror insert 11, 13 bolt 12 rotating ring 14 outer suction part 15 heat insulation Plate 16 Mold temperature control piping
───────────────────────────────────────────────────── フロントページの続き (72)発明者 栗栖 正文 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 4F202 AH79 AJ01 AJ06 AJ13 CA11 CB01 CK42 CK90 5D121 DD05 DD18 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Masafumi Kurisu 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 4F202 AH79 AJ01 AJ06 AJ13 CA11 CB01 CK42 CK90 5D121 DD05 DD18
Claims (7)
成形する為のスタンパを含んだ光ディスク射出成形金型
であって、成形中の樹脂射出開始時における前記スタン
パ表面の樹脂の冷却速度を遅延化させ転写性を向上させ
る均一な密度の断熱材を有し、該断熱材を前記スタンパ
と該スタンパ固定している支持体との間に挟みこんだこ
とを特徴とする光ディスク射出成形金型。1. An optical disk injection molding die including a stamper for molding a thermoplastic resin material into an optical disk molded body, wherein a cooling rate of a resin on the surface of the stamper at the start of injection of the resin during molding is delayed. An injection molding die for an optical disc, comprising a heat insulating material having a uniform density for improving transferability, and the heat insulating material is sandwiched between the stamper and a support fixed to the stamper.
接する面が鏡面仕上げされていることを特徴とする請求
項1記載の光ディスク射出成形金型。2. The optical disk injection molding die according to claim 1, wherein a surface of the heat insulating material in contact with the stamper is mirror-finished.
接する面の面粗さが0.10s以下にすることを特徴と
する請求項1記載の光ディスク射出成形金型。3. The optical disk injection molding die according to claim 1, wherein a surface roughness of a surface of the heat insulating material in contact with the stamper is set to 0.10 s or less.
k以下の熱伝導度、300Hv以上の硬度を有すること
を特徴とする請求項1記載の光ディスク射出成形金型。4. The heat insulating material according to claim 1, wherein the heat insulating material is 15 w / m ·
2. The optical disk injection mold according to claim 1, wherein the mold has a thermal conductivity of not more than k and a hardness of not less than 300 Hv.
0mmの厚みを有することを特徴とする請求項1記載の
光ディスク射出成形金型。5. The heat insulating material according to claim 1, wherein the heat insulating material is 0.5 to 2.
2. The optical disk injection molding die according to claim 1, having a thickness of 0 mm.
カーボンを材料とすることを特徴とする請求項1記載の
光ディスク射出成形金型。6. The optical disk injection molding die according to claim 1, wherein the heat insulating material is made of amorphous carbon.
の中央部と該断熱板中央部とを、スタンパホルダーにて
前記支持体に共締めして且つ該断熱板外周部を吸引して
該支持体に固定することを特徴とする請求項1記載の光
ディスク射出成形金型。7. The heat insulating material according to claim 1, wherein a central portion of the stamper and a central portion of the heat insulating plate are fastened to the support with a stamper holder and the outer peripheral portion of the heat insulating plate is sucked. 2. The optical disk injection molding die according to claim 1, wherein said mold is fixed to said support.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001139688A JP3849457B2 (en) | 2001-05-10 | 2001-05-10 | Optical disc injection mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001139688A JP3849457B2 (en) | 2001-05-10 | 2001-05-10 | Optical disc injection mold |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002331551A true JP2002331551A (en) | 2002-11-19 |
JP2002331551A5 JP2002331551A5 (en) | 2004-10-28 |
JP3849457B2 JP3849457B2 (en) | 2006-11-22 |
Family
ID=18986424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001139688A Expired - Fee Related JP3849457B2 (en) | 2001-05-10 | 2001-05-10 | Optical disc injection mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3849457B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007122899A1 (en) * | 2006-04-21 | 2007-11-01 | Sumitomo Heavy Industries, Ltd. | Disk molding die, mirror disk, and method of manufacturing mirror disk |
WO2011113226A1 (en) * | 2010-03-19 | 2011-09-22 | 东莞宏威数码机械有限公司 | Pressing mold device for blue-ray disk |
KR101325934B1 (en) * | 2011-12-06 | 2013-11-07 | 유영목 | A vacuum injection compression mould with a sealing device and a method of vacuum injection compression moulding |
-
2001
- 2001-05-10 JP JP2001139688A patent/JP3849457B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007122899A1 (en) * | 2006-04-21 | 2007-11-01 | Sumitomo Heavy Industries, Ltd. | Disk molding die, mirror disk, and method of manufacturing mirror disk |
JP2007290167A (en) * | 2006-04-21 | 2007-11-08 | Mitsubishi Kagaku Media Co Ltd | Disk mold, mirror surface plate and manufacturing method of mirror surface plate |
JP4717699B2 (en) * | 2006-04-21 | 2011-07-06 | 三菱化学メディア株式会社 | DISC MOLDING DIE, Mirror Surface Board, and Mirror Surface Board Manufacturing Method |
WO2011113226A1 (en) * | 2010-03-19 | 2011-09-22 | 东莞宏威数码机械有限公司 | Pressing mold device for blue-ray disk |
KR101325934B1 (en) * | 2011-12-06 | 2013-11-07 | 유영목 | A vacuum injection compression mould with a sealing device and a method of vacuum injection compression moulding |
Also Published As
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