JP2002329998A - Board transporting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board transporting device capable of transporting a part mounting board efficiently at a low cost. SOLUTION: The board transporting device 1 is provided with a coil spring 9 capable of biasing an adsorption cylinder 10 downward. While adjusting the position of an adsorption pad 12 by extending and contracting the spring 9 according to the presence and absence of a shield can 27, the pad 12 can sufficiently closely be stuck to a package 20 and a defective board 28. Consequently, it is not required to fit the can 27 to the board 28 for equalizing its thickness to that of the package 20, and the cost is reduced. Furthermore, it is possible to simultaneously transport the package 20 provided with the can 27 and the board 28 without the can 27. Thus, a working process becomes efficient.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer device.

[0002]

2. Description of the Related Art For example, a voltage controlled oscillator (VCO) used for a mobile communication device or the like is manufactured as follows. First, electronic components are mounted at predetermined positions on a printed circuit board on which a large number of the same conductive circuits are formed on one surface side. Here, a defective section where a defect exists in the conductor circuit is detected in advance by an inspection machine, and no component is mounted on this defective section. Next, a shield can that covers the electronic component and the conductor circuit is mounted on the surface on which the component is mounted. Finally, individual packages are manufactured by performing a dicing operation of cutting the printed circuit board into sections.

[0003] The cut packages are transferred from the dicing table to the next workplace by a substrate transfer device, and operations such as sorting out defective products are performed.

[0006] Here, as shown in FIG. 6, a substrate transfer device 101 is provided at a predetermined position of a plate-shaped main body 102.
Are provided with a plurality of suction holes 103 which are opened on the lower surface side. The upper end side of the suction hole 103 communicates with a cavity 104 provided inside the main body 102,
4 is connected to the suction pump 106. An annular suction pad 105 is attached to the opening of the suction hole 103. Then, the suction pad 105 is pressed against the upper surface of each package 110, and the suction hole 103 is pressed.
Is closed, the suction hole 106 is moved by the suction pump 106.
03, the package 11
0 is vacuum-adsorbed.

[0005]

However, the defective section is cut off in a state where the electronic component and the shield can 112 are not mounted, and becomes a defective substrate 111. Therefore, the defective substrate 111 is formed by the thickness of the shield can 112.
The height is shorter than the package 110. For this reason, the suction pad 105A does not reach the upper surface of the defective substrate 111, and the defective substrate 111 cannot be suctioned.

[0006] Each of the suction holes 103 is formed in the internal cavity 10.
4 are connected. For this reason, if suction is performed in a state where the suction holes 103A are not closed by the defective substrate 111, air enters the other suction holes 103 from the suction holes 103A through the hollow portions 104, and the suction power of the entire apparatus is increased. Becomes weaker.

In order to avoid these problems, the shield can 112 must be attached to the defective section and the thickness thereof must be matched with the package 110, resulting in an increase in cost.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a board transfer device capable of transferring a component mounting board efficiently at low cost.

[0009]

According to a first aspect of the present invention, there is provided a substrate transfer apparatus, comprising: a plurality of components mounted on a component mounting board; and a suction pad connected to a negative pressure source. In a substrate transfer device that transfers the component mounting board by sucking to the device, the suction pad is movably supported over a range equal to or higher than the mounting height of the component from the component mounting board, and is elastically supported by an elastic member. The suction pad is urged toward the component mounting board.

Here, the elastic member for urging the suction pad may be, for example, a spring member, a sponge member, a rubber member, or the like. Further, the elastic member may be attached to each suction pad, a single plate-like elastic member having a size over the entire area where the suction pad is provided, or A plurality of blocks may be arranged in accordance with the arrangement of the suction pads. Further, the component includes not only the electronic component itself mounted on the component mounting board but also a cover member such as a shield can for protecting these electronic components.

According to a second aspect of the present invention, there is provided the substrate transfer apparatus according to the first aspect, wherein the component mounting board is separated for each component, and each of the suction pads is individually set via a valve device. It is connected to a negative pressure source, and further includes position detection means for detecting the position of the suction pad in the component mounting board direction, and when the suction pad has advanced to the component mounting board, It is characterized in that the corresponding valve device is configured to be squeezed at a predetermined timing to reduce the attraction force.

Here, as the valve device, for example, a valve,
By opening and closing based on information from a sensor, such as a switching valve, communication-blocking switching can be performed between the inside of the suction pad and the external space, or between one suction pad and another suction pad. Anything possible can be used.

[0013]

According to the first aspect of the present invention, the substrate transfer device supports the suction pad so as to be movable over a range equal to or higher than the mounting height of the component from the substrate, and is provided with the elastic member. The suction pad is urged toward the substrate. According to such a configuration, even if the height of the surface in contact with the suction pad differs for each substrate, the position of the suction pad is adjusted so as to match the height of this surface, and the suction pad is moved to the substrate. Can be sufficiently adhered. Therefore, it is not necessary to adjust the thickness in advance on the substrate side, and the cost can be reduced. Further, since different kinds of substrates can be transferred at one time, the efficiency of the working process can be improved.

According to the second aspect of the present invention, the substrate transfer device is provided with the position detecting means for detecting the position of the suction pad and the valve device, and the suction pad advances to the component mounting board side. In this case, the valve device corresponding to the suction pad is throttled at a predetermined timing to reduce the suction force.

According to such a configuration, when the position of the suction pad is adjusted according to the mounting height of the component from each substrate, the position of the suction pad is detected by the position detecting means, so that the component is detected. It is possible to determine to which suction pad a substrate not mounted is sucked. Then, based on this information, by narrowing the valve device of the corresponding suction pad, the suction force of the suction pad is reduced, and the substrate can be selectively dropped. Also, by squeezing the valve device, it is possible to prevent the air from entering from the corresponding opened suction pad after the substrate is dropped and the suction force of another suction pad from being weakened. Thus, the transfer and the sorting of the substrate can be performed in the same process, and the efficiency of the working process can be improved.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS <First Embodiment> A first embodiment of a substrate transfer apparatus embodying the present invention will now be described with reference to FIG.
This will be described in detail with reference to FIGS.

FIG. 1 shows a substrate transfer apparatus 1 according to the present embodiment. The substrate transfer apparatus 1 includes a main body 2, a plurality of suction tubes 10 attached to the main body 2,
And a coil spring 9 (corresponding to the elastic member of the present invention) for urging the elastic member downward.

The main body 2 of the substrate transfer device 1 is formed in a plate shape having a cavity 3 therein. At a predetermined position of the main body 2, a through hole 4 penetrating vertically is provided. .

The suction tube 10 is inserted through the through hole 4 so as to be slidable up and down. The suction tube 10 is formed in a substantially cylindrical shape having an outer diameter slightly smaller than the through-hole 4, and an internal cavity is a suction hole 11. The lower end of the suction tube 10 is enlarged in the radial direction over the entire circumference, and a suction pad 12 that contacts an upper surface of a package 20 described later.
It has been. Further, the upper end side of the suction tube 10 is connected by a suction tube 5, and this suction tube 5 is connected to a suction pump 6 (corresponding to a negative pressure source of the present invention). In addition, on the outer peripheral surface of the suction tube 10, a protrusion 13 is provided in a portion located in the hollow portion 3 in the main body 2 so as to protrude in a radial direction. The projection 13 is locked to the lower wall surface 3B of the cavity 3 to prevent the suction tube 10 from falling downward.

The hollow portion 3 in the main body 2 is provided with a coil spring 9 for urging each suction tube 10 downward. The coil spring 9 is wound along the outer peripheral surface of each suction tube 10, and the upper end is fixed to the upper wall surface 3 </ b> A of the cavity 3, and the lower end is fixed to the protrusion 13. In a state where the substrate transfer device 1 is not operated, the lower end side of the suction tube 10 is the main body while the protrusion 13 of the suction tube 10 is pressed against the lower wall surface 3B of the cavity 3 by the action of the coil spring 9. 2 is projected downward from the lower surface side. The length of the protruding portion 14 of the suction tube 10 is equal to the thickness of a shield can 27 described later, that is, the package 2.
It is set to be slightly longer than the difference between the height of the defective substrate 28 and 0. And, by expansion and contraction of the coil spring 9,
The position of the suction pad 12 can be adjusted.

Next, the manufacturing process of the package 20 transferred by the substrate transfer device 1 will be described (FIG. 2). This package 20 is a voltage controlled oscillator (VCO) used for mobile communication equipment and the like.

The starting material of the package 20 is a printed circuit board 21. The printed circuit board 21 is formed by dividing one surface side (upper surface side in FIG. 2) of an insulating substrate 22 formed in a plate shape with a thickness of 500 μm using, for example, a glass cloth base epoxy resin in a grid pattern by a boundary line 23. The same conductor circuit 25 is formed in each section 24 (FIG. 2A).

The electronic component 26 is mounted on the printed board 21 by an automatic device such as a mounter and fixed by soldering (FIG. 2B). At this time, the defective section 24A in which a defect exists in the conductor circuit 25 is detected and marked in advance by an inspection machine (not shown), and the electronic component 26 is not mounted on the defective section 24A. Has become.

Next, a shield can 27 made of, for example, a metal (corresponding to a component of the present invention) is mounted on each section 24 (FIG. 2C). The shield can 27 is formed in a box shape having a width and length slightly smaller than each section 24 and a thickness of 1.2 mm, and is fixed on each section 24 so as to cover the electronic component 26 and the conductor circuit 25. You. Here, as in the case of the electronic component 26 described above, the shield can 27 is not mounted on the previously detected defective section 24A.

Finally, the package 20 is manufactured by performing a dicing operation for cutting the printed circuit board 21 into the respective sections 24 along the boundary line 23. At this time, the defective section 24A to which the shield can 27 is not attached is also cut into a defective substrate 28 (FIG. 2).
D).

Next, a process of transferring the package 20 by the substrate transfer device 1 will be described (FIG. 3).

First, the dicing table 7 on which the cut package 20 and the defective substrate 28 are placed
The main body 2 of the substrate transfer device 1 is positioned above. Next, the main body 2 is lowered, and the suction pads 12 are pressed against the upper surfaces of the packages 20 and the defective board 28 (FIG. 3).
A). At this time, the suction pad 12 is pushed upward according to the thickness of the package 20 and the defective board 28. Then, the suction pad 12 is pressed against the package 20 and the defective board 28 by the force of the coil spring 9 trying to return elastically.

Here, the defective board 28 is
In comparison with the shield can 27, the thickness is insufficient. However, the suction cylinder 10 is urged downward by the action of the coil spring 9, and the lower end of the suction cylinder 10 projects slightly longer than the thickness of the shield can 27 from the lower surface of the main body 2. As a result, the suction pad 12 formed at the tip of the suction tube 10 is also urged downward and pressed against the upper surface of the defective substrate 28. On the other hand, the package 20 is thicker than the defective board 28 by the thickness of the shield can 27. For this reason, when the coil spring 9 contracts by this thickness, the suction cylinder 10 rises, and the position of the suction pad 12 increases. Then, the suction pad 12 is pressed against the package 20 by the force of the coil spring 9 trying to return elastically. As described above, by the action of the coil spring 9, the height of the suction pad 12 is adjusted according to the presence or absence of the shield can 27, and the suction pad 12 is brought into a state of being sufficiently adhered to the package 20 and the defective board 28. .

In this state, the suction pump 6 is operated to suck the air in the suction hole 11 so that the suction pad 1 is sucked.
2, the package 20 and the defective substrate 28 are vacuum-sucked.

Next, the main body 2 is moved up (FIG. 3B) and moved to the work table 8 where the next work is performed. When the main body 2 reaches the work table 8, a valve (not shown) is opened to introduce air into the suction hole 11, and the package 20 and the defective board 28 are dropped onto the work table 8 (FIG. 3C).

As described above, according to the present embodiment, the substrate transfer device 1 is provided with the coil spring 9 capable of urging the suction tube 10 downward. According to such a configuration, the coil spring 9 expands and contracts in accordance with the presence or absence of the shield can 27, so that the position of the suction pad 12 is adjusted, and the suction pad 12 is attached to the package 2 by the elastic force of the coil spring 9.
0 and the defective substrate 28. Therefore, it is not necessary to attach the shield can 27 to the defective board 28 to make the package 20 and the package 20 uniform in thickness, and cost can be reduced. The package 20 having the shield can 27 and the shield can 2
7 can be transferred at the same time. For this reason, the efficiency of the work process can be improved.

Second Embodiment Hereinafter, a second embodiment of the present invention will be described in detail with reference to FIG. The main difference between the substrate transfer device 30 of the present embodiment and the substrate transfer device 1 of the first embodiment is that a sensor 32 capable of detecting the height of the suction tube 33 is provided, and that the sensor 32 A large valve 36 (corresponding to the valve device of the present invention) for adjusting the degree of vacuum in the suction hole 34 for each suction tube 33 based on the position information of the suction tube 33;
7 (corresponding to the valve device of the present invention). In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the substrate transfer device 30 of the present embodiment,
Sensors 3 for detecting the position of the suction pad 35 are provided on the upper surface 31A of the main body 31, one at a side of each suction tube 33.
2 (corresponding to the position detecting means of the present invention).

On the other hand, large valves 36 are provided at the upper ends of the adsorption cylinders 33, respectively. Also, this large valve 3
An opening 38 that opens to the side is provided slightly below the mounting position of 6, and a small valve 37 is attached to this opening 38.

The package 2 is transferred by the substrate transfer device 30.
When transferring 0, the main body 31 of the substrate transfer device 30 is aligned on the dicing table 7 as in the first embodiment. Then, the main body 31 is lowered, and the suction pad 3
5 is pressed against each package 20 and defective substrate 28 (FIG. 4A).

At this time, each suction pad 35 is pushed upward in accordance with the thickness of the package 20 and the defective substrate 28. That is, the suction pad 35 on which the package 20 is sucked is pushed up to a position higher by the thickness of the shield can 27, while the suction pad 35A on which the defective substrate 28 is sucked remains almost at the original position. When the sensor 32 is operated in this state, the sensor 32
The position of the suction pad 35 is determined by measuring the vertical movement distance of each suction tube 33. This information
It is sent to a controller (not shown) and processed, and it is determined that the defective substrate 28 is being sucked by the suction pad 35A at a lower position.

Next, the package 20 and the defective substrate 28
Is lifted, and the main body 31 is moved up to the collection table 39 (FIG. 4B). Then, according to an instruction from the controller, the large valve 36A of the suction cylinder 33A is closed. Next, the small valve 37A is opened, and the opening 38 is opened.
Then, air is introduced into the suction hole 34A. Thus, the suction force of the suction pad 33A is reduced, and the defective substrate 28 falls on the collection table 39 (FIG. 4C). At this time, the suction hole 34 of the suction tube 33A on which the defective substrate 28 was sucked is used.
Although A is open, the large valve 36 is closed, so that no air flows from the suction hole 34A into the other suction holes 34 via the suction tube 5. Therefore, in the other suction cylinder 33, the degree of vacuum in the suction hole 34 is maintained, and the suction force is maintained.

Thereafter, the main body 31 is moved to a position above the work table 8 where the next work is performed. When the main body 31 reaches the work table 8, the small valves 37 of all the suction cylinders 33 are opened, and air is introduced into the suction holes 34 from the openings 38.
Thereby, the package 20 falls on the work table 8.

As described above, according to this embodiment, by detecting the height of the suction tube 33 with the sensor 32, it is possible to determine which suction tube 33 the defective substrate 28 is sucked. By operating the large valve 36 and the small valve 37 based on this information, air can be introduced only into the suction hole 34A of the suction cylinder 33A on which the defective substrate 28 has been sucked. Thereby, the defective substrate 28 can be selectively dropped. Further, in the other suction cylinder 33, since the degree of vacuum inside the suction hole 34 can be maintained, the suction power can be maintained. Thus, the transfer of the package 20 and the selection of the defective substrate 28 can be performed in the same process,
The working process can be made more efficient.

<Third Embodiment> Hereinafter, a third embodiment of the present invention will be described in detail with reference to FIG. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

In this embodiment, the substrate transfer device 40
The base portion 41 (corresponding to the elastic member of the present invention) is formed in a plate shape by, for example, elastic synthetic rubber.
A cavity 42 is provided therein. Base part 41
Is located at a predetermined position from the lower surface 41A of the base 41.
A plurality of suction holes 43 communicating with 2 are formed at a constant pitch. An annular suction pad 45 having an outer diameter slightly larger than the opening 44 and having a hole 46 having the same diameter as the opening 44 is attached to the opening 44 of the suction hole 43. Further, a suction pipe 47 communicating with the cavity 42 is provided on a side surface of the base 41, and the suction pipe 47 is connected to the suction pump 6 (FIG. 5).
A).

The package 2 is transferred by the substrate transfer device 40.
When transferring 0, the base portion 41 of the substrate transfer device 40 is aligned on the dicing table 7 as in the first embodiment. Then, the main body 41 is lowered, and the suction pad 45 is pressed against each package 20 and the defective board 28 (FIG. 5B). At this time, since the base portion 41 is formed of rubber having elasticity, a portion pressed against the package 20 and the defective substrate 28 is slightly dented and deformed. Then, the suction pad 45 is brought into close contact with the package 20 and the defective substrate 28 by the force of the base portion 41 trying to return elastically.

Here, the defective substrate 28 is
In comparison with the height of the shield can 27, the height is insufficient. Therefore, the base portion 41 is hardly deformed. On the other hand, the package 20 is higher than the defective substrate 28 by the height of the shield can 27. Therefore, the position of the suction pad 45 is adjusted to be higher when the base 41 is deeply recessed.

In this state, the suction pump 6 is operated,
By sucking the air in the cavity 42, the package 20 and the defective substrate 28 are vacuum-sucked to the suction pad 45. Then, the transfer is performed as in the first embodiment (FIG. 5C).

As described above, according to the present embodiment, the base 41 of the substrate transfer device 40 is formed of synthetic rubber. According to such a configuration, the position of the suction pad 45 is adjusted by recessing the base portion 41 in accordance with the height of the package 20 and the defective substrate 28, and the suction pad 45 is moved by the elastic force of the base portion 41. 20 and the defective substrate 28. This allows
The same operation and effect as the first embodiment can be obtained.

The technical scope of the present invention is not limited by the above-described embodiment. For example, the followings are also included in the technical scope of the present invention. In addition, the technical scope of the present invention extends to an equivalent range.

(1) According to the first and second embodiments, the suction tubes 10 and 33 are connected by the suction tube 5 and connected to the suction pump 6 by the suction tube 5. According to this, the connection form between the suction tube and the suction pump is not limited to the above embodiments, and for example, the suction tube may be connected to separate suction pumps.

(2) According to the third embodiment, the base portion 41
Is made of synthetic rubber, but according to the present invention, the configuration of the elastic member is not limited to this embodiment. For example, a plate-shaped rubber member is attached to the lower surface side of a rigid plate-shaped main body. It may be. Further, the material of the elastic member is not limited to the embodiment, and may be, for example, a sponge member. (3) In the above embodiments, the substrate transfer devices 1, 30, 4
Although the package 20 transferred by the zero transfer device is a voltage controlled oscillator, the product transferred by the substrate transfer device of the present invention is not limited to the above embodiments, and may be another type of package, semiconductor chip, or the like. Good.

[Brief description of the drawings]

FIG. 1 is a side sectional view of a substrate transfer device according to a first embodiment.

FIG. 2 is a view showing a manufacturing process of the component mounting board of the present invention.

FIG. 3 is a view showing a process of transferring the component mounting board by the board transfer device of the first embodiment.

FIG. 4 is a diagram illustrating a process of transferring a component mounting board by the board transfer device according to the second embodiment.

FIG. 5 is a diagram illustrating a process of transferring a component mounting board by the board transfer device according to the third embodiment.

FIG. 6 is a side sectional view of a conventional substrate transfer device.

[Explanation of symbols]

 1, 30, 40: substrate transfer device 9: coil spring (elastic member) 12, 35, 45: suction pad 20: package (component mounting substrate) 32: sensor (position detecting means) 36: large valve (valve device) 37 … Small valve (valve device) 41… Base part (elastic member)

Claims (2)

[Claims] 1. A substrate transfer apparatus for transferring a component mounting substrate by adsorbing a plurality of components mounted on the component mounting substrate to a suction pad connected to a negative pressure source, wherein the suction pad is mounted on the component mounting substrate. A substrate transfer device, wherein a component is movably supported over a range equal to or higher than a mounting height of the component from the component mounting substrate, and the suction pad is urged toward the component mounting substrate by an elastic member. 2. The component mounting board is separated for each of the components, and each of the suction pads is individually connected to the negative pressure source via a valve device, and the suction pad is directed toward the component mounting board. Position detecting means for detecting the position of the suction pad, when the suction pad has advanced to the component mounting board side, the valve device corresponding to the suction pad is squeezed at a predetermined timing to reduce the suction force. The substrate transfer device according to claim 1, wherein the substrate transfer device is configured as follows.