JP2002323669A - Oscillating body apparatus, optical deflector, and optical instrument using optical deflector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an oscillating body apparatus, such as an optical deflector which can be made very small, and also made to a structure capable of two-dimensional scanning, and whose durability is high. SOLUTION: The oscillating body apparatus is provided with an oscillating body 5 having movable cores 7A and 7B which consist of a soft magnetic material or a hard magnetic material, fixed cores 10A and 10B around which coils 9A and 9B are wound, and an elastic support part 6 which oscillatably supports the oscillating body 5 to the supporting base board. The movable cores 7A and 7B and the fixed cores 10A and 10B respectively have the opposite surfaces which deviate in a vertical direction with respect to the oscillation direction of the oscillating body 5, and oppose via the space in almost parallel, and are arranged, and they are formed so that the area of the superposed part viewed from the above vertical direction of the respective opposite surfaces can be changed in accordance with the oscillation of the oscillating body 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oscillator device having an oscillator, and more particularly to an oscillator device for deflecting incident light. The present invention relates to an optical deflector, a method of manufacturing the same, an optical device configured using the optical deflector, and the like.

[0002]

2. Description of the Related Art At present, an apparatus for deflecting and scanning a light beam such as a laser beam (hereinafter referred to as an optical deflector) is used in optical devices such as a laser printer and a bar code reader. Conventionally, as optical deflectors incorporated in these devices, there are polygon mirrors that change the direction of reflection of incident light by rotating a polygonal prism whose side surface is a mirror surface, and galvano mirrors that rotate and oscillate a plane mirror by an electromagnetic actuator. is there.

However, a polygon mirror requires an electromagnetic motor for rotating the mirror, and a galvanomirror requires a mechanically wound drive coil and a large yoke for generating a magnetic field. There is a limit to conversion. At the same time, there is a problem that the size of the entire device for deflecting light becomes large due to the space for assembling the components.

[0004] When light is scanned two-dimensionally, a combination of a polygon mirror and a galvanometer mirror or a combination of two polygon mirrors is generally used. It is necessary to arrange the mirrors so that the scanning directions are orthogonal to each other, and the optical adjustment is very complicated.

On the other hand, an optical deflector proposed to solve the above-mentioned problems by using a micro-machining technology in which a micro-machine is integrally formed on a semiconductor substrate by applying a semiconductor manufacturing technology is disclosed in Japanese Patent Application Laid-Open No. H7-175005. Japanese Unexamined Patent Application Publication No. 07-181414 and the like are known.

FIG. 24A is a top view showing one embodiment of Japanese Patent Application Laid-Open No. Hei 7-175005. A flat movable plate 1005 having a light reflecting surface that is a total reflection mirror 1008 is a monolithic silicon-based torsionable two torsion spring 1
The structure 006 allows the semiconductor substrate, which is the silicon substrate 1002, to be pivotally supported on the semiconductor substrate. Fig. 24 (a)
Reference numeral 1001 denotes a galvanometer mirror, 1003 denotes an upper glass, 1004 denotes a lower glass, 1007 denotes a planar coil, 1009 denotes a contact pad, and 1010A, 1011A, 1010B, and 1010C denote permanent magnets. In this structure, a driving flat coil 10 that generates a magnetic field by energization is provided around the periphery of the movable plate 1005.
07 are laid, and a pair of permanent magnets 1010A, 1010B are provided on the upper and lower surfaces of the semiconductor substrate 1002 so as to apply a static magnetic field only to the portion of the driving plane coil 1007 parallel to the axial direction of the torsion spring 1006. 1011A and 1010C are installed via upper and lower glass substrates 1003 and 1004, respectively.

In this optical deflector, a driving plane coil 1007
And the current flowing through the planar coil 1007 and the permanent magnet 10
10A, 1010B; Lorentz force F in the direction according to Fleming's left-hand rule due to the magnetic flux density by 1011A, 1010C
(Not shown) works, and a moment for rotating the movable plate 1005 is generated. When the movable plate 1005 is rotated, the torsion spring 1006
A spring reaction force F ′ is generated due to the spring rigidity. Movable plate 1005
Is derived from the balance between the Lorentz force F and the spring reaction force F ′. When the current flowing through the planar coil 1007 is continuously and repeatedly performed with an alternating current, the movable plate 1005 having the light reflecting surface 1008 is rotated and vibrated, thereby scanning the reflected light.

Next, FIG. 24B is a perspective view showing one embodiment of Japanese Patent Application Laid-Open No. 07-181414. One end of the elastic support portion 2003 with two elastic deformation modes of bending mode theta _B and torsional deformation mode theta _T, a small driving source 2006 that generates a small vibration, such as a piezoelectric vibrator provided, other elastic support portion 2003 The vibrator 2002 has a light reflecting surface 2007 at the end.
In FIG. 24 (b), 2004 indicates a vibration input unit, 2006 indicates a vibration source, 2008 indicates a mirror support unit, and 2009 indicates a plate.

In this optical deflector, the elastic support portion 2003 causes bending vibration and torsional vibration by the vibration from the vibration source 2006. Due to the configuration of the element, each of the bending and torsion has its own resonance vibration mode. By generating vibration including the frequency components of these two resonance frequencies in the vibration source 2006, the elastic support portion 2003 Resonates at the resonance frequency. Thereby, the vibrator 20 having the reflection surface 2007
02 scans reflected light two-dimensionally.

[0010]

[Problems to be Solved by the Invention] However, FIG.
The optical deflectors shown in (a) and (b) constitute a small and two-dimensionally scannable optical deflector, but each has the following problems.

In the optical deflector shown in FIG. 24 (a) of Japanese Patent Application Laid-Open No. H7-175005, the upper and lower glass substrates 1003 and 1004 and the movable plate 1005 are required to increase the deflection angle of light when scanning light.
Must increase the distance. Then, the permanent magnets 1010A, 1010B; 1011A, 1010C and the driving plane coil 1
The relative distance of 007 increases, and the magnetic flux density of the permanent magnet in the planar coil 1007 decreases. Then, movable plate 10
Since a large current needs to flow through the planar coil 1007 to drive the 05, a power-saving optical deflector having a large deflection angle cannot be configured. The external magnetic field (permanent magnets 1010A, 1010B; 101
1A, 1010C) must be arranged outside the vibrating portion (movable plate 1005), which increases the external dimensions of the entire device. Further, the size of the movable plate 1005 including the planar coil 1007 is also increased.

In the optical deflector shown in FIG. 24A, wiring of a driving flat coil 1007 for driving the movable plate 1005 is patterned on a torsion spring 1006.
Therefore, the repetitive motion of the torsion spring 1006 at the time of driving the movable plate 1005 may cause the metal material of the wiring to break due to fatigue, and such a wiring disconnection accident greatly limits the life of the element. Further, the size of the movable plate 1005 including the planar coil 1007 is also increased.

Next, in the optical deflector shown in FIG. 24B of Japanese Patent Application Laid-Open No. 07-181414, scanning cannot be performed by driving at a frequency other than the resonance frequency, so that the scanning speed and the scanning waveform are limited. Would. In addition, it is not possible to perform driving that maintains the position of the reflection surface 2007.

In the optical deflector shown in FIG. 24 (b), one elastic support portion 2003 vibrates in two deformation modes, a bending mode and a torsional mode. , A large internal stress is generated in the elastic support portion 2003 as compared with a single stress. for that reason,
The elastic support portion 2003 is easily broken, which greatly limits the life of the element.

The present invention has been made in view of the above-mentioned problems of the conventional optical deflector, and is an optical deflector which can be made very small, has high durability and can have a two-dimensional scanning structure. It is an object of the present invention to provide an oscillator device, a method of manufacturing the same, an optical device configured using the optical deflector, and the like.

[0016]

An oscillator device according to the present invention for achieving the above object has an oscillator having a movable core made of a soft magnetic material or a hard magnetic material, a fixed core having a coil wound therearound. An oscillating device having an elastic supporting portion for oscillatingly supporting the oscillating body with respect to a support substrate, wherein the movable core and the fixed core are displaced in a direction perpendicular to the oscillating direction of the oscillating body. It is arranged so as to have opposing surfaces facing each other through a gap substantially in parallel, so that the area of the overlapping portion of each of the opposing surfaces viewed from the vertical direction changes as the rocking body swings. It is characterized by being formed.

As in this basic mode, a movable core is formed on an oscillating body having a reflection surface or the like, and a coil and a fixed core are formed in such a direction that a magnetic flux flows in the in-plane direction of the substrate. By arranging the cores so that their plane positions are different in the swinging direction and their opposing surfaces face each other, an electromagnetic actuator having a force generated in the normal direction of the substrate can be obtained. If the thickness of the movable core in the swing direction is appropriately set, a large generated force can be obtained even in a long stroke. Further, since no electrical wiring is performed to the movable part, an oscillator device such as an optical deflector having a long life without the possibility of a wiring disconnection accident can be configured.

The driving principle of an oscillator device having a fixed core around which the coil is wound and a movable core made of a soft magnetic material joined to the oscillator is as follows. The magnetic pole of the movable core of the soft magnetic material is not fixed, and when a magnetic flux is generated in the fixed core, a driving force is generated in which the soft magnetic material is attracted into the magnetic flux in a direction in which the cross-sectional area of the soft magnetic material that cuts off the magnetic flux increases. When the magnetic flux disappears, it is released. In the case of a movable core made of a soft magnetic material, a series magnetic circuit including the following gap can be easily formed.

On the other hand, when the movable core is formed of a hard magnetic material, the magnetic pole of the hard magnetic material to be magnetized is usually fixed (use of a hard magnetic material that is not magnetized). Is it possible to drive the oscillator by a magnetic force (attraction or repulsion) generated between the movable core and the fixed core or between the same magnetic poles. In this case, by using a hard magnetic material with large holding force and forming a movable core with large magnetization, it is possible to increase the generated force without increasing the number of turns of the coil circling the fixed core and the applied current Becomes For this reason, it is possible to configure a small-sized, power-saving actuator having a large generating force and the like.

In the case where two or more fixed cores are formed with the torsion axis interposed therebetween, the repulsive force and attractive force generated between the movable core and the fixed core depending on the direction of magnetization of the movable core are used.
A couple in the driving direction of the rocking body can be generated.
Therefore, a torque can be applied to both ends of the oscillating body at the same time, so that the generated force increases, and further, it is possible to adopt a configuration in which displacement in directions other than the oscillating direction hardly occurs.

Based on the above basic configuration, the following more specific forms are possible. The movable core and the fixed core around the coil can form a serial magnetic circuit through the gap. In this configuration, the fixed core may be formed in an appropriate shape, and the movable core may be arranged with respect to the fixed core via a gap, so that a flexible design is possible. Typically, a movable core and a fixed core form a series magnetic circuit that is closed through a gap.However, instead of a closed magnetic circuit, the movable core is sandwiched by a gap between two fixed cores with coils wound around. Various configurations are also possible.

The fixed core may have a substantially C shape in which two opposing surfaces opposing each opposing surface of the movable core oppose each other with the movable core interposed therebetween. By configuring the gap shape of the fixed core in this way, it is possible to reduce the leakage of the magnetic flux and obtain the generated force with high efficiency. Further, the generated force is determined by the permeance of the gap between the fixed core and the movable core. Therefore, in this embodiment, all the longest sides of the movable core can be configured as the width of the magnetic path, so that a large generated force can be obtained effectively. it can.

The fixed core may have a substantially U shape in which two opposing surfaces opposing the opposing surface of the movable core are in the same plane. By configuring the gap shape of the fixed core as in this form, it is possible to configure an optical deflector that has no possibility that the fixed core interferes with the bottom surface of the oscillator, and to compare an optical deflector with a large deflection angle. Can be easily achieved.

[0024] The elastic supporting portion is constituted by a torsion spring for swingably supporting the oscillator, and the movable core extends in a direction parallel to a torsion axis direction of the torsion spring. It can be made to be formed only in As in this mode, the elastic supporting portion is a torsion spring capable of torsional vibration, and the movable core is formed only on the peripheral portion of the oscillator parallel to the axial direction of the torsion spring, so that the driving torque to the oscillator is considered. In this case, the movable core can be formed in a portion where the moment arm is the largest, and torsional vibration can be efficiently performed.

[0025] The elastic support portion is constituted by a torsion spring for swingably supporting the oscillating body, and the movable core extends in a direction perpendicular to a torsion axis direction of the torsion spring. It can be made to be formed only in As in this form, the elastic support portion is formed of a torsion spring that is capable of torsional vibration, and the movable core is formed on the peripheral portion of the rocking body perpendicular to the axial direction of the torsion spring, so as to form the gap shape of the fixed core. Regardless, the configuration can be such that the opposing surfaces of the movable core and the fixed core do not interfere at all in the swing direction, and an optical deflector having a large deflection angle can be realized relatively easily.

[0026] The elastic support portion is constituted by a torsion spring for swingably supporting the oscillating body, and the movable core has a direction perpendicular to a torsion axis direction of the torsion spring in the same plane as the oscillating body. , And may be formed in a protruding shape from the periphery of the oscillator. As in this embodiment, the elastic support portion is constituted by a torsion spring capable of torsional vibration, and the movable core projects from the peripheral portion of the oscillator in a direction perpendicular to the axial direction of the torsion spring in the same plane as the support substrate. With the configuration projecting in the shape, the moment arm can be made larger than in the above-described embodiment, and a larger torque can be generated.

In these three embodiments, since the movable cores are formed only in the vicinity of the fixed cores constituting the serial magnetic circuits, unnecessary movable forces are generated in directions other than the driving direction of the oscillator. There can be no configuration. In particular, when the movable core is formed on the side opposite to the side on which the fixed core is formed with the torsion axis interposed therebetween (typically, in this example, the movable core is formed over the entire surface of the oscillator. In the positional relationship between the movable core and the fixed core as in the basic mode of the present invention, the electromagnetic force of the fixed core is also applied to the movable core opposite to the fixed core with respect to a torsion axis. Force acts. For this reason, a torque that is opposite to the torque generated in the movable core on the same side as the fixed core with respect to the torsion shaft (that is, the torque that drives the oscillator in a desired direction) is generated.

Therefore, by employing a configuration as in this embodiment in which the movable core is formed only near the fixed core constituting the serial magnetic circuit, the generated force can be effectively used for driving the oscillator. This makes it possible to configure an actuator or the like that can perform the operation.

Further, when the oscillator is driven, the movable core receives alternating magnetization by the fixed core, causing hysteresis loss and eddy current loss (so-called iron loss). Since these losses are completely unnecessary losses, the efficiency of the actuator or the like is reduced. The movable core of the present embodiment in which the movable core is formed only in the vicinity of the fixed core has a small amount of alternating magnetization, so that these losses can be reduced, and a high-efficiency, power-saving electromagnetic actuator or the like can be used. Configurable.

At the same time, these losses generate heat and cause the movable core and the oscillating body to be deformed by heat. In particular, when the movable core is formed over the entire surface of the oscillator, a larger deformation stress is applied to the oscillator due to a difference in the coefficient of thermal expansion between the movable core and the oscillator. On the other hand, in the present embodiment, since the location where the movable core is formed is a part of the oscillator, heat generation hardly occurs, and the area of the interface between the movable core and the oscillator having different thermal expansions is small. Deformation of the oscillating body can be suppressed. Furthermore, compared to the case where the movable core is formed over the entire surface of the oscillating body, in this embodiment, since the portion where the movable core is formed is a part of the oscillating body, the moment of inertia of the oscillating body can be made relatively small and high-speed driving can be achieved. It will be easier.

[0031] One or more fixed cores around which the coil is wound are disposed on both sides of the oscillating body with the rotation center axis of the torsion spring interposed therebetween, and the movable cores formed on the oscillating body are each provided. It is also possible to form a series magnetic circuit with the core. As in this embodiment, by arranging at least one coil and a fixed core with respect to one oscillator with a rotation center axis of the torsion spring therebetween (two or more in total), each is formed on the oscillator. By forming a series magnetic circuit with the movable core and alternately energizing the coil, even when driving the oscillator at a frequency other than the resonance frequency, it is possible to efficiently perform light deflection or the like without impairing the scanning angle. It becomes possible.

One or more fixed cores around which the coil is circulated are disposed on one of the two sides of the oscillating body with respect to the center axis of rotation of the torsion spring, and are formed on the oscillating body. Further, a series magnetic circuit can be formed with the movable core. As in this embodiment, at least one coil and one fixed core are arranged on one side of the oscillator with a rotation center axis of the torsion spring separated from one oscillator, and formed on the oscillator. By forming a series magnetic circuit with the movable core, the moment of inertia of the movable core required for driving can be reduced. Further, since the area occupied by the coil and the fixed core can be reduced, the entire device can be reduced in size.

[0033] A total of four fixed cores, each of which has the coil wound therearound, are arranged on each of the two sides of the rocking body with respect to the center axis of rotation of the torsion spring. A serial magnetic circuit can be formed with the movable core thus formed. As in this embodiment, the coil and the fixed core are
One rocking body is separated by the rotation center axis of the torsion spring.
By placing a total of four each, and forming a serial magnetic circuit with the movable core formed on each oscillator, one each across the rotation center axis of the torsion spring, a total of two, With the same number of winding coils, the area occupied by the fixed core can be reduced, and the entire oscillator device can be further reduced in size. Also, in particular,
In the case of four arrangements, one direction of driving during two-dimensional swing can be effectively assigned to each.

The elastic supporting portion is constituted by four springs capable of torsional vibration and bending vibration. The two central axes of the torsional vibration each constituted by a pair of springs are orthogonal to each other, and the oscillating body is formed two-dimensionally. The movable core is elastically supported to be twistable, and four movable cores are formed so as to intersect with each other in a cross shape at a 45-degree offset from the direction in which the spring is formed in the plane of the oscillating body. Four opposedly arranged to form a serial magnetic circuit with the movable core formed on the moving body,
By energizing any one of the coils, the oscillator can swing in one direction, and the coil can be selectively used to perform two-dimensional swing of the oscillator. As in this embodiment, the elastic support portion is formed of a spring capable of torsional vibration and bending vibration, and elastically supports the oscillator in a two-dimensional torsional direction such that the central axes of the torsional vibration are orthogonal to each other,
The movable core is configured to intersect the configuration direction of the elastic support portion in a cross shape in the plane of the substrate, and the coil and the fixed core are arranged to face the movable core formed on the oscillator so as to form a serial magnetic circuit. Thus, an optical deflector or the like capable of two-dimensional deflection can be realized by one element.

The fixed core around which the coil is wound is formed on a second substrate different from the supporting substrate, and the supporting substrate and the second substrate are joined in a predetermined relationship via a spacer substrate. The movable core and the fixed core may be arranged so as to form a serial magnetic circuit through an air gap. As in this embodiment, using a semiconductor manufacturing technology, an oscillator having a light deflector, an elastic support portion, and a movable core are integrally formed on the same substrate, and the coil and the fixed core are formed on another second substrate. By integrally forming them and combining them via a spacer substrate having an appropriate alignment mechanism, the gap between the movable core and the fixed core is controlled to be narrow with high precision, and the optical deflector of the present invention is used. The oscillator device can be reduced in size and the generated force can be increased.

The elastic support may be made of single-crystal silicon. Single crystal silicon is a material that is readily available and has excellent mechanical properties (ie, is relatively lightweight but has excellent physical strength, durability, and longevity). Since the elastic support portion is made of single-crystal silicon as in this embodiment, the damping coefficient of the elastic support portion is reduced, so that a large Q value can be obtained when used for resonance. Further, fatigue destruction due to repeated deformation does not occur unlike a metal material, so that a long-life optical deflector or the like can be configured.

[0037] The movable core may be made of an alloy containing iron-nickel. In this embodiment, the movable core and the fixed core can be formed of a magnetic material having a large saturation magnetic flux density, a small residual magnetic flux, and a small loss, and have an almost ideal magnetic circuit configuration, and an oscillator such as an optical deflector of the present invention. The device can be made highly efficient.

In the oscillator device according to the present invention, the oscillator is one, and the oscillator is elastically moved substantially around the straight line with respect to the support substrate by a pair of torsion springs extending along a straight line. It can take a form supported by swinging freedom. The plurality of oscillators are arranged in a nested manner, and each of the oscillators is resilient with respect to the oscillator on the outside or the substrate by a pair of torsion springs extending along each straight line. It is also possible to adopt a form in which it is swingably supported substantially around each straight line. If necessary, a form in which three or more rockers are nested can be realized. The angle formed by the straight lines is typically 90 degrees, but may be any angle other than 90 degrees if necessary.

Typically, the oscillator has a deflector,
It is configured as a light deflection device. This deflector may be a reflection surface that reflects light or a diffraction grating. By using the light deflector as the reflection surface, an optical deflector or the like that can be easily manufactured and has a small mass of the movable part can be realized. In addition, when the light deflector is a diffraction grating, incident light can be deflected as a plurality of beams.

The oscillating device may be configured as an oscillating device actuator, or may be configured as a physical quantity sensor having displacement detecting means for detecting a relative displacement between the substrate and the oscillating device. A conventionally known displacement detecting means can be used.

Further, the image display apparatus of the present invention that achieves the above object has a light source (such as a modulatable semiconductor laser) and at least one optical deflector for deflecting light emitted from the light source. And a lens that projects at least a part of light deflected by the optical deflector or the optical deflector group. The modulation of the light source and the operation of the oscillator of the optical deflector are controlled by control means. By applying the optical deflector of the present invention to an image display device, it is possible to realize a very small and inexpensive image display device as compared with a conventional image display device.

Further, in the method of manufacturing an optical deflector according to the present invention, which achieves the above object, the supporting substrate includes a step of forming the deflector on the supporting substrate, and a step of forming the movable core on the supporting substrate. And the step of forming the elastic support portion and the oscillating body on the support substrate.

The method may further include a step of forming a positioning groove in the support substrate by etching. As described above, the deflector is formed on the support substrate in which the groove is formed in advance by the etching process, the movable core is formed, and finally the oscillator and the elastic support portion are formed, thereby using the micromachining technology. The optical deflector of the present invention can be manufactured, and small and high-precision processing can be performed.

A second substrate having a fixed core around which the coil is wound and having a positioning groove formed therein and a spacer substrate having a positioning groove formed therein are separately manufactured.
An optical deflector can also be manufactured by establishing a predetermined relationship by aligning the respective grooves via a fiber and bonding the support substrate to the second substrate via the spacer substrate.

The step of forming the movable core on the support substrate includes the steps of forming a plating electrode on the support substrate, and providing a photosensitive material on the support substrate provided with the plating electrode. After partially exposing the photosensitive material with high-energy radiation, developing and removing a desired portion using a difference in etching rate between a photosensitive portion and a non-photosensitive portion, and plating and filling the developed and removed portion with a metal Process. As a method of manufacturing the movable core, it is necessary to precisely process a magnetic material on a supporting substrate, and fill a magnetic material by electroplating a template formed of a photosensitive material by lithography on a supporting substrate provided with electrodes, and move the movable core. By forming the movable core, the movable core can be formed with high accuracy and at low cost.

The high-energy radiation light has a wavelength of 400 nm.
The following wavelength light can be used: High energy synchrotron radiation is used at the wavelength of 40
It is preferable to use ultraviolet light of 0 nm or less in terms of lithography equipment, time required for the process, manufacturing cost, and the like. In this case, as a photosensitive material, for example, SU-8 (Micro C
(made by hem) or the like, a template having a thickness of about several hundred μm can be formed. In this case, the movable core can be manufactured at lower cost.

The step of forming the elastic support portion and the oscillator on the support substrate may include a step of forming the elastic support portion and the oscillator by etching the support substrate. As a method of manufacturing the elastic support portion and the oscillator, it is preferable that the elastic support portion be formed of single-crystal silicon as described above, and that the oscillator also be formed of single-crystal silicon because the density of the member is low. . In consideration of a single crystal silicon processing method, a processing method that is smooth and has no burrs is preferable in consideration of breakage. Therefore, it is possible to form a single-crystal silicon structure that is hard to break by etching the support substrate, and it is possible to manufacture the optical deflector of the present invention with an almost ideal processing surface.

The step of forming the elastic support portion and the oscillating body by etching may be a step of etching the support substrate only from the surface on which the movable core is not formed. By performing etching only from the surface where the movable core is not formed, as in this embodiment,
The optical deflector of the present invention can be manufactured without damaging the movable core already formed in the previous process by the etching process.

[0049]

Embodiments of the present invention will be described below with reference to the drawings to clarify the embodiments of the present invention.

Embodiment 1 FIG. 1 shows an optical deflector 1 according to Embodiment 1 of the present invention. FIG. 1 is a top view of the optical deflector 1 of the present embodiment,
FIG. 2 is a sectional view taken along the line AA in FIG. FIG. 3 is a perspective view showing a part.

The configuration of this embodiment will be described. First, the basic configuration of the substrate will be described. The optical deflector 1 has a three-layer structure in which a first support substrate 2 and a second support substrate 4 which are semiconductor substrates are joined to upper and lower surfaces of a spacer substrate 3, as shown in FIG.
This bonding is performed by the fiber 14 in the alignment groove 13C on the second support substrate 4 and the alignment groove 13B of the spacer substrate 3, and the fiber 14 in the alignment groove 13B on the spacer substrate 3 and the first.
The alignment is performed using the alignment groove 13A of the support substrate 2, and the alignment is performed. As shown in FIGS. 1 and 3, a frame-shaped second
A movable plate 5 is elastically torsionally supported by a pair of torsion springs 6 on the support substrate 2. A reflecting surface 8 is provided on one surface of the movable plate 5 and a movable core 7 is provided on the other surface.
A and 7B are formed. The movable plate 5, the reflecting surface 8, the movable cores 7A and 7B, and the torsion spring 6 are all integrally formed by a micromachining technique using a semiconductor manufacturing technique. In particular, movable cores 7A and 7B are torsion springs.
Only the opposite side of the movable plate 5 parallel to the torsion axis 6 is formed in a flat plate shape.

As shown in FIG. 1, two C-shaped fixed cores 10A and 10B are arranged on the second support substrate 4 with the torsion axis of the torsion spring 6 interposed therebetween. The coils 9A and 9B that generate the magnetic flux flowing in the in-plane direction of the substrate are laid. The coils 9A and 9B are connected to a current source (not shown), and the operation of the movable plate 5 is controlled by the current source. The C-shaped fixed cores 10A and 10B and the coils 9A and 9B are also integrally formed on the substrate 4 by micromachining technology.

Next, a method of manufacturing the optical deflector of the present embodiment will be described. In the present embodiment, the first support substrate 2, the spacer substrate 3, and the second support substrate 4 are manufactured by separate processes, and the substrates are joined by performing alignment using the alignment grooves 13A, 13B, and 13C using the fiber 14. The light deflector 1 is configured.

Here, referring to FIG. 4, the movable plate 5, the reflecting surface 8, the movable cores 7A and 7B, which are formed integrally with the first support substrate 2,
A method of manufacturing the torsion spring 6 will be described. 1st support substrate 2
A (100) oriented silicon substrate is used.

First, a mask layer 101 of silicon oxide is formed on both surfaces of the substrate 2 by thermal oxidation. Next, using a photoresist or the like as a mask, the mask layer 101 in a portion where the alignment groove 13A is to be formed is removed by wet etching using buffered hydrofluoric acid. Next, after removing the resist,
Perform silicon anisotropic etching using an aqueous solution of tetramethylammonium hydroxide so that only the portion where the alignment groove 13A is to be formed is exposed to the etching solution,
A V-groove serving as an alignment groove 13A is formed at a predetermined position (FIG. 4A).

After the formation of the alignment grooves 13A, the mask layers 101 on both surfaces of the substrate 2 are removed again using buffered hydrofluoric acid. After an appropriate cleaning step, chromium is deposited as a seed electrode layer 111 for performing electroplating on a surface (hereinafter referred to as a surface) on which the alignment groove 13A is formed, and then copper is deposited. Further, Al is deposited as a reflective film 8 on a surface on which the alignment groove 13A is not formed (hereinafter, referred to as a back surface). Here, a photoresist film 102 is applied for the purpose of patterning the reflection film 8 (FIG. 4B).

Here, the photoresist layer 102 is exposed and developed, and a solution (for example, H ₃ PO ₄ .HNO ₃ .C
Al patterning is performed by wet etching using a mixed solution of H ₃ COOH and H ₂ O). Thus the reflective film 8 on the back
Is formed. At this time, a protective film for protecting the seed electrode layer 111 may be formed on the seed electrode layer 111 in advance. Next, a photoresist layer 112 is applied to the surface. In this example, SU-8 (manufactured by Micro Chem) suitable for thick coating was used. The photoresist layer 112 is exposed, developed, and patterned. The part removed in this step becomes the female mold of the movable cores 7A and 7B (FIG. 4 (c)).

Next, electroplating of the permalloy layer 113 is performed while applying a voltage to the seed electrode layer 111 (FIG. 4).
(D)). After electroplating the permalloy layer 113 to a desired thickness, the photoresist layer 112 on the front surface and the protective film 102 on the back surface are removed, and polyimide is applied as a protective film 122 for protecting the permalloy layer 113. After the formation of the polyimide protective film 122, a photoresist layer 123 serving as a mask for the next process is formed on the back surface.
Is applied. The photoresist layer 123 is exposed and developed, and patterning for forming the movable plate 5 and the torsion spring 6 is performed. Here, ICP-RIE (Inductively coupled pla
The silicon 2 is dry-etched using a sma-reactive ion etching apparatus, and the movable plate 5 and the torsion spring 6 are etched.
Is formed (FIG. 4 (e)).

Finally, the remaining protective film 122, seed electrode layer 111,
The photoresist layers 123 are respectively removed. Thus,
On the first support substrate 2, the movable plate 5, the reflection surface 8, the movable cores 7A and 7B,
The torsion spring 6 and the alignment groove 13A are integrally formed (FIG. 4 (f)).

Next, a method of manufacturing the coils 9A and 9B and the fixed cores 10A and 10B integrally formed on the second support substrate 4 will be described.

In this embodiment, the coils 9A and 9B and the fixed core
10A, 10B, coil bottom wiring 114, coil side wiring 115,
The coils were manufactured by micromachining technology in the order of the coil top wiring 116. Hereinafter, this will be described in more detail with reference to FIG. 5A to 5L, the left and right portions of FIG. 5 are cross-sectional views of BB and CC in FIG. 1, respectively.

As the second support substrate 4, a (100) oriented silicon substrate is used. First, a mask layer 101 of silicon oxide is formed on both surfaces of the second support substrate 4 by thermal oxidation. Using a photoresist or the like as a mask, the mask layer 101 in a portion where the alignment groove 13C is to be formed is removed by wet etching using buffered hydrofluoric acid. Next, silicon anisotropic etching using an aqueous solution of tetramethylammonium hydroxide is performed to form alignment grooves at predetermined positions.
A V-shaped groove 13C is formed (FIG. 5A).

After the formation of the alignment grooves 13C, the mask layers 101 on both surfaces of the substrate 4 are removed again using buffered hydrofluoric acid. Then, as the coil lower surface wiring 114, copper is deposited by vapor deposition and patterned (FIG. 5B). Next, polyimide is applied and patterned as the lower wiring-core insulating layer 117 (FIG. 5C).

Next, a seed electrode layer 11 for performing electroplating
As shown in Fig. 1, chromium is deposited and then gold is deposited (Fig. 5
(D)). Next, a photoresist layer 112 is applied. In this example, SU-8 (manufactured by Micro Chem) suitable for thick coating was used (FIG. 5 (e)).

Next, the photoresist layer 112 is exposed, developed, and patterned. The portion removed in this step becomes the female mold of the fixed cores 10A and 10B and the coil side wiring 115 (FIG. 5 (f)). Next, electroplating of the permalloy layer 113 is performed while applying a voltage to the seed electrode layer 111 (FIG. 5).
(G)).

Next, the photoresist layer 112 and the seed electrode layer 111
Is removed by dry etching (FIG. 5 (h)). Next, an epoxy resin 119 is applied, and the upper surface is mechanically polished and flattened (FIG. 5 (i)).

Next, polyimide is applied to the upper surface of the fixed core 10A as the upper surface wiring-core insulating layer 118, and is patterned (FIG. 5 (j)). Next, the upper surface wiring-core insulating layer 11
Copper is vapor-deposited on the upper surface of 8 as the coil upper surface wiring 116, and is patterned (FIG. 5 (k)).

Finally, the epoxy resin 119 is removed (FIG. 5).
(L)). As described above, the alignment groove 13C, the coils 9A and 9B, and the fixed cores 10A and 10B are integrally formed on the second support substrate 4.

Next, a method of manufacturing the spacer substrate 3 will be described with reference to FIG. As the spacer substrate 3, a (100) oriented silicon substrate is used. First, a mask layer 101 of silicon oxide is formed on both surfaces of the spacer substrate 3 by thermal oxidation. Using a photoresist or the like as a mask, the mask layer 101 in a portion where the alignment groove 13B is to be formed is removed by wet etching using buffered hydrofluoric acid. Substrate 3 as well
The above-described photoresist process and etching process are repeated on the other side of the process.

Next, silicon anisotropic etching using an aqueous solution of tetramethylammonium hydroxide is performed to form V-grooves 13B serving as alignment grooves at predetermined positions (FIG.
6 (a)). After the formation of the alignment grooves 13B, the mask layers 101 on both surfaces of the substrate 3 are removed again using buffered hydrofluoric acid.

A photoresist is applied to one of the surfaces of the substrate 3 as a photoresist layer 102 serving as a mask in the next step, and the photoresist is exposed and developed (FIG. 6B).

After the exposure and development, dry etching of silicon is performed using an ICP-RIE apparatus to form through holes as shown in FIG.

As described above, the alignment groove 13B and the through hole are formed in the spacer substrate 3.

Subsequently, the first support substrate 2, the second support substrate 4, and the spacer substrate 3 are joined. For these bondings, first, after placing the fiber 14 in the alignment groove 13C of the second support substrate 4, the spacer substrate 3 was disposed so that the alignment groove 13B of the spacer substrate 3 coincided with the fiber 14, and the fiber 14 was placed. This was performed by putting an adhesive in the alignment groove and curing the adhesive. Similarly, the fiber 14 is installed in the alignment groove 13B on the upper surface of the spacer substrate 3, and the first support substrate 2
The first support substrate 2 is arranged and bonded so that the alignment grooves 13A of the first substrate 2 coincide with each other. Thereby, the first support substrate 2 and the second support substrate 4 are joined to the upper and lower surfaces of the spacer substrate 3 with predetermined alignment accuracy, and the optical deflector of the present embodiment having a three-layer structure can be obtained. .

The operating principle of the optical deflector of this embodiment having the C-shaped fixed core configured as described above will be described.

The pivoting vibration of the movable plate 5 of the optical deflector of this embodiment is performed by magnetically attracting the movable cores 7A and 7B, and the reflecting surface 8 formed on the movable plate 5 is continuously rotated. The light incident here is deflected by
Can be scanned.

The details will be described below. In the present specification, the “C-shaped fixed core” is a fixed core in which the shape of the fixed core 10A is configured such that both end surfaces thereof face each other as shown in FIG.

The principle of operation will be described with reference to FIG. 3, which illustrates the situation of only one side (movable core 7A, coil 9A and fixed core 10A) from the central axis of torsion spring 6.

When a current flows from the current source to the coil 9A, a magnetic flux is generated in the fixed core 10A in the direction of the arrow. The magnetic flux circulates around the magnetic circuit in the direction indicated by the arrow Φ in the order of the fixed core 10A, the air gap 12B, the movable core 7A, the air gap 12A, and the fixed core 10A, and the movable core 7A overlaps with the fixed core 10A. x
, That is, in the normal direction F of the movable plate 5.

Here, the permeance P _g (x) of the gap between the movable core 7A and the fixed core 10A is P _g (x) = μ ₀ w {(t− (x + x ₀ )) / (R + 2δ) ) + (x + x ₀ ) / 2δ} (1) Here, μ ₀ is the magnetic permeability of vacuum, δ is the distance of the air gap, t is the thickness of the fixed core (length in the F direction), R is the thickness of the movable core, and w is the width of the movable core (in the direction Φ). Length), x is the displacement of the movable core, and x ₀ is the overlap length in the initial state.

Assuming that the permeance other than the air gap forming the magnetic circuit is P, the potential energy W of the entire magnetic circuit is W = 1/2 · (1 / P + 1 / P _g ) ⁻¹ (Ni) ² (2 ). Here, N is the number of turns of the coil 9A, and i is the current flowing through the coil 9A.

A magnetic material having a sufficiently high relative magnetic permeability and a movable core
A When 7A and fixed core 10A are configured, P _gP is almost infinite compared to
Can be regarded as large. Therefore, it occurs in the gap
The generated force F is: F = -dW / dx = -μ₀w / 2 ・ {1 / (2δ) -1 / (R + 2δ)} (Ni)^Two (3) given by Thereby, the C-shaped fixed core of the present invention is arranged.
In the optical deflector, the generated force F is determined by the number of coil turns N and the current i
You can see that it is proportional to the square of

As shown in FIG. 3, since the movable core 7A is configured at a position having a moment arm in the movable plate 5, the generated force F generates a torque to rotate the movable plate 5.

On the other hand, when the movable plate 5 rotates, the torsion spring 6 is twisted, and the torsion spring 6
The relationship between the spring reaction force F ′ and the displacement angle の of the movable plate 5 is given by ψ = ((F ′ · L) · l) / (2 · G · I _p ) (4) Where G is the transverse elastic modulus, L is the distance from the central axis of the torsion spring to the point of force, l is the length of the torsion spring, I _p
Is the second pole moment of area. Then, the movable plate 5 rotates to a position where the generated force F and the spring reaction force F 'are balanced. Therefore, if F in Equation (3) is substituted for F 'in Equation (4), it can be seen that the displacement angle の of the movable plate 5 is proportional to the square of the current i flowing through the coil 9A.

Thus, by controlling the current flowing through the coil 9A, the displacement angle の of the movable plate 5 can be controlled, so that the reflection direction of the light incident on the reflection surface 8 can be freely controlled, and the continuous repetitive operation can be performed. For example, optical scanning can be performed.

Incidentally, the optical deflector of this embodiment has a reflecting surface.
8 is configured as a size of 1 mm x 1 mm. The maximum deflection angle of the light is about 35 degrees, and the resonance frequency of the deflector is about 22 kHz. In the above description, the movable plate 5 and the torsion spring 6 are formed by performing dry etching of silicon using an ICP-RIE apparatus.
By anisotropic etching using an alkaline solution such as OH
It is also possible to have a trapezoidal cross section surrounded by the (100) plane and the (111) plane. Here, for example, the upper base (short side is the upper base)
Is 20 μm, and the length of one side of the elastic support portion 6 is 5000 μm.

In the above manufacturing method, the thickness of the movable plate 5 and the elastic support portion 6 is 200 μm of the thickness of the first support substrate 2. By digging down by anisotropic etching, it is possible to make the thickness of the elastic support portion 6 thinner. In that case, the length of the elastic support portion 6 can be set shorter.

Further, the first support substrate 2 is a (110) oriented silicon substrate, and the cross-sectional shape of the elastic support portion 6 is anisotropically etched to form a rectangular shape surrounded by the (110) plane and the (111) plane. It can also be shaped. In this case, the thickness of the movable plate 5 and the elastic support portion 6 is 200 μm of the thickness of the first support substrate 2, for example, the length of the elastic support portion 6 is set to 3100 μm, the width is set to 75 μm, and the same as above. The optical deflector of this embodiment having the maximum deflection angle and the resonance frequency can be obtained.

In any of the embodiments described below, the optical deflector of each embodiment can be configured to have the same size as this embodiment.

By employing the structure of this embodiment, it is not necessary to provide electric wiring to the movable part, and the movable cores 7A and 7B are effectively installed only in the part where the moment arm is maximum, thereby generating torque. The movable part can be configured to be lightweight. Further, by arranging the four C-shaped fixed cores 10A and 10B, the area occupied by the coil is reduced, and a magnetic circuit configuration with less leakage magnetic flux is provided. Therefore, the optical deflector of the present embodiment can realize a small and highly durable optical deflector.

In FIG. 1, the coils 9A and 9B and the C-shaped fixed cores 10A and 10B are arranged two each with the torsion spring 6 interposed therebetween, for a total of four. An optical deflector that performs the same operation can be configured even if two devices are arranged, one each in between.

Although the reflecting surface 8 is used as the light deflecting element in FIG. 1, the reflecting surface 8 may be a reflection type diffraction grating.
An optical deflector that performs the same operation by the rotational vibration of the optical deflector can be configured. In this case, since the deflecting light becomes diffracted light with respect to the incident light, a plurality of deflecting lights can be obtained by one beam.
In the following embodiments, particularly, the case where the light deflecting element is the reflection surface 8 is described. However, in these embodiments, an optical deflector can be configured by replacing the reflection type diffraction grating.

(Embodiment 2) FIGS. 7 and 8 are schematic views illustrating an optical deflector 21 according to Embodiment 2 of the present invention. FIG. 7 is a top view of the optical deflector of the present embodiment, and FIG. 8 is a cross-sectional view taken along the line BB of FIG.

This optical deflector 21 is also a first substrate which is a semiconductor substrate.
Support substrate 2 and second support substrate 4 on the upper and lower surfaces of spacer substrate 3,
Alignment is performed via the alignment grooves 13A, 13B, and 13C, and a three-layer structure is formed.

As shown in FIG. 7, the optical deflector 21 of this embodiment
The first support substrate 2 is provided with a movable plate 5, a reflection surface 8 on one surface of the movable plate 5, and movable cores 7A and 7B on the other surface. Further, a torsion spring 6 for elastically supporting the movable plate 5 to be able to torsionally vibrate is provided, and the movable plate 5, the reflection surface 8, the movable cores 7A and 7B, and the torsion spring 6
Are formed integrally by micromachining technology applying semiconductor manufacturing technology. Especially movable core 7
A and 7B are formed in a flat plate only on the opposite side of the movable plate 5 parallel to the torsion axis of the torsion spring 6.

As shown in FIG. 7, a pair of U-shaped fixed cores 10A and 10B are provided on the second support substrate 4 with the torsion axis of the torsion spring 6 interposed therebetween. Differently, coils 9A and 9B for generating magnetic flux flowing in the in-plane direction of the substrate when energized are provided therearound. Coil 9A,
9B is connected to a current source, and controls the operation of the movable plate 5 by the current source. U-shaped fixed cores 10A, 10B and coil 9
A and 9B are both integrally formed on the substrate 4 by micromachining technology.

The basic configuration of the optical deflector 21 of this embodiment is the same as that of the first embodiment except for the shape of the fixed core 10A, and can be manufactured by the same manufacturing method as that of the first embodiment. In the optical deflector of the present embodiment configured as described above, since the fixed cores 10A and 10B are formed in a U-shape, the movable plate 5 and the fixed cores 10A and 10B interfere in the swing direction. It is not configured. Therefore, an optical deflector having a large deflection angle can be easily realized.

The operating principle of the optical deflector of this embodiment having the U-shaped fixed core configured as described above will be described with reference to FIG. FIG. 9 illustrates the situation of only one side (the movable core 7A, the coil 9A, and the fixed core 10A) from the center axis of the torsion spring 6, and illustrates the operation principle of the optical deflector having the U-shaped fixed core. FIG. In the present specification, the “U-shaped fixed core” is a fixed core in which the shape of the fixed core 10A is configured such that both end surfaces are in the same plane as shown in FIG.

When a current flows from a current source (not shown) to the coil 9A, a magnetic flux is generated in the coil 9A. This magnetic flux flows in the direction indicated by the arrow Φ in the fixed core 10A, the air gap 12A, and the movable core 7A.
A, the air gap 12B, and the fixed core 10A go around the magnetic circuit in this order, and the movable core 7A is drawn in the direction of increasing the amount of overlap x with the fixed core 10A, that is, in the substrate normal direction F.

Here, the permeance P _g (x) of the gap between the movable core 7A and the fixed core 10A is given by P _g = μ ₀ w · (x + x ₀ ) / (2δ) (5) Here, μ ₀ is the magnetic permeability of vacuum, δ is the distance of the air gap, w is the width of the fixed core, x is the displacement of the movable core, and x ₀ is the overlap length in the initial state.

Assuming that the permeance of the magnetic circuit other than the air gap is P, the potential energy W of the entire magnetic circuit is W = 1/2 · (1 / P + 1 / P _g ) ⁻¹ · (Ni) ² ( 6) given by Here, N is the number of turns of the coil 9A, and i is the current flowing through the coil 9A.

A magnetic material having a sufficiently large relative magnetic permeability and a movable core
A When 7A and fixed core 10A are configured, P _gP is almost infinite compared to
Can be regarded as large. Therefore, it occurs in the gap
The generated force F is: F = -dW / dx = -μ₀w / (2δ) ・ (Ni)^Two (7) given by Thereby, the U-shaped fixed core of the present invention is arranged.
Generated optical deflector, the generated force F is the number of coil turns N and the current i
You can see that it is proportional to the square of

As shown in FIG. 9, the movable core 7A is configured at a position having a moment arm in the movable plate 5, and thus the generated force F generates a torque that rotates the movable plate 5.

On the other hand, when the movable plate 5 rotates, the torsion spring 6 is twisted, and the torsion spring 6 generated by this is twisted.
The relationship between the spring reaction force F ′ and the displacement angle の of the movable plate 5 is given by ψ = ((F ′ · L) · l) / (2 · G · I _p ) (8) Where G is the transverse elastic modulus, L is the distance from the central axis of the torsion spring to the point of force, l is the length of the torsion spring, I _p
Is the second pole moment of area. Then, the movable plate 5 rotates to a position where the generated force F and the spring reaction force F 'are balanced. Therefore, if F in Equation (7) is substituted for F 'in Equation (8), it can be seen that the displacement angle ψ of the movable plate 5 is proportional to the square of the current i flowing through the coil 9A.

Thus, also in this case, since the displacement angle の of the movable plate 5 can be controlled by controlling the current flowing through the coil 9A, the direction of reflection of the light incident on the reflecting surface 8 can be freely controlled, and it can be continuously repeated. If operated, optical scanning can be performed.

(Embodiment 3) FIGS. 10 and 11 (sectional views taken along the line BB in FIG. 10) are schematic views illustrating an optical deflector 31 according to Embodiment 3 of the present invention.

The optical deflector 31 has the same substrate configuration as that of the first embodiment of the present invention, and includes a first support substrate 2, a spacer substrate 3,
The second support substrates 4 are integrally formed using a micromachining technique. In this embodiment and the first embodiment,
Only the relationship between the rotation direction of the torsion spring 6 and the position where the movable cores 7A and 7B are formed is different. As shown in FIG. 10, in the optical deflector 31 of the present embodiment, movable cores 7A and 7B are formed on opposite sides of the movable plate 5 perpendicular to the torsion axis of the torsion spring 6.

Therefore, the optical deflector 31 of this embodiment can be manufactured by the same manufacturing method as in the first embodiment.

The optical deflector 31 of the present embodiment configured as described above has a configuration in which the movable cores 7A and 7B and the fixed cores 10A and 10B do not interfere in the swing direction. Therefore, an optical deflector having a large deflection angle can be easily realized. The principle of operation is basically the same as that of the above-described embodiment. 5 is driven.

In FIG. 10, the coils 9A and 9B and the C-shaped fixed cores 10A and 10B are arranged two each with the torsion axis of the torsion spring 6 interposed therebetween, for a total of four. Thus, an optical deflector that performs the same operation can be configured even when two devices are arranged, one each. Also, an optical deflector that performs the same operation can be configured by arranging two fixed cores 10A or 10B only on one side of the torsion axis.

(Embodiment 4) FIG. 12 is a schematic diagram illustrating an optical deflector 41 according to Embodiment 4 of the present invention.

This optical deflector 41 is used in the first and third embodiments of the present invention.
1st support substrate 2, spacer substrate
3, the second support substrate 4 uses micromachining technology,
Each is integrally formed. This embodiment is different from the third embodiment only in the shape of the movable plate 5 and the position where the movable cores 7A and 7B are formed. As shown in FIG. 12, the optical deflector of the present embodiment
In 41, the movable plate 5 is processed into a shape having a projection extending in a direction perpendicular to the torsion axis of the torsion spring 6 from the periphery of the reflection surface 8 formed in a substantially square shape, and only the projection portion is provided. The movable cores 7A and 7B are manufactured.

Therefore, the fabrication of the optical deflector 41 of this embodiment can be performed in the same manner as in the first and third embodiments. The operating principle is also basically the same as that of the above-described embodiment, and a force is generated in a direction in which the overlapping area of the facing surfaces of the movable cores 7A and 7B and the fixed core 10A or 10B where the magnetic flux is generated increases, and the movable plate is generated. 5 is driven.

The optical deflector 41 of the present embodiment configured as described above has substantially the same effect as that of the third embodiment, and the movable cores 7A and 7B are formed in a projecting shape, so that the moment arm is formed. Larger torque can be generated.

In FIG. 12, the coils 9A and 9B and the C-shaped fixed cores 10A and 10B are arranged two each with the torsion axis of the torsion spring 6 interposed therebetween, for a total of four. An optical deflector that performs the same operation can be configured even if two devices are arranged, one each in between. Also, an optical deflector that performs the same operation can be configured by arranging two fixed cores 10A or 10B only on one side of the torsion axis.

(Embodiment 5) FIGS. 13 and 14 show Embodiment 5 of the present invention.
FIG. 5 is a top view and a BB cross-sectional view illustrating the optical deflector 51 of FIG.

The optical deflector 51 has the same substrate configuration as that of the second embodiment of the present invention, and includes a first support substrate 2, a spacer substrate 3,
The second support substrates 4 are integrally formed using a micromachining technique. As shown in FIG. 13, in the optical deflector 51 of this embodiment, the movable core 7 is attached to one of the opposite sides of the movable plate 5 parallel to the torsion axis of the torsion spring 6 on the first support substrate 2.
A is provided. On the second support substrate 4, one U-shaped fixed core 10A and a coil 9A that generates a magnetic flux flowing in the in-plane direction of the substrate around the fixed core 10A are installed so as to form a series magnetic circuit with the movable core 7A. Have been.

The coil 9A is connected to a current source (not shown), and controls the operation of the movable plate 5 by the current source. The present embodiment and the second embodiment are different only in the number of movable cores, fixed cores, and coils constituting the magnetic circuit. Therefore, the fabrication of the optical deflector 51 of the present embodiment is
It can be performed in the same manner as in 2.

The operation principle is the same as that of the second embodiment. In the optical deflector 51 of the present embodiment configured as described above, since the movable core 7A is formed only on one side of the movable plate 5, the moment of inertia of the movable portion can be reduced, and the This is a very advantageous configuration when configuring a deflector.

Furthermore, since only one movable core 7A and one fixed core 10A constituting a magnetic circuit are required, the size of the entire device can be reduced.

The same effect can be obtained even if the fixed core 10A of the present embodiment is formed in a C-shape and the movable core 7A and the magnetic circuit are configured as in the embodiment 1 described above.

Embodiment 6 FIG. 15 is a schematic diagram illustrating an optical deflector 61 according to Embodiment 6 of the present invention. FIG. 15 is a top view of the optical deflector 61 of the present embodiment.

The optical deflector 61 has the same substrate configuration as that of the first embodiment of the present invention, and includes a first support substrate 2, a spacer substrate 3,
The second support substrates 4 are integrally formed using a micromachining technique. In this embodiment and the first embodiment,
The rotation direction of the torsion spring 6 and the relationship between the rotation direction of the torsion spring 6 and the formation positions of the movable cores 7A, 7B, 7C, 7D are different. In the optical deflector 61 of the present embodiment, a torsion spring
Reference numeral 6 denotes a torsion vibration and bending vibration spring. It has a supporting structure.

The four movable cores 7A, 7B, 7C, 7D are formed along the diagonal line of the movable plate 5 perpendicular to the cross shape at a 45 ° offset from the direction of formation of the four torsion springs 6 in the plane of the substrate, For these movable cores 7A, 7B, 7C, and 7D, as shown in FIG. 15, a C-shaped fixed core 1 wound with coils 9A, 9B, 9C, and 9D.
Four pairs of 0A, 10B, 10C, and 10D are opposed to each other with a gap therebetween.

The optical deflector 61 of this embodiment can be manufactured by the same manufacturing method as in the first embodiment.

In the optical deflector 61 of the present embodiment configured as described above, by energizing any one of the coils 9A, 9B, 9C and 9D, the movable core 7A is viewed from the top view of FIG. -7C
The movable plate 5 can be swung in one direction with the direction or the 7B-7D direction as the central axis of the torsion, and light deflection can be performed two-dimensionally using these four coils. In addition, driving (so-called servo lock) for holding the position of the movable plate 5 can also be performed.

(Embodiment 7) In the embodiments described so far, the movable core is made of a soft magnetic material. In the seventh embodiment, the movable core is made of a hard magnetic material. FIG. 16 is a perspective view illustrating a micro optical deflector according to a seventh embodiment of the present invention. Figures 17 and 18
Are a top view and a side view, respectively. In FIG. 18,
For the sake of clarity, a part of the silicon single crystal thin plate 320 is cut away, and a cross section of the torsion spring 328 at a cutting line 306 in FIG. 16 is shown.

In the micro optical deflector of this embodiment, the torsion springs 328 and 329 and the mirror 33 are attached to the silicon single crystal thin plate 320 by bulk micromachining technology.
0 is integrally formed. A movable core 341 made of a magnetized hard magnetic material is fixed to an end of the mirror 330. The sectional shape of the torsion springs 328 and 329 is H
It is shaped like a letter. This means that the four interior angles are 270 °,
It is a dodecagon having eight interior angles of 90 °, which is a rotationally symmetric shape. And it is comprised by the combination of a substantially flat shape part, and this flat shape part is arrange | positioned so that the direction which most easily bends may cross | intersect (90 degrees). Movable core 341
The magnetized form is that one of both ends in the direction of elongation is N pole,
The other is an S pole. Accordingly, when the both ends of the fixed core 342, which is an electromagnet, become the N pole and the S pole, or the S pole and the N pole, both ends of the movable core 341 receive an attractive force or a repulsive force from the fixed core 342. In addition, the mirror 330 is conveniently rocked about the torsion axis of the torsion springs 328,329.

The mirror 330 has a surface coated with a substance having a high light reflectance, and the torsion spring 32 is provided.
8, 329, it is swingably supported around its long axis, the torsion axis.

On the glass substrate 340, a fixed core 342 is arranged, and a coil 345 circulates around the fixed core 342. Then, the silicon single crystal thin plate 320 and the glass substrate 340
The surfaces of the movable core 341 and the fixed core 342 that are substantially parallel to each other are joined so as to keep a predetermined interval. That is, when the mirror 330 oscillates, the overlapping area changes while the opposing surfaces remain substantially parallel.

The operation of the optical deflector of this embodiment will be described with reference to FIG. When the coil 345 is energized, the fixed core 3
42 is excited. FIG. 19 illustrates a state where the near side of the fixed core 342 in the figure is excited to the N pole and the far side is excited to the S pole. Then, the movable core 341 is attracted in the direction of the arrow in FIG. 19, assuming that the near side is excited to the S pole and the far side is excited to the N pole. As shown in FIG. 18, the movable core 341 and the fixed core 342 are arranged at different heights when no power is supplied so that the overlapping area of the opposing surfaces can be increased. A counterclockwise turning moment occurs. If the fixed core 342 is excited in reverse,
This reverse rotational moment occurs. When energization of the coil 345 is turned on / off in accordance with the resonance frequency of the mirror 330, the mirror 330 resonates around the torsion springs 328 and 329. In this state, light rays can enter the mirror 330 to perform light scanning.

Next, a method of manufacturing the present optical deflector will be described.
First, a method for processing the silicon single crystal thin plate 320 will be described with reference to FIG. The left side in the figure is a cross-sectional view taken along the section line 306 in FIG. 16, and the right side is a cross-sectional view taken along the section line 309.

1. First, a seed electrode layer 360 is formed on one surface of a silicon single crystal thin plate 320. (A). 2. On the seed electrode layer 360, a thick resist layer 361 (for example,
SU-8) manufactured by MicroChem is formed into a film, and patterning for forming the movable core 341 is performed by photolithography (b). 3. The hard magnetic layer 362 is formed on the seed electrode layer 360 by electrolytic plating (c).

4. The thick resist layer 361 and the seed electrode layer 360 are removed (d). The seed electrode layer 360 below the hard magnetic layer 362 remains as it is. 5. A mask layer 350 (for example, a resist or the like) is formed on both surfaces of the silicon single crystal thin plate 320, and patterning for forming the single crystal thin plate 320 shown in FIG. 16 is performed by photolithography (e). 6. Using an etching method such as ICP-RIE, vertical etching is performed from both surfaces to a certain depth (f). This depth defines the thickness of the central bridge portion of the torsion springs 328 and 329 having an H-shaped cross section. Double the depth is the thickness of the bridge. 7. The mask layer 350 is removed, a new mask layer 351 is formed,
And patterning (g).

8. Vertical etching is performed from the lower surface by using an etching method such as ICP-RIE. The etching is performed until the deepest portion reaches the center of the silicon single crystal thin plate 320 (h).

9. Further, vertical etching is performed from the upper surface by using an etching method such as ICP-RIE. The etching is performed until the deepest portion penetrates the silicon single crystal thin plate 320 (i). In the portion of the torsion springs 328, 329, the H-shaped torsion springs 328, 329 stop at a position where a bridge portion of a predetermined thickness is left. The thickness of the pillars on both sides of the H-shaped torsion springs 328 and 329 (typically equal to the thickness of the bridge) is defined by the width of a pair of stripes on the upper and lower surfaces of the mask layer 351. 10. Finally, the mask layer 351 is removed (j).

Next, a method for processing the glass substrate 340 will be described with reference to FIG. FIG. 21 is a sectional view taken along section line 307 in FIG.

[0138] 1. A seed electrode layer 370 is formed on one side of a glass substrate 340 (a). 2. A thick resist layer 371 is formed on the seed electrode layer 370, and patterning for forming the fixed coil 342 is performed (b). 3. On the seed electrode layer 370, the lower wiring layer 372 of the coil 345 is formed by electrolytic plating (c). 4. The thick resist layer 371 and the seed electrode layer 370 other than the lower wiring layer 372 are removed (d). 5. An insulating layer 373 is formed on the lower wiring layer 372, and patterning for forming the wiring layers 382 and 383 on both sides is performed (e).

6. A seed electrode layer 374 is formed on the insulating layer 373 (f). 7. A thick resist layer 375 is formed on the seed electrode layer 374, and the soft magnetic layer 376 as the fixed core 342 and the wiring layers 382 and 3 on both sides are formed.
Patterning is performed so that 83 can be formed (g). 8. On the portion of the seed electrode layer 374 without the thick film resist layer 375,
The soft magnetic layer 376 and the wiring layers 382 and 383 on both sides are formed by electrolytic plating (h). 9. The thick resist layer 375 and the seed electrode layer 374 are removed (i). 10. An insulating layer 377 is formed again, and patterning for forming the upper wiring layer 380 is performed (j). With this patterning, the insulating layer
377 is removed only at the top of the wiring layers 382 and 383 on both sides.

11. A seed electrode layer 378 is formed on the insulating layer 377 (k). 12. A thick resist layer 379 is formed on the seed electrode layer 378,
Patterning is performed (l). By this patterning, the thick-film resist layer 379 is removed only at locations outside the wiring layers 382 and 383 on both sides. 13. An upper wiring layer 380 is formed on the seed electrode layer 378 by electrolytic plating (m). 14． Finally, the thick resist layer 379 and the seed electrode layer 378 are removed (n).

Finally, a silicon single crystal thin plate 320 and a glass substrate 3 are formed so as to form an optical deflector as shown in FIG.
Join 40. At this point, the movable core 341 is appropriately magnetized as described above.

In this embodiment, a torsion spring having a rotationally symmetric H-shaped cross section is used. However, this is merely an example, and an X-shaped cross section, a V-shaped or an inverted V-shaped cross section (either integral or separated) may be used. Or a separated H-shaped cross-section, a cross-shaped cross-section (may be integrated or separated), or the like. These torsion springs are characterized in that they are easily twisted and hardly bent. In the present embodiment, since the movable portion is less likely to vibrate in the direction perpendicular to the axis of torsion during swinging, an optical deflector with high accuracy and less affected by disturbance can be realized. Since the value is high, the amplitude is large and the energy efficiency is high when the resonance driving is performed.

In the embodiments 1 to 6, the movable core may be made of a hard magnetic material. However, in this case,
It is necessary to determine the magnetizing direction of the movable core according to each mode so that the rocking motion of the rocking body occurs conveniently.

(Embodiment 8) FIG. 22 is a schematic diagram showing a basic configuration of an image display apparatus which is an optical apparatus of Embodiment 8. Figure
In the image display device of No. 22, an optical deflector group 201 in which two optical deflectors shown in the above embodiment are arranged so that the deflection directions are orthogonal to each other is provided, which rasterizes the incident light in the horizontal and vertical directions. Act as a scanning optical scanner device. 202 is a laser light source. 203 is a lens or lens group, 204 is a writing lens or lens group, and 205 is a projection surface. The laser light incident from the laser light source 202 undergoes predetermined intensity modulation related to the timing of optical scanning, and is two-dimensionally scanned by the optical deflector group 201. The scanned laser beam is projected onto a projection surface 205 by a writing lens 204.
An image is formed thereon.

A similar image display device can be configured by replacing the optical deflector group 201 with the optical deflector 61 of the sixth embodiment.

(Embodiment 9) FIG. 23 is a diagram showing a basic configuration of an image display apparatus which is an optical apparatus of Embodiment 9. Figure 23
In the present embodiment, reference numeral 201 denotes the optical deflector shown in the above embodiment, and in this embodiment, it functions as an optical scanner for scanning incident light one-dimensionally. 202 is a laser light source. 203 is a lens or lens group, 204 is a writing lens or lens group, and 206 is a photoconductor. The laser light emitted from the laser light source 202 undergoes predetermined intensity modulation related to the timing of optical scanning, and is scanned one-dimensionally by the optical deflector 201. The scanned laser beam is applied to the writing lens 20.
4 forms an image on the photoconductor 206. Since the photoconductor 206 is rotating, a two-dimensional image is formed on the photoconductor 206.

The photosensitive member 206 is uniformly charged by a charger (not shown), and forms an electrostatic latent image on the portion by irradiating light thereon. Next, it is possible to print by forming a toner image on the image portion of the electrostatic latent image by a developing device (not shown) and transferring and fixing the toner image to, for example, paper.

A similar image display device can be constructed by replacing the optical deflector 201 with the optical deflector 61 of the sixth embodiment. In this case, the photoconductor may be flat and stationary.

[0149]

As described above, the oscillator device such as the optical deflector according to the present invention does not provide the movable portion with the electrical wiring.
Electromagnetic driving can be performed with a simple configuration having excellent durability. In addition, by changing the arrangement of the coil, fixed core, and movable core and the configuration of the elastic support, it is possible to deflect two-dimensionally, and it is possible to perform practical two-dimensional scanning with excellent durability even for driving that requires severe operation. A simple optical deflector can be provided.

[Brief description of the drawings]

FIG. 1 is a top view illustrating an optical deflector according to a first embodiment of the present invention.

FIG. 2 is a sectional view illustrating an optical deflector according to the first embodiment.

FIG. 3 is a schematic perspective view illustrating a driving principle of a mold according to the first embodiment of the optical deflector according to the present invention.

FIG. 4 is a cross-sectional view illustrating a method for manufacturing a first support substrate according to the optical deflector of the first embodiment.

FIG. 5 is a cross-sectional view illustrating a method for manufacturing the second support substrate according to the optical deflector of the first embodiment.

FIG. 6 is a cross-sectional view illustrating a method of manufacturing a spacer substrate according to the optical deflector of the first embodiment.

FIG. 7 is a top view illustrating an optical deflector according to a second embodiment of the present invention.

FIG. 8 is a sectional view illustrating an optical deflector according to a second embodiment.

FIG. 9 is a schematic perspective view illustrating a driving principle of a mold according to a second embodiment of the optical deflector according to the present invention.

FIG. 10 is a top view illustrating an optical deflector according to a third embodiment of the present invention.

FIG. 11 is a sectional view illustrating an optical deflector according to a third embodiment.

FIG. 12 is a top view illustrating an optical deflector according to a fourth embodiment of the present invention.

FIG. 13 is a top view illustrating an optical deflector according to a fifth embodiment of the present invention.

FIG. 14 is a sectional view illustrating an optical deflector according to a fifth embodiment.

FIG. 15 is a top view illustrating a two-dimensional optical deflector according to a sixth embodiment of the present invention.

FIG. 16 is a perspective view illustrating an optical deflector according to a seventh embodiment of the present invention.

FIG. 17 is a top view illustrating an optical deflector according to a seventh embodiment.

FIG. 18 is a partially broken side view illustrating an optical deflector of a seventh embodiment.

FIG. 19 is a diagram illustrating the operation principle of the optical deflector according to the seventh embodiment.

FIG. 20 is a diagram illustrating a process for producing a silicon single crystal thin plate of the optical deflector according to the seventh embodiment.

FIG. 21 is a diagram illustrating a process for manufacturing a fixed core and a coil of the optical deflector according to the seventh embodiment.

FIG. 22 is a conceptual diagram illustrating an image display device according to an eighth embodiment of the present invention.

FIG. 23 is a conceptual diagram of another type of image display device according to the ninth embodiment of the present invention.

24A is a top view illustrating a conventional optical deflector, and FIG. 24B is a perspective view illustrating another conventional optical deflector.

[Explanation of symbols]

1, 21, 31, 41, 51, 61 Optical deflector 2 First support substrate 3 Spacer substrate 4 Second support substrate 5, 330 Movable plate (mirror) 6, 328, 329 Torsion spring (torsion spring) 7A, 7B, 7C, 7D, 341 Movable core 8 Reflective surface 9A, 9B, 9C, 9D, 345 Coil 10A, 10B, 10C, 10D, 342 Fixed core 12A, 12B Gap between movable core and fixed core 13A, 13B, 13C Alignment groove 14 Fiber 101, 350 Mask layer 102, 112, 123 Photoresist layer 111, 360, 370, 374, 378 Electrode layer 113 Permalloy layer 114 Coil bottom wiring 115 Coil side wiring 116 Coil top wiring 117 Bottom wiring-core insulation layer 118 Top wiring-core insulation layer 119 Epoxy resin 122 Protective film 201 Optical deflector group 202 Laser light source 203 Lens 204 Writing lens 205 Projection surface 206 Photoconductor 320 Silicon single crystal thin plate 340 Glass substrate 361, 371, 375, 379 Thick film resist Layer 362, 376 Soft magnetic layer 372 Lower wiring layer 373, 37 7 Insulation layer 380 Upper wiring layer 382,383 Side wiring layer 1001 Galvano mirror 1002 Silicon substrate 1003 Upper glass 1004 Lower glass 1005 Movable plate 1006 Torsion spring 1007 Planar coil 1008 Total reflection mirror 1009 Contact pad 1010A, 1011A, 1010B, 1010C Permanent magnet 2002 Vibrator 2003 Elastic support 2004 Vibration input 2006 Vibration source 2007 Reflective surface 2008 Mirror support 2009 Plate

[Procedure amendment]

[Submission date] January 23, 2002 (2002.1.2
3)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0019

[Correction method] Change

[Correction contents]

On the other hand, when the movable core is formed of a hard magnetic material, the magnetic poles of the hard magnetic material to be magnetized are usually fixed, and the difference between the movable core and the fixed core or The oscillator can be driven by the magnetic force (attraction or repulsion) between the magnetic poles. In this case, by using a hard magnetic material with large holding force and forming a movable core with large magnetization, it is possible to increase the generated force without increasing the number of turns of the coil circling the fixed core and the applied current Becomes For this reason, it is possible to configure a small-sized, power-saving actuator having a large generating force and the like.

 ──────────────────────────────────────────────────続 き Continued on the front page (31) Priority claim number Japanese Patent Application 2001-47300 (P2001-47300) (32) Priority date February 22, 2001 (2001.2.22) (33) Priority claim country Japan (JP) (72) Inventor Futa Hirose 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Takayuki Yagi 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Hidemasa Mizutani 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 2C362 BA18 BA83 2H045 AB16 AB72

Claims (27)

[Claims] An oscillator having a movable core made of a soft magnetic material or a hard magnetic material, a fixed core having a coil wound therearound, and an elastic supporting portion which swingably supports the oscillator with respect to a support substrate. Wherein the movable core and the fixed core are disposed so as to be shifted in a direction perpendicular to a swing direction of the oscillator and to be substantially parallel to each other and have opposed surfaces facing each other via a gap, and An oscillating body device characterized in that the area of an overlapping portion of each of the opposing surfaces as viewed from the vertical direction changes as the oscillating body oscillates. 2. The oscillator device according to claim 1, wherein the movable core and the fixed core around the coil form a series magnetic circuit through the gap. 3. The swing according to claim 1, wherein the fixed core has a shape in which two opposing surfaces opposing each opposing surface of the movable core oppose each other with the movable core interposed therebetween. Moving device. 4. The oscillator device according to claim 1, wherein the fixed core has a shape in which two opposing surfaces opposing the opposing surface of the movable core are in the same plane. 5. The oscillating body according to claim 1, wherein the elastic supporting portion comprises a torsion spring for oscillatingly supporting the oscillating body, and wherein the movable core extends in a direction parallel to a torsion axis direction of the torsion spring. The oscillator device according to claim 3, wherein the oscillator device is formed only on a peripheral portion. 6. An oscillator according to claim 1, wherein said elastic supporting portion is formed of a torsion spring for swingably supporting said oscillator, and wherein said movable core extends in a direction perpendicular to a torsion axis direction of said torsion spring. The oscillator device according to claim 3, wherein the oscillator device is formed only on a peripheral portion. 7. The resilient support portion is constituted by a torsion spring for swingably supporting the oscillator, and the movable core is perpendicular to the torsion axis direction of the torsion spring in the same plane as the oscillator. The oscillating device according to claim 3, wherein the oscillating device is formed in a protruding shape from a peripheral portion of the oscillating member. 8. One or more fixed cores around which the coil is wound are respectively disposed on both sides of the swinging body with respect to the rotation center axis of the torsion spring, and each of the fixed cores is formed on the swinging body. The oscillator device according to any one of claims 5 to 7, wherein a series magnetic circuit is formed with the movable core. 9. One or more fixed cores around which the coil is wound are disposed on one or both sides of a center axis of the torsion spring with respect to the oscillating body. The oscillator device according to any one of claims 5 to 7, wherein a serial magnetic circuit is formed with the formed movable core. 10. A total of four fixed cores, each of which is made to rotate around said coil, are disposed on each side of said oscillating body with respect to a center axis of rotation of said torsion spring. The oscillator device according to any one of claims 5 to 7, wherein a series magnetic circuit is formed with the movable core formed in (1). 11. The resilient support section is composed of four springs capable of torsional vibration and flexural vibration. The two central axes of the torsional vibration composed of a pair of springs are respectively orthogonal to each other to move the oscillator. The movable core is elastically supported so that it can be twisted three-dimensionally, and the movable core is formed so as to intersect in a cross shape with a 45-degree shift in the direction of formation of the spring and in the plane of the oscillating body. Four of the movable cores formed on the oscillator are opposed to each other so as to form a serial magnetic circuit, and when one of the coils is energized, the oscillator is swung in one direction to select the coil. 4. The oscillating device according to claim 3, wherein the oscillating device is used for two-dimensional oscillation. 12. A fixed core around which the coil is wound is formed on a second substrate different from the supporting substrate, and the supporting substrate and the second substrate are joined in a predetermined relationship via a spacer substrate. 12. The oscillator device according to claim 1, wherein the movable core and the fixed core are arranged so as to form a serial magnetic circuit via a gap. 13. The oscillator device according to claim 1, wherein said elastic support portion is made of single-crystal silicon. 14. The oscillator device according to claim 1, wherein said movable core is made of an alloy containing iron-nickel. 15. The swinging body is one, and the swinging body is elastically supported by the pair of torsion springs extending along a straight line with respect to the support substrate so as to freely swing around the straight line. The oscillator device according to any one of claims 1 to 14, wherein: 16. The oscillating body has a deflector and is configured as an optical deflecting device.
6. The oscillator device according to any one of 5. 17. The oscillator device according to claim 16, wherein said deflector is a reflecting surface for reflecting light. 18. An oscillator device according to claim 16, wherein said deflector is a diffraction grating. 19. The oscillator device according to claim 1, wherein the oscillator device is configured as an oscillator actuator. 20. An optical deflector or an optical deflector group having at least one optical deflector according to claim 16 for deflecting light emitted from said light source, and said light. A lens that projects at least a part of the light deflected by the deflector or the group of light deflectors. 21. The method of manufacturing an optical deflector according to claim 16, wherein said supporting substrate has a step of forming said deflector on said supporting substrate, and said movable substrate is provided with said movable member on said supporting substrate. A method for manufacturing an optical deflector, comprising: manufacturing a core; and forming the elastic support portion and the oscillator on the support substrate. 22. The method of manufacturing an optical deflector according to claim 21, further comprising a step of forming a positioning groove in said support substrate by etching. 23. A second substrate having a fixed core around which the coil is wound and having a positioning groove formed therein, and a spacer substrate having a positioning groove formed therein are separately manufactured. 23. The method for manufacturing an optical deflector according to claim 22, wherein a predetermined relationship is established by aligning the grooves, and the supporting substrate is joined to the second substrate via the spacer substrate. 24. The step of forming the movable core on the support substrate includes the steps of: forming a plating electrode on the support substrate; and providing a photosensitive material on the support substrate provided with the plating electrode. After partially exposing the photosensitive material with high-energy radiation, developing and removing a desired portion by using an etching rate difference between a photosensitive portion and a non-photosensitive portion, and plating the developed and removed portion with a metal. 24. The method of manufacturing an optical deflector according to claim 21, comprising a step of filling. 25. The high-energy radiation light has a wavelength of 400 n.
25. A light having a wavelength of not more than m is used.
A manufacturing method of the optical deflector described in the above. 26. The step of forming the elastic support portion and the oscillator on the support substrate includes forming the elastic support portion and the oscillator by etching the support substrate. Item 30. The method for manufacturing an optical deflector according to any one of Items 21 to 25. 27. The method according to claim 26, wherein the step of forming the elastic support portion and the oscillating body by etching is a step of etching the support substrate only from a surface on which the movable core is not formed. Method of manufacturing optical deflector.