JP2002323631A - Method and apparatus for manufacturing microdevice - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and apparatus for manufacturing photonic crystal elements, etc., which are capable of inexpensively manufacturing these elements, etc., and are suitable for mass production. SOLUTION: The optical microdevice has a photonic device layer PDL between a pair of supporting layers SL1 and SL2 . In manufacturing this optical microdevice, a thin film-like resin layer PLL is formed on the lower supporting layer SL1 , then a ruggedness distribution is imparted to the resin layer PLL by press forming to form the device layer PDL and finally the upper supporting layer SL2 is formed on the device layer PDL. In this method, the main body segment of the optical microdevice can be integrally formed. Since press forming is used at this time, a manufacturing cost can be suppressed lower as compared with the case a lithography process is used and the throughput in a manufacturing process can be enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for manufacturing various microdevices including optical microdevices such as photonic crystal elements.

[0002]

2. Description of the Related Art As a method of manufacturing a photonic crystal, for example, a method of manufacturing a two-dimensional photonic crystal by combining EB (electron beam) lithography and dry etching (Toshihiko Baba et al., "Nanofabrication"
of GaInAsP / InP 2-dimensionalphotonic crystals by a
methane-based reactive ion beam etching ", Physica
B, 227, 1996, pp415-418), and three-dimensional photonic crystals manufactured using wafer fusion and optical interference alignment techniques together with lithography techniques (Noda,
"Semiconductor three-dimensional photonic crystal", O plus E, vol.2
1, No.12, p.1539) and one that produces a three-dimensional photonic crystal by stereolithography using an ultrashort pulse laser (Mizawa, "New formation method of three-dimensional organic photonic crystal", O plusE , vol.21, No.12, p.1549).

[0003]

However, since the method uses a lithography process, a large-scale manufacturing system is required, and the manufacturing cost is increased. Also,
The method described above has a problem that it is not suitable for mass production because there is an upper limit on the production throughput since the method is a one-stroke cycle.

Accordingly, an object of the present invention is to provide a method and an apparatus for manufacturing various microdevices such as photonic crystal elements which can be manufactured at low cost and are suitable for mass production.

[0005]

In order to solve the above-mentioned problems, a method for manufacturing a micro device according to the present invention is a method for manufacturing a micro device including a lower support layer and a device layer, wherein the lower support layer Forming a thin film layer made of a constituent material of the device layer thereon; and applying a predetermined three-dimensional shape distribution to the thin film layer by press molding to form the device layer.

In the above method, since a predetermined three-dimensional shape distribution is given to the thin film layer by press molding to form the device layer, a main body portion of a micro device such as an optical integrated circuit can be formed at a time. . In this case, since the press molding is used, the manufacturing cost can be suppressed as compared with the case where the lithography process is used. Also,
Since the press molding is used as described above, the shape can be collectively transferred, and the throughput in the manufacturing process can be increased.

In a specific embodiment of the above method, the thin film layer is a resin layer made of a resin material. In this case, the thin film layer can be easily deformed into an arbitrary shape.

[0008] In another specific embodiment of the above method, the method further comprises forming an upper support layer on the device layer. In this case, the device layer can be protected by upper and lower support layers.

[0009] In yet another specific embodiment of the above method,
The device layer has an interstitial space between the lower support layer and the upper support layer. In this case, not only light but also a specific fluid such as a gas or a liquid can pass through the gap, and an interaction can be generated between such a specific fluid and the microdevice. That is, it is also possible to detect the state of such a specific fluid or to adjust the flow of such a specific fluid.

In yet another specific embodiment of the above method,
The thin film layer has a higher refractive index than the lower support layer and the upper support layer. In this case, light can be confined in the device layer composed of a thin film layer, and an optical element such as an optical waveguide can be formed.

In yet another specific embodiment of the above method,
A region having a periodic structure on the order of wavelength for light guided by the device layer. In this case, since a region having a periodic structure on the order of wavelength can be used as a photonic crystal, a photonic crystal element such as a waveguide can be formed at a defective portion of such a photonic crystal.

[0012] The "photonic crystal element" means an optical micro device made of a photonic crystal. Here, “photonic crystal” is one of the wavelengths to be transmitted.
It is characterized by having a periodic structure of refractive index at a pitch of about / 2, and depending on the structure, the photonic band gap (P
A phenomenon called BG) appears. Furthermore, if a certain "defect" is introduced into the periodic index structure in which PBG appears,
The bandgap effect is lost only in that part, and light is guided. The waveguide formed in such a photonic crystal is characterized in that it can be bent at a large angle.

Further, another method of manufacturing a micro device according to the present invention is a method of manufacturing a micro device having a photonic crystal element, comprising the steps of: forming a thin film layer made of a constituent material of the photonic crystal element; Applying a predetermined three-dimensional shape distribution to the thin film layer by press molding to form at least one photonic crystal element.

In the above method, since a predetermined three-dimensional shape distribution is given to the thin film layer by press molding to form at least one photonic crystal element, at least one photonic crystal element is collectively formed. Can be. In this case, since the press molding is used, the manufacturing cost can be suppressed as compared with the case where the lithography process is used. Moreover, since such press molding is used, the throughput in the manufacturing process can be increased.

Further, the apparatus for manufacturing a micro device according to the present invention comprises a lower support layer forming means for forming a lower support layer forming the micro device, and a device layer forming the micro device on the lower support layer. And a press forming means for applying a predetermined three-dimensional shape distribution to the thin film layer by press forming to form the device layer.

In the above apparatus, since the press forming means imparts a predetermined three-dimensional shape distribution to the thin film layer by press forming to form the device layer, the main body of the micro device can be formed collectively. In this case, since the press molding is used, the manufacturing cost can be suppressed as compared with the case where the lithography process is used. Moreover, since such press molding is used, the throughput in the manufacturing process can be increased.

In a specific aspect of the above-mentioned apparatus, the apparatus further comprises upper support layer forming means for forming an upper support layer constituting the micro device on the device layer. In this case, a micro device having a structure in which the device layer is protected by sandwiching it between upper and lower support layers can be formed.

In another specific mode of the above-mentioned device,
The lower support layer forming means and the upper support layer forming means respectively form the lower support layer and the upper support layer using first and second molds, respectively, and the press molding means includes a press mold. The device layer is formed using the first and second molds and the press mold on the same disk. In this case, it is possible to perform the molding while continuously feeding the mold, and it is possible to reduce the size of the manufacturing apparatus and to speed up the processing.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of an apparatus and a method for manufacturing a micro device according to the present invention will be described with reference to the drawings.

[First Embodiment] FIG. 1 is a view for explaining the overall configuration of a manufacturing apparatus according to a first embodiment. This manufacturing apparatus was formed by an injection press apparatus 10 for performing injection molding or press molding on a work W, a film forming apparatus 20 for forming a thin resin layer on the work W by spin coating, and a film forming apparatus 20. Finishing device 30 for finishing the resin layer
And a transport device having a port processing device 40 for loading a lens into an input / output port of an optical microdevice formed on the workpiece W, and a transport robot 51 for transporting the workpiece W among these devices 10, 20, 30, and 40. And a device 50.

The injection press apparatus 10 has an injection molding function for forming a support layer having a thickness of about 100 μm on the work W by injection molding, and a thin resin layer formed on the work W in a mold. A press forming function of transferring a pattern by deforming by pressing.

The film forming apparatus 20 is a thin film layer forming means.
A resin layer having a thickness of about several μm is formed on the work W by spin coating in which a resin material is dropped on the work W rotating at a high speed. This resin layer is cured by evaporation of volatile components and the like.

The finishing device 30 removes unnecessary portions around the resin layer which has been spin-coated by a chemical or mechanical method. As a result, the resin layer can be provided only on the necessary portions, and the resin layer is appropriately processed in the next press molding step.

The port processing apparatus 40 mounts a cylindrical condensing element such as a GRIN lens on a plurality of through-holes for input / output ports formed in the final stage of the manufacturing of the optical microdevice, thereby providing an external device. Prepare the interface with the component.

The transfer device 50 first transfers the work W to the injection press device 10 to form a lower support layer made of resin. Next, the transfer device 50 transfers the work W to the injection press device 1.
From 0, it is conveyed to the film forming apparatus 20 to form a resin layer different from the lower support layer. Next, the transfer device 50 transfers the work W from the film forming device 20 to the finishing device 30 to remove unnecessary portions of the resin layer. Next, the transport device 50 transports the workpiece W from the finishing device 30 to the injection press device 10 and press-molds the thin film-like resin layer to make it a photonic device layer. Further, in the injection press device 10, an upper support layer made of resin is formed on the photonic device layer. Next, the transfer device 50 transfers the work W from the injection press device 10 to the port processing device 40 to load a lens into the input / output port of the optical microdevice on the work W. Finally, the transfer device 50 unloads the work W from the injection press device 10.

FIG. 2 is a view for explaining the internal structure of the injection press device 10. This injection press device is a multi-stage micro-forming device which also serves as a lower support layer forming means, an upper support layer forming means, and a press forming means. As is clear from the figure, the injection press device is provided on the disk 11 provided with a plurality of dies for performing injection molding and press molding, a driving device 12 for rotating the disk 11 in a horizontal plane, and the disk 11. An elevating / lowering device 13 that supports and moves up and down a molding table MH (which is also a work W) for forming a cavity CA in contact with each mold; and a molding table in a cavity CA formed by the disk 11 and the molding table MH. MH
A first injection device 14 for injecting the resin PL from the side, and a second injection device 14 for injecting the resin PL from the disk 11 side to the cavity CA.
And an injection device 15.

Here, the first injection device 14 is a resin P for forming a lower support layer constituting the optical micro device.
Hopper 14a for introducing L and introduced resin P
A plasticizer 14b for melting and heating L;
injection port I provided with resin PL melted in b at molding table MH
And an injection device 14c for injecting the H into the cavity CA. The second injection device 15 also includes a hopper 15a for introducing the resin PL for forming the upper support layer constituting the optical micro device, a plasticizing device 15b for melting and heating the introduced resin PL, and a plasticizing device. An injection device 15c for injecting the resin PL melted at 15b into the cavity CA from an injection port IH provided in the disk 11.

FIG. 3 is a plan view for explaining the structure of the disk 11. This disk 11 has three mold parts.

A first mold part 11a as a first mold
Is a square flat depression, which becomes a mold for injection molding when forming the lower support layer constituting the optical microdevice. The first mold portion 11a has protrusions PR at four corners. These projections PR are for later forming a light entrance port and a light exit port of the optical microdevice, and form a through hole in the lower support layer described above.

A second mold part 11b as a second mold
Is also a square flat depression, and becomes a mold for injection molding when forming the upper support layer constituting the optical microdevice. The second mold portion 11b also has protrusions PR at four corners. These projections PR are also for forming the above-mentioned light entrance port and light exit port, and form through holes in the upper support layer constituting the optical micro device.

The protrusions PR formed on the two mold portions 11a and 11b can be formed at locations other than the four corners. That is, the above-mentioned protrusion PR can be arranged at an appropriate position according to the design of the light entrance port and the light exit port constituting the optical micro device.

The third mold portion 11c, which is a press mold,
The transfer pattern TP includes a large number of concave portions DP arranged in a matrix. The concave portion DP is for forming a photonic device layer, and imparts a three-dimensional shape distribution, that is, a periodic uneven distribution to the resin layer covering the lower support layer. That is, the interval and height of these concave portions are about several μm, and a two-dimensional photonic crystal is formed on the resin layer after press molding. The concave portions DP are arranged at lattice points in principle, but are not formed along the two V-shaped paths CH1 to CH2, and are not formed with the concave portions DP. By providing such a defect, a waveguide can be formed in the photonic crystal. In this case, a directional coupler is formed by the two paths CH1 and CH2. Further, in the drawings, the dimensions and arrangement of the concave portions DP are modified for the sake of explanation, but it goes without saying that the actual concave portions DP can have appropriate dimensions and arrangements different from those shown in the figure depending on the application and the like.

A plurality of fitting holes AH for alignment are formed around each of the mold portions 11a to 11c. These fitting holes AH have the same diameter as the alignment pins provided on the molding table MH, and are used for accurate alignment between the mold portions 11a to 11c and the molding table MH.

The above-mentioned mold portions 11a to 11c are formed by a micro-machine technology and have a submicron shape accuracy.

FIGS. 4 and 5 are views for explaining a method of manufacturing an optical microdevice using the apparatus of FIG.

First, as shown in FIGS. 4A to 4C, a lower support layer is formed by an injection press device 10.
Specifically, first, the molding table MH is fixed to the elevating device 13 of the injection press device 10, and the disk 11 is rotated to
Of the mold part 11a is opposed to the molding table MH (FIG. 4).
(A)). Next, the mold portion 11a is brought into contact with the molding table MH to form a cavity CA, and the resin PL is injected from the first injection device 14 into the cavity CA via the injection port IH (see FIG. 4B). ). At this time, the alignment of the mold portion 11a and the molding table MH is performed using the fitting holes AH and the alignment pins AP. Also, the mold part 1
1a and the molding table MH are maintained at appropriate temperatures. next,
When the resin PL injected into the cavity CA is cured, the molding table MH is separated from the mold portion 11a. Thus, a flat lower support layer SL1 is formed on the molding table MH (see FIG. 4C).

Next, as shown in FIG. 4D, a thin resin layer is formed on the flat lower support layer by the film forming apparatus 20 and the finishing apparatus 30. Specifically, the work W, that is, the molding table MH is set in the film forming apparatus 20, and the lower support layer SL1 is set.
A resin layer PLL having a thickness of several μm by spin coating
To form This resin layer PLL has transparency to the light to be guided, but has a higher refractive index than the resin constituting the lower support layer SL1. After that, the work W
Unnecessary peripheral portions of the resin layer PLL conveyed to the finishing device 30 and spin-coated by the film forming device 20 are removed.

Next, FIG. 4E, FIG. 5A and FIG.
As shown in (b), a photonic crystal pattern is press-formed on the resin layer PLL formed on the work W by the injection press device 10 to form a photonic device layer PDL. Specifically, first, the molding table MH is fixed to the elevating device 13 of the injection press device 10, and the disk 11 is rotated so that the third mold portion 11c faces the molding table MH (see FIG. 4E). ). Next, the transfer pattern TP is pressed against the resin layer PLL by bringing the mold portion 11c into contact with the molding table MH (see FIG. 5A). At this time, using the fitting hole AH and the alignment pin AP, the mold portion 11c and the molding table MH are used.
Is performed. Further, the mold portion 11c and the molding table MH are heated and held at an appropriate temperature. Next, the molding table MH is separated from the mold portion 11c. Thereby, the concavo-convex pattern corresponding to the transfer pattern TP is transferred to the resin layer PLL, and the photonic device layer PDL is obtained (see FIG. 5B). Here, the transfer pattern TP
Since the undulations and the thickness of the resin layer PLL are almost equal, the photonic device layer PDL becomes an aggregate of isolated projections as if the resin layer PLL was removed at unnecessary places.

Next, as shown in FIGS. 5 (c) to 5 (e), the upper support layer is subsequently formed by the injection press device 10. Specifically, the disk 11 is rotated so that the second mold portion 11b faces the molding table MH, and the molding table MH is brought into contact with the mold portion MH to form a cavity CA. The resin PL is injected from the device 15 into the cavity CA through the inlet IH (FIG. 5).
(C)). This resin PL has the same refractive index as the lower support layer SL1, and has a lower refractive index than the resin layer PLL. When injecting resin PL, fitting hole A
H and mold part 11b using alignment pin AP
And the alignment of the molding table MH is performed. Further, the mold portion 11b and the molding table MH are maintained at appropriate temperatures.
As a result, the upper part of the cavity CA, that is, the upper part of the photonic device layer PDL is filled with the resin PL (FIG. 5).
(D)). Next, when the resin PL injected into the cavity CA is cured, the molding table MH is moved from the mold portion 11b.
Apart. Thereby, the photonic device layer P
DL is a pair of low-refractive-index lower support layers SL1 of a parallel plate shape.
An optical micro device MD having a structure sandwiched by the upper support layer SL2 and the upper support layer SL2 is formed on the molding table MH (FIG. 5).
(E)). Here, the upper support layer SL2 is made of resin P
By setting the injection pressure of L to an appropriate condition, it is possible to prevent the photonic device layer PDL from almost entering the pattern having a fine three-dimensional shape distribution.
As a result, the photonic device layer PDL has, between the lower support layer SL1 and the upper support layer SL2, a gap space that is inverted in accordance with the three-dimensional shape distribution pattern. In the above example, a gap space is formed between the two support layers SL1 and SL2, but by adjusting the injection pressure of the resin PL during injection molding of the upper support layer SL2,
The resin PL can be filled so as to fill the above gap.

Thereafter, when the optical microdevice MD is separated from the molding table MH, a through hole is formed at a portion corresponding to the projection PR. In this through hole, the port processing device 40
Is filled with a resin having the same refractive index as the resin layer PLL.
The optical microdevice MD obtained in this manner is a photonic crystal element, and is a minute directional coupler including a pair of input ports and a pair of output ports corresponding to the through holes.

[Second Embodiment] FIG. 6 is a sectional view for explaining the structure of an optical microdevice formed by the manufacturing method of the second embodiment. This optical microdevice has 2
This is an integrated device in which a two-dimensional photonic device layer is formed in two stages. That is, a pair of photonic device layers PDL21 and PDL22 having a high refractive index are alternately laminated with three support layers SL21 to SL23 having a low refractive index. Each of the support layers SL21 to SL23 is provided with a light input / output port PO.

The optical micro device shown in FIG. 6 can be easily manufactured by repeating the manufacturing steps shown in FIGS. That is, after completing the device on the lower layer side through the step of FIG. 5 (e), the same steps as those of FIGS. 4 (d), 4 (e), and 5 (a) to 5 (e) are repeated. The photonic device layer can be formed in two or more layers.

[Third Embodiment] FIG. 7 is a sectional view for explaining the structure of an optical microdevice formed by the manufacturing method of the third embodiment. This optical micro device is an integrated device including a plurality of photonic elements. That is, the arrangement of the projection patterns DP formed on the photonic device layer PDL3 can be controlled by appropriately changing the transfer pattern TP formed on the third mold portion 11c in FIG. A desired combination of a coupler, a multiplexer, a waveguide and the like can be formed on the nick device layer PDL3.

[Fourth Embodiment] FIG. 8 is a sectional view for explaining the structure of an optical microdevice formed by the manufacturing method of the fourth embodiment. This optical microdevice uses a photonic device layer as an active element. That is, a heating element HD such as a Bertier element made of a resistor is provided above the upper support layer SL2 of the support layers SL1 and SL2 sandwiching the photonic device layer PDL. As a result, the photonic device layer PDL
Can be controlled, and the directional coupler provided in the photonic device layer PDL can have a switching function.

The integrated optical microdevice as described above is used for wavelength multiplex communication (Dense Wavelength Division Multipl
exing: DWDM). In DWDM, a large number of signals having different wavelengths are transmitted in one optical fiber to increase the capacity. However, in order to efficiently promote such networking of communication, even in a local area,
It is necessary to lay a small-sized optical integrated circuit including various elements necessary for multiplexing, demultiplexing, switching, and the like of these different wavelength signals. In the optical microdevice formed of a photonic crystal as in the above embodiment, even if the optical path is bent significantly, almost no loss occurs, so that the optical element itself can be formed compact, and further, the integration degree of the optical integrated circuit can be improved. Easy to increase. In other words, by the method of manufacturing an optical micro device described in the above embodiment, a low-cost, high-throughput, small-sized optical integrated circuit can be mass-produced.
It is possible to promote all-optical transmission in a local area of a communication network using WDM. The photonic device layer PD
In forming L, a photonic crystal pattern is formed at a period corresponding to each wavelength of DWDM. This enables multiplexing, demultiplexing, switching, and the like of different wavelength signals.

Although the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment.
For example, the lower support layer SL1 and the upper support layer SL2 can be formed not only by injection molding but also by another method such as press molding.

The photonic device layer PDL formed in the above embodiment can be used as another micro device layer by changing its three-dimensional uneven shape. For example, a microchannel or the like can be formed in a device layer by forming a transfer pattern of a mold portion in a shape corresponding to a medium channel containing DNA, and a DNA chip can be formed by providing a sensor on both side support layers or outside thereof. It can be.

Similarly, when forming a lab-on-a-chip that collectively performs various analyzes and processes in the biochemical field and the like, and a micro-chromatographic device that analyzes gases and fluids, etc. It is possible to utilize a combination of the multi-stage micro-molding technology and the micro hot embossing technology realized by the injection press device 10 or the like. Further, the combination of the multi-stage micro-molding technique and the micro hot embossing technique as in the above embodiment can be utilized for manufacturing a micro pump, a micro optical sensor, various power MEMS parts, and the like.

[0049]

As is clear from the above description, according to the method and apparatus for manufacturing a micro device according to the present invention,
Since a predetermined three-dimensional shape distribution is given to the thin film layer by press molding to form the device layer, the main body portion of the micro device can be formed collectively. On this occasion,
Since the press molding is used, the manufacturing cost can be reduced as compared with the case where the lithography process is used. Further, since the press molding is used, the throughput in the manufacturing process can be increased.

Further, according to another method of manufacturing a micro device according to the present invention, at least one photonic crystal element can be formed at a time, and a photonic crystal element can be formed as compared with the case where a lithography process is used. The manufacturing cost of the device can be kept low, and the throughput of manufacturing the photonic crystal device can be increased.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a configuration of a microdevice manufacturing apparatus according to a first embodiment.

FIG. 2 is a diagram illustrating an internal structure of an injection press device of the device of FIG.

FIG. 3 is a plan view illustrating a structure of a disk used in the apparatus of FIG.

FIGS. 4A to 4E are diagrams illustrating a method for manufacturing a micro device using the apparatus of FIG.

FIGS. 5A to 5E are diagrams illustrating a method for manufacturing a micro device using the apparatus of FIG.

FIG. 6 is a diagram illustrating a structure of a micro device obtained according to a second embodiment.

FIG. 7 is a diagram illustrating a structure of a micro device obtained according to a third embodiment.

FIG. 8 is a diagram illustrating a structure of a micro device obtained according to a fourth embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Injection press apparatus 11 Disk 11a-11c Die part 14 1st injection apparatus 15 2nd injection apparatus 20 Film-forming apparatus 30 Finishing apparatus 40 Port processing apparatus 50 Transport apparatus 51 Transport robot MD Micro device PDL Photonic device layer PLL resin layer SL1 Lower support layer SL2 Upper support layer TP Transfer pattern W Work

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G02B 6/12 N

Claims (10)

[Claims] 1. A method for manufacturing a micro device comprising a lower support layer and a device layer, comprising: forming a thin film layer made of a constituent material of the device layer on the lower support layer; Providing a predetermined three-dimensional shape distribution to the thin film layer to form the device layer. 2. The method according to claim 1, wherein the thin film layer is a resin layer made of a resin material. 3. The method of manufacturing a micro device according to claim 1, further comprising a step of forming an upper support layer on the device layer. 4. The method according to claim 3, wherein the device layer has an interstitial space between the lower support layer and the upper support layer. 5. The micro device according to claim 3, wherein the thin film layer has a higher refractive index than the lower support layer and the upper support layer. Production method. 6. The method of manufacturing a micro device according to claim 5, wherein the device layer includes a region having a periodic structure on the order of a wavelength for light to be guided. 7. A method for manufacturing a micro device having a photonic crystal element, comprising: a step of forming a thin film layer made of a constituent material of the photonic crystal element; Providing a distribution to form at least one photonic crystal element. 8. A lower support layer forming means for forming a lower support layer constituting a micro device, and a thin film layer comprising a constituent material of a device layer constituting the micro device is formed on the lower support layer. An apparatus for manufacturing a microdevice, comprising: a thin film layer forming unit; and a press forming unit that imparts a predetermined three-dimensional shape distribution to the thin film layer by press forming to form the device layer. 9. The microdevice manufacturing apparatus according to claim 8, further comprising an upper support layer forming means for forming an upper support layer constituting the micro device on the device layer. 10. The lower support layer forming means and the upper support layer forming means respectively form the lower support layer and the upper support layer using first and second molds, respectively. Forming the device layer using a press die, wherein the first and second molds and the press die are provided on the same disk. manufacturing device.