JP2002310302A - Fluororubber sealing material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sealing material having superior sealing performance and less releasing gas from itself. SOLUTION: The fluororubber sealing material used for a seal portion of a semiconductor carrying system, a vacuum container or a semiconductor manufacturing device comprises a fluororubber copolymer containing tetrafluoroethylene and propylene as polymerizing components and having unsaturated groups, the fluororubber copolymer being crosslinked with peroxide.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing material made of fluororubber, and more particularly to a sealing material which emits a small amount of gas from itself and is suitable for a semiconductor carrier or a semiconductor manufacturing device.

[0002]

2. Description of the Related Art In recent years, there has been an increasing demand for cleanliness of semiconductors, and higher cleanliness has also been demanded for semiconductor manufacturing equipment and transport equipment. For example, when a semiconductor such as a wafer is transferred, volatile components are emitted from the transfer device itself, which may contaminate the semiconductor. Rubber is generally used for the seal of the transfer device, which often contains low molecular weight components such as oligomers and monomers,
They are likely to be released as volatile components and contaminate the semiconductor.

[0003] In addition, along with the high performance of the clean room,
Large-scale investment is required, and attempts are being made to achieve cleanliness with as small a device as possible. for that reason,
2. Description of the Related Art Miniaturization of semiconductor manufacturing apparatuses has recently been regarded as important. Conventional large-scale semiconductor factories (megafabs) require enormous capital investment and have a problem that it is difficult to improve the production efficiency of semiconductors for home electric appliances such as mobile phones. To overcome these problems, the development of the mini-fab, a highly efficient next-generation semiconductor manufacturing system, is currently being promoted. Mini fabs also
It has the advantage of being suitable for high-mix low-volume production. However, the mini-fab is smaller in size than the conventional semiconductor manufacturing process, so that the emission of volatile components from the device may not be ignored.

As described above, there is a demand for a rubber material having a low emission gas amount as a sealing material for a semiconductor transfer device or a semiconductor manufacturing device.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a fluororubber sealing material which has excellent sealing performance and emits less gas from itself.

[0006]

Means for Solving the Problems We have repeatedly studied to solve the above problems, and found that a specific fluororubber copolymer containing tetrafluoroethylene and propylene as polymerization components and having an unsaturated group was peroxide-oxidized. It has been found that by crosslinking with an object, the amount of released gas is significantly reduced, and a sealing material suitable for use in a semiconductor carrier or a semiconductor manufacturing apparatus can be obtained.

That is, the present invention relates to a sealing material used for a sealing portion of a semiconductor transfer device, a vacuum vessel or a semiconductor manufacturing device, wherein the fluorine-containing rubber containing tetrafluoroethylene and propylene as a polymerization component and having an unsaturated group. A fluororubber sealing material characterized by being formed by crosslinking a copolymer with a peroxide.

The present invention also includes a wafer transfer container, a vacuum container, and a semiconductor manufacturing apparatus provided with the above-mentioned fluorine rubber sealing material.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.

The fluororubber sealing material of the present invention (hereinafter also simply referred to as "sealing material") is a fluororubber copolymer containing tetrafluoroethylene and propylene as polymerization components as a base polymer and having an unsaturated group. Is the first requirement. Particularly preferred is a tetrafluoroethylene / propylene copolymer having an unsaturated group. Components which can be copolymerized with tetrafluoroethylene and propylene include vinylidene fluoride; olefin compounds such as ethylene, butene, isobutylene, styrene and α-methylstyrene; fluorovinyl ether;
_{CF 2 = C 2 F 2 =} CF 2, CF 2 = CF-O (CF 2) 1 ~ 6
General polymerization component fluororubber divinyl monomers such as -O-CF = CF ₂ can be exemplified. In the following description, tetrafluoroethylene and propylene are contained as polymerization components, and a fluororubber copolymer having an unsaturated group, and a tetrafluoroethylene / propylene copolymer having an unsaturated group, which is a particularly preferred embodiment, are referred to as a copolymer. For convenience, it is referred to as "tetrafluoroethylene / propylene copolymer having an unsaturated group".

As will be shown in Examples described later, even if a general-purpose vinylidene fluoride-based fluororubber is used, it is not possible to obtain a sealing material having a low gas emission amount aimed at by the present invention.
Further, with a tetrafluoroethylene / propylene copolymer having no unsaturated group, crosslinking is extremely difficult. on the other hand,
From the tetrafluoroethylene / propylene copolymer having an unsaturated group, seal materials of various shapes can be produced by a usual peroxide crosslinking method. Moreover, the sealing material thus obtained has a small amount of released gas, and is suitable for applications such as a semiconductor transport device and a semiconductor manufacturing device. This is completely unexpected.

[0012] Tetrafluoroethylene having an unsaturated group /
The propylene copolymer itself is known, and it is known from the market, for example, Afras # 150 manufactured by Asahi Glass Co., Ltd. and JSR Co., Ltd.
L, Afras # 150E, Afras # 150P, Afras
# 100S, Afras # 100H, etc. can be obtained, but are not limited thereto. The polymerization ratio, molecular weight and the like are not particularly limited, and various known ones can be used. The copolymerization ratio of tetrafluoroethylene having an unsaturated group to propylene is 45/55 to 65/35. (Molar ratio), particularly preferably 50/50 to 60/40 (molar ratio). Further, the tetrafluoroethylene / propylene copolymer having an unsaturated group is preferable because the higher the molecular weight, the smaller the amount of gas released from the copolymer. The Mooney viscosity: ML1 + 10 (1
(00 ° C.) is preferably 70 or more, more preferably 90 or more, and particularly preferably 100 or more.

Each of the above Afras varieties is provided with an unsaturated group by partial deHF removal. However, a copolymer to which an unsaturated group is added by copolymerization of a third component such as a diene monomer is used. It is also possible to use. In addition, a third component such as vinylidene fluoride, an iodide monomer, and a bromide monomer may be copolymerized.

In the present invention, a tetrafluoroethylene / propylene copolymer having a plurality of types of unsaturated groups may be used in combination.

The second requirement of the present invention is that the tetrafluoroethylene / propylene copolymer having an unsaturated group is crosslinked with a peroxide. When general-purpose polyol cross-linking and polyamine cross-linking are performed, even if a tetrafluoroethylene / propylene copolymer having an unsaturated group is used, the amount of released gas is difficult to reduce. On the other hand, the copolymers crosslinked with peroxides according to the invention exhibit a very low outgassing.

The type of peroxide is not particularly limited, and various known peroxides can be used. For example, ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, methyl acetoacetate peroxide, and acetylacetone peroxide; 1,1-bis (t-butylperoxy) -3,3,3 5-trimethylcyclohexane, n-butyl
-4,4-bis (t-butylperoxy) valerate, 1,1-bis
(t-butylperoxy) cyclohexanone, 2,2-bis (t-
Peroxyketals such as butylperoxy) octane and 2,2-bis (t-butylperoxy) butane; 2,5-dimethylhexane-2,5-dihydroperoxide, t-butylhydroperoxide, cumene hydroperoxide, dii- Hydroperoxides such as propylbenzene hydroperoxide, p-menthane hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide; benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, acetyl peroxide, i-butyryl peroxide, Diacyl peroxides such as octanoyl peroxide, decanoyl peroxide, lauroyl peroxide, 3,5,5-trimethylhexanol peroxide, succinic peroxide, and m-toluoyl peroxide; dii-propylperoxydicarbonate, di-2-ethylhexylperoxide Carboxymethyl dicarbonate, di n- propyl peroxydicarbonate, bis
(4-t-butylcyclohexyl) peroxydicarbonate, dimyristyl peroxydicarbonate, di-2-ethoxyethylperoxydicarbonate, dimethoxyisopropylperoxydicarbonate, di (3-methyl-3-methoxybutyl) peroxydicarbonate, diallylperoxy Peroxydicarbonates such as dicarbonate; t-butyl peroxyacetate, t-butyl peroxyisobutyrate, t-butyl peroxypivalate, t-
Butylperoxyneodecanate, cumylperoxyneodecanate, t-butylperoxy-2-ethylhexanoate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, t- Butylperoxybenzoate, di-t-butylperoxyisophthalate, 2,5-dimethyl-2,5-di (benzoylperoxy)
Hexane, t-butylperoxymaleic acid, t-butylperoxyisopropyl carbonate, cumylperoxyoctoate, t-hexylperoxyneodecanate,
Peroxyesters such as t-hexylperoxypivalate, t-butylperoxyneohexanoate, t-hexylperoxyneohexanoate, cumylperoxyhexanoate and the like; and acetylcyclohexylsulfonyl peroxide, t-butylperoxyallylcarbonate And the like, but not limited thereto. Multiple peroxides may be used in combination

Among them, dialkyl peroxides such as di-t-butyl peroxide, t-butylcumyl peroxide, dicumyl peroxide, α, α′-bis (t-butylperoxy-m-isopropyl) benzene, 2 ,Five
-Dimethyl-2,5-di (t-butylperoxy) hexane, 2,5-
It is preferable to use dimethyl-2,5-di (t-butylperoxy) hexyne-3 or the like. By using these dialkyl peroxides, a sealing material having a particularly small amount of released gas can be produced under conventional crosslinking conditions. The amount of these peroxides is not particularly limited, and can be arbitrarily set according to the desired hardness, strength, peroxide used and crosslinking conditions. For example, about 0.01 to 10 parts by weight, especially about 0.1 to 5 parts by weight may be blended with respect to 100 parts by weight of the tetrafluoroethylene / propylene copolymer having an unsaturated group. Those skilled in the art will easily select an appropriate compounding amount according to the type of peroxide.

When crosslinking the tetrafluoroethylene / propylene copolymer having an unsaturated group with the above peroxide, it is preferable to use a crosslinking aid in combination. As a result, the crosslinking efficiency can be increased, and the amount of gas released from the obtained sealing material can be further reduced. The crosslinking assistant is not particularly limited, and various conventional ones can be used. For example, triallyl isocyanurate, trialmethallyl isocyanurate, triallyl cyanurate; (meth) acrylate having a plurality of unsaturated groups, for example, trimethylolpropane trimethacrylate, allyl methacrylate,
Ethylene glycol dimethacrylate, dimethacrylic acid 1,
3-butylene glycol; phthalic esters having a plurality of unsaturated groups, such as diallyl phthalate and diallyl isophthalate; diallyl phosphate, triallyl phosphate; quinone dioxime; and polybutadiene, but are not limited thereto. These crosslinking aids may be substituted with an alkyl group, an amino group, a carboxyl group, an epoxy group, a halogen atom, or the like.

The polybutadiene preferably has various functional groups such as terminal groups for the purpose of adjusting the compatibility with the tetrafluoroethylene / propylene copolymer having an unsaturated group. Further, a part of the double bond may be hydrogenated. Further, the ratio of the 1,4-bond / 1,2-bond, the cis / trans ratio, and the like are not particularly limited. However, the molecular weight is preferably high, and those having a molecular weight of about 500 or more, particularly those having a molecular weight of about 1000 or more are used.

A plurality of the above-mentioned crosslinking assistants can be used in combination. The amount of the crosslinking aid is not particularly limited, and can be variously set according to the types of the crosslinking aid and the peroxide and the desired physical properties. For example, based on 100 parts by weight of a tetrafluoroethylene / propylene copolymer having an unsaturated group, 0.01 to 10 parts by weight of a crosslinking aid is used, particularly 0.1.
It is preferred to use up to 5 parts by weight. These crosslinking aids are
Reacts with peroxide radicals to increase crosslinking efficiency. The present invention also includes a sealing material in which at least a part of a crosslinking point is formed by these crosslinking assistants.

Apart from the crosslinking aid, magnesium oxide (Mg
O), calcium hydroxide (Ca (OH) 2), calcium oxide
Acid acceptors such as (CaO), lead oxide (PbO), sodium stearate, potassium stearate, and magnesium stearate may be used in combination. Particularly preferably, inorganic substances such as magnesium oxide and calcium hydroxide are used. By mixing 0.1 to 20 parts by weight, especially 0.2 to 5 parts by weight of these acid acceptors, the cross-linking moldability, kneading processability, extrusion processability, etc. can be improved without increasing the amount of released gas. can do.

In addition to the above, various known compounds such as carbon black, graphite, silica, reinforcing fibers, processing aids, softeners and coupling agents can be added to the sealing material of the present invention. . Preferably, only carbon black having a small residue such as a hydrocarbon is used. As a result, the rubber strength and the like can be improved without increasing the amount of released gas. In particular, when 5 to 50 parts by weight of carbon black such as MT, FT, and SRF is blended with respect to 100 parts by weight of a tetrafluoroethylene / propylene copolymer having an unsaturated group, the strength of the sealing material can be further improved. You can do it. If desired, a high-hardness sealing material can be used.

In the present invention, the method of forming the sealing material is optional. For example, a block-shaped fluororubber composed of the above components may be placed in a mold and heat-molded, or may be preformed by compression molding, extrusion molding or the like and then crosslinked.
Injection molding can also be performed. There is no limitation on the shape of the molded product, and the molded product can be formed into various shapes of seal materials such as an O-ring, a square ring, a U-shape, and a V-shape. It may be a composite material with a metal or a resin, for example, a metal / rubber laminate. The sealing material of the present invention also includes those having various shapes, in particular, a sealing material having a structure in which a metal plate and the above-mentioned fluororubber are combined. The metal / fluororubber laminate further includes:
Embossing or the like may be performed.

There are no particular restrictions on the crosslinking method, and those skilled in the art can arbitrarily determine the method according to the intended physical properties and the type of crosslinking (auxiliary) agent. For example, about 100-300 ° C,
In particular, a crosslinked product can be obtained by heating at a temperature of about 120 to 200 ° C. for 0.1 minute to 100 hours, particularly 1 to 30 minutes with a press or the like. After press crosslinking, for example, at about 100 to 300 ° C. for 1 to 100 hours, particularly about 150 to 2 hours
Secondary crosslinking may be performed at 50 ° C. for 1 to 50 hours by a method such as hot air crosslinking. In addition, the crosslink density can be appropriately determined.

The sealing material of the present invention obtained as described above,
Even after soaking in acetone of 25 ± 2 ° C for 70 hours,
Its volume change due to swelling is not more than 300%. In consideration of the main application of the present invention to semiconductor semi-devices and semiconductor manufacturing devices, the volume change rate is preferably 250% or less, particularly preferably 200% or less, and the composition, molding conditions, crosslinking conditions, and the like are appropriately adjusted.

The sealing material of the present invention contains almost no volatile components. Therefore, for example, a temperature of 100 ° C.
The amount of released gas when held for 0.5 minutes is 0.5 ppm or less, especially 0.1 ppm. It is an extremely low value of 0.3 ppm, sometimes 0.1 ppm or less. Therefore, the sealing material of the present invention is most suitable as a sealing material for a semiconductor transfer device such as a vacuum container and a wafer carrier, or a semiconductor manufacturing device such as a mini fab. The sealing material of the present invention is also excellent in heat resistance, chemical resistance, and the like, and thus is excellent as a sealing material used under severe conditions such as drug transport and high temperature. The present invention also includes sealing materials for these various uses. The invention further provides
The present invention also includes a wafer transfer container, a vacuum container, and a semiconductor manufacturing apparatus provided with the above-mentioned sealing material.

[0027]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples.

[Examples 1 to 6, Comparative Examples 1 to 3] Various compounding agents were kneaded with various raw rubbers by a biaxial roll, sandwiched in a mold, and formed into a sheet of 100 × 100 × 2 mm by a hot press. Molded. This was subjected to secondary cross-linking in a gear oven to prepare a sample, which was subjected to the following qualitative and quantitative tests of released gas, and immersion test. The properties of the raw rubber used are shown below.

Afras # 150L: tetrafluoroethylene / propylene copolymer having an unsaturated group (55/4 molar ratio)
5), Fluorine content 57%, ML1 + 10 (100 ° C.): 35 Afras # 150E: tetrafluoroethylene / propylene copolymer having an unsaturated group (molar ratio 55/45), Fluorine content 57%, AFLAS # 150P: tetrafluoroethylene / propylene copolymer having an unsaturated group (molar ratio 55/45), fluorine content 57%, ML1 + 10 (100 ° C): 95 Afras # 100S: tetrafluoroethylene / propylene copolymer having an unsaturated group (molar ratio 55/45), fluorine content 57%, ML1 + 10 (100 ° C.): 160 Afras # 100H: unsaturated group Tetrafluoroethylene / propylene copolymer (mole ratio 55/45), fluorine content 57%, ML1 + 10 (100 ° C.): 110 Afras # 150C: tetrafluoroethylene / propylene copolymer (mole ratio 55/45) 45), having almost no unsaturated group,
Fluorine content 57%, ML1 + 10 (100 ° C.): 100 Afras 200: Tetrafluoroethylene / propylene / vinylidene fluoride copolymer having an unsaturated group, polyol crosslinking is possible in addition to peroxide crosslinking, ML1 +10 (100 ℃): 9
0 · Daiel 4070: Master batch into which Daikin Industries, Ltd. kneaded vinylidene fluoride / hexafluoropropylene / tetrafluoroethylene ternary peroxide crosslinked rubber (general purpose FKM), a crosslinking agent, carbon black, etc.

The types, blending and crosslinking conditions of the other blending agents are as follows:
It is as shown in Table 1.

The qualitative and quantitative determination of the released gas was carried out by purge & trap-gas chromatography mass spectrometry. The heating conditions were 100 ° C. for 30 minutes, and the purge gas was H
e was used. N-decane was used as a standard substance at the time of quantification.

As an immersion test, a full-surface immersion test was performed in accordance with JIS K6258 (a test method for immersion of vulcanized rubber). Acetone is used as the immersion liquid, the immersion temperature is 25 ± 2 ° C,
The immersion time was 70 hours.

Table 1 shows the results of each test.

[0034]

[Table 1]

As shown in Table 1, all of the samples obtained by subjecting the tetrafluoroethylene / propylene copolymer having an unsaturated group to peroxide crosslinking according to the present invention have a small amount of released gas. ing. On the other hand, in the sample using the general-purpose vinylidene fluoride-based fluororubber (Comparative Example 3) and the sample crosslinked with the polyol (Comparative Example 2), the amount of released gas is large. In addition, even when a tetrafluoroethylene / propylene copolymer was used, when the copolymer had almost no unsaturated groups, cross-linking molding was impossible even when a peroxide was blended (Comparative Example 1). ).

Tetrafluoroethylene having an unsaturated group
Among the samples according to the present invention in which the propylene copolymer was peroxide-crosslinked, the values of the released gas amount were particularly small in Examples 4 and 5 using high Mooney rubber as a raw material. On the other hand, in a sample made of a rubber obtained by copolymerizing vinylidene fluoride with tetrafluoroethylene / propylene having an unsaturated group, the amount of released gas is slightly larger.
(Example 6).

[Examples 7 to 10, Comparative Examples 4 to 5] Samples were prepared by the same operation as described above with the formulations shown in Table 2, and the same tests were performed. In Table 2, Florel FLS26
50 is a ternary peroxide crosslinked rubber of vinylidene fluoride / hexafluoropropylene / tetrafluoroethylene manufactured by Sumitomo 3M Co., Ltd., having a fluorine content of 70% and ML1 + 10 (1
21 ° C.) is 50. As polybutadiene, Nippon Soda Co., Ltd. B-3000 (number average molecular weight 3,000 ± 400, 1,2
-Bond> 90%).

The inner diameter of each sheet is 40 mm and the outer diameter is 4 mm.
A 7 mm test piece was punched out, and this was a cylindrical vacuum container (TVS-1 type, manufactured by Pressure Glass Industry Co., Ltd., capacity: 200 ml).
Was used as a sealing material, and the time until the pressure in the container reached 0.1 torr was measured by vacuum suction with a pump. Table 2 shows the results of each test.

[0039]

[Table 2]

As shown in Table 2, according to the present invention, it is clear that a sample obtained by peroxide crosslinking of a tetrafluoroethylene / propylene copolymer having an unsaturated group has a small amount of released gas. In particular, the samples using the tetrafluoroethylene / propylene binary copolymer having an unsaturated group as the raw material showed extremely small outgassing values (Examples 7 to 9). Further, according to the present invention, in a vacuum vessel equipped with a sample obtained by peroxide crosslinking of a tetrafluoroethylene / propylene copolymer having an unsaturated group as a sealing material, the pressure in the vessel is reduced to 0.1 torr in a short time. The pressure was reduced to the following (Examples 7 to 10, especially Examples 7 to
9). Thus, it is clear that the sealing material according to the present invention is suitable for applications such as vacuum containers and semiconductors because of a small amount of released gas, and is excellent in sealing properties.

[Embodiment 11] 400 × 320 × 0.25
One side of an aluminum plate of mm was polished with a # 100 paper file, washed with water and dried. Metalok S-7 (a vulcanizing adhesive for metal-fluororubber manufactured by Toyo Kagaku Kenkyusho) was spray-applied to the polished surface, air-dried for 30 minutes, and then cut into 300 mm squares.

On the other hand, Afras # 100H (tetrafluoroethylene / propylene copolymer having an unsaturated group) 100
A rubber composition was prepared by mixing 15 parts by weight of MT-carbon, 3 parts by weight of triallyl isocyanurate, and 2.5 parts by weight of dicumyl peroxide with a rubber kneading roll.

Then, the rubber composition was placed on the metallock coating film of the aluminum plate, placed in a 320 mm square mold, and subjected to press crosslinking at 160 ° C. for 20 minutes. Then
The obtained laminate was subjected to secondary crosslinking in an oven at 230 ° C. for 1 hour. When the released gas was measured for the laminate after the secondary crosslinking, acetone 200 ppb, methyl ethyl ketone 1
Only 00 ppb was detected.

[0044]

As described above, according to the present invention, it was possible to obtain a sealing material with less outgassing. In view of the fact that if the selection of the base rubber and the cross-linking method is incorrectly selected, the amount of outgassing gas increases, the present invention is particularly effective as a sealing material used for a semiconductor carrier, a vacuum vessel or a sealing portion of a semiconductor manufacturing apparatus.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Mitsuyuki Nakano 1-8-1 Shintoda, Hamamatsu City, Shizuoka Prefecture (72) Inventor Kazuki Morimoto 1-81-1, Shintoda, Hamamatsu City, Shizuoka Prefecture (72) Inventor Kokura Hitoshi 1-8-1 Shintoda, Hamamatsu City, Shizuoka Prefecture F-term (reference) 3J040 FA07 4J027 AA08 BA17 BA19 BA24 BA27 BA29 CB04

Claims (10)

[Claims] 1. A sealing material used for a sealing portion of a semiconductor transfer device, a vacuum container or a semiconductor manufacturing device,
A fluororubber sealing material comprising a fluororubber copolymer having an unsaturated group and containing tetrafluoroethylene and propylene as polymerization components, which is obtained by peroxide crosslinking. 2. Triallyl isocyanurate, triallyallyl isocyanurate, triallyl cyanurate, (meth) acrylate having a plurality of unsaturated groups, phthalate having a plurality of unsaturated groups, quinone dioxime The fluororubber sealing material according to claim 1, wherein at least a part of the crosslinking points is formed by one or more compounds selected from the group consisting of polybutadiene, and polybutadiene, and derivatives thereof. 3. The fluororubber sealing material according to claim 1, wherein the peroxide is a dialkyl peroxide. 4. The Mooney viscosity ML of a fluororubber copolymer
The fluororubber sealing material according to any one of claims 1 to 3, wherein 1 + 10 (100 ° C) is 90 or more. 5. The fluororubber sealing material according to claim 1, wherein the amount of gas released when the temperature is maintained at 100 ° C. for 30 minutes is 0.5 ppm or less. 6. The fluororubber sealing material according to claim 1, wherein a volume change rate after immersion in acetone at 25 ± 2 ° C. for 70 hours is 250% or less. . 7. The fluororubber sealing material according to claim 1, wherein the fluororubber sealing material has a structure combined with a metal plate. 8. A wafer transfer container provided with the fluororubber sealing material according to claim 1. Description: 9. A vacuum container comprising the fluororubber sealing material according to claim 1. 10. A semiconductor manufacturing apparatus comprising the fluororubber sealing material according to claim 1.