JP2002305115A - Chip-type electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip-type electronic component which can be miniaturized and in which the exfoliation of electrode and deterioration of characteristics can be prevented. SOLUTION: An internal conductor 12 is embedded in a base substance 11, an external electrode 16 bonded to the internal conductor 12 is arranged on the base substance 11, and the tips of the external electrode 16 are arranged in recessed parts 15, being arranged on both surfaces of the base substance 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component suitably used for electronic equipment such as mobile communication. In particular, the present invention relates to a chip-type electronic component mainly for removing noise.

[0002]

2. Description of the Related Art FIGS. 10 to 12 are perspective views showing a conventional chip-type electronic component.

In FIG. 10, reference numeral 1 denotes a base, and the base 1 is made of at least one of a dielectric, a magnetic material, and an insulator. In the base 1, a pair of spiral-shaped internal conductors 2 joined through a through hole are provided in parallel. External electrodes 3 to 6 electrically connected to the internal conductor 2 are provided on the outer surface of the base 1.

FIG. 11 shows a configuration in which only one internal conductor 2 is provided in a base 1, and external electrodes 3 and 4 are provided at both ends of the base 1, respectively.

Further, in FIG. 12, the internal conductor 2 is changed to a linear body, the internal conductor 2 is provided in the base 1, and external electrodes 3 and 4 are provided at both ends of the base 1.

FIGS. 13 to 16 show a conventional method of manufacturing a chip-type electronic component.

FIGS. 13 to 16 are perspective views showing a conventional method for manufacturing a chip-type electronic component (the method for manufacturing the chip-type electronic component shown in FIG. 10 will be described as a representative), as shown in FIG. In addition, a plurality of sheets are laminated, and the spiral inner conductor 2 is sandwiched between the sheets in two stages, and the inner conductors 2 are electrically connected to each other through through holes provided in the sheet. The laminated assembly 7 is formed.

Next, as shown in FIG. 14, the laminated assembly 7 is cut so as to include the pair of inner conductors 2, and a cut chip 8 is formed as shown in FIG. Generally, the cut chip 8 is subjected to a heat treatment such as baking or chamfering,
Next, as shown in FIG. 16, outer conductors 3 to 6 are provided on the exposed inner conductor 2 on the side surface of the cut chip 8, respectively, to complete a chip-type electronic component.

As a prior example, Japanese Patent Application Laid-Open No. 12-21602
No. 6, JP-A No. 12-173835, JP-A No. 1-173835
There are JP-A-1-17466, JP-A-11-16760 and JP-A-8-148367.

[0010]

However, when the miniaturized type of the chip-type electronic component is to be manufactured, the following problems have occurred.

First, as chip-type electronic components are reduced in size, the area of the external electrodes 3 to 6 is inevitably reduced.
Accordingly, the bonding strength between the external electrodes 3 to 6 and the base 1 is reduced, and the external electrodes 3 to 4 may fall off from the base 1. As means for solving these problems, the above-mentioned publication discloses a configuration in which a groove is provided over an opposing surface, and an electrode is provided in the groove (Configuration 1), or a groove is formed. It is conceivable to provide an electrode on the projected portion (Configuration 2). However, in each configuration, there is a problem that the tip of the external electrode is easily peeled off, and the characteristics are deteriorated.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a chip-type electronic component which can be reduced in size, can prevent peeling of electrodes, and can prevent deterioration of characteristics.

[0013]

SUMMARY OF THE INVENTION According to the present invention, an internal conductor is embedded in a substrate, external electrodes for bonding to the internal conductor are provided on the substrate, and the external conductors are provided in recesses provided on both surfaces of the substrate. A tip was provided.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to a first aspect of the present invention is directed to an internal conductor having an inductance component, a substantially rectangular parallelepiped base in which the internal conductor is embedded, and a pair of opposing first surface portions of the base. A lead-out part that is electrically connected to the internal conductor,
A pair of external electrodes provided on the base and joined to the lead portion, and a pair of second surfaces provided on the base different from the pair of first surface portions, each of which is stepped down from another portion; A chip-type electronic component comprising a pair of recesses that are discontinuous with each other, wherein the tip of the external electrode is embedded in the pair of recesses, causing friction with other members and the like. In addition, the tip of the external electrode is hardly peeled off, the characteristic can be prevented from deteriorating, and the external electrode is not easily debris, so that other electronic components and members are not adversely affected. Further, even when the chip-type electronic component is miniaturized and the bonding area between the external electrode and the base is reduced, not only can the bonding area be increased by providing the concave portion, but also the tip of the external electrode which is most easily peeled off. Since a part can be provided in the concave portion, peeling of the external electrode can be further prevented.

According to a second aspect of the present invention, with the chip-type electronic component according to the first aspect, a recess is provided between the pair of recesses. Therefore, even if the external electrodes are provided in a narrow range, the adhesion strength can be sufficiently increased, and moreover, reliable joining with the lead-out portion can be performed.

According to the third aspect of the present invention, the first recess having one recess is provided.
2. An opening is provided on a surface portion of the first member.
By using the chip-type electronic component described above, it is possible to solve a problem that the thickness of the external electrode is partially extremely reduced.

According to a fourth aspect of the present invention, there is provided a chip-type electronic component according to the first aspect, wherein a groove-like concave portion having no opening is provided between the pair of external electrodes and the first surface portion is not formed. By doing so, at least the tip of the external electrode can be embedded in the groove, so that the recess can be formed relatively easily,
The tip of the external electrode that is easily peeled from the base can be protected.

According to a fifth aspect of the present invention, there is provided an internal film formed of a base, a conductor or a resistor embedded in the base and partially exposed to the outside, and electrically connected to the internal formed film. A chip-type electronic component comprising: an external electrode connected to and provided on the base; and a recess provided on a surface of the base and provided with a tip of the external electrode. Even if friction occurs with the member, the tip of the external electrode does not easily peel off, preventing deterioration of the characteristics.In addition, since the external electrode does not easily generate debris, it can be used for other electronic components and members. It has no adverse effect. Further, even when the chip-type electronic component is miniaturized and the bonding area between the external electrode and the base is reduced, not only can the bonding area be increased by providing the concave portion, but also the tip of the external electrode which is most easily peeled off. Since a part can be provided in the concave portion, peeling of the external electrode can be further prevented.

An embodiment of a chip-type electronic component according to the present invention will be described below.

FIGS. 1 to 3 are perspective views showing a chip-type electronic component according to an embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a base, and the base 11 is made of at least one of a dielectric material, a magnetic material, and an insulating material. Specifically, Fe ₂ O ₃ , ZnO, NiO, C
It is made of a magnetic material containing uO or the like. Although not shown, the base 11 is formed by laminating a plurality of sheets having magnetism, for example. The base 11 has a substantially rectangular parallelepiped shape with a chamfer 14 at a corner.

Reference numeral 12 denotes a spiral internal conductor formed of a conductive material. The internal conductor 12 is embedded in the base 11. In the configuration shown in FIG.
Were provided in parallel on the left and right. The inner conductor 12 is made of Ag, Ag-
It is made of a conductive material containing Pd, Pd or the like as a main component. The inner conductor 12 is divided into at least two parts, and is composed of a divided conductor 12a and a divided conductor 12b. Split conductor 1
2a and the divided conductor 12b are provided between different sheets, respectively, and a through hole is provided in a sheet provided between the divided conductors 12a and 12b at a center portion, and the connection conductor 13 provided in the through hole provides electric connection. It is connected to the. In addition, each of the divided conductors 12a and 12b is provided with a lead portion 12d.

Reference numeral 15 denotes a concave portion. The concave portion 15 serves as a mounting surface of the base 11, and is provided on the opposing surfaces 11a and 11b. The concave portion 15 is stepped down from other portions of the surfaces 11a and 11b, and has a substantially semi-circular shape in plan view. At this time, the concave portion 15 is formed so as to be depressed along the direction in which the sheets are stacked when the base 11 is formed.

The concave portion 15 is provided so as to face the lead portion 12d of the internal conductor 12. In the case of FIG. 1, since four lead portions 12d are provided, a total of eight concave portions 15 are provided. Will be.

The depth M of the concave portion 15 is
It is preferable that the thickness t be 0.002 mm to t / 5 with respect to the thickness t. As a result, the effect of preventing the peeling of the external electrode is impaired. If the value is larger than t / 5, a problem occurs in the strength of the substrate at the external electrode portion.

The maximum length L1 between two opposing side surfaces 11c and 11d of the recess 15 is determined by the thickness t of the base 11.
In contrast to this, it is better to set t / 5 to 2t, and if the displacement of the external electrode portion due to the deflection of the circuit board after the external electrode and the circuit board electrode are joined is smaller than t / 5,
When the external electrodes on the side surfaces 11c and 11d are larger than 2t,
The force tends to concentrate on the external electrodes on the surfaces 11a and 11b, and the external electrodes tend to be damaged.

Further, in the case of the present embodiment, the concave portion 15 is configured to have openings on the side surfaces 11c and 11d.

Reference numeral 16 denotes an external electrode provided so as to be electrically connected to each of the lead portions 12d of the internal conductor 12 exposed on the side surfaces 11c and 11d. The external electrode 16 is also provided in the concave portion 15. Specific examples of the formation of the external electrode 16 include:
The conductive paste is applied to each of the lead portions 12d and the lead portions 12d.
Is applied in the concave portion 15 provided so as to sandwich it, and is formed by baking or the like. Preferably, the external electrode 1
By providing a plating film made of Ni, Cu, Sn, Pb alone or an alloy containing at least one of them on the surface of No. 6, weather resistance and mountability can be improved. In addition, as a conductive paste, Ag, Ag-P
It is preferable to use one containing d, Pd or the like as a main component.

The external electrodes 16 are on the side surfaces 11c and 11d,
It is provided on both sides 11a and 11b.

As described above, in the present embodiment, the external electrode 1
6, the tip of the external electrode 16 is hardly peeled off even if friction with other members occurs, and the deterioration of the characteristics can be prevented. Since no scrap is generated, other electronic components and members are not adversely affected. Therefore, even if the chip-type electronic component is miniaturized and the bonding area between the external electrode 16 and the base 11 is reduced, the provision of the recess 15 not only allows the bonding area to be increased, but also allows the external electrode 16 which is most easily peeled off. Can be provided in the recess 15, so that the external electrode 16 can be further prevented from peeling off.

In the present embodiment, the concave portion 15 is provided so as to open on the side surfaces 11c and 11d, but may be provided so as not to have an opening on the side surfaces 11c and 11d.

In the present embodiment, one drawer 1
The recesses 15 are respectively formed on the surfaces 11a and 11b so as to sandwich the 2d.
Is provided, but it may be provided on one of the surfaces 11a and 11b depending on the specifications and the like.

The concave portion 15 as shown in FIG. 1 is particularly preferably used for a chip-type electronic component in which a plurality of (two or more) independent internal conductors 12 are embedded in the base 11.

In another embodiment, as shown in FIG. 2, a groove-shaped concave portion 15 is formed on the opposed side surfaces 11e and 11f where the lead-out portion 12 is not exposed and serves as a mounting surface. A configuration provided only in 11a and 11b may be used. In FIG. 2, two are provided on each of the surfaces 11a and 11b serving as mounting surfaces.

In the case of this configuration, the tip of the external electrode 16 is arranged in the groove-shaped recess 15.

As described above, the groove-shaped recess 15 is formed between the pair of external electrodes 16 and in the vicinity of each of the pair of external electrodes 16, and the side surfaces 11 e, in which only the both ends are provided with the external electrodes 16. 11f, the groove-shaped concave portion 15 is
By providing them on 1a and 11b, respectively, the tip portions provided on the surfaces 11a and 11b of the pair of external electrodes 16 are provided in the concave portion 15, and substantially the same effect as the configuration shown in FIG. 1 can be obtained. it can.

In particular, as shown in FIG. 2, one internal conductor 12 is embedded in the base 11, and the external electrodes 16 are provided on the entire end surfaces of the base 11 and on a part of the surface adjacent to the both end surfaces. In the case of a configuration, it is particularly preferable to provide a linear concave portion 15 as shown in FIG.

In the present embodiment, Faces 11a, 11
b, groove-shaped recesses 15 are provided on both surfaces 11a and 11b.
b may be provided on at least one of them.

In the present embodiment, the side surfaces 11e, 1
Although the groove-shaped concave portion 15 is provided so as to have an opening at 1f, the opening is not provided at the side surfaces 11e and 11f, that is,
The groove-shaped recess 15 may be provided so as not to reach the side surfaces 11e and 11f.

Further, as a modified example of the structure shown in FIG.
As shown in FIG. 3, the same effect as in FIG. 2 can be obtained even if the internal conductor 12 is changed to a linear conductor wire 17.

Next, FIGS. 4 to 8 show a method of manufacturing the chip-type electronic component shown in FIG.

As shown in FIG. 4, although not shown, a sheet having magnetism or the like is laminated, the divided conductors 12a and 12b are sandwiched between the sheets, and a sheet disposed between the divided conductors 12a and 12b. Then, a connecting conductor 13 is provided in the through hole, and the divided conductors 12a and 12b are electrically connected to each other to produce a laminated assembly 18 in which the internal conductor 12 is embedded. At this time,
The concave portion 15 can be realized by providing a cutout portion in advance in at least the outermost sheet of the laminated assembly 18 so as to have the shape of the concave portion 15 and laminating. Also,
As another method, it is conceivable to form a depression by pressing or the like in a shape corresponding to the concave portion 15 after forming the laminated aggregate 18.

Next, as shown in FIG.
The laminated assembly 18 is cut out into individual pieces 19 so as to include The perspective view is shown in FIG. Next, at least a conductive paste is applied to the exposed portion 12 d of the piece 19 and the inside of the recess 15, and is baked to form four external electrodes 16 as shown in FIG. 7. If necessary, a plating film or the like may be formed on the external electrode 16 so as to improve weather resistance and mountability.

As described above, the provision of the concave portion 15 enables the
In the cross-sectional view taken along line X, it can be seen that the external electrode 16 is provided in the recess 15, thereby improving the contact area and adhesion strength of the external electrode 16 while being small. This can prevent the external electrodes from falling off.

In this embodiment, as shown in FIG. 9, a pair of spiral inner conductors 12 are connected to the intermediate sheet 2.
A chip-type electronic component magnetically coupled through a zero is also applicable.

Further, in this embodiment, the chip type electronic component provided with the internal conductor 12 forming an inductance component in the base 11 has been described as an example, but the internal conductor 12 forming the capacitor in the base 11 has been described. And a chip resistor in which a resistor is buried instead of the internal conductor 12 inside the substrate.

[0047]

According to the present invention, an internal conductor is buried in a base, an external electrode to be joined to the internal conductor is provided on the base, and a tip of the external conductor is provided in a concave portion provided on both surfaces of the base. By doing so, even if friction with other members occurs,
The tip of the external electrode is not easily peeled off, and the deterioration of the characteristics can be prevented. Moreover, since the external electrode does not easily generate debris, there is no adverse effect on other electronic components and members. Further, even when the chip-type electronic component is miniaturized and the bonding area between the external electrode and the base is reduced, not only can the bonding area be increased by providing the concave portion, but also the tip of the external electrode which is most easily peeled off. Since a part can be provided in the concave portion, peeling of the external electrode can be further prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a chip-type electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a chip-type electronic component according to an embodiment of the present invention.

FIG. 3 is a perspective view showing a chip-type electronic component according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a method for manufacturing a chip-type electronic component according to an embodiment of the present invention.

FIG. 5 is a perspective view showing a method for manufacturing a chip-type electronic component according to an embodiment of the present invention.

FIG. 6 is a perspective view showing a method of manufacturing a chip-type electronic component according to an embodiment of the present invention.

FIG. 7 is a perspective view showing a method for manufacturing a chip-type electronic component according to an embodiment of the present invention.

FIG. 8 is a sectional view showing a chip-type electronic component according to an embodiment of the present invention.

FIG. 9 is a perspective view showing a chip-type electronic component according to another embodiment of the present invention.

FIG. 10 is a perspective view showing a conventional chip-type electronic component.

FIG. 11 is a perspective view showing a conventional chip-type electronic component.

FIG. 12 is a perspective view showing a conventional chip-type electronic component.

FIG. 13 is a perspective view showing a conventional method of manufacturing a chip-type electronic component.

FIG. 14 is a perspective view showing a conventional method of manufacturing a chip-type electronic component.

FIG. 15 is a perspective view showing a conventional method for manufacturing a chip-type electronic component.

FIG. 16 is a perspective view showing a conventional method of manufacturing a chip-type electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Base 11a, 11b surface 11c, 11d, 11e, 11f Side surface 12, 17 Internal conductor 15 Concavity 16 External electrode

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Sumio Tate 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E001 AB03 AF04 AH01 AH09 AJ02 5E070 AA01 AB04 CB13

Claims (5)

[Claims] An inner conductor having an inductance component;
A substantially rectangular parallelepiped base in which the internal conductor is embedded, a lead portion exposed on a pair of first surface portions facing the base and electrically connected to the internal conductor, and joined to the lead portion provided on the base. A pair of external electrodes and a pair of concave portions provided on a pair of second surface portions different from the pair of first surface portions of the base, each of which is stepped down from other portions and further discontinuous with each other, A chip-type electronic component, wherein a tip of the external electrode is embedded in a pair of recesses. 2. The chip-type electronic component according to claim 1, wherein a lead portion is provided between the pair of concave portions. 3. The chip-type electronic component according to claim 1, wherein the recess has an opening in one first surface portion. 4. A method according to claim 1, wherein said first electrode is located between a pair of external electrodes.
2. The chip-type electronic component according to claim 1, wherein a groove-like concave portion having no opening is provided on the surface of the chip-shaped electronic component. 5. An internal forming film comprising a base, a conductor or a resistor embedded in the base and partially exposed to the outside, and electrically connected to the internal forming film and provided on the base. A chip-type electronic component comprising: an external electrode provided; and a concave portion provided on a surface portion of the base and provided with a tip of the external electrode.