JP2002301412A - Method and apparatus for coating metalic substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reliably apply a coating liquid without catching air in the surface of a metalic substrate. SOLUTION: The surface of a substrate W made of a metal is subjected to a corona discharge treatment to improve the wettability of the substrate W. Then, the substrate W is sent to a dip tank 4 and guided by a guide roller 4a to be sent outside. The surface of the substrate W with improved wettability by the corona discharge treatment can be reliably and evenly coated with a coating liquid 2 in the dip tank 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for applying a metal substrate.

[0002]

2. Description of the Related Art Conventionally, as a method of applying a metal base material,
As shown in FIGS. 2A and 2B, a solvent 12 is sprayed onto the metal base material W from a solvent spraying device 11 to wet the base material W with the solvent 12.
There is a known method. Here, FIG. 2A is a schematic view showing a method of applying a metal base material, and FIG. 2B is an enlarged view of a portion A in FIG. 2A.

[0003] The metal base material W whose surface is wet by the solvent 12 then enters the dip tank 4 containing the coating liquid 2 and is discharged outward through the guide rollers 4a. During this time, the solvent 12 and the coating liquid 2 are laminated and applied to the surface of the base material W (FIG. 2B).

[0004] Alternatively, as shown in FIG.
Is fed into the dip tank 4 in which the coating liquid 2 is stored, and the substrate W is moved in and out of the coating liquid 2 several times by a plurality of guide rollers 4a. is there.

[0005]

In the coating method shown in FIG. 2, since the solvent W is previously applied to the substrate W, the substrate W
No air is trapped between the coating liquid 2 and the coating liquid 2. However, since the solvent 12 is interposed between the base material W and the coating liquid 2, a concentration distribution occurs in the thickness direction of the coating film composed of the solvent 12 and the coating liquid 2, and the accuracy of the product formed of the base material W deteriorates. Resulting in.

In the coating method shown in FIG. 3, since the base material W moves in and out of the coating liquid 2 in the dipping tank 4 several times, no air is trapped between the base material W and the coating liquid 2. However, it is necessary to provide a plurality of guide rollers 4a, and the dip tank 4 becomes large. It is also expected that the coating solution 2 in the dip tank 4 will deteriorate.

[0007] The present invention has been made in view of such a point, and it is possible to prevent the entrainment of air between the base material and the coating solution and to obtain a good metal coating film. An object of the present invention is to provide a method and an apparatus for applying a substrate.

[0008]

SUMMARY OF THE INVENTION The present invention comprises a step of subjecting a surface of a metal substrate to a corona discharge treatment, and immersing the metal substrate subjected to the corona discharge treatment in a dip tank containing a coating liquid. And a step of applying a coating liquid to the surface of the material.

The present invention is a method for applying a metal substrate, which comprises applying a resist solution contained in a dipping tank to the surface of the substrate.

According to the present invention, there is provided a corona discharge treatment apparatus for performing a corona discharge treatment on a surface of a metal substrate, wherein a coating liquid is stored,
A coating apparatus for a metal substrate, comprising: a dip tank for immersing a metal substrate and applying a coating solution to a surface of the substrate.

According to the present invention, the surface of a metal substrate is subjected to a corona discharge treatment to improve the wettability of the substrate surface, whereby the coating liquid can be applied without entrapping air on the substrate surface. It can be applied reliably.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing a method for applying a metal substrate according to the present invention.

As shown in FIG. 1, a metal substrate coating device 10 includes a pair of corona discharge treatment devices 8 for performing a corona discharge treatment on the surface of a metal substrate W, and a coating liquid (eg, a resist).
And a dip tank 4 for immersing the substrate W and applying the coating liquid 2 to the surface of the substrate W.

Each corona discharge treatment device 8 has an electrode 5 and a dielectric roll 6, and the electrode 5 and the dielectric roll 6
A power supply 7 for applying a high voltage is connected between the electrode 5 and the dielectric roll 6.

In the dip tank 4, a guide roller 4a for guiding the base material W is disposed.

Next, the operation of the embodiment having the above-described configuration will be described.

As shown in FIG. 1, first, a metal base material W such as an iron plate is supplied, and the base material W is sent to a pair of corona discharge treatment devices 8 including electrodes 5 and dielectric rolls 6.

A high voltage is applied between the electrode 5 and the dielectric roll 6 of each corona discharge treatment device 8 by a power supply 7,
Corona discharge occurs between the electrode 5 and the dielectric roll 6.

When the substrate W passes through the corona discharge region generated between the electrode 5 and the dielectric roll 6, oil and the like adhering to the surface of the substrate W are removed, and electrons are deposited on the surface of the substrate W. As a result of the collision, irregularities at the molecular level are formed on the surface of the substrate W. Further, the molecular bond changes on the surface of the substrate W due to the collision energy when electrons collide with the surface of the substrate W, thereby generating a hydrophilic group on the surface of the substrate W.

The substrate W is subjected to the above-described corona discharge between the electrode 5 and the dielectric roll 6, and as a result, the wettability of the surface of the substrate W is improved.

Next, the substrate W is fed into the dip tank 4, guided by the guide rollers 4a, and then discharged outward. During this time, a dipping tank 4 is placed on the surface of the substrate W having improved wettability.
The application liquid 2 stored in the inside is applied.

As described above, according to the present embodiment, the coating liquid 2 can be reliably applied to the surface of the substrate W having improved wettability without involving air.

[0023]

EXAMPLES Next, specific examples of the present invention will be described.

In this embodiment, the substrate was subjected to a corona discharge treatment under the following conditions, and then a coating solution was applied to the surface of the substrate.

[0025] (2) Application result When the application liquid is applied to the base material under the application conditions described above,
By performing the corona discharge, the wettability on the surface of the substrate was improved. As a result, it was possible to reliably apply the coating liquid without air being caught in the surface of the base material. Further, the surface of the coating liquid on the substrate became uniform.

(3) Judgment of wettability Under a coating condition described above, the substrate was subjected to a corona discharge treatment to apply a coating solution. At this time, the contact angle between the substrate and the coating solution was measured to determine the wettability of the substrate.

As a result, the contact angle between the substrate and the coating solution before the corona discharge treatment was 70.3 °, whereas the contact angle between the substrate and the coating solution after the corona discharge treatment was 46.9 °. It became.

As a result, it was confirmed that the wettability of the substrate was improved by the corona discharge treatment.

[0029]

As described above, according to the present invention, the coating liquid can be applied reliably without entraining air on the surface of the substrate. Therefore, the thickness of the coating solution can be kept uniform.

[Brief description of the drawings]

FIG. 1 is a diagram showing a method and an apparatus for applying a metal substrate according to the present invention.

FIG. 2 is a view showing a conventional method of applying a metal substrate.

FIG. 3 is a view showing a conventional method of applying a metal base material.

[Explanation of symbols]

 2 Coating liquid 4 Dip tank 5 Electrode 6 Dielectric roll 7 Power supply 8 Corona discharge treatment device 10 Coating device W Base material

Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court II (Reference) B05D 7/24 301 B05D 7/24 301R G03F 7/16 501 G03F 7/16 501 (72) Inventor Eiji Aizawa Tokyo 1-1-1, Ichigaya-Kagacho, Shinjuku-ku, Tokyo F-term (reference) in Dai Nippon Printing Co., Ltd. 2H025 AA18 DA18 EA01 EA04 4D075 AB03 AB32 BB49X CA35 CA47 DA04 DB02 EA19 4F040 AA24 AB04 AC02 BA42 DB09 DB10 4F042 AA22 CA01 DA05 ED05

Claims (3)

[Claims] 1. A step of applying a corona discharge treatment to the surface of a metal base material, and dipping the metal base material subjected to the corona discharge treatment into a dip tank containing a coating liquid to apply the coating liquid to the surface of the base material. A method for applying a metal substrate, comprising: 2. A method for applying a metal substrate, comprising applying a resist solution contained in a dipping tank to the surface of the substrate. 3. A corona discharge treatment device for performing a corona discharge treatment on a surface of a metal base material, a dip tank containing a coating liquid, dipping the metal base material and applying the coating liquid to the surface of the base material, A coating device for a metal substrate, comprising: