JP6979632B2 - Coating method and coating equipment - Google Patents

Coating method and coating equipment Download PDF

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JP6979632B2
JP6979632B2 JP2018036070A JP2018036070A JP6979632B2 JP 6979632 B2 JP6979632 B2 JP 6979632B2 JP 2018036070 A JP2018036070 A JP 2018036070A JP 2018036070 A JP2018036070 A JP 2018036070A JP 6979632 B2 JP6979632 B2 JP 6979632B2
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JP2019150750A (en
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誠 川田
道朗 吉野
浩 田辺
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Panasonic Intellectual Property Management Co Ltd
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Description

本発明は、リチウムイオン二次電池などに用いられる電池極板の製造方法および製造装置に関するものである。 The present invention relates to a method and an apparatus for manufacturing a battery electrode plate used for a lithium ion secondary battery or the like.

電池極板は、供給ロールから巻取りロールまで走行中の帯状の基材に対して、スリットダイ先端から塗工液を吐出することで、均一な厚みの塗膜を形成し、それらを乾燥させることで製造される。塗工液は活物質、バインダー、増粘剤、溶媒を含んでなる。またこれら極板は、正極極板と負極極板とに大別されるが、それぞれの極板をセパレータを介して挟み、巻回または積層させて缶内に電解液とともに封入させることにより、電池は構成されている。 The battery electrode plate forms a coating film of uniform thickness by discharging the coating liquid from the tip of the slit die onto the strip-shaped base material running from the supply roll to the take-up roll, and dries them. It is manufactured by. The coating liquid contains an active material, a binder, a thickener, and a solvent. Further, these electrode plates are roughly classified into a positive electrode plate and a negative electrode plate, and each electrode plate is sandwiched between separators, wound or laminated, and sealed in a can together with an electrolytic solution to form a battery. Is configured.

特に、近年は車載用電池としての普及が進む中で、高容量化および安全性が課題となっており、いかに均一な厚みかつ高密度な塗膜を有する極板を製造するかが重要となっている。電池の高容量化を実現するためには、基材の使用量を削減しつつ活物質の量を増やす必要があり、そのためには基材の両面に塗膜を形成する必要がある。また低価格化が進行する中で、いかに生産性を高めるかが課題であり、様々な技術が開発されている。 In particular, with the increasing spread as in-vehicle batteries in recent years, increasing capacity and safety have become issues, and it is important how to manufacture a electrode plate having a uniform thickness and a high-density coating film. ing. In order to increase the capacity of the battery, it is necessary to increase the amount of active material while reducing the amount of the base material used, and for that purpose, it is necessary to form coating films on both sides of the base material. In addition, as price reduction progresses, how to improve productivity is an issue, and various technologies are being developed.

例えば、バックアップロールにより基材を支持しながら上面に塗膜を形成し、乾燥炉にて乾燥させた後に、基材面を反転させて反対面にもバックアップロールにより基材を支持しながら塗膜を形成する方法が従来提案されている。 For example, a coating film is formed on the upper surface while supporting the base material with a backup roll, dried in a drying oven, and then the base material surface is inverted and the coating film is also supported on the opposite surface with the backup roll. The method of forming the above has been conventionally proposed.

この方法により、塗膜を安定的に製造できるものの、乾燥工程が2箇所必要になることや、下面に塗膜を形成する際に面をひっくり返す必要があるため、設備コストが大きくなる、工程が長くなる、スペースが必要になるなどの問題があり、生産性が低い課題を有していた。 Although the coating film can be stably produced by this method, the equipment cost increases because two drying processes are required and the surface needs to be turned over when forming the coating film on the lower surface. There were problems such as lengthening and the need for space, and there was a problem of low productivity.

上記課題を解決する方法として、特許文献1がある。 Patent Document 1 is a method for solving the above problems.

特許4354598号Patent No. 4354598 WO2011/001648A1WO2011 / 001648A1

例えば特許文献1のように、第1,第2スリットダイの吐出口を、基材を間に挟んで対向させて、第1,第2スリットダイから塗工液を同時に吐出させながら、基材の両面に塗膜を形成し、また同時に乾燥させることで基材両面に極板を一括で形成する方法では、スリットダイごとに吐出圧力が異なる場合は、基材位置がその影響を受け変位しやすく、上面と下面の塗工液の塗布厚みに差異が生じるという課題がある。 For example, as in Patent Document 1, the discharge ports of the first and second slit dies are opposed to each other with the base material sandwiched between them, and the coating liquid is simultaneously discharged from the first and second slit dies while the base material is discharged. In the method of forming the coating film on both sides of the substrate and drying it at the same time to form the electrode plates on both sides of the substrate at once, if the discharge pressure is different for each slit die, the position of the substrate will be affected and displaced. There is a problem that it is easy to make a difference in the coating thickness of the coating liquid on the upper surface and the lower surface.

また、別の形態として例えば特許文献2のように、下面はバックアップロールにより基材を支持しながらスリットダイにより塗膜を形成し、その基材を水平方向に搬送して走行させ、基材の鉛直下面に鉛直上方に吐出口を有したダイを設置し、基材の下面に塗膜を形成することで基材両面に極板を一括で形成する方法が提案されている。 Further, as another form, for example, as in Patent Document 2, a coating film is formed on the lower surface by a slit die while supporting the base material by a backup roll, and the base material is horizontally conveyed and run to run the base material. A method has been proposed in which a die having a discharge port vertically above the vertical lower surface is installed, and a coating film is formed on the lower surface of the base material to collectively form electrode plates on both sides of the base material.

しかしながらこの方法においては、連続的に塗膜を形成する場合には適しているものの、間欠的に塗膜を形成する場合には、基材と塗膜重量による基材の撓み、及び間欠時における塗工液がスリットダイ内部に引く際の表面張力によって基材が引き込まれやすいことから基材の幅方向の中央部が、スリットダイと基材間の距離、つまり、塗工ギャップが安定せず、図7に示すように、基材4に塗工液が塗布された塗工部Bと塗工部Bの間に、塗工液を塗布しないはずの未塗工部Cを形成しようとした場合に、塗工液を塗布しないはずの未塗工部Cに、先行する塗工部Bの終端の塗工液を引き連れながら徐々に塗工液供給が停止することで、塗工部Bの終端に尾引き5が発生して、塗工部の終端10の形状が悪化するという課題がある。図8に塗工部の終端10の形状の良い事例を示す。 However, although this method is suitable for continuously forming a coating film, in the case of intermittently forming a coating film, the base material is bent due to the weight of the base material and the coating film, and the coating film is intermittently formed. Since the base material is easily pulled in by the surface tension when the coating liquid is pulled into the slit die, the distance between the slit die and the base material, that is, the coating gap is not stable at the center in the width direction of the base material. As shown in FIG. 7, an attempt was made to form an uncoated portion C to which the coating liquid should not be applied between the coating portion B to which the coating liquid was applied to the base material 4 and the coating portion B. In this case, the coating liquid supply to the uncoated portion C, which should not be coated with the coating liquid, is gradually stopped while bringing the coating liquid at the end of the preceding coating portion B to the uncoated portion C, whereby the coating liquid supply of the coating portion B is stopped. There is a problem that the tailing 5 is generated at the end and the shape of the end 10 of the coated portion is deteriorated. FIG. 8 shows a good example of the shape of the end 10 of the coated portion.

本発明は、上記課題を鑑み、基材にスリットダイを用いて塗工液を間欠的にかつ均一な厚みにて塗工しながら、基材の撓みが発生しても尾引きが無い良好な電池極板を形成することを目的とする。 In view of the above problems, the present invention is good in that there is no tailing even if the base material is bent while the coating liquid is intermittently and uniformly applied to the base material using a slit die. The purpose is to form a battery electrode.

本発明の塗工方法は、基材に間欠的に塗膜を形成する塗工方法であって、水平に走行している前記基材に対して、前記基材の下面に対向して配置したスリットダイの上流側スリットダイと、前記スリットダイの下流側スリットダイの間の吐出口より上方に向かって塗工液を吐出することで前記基材の下面に塗膜を形成し、前記スリットダイの前記上流側スリットダイと前記基材の下面との距離は変更せずに前記下流側スリットダイを下方に移動させ、その後に前記スリットダイを上方に移動させて前記上流側スリットダイを前記基材の下面に接触させ、その後に前記スリットダイへの前記塗工液の供給を停止させ、前記塗膜を乾燥させることを特徴とする。 The coating method of the present invention is a coating method for intermittently forming a coating film on a base material, and is arranged so as to face the lower surface of the base material with respect to the horizontally running base material. the upstream side slit die of the slit die, to form a coating film on the lower surface of the substrate by discharging a coating liquid upward from the discharge port between the downstream slit die of the slit die, the slit The downstream side slit die is moved downward without changing the distance between the upstream side slit die of the die and the lower surface of the base material, and then the slit die is moved upward to move the upstream side slit die. It is characterized in that the coating film is brought into contact with the lower surface of the base material, and then the supply of the coating liquid to the slit die is stopped to dry the coating film.

また、基材に間欠的に塗膜を形成する塗工方法であって、水平に走行している前記基材に対して、前記基材の下面に対向して配置したスリットダイの上流側スリットダイと、前記スリットダイの下流側スリットダイとの間の吐出口より上方に向かって塗工液を吐出することで前記基材の下面に塗膜を形成し、前記下流側スリットダイが下降を開始し、前記下流側スリットダイが下降を終了する前に前記スリットダイの全体が上昇を開始し、そして前記上流側スリットダイを前記基材の下面に接触させ、その後に前記スリットダイへの前記塗工液の供給を停止させ、前記塗膜を乾燥させることを特徴とする。 Further, it is a coating method for intermittently forming a coating film on a base material, and is an upstream slit of a slit die arranged so as to face the lower surface of the base material with respect to the base material running horizontally. A coating film is formed on the lower surface of the base material by discharging the coating liquid upward from the discharge port between the die and the slit die on the downstream side of the slit die, and the downstream slit die descends. The entire slit die begins to rise before the downstream slit die finishes descending, and the upstream slit die is brought into contact with the lower surface of the substrate, followed by the said to the slit die. It is characterized in that the supply of the coating liquid is stopped and the coating film is dried.

また、基材に間欠的に塗膜を形成する塗工方法であって、水平に走行している前記基材に対して、前記基材の下面に対向して配置したスリットダイの上流側スリットダイと、前記スリットダイの下流側スリットダイとの間の吐出口より上方に向かって塗工液を吐出することで前記基材の下面に塗膜を形成し、前記スリットダイを上方に移動させて前記上流側スリットダイを前記基材の下面に接触させ、その後に前記下流側スリットダイを下方に移動させ、前記上流側スリットダイを前記基材の下面に接触させた状態で前記スリットダイへの前記塗工液の供給を停止させ、前記塗膜を乾燥させることを特徴とする。 Further, it is a coating method for intermittently forming a coating film on a base material, and is an upstream slit of a slit die arranged so as to face the lower surface of the base material with respect to the base material running horizontally. A coating film is formed on the lower surface of the base material by discharging the coating liquid upward from the discharge port between the die and the slit die on the downstream side of the slit die, and the slit die is moved upward. The upstream slit die is brought into contact with the lower surface of the base material, then the downstream slit die is moved downward, and the upstream slit die is brought into contact with the lower surface of the base material to the slit die. It is characterized in that the supply of the coating liquid is stopped and the coating film is dried.

また、基材に間欠的に塗膜を形成する塗工方法であって、水平に走行している前記基材に対して、前記基材の下面に対向して配置したスリットダイの上流側スリットダイと、前記スリットダイの下流側スリットダイとの間の吐出口より上方に向かって塗工液を吐出することで前記基材の下面に塗膜を形成し、前記スリットダイ上昇を開始させ、前記上流側スリットダイが前記基材に当接する前に前記下流側スリットダイ下降を開始させ、
前記上流側スリットダイを前記基材の下面に接触させた状態で前記スリットダイへの前記塗工液の供給を停止させ、前記塗膜を乾燥させることを特徴とする。
Further, it is a coating method for intermittently forming a coating film on a base material, and is an upstream slit of a slit die arranged so as to face the lower surface of the base material with respect to the horizontally running base material. die and to form a coating film on the lower surface of the substrate by discharging a coating liquid upward from the discharge port between the downstream slit die of the slit die, to initiate an increase in the slit die , the upstream slit die to start lowering of the downstream slit die before contact with the said substrate,
It is characterized in that the supply of the coating liquid to the slit die is stopped in a state where the upstream slit die is in contact with the lower surface of the base material, and the coating film is dried.

また、前記上流側スリットダイを前記基材の下面に接触させた状態は、前記基材の幅方向全てで前記上流側スリットダイが接触している、ことが好ましい。 Further, in the state where the upstream slit die is in contact with the lower surface of the base material, it is preferable that the upstream slit die is in contact with the lower surface of the base material in all the width directions of the base material.

本発明の塗工装置は、上手から下手へ向かって走行中の基材に間欠的に塗膜を形成する塗工装置であって、上流側スリットダイと下流側スリットダイの間の吐出口から前記基材の下方の面に対して塗工液を供給するスリットダイと、前記スリットダイへの前記塗工液の供給を停止する前に、前記スリットダイの上流側スリットダイを前記基材の下面に接触させて支持するように前記スリットダイに移動を指示する制御部とを有し、前記制御部は、前記スリットダイを上方に移動させて前記上流側スリットダイを前記基材の下面に接触させ、その後に前記下流側スリットダイを下方に移動させ、前記上流側スリットダイを前記基材の下面に接触させた状態で前記スリットダイへの前記塗工液の供給を停止させる、ことを特徴とする。 The coating device of the present invention is a coating device that intermittently forms a coating film on a substrate traveling from good to bad, and is a discharge port between an upstream slit die and a downstream slit die. The slit die that supplies the coating liquid to the lower surface of the base material from the substrate, and the slit die on the upstream side of the slit die before the supply of the coating liquid to the slit die is stopped. the lower surface of the contacting on the lower surface have a control unit for instructing the movement to said slit die so as to support it, the control unit, of the substrate the upstream slit die by moving the slit die upward After that, the downstream side slit die is moved downward, and the supply of the coating liquid to the slit die is stopped in a state where the upstream side slit die is in contact with the lower surface of the base material. It is characterized by.

また、上手から下手へ向かって走行中の基材に間欠的に塗膜を形成する塗工装置であって、上流側スリットダイと下流側スリットダイとの間の吐出口から前記基材の下方の面に対して塗工液を供給するスリットダイと、前記スリットダイへの前記塗工液の供給を停止する前に、前記スリットダイの上流側スリットダイを前記基材の下面に接触させて支持するように前記スリットダイに移動を指示する制御部とを有し、前記制御部は、前記下流側スリットダイの下降を開始させ、前記下流側スリットダイが下降を終了する前に前記スリットダイの全体の上昇を開始させ、そして前記上流側スリットダイを前記基材の下面に接触させ、その後に前記スリットダイへの前記塗工液の供給を停止させる、ことを特徴とする。 Further, it is a coating device that intermittently forms a coating film on a base material running from good to bad, and is below the base material from a discharge port between an upstream side slit die and a downstream side slit die. Before stopping the supply of the coating liquid to the slit die and the slit die that supplies the coating liquid to the surface of the surface, the upstream side slit die of the slit die is brought into contact with the lower surface of the base material. The control unit has a control unit for instructing the slit die to move so as to support the slit die, and the control unit starts the lowering of the downstream side slit die and before the downstream side slit die finishes the lowering. It is characterized in that the ascending of the entire surface is started, and the upstream slit die is brought into contact with the lower surface of the base material, and then the supply of the coating liquid to the slit die is stopped .

また、上手から下手へ向かって走行中の基材に間欠的に塗膜を形成する塗工装置であって、上流側スリットダイと下流側スリットダイとの間の吐出口から前記基材の下方の面に対して塗工液を供給するスリットダイと、前記スリットダイへの前記塗工液の供給を停止する前に、前記スリットダイの上流側スリットダイを前記基材の下面に接触させて支持するように前記スリットダイに移動を指示する制御部とを有し、前記制御部は、前記スリットダイの上昇を開始させ、前記上流側スリットダイが前記基材に当接する前に前記下流側スリットダイの下降を開始させ、前記上流側スリットダイを前記基材の下面に接触させた状態で前記スリットダイへの前記塗工液の供給を停止させる、ことを特徴とするFurther, it is a coating device that intermittently forms a coating film on a base material running from good to bad, and is below the base material from a discharge port between an upstream side slit die and a downstream side slit die. Before stopping the supply of the coating liquid to the slit die and the slit die that supplies the coating liquid to the surface of the surface, the upstream side slit die of the slit die is brought into contact with the lower surface of the base material. The control unit has a control unit for instructing the slit die to move so as to support the slit die, and the control unit starts the ascending of the slit die, and the downstream side before the upstream side slit die abuts on the base material. The feature is that the lowering of the slit die is started, and the supply of the coating liquid to the slit die is stopped in a state where the upstream slit die is in contact with the lower surface of the base material.

本発明の塗工方法および塗工装置によれば、スリットダイを基材に接触させることで、スリットダイと基材との隙間である塗工ギャップを幅方向で強制的に一定とすることで、間欠時における終端の尾引きが無い、良好な電池極板を製造することができる。 According to the coating method and coating apparatus of the present invention, by bringing the slit die into contact with the base material, the coating gap, which is the gap between the slit die and the base material, is forcibly made constant in the width direction. , It is possible to manufacture a good battery electrode plate without tailing at the end at the time of intermittent operation.

このような構成にすることにより、塗膜形成工程の生産性を上げることができることから、電池の高容量化を安価で実現できる。また両面に塗膜が形成されている方が、塗膜を含む基材の重量が大きくなることから、基材の走行方向のたわみも大きくなる。したがって、スリットダイを基材に接触させることで、スリットダイと基材との隙間である塗工ギャップを幅方向で強制的に一定とすることで、間欠時における終端の尾引きが改善される。 With such a configuration, the productivity of the coating film forming process can be increased, so that the capacity of the battery can be increased at low cost. Further, when the coating film is formed on both surfaces, the weight of the base material including the coating film is heavier, so that the deflection of the base material in the traveling direction is also larger. Therefore, by bringing the slit die into contact with the base material, the coating gap, which is the gap between the slit die and the base material, is forcibly made constant in the width direction, thereby improving the tailing of the end at the time of intermittent operation. ..

本発明の塗工方法を実行する塗工装置の構成図Configuration diagram of a coating device that executes the coating method of the present invention 本発明の実施の形態1の塗工方法の基材の両端における(a)塗工中の説明図と、(b)その後にスリットダイの下流側スリットダイ2Lを下降させた状態の説明図と、その後にスリットダイを上昇させて上流側スリットダイ2Uを基材4の下面に当接させた状態の説明図と、(d)塗工液の供給を停止した際に基材がスリットダイ吐出口に引き込まれて変位する様子の説明図と、(e)基材が鉛直上方に戻る過程で液切れが進んでいる様子の説明図、および(f)間欠動作は終了した様子の説明図An explanatory diagram during (a) coating at both ends of the base material of the coating method according to the first embodiment of the present invention, and (b) an explanatory diagram of a state in which the slit die 2L on the downstream side of the slit die is subsequently lowered. After that, an explanatory diagram of a state in which the slit die is raised to bring the upstream slit die 2U into contact with the lower surface of the base material 4, and (d) the base material discharges the slit die when the supply of the coating liquid is stopped. An explanatory diagram of how the substrate is pulled into the outlet and displaced, (e) an explanatory diagram of how the liquid is running out in the process of returning the base material vertically upward, and (f) an explanatory diagram of how the intermittent operation is completed. 上流ギャップH1の説明図Explanatory drawing of upstream gap H1 基材の中央における(a)塗工中の説明図と、(b)その後にスリットダイの下流側スリットダイ2Lを下降させた状態の説明図と、その後にスリットダイを上昇させて上流側スリットダイ2Uを基材4の下面に当接させた状態の説明図と、(d)塗工液の供給を停止した際に基材がスリットダイ吐出口に引き込まれて変位する様子の説明図と、(e)基材が鉛直上方に戻る過程で液切れが進んでいる様子の説明図、および(f)間欠動作は終了した様子の説明図An explanatory view of (a) during coating in the center of the base material, (b) an explanatory view of a state in which the downstream side slit die 2L of the slit die is lowered after that, and then the slit die is raised to raise the upstream side slit. An explanatory diagram of a state in which the die 2U is in contact with the lower surface of the base material 4, and an explanatory diagram of (d) a state in which the base material is drawn into the slit die discharge port and displaced when the supply of the coating liquid is stopped. , (E) An explanatory diagram showing that the liquid is running out in the process of returning the base material vertically upward, and (f) an explanatory diagram showing how the intermittent operation is completed. 本発明の実施の形態2の塗工方法の基材の両端における(a)塗工中の説明図と、(b)その後にスリットダイの下流側スリットダイ2Lを下降させた状態の説明図と、その後にスリットダイを上昇させて上流側スリットダイ2Uを基材4の下面に当接させた状態の説明図と、(d)塗工液の供給を停止した際に基材がスリットダイ吐出口に引き込まれて変位する様子の説明図と、(e)基材が鉛直上方に戻る過程で液切れが進んでいる様子の説明図、および(f)間欠動作は終了した様子の説明図An explanatory diagram during (a) coating at both ends of the base material of the coating method according to the second embodiment of the present invention, and (b) an explanatory diagram of a state in which the slit die 2L on the downstream side of the slit die is subsequently lowered. After that, an explanatory diagram of a state in which the slit die is raised to bring the upstream slit die 2U into contact with the lower surface of the base material 4, and (d) the base material discharges the slit die when the supply of the coating liquid is stopped. An explanatory diagram of how the substrate is pulled into the outlet and displaced, (e) an explanatory diagram of how the liquid is running out in the process of returning the base material vertically upward, and (f) an explanatory diagram of how the intermittent operation is completed. 基材の中央における(a)塗工中の説明図と、(b)その後にスリットダイの下流側スリットダイ2Lを下降させた状態の説明図と、その後にスリットダイを上昇させて上流側スリットダイ2Uを基材4の下面に当接させた状態の説明図と、(d)塗工液の供給を停止した際に基材がスリットダイ吐出口に引き込まれて変位する様子の説明図と、(e)基材が鉛直上方に戻る過程で液切れが進んでいる様子の説明図、および(f)間欠動作は終了した様子の説明図An explanatory view of (a) during coating in the center of the base material, (b) an explanatory view of a state in which the downstream side slit die 2L of the slit die is lowered after that, and then the slit die is raised to raise the upstream side slit. An explanatory diagram of a state in which the die 2U is in contact with the lower surface of the base material 4, and an explanatory diagram of (d) a state in which the base material is drawn into the slit die discharge port and displaced when the supply of the coating liquid is stopped. , (E) An explanatory diagram showing that the liquid is running out in the process of returning the base material vertically upward, and (f) an explanatory diagram showing how the intermittent operation is completed. 尾引きが発生した悪い塗工例を示す平面図Top view showing an example of bad coating with tailing 良好な塗工例を示す平面図Plan view showing good coating examples 塗工装置の塗工開始前の状態を示す(a)構成図と(b)そのA−A矢視図および(c)B−B断面図(A) block diagram, (b) arrow view of AA, and (c) sectional view of BB showing the state of the coating device before the start of coating. 塗工装置の塗工中の状態を示す(a)構成図と(b)そのA−A矢視図と(c)B−B断面図および(d)基材の両縁部を基材支持機構で把持する従来技術における塗工後の塗工幅方向における下面塗工膜断面形状詳細図(A) A block diagram showing the state of the coating device during coating, (b) an arrow view of AA, (c) a sectional view taken along the line BB, and (d) supporting both edges of the base material. Detailed view of the cross-sectional shape of the lower surface coating film in the coating width direction after coating in the prior art gripped by the mechanism. 従来の塗工方法の基材の両端における(a)塗工中の説明図と(b)塗工を停止した際に基材がスリットダイ吐出口に引き込まれて変位する様子の説明図と(c)その後に基材が鉛直上方に戻る過程で液切れした様子の説明図および(d)間欠動作は終了した様子の説明図(A) An explanatory diagram during coating at both ends of the substrate of the conventional coating method, and (b) an explanatory diagram of how the substrate is pulled into the slit die discharge port and displaced when coating is stopped. c) An explanatory diagram showing how the base material ran out in the process of returning vertically upward after that, and (d) an explanatory diagram showing how the intermittent operation was completed. 従来の塗工方法の基材の中央における(a)塗工中の説明図と(b)塗工を停止した際に基材がスリットダイ吐出口に引き込まれて変位する様子の説明図と(c)その後に基材が鉛直上方に戻る過程で液切れした様子の説明図と(d)間欠動作は終了した様子の説明図および(e)尾引きが発生した様子の説明図(A) An explanatory diagram during coating in the center of the base material of the conventional coating method, and (b) an explanatory diagram of how the base material is pulled into the slit die discharge port and displaced when coating is stopped. c) An explanatory diagram of how the base material ran out in the process of returning vertically upward after that, (d) an explanatory diagram of how the intermittent operation was completed, and (e) an explanatory diagram of how tailing occurred.

本発明の各実施の形態を図面に基づいて説明する。 Each embodiment of the present invention will be described with reference to the drawings.

各実施の形態の説明に先立って、従来の塗工方法では塗工部の終端形状が悪化する原理について説明する。 Prior to the description of each embodiment, the principle that the terminal shape of the coated portion is deteriorated in the conventional coating method will be described.

塗工装置は、図9(a)に示すように、巻装体40から引き出されてバックアップロール7と基材支持装置3を経由して移送されている基材4は、基材支持装置3の後段に設けられた乾燥装置6を通過して完成した両面塗工基材が巻き取りリール41に巻き取られている。バックアップロール7の位置には、基材4の上面に塗工液を塗る第一ダイヘッド1が設けられている。バックアップロール7と基材支持装置3の間の位置には、基材4の下面に塗工液を塗る第二ダイヘッド2が設けられている。Xは第二ダイヘッド2と基材4との隙間である塗工ギャップを示している。 As shown in FIG. 9A, the coating device 4 is drawn out from the winding body 40 and transferred via the backup roll 7 and the base material support device 3, and the base material 4 is the base material support device 3. The double-sided coating base material completed by passing through the drying device 6 provided in the subsequent stage is wound on the take-up reel 41. At the position of the backup roll 7, a first die head 1 for applying a coating liquid to the upper surface of the base material 4 is provided. At a position between the backup roll 7 and the base material support device 3, a second die head 2 for applying a coating liquid to the lower surface of the base material 4 is provided. X indicates a coating gap which is a gap between the second die head 2 and the base material 4.

図9(b)に基材支持装置3の位置でのA−A矢視図を示す。3a,3bは基材支持装置3を構成する押し付けローラで、基材4の両縁部を支持している。Aは第一ダイヘッド1によって塗工された上面塗工部、Bは第二ダイヘッド2によって塗工された下面塗工部である。 FIG. 9B shows an arrow view of AA at the position of the base material support device 3. Reference numerals 3a and 3b are pressing rollers constituting the base material support device 3, and support both edges of the base material 4. A is a top surface coated portion coated by the first die head 1, and B is a bottom surface coated portion coated by the second die head 2.

図9(c)に第二ダイヘッド2の位置でのB−B断面図を示す。 FIG. 9C shows a sectional view taken along line BB at the position of the second die head 2.

図9(b)に示すように、塗工前の状態では、基材4の両縁部を基材支持装置3で把持しつつ流れ方向のテンション調整を行うことなどにより、基材4の流れ方向・幅方向共に基材4の撓みは無い。図9(c)に示すように、幅方向の塗膜重量精度に影響するスリットダイ2と基材4との隙間である塗工ギャップXは塗工幅方向において一定となっている。 As shown in FIG. 9B, in the state before coating, the flow of the base material 4 is adjusted by adjusting the tension in the flow direction while grasping both edges of the base material 4 with the base material support device 3. There is no bending of the base material 4 in both the direction and the width direction. As shown in FIG. 9C, the coating gap X, which is the gap between the slit die 2 and the base material 4, which affects the accuracy of the coating film weight in the width direction, is constant in the coating width direction.

図10(a)に連続間欠塗工中の状態を示す。図10(b)に基材支持装置3の位置でのA−A矢視図を示す。図10(c)に第二ダイヘッド2の位置でのB−B断面図を示す。図10(d)に塗工後の塗工幅方向における下面塗工膜の断面形状の詳細図を示す。 FIG. 10A shows a state during continuous intermittent coating. FIG. 10B shows an arrow view of AA at the position of the base material support device 3. FIG. 10C shows a sectional view taken along line BB at the position of the second die head 2. FIG. 10D shows a detailed view of the cross-sectional shape of the lower surface coating film in the coating width direction after coating.

しかしながら塗工を継続すると、図10(a)(b)に示すように塗工された塗工液による基材4の重量増加に対し、基材4の両縁部を基材支持装置3で把持しつつ流れ方向のテンション調整を行うことだけでは、基材4を塗工前の状態と同様の高さを保ちながら走行することが困難となり、基材4の長手方向および幅方向の両者において基材4の撓みが発生する。 However, when the coating is continued, both edges of the substrate 4 are subjected to the substrate support device 3 against the increase in the weight of the substrate 4 due to the coating liquid coated as shown in FIGS. 10 (a) and 10 (b). By simply adjusting the tension in the flow direction while gripping, it becomes difficult to run the base material 4 while maintaining the same height as before coating, and it becomes difficult to run the base material 4 in both the longitudinal direction and the width direction of the base material 4. Deflection of the base material 4 occurs.

その結果、図10(c)に示すように、幅方向の塗膜重量精度に影響するスリットダイ2と基材4との隙間である塗工ギャップXが狭くなり、塗工幅方向において不均一となることから、図10(d)に示すように、塗工幅方向中央部の厚みが両端部付近に比べて薄くなって、幅方向の塗膜重量精度が悪化する問題がある。 As a result, as shown in FIG. 10 (c), the coating gap X, which is the gap between the slit die 2 and the base material 4, which affects the coating film weight accuracy in the width direction, becomes narrow and non-uniform in the coating width direction. Therefore, as shown in FIG. 10D, there is a problem that the thickness of the central portion in the coating width direction becomes thinner than that in the vicinity of both end portions, and the weight accuracy of the coating film in the width direction deteriorates.

つまり、塗工を続けると基材4の両端部と中央部では、塗工ギャップが変化してしまう。基材4の幅方向の両端部と中央部におけるスリットダイ2の吐出口の状態の違いを説明する。 That is, if the coating is continued, the coating gap changes between both ends and the center of the base material 4. The difference in the state of the discharge port of the slit die 2 at both ends and the center of the base material 4 in the width direction will be described.

基材4の両端部の状態を図11に、基材4の中央部の状態を図12に示す。 The state of both ends of the base material 4 is shown in FIG. 11, and the state of the central part of the base material 4 is shown in FIG.

基材4の両端部では、図11(a)に示すように基材4に対して鉛直下方に設置したスリットダイ2に塗工液を供給して塗工する状態から、塗工液の供給を停止すると、図11(b)に示すように、塗工液の表面張力により基材4にはスリットダイ2の吐出口側に引き込まれる方向に力が働くことから、基材4が鉛直下方に変位する。そして、図11(c)に示すように、基材4の両端部では塗工ギャップが確保されているため塗工液が切れて、図11(d)に示すように時間の経過とともに塗工液はスリットダイ2の内部に戻る。 At both ends of the base material 4, as shown in FIG. 11A, the coating liquid is supplied from the state in which the coating liquid is supplied to the slit die 2 installed vertically below the base material 4 for coating. When is stopped, as shown in FIG. 11B, the surface tension of the coating liquid exerts a force on the base material 4 in the direction of being drawn into the discharge port side of the slit die 2, so that the base material 4 is vertically downward. Displace to. Then, as shown in FIG. 11 (c), since the coating gap is secured at both ends of the base material 4, the coating liquid runs out, and as shown in FIG. 11 (d), coating is performed with the passage of time. The liquid returns to the inside of the slit die 2.

しかしながら、基材4の中央部では、図12(a)に示すように、基材4の撓みの影響で塗工ギャップが狭くなっている。そして、塗工液の供給を停止すると、図12(b)に示すように、塗工液の表面張力により基材4にはスリットダイ2の吐出口側に引き込まれる方向に力が働くことから、基材4が鉛直下方に変位し更に塗工ギャップが狭くなり、上流側スリットダイ上部に液溜まり8が形成される。そのため図12(c)に示すように、液溜まり8が基材4と離脱しづらくなり、図12(d)に示すように尾引きが発生した状態で塗工される。従って、基材4に塗工された状態は図12(e)に示すように、基材中央部の終端に尾引き5が発生する。 However, in the central portion of the base material 4, as shown in FIG. 12A, the coating gap is narrowed due to the influence of the bending of the base material 4. Then, when the supply of the coating liquid is stopped, as shown in FIG. 12B, a force acts on the base material 4 in the direction of being drawn into the discharge port side of the slit die 2 due to the surface tension of the coating liquid. , The base material 4 is displaced vertically downward, the coating gap is further narrowed, and a liquid pool 8 is formed on the upper part of the upstream slit die. Therefore, as shown in FIG. 12 (c), the liquid pool 8 is difficult to separate from the base material 4, and as shown in FIG. 12 (d), the coating is applied in a state where tailing occurs. Therefore, in the state of being coated on the base material 4, a tail trail 5 is generated at the end of the central portion of the base material, as shown in FIG. 12 (e).

(実施の形態1)
図1〜図4は本発明の塗工方法を実行する塗工装置を示す。
(Embodiment 1)
1 to 4 show a coating apparatus for executing the coating method of the present invention.

この塗工装置は、二次電池や燃料電池などの電極の芯体となる基材4の両面に、塗工液を塗工するものである。搬送方向9の上流側から下流側に向けて、バックアップロール7および上面塗工用のスリットダイ1、下面塗工用スリットダイ2、基材支持装置3および乾燥装置6を有している。スリットダイ2は、搬送方向9に向かって角度θだけ傾けて配置されている。 In this coating device, a coating liquid is applied to both surfaces of a base material 4 which is a core body of an electrode such as a secondary battery or a fuel cell. From the upstream side to the downstream side in the transport direction 9, it has a backup roll 7, a slit die 1 for top coating, a slit die 2 for bottom coating, a base material support device 3, and a drying device 6. The slit die 2 is arranged at an angle θ toward the transport direction 9.

バックアップロール7および下面塗工用スリットダイ1は水平方向に対向している。基材4は下方からバックアップロール7と下面塗工用スリットダイ1の対向部に移動して、さらにバックアップロール7によって向きを変えられてそれ以後は水平方向に一定速度で移動させられる。スリットダイ1は活物質が含有された塗工液を基材4の上面に塗工するための装置である。スリットダイ2は活物質が含有された塗工液を基材4の下面に塗工するための装置である。 The backup roll 7 and the slit die 1 for bottom coating face each other in the horizontal direction. The base material 4 is moved from below to the facing portion between the backup roll 7 and the slit die 1 for bottom coating, is further turned by the backup roll 7, and is subsequently moved horizontally at a constant speed. The slit die 1 is a device for applying a coating liquid containing an active material to the upper surface of the base material 4. The slit die 2 is a device for applying a coating liquid containing an active material to the lower surface of the base material 4.

乾燥装置6は、塗工液が塗工された基材4を乾燥するための装置である。乾燥装置6内では、塗工面を乾燥させるための気体を噴出する気体噴射ノズル60が上下に設けられており、両面塗工された両面塗工基材が噴出される気体によって浮遊状態で搬送される。 The drying device 6 is a device for drying the base material 4 coated with the coating liquid. In the drying apparatus 6, gas injection nozzles 60 for ejecting a gas for drying the coated surface are provided at the top and bottom, and the double-sided coated base material is conveyed in a floating state by the ejected gas. To.

図2に基材4の幅方向の両端部におけるスリットダイ2の動作を示す。図4に基材4の幅方向の中央部におけるスリットダイ2の動作を示す。 FIG. 2 shows the operation of the slit die 2 at both ends of the base material 4 in the width direction. FIG. 4 shows the operation of the slit die 2 in the central portion of the base material 4 in the width direction.

図2(a)に示すように、スリットダイ2は上流側スリットダイ2Uと下流側スリットダイ2Lを有している。基材4の下面に対向するスリットダイ2の吐出口が、上流側スリットダイ2Uの先端と下流側スリットダイ2Lの先端の間に形成されている。スリットダイ2の上流ギャップH1および下流ギャップH2は、用いられる塗工液の特性によっても異なるが、一般的には、0.01mm以上1.0mm以下程度設けられる。 As shown in FIG. 2A, the slit die 2 has an upstream side slit die 2U and a downstream side slit die 2L. A discharge port of the slit die 2 facing the lower surface of the base material 4 is formed between the tip of the upstream slit die 2U and the tip of the downstream slit die 2L. The upstream gap H1 and the downstream gap H2 of the slit die 2 vary depending on the characteristics of the coating liquid used, but are generally provided to be about 0.01 mm or more and 1.0 mm or less.

11は制御部で、基材4の下面に対する上流側スリットダイ2Uの上下位置と、基材4の下面に対する下流側スリットダイ2Lの上下位置を、上流側スリットダイ2Uと下流側スリットダイ2Lを一緒に、または別々に独立して設定位置へ移動させるように制御する。更に制御部11は、スリットダイ2への塗工液の供給/停止のタイミングを指示する。 Reference numeral 11 is a control unit, which sets the vertical position of the upstream slit die 2U with respect to the lower surface of the base material 4 and the vertical position of the downstream slit die 2L with respect to the lower surface of the base material 4, and sets the upstream slit die 2U and the downstream slit die 2L. Control to move to the set position together or separately. Further, the control unit 11 instructs the timing of supplying / stopping the coating liquid to the slit die 2.

上流ギャップH1とは、図3に示すように上流側スリットダイ2Uの頂点P1から基材4の鉛直方向下面までの距離である。 The upstream gap H1 is the distance from the apex P1 of the upstream slit die 2U to the vertical lower surface of the base material 4 as shown in FIG.

下流ギャップH2とは、下流側スリットダイ2Lの頂点P2から基材4の鉛直方向下面までの距離である。 The downstream gap H2 is the distance from the apex P2 of the downstream slit die 2L to the lower surface of the base material 4 in the vertical direction.

制御部11の構成を説明する。 The configuration of the control unit 11 will be described.

図2(a)は基材4の幅方向両端部での塗工中の状態を示している。 FIG. 2A shows a state during coating at both ends of the base material 4 in the width direction.

基材4に塗工液が塗布された塗工部Bと塗工部Bの間に、塗工液を塗布しない未塗工部Cを形成する間欠塗工をするため、制御部11は、塗工液の供給を停止する前に、先ず、図2(b)に示すように下流側スリットダイ2Lを、下流ギャップH2が大きくなるように鉛直下方に移動させる。上流側スリットダイ2Uは図2(a)の塗工中の位置から動かさない。これによって、液溜まりが下流側に移動する。下流側スリットダイ2Lを鉛直下方に下げる量は0.01mm以上0.5mm以下程度である。 In order to perform intermittent coating to form an uncoated portion C to which the coating liquid is not applied between the coating portion B to which the coating liquid is applied to the base material 4 and the coating portion B, the control unit 11 is used. Before stopping the supply of the coating liquid, first, as shown in FIG. 2B, the downstream slit die 2L is moved vertically downward so that the downstream gap H2 becomes large. The upstream slit die 2U does not move from the position during coating in FIG. 2 (a). As a result, the liquid pool moves to the downstream side. The amount of lowering the downstream slit die 2L vertically downward is about 0.01 mm or more and 0.5 mm or less.

その後に制御部11が、スリットダイ2の全体を鉛直上方に移動させて、上流側スリットダイ2Uの一部P3を図2(c)に示すように基材4の下面に接触させる。 After that, the control unit 11 moves the entire slit die 2 vertically upward to bring a part P3 of the upstream slit die 2U into contact with the lower surface of the base material 4 as shown in FIG. 2 (c).

さらにその後に制御部11が、スリットダイ2への塗工液の供給を停止する。塗工液の供給が停止されると、図2(d)に示すように塗工液の表面張力により基材4にはスリットダイ2の吐出口側に引き込まれる方向に力が働くことから、搬送方向9に向かって走行中の基材4の一部が鉛直下方に変位する。 After that, the control unit 11 stops the supply of the coating liquid to the slit die 2. When the supply of the coating liquid is stopped, as shown in FIG. 2D, the surface tension of the coating liquid exerts a force on the base material 4 in the direction of being drawn into the discharge port side of the slit die 2. A part of the base material 4 traveling in the transport direction 9 is displaced vertically downward.

その後、図2(e)(f)に示すように時間の経過とともに塗工液が切れる。Bが下面塗工部、10が下面塗工部Bの終端である。 After that, as shown in FIGS. 2 (e) and 2 (f), the coating liquid runs out with the passage of time. B is the bottom coating portion, and 10 is the end of the bottom coating portion B.

その後のタイミングに制御部11が、上流側スリットダイ2Uと下流側スリットダイ2Lを図2(a)に示す上流ギャップH1と下流ギャップH2に戻し、塗工と間欠を繰り返す。 At a subsequent timing, the control unit 11 returns the upstream slit die 2U and the downstream slit die 2L to the upstream gap H1 and the downstream gap H2 shown in FIG. 2A, and repeats painting and intermittent coating.

制御部11がスリットダイ2を図2(a)〜(f)のように運転した場合の基材4の幅方向の中央部における塗工中のスリットダイ2の動作を、図4(a)〜(f)に示す。 FIG. 4A shows the operation of the slit die 2 during coating in the central portion in the width direction of the base material 4 when the control unit 11 operates the slit die 2 as shown in FIGS. 2A to 2F. ~ (F).

図4(a)のように、基材4の幅方向中央部の塗工中の上流ギャップH1及び下流ギャップH2は、基材4の撓みの影響で、図2(a)と同様に基材4の両端部より狭くなっている。 As shown in FIG. 4A, the upstream gap H1 and the downstream gap H2 during coating at the central portion in the width direction of the base material 4 are affected by the bending of the base material 4, and are similarly the base material as in FIG. 2A. It is narrower than both ends of 4.

塗工液の供給を停止する前に、図2(b)で下流側スリットダイ2Lを鉛直下方に移動させると、基材4の幅方向の中央部でも図4(b)に示すように液溜まりが下流側に移動する。 If the downstream slit die 2L is moved vertically downward in FIG. 2B before the supply of the coating liquid is stopped, the liquid is also liquid in the central portion in the width direction of the base material 4 as shown in FIG. 4B. The pool moves to the downstream side.

図2(c)でスリットダイ2の全体を鉛直上方に移動させると、基材4の幅方向の中央部でも上流スリットダイ2Uと基材4の下面とが図4(c)に示すように接触することで、基材両端部の塗工ギャップが図2(c)と同じになる。 When the entire slit die 2 is moved vertically upward in FIG. 2 (c), the upstream slit die 2U and the lower surface of the base material 4 are aligned with each other even in the central portion in the width direction of the base material 4 as shown in FIG. 4 (c). Upon contact, the coating gaps at both ends of the substrate become the same as in FIG. 2 (c).

その後に制御部11が、スリットダイ2への塗工液の供給を停止すると、図4(d)に示すように、塗工液の表面張力により基材4にはスリットダイ2の吐出口側に引き込まれる方向に力が働くことから、基材4が鉛直下方に変位する。その後、図4(e)(f)に示すように時間の経過とともに液が切れる。 After that, when the control unit 11 stops supplying the coating liquid to the slit die 2, as shown in FIG. 4D, the surface tension of the coating liquid causes the base material 4 to be on the discharge port side of the slit die 2. Since the force acts in the direction of being drawn into the base material 4, the base material 4 is displaced vertically downward. After that, as shown in FIGS. 4 (e) and 4 (f), the liquid runs out with the passage of time.

なお、図2(c)〜図2(e)の期間には、上流スリットダイ2Uの一部P3が、基材4の幅方向全てで接触している。 During the period from FIG. 2 (c) to FIG. 2 (e), a part P3 of the upstream slit die 2U is in contact with the base material 4 in all the width directions.

図2(f)から図2(a)のように制御部11が基材両端部の上流ギャップH1と下流ギャップH2を塗工中の状態に戻すと、基材中央部の上流ギャップH1と下流ギャップH2が図4(a)の塗工中の状態に戻る。その後は塗工と間欠を繰り返す。 When the control unit 11 returns the upstream gap H1 and the downstream gap H2 at both ends of the substrate to the state of being coated as shown in FIGS. 2 (f) to 2 (a), the upstream gap H1 and the downstream of the central portion of the substrate are returned. The gap H2 returns to the state during coating in FIG. 4 (a). After that, painting and intermittent painting are repeated.

つまり、幅方向全ての塗工ギャップを強制的に一定にすることが可能になり、図8に示すように下面塗工部Bの終端10に尾引きがない良好な電池極板を製造することができる。 That is, it becomes possible to forcibly make all the coating gaps in the width direction constant, and as shown in FIG. 8, it is possible to manufacture a good battery electrode plate having no tailing at the end 10 of the lower surface coating portion B. Can be done.

なお、実施の形態1では図2(b)で下流側スリットダイ2Lを下降させた後に、図2(c)でスリットダイ2の全体を上昇させて基材4を上流側スリットダイ2Uで支持するように制御部11を構成したが、図2(a)から下流側スリットダイ2Lが下降を開始し、下流側スリットダイ2Lが下降を終了する前にスリットダイ2の全体が上昇を開始し、そして上流側スリットダイ2Uを基材4の下面に接触させて基材4を上流側スリットダイ2Uで支持し、その後にスリットダイ2への塗工液の供給を停止するように制御部11を構成しても、同様の効果を期待できる。 In the first embodiment, after the downstream slit die 2L is lowered in FIG. 2B, the entire slit die 2 is raised in FIG. 2C to support the base material 4 by the upstream slit die 2U. Although the control unit 11 is configured to do so, the downstream slit die 2L starts descending from FIG. 2A, and the entire slit die 2 starts ascending before the downstream slit die 2L finishes descending. Then, the control unit 11 so as to bring the upstream slit die 2U into contact with the lower surface of the base material 4 to support the base material 4 with the upstream slit die 2U, and then stop the supply of the coating liquid to the slit die 2. The same effect can be expected even if the above is configured.

(実施の形態2)
図5と図6は実施の形態2を示す。実施の形態1とは制御部11の構成が異なる。その他は実施の形態1と同じである。
(Embodiment 2)
5 and 6 show the second embodiment. The configuration of the control unit 11 is different from that of the first embodiment. Others are the same as those in the first embodiment.

制御部11の構成を図5に基づいて説明する。 The configuration of the control unit 11 will be described with reference to FIG.

図5は基材4の両端部におけるスリットダイ2の動作を示す。 FIG. 5 shows the operation of the slit die 2 at both ends of the base material 4.

図5(a)に示すように上流ギャップH1及び下流ギャップH2は、用いられる塗工液の特性によっても異なるが、一般的には、0.01mm以上1.0mm以下程度設けられる。 As shown in FIG. 5A, the upstream gap H1 and the downstream gap H2 are generally provided to be about 0.01 mm or more and 1.0 mm or less, although they differ depending on the characteristics of the coating liquid used.

図5(a)は塗工中の状態を示している。間欠塗工をするため、スリットダイ2への塗工液の供給を停止する前に、図5(b)に示すようにスリットダイ2の全体を制御部11が鉛直上方に移動させることで、上流側スリットダイ2Uの一部P3を基材4の下面に接触させる。 FIG. 5A shows a state during coating. In order to perform intermittent coating, the control unit 11 moves the entire slit die 2 vertically upward as shown in FIG. 5B before stopping the supply of the coating liquid to the slit die 2. A part P3 of the upstream slit die 2U is brought into contact with the lower surface of the base material 4.

その後、図5(c)に示すようにスリットダイ2の一部を基材4に接触させた状態で下流側スリットダイ2Lだけを制御部11が鉛直下方に移動させることで、液溜まりが下流側に移動する。下流側スリットダイ2Lを鉛直下方に下げる量は0.01mm以上0.5mm以下程度である。 After that, as shown in FIG. 5C, the control unit 11 moves only the downstream slit die 2L vertically downward with a part of the slit die 2 in contact with the base material 4, so that the liquid pool is downstream. Move to the side. The amount of lowering the downstream slit die 2L vertically downward is about 0.01 mm or more and 0.5 mm or less.

さらにその後、制御部11がスリットダイ2への塗工液の供給を停止すると、図5(d)に示すように、塗工液の表面張力により基材にはスリットダイの吐出口側に引き込まれる方向に力が働くことから、基材4の一部が鉛直下方に変位する。 After that, when the control unit 11 stops supplying the coating liquid to the slit die 2, as shown in FIG. 5D, the surface tension of the coating liquid causes the substrate to be drawn into the slit die discharge port side. Since the force acts in the direction of tension, a part of the base material 4 is displaced vertically downward.

そして図5(e)(f)に示すように時間の経過とともに液が切れる。その後は図5(a)に示す上流ギャップH1と下流ギャップH2に戻し、塗工と間欠を繰り返す。 Then, as shown in FIGS. 5 (e) and 5 (f), the liquid runs out with the passage of time. After that, the process is returned to the upstream gap H1 and the downstream gap H2 shown in FIG. 5A, and coating and intermittent painting are repeated.

制御部11がスリットダイ2を図5(a)〜(f)のように運転した場合の基材4の幅方向の中央部における塗工中のスリットダイ2の動作を、図6(a)〜(f)に示す。 6 (a) shows the operation of the slit die 2 during coating in the central portion in the width direction of the base material 4 when the control unit 11 operates the slit die 2 as shown in FIGS. 5 (a) to 5 (f). ~ (F).

図6(a)に示すように、基材4の中央部の上流ギャップH1及び下流ギャップH2は、基材4の撓みの影響で、基材両端部より狭くなっている。しかし、図4(b)において制御部11がスリットダイ2の全体を鉛直上方に移動させて上流側スリットダイ2Uの一部P3を基材4の下面に接触させることによって、基材4の中央部でも上流側スリットダイ2Uの一部P3が図6(b)に示すように基材4の下面に接触する。 As shown in FIG. 6A, the upstream gap H1 and the downstream gap H2 in the central portion of the base material 4 are narrower than both ends of the base material 4 due to the influence of the bending of the base material 4. However, in FIG. 4B, the control unit 11 moves the entire slit die 2 vertically upward to bring a part P3 of the upstream slit die 2U into contact with the lower surface of the base material 4, thereby causing the center of the base material 4. Even in the portion, a part P3 of the upstream slit die 2U comes into contact with the lower surface of the base material 4 as shown in FIG. 6 (b).

図4(c)において制御部11が下流側スリットダイ2Lを鉛直下方に移動させることで、基材4の中央部でも図6(c)に示すように液溜まりが下流側に移動して基材両端部の塗工ギャップと同じになる。 In FIG. 4 (c), the control unit 11 moves the downstream side slit die 2L vertically downward, so that the liquid pool moves to the downstream side even in the central portion of the base material 4 as shown in FIG. 6 (c). It will be the same as the coating gap at both ends of the material.

その後、制御部11が塗工液の供給を停止すると、図6(d)に示すように、塗工液の表面張力により基材4にはスリットダイ2の吐出口側に引き込まれる方向に力が働くことから、基材4の一部が鉛直下方に変位する。 After that, when the control unit 11 stops supplying the coating liquid, as shown in FIG. 6D, a force is applied to the base material 4 in the direction of being drawn into the discharge port side of the slit die 2 by the surface tension of the coating liquid. Is working, so that a part of the base material 4 is displaced vertically downward.

その後、図6(e)(f)に示すように時間の経過とともに液が切れる。その後は図6(a)に示す上流ギャップH1と下流ギャップH2に戻し、塗工と間欠を繰り返す。 After that, as shown in FIGS. 6 (e) and 6 (f), the liquid runs out with the passage of time. After that, the process is returned to the upstream gap H1 and the downstream gap H2 shown in FIG. 6A, and coating and intermittent painting are repeated.

つまり、幅方向全ての塗工ギャップを強制的に一定にすることが可能になり、図8(b)に示すように、尾引きがない良好な電池極板を製造することができる。 That is, it becomes possible to forcibly make all the coating gaps in the width direction constant, and as shown in FIG. 8B, it is possible to manufacture a good battery electrode plate without tailing.

なお、図5(b)〜図5(e)の期間には、上流スリットダイ2Uの一部P3が、基材4の幅方向全てで接触している。 During the period from FIG. 5 (b) to FIG. 5 (e), a part P3 of the upstream slit die 2U is in contact with the base material 4 in all the width directions.

なお、実施の形態2では図5(b)で基材4をスリットダイ2で支持した後に、図5(c)で下流側スリットダイ2Lが下降動作を開始するように制御部11を構成したが、図5(a)からスリットダイ2が上昇を開始し、上流側スリットダイ2Uが基材4に当接する前に下流側スリットダイ2Lが下降を開始し、上流側スリットダイ2Uを基材4の下面に接触させた状態でスリットダイ2への塗工液の供給を停止するように制御部11を構成しても、同様の効果を期待できる。 In the second embodiment, after the base material 4 is supported by the slit die 2 in FIG. 5 (b), the control unit 11 is configured so that the downstream slit die 2L starts the lowering operation in FIG. 5 (c). However, from FIG. 5A, the slit die 2 starts to rise, the downstream slit die 2L starts to descend before the upstream slit die 2U abuts on the base material 4, and the upstream side slit die 2U is used as the base material. The same effect can be expected even if the control unit 11 is configured to stop the supply of the coating liquid to the slit die 2 in a state of being in contact with the lower surface of the 4.

− 実施例 −
実施の形態1および実施の形態2において、実施した結果を下記実施例1および2に示す。また本発明を使用しない従来技術を比較対象とする。
− Example −
The results of the implementation in the first and second embodiments are shown in Examples 1 and 2 below. Further, the prior art that does not use the present invention will be compared.

本実施例を実施するにあたり、共通条件を以下に記載する。 Common conditions for implementing this example are described below.

スリットダイ2は、ステンレス鋼材SUS430製で、上流側スリットダイ2Uの先端幅1mm、下流側スリットダイ2Lの先端幅1mm、上流側スリットダイ2Uと下流側スリットダイ2Lの間の間隙0.5mmのものを使用した。基材4は日本電解株式会社製の電解銅箔YB−10(厚み0.01mm)を幅70mmにスリットして使用した。塗工液はB型粘度計で回転速度毎分20回転の条件にて測定した粘度6000cP程度のスラリーを使用した。スラリーは兵神装備株式会社製モーノポンプにて毎分11.7gにて送液し、スリットダイ2から幅45mmにて吐出して塗膜形成を行った。基材搬送速度は毎分1mで、張力は15Nで、1000m塗工した。下流側スリットダイ2Lを鉛直下方に下げる量は、0.05mmに設定した。 The slit die 2 is made of stainless steel SUS430 and has a tip width of 1 mm for the upstream slit die 2U, a tip width of 1 mm for the downstream slit die 2L, and a gap of 0.5 mm between the upstream slit die 2U and the downstream slit die 2L. I used the one. As the base material 4, an electrolytic copper foil YB-10 (thickness 0.01 mm) manufactured by Nippon Denkai Co., Ltd. was used by slitting it to a width of 70 mm. As the coating liquid, a slurry having a viscosity of about 6000 cP measured under the condition of a rotation speed of 20 rpm with a B-type viscometer was used. The slurry was sent at 11.7 g / min by a MONO pump manufactured by Hyojin Equipment Co., Ltd., and discharged from the slit die 2 at a width of 45 mm to form a coating film. The substrate transfer speed was 1 m / min, the tension was 15 N, and the coating was applied at 1000 m. The amount of lowering the downstream slit die 2L vertically downward was set to 0.05 mm.

また尾引きの良否判断は、尾引き長さY=1.5mmを超えるものを不良と定義した。以下に、本発明における実施形態の中のごく一部であるが、本発明における実施例を記載する。 In addition, in the judgment of the quality of the tail pull, the tail pull length exceeding Y = 1.5 mm was defined as a defect. Hereinafter, examples of the present invention will be described, which are only a few of the embodiments of the present invention.

(実施例1)
実施の形態1において、塗工開始前における基材中央部の上流ギャップH1=0.24mm、下流ギャップH2=0.3mmに設定した。この時の基材両端部は、上流ギャップH1=0.34mm、下流ギャップH2=0.4mmであり、基材4は撓みの影響で中央部と両端部で0.1mmの差がある。結果を表1に示す。
(Example 1)
In the first embodiment, the upstream gap H1 = 0.24 mm and the downstream gap H2 = 0.3 mm in the central portion of the base material before the start of coating are set. At this time, both ends of the base material have an upstream gap H1 = 0.34 mm and a downstream gap H2 = 0.4 mm, and the base material 4 has a difference of 0.1 mm between the central portion and both ends due to the influence of bending. The results are shown in Table 1.

表1に示すように、従来技術では尾引き不良率1.5%に対して、実施の形態1では尾引き不良率0%であった。 As shown in Table 1, the tailing defect rate was 1.5% in the prior art, whereas the tailing defect rate was 0% in the first embodiment.

このように、幅方向全ての塗工ギャップを強制的に一定にすることで、両端部と中央部で基材の撓みの差が0.1mmあっても尾引きが無い良好な電池極板を製造することができることを確認した。 In this way, by forcibly making the coating gap in all width directions constant, a good battery electrode plate with no tailing even if the difference in deflection of the base material between both ends and the center is 0.1 mm can be obtained. It was confirmed that it could be manufactured.

Figure 0006979632
(実施例2)
実施の形態2で、塗工開始前における基材中央部の上流ギャップH1=0.2mm、下流ギャップH2=0.26mmに設定した。この時の基材両端部は、上流ギャップH1=0.28mm、下流ギャップH2=0.34mmであり、基材は撓みの影響で中央部と両端部で0.08mmの差がある。結果を表2に示す。表2に示すように、従来技術では尾引き不良率1.5%に対して、本発明では尾引き不良率0%であった。このように、幅方向全ての塗工ギャップを強制的に一定にすることで、両端部と中央部で基材の撓みの差が0.08mmあっても尾引きが無い良好な電池極板を製造することができることを確認した。
Figure 0006979632
(Example 2)
In the second embodiment, the upstream gap H1 = 0.2 mm and the downstream gap H2 = 0.26 mm in the central portion of the base material before the start of coating are set. At this time, both ends of the base material have an upstream gap H1 = 0.28 mm and a downstream gap H2 = 0.34 mm, and the base material has a difference of 0.08 mm between the central portion and both ends due to the influence of bending. The results are shown in Table 2. As shown in Table 2, the tailing defect rate was 1.5% in the prior art, whereas the tailing defect rate was 0% in the present invention. In this way, by forcibly making the coating gap in all width directions constant, a good battery electrode plate with no tailing even if the difference in deflection of the base material between both ends and the center is 0.08 mm can be obtained. It was confirmed that it could be manufactured.

Figure 0006979632
Figure 0006979632

本発明の塗工方法は、基材の両面に間欠的に塗膜を形成可能となることから、特にリチウムイオン二次電池極板の高容量化を安価に実現可能である。 Since the coating method of the present invention can intermittently form a coating film on both sides of the base material, it is possible to realize an increase in capacity of the lithium ion secondary battery electrode plate at low cost.

1 下面塗工用スリットダイ
2 下面塗工用スリットダイ
2U 上流側スリットダイ
2L 下流側スリットダイ
3 基材支持装置
4 基材
5 尾引き
6 乾燥装置
7 バックアップロール
8 液溜まり
9 搬送方向
10 塗工部の終端
11 制御部
B 塗工部
C 未塗工部
P1 上流側スリットダイ2Uの頂点
P2 下流側スリットダイ2Lの頂点
P3 上流側スリットダイ2Uの一部
H1 上流ギャップ
H2 下流ギャップ
1 Slit die for bottom coating 2 Slit die for bottom coating 2U Slit die on the upstream side 2L Slit die on the downstream side 3 Base material support device 4 Base material 5 Tailing 6 Drying device 7 Backup roll 8 Liquid pool 9 Transport direction 10 Coating End of part 11 Control part B Painted part C Unpainted part P1 Top of upstream slit die 2U P2 Top of downstream slit die 2L P3 Part of upstream slit die 2U H1 Upstream gap H2 Downstream gap

Claims (8)

基材に間欠的に塗膜を形成する塗工方法であって、
水平に走行している前記基材に対して、前記基材の下面に対向して配置したスリットダイの上流側スリットダイと、前記スリットダイの下流側スリットダイの間の吐出口より上方に向かって塗工液を吐出することで前記基材の下面に塗膜を形成し、
前記スリットダイの前記上流側スリットダイと前記基材の下面との距離は変更せずに前記下流側スリットダイを下方に移動させ、
その後に前記スリットダイを上方に移動させて前記上流側スリットダイを前記基材の下面に接触させ、
その後に前記スリットダイへの前記塗工液の供給を停止させ、
前記塗膜を乾燥させる、塗工方法。
It is a coating method that intermittently forms a coating film on a base material.
Above the discharge port between the upstream side slit die of the slit die arranged facing the lower surface of the base material and the downstream side slit die of the slit die with respect to the horizontally running base material. A coating film is formed on the lower surface of the base material by discharging the coating liquid toward the substrate.
The downstream slit die is moved downward without changing the distance between the upstream slit die of the slit die and the lower surface of the base material.
After that, the slit die is moved upward so that the upstream slit die is brought into contact with the lower surface of the base material.
After that, the supply of the coating liquid to the slit die was stopped, and the supply was stopped.
A coating method for drying the coating film.
基材に間欠的に塗膜を形成する塗工方法であって、
水平に走行している前記基材に対して、前記基材の下面に対向して配置したスリットダイの上流側スリットダイと、前記スリットダイの下流側スリットダイの間の吐出口より上方に向かって塗工液を吐出することで前記基材の下面に塗膜を形成し、
前記下流側スリットダイが下降を開始し、前記下流側スリットダイが下降を終了する前に前記スリットダイの全体が上昇を開始し、そして前記上流側スリットダイを前記基材の下面に接触させ、
その後に前記スリットダイへの前記塗工液の供給を停止させ、
前記塗膜を乾燥させる、塗工方法。
It is a coating method that intermittently forms a coating film on a base material.
Above the discharge port between the upstream side slit die of the slit die arranged facing the lower surface of the base material and the downstream side slit die of the slit die with respect to the horizontally running base material. A coating film is formed on the lower surface of the base material by discharging the coating liquid toward the substrate.
The entire downstream slit die begins to ascend before the downstream slit die begins to descend, and the entire slit die begins to ascend, and the upstream slit die is brought into contact with the lower surface of the substrate.
After that, the supply of the coating liquid to the slit die was stopped, and the supply was stopped.
A coating method for drying the coating film.
基材に間欠的に塗膜を形成する塗工方法であって、
水平に走行している前記基材に対して、前記基材の下面に対向して配置したスリットダイの上流側スリットダイと、前記スリットダイの下流側スリットダイの間の吐出口より上方に向かって塗工液を吐出することで前記基材の下面に塗膜を形成し、
前記スリットダイを上方に移動させて前記上流側スリットダイを前記基材の下面に接触させ、
その後に前記下流側スリットダイを下方に移動させ、
前記上流側スリットダイを前記基材の下面に接触させた状態で前記スリットダイへの前記塗工液の供給を停止させ、
前記塗膜を乾燥させる、塗工方法。
It is a coating method that intermittently forms a coating film on a base material.
Above the discharge port between the upstream side slit die of the slit die arranged facing the lower surface of the base material and the downstream side slit die of the slit die with respect to the horizontally running base material. A coating film is formed on the lower surface of the base material by discharging the coating liquid toward the substrate.
The slit die is moved upward so that the upstream slit die is brought into contact with the lower surface of the base material.
After that, the downstream slit die is moved downward to move it downward.
With the upstream slit die in contact with the lower surface of the base material, the supply of the coating liquid to the slit die is stopped.
A coating method for drying the coating film.
基材に間欠的に塗膜を形成する塗工方法であって、
水平に走行している前記基材に対して、前記基材の下面に対向して配置したスリットダイの上流側スリットダイと、前記スリットダイの下流側スリットダイの間の吐出口より上方に向かって塗工液を吐出することで前記基材の下面に塗膜を形成し、
前記スリットダイの上昇を開始させ、前記上流側スリットダイが前記基材に当接する前に前記下流側スリットダイの下降を開始させ、
前記上流側スリットダイを前記基材の下面に接触させた状態で前記スリットダイへの前記塗工液の供給を停止させ、
前記塗膜を乾燥させる、塗工方法。
It is a coating method that intermittently forms a coating film on a base material.
Above the discharge port between the upstream side slit die of the slit die arranged facing the lower surface of the base material and the downstream side slit die of the slit die with respect to the horizontally running base material. A coating film is formed on the lower surface of the base material by discharging the coating liquid toward the substrate.
The ascending of the slit die is started, and the descending of the downstream slit die is started before the upstream slit die comes into contact with the base material.
With the upstream slit die in contact with the lower surface of the base material, the supply of the coating liquid to the slit die is stopped.
A coating method for drying the coating film.
前記上流側スリットダイを前記基材の下面に接触させた状態は、前記基材の幅方向全てで前記上流側スリットダイが接触していることを特徴とする、
請求項1〜の何れかに記載の塗工方法。
The state in which the upstream slit die is in contact with the lower surface of the base material is characterized in that the upstream slit die is in contact with the lower surface of the base material in all the width directions of the base material.
The coating method according to any one of claims 1 to 4.
上手から下手へ向かって走行中の基材に間欠的に塗膜を形成する塗工装置であって、
上流側スリットダイと下流側スリットダイの間の吐出口から前記基材の下方の面に対して塗工液を供給するスリットダイと、
前記スリットダイへの前記塗工液の供給を停止する前に、前記スリットダイの上流側スリットダイを前記基材の下面に接触させて支持するように前記スリットダイに移動を指示する制御部と
を有し、
前記制御部は、
前記スリットダイを上方に移動させて前記上流側スリットダイを前記基材の下面に接触させ、
その後に前記下流側スリットダイを下方に移動させ、
前記上流側スリットダイを前記基材の下面に接触させた状態で前記スリットダイへの前記塗工液の供給を停止させることを特徴とする、塗工装置。
It is a coating device that intermittently forms a coating film on a base material that is running from good to bad.
A slit die for supplying the coating solution to the surface of the lower of the substrate from the discharge port between the upstream side slit die and the downstream slit die,
Before stopping the supply of the coating liquid to the slit die, a control unit for instructing the slit die to move the slit die on the upstream side of the slit die so as to contact and support the lower surface of the base material. have a,
The control unit
The slit die is moved upward so that the upstream slit die is brought into contact with the lower surface of the base material.
After that, the downstream slit die is moved downward to move it downward.
A coating apparatus , characterized in that the supply of the coating liquid to the slit die is stopped in a state where the upstream slit die is in contact with the lower surface of the base material.
上手から下手へ向かって走行中の基材に間欠的に塗膜を形成する塗工装置であって、
上流側スリットダイと下流側スリットダイの間の吐出口から前記基材の下方の面に対して塗工液を供給するスリットダイと、
前記スリットダイへの前記塗工液の供給を停止する前に、前記スリットダイの上流側スリットダイを前記基材の下面に接触させて支持するように前記スリットダイに移動を指示する制御部と
を有し、
前記制御部は、
前記下流側スリットダイの下降を開始させ、
前記下流側スリットダイが下降を終了する前に前記スリットダイの全体の上昇を開始させ、
そして前記上流側スリットダイを前記基材の下面に接触させ、
その後に前記スリットダイへの前記塗工液の供給を停止させることを特徴とする、塗工装置。
It is a coating device that intermittently forms a coating film on a base material that is running from good to bad.
A slit die for supplying the coating solution to the surface of the lower of the substrate from the discharge port between the upstream side slit die and the downstream slit die,
Before stopping the supply of the coating liquid to the slit die, a control unit for instructing the slit die to move the slit die on the upstream side of the slit die so as to contact and support the lower surface of the base material. have a,
The control unit
The lower side slit die is started to descend, and the lower side slit die is started to descend.
Before the downstream slit die finishes descending, the entire ascending of the slit die is started.
Then, the upstream slit die is brought into contact with the lower surface of the base material, and the slit die is brought into contact with the lower surface of the base material.
After that, the coating apparatus is characterized in that the supply of the coating liquid to the slit die is stopped.
上手から下手へ向かって走行中の基材に間欠的に塗膜を形成する塗工装置であって、
上流側スリットダイと下流側スリットダイの間の吐出口から前記基材の下方の面に対して塗工液を供給するスリットダイと、
前記スリットダイへの前記塗工液の供給を停止する前に、前記スリットダイの上流側スリットダイを前記基材の下面に接触させて支持するように前記スリットダイに移動を指示する制御部と
を有し、
前記制御部は、
前記スリットダイの上昇を開始させ、
前記上流側スリットダイが前記基材に当接する前に前記下流側スリットダイの下降を開始させ、
前記上流側スリットダイを前記基材の下面に接触させた状態で前記スリットダイへの前記塗工液の供給を停止させることを特徴とする、塗工装置。
It is a coating device that intermittently forms a coating film on a base material that is running from good to bad.
A slit die for supplying the coating solution to the surface of the lower of the substrate from the discharge port between the upstream side slit die and the downstream slit die,
Before stopping the supply of the coating liquid to the slit die, a control unit for instructing the slit die to move the slit die on the upstream side of the slit die so as to contact and support the lower surface of the base material. have a,
The control unit
The rise of the slit die is started, and the slit die is started to rise.
Before the upstream slit die comes into contact with the base material, the downstream slit die is started to descend.
A coating apparatus , characterized in that the supply of the coating liquid to the slit die is stopped in a state where the upstream slit die is in contact with the lower surface of the base material.
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