JP2002297048A - Method and device for segmenting unit substrate, and method for manufacturing display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce defective areas, corresponding to substrates for display panel in a segmented unit substrate, in comparison with the conventional methods and devices, with respect to a method and a device which segment the unit substrate, from which many substrates including a prescribed number of areas corresponding to substrates for display panel are taken, from a long-sized film; and to provide a method for manufacturing a display panel, which improves the rate of nondefective goods of the display panel. SOLUTION: The method for segmenting the unit substrate includes an examination stage, which discriminates whether the areas (a) of a long-sized film F where at least one area (a) corresponding to the substrate for display panel is arranged in the breadthwise direction y of the film and a lot of areas (a) are arranged in the lengthwise direction z of the film at a prescribed pitch p are defective; and a film cutting stage, which moves a cutter 20 for cutting the film F in the direction y and the film F relatively in the direction x, to cut the film F between areas (a) by the cutter 20, in accordance with discrimination results of areas (a) in the examination stage. The film F is cut in the film cutting stage, so that the unit substrate including a prescribed number of areas (a) may be obtained and the number of defective areas (a) included in the unit substrate may be a prescribed number or smaller.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for cutting out a unit substrate and a method for manufacturing a display panel.

[0002]

2. Description of the Related Art As a display panel, a liquid crystal display panel, an electroluminescence (EL) display panel, a plasma display panel (PDP) and the like are known. In recent years, display panels such as a liquid crystal display panel, an EL display panel, and a PDP have been widely used in place of the CRT.

Such a display panel usually includes a pair of substrates, and a display material such as a liquid crystal material is disposed between the pair of substrates. An electrode may be formed on each of the pair of substrates.

[0004] As a pair of substrates, glass substrates have been widely used so far. In recent years, display panels such as liquid crystal display panels using plastic film substrates instead of conventional glass substrates have been researched and developed and put to practical use.

[0005] As a method of manufacturing a display panel, a method of manufacturing a display panel using a unit substrate for multi-cavity production including a predetermined plurality of regions corresponding to a substrate for a display panel, that is, one of the substrates constituting the display panel is used. A display panel group connected in series is formed by using a multi-unit substrate unit substrate having an area to be formed and a multi-unit substrate unit substrate having an area corresponding to the other substrate, and the display panel group is individually formed. There is known a method of manufacturing a display panel having a large number of substrates by dividing the display panel into a plurality of display panels to obtain a plurality of display panels. This manufacturing method has an advantage that the productivity can be increased as compared with a manufacturing method in which one display panel is processed with a pair of substrates in each process.

In the case of producing a unit substrate for taking a large number of substrates in such a method of manufacturing a display panel, a long film (for example, in the form of a roll wound as a long film) is used, and a large number of substrates are formed from the long film. A method of cutting out a unit substrate for taking out may be used.

Hereinafter, an example will be described with reference to FIG.

FIG. 12A is a schematic plan view of an example of a conventional long film, and FIG. 12B shows a case where a region corresponding to a display panel substrate is formed from the long film shown in FIG. The figure for demonstrating the conventional unit board | substrate cutting method of cutting | disconnecting the unit board | substrate for multiple board | substrate picking-up including a unit is shown.

As shown in FIG. 12A, the long film F 'has two display panel substrate-corresponding regions a in the long film short direction (the y direction in the figure) and the long film long direction (the y direction in the drawing). (X direction in the figure), a plurality of alignment markers m ′ are arranged at predetermined pitches p ′, and cut-out alignment markers m ′ indicating a film cutting position are formed at every three cycles of the predetermined pitch p ′. The electrode pattern T1 '(T
2 ′) is formed.

When a unit substrate is cut out from the long film F ', for example, the long film F' is unwound from a roll form wound up as the long film F 'and provided in advance at every three cycles of the pitch p'. Referring to the cut-out alignment marker m ′, as shown by the bold line in FIG. 12B, a unit for obtaining a large number of substrates including a predetermined number (six in this case) of the display panel substrate equivalent region a. The substrates S1 'and S2' are cut out. In FIG. 12B, the marker m 'is not shown.

With respect to the unit substrate thus cut out, a unit substrate S1 'having an area corresponding to one substrate constituting a display panel and a unit substrate S2' having an area corresponding to the other substrate are used. To form a series of connected display panels, and the display panel group is divided into individual display panels. Thus, a predetermined plurality (here, six) of display panels are manufactured.

For example, when manufacturing a liquid crystal display panel,
Among the unit substrate having a region corresponding to one substrate constituting the display panel and the unit substrate having a region corresponding to the other substrate, one of the unit substrates has a liquid crystal material surrounding in a region corresponding to each display panel substrate. A sealing wall is formed and a liquid crystal material is dropped, and then both unit substrates are bonded together. Alternatively, a sealing wall for surrounding a liquid crystal material is formed while leaving an injection port of the liquid crystal material, and both unit substrates are bonded together and then vacuum injection is performed. The liquid crystal material is injected from the injection port by, for example, closing the injection port to form a display panel group. Thereafter, the display panel group is divided into individual display panels to obtain a predetermined plurality of liquid crystal display panels. In any case, prior to the bonding of the two unit substrates, a thin film such as an alignment film or an insulating film may be formed as necessary on at least one of the unit substrates in a region corresponding to each display panel substrate. In addition, a spacer for maintaining the distance between the substrates may be sprayed in a region corresponding to each display panel substrate of one of the unit substrates, or a resin column may be provided for maintaining the distance between the substrates, improving the strength, and the like. There is also.

[0013]

However, the unit substrate S
When a display panel group is formed using 1 ′ and the unit substrate S2 ′, and the display panel group is divided to produce individual display panels, if a defect occurs in a part of the electrode pattern, for example, FIG. As shown in (B), the long film F 'is cut into unit substrates S1' and S2 ', and a display panel group is formed using the cut unit substrates S1' and S2 '. Even if a divided display panel is obtained, even if a divided display panel, for example, a display panel including the substrates s1 ′ and s2 ′, if the electrode pattern T1 ′ of one substrate s1 ′ has a defect, even if the other substrate is defective, Even if there is no defect in the electrode pattern T2 'of s2', it will be defective as a display panel. In FIG. 12 (B), for the electrode patterns T1 ′ and T2 ′, defective ones are indicated by crosses, and non-defective ones are indicated by triangles.

In the case of patterning an electrode on a long film, the process may be carried out by roll-to-roll. That is, a long film is unwound from a roll form wound up as a long film, a resist material is applied to the long film, a photomask of an electrode pattern is placed thereon, and exposure is performed. Removes the resist material. In addition, the patterning of the electrodes is performed collectively, such as by performing processing such as etching, removing the remaining resist material, patterning the electrodes for obtaining a large number of substrates, and then re-rolling the electrodes. There is.

When the process is performed in a roll-to-roll manner as described above, when a defect occurs, the defect does not stop at the position where the defect has occurred, but continues. There is a problem that the process is proceeding.

For example, in the step of patterning an electrode on a long film, if a trouble occurs in a resist coating apparatus for applying a resist material to the long film, the situation is that the resist material is not applied to a portion of the long film. Become. In this case, the electrode cannot be patterned, so that an area corresponding to a defective display panel substrate having no electrode pattern is generated in a certain portion of the long film.

When cutting out a unit substrate for taking out a large number of substrates from this long film, if the long film is cut with cutting alignment marks provided for each cutting pitch in the long film, a substrate equivalent to a defective display panel substrate is obtained. In some cases, the unit substrate cut out at the boundary region between the region and the display panel substrate equivalent region having no defect includes a large number of defective display panel substrate equivalent regions. When a display panel is manufactured using a unit substrate including a large area equivalent to the defective display panel substrate, the yield rate of the obtained display panel is reduced accordingly.

Therefore, the present invention relates to a method for manufacturing a display panel in which a display material is sandwiched between a pair of film substrates, a unit substrate for multi-cavity production including a plurality of predetermined regions corresponding to display panel substrates. It is an object of the present invention to provide a unit substrate cutting method for cutting out a unit substrate cut out from a unit substrate, which can reduce an area corresponding to a defective display panel substrate in the unit substrate to be cut out as compared with the case of cutting out by a conventional method.

According to the present invention, there is also provided a multi-substrate unit substrate for producing a display panel in which a display material is sandwiched between a pair of film substrates, the unit substrate including a plurality of predetermined regions corresponding to display panel substrates. An object of the present invention is to provide a unit substrate cutout device for cutting out a unit substrate cutout from a unit substrate, which can reduce a region corresponding to a defective display panel substrate in a cutout unit substrate as compared with a case where the unit is cut out by a conventional device.

Further, the present invention provides a method of manufacturing a display panel in which a display material is sandwiched between a pair of film substrates, wherein the method of manufacturing a display panel can improve the yield rate of the obtained display panel. As an issue.

[0021]

In order to solve the above-mentioned problems, the present invention provides the following first and second unit substrate cutting methods and a display panel manufacturing method. (1) First Unit Substrate Cutting Method This is a unit substrate cutting method for cutting a unit substrate for large number of substrates including a plurality of display panel substrate equivalent regions from a long film, wherein the display panel substrate equivalent region is long. At least one in the short direction of the long film, a plurality of long film longitudinal direction, an inspection step of determining the quality of the display panel substrate equivalent region in a long film arranged at a predetermined pitch, the long film The cutting device for cutting along the film short direction and the long film are relatively moved in the film longitudinal direction, and the cutting device is used in accordance with the quality judgment result of the display panel substrate equivalent region in the inspection process. A film cutting step of cutting the long film between the display panel substrate equivalent region at
In the film cutting step, a length is set so as to obtain a unit substrate including a predetermined number of display panel substrate equivalent regions and to set a defective display panel substrate equivalent region included in the unit substrate to a predetermined number or less. A method for cutting a unit substrate, comprising cutting a length film. (2) Second unit substrate cutting-out method This is a unit substrate cutting-out method for cutting out a unit film for multi-unit picking up from a long film, including a predetermined plurality of display panel substrate equivalent regions, wherein the display panel substrate equivalent region is long. At least one in the short direction of the long film, a plurality of long film longitudinal direction, an inspection step of determining the quality of the display panel substrate equivalent region in a long film arranged at a predetermined pitch, the long film The cutting device for cutting along the film short direction and the long film are relatively moved in the film longitudinal direction, and the cutting device is used in accordance with the quality judgment result of the display panel substrate equivalent region in the inspection process. A film cutting step of cutting the long film between the display panel substrate equivalent region at
In the film cutting step, a long film is cut so as to obtain a unit substrate including a predetermined number of display panel substrate equivalent regions, and a cutting device is used to cut out the long film. When there is a predetermined number or more of the defective areas in the leading portion in the relative moving direction of the long film with respect to the area, each time, the area and the adjacent display panel substrate-equivalent area on the upstream side are located between the area and the defective area. A method for cutting out a unit substrate, comprising cutting a long film and defining a new unit substrate equivalent portion. (3) Display Panel Manufacturing Method A unit substrate cut out by the unit substrate cutting method according to the present invention has a unit substrate having a region corresponding to one substrate constituting a display panel and a region corresponding to the other substrate. A method for manufacturing a display panel, comprising: a step of forming a series of connected display panel groups using a unit substrate having the display panel group; and a step of dividing the display panel group into individual display panels. In the first and second unit substrate cutting methods of the present invention, in the film cutting step, the long film and the cutting device are relatively moved in the longitudinal direction of the film, and a predetermined number of display panel substrate equivalent regions are provided. The long film is cut so as to obtain the unit substrate included therein.

In this case, in the first unit substrate cutting method of the present invention, the display panel substrate is cut by the cutting device so that the area corresponding to the defective display panel substrate included in the unit substrate is limited to a predetermined number or less. The long film is cut between corresponding areas.

In the second unit substrate cutting method according to the present invention, a predetermined number or more of the unit substrates corresponding to the unit substrate to be cut out at the head portion in the direction of relative movement of the long film with respect to the cutting device. Whenever there is a defective area, the long film is cut between the area and the adjacent area corresponding to the display panel substrate on the upstream side to define a new unit substrate equivalent part. The leading portion cut in this manner may be discarded.

When the long film is cut, a marker serving as a mark of the film cutting position is provided on the long film in advance (for example, provided between regions corresponding to the display panel substrate), and this marker is used as a mark. The film may be cut by the cutting device utilizing the above method. The film cutting position detecting device in the unit substrate cutting device described later may detect such a marker.

In the method of manufacturing a display panel according to the present invention,
Using a unit substrate having a region corresponding to one substrate constituting a display panel as a unit substrate cut out by the unit substrate cutting method according to the present invention and a unit substrate having a region corresponding to the other substrate A display panel group connected in series is formed. Then, the display panel group is divided into individual display panels to obtain a display panel.

In the conventional unit substrate cutting method, when cutting a unit substrate for multi-piece substrate cutting from a long film, the long film is cut by cutting alignment marks provided for each cutting pitch in the long film. In some cases, the cut-out unit substrate includes many defective display panel substrate equivalent regions. When a display panel is manufactured using a unit substrate including a large area corresponding to the defective display panel substrate, the yield rate of the obtained display panel is reduced accordingly.

However, according to the first and second unit substrate cutting methods according to the present invention, in the first unit substrate cutting method, the number of defective display panel substrate equivalent regions included in the unit substrate is not more than a predetermined number. Since the long film is cut as described above, in the second unit substrate cutting method, a predetermined number or more of the defective areas are present at the head portion of the unit substrate equivalent portion to be cut out of the long film. In each case, the long film is cut between the region and the region corresponding to the display panel substrate on the upstream side adjacent thereto to define a new portion corresponding to the unit substrate. The area corresponding to the defective display panel substrate in the unit substrate can be reduced as compared with the case where it is cut out by the conventional method.

Further, according to the display panel manufacturing method of the present invention, the unit substrate cut out by the unit substrate cutting method of the present invention can be used to reduce the area corresponding to the defective display panel substrate in the cut unit substrate. Therefore, the yield rate of the obtained display panel can be improved accordingly.

In the first unit substrate cutting method according to the present invention, in the film cutting step, the predetermined display panel substrate equivalent region included in the unit substrate equivalent portion to be cut out of the long film is the predetermined number. When the number is larger, each time, in the portion corresponding to the unit substrate, in the relative movement direction of the long film with respect to the cutting device, the long region is formed between the region of the leading portion and the upstream region adjacent thereto. The film may be cut to define a portion corresponding to a new unit substrate. The leading portion cut in this manner may be discarded.

[0030] In the second unit substrate cutting method according to the present invention, in the film cutting step, there is no defective area equal to or more than the predetermined number in the leading portion of the unit substrate equivalent portion to be cut out of the long film. At this time, the long film may be cut so as to cut out a portion corresponding to the unit substrate including the head portion. In this case, among the cut-out unit substrates, those having the defective area at the same position may be collected and stored for the unit substrates including the defective area.

In the second unit substrate cutting method according to the present invention, in the film cutting step, the head portion of the portion corresponding to the unit substrate to be cut out of the long film has the predetermined number or more of defects. Although there is no area, when there is a predetermined number or more defective areas in the row of the area in the film lateral direction in the upstream part of the leading part, each time, the area of the row and the upstream side adjacent thereto are A long film may be cut between the region and a new unit substrate equivalent portion. The portion from the leading portion to the portion including the defective area may be discarded.

In any of the first and second unit substrate cutting methods according to the present invention, in the long film preparing step, a roll-shaped long film is prepared as the long film, and the film cutting step is performed. Then, the wound long film may be unwound.

In any case, in the method of manufacturing a display panel according to the present invention, a unit substrate having an area corresponding to one of the substrates constituting the display panel and having a defective area is used and the other substrate is used. When a unit substrate having a corresponding area and having a defective area is used, the display panel group may be formed using a unit substrate capable of forming the series of connected display panel groups so that the defective areas overlap. Good. By doing so, the yield rate of the obtained display panel can be further improved.

Any of the display panel manufacturing methods according to the present invention may further include a step of discarding the display panel having the defective substrate among the individually divided display panels.

In any case, examples of the long film from which the unit substrate is cut out include a film in which a predetermined electrode pattern is formed in a region corresponding to a display panel substrate. In this case, the quality of the area corresponding to the display panel substrate in the inspection step can be determined by determining the quality of the electrode pattern.

In any case, examples of the long film include a film for obtaining a substrate for a liquid crystal display panel. The unit substrate cut out from the substrate for obtaining the liquid crystal display panel substrate includes a predetermined number of liquid crystal display panel substrates.

In the method of manufacturing a display panel according to the present invention, when a unit including a predetermined number of substrates for a liquid crystal display panel is used as the unit substrate, in the step of forming the display panel group, for example, one of the constituents of the display panel is formed. Of the unit substrate having a region corresponding to the substrate and the unit substrate having a region corresponding to the other substrate, a seal wall for surrounding a liquid crystal material is formed in each display panel substrate equivalent region of one of the unit substrates, After disposing (dropping) the liquid crystal material, both unit substrates may be attached to each other to form a display panel group. Also, a sealing wall for surrounding the liquid crystal material is formed while leaving the injection port of the liquid crystal material, and after bonding both unit substrates, the liquid crystal material is injected from the injection port by a vacuum injection method or the like, and the injection port is closed. Groups may be formed. In any case, prior to the bonding of the two unit substrates, a thin film such as an alignment film or an insulating film may be formed on at least one of the unit substrates in a region corresponding to each display panel substrate as needed. In addition, a spacer for maintaining the distance between the substrates is sprayed in a region corresponding to each display panel substrate of one of the unit substrates, or a resin column is provided for maintaining the distance between the substrates, improving strength, and the like. Is also good.

The present invention also provides the following unit substrate cutting apparatus. (4) Unit substrate cutout device A unit substrate cutout device for cutting out a unit film for multi-substrate picking up from a long film, including a predetermined plurality of display panel substrate equivalent regions, wherein the display panel substrate equivalent region is long. At least one in the film short direction, a plurality of long films in the longitudinal direction, a long film receiving portion for storing a long film arranged at a predetermined pitch, and the long film along the film short direction. A cutting device for cutting, a driving device for moving the long film out of the housing portion and relatively moving the long film with respect to the cutting device in the film longitudinal direction, and judging pass / fail of a region corresponding to a display panel substrate in the long film. Inspection device, a detecting device that detects the cutting position of the long film, and a control unit that controls the cutting position of the long film. The control unit, when cutting out the unit substrate from the long film, by moving the long film relative to the cutting device in the film longitudinal direction by the driving device, the display device substrate by the inspection device A unit substrate cutting device, wherein a film cutting position is controlled so as to cut the long film at a film cutting position detected by the detecting device by the cutting device in accordance with a quality judgment result of an area. This unit substrate cutting device performs the first and second unit substrate cutting methods according to the present invention.

In the unit substrate cutting apparatus according to the present invention,
When cutting out the unit substrate from the long film, the long film is taken out of the accommodation portion by the driving device and relatively moved in the film longitudinal direction with respect to the cutting device. Then, the long film is cut at the film cutting position detected by the marker detecting device by the cutting device in accordance with the quality judgment result of the area corresponding to the display panel substrate by the inspection device. At this time, the control unit performs one of the following controls (a) and (b). That is, (a) the control unit obtains a unit substrate including a predetermined number of display panel substrate equivalent regions, and reduces the number of defective display panel substrate equivalent regions included in the unit substrate to a predetermined number or less. The cutting position of the long film is controlled so as to stop. In this case, the apparatus of the present invention implements the first unit substrate cutting method of the present invention. (B) the control unit is configured to obtain a unit substrate including a predetermined number of display panel substrate-equivalent regions, and a long film for a cutting device in a unit substrate-equivalent portion to be cut out of the long film; In the relative movement direction, when there is a predetermined number or more of the defective areas at the head portion, each time, a long film is formed between the area and the area corresponding to the upstream display panel substrate adjacent thereto. The cutting position of the long film is controlled so as to cut and define a new unit substrate equivalent portion. In this case, the apparatus of the present invention implements the second unit substrate cutting-out method of the present invention.

The control section may switch between the control of (a) and the control of (b).

According to the unit substrate cutting apparatus according to the present invention, the long film is cut so that the area corresponding to the defective display panel substrate included in the unit substrate remains at a predetermined number or less. When there is a predetermined number or more of the defective areas in the head portion among the unit substrate equivalent parts to be cut out, each time, the area and the upstream display panel substrate equivalent area adjacent thereto are included. Since the long film is cut in between to define a new unit substrate equivalent portion, the defective display panel substrate equivalent region in the unit substrate to be cut out in any case can be reduced as compared with the case where it is cut out by the conventional device. .

In the unit substrate cutting apparatus of the present invention,
When the control unit performs the control of (a), the cutting device has a cutter knife, and the inspection device determines whether the display panel substrate-equivalent region in the unit substrate-equivalent portion of the long film is in a good or bad state. A sensor for detecting the position of the cutting device, the sensor being disposed upstream of the knife in the direction of advance of the long film relative to the cutter knife of the cutting device. In performing the control of (1), the cutting device has a cutter knife, and the inspection device detects a pass / fail state of at least one display panel substrate-corresponding region arranged in the short direction of the long film. A sensor, the sensor being located downstream of and near the knife in the direction of travel of the long film relative to the cutter knife of the cutting device. If the exemplified.

In any case, when the control of (a) is performed, when the number of defective display panel substrate equivalent regions included in the unit substrate equivalent portion to be cut out of the long film is larger than the predetermined number, Each time, of the unit substrate equivalent portion, in the relative movement direction of the long film with respect to the cutting device, cutting the long film between the region of the leading portion and the upstream region adjacent thereto. In this case, a new portion corresponding to a unit substrate may be determined.

In the control of the above (b), if there is no defective area equal to or more than the predetermined number in the leading portion of the portion corresponding to the unit substrate to be cut out of the long film, the leading portion is removed. It may be possible to cut out a portion corresponding to the unit substrate including, or, in the portion corresponding to the unit substrate to be cut out of the long film, the leading portion does not have the defective area of the predetermined number or more, but is upstream from the leading portion. When there is a predetermined number or more defective areas in the row of the area in the film short direction in the side portion, each time, a long film is formed between the row area and the upstream area adjacent thereto. The cutting may be performed to define a new unit substrate equivalent portion.

In any case, one of the inspection device and the film cutting position detection device may also serve as the other.

In any of the unit substrate cutting-out apparatuses according to the present invention, the unit film may be provided in a roll form wound as the long film. In this case, the wound long film can be fed out by the driving device.

[0047]

Embodiments of the present invention will be described below.

FIG. 1A is a schematic sectional view of an example of a display panel (here, a reflection type liquid crystal display panel).
FIG. 2B is a diagram showing a state of the liquid crystal display panel shown in FIG.

The liquid crystal display panel LCD shown in FIG. 1 was manufactured by the method of manufacturing a display panel according to the present invention using an example of a unit substrate for multi-piece substrate cut out by the method of cutting out unit substrates according to the present invention. A plurality of unit substrates S1 and S2, each of which includes a predetermined plurality of display panel substrate equivalent regions a, are cut out from the long film F, and one of the cut-out unit substrates constitutes a display panel. Unit substrate S1 having a region corresponding to
And a unit substrate S2 having a region corresponding to the other substrate, a display panel group SW connected in series is formed, and the display panel group SW is further divided into individual display panels. .

The liquid crystal display panel LCD has a display material (here, a liquid crystal material) LC for displaying an image in a predetermined color between a pair of opposed transparent film substrates s1 and s2.

Each of the substrates s1 and s2 has an electrode pattern T1 comprising an electrode t1 and an electrode t
2 are formed, respectively. The electrode t1 is a thin band-shaped electrode, and a plurality of electrodes t1 are formed on the substrate s1 in parallel in a predetermined direction (β direction in FIG. 1B). The electrode t2 is also a thin band-shaped electrode, and a plurality of electrodes t2 are formed on the substrate s2 in parallel with a direction perpendicular to the electrode t1 (α direction in FIG. 1B).

Each of the substrates s1 and s2 is further provided with an insulating film IS.
And an alignment film FF are also formed.

The liquid crystal material LC has spacers SP and resin columns RC. The spacer SP is for maintaining the gap between the two substrates at a predetermined value, and the resin pillar RC is not limited to this, but here is for maintaining the gap between the two substrates at a predetermined value and connecting the two substrates to each other. It is.

A sealing wall SL surrounding the liquid crystal material LC and closing the gap between the peripheral portions of both substrates is also provided.

Although not limited thereto, for example, the resin pillar R
C is formed of a thermoplastic resin, and the seal wall SL is formed of a thermosetting resin.

More specifically, but not exclusively, here, the resin pillar RC is formed of polyurethane resin,
The seal wall SL is formed of an epoxy resin.

A black light absorbing layer BK is formed on the outer surface on the opposite side of the substrate s1.

Each of the liquid crystal display panels manufactured using the unit substrates S1 and S2 for multi-cavity substrate has the structure described above.

This liquid crystal display panel LCD can be manufactured, for example, as follows.

FIG. 2 shows a pair of film substrates s shown in FIG.
A liquid crystal display panel L having a liquid crystal material LC sandwiched between 1 and s2
1 shows an example of a CD manufacturing process. The liquid crystal display panel LCD manufactured here has a spacer S on the liquid crystal material LC.
Only P exists. FIG. 3 is a plan view of a part of an example F of a long film used for manufacturing the liquid crystal display panel LCD shown in FIG.

As shown in FIG. 3, the long film F has at least one (two in the illustrated example) one or more areas a corresponding to the display panel substrate in the short direction of the long film (the y direction in the figure). A plurality of films are arranged at a predetermined pitch p in the longitudinal direction of the film (x direction in the figure). Here, the long film F
Is used as a roll.

First, a long film F is unwound from a rolled film wound as the long film F, and a predetermined electrode pattern T1 (T2) (here, ITO) is formed on a region a of the long film F corresponding to a display panel substrate. : Electrode pattern made of indium tin oxide (Step S)
a), the long film on which the electrode patterns T1 (T2) are formed is washed (step Sb), and is again made into a roll form (step Sc). At this time, an alignment marker m indicating a film cutting position is formed in a portion outside the display panel substrate equivalent region a for each column of the region a in the film short direction y (see FIG. 3). The alignment marker m may be formed by the same method as the patterning of the electrode when forming the electrode pattern, or may be a dot-shaped or linear hole provided by a punching device, a laser beam emitting device, or the like. The alignment marker m here is made of ITO provided at the same time as the formation of the electrode pattern.

Next, the quality of the electrode pattern T1 (T2) in the area a corresponding to the display panel substrate in the long film F is judged (step Sd), and the unit substrate S1 (S2 ) (Step S)
e). In FIG. 3, the film cutting position C from the long film F
1. A unit substrate S1 (S4
The state where 2) is cut out is shown by a thick line. Then, the cutout unit substrates S1 (S2) are sorted or sorted out (step Sf). The determination of the quality of the electrode pattern, the cutting out of the unit substrate, and the selection or sorting of the unit substrate will be described later in detail.

Next, a unit substrate S1 having a region corresponding to one substrate s1 constituting the display panel LCD and a unit substrate S2 having a region corresponding to the other substrate s2 are prepared. In this case, each unit substrate is made of polycarbonate (P
C).

An insulating film IS and an alignment film FF are respectively formed in the display panel substrate-corresponding regions a of the unit substrates S1 and S2 (step Sg). In addition, spacers SP for maintaining the inter-substrate distance are dispersed in each display panel substrate equivalent region a of one of the unit substrates S1 and S2 (in this case, the substrate S2) (Step Sh).

Then, a sealing wall SL for surrounding the liquid crystal material is formed on one of the unit substrates (the substrate S2 in this case) while leaving the injection port of the liquid crystal material LC (step Si), and both unit substrates S1 and S2 are attached. After the alignment (Step Sj), the liquid crystal material LC is injected from the injection port by a vacuum injection method or the like (Step Sk), the injection port is closed, and the display panel group SW is formed. Alternatively, the liquid crystal material surrounding sealing wall SL is formed on one of the unit substrates (here, the substrate S2) (Step Si '), and the liquid crystal material LC is dropped on the other substrate (here, the substrate S1) (Step Si). Sj ') Both unit substrates S1 and S2 are bonded together (Step Sk') to form a display panel group SW. FIG. 4A shows a plan view of the unit substrates S1 and S2 before being bonded, and FIG.
FIG. 4B is a perspective view of the display panel group SW to which the unit substrates S1 and S2 shown in FIG. FIG.
In (B), the electrode patterns T1, T2 and the like are not shown. The formation of the display panel group will also be described later.

After that, the display panel group SW is divided into individual liquid crystal display panels (step S1), and the divided liquid crystal display panels are classified into good and defective products (step Sm). The process of extracting terminal electrodes is performed on the liquid crystal display panel (step Sn). Thus, a liquid crystal display panel LCD is obtained.

FIG. 5A is a schematic sectional view of an example of the unit substrate cutting apparatus of the present invention for implementing the unit substrate cutting method of the present invention, and FIG. 5B is a plan view thereof.

The unit substrate cutting apparatus shown in FIG. 5 includes a plurality of display panel substrate equivalent regions a for manufacturing a display panel LCD having a display material LC sandwiched between a pair of film substrates s1 and s2. This is a device that cuts out a unit substrate S1 (S2) for multi-substrate cutting from a long film F, and a region a corresponding to a display panel substrate is in the film short direction y.
At least one of which is arranged in the film longitudinal direction x at a plurality of predetermined pitches p, and which indicates a film cutting position at a portion outside the display panel substrate equivalent region a for each column of the region a in the film lateral direction y. A storage unit 10 for a long film that houses a long film F on which a marker m is formed, a cutting device 20 that cuts the long film F along the film short direction y, and a display panel for the long film F Inspection device 3 for judging pass / fail of substrate equivalent region
0, a driving device 40 for moving the long film F out of the storage section 10 and relatively moving the long film F relative to the cutting device 20 in the film longitudinal direction x, and detecting a film cutting position indicated by the marker m of the long film F. A marker detecting device (inspection device serving also as the marker detecting device) 30 and a control unit CONT for controlling a cutting position of the long film F are provided.

The long film F is wound around a roller FR here. The storage unit 10 can store the roller FR around which the film F has been wound.

The cutting device 20 includes a cutter knife driving device 2
1, 22 and cutter knives 21a and 22a.
The cutter knives 21a and 22a are both long films F
For cutting off. The driving devices 21 and 22 are connected to the control unit CONT, respectively.
Under the instruction of T, the cutter knives 21a and 22a can be moved in the vertical direction (z in the figure). Thereby, the long film F can be cut.

The driving device 40 includes a load mechanism 41, a transport device 42, and a film support 43.

The loading mechanism 41 includes a film roller driving device 41a, a film feeding claw and a film guide 41.
b. The film roller driving device 41a is connected to the control unit CONT, and can rotationally drive the roller FR stored in the storage unit 10 in a predetermined direction (w direction in the drawing) under the instruction of the control unit CONT. The film feeding claw and film guide 41b is attached to the film F
The film F wound around the roller FR can be guided to the transport device 42 by rotating the roller FR by the driving device 41a. Thereby, the long film F wound around the roller FR can be fed out toward the transport device 42.

The conveying device 42 includes a conveying belt 42a, a driving pulley 42b, a driven pulley 42c, and a belt driving device 42d.
It has. The transport belt 42a is wound around a driving pulley 42b and a driven pulley 42c, and
1 can hold the long film F fed out of the storage section 10. The belt driving device 42d includes a control unit C
Connected to the ONT, and under the direction of the control unit CONT,
The driving pulley 42b can be rotationally driven in a predetermined direction (w direction in the figure).

The driving pulley 42b of the belt 42a is rotated in the w direction by the belt driving device 42d. Thus, the long film F held by the belt 42a can be relatively moved in the film longitudinal direction x with respect to the cutting device 20. The belt 42a has a belt slit 4 for the cutter knives 21a and 22a to enter and exit.
2a 'is provided (see FIG. 5B), and the film F is held so that the slit 42a' and the marker m of the film F coincide with each other.

The film support 43 is for supporting the film F when cutting the long film F.
(A), the driving pulley 42b and the driven pulley 4
2c. The film support 43 is
A support base slit 43 'is provided for the cutter knives 21a and 22a to enter and exit.

In the transfer device 42, in order to more reliably hold the long film F, suction holes for adsorbing substrates are provided at predetermined intervals in at least a region of the transfer belt 42a where the film F is held. In this case, a plurality may be provided so as to be vacuum-sucked from the support table 43. Alternatively, the long film F may be fixed to the conveyor belt 42a by a jig or the like.

The inspection device 30 includes a sensor 31 for detecting the pass / fail state of the display panel substrate-corresponding area a in a portion corresponding to the unit substrate of the long film F, and a display panel arranged in the short direction y of the long film F. And a sensor 32 for detecting a pass / fail state of the substrate equivalent area a.

The sensor 31 is connected to the control unit CONT, and is arranged on the upstream side of the knife 21a in the relative traveling direction x of the long film F with respect to the cutter knife 21a of the cutting device 20. Here, the sensor 31 detects the pass / fail state of the region a in the portion corresponding to the unit substrate of the film F by sequentially detecting the region a of the film F conveyed by the conveying device 42. However, the present invention is not limited to this.
Any one may be used as long as it can detect the pass / fail state of the device.

The sensor 32 is connected to the control unit CONT. The sensor 32 is connected to the knife 2a in the direction x in which the long film F moves relative to the cutter knife 22a of the cutting device 20.
It is arranged downstream of 2a and near the knife 22a. Here, the sensor 32 detects an area a arranged below the knife 22a and arranged in the short direction y in the film F conveyed by the conveying device 42.

In the long film F, the quality of the display panel substrate equivalent area a is determined in advance, and a defect indicating the failure of the display panel substrate equivalent area a is shown near the defective display panel substrate equivalent area a. Marker M is marked (FIG. 5
(B)).

Each of the sensors 31 and 32 detects the defect state of the area a by detecting a defective marker M which is previously written in the vicinity of the area a corresponding to the defective display panel substrate in the long film F. Things. However, the present invention is not limited to this, and the quality of the area a may be directly detected. The detection result of the pass / fail state of the area a detected by the sensors 31 and 32 is sent to the control unit CONT.

The marker detecting device (inspection device serving also as the detecting device) 30 detects the alignment marker m formed in advance on the long film F by the sensors 31 and 32 to determine the film cutting position indicated by the marker m. Can be detected. The detection result of the film cutting position detected by the sensors 31 and 32 is sent to the control unit CONT.

When cutting out the unit substrate S1 (S2) from the long film F, the control unit CONT controls the driving device 40
To move the long film F relative to the cutting device 20 in the film longitudinal direction x, and in accordance with the quality judgment result of the display panel substrate equivalent region a by the inspection device 30, the marker detection device 30 in the cutting device 20 The film cutting position is controlled so as to cut the long film F at the detected film cutting position. Here, the following (a),
Any one of the controls (b1) and (b2) can be switched and controlled. (A) Control The control unit CONT is configured to obtain a unit substrate S1 (S2) including a predetermined number of display panel substrate-equivalent regions a, and to control a defective display panel included in the unit substrate S1 (S2). The film cutting position is controlled so that the area a corresponding to the substrate remains below a predetermined number. Furthermore, long film F
When the number of defective display panel substrate equivalent regions a included in the unit substrate equivalent portion to be cut out is larger than the predetermined number, each time the unit substrate equivalent portion is longer than the predetermined number, Relative movement direction x of film F
In step (1), the film cutting position is controlled so that the long film F is cut between the region a of the leading portion and the region a on the upstream side adjacent thereto to define a portion corresponding to a new unit substrate.

In the case of the control (a), the long film F
Is cut by the cutter knife 21a of the cutting device 20, and the sensor 31 of the inspection device 30 detects the quality of the display panel substrate equivalent region a in the unit substrate equivalent portion of the long film F. (B1) Control The control unit CONT is configured to obtain a unit substrate including a predetermined number of display panel substrate equivalent regions a, and to perform a cutting device in a unit substrate equivalent portion where a long film F is to be cut out. When there is a predetermined number or more of defective areas a at the head in the relative movement direction x of the long film F with respect to the area 20, each time, the area a and an area corresponding to the upstream display panel substrate adjacent thereto are provided. a long film F between
Is cut to define a new unit substrate equivalent portion, and when the leading portion of the unit substrate equivalent portion to be cut out of the long film F does not have the predetermined number or more defective areas at the head portion, The film cutting position is controlled so that a portion corresponding to the unit substrate including the leading portion is cut out. (B2) Control The control unit CONT is configured to obtain a unit substrate including a predetermined number of display panel substrate equivalent regions a, and to perform a cutting device in a unit substrate equivalent portion where a long film F is to be cut out. When there is a predetermined number or more of defective areas a at the head in the relative movement direction x of the long film F with respect to the area 20, each time, the area a and an area corresponding to the upstream display panel substrate adjacent thereto are provided. a long film F between
In order to define a new unit substrate equivalent portion, and among the unit substrate equivalent portions to be cut out of the long film F, there is no defective area of the predetermined number or more at the head portion, When there is a predetermined number or more defective areas in the row of the area a in the film lateral direction y in the upstream section from the leading section, each time the area a in the row and the upstream area a adjacent to the area a are adjacent to each other. The film cutting position is controlled so that the long film F is cut in between to define a portion corresponding to a new unit substrate.

In the case of the controls (b1) and (b2),
For cutting the long film F, the cutter knife 2 of the cutting device 20 is used.
2a, and the sensor 32 of the inspection device 30 detects the pass / fail state of the display panel substrate equivalent region a in the unit substrate equivalent portion of the long film F.

The unit substrate cutting apparatus shown in FIG.
It has a storage part (not shown) that can store a unit substrate or the like cut out from the long film F.

In the unit substrate cutting apparatus described above,
From the long film F stored in the storage unit 10 to the unit substrate S
In cutting out 1 (S2), first, the roller FR around which the long film F has been wound by the loading mechanism 41 is rotated,
The long film F is pulled out from the storage section 10 toward the transport device 42, and the transport belt 42a holds the film F.
Then, the long film F is cut by the transport device 42 into the cutting device 2.
The film is moved relative to 0 in the longitudinal direction x of the film, cut out at the first marker m of the film F by the cutting device 20, and an unnecessary portion of the long film tip portion without the electrode pattern / alignment marker is cut off.

Subsequently, the long film F is further pulled out from the storage section 10 by the transport device 42, and the unit substrate S1 (S2) is cut out from the long film F.

The cutout of the unit substrate S1 (S2) will be specifically described with reference to FIGS.

FIG. 6A is a diagram for explaining an example of the above control (a) by the control unit CONT.
(B) shows a diagram for explaining another example of the control of (a) by the control unit CONT. In FIG. 6, a defective electrode pattern is indicated by a cross in the figure, and a non-defective electrode pattern is indicated by a circle in the figure. The same applies to FIG. 7 described later.

Here, the predetermined number is assumed to be 0, and 3 × 2
The case of cutting out the unit substrate for taking six substrates described above will be described. In the case of the control of (a) As shown in FIGS. 6A and 6B, there is no defective display panel substrate equivalent region a included in the unit substrate equivalent portion D1 to be cut out of the long film F. A unit substrate S1 (S2) is cut out from the long film F at a film cutting position C3 indicated by a marker m3. 2. Next, since there is one defective display panel substrate equivalent region a included in the unit substrate equivalent portion D2 to be cut out of the long film F, each time the unit substrate equivalent portion D2 Long film F for cutting device 20
In the relative movement direction x, between the area a of the leading portion D2a and the area a of the upstream side D2b adjacent thereto, that is, in the example of FIG. 6A, the film cutting position C4 indicated by the marker m4, and FIG. In the example of ()), the long film F is cut at the film cutting position C5 indicated by the marker m5 to determine a new unit D2 'corresponding to a unit substrate. The leading portion D2a cut out here is discarded later in the unit substrate sorting / sorting process. 3. Since the defective display panel substrate equivalent region a included in the new unit substrate equivalent portion D2 ′ is 0, the film cutting position C7 indicated by the marker m7 in the example of FIG. In the example of FIG. 6B, the marker m
At the film cutting position C8 indicated by reference numeral 8, the unit substrate S1 (S
Cut out 2). 4. Thereafter, the above control is similarly performed.

FIGS. 7A and 7B show the control unit CON.
FIG. 7C is a diagram for explaining an example of the control of (b1) by T, and FIG.
The figure for demonstrating an example of control of 2) is shown.

Here, the predetermined number is assumed to be 0, and 3 × 2
The case of cutting out the unit substrate for taking six substrates described above will be described. In the case of the control of (b1) As shown in FIGS. 7A and 7B, the leading portion of the portion D1 corresponding to the unit substrate to be cut out of the long film F in the relative movement direction x of the long film F with respect to the cutting device 20. Since there are zero or more defective areas a in D1a, each time the area is indicated by the marker m2 between the area a and the display panel substrate-equivalent area a on the upstream side D1b adjacent to the area a. The long film F is cut at the film cutting position C2 to define a new unit substrate equivalent portion D1 '. Head part D1a cut out here
Is discarded later in the unit substrate sorting / sorting process. 2. Next, since there is no zero or more defective area in the head portion D1a 'of the unit substrate equivalent portion D1' to be cut out of the long film F, the unit substrate equivalent portion D1 'including the head portion D1a' is cut out. That is, in the illustrated example, the marker m5
The long film F is cut at the film cutting position C5 indicated by, and the unit substrate S1 (S2) is cut out from the long film F. The cut out unit substrate S1 (S2) includes a defective area. Here, in the unit substrate sorting / sorting step, those having the defective area at the same position are collected and stored. 3. Next, since there is no defective area in the leading portion D2a of the unit substrate equivalent portion D2 to be cut out of the long film F, the unit substrate equivalent portion D2 including the leading portion D2a is cut out. That is, in the illustrated example, the unit substrate S1 (S2) is cut out at the film cutting position C8 indicated by the marker m8. 4. Thereafter, the above control is similarly performed. In the case of the control of (b2) As shown in FIG. 7 (C), 1 of the above (b1). The long film F is cut at the film cutting position C2 indicated by the marker m2 as in
Define 1 '. The leading portion D1a cut out here is:
It will be discarded later in the unit substrate sorting / sorting process. 2. Next, of the unit substrate-equivalent portion D1 'to be cut out of the long film F, the leading portion D1a' has no defective area of zero or more, but the upstream portion D1a 'of the leading portion D1a'.
Row D1c 'of region a in b' of film short direction y
There are zero or more defective areas, so that each time between the area a of the row D1c ′ and the area a of the upstream side D1d ′ adjacent thereto, that is, the film cutting position indicated by the marker m4 in the illustrated example The long film F is cut at C4 to define a new portion D1 ″ corresponding to a unit substrate. From the leading portion D1a ′ cut out, a portion D1 including the defective area is cut out.
Until c ′, it is discarded later in the unit substrate sorting / sorting process. 3. Leading portion D1 of new unit substrate equivalent portion D1 "
Since there is no defective area in a ″ and no defective area in the part D1b ″ upstream from the leading part D1a ″, the leading part D1
A unit substrate equivalent portion D1 "including a" is cut out. That is, in the illustrated example, the film cutting position C indicated by the marker m7
At 7, the unit substrate S1 (S2) is cut out. 4. Thereafter, the above control is similarly performed.

In any case, the unit substrates and the like cut out from the long film F are stored in a storage section (not shown).

According to the unit substrate cutting apparatus shown in FIG. 5, as shown in FIG. 6, the defective display panel substrate equivalent region a included in the unit substrate S1 (S2) is reduced to a predetermined number (here, 0) or less. Since the long film F is cut so as to stop, as shown in FIG. 7, the leading portion D of the unit substrate equivalent portion D1 to be cut out of the long film F is used.
When there is a predetermined number (here, 0) or more defective areas a in 1a, each time the area a is long between the area a and the display panel substrate equivalent area a on the upstream side D1b adjacent thereto. Cut the film F to obtain a new unit substrate equivalent part D1 '
Is determined, the unit substrate S cut out in any case
Area a corresponding to the defective display panel substrate in 1 (S2)
Can be reduced as compared with the case where it is cut out by the conventional device.

FIG. 8 shows an example of the overall configuration of a device used for manufacturing a liquid crystal display panel LCD and an example of a processing process thereof.

As shown in FIG. 8, the film cut from the long film by the “unit substrate cutting device” is sorted and sorted by the “unit substrate sorting device”. That is, a unit substrate having no defect in any of the display panel substrate equivalent regions a is sorted as a completely non-defective unit substrate, and a unit substrate having a defect in some display panel substrate equivalent regions a is regarded as a partially defective unit substrate. Those having a defective area at the same position are sorted. Also, the above-mentioned head portion and the like are discarded here.

The completely non-defective unit substrates and the partially defective unit substrates sorted by the “unit substrate sorting device” are cleaned by the “cleaning device”, and each display panel substrate equivalent area “a” is printed by the “flexographic printing device”. Insulation film IS
And an alignment film FF are formed. After cleaning and formation of a thin film such as an insulating film, each display panel substrate equivalent region a
Spacers SP are sprayed on the sealing wall S for surrounding the liquid crystal material.
L is formed.

These unit substrates are referred to as a “bonding device”
To form a display panel group SW.

FIG. 9 shows a schematic configuration of an example of the bonding apparatus.

The bonding apparatus shown in FIG. 9 includes a first stage 100, a second stage 200, a driving device 310 for the stage 100, a driving device 320 for the stage 200, a positioning device 400, a positioning device 500, and a pressing roller 6.
10, heating / pressing roller 70, liquid crystal material coating apparatus 1000
It has.

The first and second stages 100 and 200 hold unit substrates S1 and S2, respectively, and include first and second suction tables 101 and 201 and substrate holding devices 110 and 210 for holding substrates. Respectively.

First and second suction tables 101, 201
Are provided with a plurality of suction holes 101a and 201a for holding the substrates S1 and S2 at predetermined intervals in a region for holding the substrates.

The substrate holding devices 110 and 210 include, in addition to the suction holes 101a and 201a, the exhaust chambers 111 and 211, the flexible tubes 112 and
12. Exhaust devices 113 and 213 are included. The exhaust devices 113 and 213 are provided at one end of the tubes 112 and 212,
The other ends of the tubes 112 and 212 are connected to the exhaust chambers 111 and 21 respectively.
1 respectively. The exhaust chambers 111 and 211 are provided in the suction holes 101a and 201 of the suction tables 101 and 201, respectively.
a. Thus, the exhaust device 113,
213 causes air to flow through the intake holes 101a and 201a.
The air is exhausted through the exhaust chambers 111 and 211 and the tubes 112 and 212, respectively.

The driving device 310 of the first stage 100
Although not limited thereto, a pinion gear 313 provided on the first stage 100 meshes with a rack gear 311 a provided along the guide rail 311, and a motor 312 mounted on the first stage 100 with the pinion gear 313.
To reciprocate. The first stage 100 is moved along the guide rail 311 by the driving device 310, and the substrate alignment position Q1, the liquid crystal material application position Q2,
It is arranged at the substrate temporary bonding start position Q3 or the main substrate bonding start position Q4. During this movement, the slider 102 provided on the first stage 100 slides along the guide rail 311.

The driving device 320 of the second stage 200 is
It includes a second stage support arm 321 and a rotation drive section 322 that drives the second stage support arm 321.

The second stage support arm 321 is supported at one end by the shaft 322a of the rotary drive 322, and is connected to the second stage 200 at the other end. The rotation drive section 322 is disposed at a fixed position, and can rotate the shaft 322a at a predetermined timing in a predetermined direction (A direction in the figure) or in a direction opposite to the predetermined direction (B direction in the figure). Thus,
The rotation of the shaft 322 a by the driving of the rotation drive unit 322 causes the support arm 321 and the second stage 200 to turn in the A direction or the B direction at a predetermined timing. This allows
The driving devices 310 and 320 are unit substrates S1 and S2 held on the first and second stages 100 and 200, respectively.
And the first and second stages 100 and 2 so that predetermined ends of both substrates S1 and S2 are overlapped with each other.
00 can be relatively moved.

Here, the pressing roller 610 is a rotatable pressing roller having a circular cross section, and can be raised and lowered by a lifting drive device (not shown). Thus, the pressing roller 610 is moved from the substrate temporary bonding start position Q3 to the predetermined position at a predetermined timing to the predetermined position. The unit substrate S1, S2 is pressed to the first stage 100 under the predetermined pressing force or retracted upward from the position P1 or the position P1. At the evacuation position P2. Thus, the end portions of the unit substrates S1 and S2 to be superimposed can be sandwiched between the unit stage S1 and the first stage 100.

The heating / pressing roller 70 is a rotatable roller having a uniform diameter and a circular cross section. Further, the heating / pressing roller 70 has a built-in heating device 71. The heating / pressing roller 70 can be moved up and down by a lifting drive device (not shown). Thus, the heating and pressing roller 70 presses the unit substrates S1 and S2, which are moved from the main substrate bonding start position Q4 to the predetermined position at a predetermined timing, while heating the unit substrates S1 and S2 to the first stage 100 at a predetermined pressure and at a predetermined temperature. It is arranged at a position P5 or a retreat position P6 that retreats upward from the position P5. Thereby, both substrates S1 and S2 are moved to the first stage 10
Pressure can be applied while heating with the movement of zero.

The liquid crystal material application device 1000 is disposed above the liquid crystal material application position Q2, and can be moved up and down by a lifting drive device (not shown). A liquid crystal material supply position P3 for supplying the liquid crystal material L to the unit plate S1 at a predetermined timing or a retreat position P4 retracting upward from the position P3.
Placed in Thereby, the liquid crystal material LC can be arranged on the unit substrate S1 held on the first stage 100.

The positioning device 400 is the first stage 10
0 for aligning the unit substrate S1 with 0,
It is arranged above the substrate alignment position Q1.

The positioning device 400 includes two cameras 410 (here, a CCD camera), an XY-θ driving device D1 incorporated in the stage 100, and a control unit 430. Suction table 10 in stage 100
1 can be driven XY-θ by an XY-θ driving device D1.

The CCD camera 410 shown in FIG.
30, observes an alignment marker m formed in advance on the substrate S1 held on the suction table 101 of the stage 100, and transmits the mark information to the control unit 430.
Can be sent to

The control section 430 controls the operation of the XY-θ driving device D1 based on the mark information from the camera 410 so as to position the substrate S1 at a predetermined position.

The positioning device 500 is the second stage 20
The unit substrate S2 is positioned at 0, and is disposed above the second stage 200.

The positioning device 500 also includes two cameras 510 (here, a CCD camera), an XY-θ driving device D2 incorporated in the stage 200, and a control unit 530. Suction table 20 in stage 200
1 can be driven XY-θ by an XY-θ driving device D2.

The CCD camera 510 shown in FIG.
30 and an alignment marker m formed in advance on the substrate S2 held on the suction table 201 of the stage 200, and the mark information is transmitted to the control unit 530.
Can be sent to

The control section 530 controls the operation of the XY-θ driving device D2 based on the mark information from the camera 510 so as to position the substrate S2 at a predetermined position.

Camera 51 in positioning device 500
0 is the second stage 20 except when aligning the substrate S2.
The device is lifted and retracted by a device (not shown) so as to allow a zero turn.

The substrate S1 on the stages 100 and 200
Positioning of S2 is performed by later overlapping predetermined ends of both substrates S1 and S2, temporarily bonding both substrates by pressing roller 610, and finally bonding both substrates by heating / pressing roller 70. This is performed so that the alignment is performed with high accuracy.

According to the bonding apparatus shown in FIG. 9, first, the unit substrate S1 is suction-held on the first stage 100 on the surface opposite to the surface on which the electrode pattern T1 is provided. Next, the unit substrate S2 is suction-held on the second stage 200 on the surface opposite to the surface on which the electrode pattern T2 is provided.

Further, the substrate S1 held on the first stage 100 is positioned by the positioning device 400, and the substrate S2 held on the second stage 200 is positioned by the positioning device 500. After the alignment, the camera 510 in the device 500 is raised.

The first stage 100 holding the first substrate S1 by suction by the driving device 310 of the stage 100 is moved to a position where a predetermined end of the substrate S1 is below the liquid crystal material coating device 1000, that is, a liquid crystal material coating position Q2. The liquid crystal material application device 1000 is moved down to the material supply position P3. Then, a predetermined amount of liquid crystal material LC is arranged at the end of each display panel substrate equivalent region a on the substrate S1.

The liquid crystal material application device 1000 is raised to retreat from the position P3 to the retreat position P4, and the first stage 100 holding the unit substrate S1 by the stage driving device 310 is moved to the substrate on which the liquid crystal material LC is applied. It is moved to the position where the end of S1 comes below the pressing roller 610, that is, the substrate temporary bonding start position Q3.

The second stage 200 holding the unit substrate S2 by suction is rotated in the direction A by the stage driving device 320, and the predetermined ends of both substrates S1 and S2 are pressed by the pressing roller 610.
By moving the two substrates S1,
S2 is made to face, and predetermined ends of both substrates S1 and S2 are overlapped.

The pressing roller 610 is lowered to the substrate pressing position P1, and the overlapped ends of both substrates S1 and S2 are moved to the first position.
The stage 100 is pressed under a predetermined pressure.

Thereafter, the first stage 100 is moved relative to the second stage 200 and the pressing roller 610 by the stage driving device 310, that is, the first stage 100 is moved while the pressing roller 610 is interposed between the unit substrates S1 and S2. 100, the liquid crystal material is maintained between the two substrates S1 and S2 while maintaining the substrate pressurized state by the pressing roller 610, while pulling out the unit substrate S2 from the second stage 200. Both substrates S1 and S2 are temporarily bonded sequentially on the first stage 100 while spreading LC. When the temporary bonding is completed for each seal wall SL in the substrate advancing direction γ to the end portion (liquid crystal retaining portion) of the most downstream seal wall, the pressing roller 610 temporarily retreats to the retreat position P2, and then the next seal When the substrate portion where the wall SL is provided arrives, it descends to the substrate pressing position P1 and retreats to the position P2 when the temporary bonding to the end of the seal wall is completed. Thereafter, this operation is repeated in a similar manner.

Subsequently, the temporarily bonded portions of both substrates S 1 and S 2 are passed under the heating and pressing roller 70. The heating / pressing roller 70 is heated by a heating device 71 prior to the arrival of the substrate. Then, in the substrate advancing direction γ of the temporarily bonded substrate, the substrate portion provided with the seal wall SL on the most downstream side is lowered to the pressing position P5 at the timing of arrival, whereby the heating and pressing roller is pressed at the substrate portion. Nipping under a predetermined pressure between the first stage 70 and the first stage 100 is started. As the substrate continues to advance with the movement of the stage 100, the substrates S1 and S2 are fully bonded while being heated to a predetermined temperature. When this bonding is completed for each seal wall SL up to the end portion (liquid crystal retaining portion) of the most downstream seal wall in the substrate advancing direction γ, the heating / pressurizing roller 70 once retreats to the retreat position P6, and then continues to the next position. When the substrate portion on which the seal wall SL is provided arrives, it descends to the substrate pressing position P5, and retreats to the position P6 when the final bonding to the end of the seal wall is completed. Thereafter, this operation is repeated in a similar manner.

When the temporary bonding is completed to the substrate portion where the seal wall SL on the most upstream side is provided in the substrate traveling direction γ of the substrates S1 and S2, the pressing roller 610 is retracted to the retracted position P2.

The temporary bonding is completed, and both substrates S1, S2
When the main bonding is completed up to the substrate portion where the seal wall SL on the most upstream side is provided in the substrate advancing direction γ, the heating / pressing roller 70 retreats to the retreat position P6.

Thereafter, the substrate holding by the first stages 100 and 200 is released. Also, the second stage 200
And return to the initial position.

The display panel group SW is formed when the seal wall SL is cooled and hardened.

Here, the seal wall S for surrounding the liquid crystal material is used.
After the liquid crystal material LC is disposed (dropped), the two unit substrates S1 and S2 are attached to each other to form a display panel group SW.
And the unit substrates S1 and S2 are bonded to each other, and the liquid crystal material L is injected from the injection port by a vacuum injection method or the like.
C may be injected to close the injection port to form the display panel group SW. However, when a liquid crystal material is injected by a vacuum injection method or the like after bonding the unit substrates, any region corresponding to the display panel substrate can be applied to the unit substrate arranged at the peripheral portion of the substrate. For example, in a unit substrate of 40 × 8 × 5 substrates, the display panel substrate equivalent region is disposed inside the substrate in addition to the substrate peripheral portion. In the case of such a unit substrate, the liquid crystal material may be dropped and then bonded.

The display panel group S thus formed
W is divided into individual liquid crystal display panels by a "display panel dividing device" as shown in FIG. The liquid crystal display panel divided by the “display panel dividing device” is sorted by pass / fail by the “display panel sorting device” to be classified into non-defective and defective products, and the defective liquid crystal display panel is discarded.

According to the display panel manufacturing method of the present invention, the unit substrate S1 (S2) cut out by the unit substrate cutting method of the present invention can reduce the defective display panel substrate equivalent region a in the cut unit substrate. )
Is used to manufacture the display panel LCD, so that the yield rate of the obtained display panel LCD can be improved accordingly.

Next, specific examples in which the method of cutting out a unit substrate and the method of manufacturing a display panel according to the present invention will be described below. Example 1 Six 3 × 2 substrate unit substrates are cut out from a long film on which an electrode pattern for a simple matrix is formed,
A liquid crystal display panel was manufactured.

As the long film, a film obtained by previously patterning a predetermined electrode pattern on a 200 μm-thick polycarbonate film (manufactured by Teijin Limited) was used. The electrode pattern is provided in a region corresponding to the display panel substrate in the long film.

In the long film, two regions corresponding to the display panel substrate provided with the electrode patterns are arranged at a predetermined pitch in the longitudinal direction of the long film, and two in the longitudinal direction of the long film. Further, an alignment marker indicating a film cutting position is formed in a portion outside a region corresponding to a display panel substrate for each row of the region in the lateral direction of the film (hereinafter, one line of the region is referred to as one block). That is, alignment markers for film cutting are provided between the blocks, and cutting can be performed at any portion of the long film between the blocks. The alignment marker is provided simultaneously with the patterning of the electrode with ITO (indium tin oxide).

A unit substrate for cutting out six substrates was cut out from the long film by a unit substrate cutting device as shown in FIG.

Next, the cut position of the long film and the processing of the cut unit substrate after cutting will be described.

The pattern of the appearance of the defect in the long film is basically the same as that shown in FIGS.
0 (C). The arrow in the figure indicates the direction of movement of the long film relative to the cutting device.

FIG. 10A shows a state after cutting into unit substrates.
FIG. 10B and FIG. 10C show patterns when there is a defect in the second and third blocks, respectively, after cutting out the unit substrate. Shows a pattern.

In the case of FIG. 10A, a cut was made at an alignment marker (position C1 in FIG. 10A) adjacent to a defective block (hereinafter referred to as a defective block). The cut part was discarded.

In other cases, the unit substrate is cut into three unit blocks (the position of C3 in FIGS. 10B and 10C), and the cut unit substrate is not discarded, but is transferred to the next step. Advanced.

Thereafter, the cut unit substrate was washed with ultrapure water using a washing device, dried, and then a thin film such as an insulating film was formed by a flexographic printing device or the like. After the formation of the thin film on the unit substrate, spacers for maintaining a uniform cell gap were dispersed on one unit substrate, and a seal wall for preventing liquid crystal from leaking was provided on the other unit substrate. The pair of unit substrates were aligned using an alignment marker provided for bonding, and bonded by heating and pressing.

After the bonding, the seal wall was fully cured in order to completely cure the seal wall. After the sealing wall was completely cured, liquid crystal was injected by a vacuum injection method to form a display panel group. This display panel group was divided into individual liquid crystal display panels to obtain a liquid crystal display panel.

As described above, when a defect appears in the block immediately after the film is cut, only the defective portion is cut and discarded, and a liquid crystal display panel is manufactured. The number of defective liquid crystal display panels caused by overlapping can be reduced, and the non-defective rate of the liquid crystal display panels can be increased.

For example, consider a case where a 3 × 2 6-unit substrate is cut out from a long film in which 3000 electrodes having a non-defective rate of 97% are patterned and a display panel is manufactured using the cut-out unit substrate. .

In this case, the unit substrate 300 to be cut out
Ninety of the zero electrodes are defective.

Here, in the case where the long film is cut every three blocks without considering the defective portion by the conventional unit substrate cutting method, a maximum of 90 display panels out of 1500 display panels to be completed are obtained. It becomes bad. Therefore, in this case, among the 1500 display panels, the number of non-defective display panels is 1410, and the non-defective rate is 94%.

On the other hand, when a defect appears in the block immediately after the film cut as in the present embodiment, only the defective portion is cut, and the cut defective portion is discarded without proceeding to the next step. The defective electrode in the discarded part is 3
0 and 30 defective electrodes are discarded, and 60 defective electrodes on the unit substrate which proceeded to the next step are 1470 (the cutout portion of 30 display panels is discarded) among the completed display panels. , Up to 60 display panels are defective. Therefore, in this case, among the 1470 display panels, the number of non-defective display panels is 1410 and the non-defective rate is about 9
6%, and the non-defective rate can be improved. Also,
Useless work for manufacturing a defective display panel can be reduced. Example 2 The same long film as in Example 1 was used. Based on the result of the electrode pattern inspection performed in advance on the long film, the process proceeds to a thin film coating / firing process such as an alignment film using a roll-to-roll process. 3 × 2 substrate 6 in the same manner as
A unit substrate for cutting was cut out. That is, when a defect appeared in the block immediately after the film was cut, only the defective portion was cut, and the cut defective portion was discarded without proceeding to the next step. However, as for the unit substrates including the defective block, those having the defective electrode at the same position were collected and bonded together.

For example, in the same manner as in the first embodiment, a 3 × 2 6-unit substrate is cut out from a long film in which 3,000 electrodes having a non-defective rate of 97% are patterned, and a display panel is formed using the cut unit substrate. Consider the case of producing Ninety of the 3000 electrodes of the unit substrate to be cut out are defective electrodes.

Here, when a long film is cut into three blocks every three blocks without considering a defective portion by the conventional unit substrate cutting method, and electrodes having defective electrodes at the same position are collected and bonded together. Of the 1500 display panels, 45 display panels are defective at least. Therefore, in this case, out of the 1500 display panels, the number of non-defective display panels is 1455, and the non-defective rate is 97%.

On the other hand, if a defective block appears immediately after film cutting as in the present embodiment, only the defective portion is cut, and the cut defective portion is discarded without proceeding to the next step. The defective electrode in the portion to be
The number of defective electrodes to be discarded is 30, and the number of defective electrodes of the unit substrate advanced to the next process is 60. In addition, since electrodes having a defective electrode at the same position are collected and attached to each other, among the 1470 display panels (the cut-out portion for 30 display panels is discarded), at least 30 display panels are used when the minimum number is obtained. It becomes bad. Therefore, in this case, the number of non-defective display panels out of the 1470 display panels is 1440, and the non-defective rate is about 98%, which can improve the non-defective rate.

In addition, the rate at which the unit substrate including the defective electrode proceeds in the process is reduced, so that unnecessary work can be reduced, and the productivity of the display panel can be increased.
Therefore, even if various processes other than the electrode patterning process are performed by roll-to-roll and mass production is performed, loss is small. Example 3 The same long film as in Example 1 was used, and the long film was patterned with a roll-to-roll electrode.

Thereafter, processing was performed in the same manner as in Example 1 except for the cut position of the long film and the processing of the cut unit substrate after cutting. Hereinafter, the cut position of the long film and the processing of the cut unit substrate after the cut will be described, focusing on the differences from the case of the first embodiment.

The cut positions of the long film here are the following four cases. That is, [1] when all three blocks are non-defective, [2] when there is only one defective block (position C1 in FIG. 10A),
[3] There is a bad block after a non-bad block 2
In the case of blocks (position C2 in FIG. 10B),
[4] There are four cases where two non-bad blocks continue and then there are three bad blocks (position C3 in FIG. 10C). The processing after cutting was as follows. That is, the portion cut at the positions [2] and [3] is discarded, and the unit substrate cut at the positions [1] and [4] is advanced to the next step.

The difference from the first embodiment is that when a defect occurs, the defect is cut by two blocks each including one non-defective block and one defective block (the position of C2 in FIG. 10B), and the defect is determined. The point is that two blocks of substrates are discarded. Other points are the same as in the first embodiment.

For example, in the same manner as in Example 1, 6 × 3 substrate unit substrates are cut out from a long film in which 3000 electrodes having a non-defective rate of 97% are patterned, and a display panel is formed using the cut unit substrates. Consider the case of producing Ninety of the 3000 electrodes of the unit substrate to be cut out are defective electrodes.

In the case of the present embodiment, there are substantially 30 defective electrodes in the portions cut at the positions [2], [3] and [4]. Of these, 6 defective electrodes are discarded.
0, the number of defective electrodes of the unit substrate advanced to the next step is 30, and the number of non-defective electrodes discarded is 120,
Of the completed 1410 display panels (90 display panels cut out are discarded), a maximum of 30 display panels are defective. Accordingly, in this case, out of the 1410 display panels, the number of non-defective display panels is 1380, and the non-defective rate is about 98%, and the non-defective rate can be improved as compared with the case where the unit substrate is cut out by the conventional unit substrate cutting method. . In addition, the number of unit substrates including defective electrodes in the next process can be reduced, which leads to a reduction in useless work and a useless material, thereby increasing the productivity of the display panel. Example 4 In this example, the processing was performed in the same manner as in Example 3 except for the processing of the cut out unit substrate after the film cutting. Hereinafter, the processing of the cut unit substrate after the film cutting will be described focusing on the differences from the case of the third embodiment.

In this example, after the film was cut in Example 3, a unit substrate having a defective electrode which was advanced to the next step was collected and bonded together with a defective electrode at the same position.

For example, as in Example 1, a 3 × 2 6-unit substrate is cut out from a long film on which 3000 electrodes having a non-defective rate of 97% are patterned, and a display panel is formed using the cut-out unit substrate. Consider the case of producing Ninety out of the 3,000 electrodes of the unit substrate to be cut out are defective electrodes.

In this case, out of the completed 1410 display panels (90 display panel cut-out parts are discarded), 15 display panels are defective when the number is the smallest, which is more defective than in the third embodiment. Display panels can be halved. Accordingly, in this case, among the 1410 display panels, the number of non-defective display panels is 1,395, and the non-defective rate is about 99%. In the present embodiment, the yield rate can be increased as compared with the case of the third embodiment. Example 5 A 40-inch unit substrate was cut out from a long film on which an electrode pattern for a simple matrix was formed to produce a 2-inch liquid crystal display panel.

As the long film, a film obtained by previously patterning a predetermined electrode pattern on a 100 μm thick polycarbonate film (manufactured by Teijin Limited) was used. The electrode pattern is provided in a region corresponding to the display panel substrate in the long film.

FIG. 11A is a schematic plan view of the long film used in this example, and FIG. 11B shows the cut position of the long film when there is no defect in each block of the long film. Show. Note that the bold line in FIG. 11B indicates a unit substrate, and the arrow indicates a direction in which the long film moves relative to the cutting device.

As shown in FIG. 11A, the long film has a predetermined area corresponding to the display panel substrate on which the electrode pattern is provided, five in the short direction of the long film and a plurality of predetermined areas in the long direction of the long film. Are arranged at the same pitch. Further, an alignment marker indicating a film cutting position is formed in a portion outside a region corresponding to the display panel substrate for each row (each block) of the region in the lateral direction of the film. That is, alignment markers for film cutting are provided between the blocks, and cutting can be performed at any portion of the long film between the blocks. The alignment marker is provided at the same time as the patterning of the electrode with lTO (indium tin oxide).

A unit substrate for taking out 40 substrates was cut out from the long film by a unit substrate cutting device as shown in FIG.

The cut unit substrate was washed with ultrapure water using a washing device, dried, and formed into a thin film such as an alignment film using a flexographic printing device. After a thin film is formed on a unit substrate, spacers for keeping the cell gap uniform are scattered and liquid crystal is dropped on one unit substrate, and a seal wall is provided on the other unit substrate to prevent liquid crystal from leaking. Was. The pair of unit substrates are aligned using an alignment marker provided for bonding by a bonding apparatus as shown in FIG.
A display panel group was formed. This display panel group was divided into individual liquid crystal display panels to obtain a liquid crystal display panel.

When the process is carried out by roll-to-roll, when a defect occurs, the defect does not stop at the position where the defect has occurred, but continues. There is a problem of progress.

FIG. 11 (C) shows a cut position of the long film when a defect continuously occurs in some blocks of the long film. Note that the bold line in FIG. 11C indicates a unit substrate, and the arrow indicates a direction in which the long film moves relative to the cutting device.

For example, in the step of patterning an electrode on a long film, if a trouble occurs in a resist coating apparatus for applying a resist material to the long film, the situation that the resist material is not applied to a portion of the long film is considered. Become. In this case, the electrode cannot be patterned, so that an area corresponding to a defective display panel substrate having no electrode pattern is generated in a certain portion of the long film.

When a unit substrate for multi-substrate cutting is cut out from the long film, the long film is cut by alignment marks provided at every cutting pitch in the long film, as in the conventional unit substrate cutting method. When the cutting is performed, a large number of defective blocks may be included in a unit substrate cut out in a boundary region between a defective block and a block having no defect. When a display panel is manufactured using a unit substrate including many defective blocks, the yield rate of the obtained display panel is reduced accordingly.

In this embodiment, since a marker for cutting is provided between each block, FIG.
As shown in (1), a long film can be cut at a position just before a defective block is included in a boundary region between a continuously generated defective block and a block having no defect. Thus, a liquid crystal display panel can be manufactured without wasting portions without defects.

In the above, the electrode patterning step has been described as an example. However, the present invention is not limited to the electrode patterning step, but includes a thin film forming step, a seal forming step, and the like in which “continuous defects” are likely to occur in a roll-to-roll manufacturing process. In various processes, using the cutting markers provided between the blocks, cut the long film without waste,
Defective parts can be removed.

[0176]

As described above, according to the present invention, a large number of substrates including a predetermined number of display panel substrate equivalent regions for manufacturing a display panel in which a display material is sandwiched between a pair of film substrates. A unit substrate cutting method for cutting a unit substrate for use from a long film, wherein a region corresponding to a defective display panel substrate in the cut unit substrate is
It is possible to provide a unit substrate cutting method which can be reduced as compared with the case of cutting by a conventional method.

Further, according to the present invention, there is provided a method for manufacturing a display panel in which a display material is sandwiched between a pair of film substrates.
What is claimed is: 1. A unit substrate cutout apparatus for cutting a unit substrate for multi-panel production including a predetermined plurality of display panel substrate equivalent regions from a long film, wherein a defective display panel substrate equivalent region in the unit substrate to be cut is formed by a conventional device. It is possible to provide a unit substrate cutting device which can be reduced as compared with the case of cutting by a unit.

Further, according to the present invention, there is provided a method of manufacturing a display panel in which a display material is sandwiched between a pair of film substrates, wherein a method of manufacturing a display panel capable of improving the yield rate of the obtained display panel is provided. be able to.

[Brief description of the drawings]

FIG. 1A is a schematic cross-sectional view of an example of a display panel (here, a reflective liquid crystal display panel), and FIG. 1B is a plan view of the liquid crystal display panel shown in FIG. FIG.

FIG. 2 is a diagram illustrating an example of a manufacturing process of a liquid crystal display panel in which a liquid crystal material is sandwiched between a pair of film substrates illustrated in FIG.

FIG. 3 is a plan view of a part of an example of a long film used for manufacturing the liquid crystal display panel shown in FIG.

FIG. 4A is a plan view of a unit substrate before bonding, and FIG. 4B is a perspective view of a display panel group to which the unit substrates shown in FIG. .

FIG. 5A is a schematic cross-sectional view of an example of a unit substrate cutting device of the present invention for implementing the unit substrate cutting method of the present invention, and FIG. 5B is a plan view thereof.

FIG. 6A is a diagram for explaining an example of control of (a) by the control unit, and FIG. 6B is a diagram for explaining another example of control of (a) by the control unit; FIG.

FIGS. 7A and 7B are diagrams (b1) of a control unit.
Is a diagram for explaining an example of the control of (b), and FIG. (C) is a diagram for explaining an example of the control of (b2) by the control unit.

FIG. 8 is a diagram showing an overall configuration of an apparatus used for manufacturing a liquid crystal display panel and an example of a processing process thereof.

FIG. 9 is a diagram illustrating a schematic configuration of an example of a bonding apparatus.

FIG. 10 is a diagram showing an example of how a defect appears on a long film. FIG. 10A shows a pattern in the case where a block immediately after a cut is cut into a unit substrate, and a block immediately thereafter has a defect. B) shows a pattern in the case where there is a defect in the second block after cutting out the unit substrate, and FIG. (C) shows a pattern in which there is a defect in the third block after cutting out the unit substrate. FIG.

FIG. 11A is a schematic plan view of a long film used in Example 5, and FIG. 11B shows a cut position of the long film when there is no defect in each block of the long film. FIG. 4C is a view showing a cut position of the long film when a defect continuously occurs in some blocks of the long film.

FIG. 12A is a schematic plan view of an example of a conventional long film, and FIG. 12B includes a plurality of regions corresponding to the display panel substrate from the long film shown in FIG. It is a figure for explaining the conventional unit substrate cutout method of cutting out a unit substrate for multi-substrate picking.

[Explanation of symbols]

BK Light absorbing layer FF Alignment film IS Insulating film LC Liquid crystal material LCD Liquid crystal display panel RC Resin pillar SP Spacer SL Seal wall s1, s2 A pair of film substrates T1, T2 Electrode pattern t1, t2 Electrode 10 Long film accommodation section 20 Cutting Device 21, 22 Cutter knife driving device 21a, 22a Cutter knife 30 Inspection device (marker detection device) 31, 32 Sensor 40 Drive device 41 Loading mechanism 41a Film roller driving device 41b Film feeding claw and film guide 42 Transport device 42a Transport belt 42b Drive pulley 42c Driven pulley 42d Belt drive device 42a 'Belt slit 43 Film support base 43' Support base slit CONT Control unit C1, C2, C3 ... Film cutting position D1, D2, D3 Cutting out long film F D1a, D2a Head D1b, D2b Upstream side D1 ', D1 ", D2' adjacent to region a of head D1a, D2a New unit board equivalent D1a 'head D1b' head D1a 'The upstream portion D1c' adjacent to the region 'a' D The row of the region a in the film short direction y in the 'upstream portion D1b' F Long film FR Roller on which the long film F has been wound M Bad markers S1, S2 Many substrates Individual substrate unit a Area corresponding to display panel substrate m, m1, m2, m3... Alignment marker indicating film cutting position p Predetermined pitch 70 Heating and pressurizing roller 71 Heating device 100 First stage 101 First suction table 101a Intake hole 102 Slider 110 Substrate holding device 111 Exhaust chamber 112 Flexible tube 113 Exhaust Placement 1000 Liquid crystal material coating device 200 Second stage 201 Second suction table 201a Inlet hole 210 Substrate holding device 211 Exhaust chamber 212 Flexible tube 213 Exhaust device 310 Driving device of first stage 100 311 Guide rail 311a Rack gear 312 Motor 313 Pinion gear 320 Drive unit 321 for second stage 200 321 Second stage support arm 322 Rotary drive unit 322a Axis 400 Alignment device 410 Camera 430 Control unit 500 Alignment device 510 Camera 530 Control unit 610 Press roller P1 Press position P2 Evacuation position P3 Liquid crystal material supply Position P4 Evacuation position P5 Heat pressing position P6 Evacuation position Q1 Substrate alignment position Q2 Liquid crystal material arrangement position Q3 Substrate temporary bonding start position Q4 Substrate main bonding start Position F 'Long film m' Alignment marker for cutting out indicating film cutting position p 'Predetermined pitch S1', S2 'Unit substrate for multi-substrate picking s1', s2 'Substrate T1', T2 'Electrode pattern

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission Date] April 13, 2001 (2001.4.1
3)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0032

[Correction method] Change

[Correction contents]

In any of the first and second unit substrate cutting-out methods according to the present invention, the long film is used in the form of a wound roll, and in the film cutting step, the winding is performed. The long film that has been used may be fed out.

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0039

[Correction method] Change

[Correction contents]

In the unit substrate cutting apparatus according to the present invention,
When cutting out the unit substrate from the long film, the long film is taken out of the accommodation portion by the driving device and relatively moved in the film longitudinal direction with respect to the cutting device. Then, according to the result of the pass / fail judgment of the display panel substrate equivalent region by the inspection device, the cutting device
The long film is cut at a film cutting position detected by the detection device . At this time, the control unit performs one of the following controls (a) and (b). That is, (a) the control unit obtains a unit substrate including a predetermined number of display panel substrate equivalent regions, and reduces the number of defective display panel substrate equivalent regions included in the unit substrate to a predetermined number or less. The cutting position of the long film is controlled so as to stop. In this case, the apparatus of the present invention implements the first unit substrate cutting method of the present invention. (B) the control unit is configured to obtain a unit substrate including a predetermined number of display panel substrate-equivalent regions, and a long film for a cutting device in a unit substrate-equivalent portion to be cut out of the long film; In the relative movement direction, when there is a predetermined number or more of the defective areas at the head portion, each time, a long film is formed between the area and the area corresponding to the upstream display panel substrate adjacent thereto. The cutting position of the long film is controlled so as to cut and define a new unit substrate equivalent portion. In this case, the apparatus of the present invention implements the second unit substrate cutting-out method of the present invention.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0071

[Correction method] Change

[Correction contents]

The cutting device 20 includes a cutter knife driving device 2
1, 22 and cutter knives 21a and 22a.
The cutter knives 21a and 22a are both long films F
For cutting off. The driving devices 21 and 22 are connected to the control unit CONT, respectively.
Under the instruction of T, the cutter knives 21a and 22a can be moved in the elevating direction ( z direction in the figure ) . Thereby, the long film F can be cut.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0075

[Correction method] Change

[Correction contents]

[0075] Belt 42a is a driving pulley 42b is driven by being times to the w direction by 42d belt drive. Thus, the long film F held by the belt 42a can be relatively moved in the film longitudinal direction x with respect to the cutting device 20. Further, the belt 42a is provided with a belt slit 42a 'through which the cutter knives 21a and 22a enter and exit (see FIG. 5B).
The film F is held so that the slit 42a 'and the marker m of the film F coincide with each other.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0077

[Correction method] Change

[Correction contents]

[0077] Note that, in the transport apparatus 42, in order to hold the long film F more reliable ones, each predetermined interval of suction holes for suction in the region for holding at least the film F of the conveyor belt 42a Multiple,
You may comprise so that it may be vacuum-sucked from the support stand 43. Alternatively, the long film F may be fixed to the conveyor belt 42a by a jig or the like.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0092

[Correction method] Change

[Correction contents]

Here, a case will be described in which the predetermined number of the defective area a is set to 0 and a unit substrate for cutting out 6 3 × 2 substrates is cut out. In the case of the control of (a) As shown in FIGS. 6A and 6B, there is no defective display panel substrate equivalent region a included in the unit substrate equivalent portion D1 to be cut out of the long film F. A unit substrate S1 (S2) is cut out from the long film F at a film cutting position C3 indicated by a marker m3. 2. Next, since there is one defective display panel substrate equivalent region a included in the unit substrate equivalent portion D2 to be cut out of the long film F, each time the unit substrate equivalent portion D2 Long film F for cutting device 20
In the relative movement direction x, between the area a of the leading portion D2a and the area a of the upstream side D2b adjacent thereto, that is, in the example of FIG. 6A, the film cutting position C4 indicated by the marker m4, and FIG. In the example of ()), the long film F is cut at the film cutting position C5 indicated by the marker m5 to determine a new unit D2 'corresponding to a unit substrate. The leading portion D2a cut out here is discarded later in the unit substrate sorting / sorting process. 3. Since the defective display panel substrate equivalent region a included in the new unit substrate equivalent portion D2 ′ is 0, the film cutting position C7 indicated by the marker m7 in the example of FIG. In the example of FIG. 6B, the marker m
At the film cutting position C8 indicated by reference numeral 8, the unit substrate S1 (S
Cut out 2). 4. Thereafter, the above control is similarly performed.

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name]

[Correction method] Change

[Correction contents]

Here, a case will be described in which the predetermined number of the defective areas a is set to one and a unit substrate for cutting out six 3 × 2 substrates is cut out. In the case of the control of (b1) As shown in FIGS. 7A and 7B, the leading portion of the portion D1 corresponding to the unit substrate to be cut out of the long film F in the relative movement direction x of the long film F with respect to the cutting device 20. Since there is one defective area a in D1a, a film indicated by a marker m2 between the area a and the adjacent display panel substrate area a of the upstream side D1b each time, that is, in each case, Cutting position C2
Cuts the long film F with a new unit substrate equivalent part D
Define 1 '. The leading portion D1a cut out here is:
It will be discarded later in the unit substrate sorting / sorting process. 2. Next, since there is no defective area in the leading portion D1a ' of the unit substrate equivalent portion D1' to be cut out of the long film F, the unit substrate equivalent portion D1 'including the leading portion D1a' is included.
Cut out. That is, in the illustrated example, the long film F is cut at the film cutting position C5 indicated by the marker m5, and the unit substrate S1 (S2) is cut out from the long film F. The cut out unit substrate S1 (S2) includes a defective area. Here, in the unit substrate sorting / sorting step, those having the defective area at the same position are collected and stored. 3. Next, since there is no defective area in the leading portion D2a of the unit substrate equivalent portion D2 to be cut out of the long film F, the unit substrate equivalent portion D2 including the leading portion D2a is cut out. That is, in the illustrated example, the unit substrate S1 (S2) is cut out at the film cutting position C8 indicated by the marker m8. 4. Thereafter, the above control is similarly performed. In the case of the control of (b2) As shown in FIG. 7 (C), 1 of the above (b1). The long film F is cut at the film cutting position C2 indicated by the marker m2 as in
Define 1 '. The leading portion D1a cut out here is:
It will be discarded later in the unit substrate sorting / sorting process. 2. Next, there is no defective area in the leading portion D1a ' of the portion D1' corresponding to the unit substrate to be cut out of the long film F.
There are, 'Since there is one defective region, the each occasion, said column D1c' leading portion D1a 'upstream side portion D1b' column of the area a of the film widthwise direction y in D1c thereto and the region a of The long film F is cut between the adjacent area a of the upstream side D1d ', that is, at the film cutting position C4 indicated by the marker m4 in the illustrated example, and a new unit substrate equivalent portion D1 "is determined. Head part D1
From a ′ to the portion D1c ′ including the defective area, it is later discarded in the unit substrate sorting / sorting process. 3. Leading portion D1 of new unit substrate equivalent portion D1 "
Since there is no defective area in a ″ and no defective area in the part D1b ″ upstream from the leading part D1a ″, the leading part D1
A unit substrate equivalent portion D1 "including a" is cut out. That is, in the illustrated example, the film cutting position C indicated by the marker m7
At 7, the unit substrate S1 (S2) is cut out. 4. Thereafter, the above control is similarly performed.

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0096

[Correction method] Change

[Correction contents]

According to the unit substrate cutting apparatus shown in FIG. 5, as shown in FIG. 6, the defective display panel substrate equivalent region a included in the unit substrate S1 (S2) is reduced to a predetermined number (here, 0) or less. Since the long film F is cut so as to stop, as shown in FIG. 7, the leading portion D of the unit substrate equivalent portion D1 to be cut out of the long film F is used.
When a predetermined number ( here, one ) of defective areas a is present in 1a or more, each time the area a is long between the area a and the display panel substrate equivalent area a on the upstream side D1b adjacent thereto. Cut the film F to obtain a new unit substrate equivalent part D1 '
Is determined, the unit substrate S cut out in any case
Area a corresponding to the defective display panel substrate in 1 (S2)
Can be reduced as compared with the case where it is cut out by the conventional device.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Masakazu Okada 2-3-13 Azuchicho, Chuo-ku, Osaka-shi, Osaka F-term in Osaka International Building Minolta Co., Ltd. (reference) 2H088 FA06 FA07 FA12 FA25 FA26 2H090 JB03 JC13 JC18 JC20 5C094 AA42 AA43 BA43 CA19 EB02 GB10 5G435 AA17 BB12 EE33 KK05 KK10

Claims (18)

[Claims] 1. A method for cutting out a unit substrate for cutting a large number of substrates including a plurality of regions corresponding to display panel substrates from a long film, wherein the region corresponding to the display panel substrate is in a lateral direction of the long film. At least one, in the longitudinal direction of the long film, a plurality of in the longitudinal direction, an inspection step of judging the quality of the display panel substrate equivalent region in a long film arranged at a predetermined pitch, the long film in the film short direction A cutting device for cutting along the film and the long film are relatively moved in the longitudinal direction of the film, and the display panel is used by the cutting device according to the quality judgment result of the display panel substrate equivalent region in the inspection process. And a film cutting step of cutting the long film between the regions corresponding to the substrate for the display panel, wherein in the film cutting step, a predetermined number of display panel substrates Cutting a long film so as to obtain a unit substrate including the area, and to cut the number of defective display panel substrate equivalent areas included in the unit substrate to a predetermined number or less. Method. 2. In the film cutting step, when the number of defective display panel substrate equivalent regions included in the unit substrate equivalent portion to be cut out of the long film is larger than the predetermined number, each time, In the unit substrate equivalent portion, the long film is disposed between the display panel substrate equivalent region of the leading portion and the upstream display panel substrate equivalent region adjacent thereto in the leading direction in the relative movement direction of the long film with respect to the cutting device. 2. The unit substrate cutting-out method according to claim 1, wherein the unit substrate is cut to define a new unit substrate equivalent part. 3. The method according to claim 2, wherein the head portion is discarded. 4. A unit substrate cutting method for cutting a unit substrate for multi-panel production including a plurality of display panel substrate equivalent regions from a long film, wherein the display panel substrate equivalent region is in a lateral direction of the long film. At least one, in the longitudinal direction of the long film, a plurality of in the longitudinal direction, an inspection step of judging the quality of the display panel substrate equivalent region in a long film arranged at a predetermined pitch, the long film in the film short direction A cutting device for cutting along the film and the long film are relatively moved in the longitudinal direction of the film, and the display panel is used by the cutting device according to the quality judgment result of the display panel substrate equivalent region in the inspection process. And a film cutting step of cutting the long film between the regions corresponding to the substrate for the display panel, wherein in the film cutting step, a predetermined number of display panel substrates Cut the long film so as to obtain the unit substrate including this area, and, at the head portion in the relative movement direction of the long film with respect to the cutting device, of the portion corresponding to the unit substrate to be cut out of the long film. When there is a predetermined number or more of the defective areas, each time, the long film is cut between the area and an adjacent display panel substrate-equivalent area adjacent thereto and a new unit substrate-equivalent part is cut. A unit substrate cutting-out method characterized in that: 5. The method according to claim 4, wherein the head portion is discarded. 6. In the film cutting step, if there is no defective area equal to or more than the predetermined number in the leading portion of the unit substrate corresponding portion to be cut out of the long film, the unit substrate includes the leading portion. 6. The unit substrate cutting method according to claim 4, wherein the long film is cut so as to cut out a portion. 7. The unit substrate cutting method according to claim 6, wherein, among the unit substrates cut out, the unit substrates having a defective region at the same position among the unit substrates including the defective region are collected and stored. 8. In the film cutting step, the leading portion of the portion corresponding to the unit substrate to be cut out of the long film does not have the defective area of the predetermined number or more, but the portion in the upstream portion of the leading portion is When there is a defective area of a predetermined number or more in the row of the area in the film short direction, each time, cut the long film between the area of the row and the upstream area adjacent thereto. 5. The method according to claim 4, wherein a portion corresponding to a new unit substrate is determined. 9. The unit substrate cutting method according to claim 8, wherein the portion from the head portion to the portion including the defective area is discarded. 10. The rolled long film is used as the long film, and the wound long film is fed out in the film cutting step.
The method for cutting out a unit substrate according to any one of the above. 11. The long film from which the unit substrate is cut out has a predetermined electrode pattern formed in a region corresponding to a display panel substrate. The method for cutting out a unit substrate according to any one of claims 1 to 10, wherein the method is performed by determining the quality of the electrode pattern. 12. The liquid crystal display panel according to claim 1, wherein the long film is for obtaining a liquid crystal display panel substrate, and the unit substrate includes a predetermined number of liquid crystal display panel substrates.
The method for cutting out a unit substrate according to any one of the first to third aspects. 13. A unit substrate having a region corresponding to one substrate constituting a display panel as a unit substrate cut out by the unit substrate cutting method according to any one of claims 1 to 12; A method of manufacturing a display panel, comprising: a step of forming a display panel group connected in series using a unit substrate having a corresponding region; and a step of dividing the display panel group into individual display panels. . 14. A unit substrate having a region corresponding to one substrate constituting a display panel and having a defective region, and a unit substrate having a region corresponding to the other substrate and having a defective region. 14. The method of manufacturing a display panel according to claim 13, wherein when using a display panel group, the display panel group is formed using a unit substrate capable of forming the display panel group connected in series such that the defective areas overlap. 15. The method of manufacturing a display panel according to claim 13, further comprising a step of discarding a display panel having a defective substrate among the display panels divided individually. 16. A unit substrate cutout device for cutting out a unit film for multi-unit picking up from a long film, including a predetermined plurality of display panel substrate equivalent regions, wherein the display panel substrate equivalent region is in a lateral direction of the long film. At least one, a plurality of long films in the longitudinal direction thereof, a storage portion for a long film that stores long films arranged at a predetermined pitch, and a cutting device that cuts the long films along the film short direction. A driving device that moves the long film out of the housing portion and relatively moves the cutting device with respect to the cutting device in the film longitudinal direction, and an inspection device that determines the quality of a display panel substrate equivalent region in the long film. A detecting device that detects a cutting position of the long film, and a control unit that controls a cutting position of the long film, the control unit includes: In cutting out the unit substrate from the long film, the driving device moves the long film relatively in the film longitudinal direction with respect to the cutting device, and the pass / fail judgment result of the display panel substrate equivalent region by the inspection device is used. A unit substrate cutting device, wherein a film cutting position is controlled so as to cut the long film at a film cutting position detected by the detecting device in the cutting device. 17. The cutting device has a cutter knife, and the inspection device has a sensor for detecting a pass / fail state of a region corresponding to a display panel substrate in a portion corresponding to a unit substrate of a long film. 17. The unit substrate cutting device according to claim 16, wherein the sensor is disposed upstream of the cutting device in a direction in which the long film moves relative to the cutter knife. 18. The cutting device has a cutter knife, and the inspection device has a sensor for detecting a pass / fail state of at least one display panel substrate-corresponding region arranged in a short direction of a long film. 17. The unit substrate cutting device according to claim 16, wherein the sensor is disposed downstream of the knife in the direction of advance of the long film relative to the cutter knife of the cutting device and near the knife.