JP2002283299A5 - - Google Patents

Description

[0005]
[Means for Solving the Problems]
Microelectromechanical having a microstructure, an electric circuit is formed on the wafer-shaped workpiece is formed, then chips and dicing in g, further, be shipped mounted in the package. Alternatively, it is installed in an apparatus using an image display apparatus such as a projector or other small electric device. Therefore, it is required that the desired performance can be exhibited at the packaging stage. However, even if it is made into a chip, even if it exhibits desired performance, problems may occur after packaging, and it is considered that adhesion of dust, minute deformation of the working part, etc. are the factors. Therefore, in the present invention, when manufacturing a micro-electric machine, it is not a complete product at the chipping stage, but is complete at the chip level after being packaged and electrically connected (wiring). It is like that. For this reason, at least at the stage of packaging, the sacrificial layer for producing the structural layer is removed to complete the micro-electric machine. Thereby, by leaving the sacrificial layer for forming the structural layer of the micro electric machine until the wiring process after packaging is completed, adhesion of dust that may occur when wiring such as bonding, micro It is possible to protect the micro electric machine from such deformation, and to improve the yield, quality and reliability at the packaging stage.

[0010]
Furthermore, Etchento used in the production method of the present invention, since it dry etching, following the etching in the same chamber over, it is possible to continue performing the step of sealing the substrate attached to the packaging material. Therefore, sealing is performed in a vacuum or nitrogen atmosphere, and the substrate can be sealed without being exposed to the outside air, so that intrusion of dust and the like can be prevented. Furthermore, since it can be handled in a dry environment, problems such as adsorption due to moisture can be avoided at the time of sealing, and high-quality micro electric machines with high reliability can be manufactured with high yield in this respect as well. .

[0024]
Thereafter, as shown in FIG. 4, when using the device of the present example as an image display device, only the portion of the optical element layer 40 is an element by a technique such as dry etching for each light switching element 10 serving as a unit of each pixel. Separate and form grooves 90 between the elements. In this example, the sacrificial layer 99 is not removed at this stage. That is, the sacrificial layer 99 is left in the actuator layer 60, and the gap G which becomes a movable part when functioning as an actuator is filled with the sacrificial layer 99. In this state, the tip of the workpiece 50 and the die sheet ring from a wafer. Then, at the stage of manufacturing the chip 50 with the sacrificial layer 99, the process moves to a mounting process for mounting on the package material.

[0040]
Thus, steps in the present process, like the optical switching device 55 using the evanescent light as described above, the chip 50 that serves as a microelectromechanical package, attaching the light off § Lee bar serving as a light guide in yet this example The sacrificial layer 99 is left until the sacrificial layer is removed, and portions or elements of the micro-electric machine are allowed to stand and complete. Furthermore, by selecting the combination of the sacrificial layer 99 and the etchant for removing it without affecting the actuator 6, the optical element 49, the die attach agent 120, etc., the sacrificial layer is removed in the above order. Can be realized without any problems, and as a result, the yield can be improved and an optical switching device with high quality and reliability can be provided.

Claims (15)

Forming on the substrate a structural layer constituting a movable electrode, and a sacrificial layer for forming the structural layer to form a movable layer capable of electrically controlling or measuring the movement of the electrode;
A wiring step of attaching the substrate to a package material, and connecting a terminal of the substrate and a terminal of the package material;
Removing the sacrificial layer. The method of manufacturing a micro electric machine according to claim 1, wherein the movable layer forms at least one actuator. The method according to claim 1, wherein in the wiring step, the substrate is attached to the package material. In Claim 1, in the wiring step, the substrate and the package material are fixed by a die attach agent,
In the step of removing the sacrificial layer, a method of manufacturing a micro-electric machine using an etchant that does not affect the die attach agent. 5. The method of claim 4, wherein the sacrificial layer is silicon and the etchant is xenon fluoride. The method according to claim 4, wherein the sacrificial layer is silicon oxide and the etchant is hydrogen fluoride. The method according to claim 1, wherein the step of removing the sacrificial layer is performed in a chamber, and the step of subsequently sealing the substrate attached to the package material. The method according to claim 1, further comprising the step of attaching an attachment member to the electrode prior to the step of removing the sacrificial layer. The method according to claim 8, wherein the structural layer forms at least one actuator, and the attachment member is driven by the actuator. The method according to claim 1, wherein the movement of the electrode can be controlled or measured by electrostatic force. The method according to claim 1, wherein the movable layer forms at least one electrostatic actuator. Method according to claim 2, characterized in that it comprises the steps of forming an attachment layer with at least one attachment element driven by the actuator. The method of manufacturing a micro electric machine according to claim 12, wherein the actuator and the attachment element are two-dimensionally arranged, and the step of element separation of the attachment layer is performed before the wiring step. The micro electric machine according to claim 12, wherein the step of removing the sacrificial layer is performed in a chamber, and the step of subsequently sealing the substrate attached to the package material in a state where the attached element can operate. Production method. The method of manufacturing a micro-electric machine according to claim 12, further comprising the step of attaching an attachment member that moves with the attachment element prior to the step of removing the sacrificial layer.