JP2002280855A - Manufacturing method of vibrator, frequency adjustment device and vibrator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adjustment device that can adjust the resonance frequency of a vibrator at a low cost. SOLUTION: A head 10 is placed opposite to an electrode of a crystal board 3 and minute silver powder solution is jetted from nozzle holes of the head 10 and deposited on the electrode 2. An oscillation circuit 14 detects a resonance frequency of the crystal vibrator 1 to which the silver powder solution is deposited and a discrimination device 16 discriminates whether or not the detected resonance frequency is equal to a prescribed frequency. When the resonance frequency is the prescribed frequency, the frequency adjustment is terminated. On the other hand, when the resonance frequency is higher than the prescribed frequency, the head 10 is shifted and the minute silver powder solution is sequentially deposited to a position of the electrode 2 closer to its circumferential part and the frequency is adjusted furthermore until the resonance frequency reaches the prescribed frequency.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inexpensive vibrator having a small variation in resonance frequency, a method of manufacturing such a vibrator, and a vibrator frequency adjusting device.

[0002]

2. Description of the Related Art In recent years, in information processing devices such as personal computers and portable devices, the amount of information processing and the speed of information processing have been rapidly increasing. The clock frequency required for the MPU mounted on these devices or the oscillation frequency required for the oscillating element for mobile phones is increasing year by year. In such information processing equipment, AT-cut quartz resonators are widely used.

An AT-cut quartz resonator uses a very thin AT-cut quartz plate, but the resonance frequency of the resonator increases in inverse proportion to the thickness of the quartz plate. Then, an electrode is formed by depositing a metal thin film of silver, gold, nickel, aluminum or the like on a predetermined range on both surfaces of a very thin quartz plate by vacuum deposition or the like. However, an increase in mass due to such electrode formation causes a decrease in the resonance frequency of the crystal resonator.

Therefore, in general, the thickness of the quartz plate is set so as to be a frequency slightly higher than the target resonance frequency in anticipation of a reduction in the resonance frequency due to the formation of the electrodes. The formation of the electrode lowers the resonance frequency. Eventually, in the frequency adjustment step, a further small amount of electrode is deposited on the electrode to lower the resonance frequency to a target frequency.

As a final frequency adjusting method, an electrode is vacuum-deposited in advance and an electric circuit is connected to form an oscillation circuit. The oscillation circuit is actually oscillated, and the oscillation frequency is monitored and superimposed on the electrode again. To perform evaporation. Then, when the monitored frequency reaches a specified value, the shutter of the vacuum evaporation source is closed to stop the film formation on the electrode.

[0006]

However, since this frequency adjustment is performed while holding the crystal unit to be adjusted in the vapor deposition apparatus, it is necessary to provide a part of the adjustment means in the vacuum apparatus. The device itself becomes expensive. Also,
There is a problem that the cost is increased because mass addition for the frequency adjustment is performed by expensive vacuum deposition. Further, the fact that a vapor deposition product is formed in a hole pattern of a vapor deposition mask used for vapor deposition and the mask cannot be reused many times also causes a cost increase.

SUMMARY OF THE INVENTION An object of the present invention is to provide an inexpensive oscillator having small resonance frequency variation, a manufacturing method capable of manufacturing a resonator having small resonance frequency variation at low cost, and to adjust the resonance frequency of the oscillator at low cost. It is an object of the present invention to provide an adjusting device that can perform the adjustment.

[0008]

Embodiments of the present invention will be described with reference to FIGS. 2 to 4, FIGS. 10 and 11. FIG. (1) Explaining with reference to FIGS. 2 to 4, in the method of manufacturing a vibrator according to the first aspect of the present invention, the liquid material discharged from the nozzle 100 e of the liquid discharge device 10 is applied to the piezoelectric element plate 3 of the vibrator 1 The above-mentioned object is achieved by including a frequency adjusting step (step 4) of attaching and adjusting the resonance frequency of the vibrator 1 to a predetermined frequency. (2) In the manufacturing method according to the first aspect, in the manufacturing method according to the first aspect, in the frequency adjustment step (step 4), the adjustment is performed by sequentially adhering the liquid substance from the central portion to the peripheral portion of the piezoelectric element plate 3. It is something to do. (3) In a third aspect of the present invention, in the manufacturing method according to the first aspect, the liquid discharge device 10 includes a pressure chamber 100a that is in communication with the nozzle 100e and is filled with the liquid substance, and a liquid substance in the pressure chamber 100a. Pressure applying means 101 and 102 for applying pressure to the
2, and a liquid substance is discharged from the nozzle 100e by applying pressure. (4) A vibrator 1 manufactured by the manufacturing method according to any one of the first to third aspects. (5) According to the fifth aspect of the present invention, the liquid discharge device 10 for adhering the liquid substance discharged from the nozzle 100e to the piezoelectric element plate 3 of the vibrator 1 and the resonance frequency of the vibrator 1 to which the liquid substance is adhered are detected. Frequency detecting device 14 and the liquid discharging device 10 when the detected resonance frequency is higher than a predetermined frequency.
The control device 16 controls the liquid discharge device 10 to stop discharging the liquid material when the detected resonance frequency is equal to or lower than the predetermined frequency.
17 to achieve the above object. (6) According to a sixth aspect of the present invention, in the frequency adjusting apparatus according to the fifth aspect, a position changing device (12, 1) for changing a relative position between the nozzle (100e) of the liquid ejection device (10) and the piezoelectric element plate (3).
3 is provided. (7) Explained in association with FIGS. 10 and 11, the invention of claim 7 is the frequency adjustment apparatus according to claim 5, wherein a plurality of nozzles 301 are provided in the liquid ejection device 30 and the plurality of nozzles 301 An ejection control device 31 is provided for changing at least one of the selected positions of the liquid material on the piezoelectric element plate 3 by discharging the liquid material. (8) Explaining with reference to FIG. 4, the invention of claim 8 is the frequency adjustment device according to claim 5, wherein the liquid discharge device 10 is connected to the nozzle 100e and is filled with a liquid chamber. 100a and pressure applying means 101, 10 for applying pressure to the liquid substance in the pressure chamber 100a.
And a liquid substance is ejected from the nozzle 100e by applying pressure by the pressure applying means 101 and 102. (9) Explaining with reference to FIG. 3, the invention of claim 9 is the frequency adjusting device according to claim 5, wherein the adhesion position changing device 12, which changes the adhesion position of the liquid substance on the piezoelectric element plate 3, 13 and an adhesion position control device 17 for controlling the adhesion position changing devices 12 and 13 so that the liquid substance is sequentially adhered from the central portion to the peripheral portion of the piezoelectric element plate 3.

In the meantime, in the section of the means for solving the above problems, the drawings of the embodiments of the present invention are used to make the present invention easy to understand, but the present invention is not limited to the embodiments of the present invention. Not something.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. First Embodiment FIG. 1 is a diagram illustrating an example of a crystal resonator. Crystal unit 1
Has a crystal plate 3 and a support 4. The crystal plate 3 is obtained by processing a crystal piece cut at a specific cut angle (for example, AT cut) into a predetermined thickness. Electrodes 2 are formed on both front and back surfaces of the quartz plate 3. The support 4 supporting the crystal blank 3 also serves as a lead wire of the electrode 2. The support 4 is soldered to a lead terminal 5 provided on a base 7. The lead terminal 5 is attached to a base 7 via an electrical insulating material 6 such as Kovar glass. The base 7 is provided with a case 8 for sealing the quartz plate 3.

The electrode 2 is made of silver, gold, nickel, aluminum or the like. In this embodiment, the electrode is formed by depositing a silver thin film. In general, vacuum deposition is used for forming a metal thin film. The shape of the electrode 2 is a symmetrical pattern with respect to the center of the circular quartz plate 3. In the example shown in FIG. 1, the electrode 2 includes a circular electrode portion 2a and a lead portion 2b. The lead portion 2b of the back surface side electrode 2 in the figure is formed on the opposite side to the front side lead portion 2b as shown by a broken line. Phosphor bronze or the like is used for the support 4, and a coil-shaped coil portion 4a is formed at the upper end. The coil portion 4a sandwiches the lead portion 2b of the crystal plate 3, and holds the crystal plate 3 as shown in FIG. Copper paste or the like is applied to the coil portion 4a so that electrical contact between the lead portion 2b and the coil portion 4a and holding of the crystal plate 3 are ensured. The inside of the case 8 is sealed in a vacuum, but may be filled with nitrogen gas or the like.

FIG. 2 is a view showing a manufacturing procedure of the crystal unit 1. The outline of the manufacturing process of the crystal unit 1 will be described with reference to FIGS. Step 1 is a crystal plate processing step of processing the crystal plate 3 to a predetermined thickness. In this step, the crystal of the artificial quartz as a base material is cut at a predetermined angle with respect to the crystal axis, and A
A T-cut crystal blank is cut out, and the cut-out crystal blank is polished and polished to a predetermined thickness.
It is well known that the resonance frequency f (MHz) of the thickness shear vibration in the AT-cut quartz resonator has a relationship with the plate thickness t (μm) of the quartz plate 3 according to the following equation (1).

F = 1670 / t (1)

For example, if the plate thickness t is 10 (μm),
The resonance frequency f is about 167 (MHz). That is, when manufacturing a quartz oscillator having a resonance frequency f = 167 (MHz), the quartz plate 3 must be polished to a thickness of 10 (μm). Actually, since the resonance frequency is lowered by the electrode 2 and an adjustment margin is required at the time of frequency adjustment described later, the polishing is performed so as to be thinner than 10 (μm).

Step 2 is an electrode forming step. In this step, a silver thin film is formed on each of the front and back surfaces of the quartz plate 3 in FIG. Step 3 is a temporary assembly step. In this step, the lead terminals 5 of the base 7 are
After soldering the support 4 to each of the above, the crystal plate 3 is mounted so as to be sandwiched between the coil portions 4a of the support 4. After the mounting, a copper paste is applied to the coil portion 4a.

Step 4 is a frequency adjustment step. In this step, the temporarily assembled quartz oscillator is oscillated, and a fine silver powder solution is attached to the electrode 2 so that the resonance frequency is within a specified range. The configuration of the frequency adjustment device and the adjustment method will be described later. Step 5 is a case mounting step.
In this step, the case 8 is attached to the base 7 of the crystal unit in the tentatively assembled state for which the frequency adjustment has been completed, and the case 8 is sealed to complete the crystal unit 1. At this time, when the inside of the case 8 is evacuated, the case is mounted in a vacuum atmosphere. On the other hand, when nitrogen gas is sealed, the case is mounted in a nitrogen gas atmosphere.

FIG. 3 is a diagram showing a schematic configuration of a frequency adjusting device used in the above-described frequency adjusting step. The frequency adjusting device has a head 10 for spraying a fine silver powder solution on the electrode 2 of the quartz plate 3. The head 10 is two-dimensionally moved by the head moving mechanism 12 in the xy directions in the drawing. A fine silver powder solution is supplied to the head 10 from a liquid supply source 11 via a liquid supply tube 18. The head 10 is driven by the head drive circuit 15, and the solution is sprayed from the head 10.

Further, the frequency adjusting device controls an oscillation circuit 14 for oscillating the crystal oscillator 1, a discriminator 16 for judging whether or not the resonance frequency of the crystal oscillator 1 is within a predetermined range, and controls the entire device. And a controller 17. The fine silver powder solution for adjusting the resonance frequency sprayed on the electrode 2 includes:
For example, a mixture of a solution in which a resin such as acryl is dissolved with a diluent such as toluene and a spherical silver powder having a particle size of about 0.5 to 1.5 (μm) is used.

FIG. 4 is a view showing details of the head 10.
(A) is a plan view, (b) is a cross-sectional view. Head 10
Has a base 100, a vibration plate 101, and a piezoelectric element 102. The base 100 includes a pressure chamber 100a and a standby chamber 100.
b. A communication slit 100c is formed in the partition wall 100d between the pressure chamber 100a and the standby chamber 100b. Further, a pressure chamber 1 is provided at the tip of the base 100.
Nozzle hole 100 for discharging the fine silver powder solution from
e is provided. A micro silver powder solution is supplied to the standby chamber 100b from the liquid supply source 11 of FIG.

The piezoelectric element 102 is composed of PZT between metal electrodes.
It has a structure in which a piezoelectric material such as (lead zirconate titanate) is sandwiched, and is adhered on the diaphragm 101. When a voltage is applied between the metal electrodes of the piezoelectric element 102, the piezoelectric material of the piezoelectric element 102 is deformed. The head 10 deforms the vibration plate 101 on the pressure chamber 100a by utilizing the deformation of the piezoelectric element 102, applies pressure to the fine silver powder solution in the pressure chamber 100a, and discharges the fine silver powder solution from the nozzle hole 100e.

In a steady state, the pressure chamber 100a and the standby chamber 100b are filled with the fine silver powder solution supplied from the supply tube 18. FIG. 4B shows the piezoelectric element 102.
When a voltage having the polarity shown in FIG.
As shown in FIG. 4B, the diaphragm 101 in the pressure chamber 100a is deformed into an upwardly convex shape as shown in FIG. As a result, the volume of the pressure chamber 100a increases, and the minute silver powder solution corresponding to the increased volume is transferred from the standby chamber 100b to the pressure chamber 1a.
00a. Next, when the voltage application is stopped, the piezoelectric element 102 returns to the original length. Therefore, the pressure chamber 10
The volume of 0a returns to its original state, and the fine silver powder solution filled in the pressure chamber 100a tries to escape to the nozzle hole 100e and the standby chamber 100b. However, since the standby chamber 100b is filled with the fine silver powder solution, it tends to escape to the nozzle hole 100e more, and the fine silver powder solution is discharged from the nozzle hole 100e. The on / off of the applied voltage is controlled by the head drive circuit 15 in FIG. 3 to control the on / off of the ejection of the fine silver powder solution.

Next, a frequency adjusting method using the adjusting device shown in FIGS. 3 and 4 will be described with reference to a flowchart shown in FIG. FIG. 5 is a flowchart showing the frequency adjustment procedure. This process is started when the crystal oscillator 1 is set in the adjustment device and an instruction to start the adjustment is input to the controller 17 by the operator. At the start, a variable N representing the spray position on the electrode 2 is set to zero. The variable N will be described later in detail. Step S
At 1, the crystal oscillator 1 is oscillated by the oscillation circuit 14.
Specifically, a signal for starting oscillation is transmitted from the controller 17 to the oscillation circuit 14. In step S2, the resonance frequency f of the crystal unit 1 is detected.

In step S3, the discriminator 16 determines whether the detected resonance frequency f is within a specified frequency range. For example, when the target resonance frequency is fc and the adjustment allowable range is ± α, the resonance frequency f is fc−α ≦
It is determined whether or not f ≦ fc + α. If "YES" is determined in the step S3, that is, if the resonance frequency f
Is within the specified frequency range, the process proceeds to step S6.
In step S6, the oscillation by the oscillation circuit 14 is stopped. Thus, a series of frequency adjustment processing ends. On the other hand, if NO is determined in step S3, the process proceeds to step S4.

In step S4, a variable N representing the spray position of the fine silver powder solution on the electrode 2 is set to N + 1. When the value of the variable N before step S4 is zero,
In step S4, the variable N becomes 1. FIG. 6 is a diagram illustrating an example of the spray position N on the electrode 2, where each numeral indicates the position N.
Is represented. For example, an area numbered 1 represents position N = 1, and an area numbered 2 is position N
= 2. When adjusting the frequency, position 1,
Spray the fine silver powder solution in the order of 2, 3, .... FIG. 6 shows the position up to position N = 11.

The quartz plate 3 when the quartz oscillator 1 resonates
Are as shown in FIG. The amplitude of the central portion of the crystal plate 3 is the largest, and the amplitude decreases as the distance from the center to the periphery increases. Therefore, when the same amount of the fine silver powder solution is applied, the change in the resonance frequency is larger when the solution is applied to the central portion than to the peripheral portion of the electrode 2.
Therefore, when depositing the fine silver powder solution, the fine silver powder solution is deposited more sequentially from the central part of the electrode where the resonance frequency changes more sensitively to the peripheral part. That is, the frequency adjustment can be performed with higher precision by first changing the resonance frequency largely and gradually decreasing the amount of change in the resonance frequency.

In step S5, the head 10 is positioned so that the nozzle hole 100e faces the position N of the electrode 2 shown in FIG. 6, and a predetermined amount of the fine silver powder solution is sprayed on the region of the position N of the electrode 2. Then, returning to step S2, the resonance frequency f of the crystal resonator 1 after spraying is detected. Then, in a step S3, it is determined whether or not the resonance frequency f is within the normal frequency range. If “YES” is determined in the step S3, the process proceeds to a step S6 to stop the oscillation. Thereby, the frequency adjustment ends. On the other hand, NO in step S3
When the determination is made, the process proceeds to step S4 to further increase the position N by N.
Change to +1. In step S5, the head 10 is moved to spray a predetermined amount of the fine silver powder solution on the position N = 2 of the electrode 2. Thereafter, the processing of steps S2 to S5 is repeated until YES is determined in step S3, that is, until the resonance frequency f becomes fc−α ≦ f ≦ fc + α.

By the way, the resonance frequency of a crystal unit differs depending on its environmental temperature. FIG. 8 shows the temperature T and the resonance frequency f.
Qualitatively shows a part of the relationship with. A characteristic L0 in FIG. 8 shows a crystal resonator having a target resonance frequency fc at a predetermined temperature Tc. As described above, the frequency is adjusted with respect to the target resonance frequency fc of FIG. 8 until the resonance frequency f of the crystal unit 1 satisfies fc−α ≦ f ≦ fc + α. A characteristic L1 shown in FIG. 8 is a characteristic of the crystal unit after the fine silver powder solution is attached to the crystal unit of the characteristic L0 and the frequency is adjusted. That is, it is the characteristic of the crystal resonator adjusted so that the resonance frequency fc1 at the temperature Tc becomes fc-α. Similarly, the characteristic L2 indicates the temperature T
This is a characteristic of the crystal resonator adjusted so that the resonance frequency fc2 at the time of c becomes fc + α.

In the characteristic L0 of FIG. 8, the resonance frequency at the ambient temperature Tc is fc, but when the ambient temperature reaches T ', the resonance frequency changes to f'. Similarly, characteristics L1 and L2
The resonance frequencies fc1 and fc2 of the crystal resonator of
Changes to fc1 'and fc2'. Therefore, if the ambient temperature is T
In the case of c, the discriminator 16 shown in FIG.
≦ f ≦ fc2 ”, and when the ambient temperature is T ′, the determination is made based on the discriminant“ fc1 ′ ≦ f ≦ fc2 ′ ”.

The resonance frequency of the quartz plate 3 is shifted not only by the temperature but also by the ambient pressure. Also in this case, the discriminator 16 performs the discrimination by correcting the difference between the sealing pressure when the case 8 is sealed and the ambient pressure when adjusting the frequency.

FIG. 9 is a schematic view of an apparatus for performing an adjusting operation using three heads 10. As shown in FIG. In this device, the frequency adjustment operations of the three crystal units 1 can be performed simultaneously.
This device has a rotary table 20 on which a plurality of crystal units 1 can be mounted. This turntable 20
It can be driven to rotate in the R direction in the figure. Positions J1 and J at an angle of 120 degrees with respect to the center of the turntable 20
2 and J3 are set, and heads 10 are provided at these positions J1, J2 and J3, respectively.

At each of the positions J1, J2, J3, a lead terminal contact portion 21 connected to the oscillation circuit 14 is provided. The rotary table 20 is driven to rotate so that each position J1, J
When the quartz oscillator 1 is positioned at J2 and J3, the lead terminals 5 (see FIG. 1) of the quartz oscillator 1
, And each crystal resonator 1 is connected to the corresponding oscillation circuit 14. After that, the above-described frequency adjustment work is performed on the three crystal units 1 positioned at the positions J1, J2, and J3, respectively.

When the work of adjusting the three crystal units 1 at the positions J1, J2 and J3 is completed, the rotary table 20 is rotated by the angle β. Each crystal oscillator 1 is a rotary table 2
It is mounted on 0 at every angle β. Therefore, when the rotary table 20 is rotated by the angle β from the state shown in FIG. 9, the unadjusted crystal resonator 1 is positioned at each of the positions J1, J2, and J3. As shown by the arrow in FIG.
The unadjusted quartz oscillator 1 is carried in from three places, and is mounted thereon.
Removed and transported.

In the example shown in FIG. 3, the position at which the fine silver powder solution is sprayed is changed by moving the head 10 with respect to the quartz plate 3, but conversely, the quartz oscillator 1 is moved. The spray position may be changed.
In the apparatus shown in FIG. 9, the plurality of crystal units 1 are arranged on the turntable 20 and rotated with respect to the heads 10. On the contrary, each head 10 is arranged on the turntable 20. Each head 10 may be rotated with respect to a plurality of crystal units 1.

According to the above-described first embodiment, the following effects can be obtained. (1) A fine silver powder solution, which is an additional mass for adjustment, is
Was added to the electrode 2 in the atmosphere using
Adjustment can be performed at low cost as compared with conventional frequency adjustment using vacuum deposition. (2) Further, since there is no work of evacuation and opening to the atmosphere as in the related art, the speed of the adjustment work can be increased. (3) By attaching the fine silver powder solution in order from the center to the periphery of the electrode 2, the resonance frequency can be adjusted accurately.

-Second Embodiment-In the first embodiment described above, the nozzle hole 100e is
The head 10 or the quartz oscillator 1 was moved to change the spraying position. In the second embodiment, a fine silver powder solution is sprayed using a head having a plurality of nozzle holes. FIG. 10 is a diagram showing a schematic configuration of the frequency adjustment device. The head 30 of the frequency adjustment device shown in FIG. 10 has a plurality of nozzles for discharging a fine silver powder solution.

FIG. 11 is a view showing a part of the head 30, in which a part is cut away. In FIG. 11, the head 30 has a base 300,
0 has a plurality of nozzle holes 301 arranged in a line. Pressure chambers 302 are formed in the base 300 so as to correspond to the respective nozzle holes 301.
2 communicates with a common standby chamber 304 through a slit 303. On the vibration plate 305 provided in each pressure chamber 302, a piezoelectric element 306 is provided corresponding to each pressure chamber 302. The liquid supply tube 18 is provided in the standby chamber 304.
Is connected. A voltage is independently applied to each piezoelectric element 306 by the head drive circuit 31 of FIG. 10, and a fine silver powder solution is discharged from each nozzle hole 301.

FIG. 12 is a view for explaining the procedure when a fine silver powder solution is sprayed onto the electrode 2 using the head 30.
Nine nozzle holes 301 are formed in the head 30 shown in FIG.
9. Then, while the head 30 is positioned as shown in FIG. 12, the fine silver powder solution is sprayed in the order of 1, 2,..., 9 to adjust the frequency. Therefore, in the second embodiment, a moving unit (the head moving mechanism 12 and the driving unit 13 in FIG. 3) for moving the head 30 is not required. As a result, in addition to the effects achieved in the above-described first embodiment, the speed of the frequency adjustment operation can be increased by omitting the head moving time.

In the first and second embodiments described above, the spraying amount of the fine silver powder solution in step S5 of FIG. 5 is described as being constant. However, the spraying amount is adjusted in accordance with the deviation amount Δf from the target resonance frequency fc. You may change it. As an example, if the frequency deviation amount Δf is Δf ≧ Δf1 with respect to the predetermined deviation amount Δf1, the number of spraying in step S5 is set to two, and if Δf <Δf1, the number of blowing is set to one. In this manner, steps S2 to S5 in FIG.
Can be reduced, and the speed of the adjustment operation can be increased.

Further, instead of changing the spraying position every time the resonance frequency is detected, for example, the frequency shift amount Δf is set to Δf
In the case of ≧ Δf1, the spraying position may be changed only to the position N = 1 where the frequency change is large, and if Δf <Δf1, the spraying position may be changed to position N = 2, 3,.

In the above-described embodiment, a fine silver powder solution in which fine spherical silver powder is mixed into a solution obtained by dissolving a resin in a solvent such as toluene is used as an additional mass to be attached to the electrode 2. Only the additional mass may be used. In this case, the mass per unit volume of the solution is reduced, and finer frequency adjustment is possible.

In the correspondence between the embodiment described above and the elements of the claims, the quartz oscillator 1 is a vibrator, the quartz plate 3 is a piezoelectric element, the heads 10 and 30 are liquid ejection devices, and the nozzles are nozzles. The holes 100e and 301 control the nozzle, the fine silver powder solution controls the liquid substance, the vibrating plates 101 and 305 and the piezoelectric elements 102 and 306 control the pressure applying means, the oscillation circuit 14 controls the frequency detecting device, and the discriminator 16 and the controller 17 control. The head moving mechanism 12
The drive unit 13 constitutes a position changing device and an adhesion position changing device, and the head drive circuit 31 constitutes an ejection control device.

[0041]

As described above, according to the present invention,
Since the liquid substance can be attached to the quartz plate in the air, the adjustment can be performed at a lower cost than the conventional frequency adjustment using vacuum deposition. Further, by attaching the liquid substance in order from the central portion to the peripheral portion of the quartz plate, a quartz oscillator having a small variation in resonance frequency can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an example of a crystal resonator.

FIG. 2 is a view showing a manufacturing procedure of the crystal unit 1;

FIG. 3 is a diagram illustrating a schematic configuration of a frequency adjustment device according to the first embodiment.

4A and 4B are diagrams showing details of a head 10, wherein FIG. 4A is a plan view and FIG. 4B is a transverse sectional view.

FIG. 5 is a flowchart illustrating a frequency adjustment procedure.

FIG. 6 is a view showing an example of a spray position N on an electrode 2;

FIG. 7 is a diagram showing a distribution of amplitude magnitude of the quartz plate 3;

FIG. 8 is a diagram qualitatively showing a relationship between a temperature T and a resonance frequency f.

9 shows three crystal units 1 using three heads 10. FIG.
FIG. 4 is a schematic configuration diagram of a frequency adjustment device configured to perform the adjustment work at the same time.

FIG. 10 is a diagram illustrating a schematic configuration of a frequency adjustment device according to a second embodiment.

11 is a perspective view showing a part of the head 30. FIG.

FIG. 12 is a diagram illustrating a procedure of spraying a fine silver powder solution by a head 30.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Quartz crystal resonator 2 Electrode 3 Quartz plate 10, 30 Head 11 Liquid supply source 12 Head moving mechanism 13 Drive unit 14 Oscillation circuit 15, 31 Head drive circuit 16 Discriminator 17 Controller 100, 300 Base 100e, 301 Nozzle hole 100a, 302 Pressure chamber 100b, 304 Standby chamber 101, 305 Vibration plate 102, 306 Piezoelectric element

Claims (9)

[Claims] 1. A frequency adjusting step of adjusting a resonance frequency of a vibrator to a predetermined frequency by attaching a liquid substance discharged from a nozzle of a liquid discharge device to a piezoelectric element plate of a vibrator. Method of manufacturing a vibrator. 2. The manufacturing method according to claim 1, wherein in the frequency adjusting step, the adjustment is performed by sequentially adhering the liquid substance from a central portion to a peripheral portion of the piezoelectric element plate. Child manufacturing method. 3. The manufacturing method according to claim 1, wherein the liquid discharge device communicates with the nozzle and is filled with the liquid substance, and a pressure for applying a pressure to the liquid substance in the pressure chamber. A method of manufacturing a vibrator, comprising: applying a pressure by the pressure applying means to discharge the liquid substance from the nozzle. 4. A vibrator manufactured by the manufacturing method according to claim 1. 5. A liquid ejecting apparatus for attaching a liquid substance ejected from a nozzle to a piezoelectric element of a vibrator, a frequency detecting apparatus for detecting a resonance frequency of the vibrator to which the liquid substance is attached, When the resonance frequency is higher than a predetermined frequency, the liquid discharge device discharges the liquid material, and when the detected resonance frequency is lower than the predetermined frequency, the liquid discharge device stops discharging the liquid material. And a control device for controlling the frequency of the vibrator. 6. The frequency adjusting device according to claim 5, further comprising a position changing device for changing a relative position between a nozzle of the liquid discharging device and the piezoelectric element. apparatus. 7. The frequency adjusting device according to claim 5, wherein the plurality of nozzles are provided in the liquid ejection device,
A discharge control device for selecting at least one of the plurality of nozzles to discharge the liquid material and changing an attachment position of the liquid material on the piezoelectric element plate; Adjustment device. 8. The frequency adjusting device according to claim 5, wherein the liquid ejection device communicates with the nozzle and applies pressure to the pressure chamber filled with the liquid substance and the liquid substance in the pressure chamber. A frequency adjusting device for a vibrator, comprising: pressure applying means for applying pressure by the pressure applying means to discharge the liquid substance from the nozzle. 9. The frequency adjusting device according to claim 5, wherein an adhesion position changing device that changes an adhesion position of the liquid material on the piezoelectric element plate, and the liquid material is applied from a central portion of the piezoelectric element plate to a periphery thereof. An adhesion position control device for controlling the adhesion position changing device so that the adhesion position is sequentially applied to the parts.