JP2002275316A - Thermoplastic resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition which is excellent in oil resistance, is excellent in flame retardance though it does not contain a halogenous or phosphorus flame retardant, and is highly suitable for electric wire or cable covering. SOLUTION: This resin composition is prepared by melt kneading (A) a polyolefin resin, (B) a polyphenylene ether resin, (C) 1-50 pts.wt. epoxy-group- containing ethylene copolymer, and (D) a polyorganosiloxane having at least one kind of group selected from among amino, hydroxy, phenolic, carboxy, methacrylouloxy, and alkoxy groups. In the composition, the wt.ratio of (A)/(B) is (30/70)-(80/20); the content of (C) is 0.1-30 pts.wt. based on 100 pts.wt. sum of (A) and (B); and the content of (D) is 0.1-10 pts.wt. based on 100 pts.wt. sum of (A) and (B).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a thermoplastic resin composition. More specifically, the present invention is a thermoplastic resin composition having excellent oil resistance and flame retardancy, and excellent flame retardancy without using a halogen-based flame retardant or a phosphorus-based flame retardant as an essential component, The present invention relates to a thermoplastic resin composition optimally used for covering electric wires or cables.

[0002]

2. Description of the Related Art Vinyl resins or polyolefin resins containing halogen-based flame retardants have been conventionally used for resin applications requiring moderate flexibility and flame retardancy, for example, for wire and cable coating applications. ing. However,
In recent years, there has been a concern about the effects of halogen-containing compositions on the environment, and demand for non-halogen-based materials has been increasing.

As a non-halogen resin material for covering electric wires and cables, a composition in which a metal hydroxide is mixed with an olefin resin is disclosed in, for example, JP-A-9-017244. However, when imparting sufficient flame retardancy to an olefin resin with a metal hydroxide without using a halogen-based flame retardant, it is necessary to add a large amount of a metal hydroxide, and mechanical properties such as tensile elongation are required. And wear resistance.

Japanese Patent Application Laid-Open No. 11-185532 discloses a resin composition for covering electric wires, comprising a polyolefin resin, a polyphenylene ether resin, an organic phosphate compound, an ammonium polyphosphate, and a triazine compound. However, in recent years, there have been concerns about the effects of phosphorus compounds on the environment.

[0005]

Under such circumstances, the problem to be solved by the present invention is to make the halogen-based flame retardant and the phosphorus-based flame retardant as essential components excellent in oil resistance and flame retardancy. Another object of the present invention is to provide a thermoplastic resin composition having excellent flame retardancy and being optimally used for covering electric wires or cables.

[0006]

The present inventors have made intensive studies on the flame retardancy and mechanical properties of the polyolefin resin, and have found that the polyolefin resin and the polyphenylene ether resin, the epoxy group-containing ethylene copolymer and the specific structure have a specific structure. The present inventors have found that a composition comprising a polyorganosiloxane solves the above-mentioned problems, and have completed the present invention. That is, the present invention comprises melt-kneading the following (A) to (D), and (A) / ( The weight ratio of B) is 30/70 to 80 /
20, the addition amount of (C) is 0.1 to 30 parts by weight based on 100 parts by weight of the total amount of (A) and (B);
The present invention relates to a thermoplastic resin composition wherein the added amount of (D) is 0.1 to 10 parts by weight based on 100 parts by weight of the total of (A) and (B). (A): polyolefin resin (B): polyphenylene ether resin (C): 1 to 50 parts by weight of an epoxy group-containing ethylene copolymer (D): amino group, hydroxyl group, phenol group, carboxyl group, methacryloxy group and Polyorganosiloxane containing at least one of alkoxy groups

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION (A) in the present invention is a polyolefin resin. Polyolefin resins include ethylene, propylene, butene-1, pentene-1, hexene-1, 3-methylbutene-1, and 4-methylpentene.
Α-olefins such as 1, octene-1, decene-1, dodecene-1, tetradecene-1, hexadecene-1, octadecene-1, eicosene-1, etc .;
Homopolymers or copolymers of olefins such as cyclic olefins described in JP-B-48. In addition, a copolymer obtained by copolymerizing an olefin and a small amount of another unsaturated monomer, and a copolymer of the copolymer and the olefin alone or modified by oxidation, sulfonation, etc. are used as polyolefin resins. Shall be included.

Examples of other unsaturated monomers copolymerizable with olefins include acrylic acid, methacrylic acid, maleic acid, itaconic acid, methyl acrylate, methyl methacrylate, maleic anhydride, arylmaleimide And organic derivatives thereof such as alkyl maleimide and the like; vinyl esters such as vinyl acetate and vinyl butyrate; aromatic vinyl compounds such as styrene and methyl styrene; vinyl trimethylmethoxysilane, γ-methacryloyloxypropyltrimethoxysilane and the like. Vinylsilane; dicyclopentadiene, 4-ethylidene-2-norbornene,
4-methyl-1,4-hexadiene, 5-methyl-1,
Non-conjugated dienes such as 4-hexadiene are exemplified. Among these, ethylene, propylene, butene-1,3-
Copolymers or homopolymers containing a majority weight of methylbutene-1,4-methylpentene-1 are preferred, and crystalline propylene polymers such as propylene homopolymer, propylene-ethylene block, random copolymer and mixtures thereof. Is more preferred.

Regarding the molecular weight of the polyolefin resin,
Since the preferred range varies depending on the purpose, the range cannot be unconditionally determined, but generally the temperature is 230 ° C. and the load is 21.2.
0.01 to 400 g / 10 min, and preferably 0.1 to 400 g / 10 minutes as expressed by the melt flow rate (MFR) measured under the conditions of N.
60 g / 10 min.

The above-mentioned polyolefin resin can be produced by a conventionally known method such as polymerization or modification. Also, commercially available products are widely available, and can be appropriately selected from these and used.

[0011] The polyphenylene ether resin of the component (B) used in the present invention means that at least one phenol compound represented by the following formula (I) is obtained by using an oxidation coupling catalyst and using oxygen or an oxygen-containing gas. It means a resin comprising a homopolymer or a copolymer obtained by oxidative polymerization. (Wherein, R ₁ , R ₂ , R ₃ , R ₄ and R ₅ are each selected from a hydrogen atom, a halogen atom, a hydrocarbon group or a substituted hydrocarbon group, and at least one of them is always Is a hydrogen atom)

R ₁ , R ₂ , R ₃ , R ₄ and R ₅ in the formula (I) are hydrogen, chlorine, bromine, fluorine, iodine, methyl, ethyl, n- or iso-propyl, pri-, s
Examples thereof include ec- or t-butyl, chloroethyl, hydroxyethyl, phenylethyl, benzyl, hydroxymethyl, carboxyethyl, methoxycarbonylethyl, cyanoethyl, phenyl, chlorophenyl, methylphenyl, dimethylphenyl, ethylphenyl, and allyl.

As the phenol compound represented by the formula (I), phenol, o-, m- or p-cresol, 2,
6-, 2,5-, 2,4- or 3,5-dimethylphenol, 2-methyl-6-phenylphenol, 2,6-
Diphenylphenol, 2,6-diethylphenol,
2-methyl-6-ethylphenol, 2,3,5-,
2,3,6- or 2,4,6-trimethylphenol,
3-methyl-6-t-butylphenol, thymol, 2
-Methyl-6-allylphenol can be exemplified. Among these phenol compounds, 2,6-dimethylphenol, 2,6-diphenylphenol, 3-
Methyl-6-t-butylphenol and 2,3,6-trimethylphenol are preferred.

The phenol compound represented by the formula (I) is
Bisphenol-A, tetrabromobisphenol-
A, resorcin, hydroquinone, and a polyvalent hydroxy aromatic compound exemplified by a novolak resin may be copolymerized, and these copolymers are also included in the polyphenylene ether-based resin according to the present invention.

The oxidative coupling catalyst used for oxidatively (co) polymerizing the phenol compound is not particularly limited, and any catalyst having a polymerization ability can be used. Further, as a method for producing a polyphenylene ether-based resin by oxidatively (co) polymerizing a phenol compound, US Pat. Nos. 3,306,874, 3,306,875 and 3,257,357, and JP-B-52-178.
No. 80, JP-A-50-51197, JP-A-1
-304119 can be exemplified.

The polyphenylene ether resins used in the present invention include poly (2,6-dimethyl-1,4-phenylene ether) and poly (2,6-diethyl-1,4).
-Phenylene ether), poly (2-methyl-6-ethyl-1,4-phenylene ether), poly (2-methyl-6-propyl-1,4-phenylene ether), poly (2,6-dipropyl-1) , 4-phenylene ether), poly (2-ethyl-6-propyl-1,4-phenylene ether), poly (2,6-butyl-1,4-phenylene ether), poly (2,6-dipropenyl-)
1,4-phenylene ether), poly (2,6-dilauryl-1,4-phenylene ether), poly (2,6-
Diphenyl-1,4-phenylene ether), poly (2,6-dimethoxy-1,4-phenylene ether), poly (2,6-diethoxy-1,4-phenylene ether), poly (2-methoxy-6- Ethoxy-1,
4-phenylene ether), poly (2-ethyl-6-stearyloxy-1,4-phenylene ether), poly (2-methyl-6-phenyl-1,4-phenylene ether), poly (2-methyl-1) , 4-phenylene ether), poly (2-ethoxy-1,4-phenylene ether), poly (3-methyl-6-t-butyl-1,4-phenylene ether), poly (2,6-dibenzyl-1) ,
4-phenylene ether), and various copolymers containing a plurality of types of repeating units constituting these resins.

Further, a polysubstituted phenol exemplified by 2,3,6-trimethylphenol and 2,3,5,6-tetramethylphenol and a disubstituted phenol exemplified by 2,6-dimethylphenol are used. The polymer is also included in the polyphenylene ether-based resin according to the present invention.

Preferred among the above-mentioned polyphenylene ether resins are poly (2,6-dimethyl-1,4).
-Phenylene ether) and a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol.

The polyphenylene ether-based resin used in the present invention may further comprise styrene, α-
It may be a graft copolymer obtained by grafting a styrene compound exemplified by methylstyrene, p-methylstyrene and vinyltoluene, and such a graft copolymer is also included in the polyphenylene ether resin according to the present invention. Shall be.

The polyphenylene ether resin used in the present invention preferably has an intrinsic viscosity of 0.3 to 0.7 dl / g measured in chloroform at 30 ° C.
It is more preferably 0.36 to 0.65 dl / g, particularly preferably 0.4 to 0.6 dl / g. If the intrinsic viscosity is too low, flame retardancy may occur, and if the intrinsic viscosity is too high, the moldability of the resin composition of the present invention may decrease.

The component (C) used in the present invention is an epoxy group-containing ethylene copolymer having an epoxy group in a main chain or a side chain. The copolymer is obtained by copolymerizing ethylene and a monomer having an epoxy group, or by oxidizing a carbon-carbon double bond in a copolymer of ethylene and a diene compound such as butadiene with ozone or the like. can get. Component (C) is preferably a unit derived from ethylene (hereinafter also referred to as “unit (a)”) and a unit derived from unsaturated glycidyl carboxylate copolymerizable with ethylene (hereinafter referred to as “unit”). (B-1)) or a unit derived from a glycidyl ether having an unsaturated group copolymerizable with ethylene (hereinafter referred to as “unit (b)
-2) ") as an essential repeating unit.

The unsaturated carboxylic acid glycidyl ester for deriving the unit (b-1) is a compound represented by the general formula (II). (II) (wherein, R is a group having 2 to 2 carbon atoms having an ethylenically unsaturated bond)
18 alkenyl groups)

Examples of the compound represented by the general formula (II) include glycidyl acrylate, glycidyl methacrylate and glycidyl itaconate.

The glycidyl ether having an unsaturated group for deriving the unit (b-2) is a compound represented by the general formula (III). (III) (wherein, R is a group having 2 to 2 carbon atoms having an ethylenically unsaturated bond)
18 is an alkenyl group, and X is CH ₂ —O or O)

Examples of the compound represented by the general formula (III) include allyl glycidyl ether, 2-methylallyl glycidyl ether and styrene-p-glycidyl ether.

The component (C) comprises a unit (a) and a unit (b-
In addition to 1) or (b-2), a unit derived from an ethylenically unsaturated compound (hereinafter, also referred to as “unit (c)”)
Can be included as an arbitrary repeating unit.

Examples of the ethylenically unsaturated compound from which the unit (c) is derived include α, β-unsaturated carboxylic acid alkyl esters such as methyl acrylate, ethyl acrylate, butyl acrylate and methyl methacrylate, vinyl acetate, vinyl propionate and butanoic acid. Examples thereof include carboxylic acid vinyl esters such as vinyl, vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether and phenyl vinyl ether, and styrenes such as styrene, methyl styrene and ethyl styrene.

The proportion of each unit constituting the component (C) is 50 to 99% by weight of the unit (a) and 0.1 to 100% by weight of the unit (b).
It is 50% by weight, preferably 0.5 to 20% by weight, and the unit (c) is 0 to 50% by weight, preferably 10 to 40% by weight.

Specific examples of the component (C) include ethylene-glycidyl methacrylate copolymer, ethylene-glycidyl methacrylate-methyl acrylate copolymer, ethylene-glycidyl methacrylate-ethyl acrylate copolymer, and ethylene-glycidyl methacrylate-vinyl acetate. And copolymers. Among them, an ethylene-glycidyl methacrylate copolymer, an ethylene-glycidyl methacrylate-methyl acrylate copolymer, and an ethylene-glycidyl methacrylate-ethyl acrylate copolymer are preferable.

The glycidyl group content of the component (C) is 0.1
% Or more, and the melt index of the component (C) is 0.5 to 3000 g / 10 min (J
ISK6760).

The component (C) can be produced by various known polymerization methods. For example, a method of copolymerizing ethylene with a compound represented by the general formula (II), a method of copolymerizing ethylene with a compound represented by the general formula (III), a method of copolymerizing ethylene with a compound represented by the general formula (II), A method of copolymerizing a compound represented by the general formula (III),
Ethylene homopolymer or copolymer of ethylene and olefin such as propylene copolymerizable with ethylene (hereinafter, referred to as
A method in which a compound represented by the general formula (II) or (III) is graft-polymerized to an “ethylene copolymer”, and a copolymerization of ethylene with an ethylenically unsaturated compound that induces the unit (c). Combine with the general formula (II) or the general formula (II
A method of graft-polymerizing the compound represented by I).

As an example of a specific method for producing the component (C), ethylene and a compound represented by the general formula (II) or (III) may be prepared in the presence of a radical generator in the range of 500 to 4
A method of copolymerizing at a pressure of 000 atm and a temperature of 100 to 300 ° C. in the presence or absence of a suitable solvent or chain transfer agent, ethylene homopolymer or ethylene which is a copolymer of ethylene and propylene General copolymer (II)
Alternatively, a method in which a compound represented by the general formula (III) and a radical generator are mixed, and the mixture is melt-kneaded in a Banbury kneader or an extruder to carry out graft copolymerization.

The (D) of the present invention is a polyorganosiloxane containing at least one of an amino group, a hydroxyl group, a phenol group, a carboxyl group, a methacryloxy group and an alkoxy group in the molecule.

The polyorganosiloxane comprises at least one of the following M units, D units, T units, and Q units. R ₆ R ₇ R ₈ SiO _0.5 M unit R ₉ R ₁₀ SiO _1.0 D unit R ₁₁ SiO _1.5 T unit SiO _2.0 Q unit (wherein, R ₆ , R ₇ , R ₈ , R ₉ , R ₁₀ and R _11, respectively) Independently selected from an alkyl group, an aryl group, or a group in which hydrogen bonded to a carbon atom of these groups is substituted with an amino group, a hydroxyl group, a carboxyl group, a methacryloxy group, an amino group, a hydroxyl group, a carboxyl group, or a methacryloxy group. Is a monovalent group.)

The polyorganosiloxane of the present invention is produced according to a general method for producing a polyorganosiloxane. For example, a linear polyorganosiloxane composed of M units and D units is obtained by the reaction of diorganodichlorosilane and triorganochlorosilane. Also, by hydrolyzing two or more silane compounds selected from diorganodichlorosilane, monoorganotrichlorosilane and tetrachlorosilane to form a partially condensed polyorganosiloxane, and further reacting with triorganochlorosilane Having a branched structure (T
And / or having Q units). In the present invention, a polyorganosiloxane having a branched structure is more preferable than a linear polyorganosiloxane from the viewpoint of flame retardancy.

The weight ratio of (A) / (B) is 30 / 70-8.
0/20, preferably 35/65 to 70/30. If the ratio is too small, chemical resistance and fluidity deteriorate,
On the other hand, if the ratio is excessive, the flame retardancy deteriorates. The content of (C) is 0.1 to 30 parts by weight, preferably 0.2 to 10 parts by weight, based on 100 parts by weight of the total of (A) and (B). When (C) is excessive, heat resistance becomes insufficient, while when (C) is insufficient, flame retardancy becomes insufficient.
The content of (D) is from 0.1 to 10 parts by weight, preferably from 0.2 to 100 parts by weight of the total amount of (A) and (B).
７7 parts by weight. When (D) is too large, heat resistance becomes insufficient, while when (D) is too small, flame retardancy becomes insufficient.

In the thermoplastic resin composition of the present invention, (A) preferably forms a continuous phase. When (A) does not form a continuous phase, sufficient chemical resistance may not be obtained.

In the thermoplastic resin composition of the present invention, (C) is preferably dispersed in (A). When (C) is dispersed in (B), the flame retardancy may deteriorate.

The resin composition of the present invention has the above (A) to
(D) is obtained by melt-kneading. As an example of the melt kneading method, there is a method of melt kneading using an extruder or the like, but there is no particular limitation as long as it is a commonly used kneading method. Feeding method is a method to input materials all at once,
A method of side-feeding a part of the material and a method of feeding a pre-kneaded material are conceivable, but (A), (B),
A method in which (C) and (D) are simultaneously melt-kneaded, (A)
(B) a method of adding (C) and (D) to the melt-kneaded material, (A) a method of adding (B), (C) and (D) to the melt-kneaded material, (B) melt-kneading It is preferable to add (A), (C) and (D) to the product. The kneading temperature is the glass transition point of the polyphenylene ether resin (about 210
℃) or more, but preferably 220 to 400 ℃
And more preferably in the range of 230 to 350 ° C.

In the present invention, when a resin composition having higher impact strength is desired, it is desirable to incorporate an elastomer into the composition.

Examples of such elastomers include natural rubber, polybutadiene rubber, polyisoprene rubber, butyl rubber, ethylene-propylene copolymer rubber, butadiene styrene copolymer rubber, butadiene-acrylonitrile copolymer rubber, hydrogenated and non-hydrogenated rubbers. Examples include hydrogenated styrene-conjugated diene block copolymer rubber, polyester rubber, acrylic rubber, silicone rubber, and the like, and modified products thereof.

Preferred elastomers among these are:
Styrene-isoprene diblock copolymers containing hydrogenated products including terpolymers obtained by copolymerizing diene compounds and graft copolymers obtained by graft copolymerizing unsaturated monomers such as styrene, styrene-butadiene It is a styrene-conjugated diene block copolymer rubber such as a triblock copolymer.

When an elastomer is used, it is used in an amount of 0 to 70% by weight, preferably 1 to 50% by weight, based on 100 parts by weight of the total of (A) and (B).

The resin composition of the present invention may contain other substances other than the above-mentioned substances, if desired. Examples of such other materials that are preferably included for certain purposes include other resins, flame retardants, stabilizers, plasticizers, lubricants,
Pigments, reinforcing fibers, fillers and the like.

The resin composition of the present invention can contain other substances other than the above-mentioned substances, if desired. Examples of such other materials that are preferably included for certain purposes include other resins, flame retardants, stabilizers, plasticizers, lubricants,
Pigments, reinforcing fibers, fillers and the like.

The polyphenylene ether-based resin composition of the present invention can be molded by extrusion molding, calender molding, injection molding, blow molding or the like.

Examples of uses of the polyphenylene ether-based resin composition of the present invention include secondary battery battery case materials, flexible tubes, hose coatings, weather strips, and various gaskets. In particular, it is suitably used for covering electric wires or cables such as optical fiber, instrumentation cable, automobile wire harness, etc., which require flame retardancy and oil resistance.

[0048]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples. Indicates the meaning of the abbreviation used. 1. 1. Polyolefin resin (component (A)) PP : polypropylene resin Trademark: AS640V (manufactured by Sumitomo Chemical Co., Ltd.) Polyphenylene ether resin (component (B)) PPE : polyphenylene ether resin (poly (2,6-polydimethyl-1,4-phenylene ether) having an intrinsic viscosity of 0.46 dl / g measured at 30 ° C. in a chloroform solvent) 3 .Epoxy group-containing ethylene copolymer EPO: a copolymer of ethylene, glycidyl methacrylate and methyl acrylate, having a glycidyl methacrylate content of 6% by weight and a methyl acrylate content of 3
0% by weight and a melt index of 9 (190 ° C, 21.
2N load). 4. Hydroxyl-containing polyorganosiloxane SIP : a polyorganosiloxane containing the general formula M unit, D unit and T unit (according to the present invention) ("SH6018" manufactured by Dow Corning Toray Co., Ltd.) R ₉ , R ₁₀ , R ₁₁ : phenyl Group 70 mol%, methyl group 30 mol% R ₆ , R ₇ , R ₈ : hydroxyl group 6 wt% (% by weight of hydroxyl group based on polyorganosiloxane), the remainder is methyl group 5. Other components SEBS : hydrogenated styrene-butadiene-styrene triblock Copolymer (trade name: Tuftec H1051 (manufactured by Asahi Kasei Corporation))

Measurement / Evaluation Method Heat Deformation Temperature The heat deformation temperature as a measure of heat resistance was determined by ASTM D
According to 648, it was measured under a load of 0.45 MPa. Tensile Yield Strength and Tensile Elongation Tensile yield strength at 23 ° C. and tensile elongation at 23 ° C. were measured according to ASTM D638. Flammability evaluation A test piece of 127 × 12.7 × 3.2 mm was horizontally attached to a clamp. Apply a gas burner flame to the end of the test piece.
There was a second indirect flame. Thereafter, the flame was kept away, and the duration of combustion and the presence or absence of dripping of the molten resin during combustion were observed.
The evaluation was performed on two test pieces, and the combustion duration was
The average value of the two was used. The shorter the burning duration,
The smaller the number of drippings, the better the flame retardancy. Chemical resistance The ASTM No. 1 tensile test piece was attached to a semicircular jig having a curvature of 168 mm, a 20 × 12 mm gauze impregnated with engine oil was placed at the center of the test piece, and left at 60 ° C. for 24 hours. . Thereafter, the test piece was removed from the semicircular jig, and the tensile elongation at 23 ° C. was measured according to ASTM D638. The retention of tensile elongation after the chemical resistance test was determined according to the following formula. The higher the retention of tensile elongation, the better the chemical resistance. Retention of tensile elongation (%) = (tensile elongation after chemical resistance test)
/ (Tensile elongation before chemical resistance test) x 100

Observation of continuous phase and dispersion position of (C) Whether the continuous phase is polyolefin resin or polyphenylene ether resin, and dispersion position of (C) is (A)
It was determined whether it was in the middle or (B) by the method comprising the following procedure. Procedure 1-Using an injection molding machine set at a cylinder temperature of 260 ° C and a mold temperature of 50 ° C, a thickness of 3.2 m was obtained from the resin composition.
m are obtained. Step 2- Cut out an ultra-thin section of the molded product with a microtome. Procedure 3-Ultrathin sections are stained with ruthenium tetroxide (the phase consisting of polyphenylene ether resin is stained). Step 4-Observe the stained ultrathin section with a transmission electron microscope, and determine whether the continuous layer is a phase composed of a polyolefin resin,
It is determined whether the phase is made of a polyphenylene ether resin. At the same time, it is determined whether the dispersion position of (C) is in (A) or (B).

Example 1 Each component having the compounding ratio (parts by weight) shown in Table 1 was mixed in the order shown in Table 1 in a continuous two-hole mode having two feed ports set at a cylinder temperature of 260 ° C. and a screw rotation speed of 200 rpm. The mixture was charged from a first feeder of a shaft kneader (TEM-50A manufactured by Toshiba Machine Co., Ltd.) and a second feeder downstream of the first kneader, and these components were melt-kneaded to obtain a pellet-shaped resin composition. The obtained pellets were heated at a cylinder temperature of 260.
A test piece was prepared using an injection molding machine set at
The tensile yield point strength, tensile elongation, heat deformation temperature, chemical resistance and flame retardancy were evaluated. Table 1 shows the results.

Comparative Examples 1 and 2 The same procedures as in Example 1 were carried out except that the mixing ratios shown in Table 1 were used. Table 1 shows the results.

The following can be understood from the results. Example 1, which satisfies the conditions of the present invention, shows satisfactory results in all evaluation items. On the other hand, Comparative Example 1, which does not contain (C) and (D), is inferior in flame retardancy. Comparative Example 2 containing no (D) is inferior in flame retardancy.

[0054]

[Table 1]

[0055]

As described above, according to the present invention, a thermoplastic resin excellent in oil resistance and flame retardancy and excellent in flame retardancy without using halogen-based or phosphorus-based flame retardants as essential components. A thermoplastic resin composition, which is a composition that is optimally used for covering electric wires or cables, could be provided.

Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) // (C08L 23/00 C08L 83:04) 83:04) H01B 7/34 B F term (reference) 4J002 BB03W BB05W BB103 BB12W BB13W BB15W BB17W BK00W BN033 BP02W CD183 CD193 CH07X CP054 CP064 CP094 CP164 GQ01 5G305 AA02 AA14 AB25 AB32 BA12 BA22 CA01 CA13 CA26 CA51 5G315 CA03 CB06 CD01 CD02 CD04 CD06

Claims (3)

[Claims] (1) The following (A) to (D) are melt-kneaded, and the weight ratio of (A) / (B) is 30/70 to 80/20.
And the total amount of (A) and (B) is 10
0.1 to 30 parts by weight based on 0 parts by weight, and 0.1 to 10 parts by weight based on 100 parts by weight of the total amount of (A) and (B) added to (D). Resin composition. (A): polyolefin resin (B): polyphenylene ether resin (C): 1 to 50 parts by weight of an epoxy group-containing ethylene copolymer (D): amino group, hydroxyl group, phenol group, carboxyl group, methacryloxy group and Polyorganosiloxane containing at least one of alkoxy groups 2. An epoxy group-containing ethylene copolymer of the component (C) comprises: (a) a unit derived from ethylene of 50 to 9;
9% by weight, (b-1) a unit derived from an unsaturated carboxylic acid glycidyl ester copolymerizable with ethylene or (b-2) a unit derived from a glycidyl ether having an unsaturated group copolymerizable with ethylene. The thermoplastic resin composition according to claim 1, which is an epoxy group-containing ethylene copolymer containing 0.1 to 50% by weight and (c) 0 to 50% by weight of a unit derived from an ethylenically unsaturated compound. 3. The thermoplastic resin composition according to claim 1, wherein the thermoplastic resin composition is used for coating an electric wire or a cable.